CN203134857U - COB substrate structure - Google Patents
COB substrate structure Download PDFInfo
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- CN203134857U CN203134857U CN 201320047223 CN201320047223U CN203134857U CN 203134857 U CN203134857 U CN 203134857U CN 201320047223 CN201320047223 CN 201320047223 CN 201320047223 U CN201320047223 U CN 201320047223U CN 203134857 U CN203134857 U CN 203134857U
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- board structure
- metallic matrix
- bulge loop
- circuit module
- plane
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Abstract
The utility model is suitable for the field of LED lamp plate structure and provides a COB substrate structure. The COB substrate structure comprises a metal matrix and a circuit module, and further comprises an insulating part arranged between the metal matrix and the circuit module; one side of the insulating part is pasted on the surface of the metal matrix; the circuit module is pasted on the other side of the insulating part; the surface of the metal matrix is provided with pits; edges of the pits are provided with bulge loops; the bulge loops surround the pits; and one pit and two bulge loops form a groove used for disposing a luminescence wafer. According to the COB substrate structure provided by the utility model, pits and bulge loops are integrally stamped on the metal matrix to form grooves for disposing luminescence wafers; the luminescence wafers directly contact the metal matrix to directly transfer generated heat to the metal matrix; and heat is rapidly radiated to guarantee stability of the illumination of the luminescence wafers.
Description
Technical field
The utility model belongs to LED lamp panel structure field, relates in particular to a kind of COB board structure.
Background technology
COB is English (abbreviation of Chip On Board, Chinese translation is: wafer is directly adorned on the plate), is a kind ofly by adhesive or scolder the LED wafer directly to be pasted on the substrate, realizes the encapsulation technology of electrical interconnection between wafer and substrate again by the lead-in wire bonding.
At present, the surface that is used for the substrate of installation LED wafer all is smooth, the LED wafer directly is attached at the surface of substrate, needs the support of a plastic cement encapsulation like this, and is provided with support, then influence radiating effect, bring limitation aspect heat radiation, it has increased thermal resistance, has caused temperature to raise, and then, increased the light decay of LED lamp, the brightness of influence illumination.
The utility model content
The purpose of this utility model is to overcome above-mentioned the deficiencies in the prior art, a kind of COB board structure is provided, it is provided with pit and bulge loop by metal substrate, increased the surface area of substrate, reduce the thermal resistance of metal substrate, improved radiating effect, excellent in heat dissipation effect, reduce the light decay of LED lamp, guaranteed the brightness of illumination.
The utility model is achieved in that a kind of COB board structure, comprise metallic matrix and circuit module, also comprise the insulating part that is arranged between described metallic matrix and the described circuit module, described insulating part simultaneously arranges the surface that is attached at described metallic matrix, described circuit module is attached at the another side of described insulator, the surface of described metallic matrix is provided with pit, edge in described pit also convexes with bulge loop, described bulge loop is surrounded on described pit, and described bulge loop and described pit are combined to form for the groove of placing luminescent wafer.
Particularly, described pit comprises bottom surface and first inclined-plane, and an end ring on described first inclined-plane is connected around described bottom surface and with described bottom surface, and the other end is surperficial concordant with described metallic matrix, and luminescent wafer is attached at described bottom surface.
Particularly, described bulge loop comprises step and second inclined-plane, and described first inclined-plane is connected with described second inclined-plane, and described step and described pit are provided with seal.
Particularly, described first inclined-plane and described second inclined-plane are provided with for reflective reflector layer.
Preferably, described metallic matrix is rectangular and adopt metallic material of aluminum to make, and described groove is provided with two at least.
Particularly, described groove is a bowl cup-shaped, described groove be provided with four and be two row two row shapes be arranged on the described metallic matrix.
Particularly, the number that described bulge loop arranges is identical with the number of described groove, described insulating part and described circuit module be covered in successively described bulge loop around.
Particularly, described circuit module is provided with conducting strip, is electroplate with coating on the described conducting strip, and described conducting strip is surrounded on around the described bulge loop, and the described conducting strip between each adjacent columns is electrically connected.
Further, the rectangular and edge of described metal substrate offers the locating notch for the location, and described locating notch is provided with at least two and be the diagonal angle and distribute.
Preferably, described locating notch is curved.
A kind of COB board structure that the utility model provides, be provided with pit by metallic matrix, the edge of pit also convexes with bulge loop, pit and bulge loop are combined to form for the groove of placing luminescent wafer, luminescent wafer is directly contacted with metallic matrix, and the heat that luminescent wafer is produced can directly be passed to metallic matrix, has increased area of dissipation, the radiating efficiency height has reduced the light decay of luminescent wafer; Groove has reflection action, has promoted the uniformity of light extraction efficiency and light source.And, improved glare effect from whole light shape, reduced the sense of discomfort of human eye to the dazzle of LED lamp.
Description of drawings
Fig. 1 is the whole decomposing schematic representation of the COB board structure that provides of the utility model embodiment;
Fig. 2 is the vertical view of the COB board structure that provides of the utility model embodiment;
Fig. 3 is the profile of B-B section among Fig. 2;
Fig. 4 is the upward view of the COB board structure that provides of the utility model embodiment;
Fig. 5 is the local enlarged diagram at A place among Fig. 1.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explaining the utility model, and be not used in restriction the utility model.
As Fig. 1, Fig. 3 and shown in Figure 5, a kind of COB board structure that the utility model embodiment provides, comprise metallic matrix 2 and circuit module 3, also comprise the insulating part 4 that is arranged between metallic matrix 2 and the circuit module 3, insulating part 4 one side settings are attached at the surface of metallic matrix 2, and circuit module 3 is attached at the another side of insulator.Metallic matrix 2 and circuit module 3 all have conductivity; by between metallic matrix 2 and circuit module 3, being provided with insulating part 4; guaranteed that circuit module 3 is not short-circuited in the process of transmission power supply; insulating part 4 is glue-line; material as other good insulation preformances such as silica gel, epoxy resin; not only cementability is good for it; stable being adhered on the metallic matrix 2 of energy; and insulating properties might as well; can provide good insulation protection for the circuit module 3 with its adhesion; satisfy the insulating requirements of circuit module 3, guaranteed the reliability that substrate uses.The surface of metallic matrix 2 is provided with pit 211, also convexes with bulge loop 212 in the edge of pit 211, and bulge loop 212 is surrounded on pit 211, and bulge loop 212 and pit 211 are combined to form for the groove 21 of placing luminescent wafer.Luminescent wafer is arranged in the groove 21, contacts with heat conductive metal matrix 2, be convenient to the transmission of heat and scatter and disappear the radiating efficiency height.Avoided traditional mounting means: be about to luminescent wafer and directly be attached on the smooth substrate, because of the plastic cement package support on the substrate to stopping that heat forms, and cause the bad phenomenon of heat radiation.The setting of groove 21, make the light fixture product can reach radiating efficiency preferably under limited volume, all have better radiating effect on horizontal and rectilinear packing forms, the temperature of luminescent wafer is is in time scattered and disappeared, reduce the light decay of luminescent wafer, guaranteed the stability of illumination.
Particularly, as Fig. 1, Fig. 3 and shown in Figure 5, the end ring that pit 211 comprises bottom surface 2111 and 2112, the first inclined-planes 2112, first inclined-plane is around the bottom surface 2111 and be connected with bottom surface 2111, the other end is surperficial concordant with metallic matrix 2, and luminescent wafer is attached at bottom surface 2111.The bottom surface 2111 of pit 211 is lower than the surface of metallic matrix 2, and luminescent wafer is attached at bottom surface 2111, not only can be in time with heat transferred metallic matrix 2, improve radiating efficiency, and it is poor to form certain height, and being convenient to can be reliably with the luminescent wafer good seal when the sealed light emitting wafer.
Particularly, as Fig. 1, Fig. 4 and shown in Figure 5, bulge loop 212 comprises step 2121 and second inclined-plane 2122, the height of bulge loop 212 is higher than the surface of metallic matrix 2, and, first inclined-plane 2112 is identical with the gradient on second inclined-plane 2122, and first inclined-plane 2112 is connected with second inclined-plane 2122 and is combined to form the inclined-plane of a surfacing, is conducive to ray refraction.Pit 211 and bulge loop 212 integrated punchings form, the working (machining) efficiency height, and, first inclined-plane 2112 that is stamped to form and the surface gloss height on second inclined-plane 2122.Be provided with the seal (not shown) in step 2121 and the pit 211, by being provided with bulge loop 212, the step 2121 on it has limited seal and has not outflowed, and can fully be full of whole groove 21, luminescent wafer in the groove 21 is covered sealing, improve whole sealing effectiveness.Seal can be silica gel, epoxy resin or its mixture etc., and its stable performance can provide sealing function for a long time, and good waterproof performance, and sealing is reliable.When punching press forms pit 211 and bulge loop 212, be formed with depression 22 in the bottom surface of metallic matrix 2.
Particularly, as Fig. 3 and shown in Figure 5, first inclined-plane 2112 and second inclined-plane 2122 are provided with for reflective reflector layer (not shown), improved the ray refraction effect, make light that the luminescent wafers in the groove 21 send under the refraction action of reflector layer, the light that sends is even, soft, and irradiation can better be provided.
Preferably, as shown in Figure 3, in the present embodiment, metallic matrix 2 is rectangular, certainly, is appreciated that ground, and the shape of metallic matrix 2 also can be set to other shape according to the difference that is applied to the light fixture type, as circle, triangle, polygon etc.Metallic matrix 2 is become by metallic material of aluminum or copper, and intensity height, and good heat conductivity are convenient to that heat transmits timely and are scattered and disappeared, and avoids the lamp plate temperature too high and influence is used.Metallic matrix 2 also can adopt other material to make, and as iron, pottery, aluminium nitride, alchlor etc., all has high thermal conductance.At least be provided with two grooves 21 on the metallic matrix 2, at least two luminescent wafers can be installed, to guarantee that illumination intensity can satisfy instructions for use.
Particularly, as Fig. 3 and shown in Figure 5, the groove 21 that pit 211 and bulge loop 212 are combined to form roughly is a bowl cup-shaped, and the bottom surface diameter of a circle forms little big back-off shape down less than the opening part diameter of a circle, is convenient to installation and the ray refraction of luminescent wafer.Certainly, be appreciated that ground, under the prerequisite of realistic use, the shape of groove 21 also can be other shape such as rectangle, polygon.Groove 21 is provided with four and be two rows, two row shapes and be arranged on the metallic matrix 2, and groove 21 is concentrated and arranged, and is convenient to the cover of light, strengthens the intensity of illumination.The shape that groove 21 is arranged at metallic matrix 2 can be arranged in other shape according to the needs of actual conditions, as triangle, circle etc.
Particularly, as Fig. 1, Fig. 3 and shown in Figure 5, the number that bulge loop 212 arranges is identical with the number of groove 21, and the edge of each groove 21 all is provided with a bulge loop 212, when being convenient in groove 21, fill seal sealed light emitting wafer, can improve the reliability of sealing.Insulating part 4 and circuit module 3 be covered in successively bulge loop 212 around, circuit module 3 is arranged on the top of insulating part 4, avoid circuit module 3 directly to contact with metallic matrix 2 and be short-circuited, and circuit module 3 be surrounded on bulge loop 212 around, make things convenient for the luminescent wafers in the groove 21 to be electrically connected with circuit module 3.Insulating part 4 can be the material of other good insulation preformances such as silica gel, epoxy resin.Not only cementability is good for it, and stable being adhered on the metallic matrix 2 of energy, and insulating properties can provide good insulation protection for the circuit module 3 with its adhesion, satisfy the insulating requirements of circuit module 3, has guaranteed the reliability that substrate uses.
Particularly, as Fig. 1, Fig. 2 and shown in Figure 5, circuit module 3 is provided with conducting strip 31, be electroplate with coating 5 on the conducting strip 31, by being electroplate with coating 5 at conducting strip 31, prevent corrosion, improve resistance to wear, improve the conductivity of circuit module 3, guarantee the reliability that is electrically connected, and, the glossiness height on electrodeposited coating 5 surfaces, reflective is good, be convenient to ray refraction, improve the intensity of illumination.The material that coating 5 can conduct electricity very well for gold, silver and titanium etc.Conducting strip 31 is surrounded on around the bulge loop 212, and the conducting strip 31 between each adjacent columns is electrically connected mutually, to realize the transmission of power supply between each row conducting strip 31, for the luminescent wafer in each groove 21 provides power supply.Conducting strip 31 can be and adopts metal material of copper to make, and its resistance is low, conduct electricity very well, reliable and stable electrical connection can be provided, and, have corrosion-resistant.Advantages such as easy processing.Certainly, be appreciated that ground, conducting strip 31 also can adopt as the metal material of other good conductivity such as aluminium, zinc and make.
Further, as Fig. 1, Fig. 2 and shown in Figure 4, the rectangular and edge of metallic matrix 2 offers the locating notch 6 for the location, and locating notch 6 is provided with at least two and be the diagonal angle and distribute.Be provided with locating notch 6, the securing member (not shown) is snapped in breach, and is can be easily that metallic matrix 2 is fixing, and locating notch 6 is the diagonal angle and distributes, and can more reliably substrate be fixed, and securing member can be screw, bolt etc.Certainly, be appreciated that ground, locating notch 6 also can be set to other suitable quantity.
Preferably, as shown in Figure 4, locating notch 6 is curved.The locating notch 6 of the shape of arc can be good at cooperating with securing member, makes things convenient for snapping in of securing member, and substrate is fixed.This kind set-up mode is located convenient, fastly, and when dismounting is also convenient.Certainly, be appreciated that ground, also locating notch 6 can be set to other suitable shape, as rectangle, polygon etc.
A kind of COB board structure that the utility model provides, it forms pit 211 and bulge loop 212 by integrated punching on metallic matrix 2, pit 211 and bulge loop 212 are combined to form for the groove 21 of placing luminescent wafer, luminescent wafer is attached at the bottom surface 2111 of pit 211, directly contact with metallic matrix 2, the heat that luminescent wafer is produced can directly be passed to metallic matrix 2 and in time scatter and disappear, and has reduced the temperature of luminescent wafer, has guaranteed the stability of illumination intensity.This kind board structure has not only solved the problem of luminescent wafer heat radiation, has reduced the light decay of LED lamp; Simultaneously, first inclined-plane 2112 and second inclined-plane, 2122 surface gloss height that integrated punching forms, light refraction is good, promoted the light extraction efficiency of luminescent wafer, improve glare effect from whole light shape, reduced the sense of discomfort of human eye to the dazzle of LED lamp, greatly eliminated the point-like effect of LED lamp, reach the effect of area source, promoted the uniformity of light source.
In concrete the application, with regard to vertical plane, as you know SMD(it be the abbreviation of Surface Mounted Devices, mean: the support that surface mount device) needs a plastic cement encapsulation, so he vertical heat radiation many again two or three layer thermal resistance, all heat will down be fallen, and, the radiating effect of plastic rubber bracket is bad, aspect heat radiation, has certain limitation, and the COB illuminating product can reach reasonable efficient under limited volume, and the COB packing forms has reasonable performance in horizontal and rectilinear heat radiation.
The above only is preferred embodiment of the present utility model; not in order to limit the utility model; all any modifications of within spirit of the present utility model and principle, doing, be equal to and replace or improvement etc., all should be included within the protection range of the present utility model.
Claims (10)
1. COB board structure, comprise metallic matrix and circuit module, also comprise the insulating part that is arranged between described metallic matrix and the described circuit module, described insulating part simultaneously arranges the surface that is attached at described metallic matrix, described circuit module is attached at the another side of described insulator, it is characterized in that, the surface of described metallic matrix is provided with pit, edge in described pit also convexes with bulge loop, described bulge loop is surrounded on described pit, and described bulge loop and described pit are combined to form for the groove of placing luminescent wafer.
2. COB board structure as claimed in claim 1, it is characterized in that described pit comprises bottom surface and first inclined-plane, an end ring on described first inclined-plane is connected around described bottom surface and with described bottom surface, the other end is surperficial concordant with described metallic matrix, and luminescent wafer is attached at described bottom surface.
3. COB board structure as claimed in claim 2 is characterized in that, described bulge loop comprises step and second inclined-plane, and described first inclined-plane is connected with described second inclined-plane, and described step and described pit are provided with seal.
4. COB board structure as claimed in claim 3 is characterized in that, described first inclined-plane and described second inclined-plane are provided with for reflective reflector layer.
5. COB board structure as claimed in claim 1 is characterized in that, described metallic matrix is rectangular and adopt metallic material of aluminum to make, and described groove is provided with two at least.
6. COB board structure as claimed in claim 1 is characterized in that, described groove is a bowl cup-shaped, described groove be provided with four and be two row two row shapes be arranged on the described metallic matrix.
7. COB board structure as claimed in claim 6 is characterized in that, the number that described bulge loop arranges is identical with the number of described groove, described insulating part and described circuit module be covered in successively described bulge loop around.
8. COB board structure as claimed in claim 6 is characterized in that, described circuit module is provided with conducting strip, is electroplate with coating on the described conducting strip, and described conducting strip is surrounded on around the described bulge loop, and the described conducting strip between each adjacent columns is electrically connected.
9. COB board structure as claimed in claim 1 is characterized in that, the rectangular and edge of described metal substrate offers the locating notch for the location, and described locating notch is provided with at least two and be the diagonal angle and distribute.
10. COB board structure as claimed in claim 9 is characterized in that, described locating notch is curved.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320047223 CN203134857U (en) | 2013-01-28 | 2013-01-28 | COB substrate structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320047223 CN203134857U (en) | 2013-01-28 | 2013-01-28 | COB substrate structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203134857U true CN203134857U (en) | 2013-08-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320047223 Expired - Fee Related CN203134857U (en) | 2013-01-28 | 2013-01-28 | COB substrate structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203134857U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110071206A (en) * | 2018-12-29 | 2019-07-30 | 博罗康佳精密科技有限公司 | A kind of COB aluminum-based packaging plate and its preparation process |
-
2013
- 2013-01-28 CN CN 201320047223 patent/CN203134857U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110071206A (en) * | 2018-12-29 | 2019-07-30 | 博罗康佳精密科技有限公司 | A kind of COB aluminum-based packaging plate and its preparation process |
| CN110071206B (en) * | 2018-12-29 | 2021-09-17 | 博罗康佳精密科技有限公司 | COB aluminum-based packaging plate and preparation process thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130814 Termination date: 20210128 |