CN201680207U - Light-emitting diode light source module - Google Patents

Abstract

The utility model provides a light emitting diode light source module, it contains a metal base, a circuit board, a plurality of emitting diode, many bonding wires to and an encapsulation layer. The metal base is provided with a bottom wall and a surrounding wall extending upwards from the bottom wall, and the bottom wall and the surrounding wall define an accommodating space. The circuit board and the light emitting diodes are respectively arranged on the bottom wall. The bonding wires are respectively electrically connected with the light emitting diode and the circuit board. The packaging layer is arranged in the containing space and covers the light-emitting diodes and the bonding wires. The utility model discloses a light emitting diode light source module can have the radiating effect of preferred to can advance the whole luminous luminance that improves light emitting diode light source module.

Description

LED light source module

technical field

The utility model relates to a light emitting diode light source module, in particular to a light emitting diode light source module with good heat dissipation effect.

Background technique

Light-emitting diodes have the advantage of saving energy, and have recently gradually replaced traditional incandescent or fluorescent lamps for general lighting. Whether it is a street lamp with a large power consumption or a general indoor lamp, light-emitting diodes are used to reduce energy consumption. However, since the high temperature of the LED during operation will reduce its luminous efficiency and possibly shorten its lifespan, it is necessary to dissipate the heat efficiently and quickly by various means.

As shown in Figure 1, it is a known light emitting diode light source module, which includes a metal base plate 11, an insulating layer 12 arranged on the metal base plate 11, a plurality of lines 13 arranged on the insulating layer 12, at least one device LED 14 on the insulating layer 12, a plurality of electrical connection lines 13 and bonding wires 15 of the LEDs 14, a frame 16 surrounding the LEDs 14 and the bonding wires 15, and a package covering the LEDs 14 and the bonding wires 15 Layer 17. In actual operation, the heat emitted by the LED 14 can be conducted to the metal base 11 and the frame 16 through the insulating layer 12, and the metal base 11 and the frame 16 can help to dissipate heat, so as to reduce the operating temperature of the LED 14 itself and prevent the LED 14 Reduce its luminous efficiency at high temperature.

However, since the light-emitting diodes 14 are arranged on the insulating layer 12, the heat generated by the light-emitting diodes 14 must first pass through the insulating layer 12 before being conducted to the metal base plate 11. The surroundings of the light-emitting diode 14 cause its luminous efficiency to decrease.

On the other hand, since the light-emitting diodes 14 and the lines 13 are also arranged on the insulating layer 12 and each occupy a certain area, the difficulty in layout of the lines 13 on the insulating layer 12 is increased, which indirectly affects the addition of more components on the insulating layer 12. The possibility of multiple light emitting diodes 14 results in that the overall luminance of the light emitting diode light source module cannot be further improved. Moreover, the minimum distance required to achieve uniform light mixing cannot be shortened by adding more LEDs 14 .

Utility model content

The purpose of the utility model is to provide an LED light source module, which not only has a better heat dissipation effect, but also improves the overall luminous brightness of the LED light source module.

To achieve the above purpose, the light emitting diode light source module of the present invention includes a metal base, a circuit board, a plurality of light emitting diodes, a plurality of bonding wires, and a packaging layer. The metal base has a bottom wall and a surrounding wall extending upward from the bottom wall, and the bottom wall and the surrounding wall define an accommodating space. The circuit board and the LEDs are respectively arranged on the bottom wall. The bonding wires are respectively electrically connected to the LED and the circuit board. The encapsulation layer is arranged in the accommodating space and covers the light emitting diodes and the bonding wires.

In the above LED light source module, the bottom wall is recessed downward to form a groove, and at least a part of the circuit board is located in the groove.

In the aforementioned light emitting diode light source module, the bottom wall penetrates downward to form a through groove, and the circuit board is located in the through groove.

In the above LED light source module, the circuit board is a single-layer circuit board or a multi-layer circuit board.

In the above LED light source module, a reflective layer is formed on the metal base.

In the above LED light source module, the reflective layer is formed by electroplating, sputtering, or coating.

In the above LED light source module, the encapsulation layer contains fluorescent particles or diffusion particles.

The LED light source module above further includes a lens layer disposed on the encapsulation layer.

The above LED light source module further includes a fluorescent layer disposed on the encapsulation layer.

The LED light source module above further includes a diffusion film disposed on the encapsulation layer.

In the above LED light source module, the diffusion film is formed by coating or pasting.

The LED light source module above further includes a lens layer disposed above the encapsulation layer.

In the above LED light source module, the lens layer is a Fresnel lens layer.

In the above light emitting diode light source module, the light emitting diode is a light emitting diode chip or a packaged light emitting diode assembly.

Since the light emitting diode of the present invention is not arranged on the circuit board, but is arranged on the bottom wall of the metal base, and then electrically connected to the circuit board through welding wires, the heat generated by the light emitting diode during operation can be reduced Direct conduction to the metal base, better heat dissipation efficiency. Moreover, since the light emitting diodes are not arranged on the circuit board, the circuit layout on the circuit board can be made easier, and the light emitting diodes can be arranged on the bottom wall in a more compact manner, so as to improve the overall luminescence of the light emitting diode light source module. brightness.

The utility model will be described in detail below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the utility model.

Description of drawings

FIG. 1 is a cross-sectional view of a known LED light source module;

2 is a schematic diagram of a preferred embodiment of the light emitting diode light source module of the present invention;

3 is a cross-sectional view of the LED light source module of the preferred embodiment;

4 is a cross-sectional view of another embodiment of the LED light source module;

5 is a cross-sectional view of another embodiment of the LED light source module;

6 is a cross-sectional view of another embodiment of the LED light source module;

7 is a cross-sectional view of another embodiment of the LED light source module;

Fig. 8 is a cross-sectional view of another embodiment of the LED light source module;

9 is a cross-sectional view of another embodiment of the LED light source module; and

Fig. 10 is a cross-sectional view of another embodiment of the LED light source module.

Among them, reference signs

21 metal base

211 bottom wall

212 around the wall

213 accommodation space

214 grooves

215 slotting

22 circuit board

23 LEDs

24 welding wire

25 encapsulation layers

25' encapsulation layer

26 reflective layers

27 fluorescent layer

271 fluorescent particles

27' diffusion layer

271' Diffused Particles

27" lens layer

28 diffusion layer

29 Fresnel lens layers

Detailed ways

The technical scheme of the utility model is described in detail below in conjunction with the accompanying drawings and specific embodiments, so as to further understand the purpose, scheme and effect of the utility model, but not as a limitation of the scope of protection of the appended claims of the utility model.

As shown in Figure 2 and Figure 3, it is a preferred embodiment of the light emitting diode light source module of the present invention, the light emitting diode light source module mainly includes a metal base 21, a circuit board 22, a plurality of light emitting diodes 23, a plurality of Bonding wire 24, and an encapsulation layer 25.

The metal base 21 has a bottom wall 211 and a surrounding wall 212 extending upward from the bottom wall 211 , the bottom wall 211 and the surrounding wall 212 define an accommodating space 213 . The metal base 21 can be formed by punching a metal plate, and its material can be made of aluminum or copper with good heat dissipation.

The circuit board 22 is a long strip and is disposed at the center of the bottom wall 211 , and a plurality of circuits and contacts (not shown) are formed on the upper surface thereof. The circuit board 22 can be a single-layer or multi-layer printed circuit board, in addition, a flexible circuit board can be used. Moreover, the circuit board 22 can be further provided with a plurality of electronic components.

The light emitting diodes 23 are located in the accommodating space 213 and disposed on the bottom wall 211 of the metal base 21 , and are respectively electrically connected to the circuit board 22 through the soldering wires 24 . The light emitted by the LEDs 23 can be the same single color, or can include multiple colors such as red, green and blue. In this embodiment, the light-emitting diode 23 is an example of a light-emitting diode chip. In actual implementation, it can also be a packaged light-emitting diode assembly, such as a lamp type or surface mounted type of light-emitting diode assembly. .

The encapsulation layer 25 is a transparent material, which is arranged in the accommodating space 213 and covers the circuit board 22, the light emitting diodes 23, and the bonding wires 24, so that the circuit board 22, the light emitting diodes 23, And the welding wires 24 will not be oxidized due to exposure to outside air, which will impair their performance.

Thereby, since the light emitting diode 23 of the present invention is not arranged on the circuit board 22, but is arranged on the bottom wall 211 of the metal base 21, and then is electrically connected to the circuit board 22 through the welding wire 24, so it emits light. The heat generated by the diode 23 during operation can be directly conducted to the metal base 21 , and the heat dissipation efficiency is better. On the other hand, since the light-emitting diodes 23 are not arranged on the circuit board 22, the circuit layout on the circuit board 22 can be made easier, and the light-emitting diodes 23 can be arranged in a more compact manner on the bottom wall 211 to improve The overall luminous brightness of the LED light source module.

In addition, since the circuit board 22 will shield part of the lateral light emitted by the LED 23, as shown in FIG. set in the groove 214. Or, as shown in FIG. 5 , the depth of the groove 214 can be further adjusted according to actual application conditions, so that the circuit board 22 can be completely disposed in the groove 214 .

In addition, as shown in FIG. 6 , the bottom wall 214 can further penetrate downwards to form a through groove 215 , and the circuit board 22 is positioned in the through groove 215 . Since the bottom surface of the circuit board 22 is exposed through the slot 215 , an external power source can be electrically connected to the circuit board 22 through the slot 215 , or an electrical signal can be input therefrom.

In practice, as shown in FIG. 7 , a reflective layer 26 with high reflectivity can be formed on the metal base 21 to increase the reflectivity of the metal base 21 to the light emitted by the LED 23 . The reflective layer 26 can be formed by electroplating, sputtering, or coating. In addition, a fluorescent layer 27 can be further disposed on the encapsulation layer 25 . The fluorescent layer 27 can be formed by coating or sticking, and contains a plurality of fluorescent particles 271 for converting the light with a predetermined wavelength emitted by the LED 23 into light with a different wavelength.

Or, as shown in FIG. 8, a diffusion layer 27' can be further arranged on the encapsulation layer 25, and the diffusion layer 27' can also be formed by coating or sticking, and contains a plurality of diffusion particles 271' in it. The light emitted by the light emitting diodes 23 is diffused to achieve the effect of uniform light emission.

In addition, as shown in FIG. 9 , a lens layer 27 ″ can be further provided on the encapsulation layer 25 to effectively converge the light emitted by the LED 23. The encapsulation layer 25 ′ contains fluorescent particles or diffusion particles 251, so as to provide wavelength conversion function or light diffusion function.

In addition, as shown in FIG. 10 , in addition to disposing a diffusion layer 28 on the encapsulation layer 25 , a Fresnel ( Fresnel) lens layer 29.

Of course, the utility model can also have other various embodiments, and those skilled in the art can make various corresponding changes and deformations according to the utility model without departing from the spirit and essence of the utility model, but These corresponding changes and deformations should all belong to the protection scope of the appended claims of the present utility model.

Claims (14)

1. A light-emitting diode light source module, characterized in that, comprising: A metal base has a bottom wall and a surrounding wall extending upward from the bottom wall, the bottom wall and the surrounding wall define an accommodating space; a circuit board disposed on the bottom wall; a plurality of light emitting diodes are arranged on the bottom wall; a plurality of soldering wires respectively electrically connecting the LED to the circuit board; and An encapsulation layer is arranged in the accommodating space and covers the circuit board, the LED and the welding wire. 2 . The LED light source module as claimed in claim 1 , wherein the bottom wall is recessed downward to form a groove, and at least a part of the circuit board is located in the groove. 3 . The LED light source module as claimed in claim 1 , wherein the bottom wall penetrates downward to form a through groove, and the circuit board is located in the through groove. 4 . 4. The LED light source module according to claim 1, wherein the circuit board is a single-layer circuit board or a multi-layer circuit board. 5. The LED light source module as claimed in claim 1, wherein a reflective layer is formed on the metal base. 6. The LED light source module according to claim 5, wherein the reflective layer is formed by electroplating, sputtering, or coating. 7. The LED light source module according to claim 1, wherein the encapsulation layer contains fluorescent particles or diffusion particles. 8. The LED light source module as claimed in claim 7, further comprising a lens layer disposed on the encapsulation layer. 9. The LED light source module as claimed in claim 1, further comprising a fluorescent layer disposed on the encapsulation layer. 10. The LED light source module as claimed in claim 1, further comprising a diffusion film disposed on the encapsulation layer. 11. The LED light source module according to claim 9, wherein the diffusion film is formed by coating or pasting. 12. The LED light source module according to claim 9 or 10, further comprising a lens layer disposed above the encapsulation layer. 13. The LED light source module as claimed in claim 12, wherein the lens layer is a Fresnel lens layer. 14. The light emitting diode light source module according to claim 1, wherein the light emitting diode is a light emitting diode chip or a packaged light emitting diode assembly.

Images