CN103258944A - Method for manufacturing LED package - Google Patents
Method for manufacturing LED package Download PDFInfo
- Publication number
- CN103258944A CN103258944A CN2013102110088A CN201310211008A CN103258944A CN 103258944 A CN103258944 A CN 103258944A CN 2013102110088 A CN2013102110088 A CN 2013102110088A CN 201310211008 A CN201310211008 A CN 201310211008A CN 103258944 A CN103258944 A CN 103258944A
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- CN
- China
- Prior art keywords
- led
- led chip
- manufacture method
- circuit board
- positive electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The invention discloses a method for manufacturing an LED package. The method includes the following steps: (1) positive electrodes and negative electrodes are respectively arranged on a printing circuit board; (2) LED chips are pasted on the positive electrodes or the negative electrodes through glue, positive poles and negative poles of the LED chips are electrically connected with the positive electrodes and the negative electrodes respectively, and the glue is hardened; (3) a transparent mould is placed on the printing circuit board, the LED chips are placed in an cavity of the transparent mould, mixtures of liquid silicon resin or liquid silicon resin and fluorescent powder are filled in the mould cavity, and the filling material is hardened to be a mould pressing forming portion; (4) the filling material is subjected to drying processing after being molded; (5) the transparent mould is moved out. The manufacturing method has the advantages that on one hand, less materials are used, cost is low, batch production can be achieved, and on the other hand, produced LED chips achieve the effects of high light effect, low light degradation and large light-emitting angle.
Description
Technical field
The present invention relates to a kind of manufacture method of LED LED package.
Background technology
Used led chip comprises the forming part of the epoxy resin of printed circuit board (PCB), led chip and packaging LED chips at present, and for the ease of the moulding of forming part, this printed circuit board (PCB) is provided with boss, utilize boss to surround to hold the forming cavity of liquid-state epoxy resin, after the epoxy resin of liquid state put into syringe, by Dispenser quantitatively apply on the led chip, behind the filling forming cavity, hardening through 4-5 hour to form forming part.And in order to make this led chip produce white light, often in epoxy resin, sneak into a spot of fluorescent material, the fluorescent material of coating, filling not only is dispersed to any direction in liquid-state epoxy resin, and the liquid-state epoxy resin firm time is long, can be poly-around led chip along with the increase of time than the heavy fluorophor of epoxy resin, the refractive index of light is descended, cause the brightness of white light low, scatter greatly, and epoxy resin can't satisfy existing market and pursues high light efficiency, the high and low light decay of the photochromic uniformity, finished product and stablize high effect.The final price competition can go wrong, and will be difficult to survive on the market again.
Summary of the invention
Technical problem to be solved by this invention is: a kind of manufacture method of LED LED package is provided, and this manufacture method consumptive material is few, cost is low and the high light efficiency of led chip produced, low light decay, lighting angle are big.
For solving the problems of the technologies described above, technical scheme of the present invention is: a kind of manufacture method of LED LED package is as follows: a. is installed on positive electrode and negative electrode on the printed circuit board (PCB) respectively; B. led chip is adhered on positive electrode or the negative electrode with jelly, the positive pole of led chip, negative pole are electrically connected with positive electrode, negative electrode respectively, and described jelly hardens; C. transparent mould is positioned over printed circuit board (PCB), led chip is in the die cavity of transparent mould, the mixture of filling liquid silicones or liquid silicone resin and fluorescent material in the die cavity, described charges are that liquid silicone resin or liquid silicone resin become compression molding portion with the mixture cures of fluorescent material; D. after the charges moulding, dry processing is 1-1.5 hour under 100-150 ℃; E. shift out transparent mould.
As a kind of preferred version, it is non-conductive glue that led chip is adhered to jelly used on positive electrode or the negative electrode, and the positive pole of led chip, negative pole all are electrically connected by conductor wire and positive electrode, negative electrode, and this conductor wire is encapsulated by described charges.
As a kind of preferred version, led chip is adhered on positive electrode or the negative electrode by conductive paste, the negative or positive electrode of led chip contacts with conductive paste, the negative pole of led chip or anodal be electrically connected by conductor wire and negative electrode or positive electrode, and this conductor wire is encapsulated by described filler.
As a kind of preferred version, when described filler was the mixture of liquid silicone resin and fluorescent material, fluorescent material shared ratio in mixture was 0-95%.
As a kind of preferred version, also be added with precipitating inhibitor in the described filler, the amount of this fluorescent material precipitating inhibitor is respectively (0-10%).
As a kind of preferred version, the cross section of described compression molding portion is trapezoidal, and described trapezoidal long limit contacts with printed circuit board (PCB).Certainly, this compression molding portion also can be hemisphere.
As a kind of preferred version, be bonded with the plurality of LEDs chip on the described printed circuit board (PCB), corresponding, transparent mould is provided with and led chip die cavity one to one, printed circuit board (PCB) is provided with led chip to organize positive and negative electrodes one to one more, and this method also comprises: f. cuts each led chip; G. to the Performance Detection of each led chip.
As a kind of preferred version, be bonded with the plurality of LEDs chip on the described printed circuit board (PCB), transparent mould is provided with a plurality of die cavitys, the compression molding portion encapsulation at least two LEDs chips of each cavity forming.
After having adopted technique scheme, the invention has the beneficial effects as follows: a kind of manufacture method of LED LED package, this manufacture method is used transparent mould, and this transparent mould is taken out in the back that completes, can realize recyclingly, make that manufacture method consumptive material of the present invention is few, cost is low, the compression molding portion on the led chip of producing is whole exposed, the situation that can not occur shutting out the light when led chip is luminous has realized high light efficiency, the effect of hanging down light decay.
When being the mixture of liquid silicone resin and fluorescent material owing to described filler again, fluorescent material shared ratio in mixture is (0-95%), can satisfy the different user demands to light color.
Description of drawings
Fig. 1 is a kind of LED LED package that manufacturing of the present invention obtains;
In the accompanying drawing: 1. printed circuit board (PCB); 2. positive electrode; 3. negative electrode; 4. chip; 5. non-conductive glue; 6. compression molding portion; 7. conductor wire.
Embodiment
Be described in further detail below by the manufacture method of specific embodiment to a kind of LED LED package of the present invention.
A kind of manufacture method of LED LED package is as follows:
A. positive electrode 2 and negative electrode 3 are installed on respectively on the printed circuit board (PCB) 1;
B. led chip 4 usefulness jellies are adhered on positive electrode 2 or the negative electrode 3, the positive pole of led chip 4, negative pole are electrically connected with positive electrode 2, negative electrode 3 respectively, and described jelly hardens;
C. transparent mould is positioned over printed circuit board (PCB) 1, led chip 4 is in the die cavity of transparent mould, the mixture of filling liquid silicones or liquid silicone resin and fluorescent material in the die cavity, described charges are that liquid silicone resin or liquid silicone resin become compression molding portion 6 with the mixture cures of fluorescent material, also be added with precipitating inhibitor in the described filler, the amount of this precipitating inhibitor is respectively (0-10%), can effectively suppress the precipitation of fluorescent material; The cross section of described compression molding portion 6 is trapezoidal, and described trapezoidal long limit contacts with printed circuit board (PCB) 1.Certainly, this compression molding portion 6 also can be semicircle.
D. after the charges moulding, dry processing is 1-1.5 hour under 100-150 ℃;
E. shift out transparent mould.
In the present embodiment, it is non-conductive glue 5 that led chip 4 is adhered to jelly used on positive electrode 2 or the negative electrode 3, and the positive pole of led chip 4, negative pole all are electrically connected by conductor wire 7 and positive electrode 2, negative electrode 3.Certainly, led chip 4 also can be adhered on positive electrode 2 or the negative electrode 3 by conductive paste, and at this moment, the negative or positive electrode of led chip 4 contacts with conductive paste, and the negative pole of led chip 4 or positive pole are electrically connected by conductor wire 7 and negative electrode 3 or positive electrode 2.
When described filler was the mixture of liquid silicone resin and fluorescent material, fluorescent material shared ratio in mixture was (0-95%)
The manufacture method of a kind of LED LED package of the present invention also is applicable to batch process, be bonded with plurality of LEDs chip 4 on the described printed circuit board (PCB) 1, corresponding, transparent mould is provided with and led chip 4 die cavity one to one, printed circuit board (PCB) 1 is provided with led chip 4 to organize positive and negative electrodes 3 one to one more, so, this method also comprises: f. cuts each led chip 4; G. to the Performance Detection of each led chip 4.
Certainly, also may be to be bonded with plurality of LEDs chip 4 on the described printed circuit board (PCB) 1, transparent mould is provided with a plurality of die cavitys, the compression molding portion 6 encapsulation at least two LEDs chips 4 of each cavity forming, by can in parallel or series connection between a plurality of led chips 4 of same compression molding portion 6 encapsulation, get final product cutting each LED light-emitting diode then.
As shown in Figure 1, the encapsulation of the LED light-emitting diode of producing by the present invention comprises printed circuit board (PCB) 1, led chip 4, transparent compression molding portion 6, described printed circuit board (PCB) 1 is provided with positive electrode 2 and negative electrode 3, described chip 4 is adhered on positive electrode 2 or the negative electrode 3, the positive pole of chip 4 and negative pole connect with positive electrode 2, negative electrode 3 electricity respectively, and described compression molding portion 6 is arranged on the printed circuit board (PCB) 1 and covers described led chip 4.
Claims (9)
1. the manufacture method of a LED LED package is as follows:
A. be installed on positive electrode and negative electrode on the printed circuit board (PCB) respectively;
B. led chip is adhered on positive electrode or the negative electrode with jelly, the positive pole of led chip, negative pole are electrically connected with positive electrode, negative electrode respectively, and described jelly hardens;
C. transparent mould is positioned over printed circuit board (PCB), led chip is in the die cavity of transparent mould, the mixture of filling liquid silicones or liquid silicone resin and fluorescent material in the die cavity, described charges are that liquid silicone resin or liquid silicone resin become compression molding portion with the mixture cures of fluorescent material;
D. dry processing after the charges moulding;
E. shift out transparent mould.
2. a kind of manufacture method of LED LED package according to claim 1, it is characterized in that: it is non-conductive glue that led chip is adhered to jelly used on positive electrode or the negative electrode, the positive pole of led chip, negative pole all are electrically connected by conductor wire and positive electrode, negative electrode, and this conductor wire is encapsulated by described charges.
3. a kind of manufacture method of LED LED package according to claim 1, it is characterized in that: led chip is adhered on positive electrode or the negative electrode by conductive paste, the negative or positive electrode of led chip contacts with conductive paste, the negative pole of led chip or anodal be electrically connected by conductor wire and negative electrode or positive electrode, this conductor wire is encapsulated by described filler.
4. as the manufacture method of a kind of LED LED package as described in claim 2 or 3, it is characterized in that: when described filler was the mixture of liquid silicone resin and fluorescent material, fluorescent material shared ratio in mixture was (0-95%).
5. as the manufacture method of a kind of LED LED package as described in the claim 4, it is characterized in that: also add the fluorescent material precipitating inhibitor in the described filler, the amount of this fluorescent material precipitating inhibitor is respectively (0-10%).
6. as the manufacture method of a kind of LED LED package as described in the claim 4, it is characterized in that: the cross section of described compression molding portion is trapezoidal, and described trapezoidal long limit contacts with printed circuit board (PCB).
7. state a kind of manufacture method of LED LED package as claim 4, it is characterized in that: the cross section of described compression molding portion is hemisphere.
8. state a kind of manufacture method of LED LED package as claim 1, it is characterized in that: be bonded with the plurality of LEDs chip on the described printed circuit board (PCB), corresponding, transparent mould is provided with and led chip die cavity one to one, printed circuit board (PCB) is provided with led chip to organize positive and negative electrodes one to one more, and this method also comprises
F. cut each led chip;
G. to the Performance Detection of each led chip.
9. state a kind of manufacture method of LED LED package as claim 1, it is characterized in that: be bonded with the plurality of LEDs chip on the described printed circuit board (PCB), transparent mould is provided with a plurality of die cavitys, the compression molding portion encapsulation at least two LEDs chips of each cavity forming.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013102110088A CN103258944A (en) | 2013-05-31 | 2013-05-31 | Method for manufacturing LED package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013102110088A CN103258944A (en) | 2013-05-31 | 2013-05-31 | Method for manufacturing LED package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103258944A true CN103258944A (en) | 2013-08-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013102110088A Pending CN103258944A (en) | 2013-05-31 | 2013-05-31 | Method for manufacturing LED package |
Country Status (1)
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| CN (1) | CN103258944A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103557467A (en) * | 2013-10-25 | 2014-02-05 | 大连恭德科技有限公司 | Concentrating LED (light-emitting diode) soft lamp strip |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030083392A (en) * | 2002-04-22 | 2003-10-30 | 서울반도체 주식회사 | Chip type white light-emitting diode and method of manufacturing the same |
| CN101959932A (en) * | 2008-03-06 | 2011-01-26 | 富士胶片株式会社 | Curable composition for nanoimprint, cured product using the same, method for producing the cured product, and member for liquid crystal display device |
| CN102447049A (en) * | 2011-12-31 | 2012-05-09 | 杭州电子科技大学 | LED (light-emitting diode) package structure based on COB (chip on board) package technology and LED illuminator |
| CN202308059U (en) * | 2011-11-01 | 2012-07-04 | 厦门煜明光电有限公司 | LED (Light Emitting Diode) package structure |
-
2013
- 2013-05-31 CN CN2013102110088A patent/CN103258944A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030083392A (en) * | 2002-04-22 | 2003-10-30 | 서울반도체 주식회사 | Chip type white light-emitting diode and method of manufacturing the same |
| CN101959932A (en) * | 2008-03-06 | 2011-01-26 | 富士胶片株式会社 | Curable composition for nanoimprint, cured product using the same, method for producing the cured product, and member for liquid crystal display device |
| CN202308059U (en) * | 2011-11-01 | 2012-07-04 | 厦门煜明光电有限公司 | LED (Light Emitting Diode) package structure |
| CN102447049A (en) * | 2011-12-31 | 2012-05-09 | 杭州电子科技大学 | LED (light-emitting diode) package structure based on COB (chip on board) package technology and LED illuminator |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103557467A (en) * | 2013-10-25 | 2014-02-05 | 大连恭德科技有限公司 | Concentrating LED (light-emitting diode) soft lamp strip |
| CN103557467B (en) * | 2013-10-25 | 2016-03-16 | 大连恭德科技有限公司 | A kind of light-focusing type flexible LED lamp band |
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Application publication date: 20130821 |