CN201048138Y

CN201048138Y - LED packaging module with secondary lens

Info

Publication number: CN201048138Y
Application number: CNU2007201482327U
Authority: CN
Inventors: 许弘宗
Original assignee: ZHAOLI OPTOELECTRONIC CO Ltd
Current assignee: ZHAOLI OPTOELECTRONIC CO Ltd
Priority date: 2007-05-11
Filing date: 2007-05-11
Publication date: 2008-04-16
Anticipated expiration: 2017-05-11

Abstract

The utility model relates to a LBD packaging module with a secondary lens. The module consists of a base plate, a LBD, and a lens holder arranged on the base plate; wherein, the LBD is provided with a first lens packaged outside a chip, while the lens holder comprises a second lens and a holder plate arranged around the bottom of the second lens. A concave space for holding the LBD is formed inside the bottom of the second lens, while an embed groove which is matched with the base plate is formed in the holder plate, and a cementing layer is formed between the contact surfaces of the holder plate and the base plate, thereby forming the LBD packaging module with the secondary lens.

Description

LED encapsulation module with secondary camera lens

Technical field

The utility model relates to a kind of light-emitting diode, particularly a kind of package module with light-emitting diode of secondary camera lens.

Background technology

(Light Emitting Diodes is a kind of its voltage slightly that offers LED) to light-emitting diode, and it just can send the semiconductor of light, abbreviates LED again as.Light-emitting diode is a kind of very useful and efficient light source, and it has plurality of advantages such as brightness height, power saving, life-span length, and is widely used in the illumination of electronic installation or light fixture.For increasing its range of exposures and brightness, be combined into LED lamp group or cooperate the design of the above optical lens of secondary (lens) by a plurality of light-emitting diodes usually, to reach aforementioned purpose by single light-emitting diode.

Yet, used the package structure for LED of secondary optics camera lens, owing to be mostly with circuit board as the energising media, so need on circuit board, to form complicated wiring in the past, add back of circuit board and be difficult for setting up radiating block, thereby cause comparatively inconvenience and difficult of making.

In view of this, the design artificially improves and addresses the aforementioned drawbacks, so concentrate on studies and cooperate the utilization of scientific principle, proposes a kind of reasonable in design and effectively improve the utility model of above-mentioned defective finally.

The utility model content

Main purpose of the present utility model is to provide a kind of LED encapsulation module with secondary camera lens, it has on the substrate of thermolysis, directly coating separates the conductive layer of positive and negative conduction region, and between heat dissipating layer and conductive layer, be provided with insulating barrier, so as to simplifying the board structure of light-emitting diode, and assemble secondary lens with modular mode, thereby reach the purpose of quick assembling.

In order to achieve the above object, the utility model provides a kind of LED encapsulation module with secondary camera lens, and it comprises substrate, light-emitting diode and is located at lens mount on the substrate.Substrate is formed by stacking the putting of heat dissipating layer, insulating barrier and conduction, and conductive layer distinguishes two conduction regions are arranged, and the chip of light-emitting diode is cross-placed between two conduction regions, and has and be packaged in the first outer lens of chip.The seat board that lens mount comprises second lens and is formed at the second lens bottom periphery.Be formed with for the ccontaining recessed space of light-emitting diode in second lens bottom, then form the caulking groove that matches with substrate in the seat board, and between seat board and the contacted surface of substrate, form cementing layer.Whereby, just can constitute described LED encapsulation module, and achieve the above object with secondary camera lens.

Compared with prior art, the beneficial effects of the utility model are, can simplify the board structure of light-emitting diode, and with modular mode assembling secondary lens, can reach the purpose of quick assembling.

Description of drawings

Fig. 1 is a three-dimensional exploded view of the present utility model;

Fig. 2 is a three-dimensional combination figure of the present utility model;

Fig. 3 is the three-dimensional combination figure at another visual angle of the utility model;

Fig. 4 is a top plan view of the present utility model;

Fig. 5 is the cutaway view along the 5-5 section of Fig. 4;

Fig. 6 is the 6-6 cross-section cutaway view along Fig. 4; And

Fig. 7 is the generalized section of the utility model user mode.

In the accompanying drawing, the list of parts of each label representative is as follows:

Substrate 1

Heat dissipating layer 10 insulating barriers 11

Conductive layer 12 conduction regions 120

Conduction region 121 slits 122

Cementing layer 123 electric wires 13

Aspirating hole 14 lockholes 15

Light-emitting diode 2

Chip 20 lens 21

Lens mount 3

Lens 30 recessed spaces 300

Seat board 31 caulking grooves 310

Opening 311 perforation 312

Groove 313

Parts 4

Spiral shell is established assembly 40

Embodiment

Relevant feature of the present utility model and technology contents, see also following about detailed description of the present utility model and accompanying drawing, yet accompanying drawing only provide with reference to and the explanation usefulness, be not to be used for the utility model is limited.

Fig. 1 is a three-dimensional exploded view of the present utility model, and Fig. 2 is a three-dimensional combination figure of the present utility model, and Fig. 3 is the three-dimensional combination figure at another visual angle of the utility model.The utility model provides a kind of LED encapsulation module with secondary camera lens, and it comprises substrate 1, light-emitting diode 2 and lens mount 3.

Substrate 1 can be square plate, and it is repeatedly put by heat dissipating layer 10, insulating barrier 11 and conductive layer 12 and forms.Heat dissipating layer 10 can be made by the good material of thermal conductivity such as copper, and is positioned at substrate 1 bottom, so that when light-emitting diode 2 energisings it is dispelled the heat.Insulating barrier 11 is between heat dissipating layer 10 and conductive layer 12.Conductive layer 12 is coated in insulating barrier 11 surfaces, and can be coated with by conductive metallic materials such as Copper Foils and form.Distinguishing on insulating barrier 11 surface has positive and negative two conduction regions 120,121, and between two conduction regions 120,121 with slit 122 by being separated by.

From the above, light-emitting diode 2 comprises chip 20 and is packaged in chip 20 first lens 21 outward.Chip 20 is cross-placed on two conduction regions 120,121 and is positioned on the slit 122, and is preferably placed at substrate 1 top center place.First lens 21 are as a camera lens of light-emitting diode 2.

Lens mount 3 is assembled on the substrate 1, and the seat board 31 that comprises second lens 30 and be formed at second lens, 30 bottom peripheries.Second lens 30 are as the secondary camera lens of light-emitting diode 2.Second lens, 30 bottoms inwardly concave and form recessed space 300, are positioned at recessed space 300 to make light-emitting diode 2, and can make first and

second lens

21,30 upper and lower phase contrapositions.Seat board 31 can be made into integration by transparent material with second lens 30, and can further do atomizing to seat board 31 and handle.Seat board 31 bottoms inwardly concave and form the caulking groove 310 that matches with substrate 1.Caulking groove 310 cooperate slits 122 on substrate 1 trend and on its corresponding both side edges, form opening 311 respectively, all can the part be exposed to outside the caulking groove 310 by at least one opening 311 with two conduction regions 120,121 that make substrate 1, thus be electrically connected with two conduction regions 120,121 in order to supply lines 13.

Moreover, shown in Figure 4 and 5, seat board 31 can further be concaved with annular ditch groove 313 near outside recessed space 300 peripheries of second lens 30, and the place is provided with a plurality of aspirating holes 14 respectively at substrate 1 corresponding ring-type position, and each aspirating hole 14 is all connected by the thickness direction of substrate 1.When lens mount 3 is assembled on the substrate 1, can utilize 300 inside, 14 pairs of recessed spaces of each aspirating hole to bleed, to increase the adaptation between seat board 31 and the substrate 1, and can be glued between seat board 31 and the substrate 1 contacted surface with viscose, so that on two conduction regions, 120,121 corresponding sections, stick together cementing layer 123, thereby as the obstruct of 14 of recessed space 300 and each aspirating holes or further packing in each aspirating hole 14, simultaneously substrate 1 and lens mount 3 are given affixed moulding.

In addition,, also can further wear a plurality of perforation 312 on the seat board 31, and on substrate 1, also wear corresponding a plurality of lockhole 15 as Fig. 4 and shown in Figure 6.In view of the above, as shown in Figure 7, can establish assembly 40 by a plurality of spiral shells and run through lockhole 15 and perforation 312, so as with modularized light emitting diode be locked in desire on the mounted component 4.

Therefore, by above-mentioned contexture, just can obtain the LED encapsulation module with secondary camera lens of the present utility model.

Therefore,, can simplify the structure of the substrate 1 of light-emitting diode, and substrate 1 is also comparatively easy with the assembling of lens mount 3, so as to reaching quick assembling and the purpose of simplifying technology by the LED encapsulation module with secondary camera lens of the present utility model.

In sum, the utility model is real to be rare novel creation product, it can reach the application target of expection really, solve the defective that exists in the prior art, have novelty and creativeness, meet the requirement of novel patent application fully, file an application according to Patent Law, would like to ask detailed survey and authorize this case patent, to ensure designer's right.

The above is a preferred embodiment of the present utility model only, is not so promptly limits claim of the present utility model, and the equivalent structure transformation that every utilization the utility model specification and accompanying drawing content are done all in like manner is included in the claim of the present utility model.

Claims

1. LED encapsulation module with secondary camera lens is characterized in that comprising:

Substrate, it is formed by heat dissipating layer, insulating barrier and stacking the putting of conducting electricity, and the differentiation of described conductive layer has two conduction regions;

Light-emitting diode, it comprises and is cross-placed on the chip between described two conduction regions and is packaged in the first outer lens of described chip; And

Lens mount, it is located on the described substrate, and comprise second lens and be formed at the seat board of the described second lens bottom periphery, described second lens bottom inwardly concaves and forms recessed space, to make described light-emitting diode be positioned at the female space, described seat board bottom inwardly concaves and forms the caulking groove that matches with described substrate, and sticks together between described seat board and the contacted surface of described substrate cementing layer is arranged.

2. the LED encapsulation module with secondary camera lens as claimed in claim 1, between two conduction regions of wherein said substrate with the slit by separating.

3. the LED encapsulation module with secondary camera lens as claimed in claim 2, wherein said caulking groove cooperates the trend of described slit on described substrate, and on the corresponding both side edges of described seat board, form opening respectively, the part is exposed to outside the described caulking groove two conduction faunas of described substrate by at least one described opening, is electrically connected in order to supply lines.

4. the LED encapsulation module with secondary camera lens as claimed in claim 1 or 2, wherein said seat board is outside the periphery in the recessed space of close described second lens, further be concaved with annular ditch groove, and be provided with a plurality of aspirating holes respectively at place, the corresponding ring-type of described substrate position.

5. the LED encapsulation module with secondary camera lens as claimed in claim 1 or 2, further be equipped with a plurality of perforation on the wherein said seat board, and on described substrate, be equipped with corresponding a plurality of lockhole, and establish assembly with a plurality of spiral shells and run through described perforation and described lockhole and lock.