CN112151663A - LED circuit board module with diffusion cover and manufacturing method thereof - Google Patents

Abstract

The invention relates to an LED circuit board module with a diffusion cover and a manufacturing method thereof, and particularly comprises the following steps: the diffusion agent is added into the light-transmitting resin, then the light-transmitting resin is molded into a bowl-shaped diffusion cover, or the diffusion agent is applied to the surface of the bowl-shaped diffusion cover to form the diffusion cover with the diffusion agent, LED lamp beads are welded on a circuit board, or a chip is packaged on the circuit board, then the diffusion cover covers the LED and is attached to the circuit board, light emitted by the LED on the circuit board passes through a cavity of the diffusion cover and then passes through the diffusion cover, and the light passes through the diffusion cover and then is transmitted to the outside after being reflected and refracted for many times under the diffusion effect of the diffusion cover, so that the light-emitting angle is increased, the irradiation area is increased, and meanwhile, the diffusion cover also plays an insulating protection role.

Description

A LED circuit board module with a diffuser cover and a manufacturing method thereof

technical field

The invention relates to the application field of circuit boards and LEDs, in particular to an LED circuit board module with a diffuser cover and a manufacturing method thereof.

Background technique

Due to the small light-emitting angle of the SMD LED lamp itself, when making large-area lighting lamps or light boxes and other products, many circuit board light strips with lamp beads are required, and the lamp beads on each light strip must also be dense. Otherwise, the light emitted by the whole lamp will be uneven. How to achieve uniform light emission with fewer light bars and fewer lamp beads, and can greatly reduce the cost, is a technology in the industry for a long time.

In the industry, a lens is also added to each lamp bead on the light bar, so that the light emitted by the lamp bead increases in the angle of light and the light-emitting area after passing through the lens. However, adding a lens has two major disadvantages. One is the lens. The cost is high, and the lens ruler needs to be much larger than the lamp bead to achieve a larger light-emitting angle and a larger irradiation area, and the lens design is difficult, and the cost of the mold is very high.

In order to overcome the above shortcomings and solve the above technical problems, the present invention adds a diffusing agent to the light-transmitting material to make a bowl-shaped diffusing cover, which is buckled on the top of the light bar and covered on the LED, and the light emitted by the LED passes through. When passing through the diffuser, the diffuser is repeatedly reflected and refracted, and then emitted from the diffuser, which increases the light-emitting angle and increases the light-emitting area. Uniform light emission can be achieved, and the cost is greatly reduced.

SUMMARY OF THE INVENTION

The invention relates to an LED circuit board module with a diffuser cover and a manufacturing method thereof. Specifically, a diffusing agent is added to a light-transmitting resin, and then injection-molded into a bowl-shaped diffusing cover, or the diffusing agent is applied to the bowl The surface of the diffuser cover is made into a diffuser with diffusing agent, and the LED lamp beads are welded to the circuit board, or the chip is packaged on the circuit board, and then the diffusion cover is covered on the LED and attached to the circuit board. The light emitted by the LED on the circuit board passes through the cavity of the diffuser cover, and then passes through the diffuser cover. When the light passes through the diffuser cover, under the diffusion effect of the diffuser cover, it is transmitted to the outside after multiple reflections and refractions, which increases the light-emitting angle. , increasing the irradiation area, and the diffusion cover also plays a role in insulating protection.

According to the present invention, a method for manufacturing an LED circuit board module with a diffuser cover is provided. Specifically, the diffusing agent is added to the light-transmitting resin, and then injection-molded into a bowl-shaped diffusing cover, or the diffusing agent is applied to the light-transmitting resin. The surface of the bowl-shaped diffuser cover is made into a diffuser with diffusing agent, and the LED lamp beads are soldered to the circuit board, or the chip is packaged on the circuit board, and then the diffuser cover is covered over the LED and snapped onto the circuit board. hole, or first apply glue on the circuit board, and then stick the diffuser cover and the circuit board together, the light emitted by the LED on the circuit board passes through the cavity in the diffuser cover, and then passes through the diffuser cover, and the light passes through When the diffuser is used, under the diffusion effect of the diffuser, it is transmitted to the outside after multiple reflections and refractions, which increases the light-emitting angle and increases the irradiation area.

According to the present invention, there is also provided an LED circuit board module with a diffuser cover, including: a circuit board; LED; Bowl-shaped diffuser cover, the cover of the diffuser is a light-transmitting white cover, the thickness of the cover is greater than or equal to 0.05mm, less than or equal to 3mm, the diffuser cover is above the LED, and is connected to the circuit board, and the circuit The connection method of the board is to use adhesive to bond it together, or to connect it to the hole of the circuit board, or to connect it with glue and to be stuck in the hole of the circuit board at the same time. The LED is a packaged LED lamp bead welded to the circuit The board, or the LED chip is directly packaged on the circuit board. After the power is turned on, the light emitted by the LED first passes through the cavity in the diffuser, and then passes through the diffuser. Under the diffusion of the diffuser, the light is refracted multiple times. And after reflection, it is transmitted to the outside, which increases the light-emitting angle and increases the irradiation area.

According to a preferred embodiment of the present invention, the LED circuit board module with a diffuser cover is characterized in that the number of the LEDs is greater than or equal to one, and the number of the diffuser covers is also greater than or equal to 1 Equal to 1, multiple LEDs are covered by multiple diffusers, each diffuser is independent, or all diffusers are connected together.

The details of one or more embodiments of the invention are set forth in the accompanying drawings and the detailed description below. Other features, objects and advantages of the present invention will be apparent from the description, drawings and claims.

Description of drawings

The features, objects and advantages of the present invention will become more apparent by reading this specification in conjunction with the following drawings, in which:

FIG. 1 is a schematic cross-sectional view of a conjoined diffuser cover.

FIG. 2 is a schematic cross-sectional view of the LED lamp beads soldered to the circuit board.

FIG. 3 is a schematic cross-sectional view of the conjoined diffusion cover attached to the circuit board.

4 is a schematic cross-sectional view of a single diffuser cover.

FIG. 5 is a schematic cross-sectional view of a single diffuser being attached to a circuit board.

Detailed ways

The present invention will be described in detail below by taking the preferred embodiments as examples.

However, those skilled in the art should understand that the following descriptions merely illustrate and describe some preferred embodiments, and other similar or equivalent embodiments can also be used to implement the present invention.

The light-transmitting resin with diffusing agent is injected into a designed and manufactured injection mold to make a conjoined diffuser 1.1a with multiple small bowl openings 1.2a, and the adjacent diffusers 1.1a are connected into one (as shown in the figure). 1), or injection molding into a single diffuser cover 1.1b with a small bowl opening 1.2b (as shown in Figure 4).

Using the traditional SMT patch process, on the solder paste printer, the solder paste is printed on the component pads of the circuit board 3 with steel mesh, and then the LED lamp beads 2 are correspondingly mounted on the solder paste printed pads. After reflow soldering, solder the EED lamp beads 2 to the circuit board 3 (as shown in Figure 2).

Apply a layer of adhesive on the circuit board 3 to which the LED lights are soldered, and fasten the conjoined diffuser cover 1.1a to the adhesive on the circuit board 3, with the bowl mouth 1.2a facing down, and one bowl mouth 1.2a corresponding to one LED lamp beads, then apply pressure, bake and solidify, the adhesive will firmly bond the diffuser cover 1.1a and the circuit board 3 together to make the LED circuit with the conjoined diffuser cover 1.1a pasted to the circuit board as shown in Figure 3 The board module, or, a single diffuser cover 1.1b is respectively buckled on the adhesive on the circuit board 3, the bowl mouth 1.2b is facing down, and one bowl mouth 1.2b corresponds to an LED lamp bead, and then pressure is applied to bake and cure , and the adhesive firmly bonds the diffuser cover 1.1b and the circuit board 3 together to make a LED circuit board module with a single diffuser cover 1.1b pasted to the circuit board as shown in Figure 5.

In the present invention, diffusing agent is added to the light-transmitting material to make a bowl-shaped diffusing cover, which is buckled upside down on the light bar and covered on the LED. When the light emitted by the LED passes through the diffusing cover, it is repeatedly reflected and refracted by the diffusing cover. , and then emitted from the diffuser cover, which increases the light-emitting angle, increases the irradiation area, realizes fewer light bars and uses fewer lamp beads to achieve uniform light emission, and greatly reduces the cost.

A LED circuit board module with a diffuser cover and a manufacturing method thereof of the present invention have been described in detail above with reference to the accompanying drawings. However, those skilled in the art should understand that the above only illustrates and describes some specific embodiments, and does not limit the scope of the present invention, especially the scope of the claims.

Claims (3)

1. A manufacturing method of an LED circuit board module with a diffusion cover comprises the following steps: the diffusion agent is added into the light-transmitting resin, then the light-transmitting resin is manufactured into a bowl-shaped diffusion cover through injection molding, or the diffusion agent is applied to the surface of the bowl-shaped diffusion cover to manufacture the diffusion cover with the diffusion agent, LED lamp beads are welded on a circuit board, or a chip is packaged on the circuit board, then the diffusion cover covers the LED and is clamped in a hole in the circuit board, or glue is applied to the circuit board firstly, then the diffusion cover and the circuit board are adhered together, light emitted by the LED on the circuit board passes through a cavity in the diffusion cover and then passes through the diffusion cover, the light passes through the diffusion cover under the diffusion effect of the diffusion cover and is reflected and refracted for multiple times and then transmitted to the outside, the light-emitting angle is increased, the irradiation area is increased, and meanwhile, the diffusion cover also plays an insulating protection role for the LED and the circuit board.

2. An LED circuit board module with a diffusion cover comprises:

a circuit board;

LED；

a diffusion cover;

the LED lamp is characterized in that the diffusion cover is a single bowl-shaped diffusion cover or a connected diffusion cover containing a plurality of bowl shapes, the casing of the diffusion cover is a light-transmitting white casing, the thickness of the casing is more than or equal to 0.05mm and less than or equal to 3mm, the diffusion cover covers the LED and is connected with the circuit board, the casing is connected with the circuit board in a bonding mode through an adhesive, or the casing is connected into a hole of the circuit board in a clamping mode, or the casing is connected through the adhesive and is simultaneously clamped into the hole of the circuit board, the LED is a packaged LED lamp bead welded on the circuit board, or an LED chip is directly packaged on the circuit board, light emitted by the LED firstly penetrates through a cavity in the diffusion cover after being powered on and then penetrates through the diffusion cover, and under the diffusion effect of the diffusion cover, the light is transmitted to the outside after being refracted and reflected for multiple times, the light emitting angle.

3. The diffusion-covered LED circuit board module as claimed in claim 1 or 2, wherein the number of the LEDs is greater than or equal to 1, the number of the diffusion covers is greater than or equal to 1, the LEDs are covered by a plurality of diffusion covers, each diffusion cover is independent, or all the diffusion covers are connected together.

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