CN103094465B - LED module and processing technology thereof - Google Patents
LED module and processing technology thereof Download PDFInfo
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- CN103094465B CN103094465B CN201110345484.XA CN201110345484A CN103094465B CN 103094465 B CN103094465 B CN 103094465B CN 201110345484 A CN201110345484 A CN 201110345484A CN 103094465 B CN103094465 B CN 103094465B
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- 238000005516 engineering process Methods 0.000 title claims description 15
- 239000000463 material Substances 0.000 claims abstract description 72
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- 230000015572 biosynthetic process Effects 0.000 claims abstract description 9
- 238000005755 formation reaction Methods 0.000 claims abstract description 9
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- 239000000843 powder Substances 0.000 claims description 22
- 239000000741 silica gel Substances 0.000 claims description 22
- 229910002027 silica gel Inorganic materials 0.000 claims description 22
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 17
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- 229910052710 silicon Inorganic materials 0.000 description 6
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- 238000001746 injection moulding Methods 0.000 description 4
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- 229910052782 aluminium Inorganic materials 0.000 description 3
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Abstract
A kind of LED module, including radiator, pcb board, LED chip and lens module, radiator contacts with pcb board laminating formation face, described lens module is arranged on above LED chip, pit on one corresponding lens module of LED chip, all fill out in space between lens pit and LED chip and set molding colloid, by molding colloid be all coated with LED chip and between do not leave a blank gas, fluorescent material is arranged on the far-end of LED chip and is not directly contacted with LED chip.Fluorescent material and LED chip away from, both are independent of each other in heating, and the light decay of LED chip and fluorescent material is slack-off, and the conversion efficiency of fluorescent material is high.
Description
Technical field
The present invention relates to quasiconductor application and encapsulation field, more particularly, it relates to a kind of LED module and making work thereof
Skill.
Background technology
Along with the development of LED chip technology Yu encapsulation technology, increasing LED product is applied to lighting field, especially
It it is large power white light LED.Owing to LED has specular removal, long-life, energy-conserving and environment-protective, suitable brightness adjustment control, the pollutant such as the most mercurous
The feature of matter, becomes the lighting source of new generation after the conventional light source such as electric filament lamp, fluorescent lamp.
LED is a kind of electroluminescent semiconductor device, and the electric energy that wherein there are about 30 percent is converted to light, dump energy
Then be converted to heat, and the LED temperature that thermal accumlation causes rises, and is the main cause causing LED light to decline.Thus, LED chip
Heat radiation is the key issue that LED encapsulation is devoted to solve, and domestic and international manufacturer proposes various packaged type in succession.
Traditional LED encapsulation is LED chip to be fixed on package support, after bonding wire, by fluorescent material point to core
On sheet, sealing forms LED component.LED component is welded to aluminium base, fixed heat sink again, adds a cover lens forming LED module.
It is to say, use structure as shown in Figure 1 to carry out LED encapsulation and assemble.It is: with heat sink etc., LED chip is packaged into LED
Device 103, LED component 103 is welded to pcb board 102 (such as aluminium base), and pcb board 102 is fixed by the mode such as screw or silicone grease
At radiator 101, lens cover is on pcb board 102.
Traditional following several weak points of LED module existence:
First, fluorescent material efficiency is low, and light decay is fast；
In traditional LED module, fluorescent material covers in LED chip, and both directly contact combination, and LED chip and glimmering
Light powder is all the thermal source of heating, owing to both directly fit, heat superposition, and temperature rises.The rising of temperature does not only result in LED core
The light decay of sheet is accelerated, and can reduce the conversion efficiency of fluorescent material, and accelerates the rate of decay of fluorescent material conversion efficiency.
Second, passage of heat is complicated, poor heat radiation；
Traditional its passage of heat of LED module is: heat from LED chip, by internal heat sink, the pcb board 102 of encapsulation, with
And radiator 101, it is ultimately conducted to air.Owing to LED chip heat radiation needs the middle interlayer of passage of heat of process many, and
LED heat is heavy and medium between pcb board 102, pcb board 102 and radiator 101 is air or silicone grease, middle interlayer thermal conductivity
Relatively low, therefore heat dispersion is the best.
3rd, light is many through medium, and light loss is big；
Traditional LED module, light typically to pass through after chip sends: fluorescent material, package lens, air, light-distribution lens
Arriving diffuser again, the medium of light process is many, and each interface can occur reflection loss, and the most total optical transmittance is low.
Thus, traditional LED module, have that heat dispersion is the best, fluorescent material efficiency is low, light decay is fast, optical transmittance is low,
Production process is complicated, high in cost of production shortcoming.
Summary of the invention
It is an object of the invention to provide a kind of LED module, low to solve fluorescent material efficiency in prior art, light decay is fast
Technical problem.
The second object of the present invention be to provide a kind of LED module processing technology, to solve fluorescence in prior art
Powder efficiency is low, the technical problem that light decay is fast.
A kind of LED module, including radiator, pcb board, LED chip and lens module, it is characterised in that radiator and PCB
Plate laminating formation face contact, described lens module is arranged on above LED chip, on a corresponding lens module of LED chip
Pit, all fills out in the space between lens pit and LED chip and sets packing colloid, packing colloid be all coated with LED core
Sheet and between do not leave a blank gas, fluorescent material is arranged on the far-end of LED chip and is not directly contacted with LED chip.
Fluorescent material coats or is sprayed on each this lens pit inner surface in advance.
Described fluorescent material is mixed to be located in packing colloid, after being mixed with the packing colloid filling of fluorescent material, stands and makes fluorescent material sink
Drop to pit inner surface, in the distribution that center thickness surrounding is the thinnest.
In lens module injection moulding process, fluorescent material is mixed to be located in raw material, makes fluorescent material be distributed in lens module internal.
Pcb board inwardly has the some pits not penetrated from electrical layer, and the bottom of pit is planar structure, each LED
Chip covers respectively and is loaded in a pit bottom, is welded on the pad of pcb board electrical layer by lead-in wire, LED chip and pit bottom
Formation face contacts.
It is following a kind of situation that LED chip is welded to pcb board by lead-in wire:
Situation one: LED chip is positive cartridge chip, is welded to the both positive and negative polarity of LED chip and the positive and negative of pcb board by lead-in wire
Pole pad；
Situation two: LED chip is vertical chip, LED chip lower surface is bonded with pcb board by eutectic technology, and lead-in wire is only
Single electrode need to be welded to the corresponding electrode pad of pcb board；
Situation three: LED chip is flip-chip, then by flip technique, chip both positive and negative polarity is welded direct to the weldering on PCB
Dish.
A kind of LED module also includes that being coated with last layer inside lens module surrounding seals silica gel, and the position being coated with sealing silica gel is opened
Having the groove of correspondence, the silica gel sealing ring of molding is placed in outside；Or place the silica gel sealing of molding inside lens module surrounding
Circle, outside is coated with last layer and seals silica gel, and the position being coated with sealing silica gel has the groove of correspondence.
A kind of processing technology of LED module, including:
(1) LED chip is welded on pcb board；
(2) being fixed on a heat sink by the pcb board of step (1), the bottom of described pcb board fits tightly with described radiator
Formation face contacts；
(3) lens module is arranged on above LED chip, and the pit on a corresponding lens module of LED chip, at lens
All fill out in space between pit and LED chip and set packing colloid, by packing colloid be all coated with LED chip and between do not stay
Air, fluorescent material is arranged on the far-end of LED chip and is not directly contacted with LED chip.
Fluorescent material coats or is sprayed on each this lens pit inner surface in advance.
Described fluorescent material is mixed to be located in packing colloid, after being mixed with the packing colloid filling of fluorescent material, stands and makes fluorescent material sink
Drop to pit inner surface, in the distribution that center thickness surrounding is the thinnest.
This technique also includes: using standard light source to have above the lens of fluorescent material at point and irradiate, lower section uses colour temperature detection
Instrument, analyzes the colour temperature of each lens, and carries out mending powder or mending the packing colloid without fluorescent material according to the color temperature value of detection.
According to colour temperature deviation carry out mend powder technique can be following any one:
Again fluorescent material coated or be sprayed on the lens pit inner surface needing to mend powder；
Or in the setting time cycle according to packing colloid, the packing colloid being mixed with fluorescent material is put again and is needing benefit powder
In lens pit, stand in making fluorescent material be deposited to pit or pit inner surface.
Beneficial effects of the present invention is as follows:
First, fluorescent material and LED chip away from, both are independent of each other in heating, and the light decay of LED chip and fluorescent material is slow, glimmering
The conversion efficiency of light powder is high.
Secondly, the theory of traditional encapsulation is all that LED chip is encapsulated on the support of device, and substantial amounts of encapsulation is correlated with
Research work all launch around support, all become the weight of research including the hot property of support, reflective function, the stability of material
Point and put into huge manpower and materials and the present invention has jumped out the set of this thinking model, casted off the support of LED component once and for all,
LED chip is directly encapsulated on pcb board, eliminates and includes heat sink support, make the heat of LED chip without heat sink this
Intermediate layer, is directly diffused into pcb board and the radiator of high thermal conductivity, good heat dissipation effect.
Moreover, between lens module and LED chip, only fill colloid, and fill colloid refractive index 1.4 and 1.6 it
Between, light is few through medium, and transmitance is high, and fills the refractive index match of colloid and lens module, and reflection loss is few, improves
The light extraction efficiency of LED module.
It addition, lens module pours into packing colloid (molding colloid), and fill whole lens module inner chamber, be solidified into
Type, or be directly first to pour into packing colloid (molding colloid), then back-off fastening, all without knockout course, draw in not damaging
Line.
Further, it is few that LED module comprises parts, and production process is simple, with low cost.
Accompanying drawing explanation
Fig. 1 is the encapsulation exemplary plot of existing LED component；
Fig. 2 is the embodiment schematic diagram of LED module of the present invention；
Fig. 3 is pcb board of the present invention composition and bowl configurations schematic diagram thereof；
Fig. 4 is pcb board of the present invention composition and bowl configurations profile thereof；
Fig. 5 is the cut-away view of the back-off structure of lens mirror group.
In figure, 101 is radiator, and 102 is pcb board, and 103 is LED component, and 201 is radiator, and 202 is pcb board, and 203 are
LED chip, 204 is LED open-circuit protector, and 206 is to seal silica gel, and 207 is lens modules, and 301 is metal level, and 302 is insulation
Layer, 303 is electrical layer, and 401 is back-off structure, and 402 is glue, 403 fluorescent material.
Detailed description of the invention
Below in conjunction with the accompanying drawings embodiments of the invention are further elaborated:
Referring to Fig. 1 to Fig. 5, the LED module that a kind of fluorescent material is thermally isolated, including radiator 201PCB plate 202, LED core
Sheet 203, fluorescent material, sealing silica gel 206 and lens module 207, pcb board 202 inwardly has do not penetrate recessed from electrical layer 303
Hole；LED chip 203 is covered and is loaded in pit bottom, and is welded to the electrode pad of pcb board 202 electrical layer 303 by lead-in wire；Pcb board
202 fit with radiator 201.
Pcb board 202 includes electrical layer 303, insulating barrier 302, metal level 301, in pit, electrical layer 303 and insulating barrier
302 penetrate, and metal level 301 does not penetrates.Perforation is formed at electrical layer 303 and the insulating barrier 302 of pcb board by boring cup technique, and
Metal level 301 at pcb board arranges the pit not penetrated, and LED chip 203 is directly covered and is loaded in the pit bottom not penetrated, and
Be welded to the electrode pad of pcb board 202 electrical layer 303 by lead-in wire, pcb board can be aluminium base, then it includes electrical layer, absolutely
Edge layer, metal level.Pcb board 202 can be ceramic substrate, then it includes electrical layer, ceramic layer.The pit that pcb board 22 is arranged, recessed
Hole penetrates electrical layer and insulating barrier, arrives metal level or ceramic layer.Pit bottom is plane, so, and LED chip 204
Carry out face with pit to contact.Further, the size of pit is suitable with LED chip 204, preferably round, it is also possible to be other shape
Shape, can house LED chip 204 and be as the criterion, or slightly larger than LED chip 204, convenient heat radiation.Pit inner surface can be the light of brightening
Sliding surface.As preferably, the shiny surface of brightening is with coating minute surface.
For pcb board 202, by boring the perforation shape that cup technique is formed at electrical layer 303 and the insulating barrier 302 of pcb board 202
The wall of cup become, forms taper seat with the wall of cup of metal level 301 pit, and the wall of cup of this taper seat is formed with the horizontal plane of pit bottom
Angle between 90 degree～120 degree, and the wall of cup of this taper seat by bore cup technique be polished into can be reflective shiny surface, or plating
Upper silver carries out reflective.The face that described perforation wall of cup is formed with pit wall of cup, other shapes can being in addition to outside taper seat, as
Mesa-shaped, multiaspect column, cylindric, formed face is come by processing technique and the requirement to perforation wall of cup with the angle of pit bottom surface
Determine.
It is following a kind of situation that LED chip 204 is welded to pcb board 202 by lead-in wire:
Situation one: LED chip is positive cartridge chip, is welded to the both positive and negative polarity of LED chip and the positive and negative of pcb board by lead-in wire
Pole pad；
Situation two: LED chip is vertical chip, LED chip lower surface is bonded with pcb board by eutectic technology, and lead-in wire is only
Single electrode need to be welded to the corresponding electrode pad of pcb board；
Situation three: LED chip is flip-chip, then by flip technique, chip both positive and negative polarity is welded direct to the weldering on PCB
Dish.
Three cases above, the electrical layer 303 of pcb board 202 is provided with electrode pad, electroplate or gold or nickel.
A kind of mode is: lens module 207 covers on LED chip 203, and the lens pit inwall of lens module 207 is pre-
First coat or be coated with fluorescent material 403, and be filled with packing colloid 402, and by sealing silica gel 206 and pcb board 202
Formed with radiator 201 and seal structure.All fill out in space between lens pit and LED chip and set packing colloid
(molding colloid), by packing colloid (molding colloid) all cladding LED chip and between do not leave a blank gas, fluorescent material does not connects
Touch LED chip.
The second way is: all fills out in the space between lens pit and LED chip 203 and sets the envelope being mixed with fluorescent material
Dress colloid (molding colloid), makes fluorescent material be deposited to pit inner surface after standing, it is therefore desirable to the thinnest the dividing in center thickness surrounding
Cloth.Finally, by sealing silica gel 206 and pcb board 202 and radiator 201 formation sealing structure.
The third mode is: in lens module injection moulding process, and mixed fluorescent powder in raw material makes fluorescent material be distributed in
Lens module internal, then inject packing colloid to pit.
In above process, lens module 207 can directly cover on LED chip 203, is noted by gum-injecting port
Glue.Can also be that lens module 207 is inverted, after filling glue, then radiator button be sealed the most afterwards.That is, lens module 207 sets
In respect of back-off structure 401, radiator 201 tips upside down on formation on lens module 207 and closes fixing.Regardless of which kind of mode, if real
Existing lens module 207 is arranged on above LED chip 203.
Seal the solid silicon cushion rubber that silica gel 206 includes being arranged on lens module 207.Corresponding saturating of solid silicon cushion rubber side
On the position of mirror module 207 plane, have groove, be used for being coated with molding colloid.Lens module 207 has an integral planar, flat
Being clearly visible on face is lens pit (if turnback is seen, it is simply that protruding lens) one by one, this position, plane edge
Put and first enclose a solid silicon cushion rubber, in lens module 207 plane that solid silicon cushion rubber side is corresponding, have a circle groove, permissible
For being coated with molding colloid.It is of course also possible to be not provided with groove, (refractive index is 1.4 to 1.6 directly to coat molding colloid
Between).
LED chip 203 is parallel with LED open-circuit protector 204, and it act as open-circuit-protection and antistatic.
A kind of processing technology of LED module, including:
S110: LED chip is welded on pcb board；
S120: being fixed on a heat sink by the pcb board of step S110, the bottom of described pcb board is tight with described radiator
The contact of laminating formation face；
S130: lens module is arranged on above LED chip, the pit on a corresponding lens module of LED chip, thoroughly
All fill out in space between mirror pit and LED chip and set packing colloid (molding colloid), by packing colloid (molding glue
Body) all cladding LED chip and between do not leave a blank gas, fluorescent material is arranged on the far-end of LED chip and is not directly contacted with LED core
Sheet.
Arranging phosphor process step, it is one of them in following steps:
Each lens pit at lens module is injected separately into the packing colloid (molding colloid) being mixed with fluorescent material,
Fluorescent material is made to be deposited to pit inner surface after standing；Most preferably, fluorescent material is the distribution that center thickness surrounding is the thinnest；
At each pit inner surface of lens module sprayed with fluorescent powder respectively, then inject packing colloid (molding glue to pit
Body)；
In lens module injection moulding process, mixed fluorescent powder in raw material, make fluorescent material be distributed in lens module internal,
Packing colloid is injected again to pit.
Also include step S140:
The radiator of pcb board will be installed, on back-off lens module, fixed by the back-off structure on lens module, shape
Become the LED module sealed.Certainly, heat radiation cry and lens module can be mounted directly formed seal LED module, after pass through injecting glue
Hole carries out injecting glue so that molding colloid be all coated with LED chip and between do not leave a blank gas, this mode, avoid the need for lens
Module fills molding colloid in first carrying out being upside down in each pit.
Embodiment
A kind of manufacturing process of the LED module being thermally isolated based on fluorescent material, step is as follows:
(1) cover in PCB chip and at load, coat primer, LED chip is fixed on primer, toasted fixing；
(2) if LED chip is positive cartridge chip, lead-in wire is welded to the both positive and negative polarity of LED chip and the both positive and negative polarity of pcb board
Pad；If LED chip is vertical chip, LED chip lower surface is bonded with pcb board by eutectic technology, and lead-in wire only needs welding single
Individual electrode is to the corresponding electrode pad of pcb board；If LED chip is flip-chip, then by flip technique, chip both positive and negative polarity is direct
It is welded on PCB；
(3) pcb board is installed on a heat sink；
(4) the lens pit at lens module injects the packing colloid being mixed with fluorescent material, makes fluorescent material settle after standing
To pit inner surface, it is preferred that after fluorescent material sedimentation, in the distribution that center thickness surrounding is the thinnest；
Or, at lens module pit inner surface sprayed with fluorescent powder, then inject packing colloid to pit；
Or, in lens module injection moulding process, mixed fluorescent powder in raw material, make fluorescent material be distributed in lens module
Inside, then inject packing colloid to pit；
(5) using standard light source to have irradiation above the lens module of fluorescent material at the point of (4th) step, lower section uses colour temperature
Detecting instrument, analyzes the colour temperature of each pit of lens module, and carries out mending powder according to the color temperature value of detection.
It is preferred that standard light source uses the pcb board of the intrinsic chip of (2nd) step, described chip is the core through demarcating
Sheet.
Described benefit powder process is, the higher pit of colour temperature clicks and enters the glue containing fluorescent material again, and the pit that colour temperature is on the low side is again
Click and enter the glue without fluorescent material.
Using standard light source to have above the lens of fluorescent material at point to irradiate, lower section uses colour temperature detecting instrument, analyzes each
The colour temperature of lens, and carry out mending powder or mending the packing colloid (molding colloid) without fluorescent material according to the color temperature value of detection.Root
According to colour temperature deviation carry out mend powder technique can be following any one: again by fluorescent material coating or be sprayed on need benefit powder saturating
Mirror pit inner surface；Or according to the setting time cycle of the packing colloid (molding colloid) being mixed with fluorescent material, will be mixed with glimmering
The packing colloid (molding colloid) of light powder is put in the lens pit needing to mend powder again, stands and makes fluorescent material be deposited to pit
In or pit inner surface.
(6) on lens module, solid silicon cushion rubber, the lens module plane that described solid silicon cushion rubber side is corresponding are placed
Position on scribble liquid silica gel.Being coated with last layer inside lens module surrounding and seal silica gel, the silica gel sealing of molding is placed in outside
Circle；Or placing the silica gel sealing ring of molding inside lens module surrounding, outside is coated with last layer and seals silica gel.
(7) by the radiator being provided with pcb board of step (3), tip upside down on the lens module of step (5), pass through lens
Back-off structure on module is fixed, and forms the LED module sealed.
Between described step (1) (2), it is also possible to comprise the following steps: LED chip parallel connection LED open-circuit protector, and
It is fixed on Metal Substrate pcb board.
Described pcb board is metal basal board, outputs pit, electrical layer and insulating barrier by brill cup technique and penetrates, metal level
Do not penetrate.
Above-described is only the preferred embodiment of the present invention, it is noted that for common skill in the art
For art personnel, on the premise of without departing from core technical features of the present invention, it is also possible to make some improvements and modifications, these change
Enter and retouch and also should be regarded as protection scope of the present invention.
Claims (7)
1. a LED module, including radiator, pcb board, LED chip and lens module, it is characterised in that radiator and pcb board
The contact of laminating formation face, described lens module is arranged on above LED chip, recessed on the corresponding lens module of LED chip
Hole, all fills out in the space between lens pit and LED chip and sets packing colloid, packing colloid be all coated with LED chip
Not leaving a blank between and gas, fluorescent material is arranged on the far-end of LED chip and is not directly contacted with LED chip；
Described fluorescent material is mixed to be located in packing colloid, after being mixed with the packing colloid filling of fluorescent material, stands and makes fluorescent material be deposited to
Pit inner surface, in the distribution that center thickness surrounding is the thinnest.
2. LED module as claimed in claim 1, it is characterised in that pcb board inwardly has do not penetrate some from electrical layer
Pit, the bottom of pit is planar structure, and each LED chip is covered respectively and is loaded in a pit bottom, is welded to pcb board by lead-in wire
On the pad of electrical layer, LED chip forms face with pit bottom and contacts.
3. LED module as claimed in claim 1, it is characterised in that it is following one that LED chip is welded to pcb board by lead-in wire
The situation of kind:
Situation one: LED chip is positive cartridge chip, is welded to the both positive and negative polarity of LED chip and the both positive and negative polarity weldering of pcb board by lead-in wire
Dish；
Situation two: LED chip is vertical chip, LED chip lower surface is bonded with pcb board by eutectic technology, and lead-in wire only needs weldering
Order electrode is to the corresponding electrode pad of pcb board；
Situation three: LED chip is flip-chip, then by flip technique, chip both positive and negative polarity is welded direct to the pad on PCB.
4. LED module as claimed in claim 1, it is characterised in that also include that being coated with last layer inside lens module surrounding seals
Silica gel, the position being coated with sealing silica gel has the groove of correspondence, and the silica gel sealing ring of molding is placed in outside；Or lens module surrounding
The silica gel sealing ring of inner side placement molding, outside is coated with last layer and seals silica gel, and painting seals the position of silica gel and has corresponding groove.
5. the processing technology of a LED module, it is characterised in that including:
(1) LED chip is welded on pcb board；
(2) being fixed on a heat sink by the pcb board of step (1), the bottom of described pcb board and described radiator fit tightly formation
Face contacts；
(3) lens module is arranged on above LED chip, and the pit on a corresponding lens module of LED chip, at lens pit
And all fill out in the space between LED chip and set packing colloid, by packing colloid be all coated with LED chip and between do not leave a blank
Gas, fluorescent material is arranged on the far-end of LED chip and is not directly contacted with LED chip；
Described fluorescent material is mixed to be located in packing colloid, after being mixed with the packing colloid filling of fluorescent material, stands and makes fluorescent material be deposited to
Pit inner surface, in the distribution that center thickness surrounding is the thinnest.
6. the processing technology of LED module as claimed in claim 5, it is characterised in that also include: use standard light source to have at point
Irradiating above the lens of fluorescent material, lower section uses colour temperature detecting instrument, analyzes the colour temperature of each lens, and according to the colour temperature of detection
Value carries out mending powder or mending the packing colloid without fluorescent material.
7. the processing technology of LED module as claimed in claim 6, it is characterised in that carry out mending the work of powder according to colour temperature deviation
It is mixed with the setting time cycle of the packing colloid of fluorescent material according to skill, the packing colloid being mixed with fluorescent material is put again and mends at needs
In the lens pit of powder, stand in making fluorescent material be deposited to pit or pit inner surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110345484.XA CN103094465B (en) | 2011-11-04 | LED module and processing technology thereof |
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| CN201110345484.XA CN103094465B (en) | 2011-11-04 | LED module and processing technology thereof |
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