JP2007088253A - Light emitting diode device and lighting apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting diode device which can prevent or reduce such deformations as the warps of its substrate and its resin layer and can increase its heat radiating quantity, and to provide a lighting apparatus. <P>SOLUTION: The light emitting diode device has a substrate 2 having a front surface, and having substrates 3 each of which has steps 3e, 3f, and having slits 6 interposed between the substrates, and has a resin layer 12 having a plurality of recesses 11 formed in the front surface of each substrate, and having via each slit engagements 12a2, 12b2 for covering therewith the steps of the rear surface of each substrate, and having spaces 12a3, 12b3 formed between the engagements and the rear surface of each substrate, and further, has each conductor layer 8a provided in each substrate, and moreover, has each light emitting diode chip 9 provided in each recess and connected electrically with each conductor layer. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a light emitting diode device and a lighting device.

  As an example of a conventional light emitting diode device, a surface mount type device in which a synthetic resin is filled in a resin case in which a light emitting diode chip is disposed and a light emitting diode chip is sealed in the case is known ( For example, see Patent Document 1).

Further, in this type of light emitting diode device, the light emitting diode chip is electrically connected to a pair of metal plates, and the plurality of light emitting diode chips and the plurality of pairs of metal plates are made of a translucent epoxy resin or the like. Some of them are integrally covered with a resin layer such as a sealing resin (see, for example, Patent Document 2).
JP 2002-43625 A JP 2003-60240 A

  However, in the light emitting diode device described in Patent Document 2, there is a difference in thermal expansion that the thermal expansion coefficient of the resin layer is larger than that of the metal plate. On the other hand, deformation such as warping that curves in a convex arc shape occurs. For this reason, there exists a subject that a resin layer floats from a metal plate and a gap | interval is formed between a metal plate and a resin layer.

  As a result, the size of the gap between the metal plate and the resin layer is different between the portion where the lift amount of the resin layer is large and the portion where the resin layer is small, and a part of the sealing resin penetrates into the gap. Since the filling amount of the sealing resin containing the phosphor covering the surface is not constant, and the light projecting direction is different due to the difference in the light projecting surface of the sealing resin, there is a problem that uneven color and uneven brightness occur. is there. Further, since the entire light emitting diode chip that generates heat is covered with the sealing resin, there is a problem that the amount of heat radiation is small and the entire light emitting diode device is heated to a high temperature.

  An object of the present invention is to provide a light-emitting diode device and an illumination device that can prevent or reduce deformation such as warping of a substrate or a resin layer and can increase the amount of heat dissipation.

  The invention described in claim 1 includes a substrate portion having a surface and a step portion, and a substrate having a slit portion provided between the substrate portions; and a plurality of recesses and the slit portion formed on the surface of the substrate portion. A resin layer having a fitting portion covering the step portion on the back surface of the substrate portion, and forming a space portion between the fitting portion and the back surface of the substrate portion; and a conductive layer disposed on the substrate portion A light emitting diode chip disposed in the recess and electrically connected to the conductive layer.

  A plurality of the substrate portions may be arranged in the longitudinal direction, or may be arranged on a matrix, and the slit portion refers to a space formed between the substrate portions.

  The stepped portion may be continuously formed on the back surface of the substrate portion along the longitudinal direction, or may be intermittent. The step portion may be a concave portion, a convex portion, or the like, and is configured such that a part of the resin layer enters a part of the substrate portion, and is configured so that the resin layer does not float from the substrate portion. It only has to be.

  The space portion formed between the fitting portion and the back surface of the substrate portion may have any structure as long as it can be a heat dissipation path.

  The resin layer may be filled with a resin layer throughout the slit portion or may have a gap. When the entire slit portion is filled, the strength of the entire substrate is increased, and the resin layer is not easily lifted off from the substrate. Further, when the slit has a gap, the heat of the light emitting diode chip is radiated from the gap, and the lifting of the resin layer from the substrate due to the difference in thermal expansion between the resin layer and the substrate can be suppressed.

  The invention according to claim 2 is characterized by comprising: a lighting fixture body; and the light emitting diode device according to claim 1, wherein the back surface of the substrate portion is disposed in contact with the lighting fixture body.

  Heat of the light emitting diode chip is conducted by bringing the back surface of the substrate portion into contact with the lighting fixture body.

  According to the first aspect of the present invention, since the slit is formed in the substrate between the plurality of substrate portions, the resin layer and the substrate are deformed such as warpage due to the difference in thermal expansion between the substrate and the resin layer. Even if it is going to be generated, a part of the resin layer can enter a part of the substrate part so that the resin layer does not float from the substrate part. Furthermore, the heat of the light emitting diode chip can be radiated from the space formed between the fitting portion and the back surface of the substrate portion, and deformation such as warpage due to the difference in thermal expansion between the substrate and the resin layer can be reduced. As a result, it is possible to prevent or reduce color unevenness and brightness unevenness due to deformation of the recesses formed in the resin layer.

  According to the invention which concerns on Claim 2, the space part formed between the said fitting part and a board | substrate back surface by making the said board | substrate part back surface contact | abut to the said lighting fixture main body becomes a thermal radiation path | route, and a light emitting diode Dissipate the heat of the chip. That is, since the space portion is configured to penetrate in the longitudinal direction of the substrate portion, the air flow passage can be increased, and the substrate portion adjacent to the slit and the resin layer can be cooled. Thereby, the high temperature temperature rise of the light emitting diode light emitting part can be prevented or suppressed.

  Hereinafter, an embodiment of a light-emitting diode device of the present invention will be described with reference to the drawings. 1 is a plan view of a light emitting diode device according to an embodiment of the present invention, FIG. 2 is a plan view of the substrate, FIG. 3 is a cross-sectional view taken along line AA of FIG. 1, and FIG. FIG. 5 is a sectional view taken along the line CC of FIG. 1, and FIG. 6 is a light-emitting diode device according to another embodiment, corresponding to the line BB of FIG. It is the principal part sectional drawing cut | disconnected.

  In the figure, the light-emitting diode device 1 has a plurality of substrate portions 3, a terminal portion 4a, 4b, 5a, 5b, and a slit portion 6 formed on an upper surface 2a of a substantially square flat substrate 2. . These substrate portions 3 are formed by arranging a plurality of light emitting diode light emitting portions 13 in a line in the horizontal direction in FIG. 1 on the surface 2 a of the substrate 2. The substrate portion 3 is arranged in 16 rows, for example, with slit portions 6 having a required interval.

  The substrate 2 is made of a flat plate made of metal such as aluminum (Al) or nickel (Ni) having heat dissipation and rigidity, and has a predetermined width which is a through-hole having substantially the same length or slightly shorter length of the adjacent substrate portion 3. A slit portion 6 is formed. As shown in FIG. 3, a circuit pattern 8, which is an example of a conductive layer, is disposed on each substrate portion 3 with an electrical insulating layer 7 interposed therebetween.

  In addition, for example, rectangular notches 3b and 3c are formed on both sides in the width direction of the substrate portion 3, and a plurality of pairs of these notches 3b and 3c are formed at a predetermined pitch in the longitudinal direction. Further, the substrate portion 3 is formed with a pair of left and right step portions 3e and 3f having a required shape on both sides in the width direction of the substrate portion 3 on the back surface 3d side opposite to the one surface (upper surface in the drawing) on which the resin layer 12 is formed. is doing. The pair of step portions 3 e and 3 f are continuously formed over the entire length of the substrate portion 3 in the longitudinal direction.

  FIG. 5 is a plan view mainly showing the circuit pattern 8 formed on the upper surface (front surface) 2 a of the substrate 2. The circuit pattern 8 is formed on a copper (Cu) foil by nickel (Ni) plating and further gold (Au) plating, and a plurality of circuit pattern 8a for a substrate part formed on each substrate part 3 respectively. And circuit patterns 8b and 8c for connection that are electrically connected to both ends in the longitudinal direction of the circuit pattern 8a for the substrate. The plurality of circuit pattern 8a for the substrate section are electrically connected in parallel to the connection circuit patterns 8b and 8c.

  The connection circuit patterns 8b and 8c have one end connected to the upper terminal portions 4a and 5a and the other end connected to the lower terminal portions 4b and 5b. The connection circuit patterns 8b and 8c may be covered with a resin such as PBT, PPA, or PC to be electrically insulated. One of the terminal portions 4a and 5a is supplied with, for example, the anode side of the DC voltage, and one of the terminal portions 4b and 5b is supplied with the cathode side of the DC voltage. That is, a DC voltage can be appropriately applied between the terminal portions 4a and 5a and between the terminal portions 4b and 5b.

  As shown in FIG. 2, the circuit pattern 8a for the substrate portion is formed to have a width substantially equal to or slightly narrower than the width of the substrate portion, and a plurality of small circuit patterns 8a1 are arranged on the substrate portion in the longitudinal direction of the substrate portion 3. Are sequentially arranged via a required electric insulation gap 8d, and connection terminals 8a2 and 8a3 respectively connected to connection circuit patterns 8b and 8c are provided at both ends in the longitudinal direction.

  The small circuit pattern 8a1 is formed by placing a light emitting diode chip 9 on a rectangular protruding end protruding to the side of the circuit pattern 8a1 adjacent to each other in the longitudinal direction of each substrate 3, and electrically connecting the bottom electrode by die bonding or the like. The circuit pattern is electrically connected to the upper surface electrode of the light-emitting diode chip 9 through the bonding wire 10. The light emitting diode chip 9 is made of, for example, a gallium nitride (GaN) system that emits blue light. The light emitting diode chip 9 may be electrically connected to the small circuit patterns 8a1 adjacent in the longitudinal direction by two bonding wires 10.

  That is, the small circuit patterns 8a1 are formed by sequentially connecting a plurality of, for example, 16 light emitting diode chips 9 in series for each substrate unit 3. Since the substrate section 3 is arranged on the substrate 2, for example, in 16 rows, the light emitting diode chips 9 are arranged on the substrate 2 in a matrix of 16 rows and 16 columns.

  As shown in FIG. 1, each substrate portion 3 is provided with a resin layer 12 on the substrate portion 3, surrounds the periphery of the light emitting diode chip 9, and has an inverted truncated cone-shaped recess 11 that gradually expands. Each is formed integrally. Each recess 11 forms a reflection surface 11 a on the inner surface of the recess, and constitutes one unit of light emitting diode light emitting portion 13 for each light emitting diode chip 9 disposed in the recess 11.

  Moreover, a thermosetting transparent resin such as a translucent silicone resin or epoxy resin is injected into each recess 11 and filled so as to be substantially flush with the opening end of the recess 11. As each formed. Further, for example, a phosphor emitting yellow light is mixed in the sealing resin 14.

  The resin layer 12 is formed of a synthetic resin such as PBT (polybutylene terephthalate), PPA (polyphthalamide), or PC (polycarbonate). The resin layer 12 is formed in a U-shaped cross section by integrally connecting a pair of side surface portions 12a and 12b sandwiching both sides in the width direction of the substrate portion. In addition, as shown in FIG. 6, all the slit portions 6 may be filled with the resin layer 12.

  Further, in the resin layer 12, a bottomed groove 15 that opens upward is formed across the entire width of the substrate portion 3 as shown in FIGS. 1 and 3. Each groove 15 is formed by exposing a part of the circuit pattern 8 to the outside. The resin layer 12 also forms a pair of side surfaces 12a and 12b on both sides in the width direction of the substrate portion 2 in the groove 15 portion. As shown in FIG. 4, the pair of side surface portions 12 a and 12 b are arranged so as to sandwich the substrate portion 3 in the width direction, and are integrally connected to both side surface portions in the width direction of the resin layer 12 to have a cross-sectional shape. It is formed on a substantially U-shaped substrate.

  As shown in FIGS. 4 and 5, the pair of side surface portions 12a and 12b of the resin layer 12 are coated with a required thickness so as to sandwich both sides in the width direction of the substrate portion 3 in the width direction. As shown, the substrate portion 3 is continuously coupled over the entire length in the longitudinal direction. Further, the pair of side surface portions 12a and 12b form prismatic engagement convex portions 12a1 and 12b1 that respectively engage with the notches 3b and 3c of the substrate portion 3 shown in FIG. These engaging convex portions 12a1 and 12b1 are formed at the same position as the groove 15 formed between the adjacent concave portions 11. Further, as shown in FIG. 5, the upper ends in the thickness direction of the respective engaging convex portions 12 a 1 and 12 b 1 are formed substantially flush with the surface 2 a of the substrate portion 3.

  As shown in FIGS. 4 and 5, the pair of side surface portions 12 a and 12 b of the resin layer 12 are bent at their lower end portions substantially at right angles to the back surface 3 d side of the substrate portion 3, and left and right pair on the back surface 3 d side of the substrate portion 3. The fitting portions 12a2 and 12b2 that are respectively fitted to the step portions 3e and 3f are integrally formed. Accordingly, the pair of fitting portions 12a2 and 12b2 of the pair of side surface portions 12a and 12b are fitted to the pair of stepped portions 3e and 3f on the substrate portion back surface 3d side, whereby a pair of formed on the resin layer 12 is formed. The substrate portion 3 is held in the thickness direction by the side portions 12a and 12b. In other words, the resin layer 12 and the pair of side surface portions 12a and 12b sandwich the substrate portion 3 in the three directions of the front and back direction and the width direction, and are locked in the longitudinal direction of the substrate portion 3. It can be firmly fixed at a predetermined position on the substrate unit 3.

  When the resin layer 12 described above is formed on the substrate 2 by injection molding, a pair of left and right side portions 12a and 12b that connect adjacent recesses 11 are formed on the left and right sides of the mold for forming each groove 15. When these recesses 11 are formed by injection molding, the resin is injected in the arrangement direction, so that the resin passes through the pair of side surface portions 12a1 and 12b1 of the grooves 15 in the other end in the column direction. Can be spread all over. For this reason, while being able to form the some recessed part 11 substantially simultaneously by injection molding, the moldability can be improved.

  In addition, when the resin layer 12 including the pair of side surface portions 12a and 12b is formed of an elastic resin in advance, the ends of the lower surface openings 12c of the pair of side surface portions 12a and 12b are mounted on the circuit pattern 8 of the substrate portion 3. The resin layer 12 can be simply and quickly and reliably attached by pushing the resin layer 12 toward the substrate portion 3 side.

  That is, when the resin layer 12 side is pushed into the substrate portion 3 side, the lower ends of the pair of side surface portions 12a and 12b are elastically deformed so as to gradually expand, and further, when the resin layer 12 is continuously pushed into the substrate portion 3 side. Eventually, the process proceeds to the back surface 3d of the board part 3, and when the back surface 3d of the board part 3 is reached, the fitting parts 12a2 and 12b2 of the pair of side face parts 12a and 12b are fitted to the step parts 3e and 3f of the back surface 3d of the board part 3 Is done.

  Further, the side surface portions 12a and 12b of the resin layer 12 have their respective engaging projections 12a1 and 12b1 engaged with the notches 3b and 3c of the substrate portion 3, so that the side surface portions 12a and 12b It is possible to prevent the resin layer 12 integrally coupled from being displaced in the longitudinal direction of the substrate portion 3, and to prevent fluctuations in optical performance due to the displacement of the reflecting surface 11a.

  In the light emitting diode device 1, a plurality of light emitting diode chips 9 are disposed on the entire top surface 2a of the substrate 2 by providing a plurality of substrate portions 3 on the top surface (surface) 2a of the substrate 2. Therefore, light can be emitted in a planar shape.

  Further, since the light emitting diode device 1 has a plurality of one-row substrate portions 3 formed on one substrate 2, each substrate portion 3 is punched by press shearing or the like to form one row. The plurality of substrate portions 3 can be formed almost simultaneously. Moreover, since the board | substrate part 3 has electrically connected the some light emitting diode chip 9 in series, the brightness | luminance of these light emitting diode chips 9 can be made substantially equal. Further, since the plurality of substrate parts 3 are electrically connected in parallel to the terminal parts 4a, 5a or 4b, 5b, some of the light emitting diode chips 9 of the substrate parts 3 should be damaged due to failure or the like. Even if the lighting does not occur, the light-emitting diode chip 9 of the other substrate unit 3 can be energized and lit.

  Next, the operation of the light emitting diode device 1 will be described. First, in FIG. 2, when a predetermined DC voltage is applied between the pair of left and right terminal portions 4a and 5a or between the terminal portions 4b and 5b, the DC voltage is passed through the pair of connection circuit patterns 8a and 8b. Applied to each light emitting diode chip 9 of the substrate unit 3, the light emitting diode chip 9 emits blue light. This blue light emission excites the yellow light emitting phosphor in the transparent sealing resin 14 to emit yellow light and mix with the blue light of the light emitting diode chip 9 to form white light, which is reflected by the reflecting surface 11a. Radiated from the opening to the outside.

  These light emitting diode chips 9 emit light and generate heat, and are conducted to the entire light emitting diode device 1, but a part of the heat conducted to the substrate portion 3 is on the substrate portion 3 upper surface 3 b which is the externally exposed bottom surface of each groove 15. Since it is released from a part to the outside, the temperature rise can be suppressed.

  Furthermore, the heat of the light emitting diode chip 9 can be radiated from the space portions 12a3 and 12b3 formed between the fitting portions 12a2 and 12b2 and the back surface 3d of the substrate portion 3, and is caused by the difference in thermal expansion between the substrate 2 and the resin layer 12. Deformation such as warpage can be reduced. As a result, it is possible to prevent or reduce color unevenness and brightness unevenness due to deformation of the recess 11 formed in the resin layer 12.

  As shown in FIG. 6, the resin layer 12 may be filled with resin in the entire area of the slit portion 6 or may have a gap as shown in FIGS. 4 and 5. When the portion 6 has a gap, the heat of the light emitting diode chip 9 is radiated from the gap, and the floating of the resin layer 12 from the substrate 2 due to the difference in thermal expansion between the resin layer 12 and the substrate 2 can be suppressed. .

  Next, an embodiment of a lighting device using the light emitting diode device will be described with reference to the drawings. 7 is an illuminating device according to an embodiment of the present invention, and is a cross-sectional view of a principal part cut at a portion corresponding to the line CC in FIG.

  In the figure, the illuminating device is a space formed between the fitting portions 12a2 and 12b2 and the back surface 3d of the substrate portion 3 by bringing the back surface 3d of the substrate portion 3 of the light emitting diode device 1 into contact with the luminaire main body 30. The parts 12a3 and 12b3 serve as heat dissipation paths and radiate heat from the light emitting diode chip 9. That is, since the space portions 12a3 and 12b3 penetrate in the longitudinal direction of the substrate portion 3, the air flow passage is increased, and the substrate portion 3 adjacent to the slit portion 6 and the resin layer 12 can be cooled. it can. Thereby, the high temperature temperature rising of the light emitting diode light emission part 13 can be prevented or suppressed.

  Further, since the resin layer 12 is made of resin and has a higher coefficient of thermal expansion than the metal substrate 2 and the substrate portion 3, the resin layer 12 tends to be deformed such as warpage due to the difference in thermal expansion. The deformation of the resin layer 12 can be prevented or reduced by the released heat.

  For this reason, it is possible to prevent or reduce the occurrence of color unevenness and brightness unevenness (brightness unevenness) due to deviation of the light projecting direction due to deformation of the reflecting surface 11a of the resin layer 12 and the sealing resin 14.

The top view of the light emitting diode apparatus which concerns on one Embodiment of this invention. The top view of a board | substrate similarly. FIG. 2 is a cross-sectional view taken along line AA in FIG. 1. FIG. 3 is a cross-sectional view of the main part of the line BB in FIG. 1. The CC sectional view taken on the line of FIG. FIG. 6 is a cross-sectional view of a principal part of a light-emitting diode device according to another embodiment, cut at a portion corresponding to the line BB in FIG. 1. It is an illuminating device which concerns on one Embodiment of this invention, Comprising: The principal part sectional drawing cut | disconnected by the part corresponded to CC line of FIG.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Light emitting diode device, 2 ... Board | substrate, 3 ... Board | substrate part, 3b, 3c ... Notch, 3e, 3f ... Step part, 4a, 4b, 5a, 5b ... Terminal part, 6 ... Slit part, 7 ... Insulating layer, 8 ... Circuit pattern, 8a ... Circuit pattern for substrate part, 8b, 8c ... Circuit pattern for connection, 9 ... Light emitting diode chip, 11 ... Recess, 11a ... Reflecting surface, 12 ... Resin layer, 14 ... Sealing resin, 15 ... Groove , 12a, 12b ... a pair of side parts, 12a1, 12b1, ... engaging convex part, 12a2, 12b2, ... fitting part, 12a3, 12b3 ... space part, 13 ... light emitting diode light emitting part.

Claims (2)

A substrate portion having a surface portion and a step portion, and a substrate having a slit portion provided between the substrate portions;
A plurality of concave portions formed on the surface of the substrate portion and a fitting portion that covers a step portion on the back surface of the substrate portion via the slit portion, and a space portion is formed between the fitting portion and the back surface of the substrate portion. A resin layer comprising:
A conductive layer disposed on the substrate portion;
A light emitting diode chip disposed in the recess and electrically connected to the conductive layer;
A light-emitting diode device comprising: A lighting fixture body;
The light-emitting diode device according to claim 1, wherein the back surface of the substrate portion is disposed in contact with the lighting fixture body;
An illumination device comprising:

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