CN110473946A - Novel LED support and LED - Google Patents

Novel LED support and LED Download PDF

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Publication number
CN110473946A
CN110473946A CN201810436828.XA CN201810436828A CN110473946A CN 110473946 A CN110473946 A CN 110473946A CN 201810436828 A CN201810436828 A CN 201810436828A CN 110473946 A CN110473946 A CN 110473946A
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CN
China
Prior art keywords
substrate
led
layer
circuit
circuit layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810436828.XA
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Chinese (zh)
Inventor
曾学伟
邢其彬
杨丽敏
姚亚澜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHENZHEN JUFEI PHOTOELECTRIC CO Ltd
Shenzhen Jufei Optoelectronics Co Ltd
Original Assignee
SHENZHEN JUFEI PHOTOELECTRIC CO Ltd
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Application filed by SHENZHEN JUFEI PHOTOELECTRIC CO Ltd filed Critical SHENZHEN JUFEI PHOTOELECTRIC CO Ltd
Priority to CN201810436828.XA priority Critical patent/CN110473946A/en
Publication of CN110473946A publication Critical patent/CN110473946A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body

Abstract

The present invention provides a kind of Novel LED support and LED, Novel LED support used by LED includes insulating substrate and the circuit layer that is set on insulating substrate, is dielectrically separated from insulating substrate, the circuit layer includes the circuit for LED chip to be placed in the lamp bead region on substrate to be connect with the tie point of other devices on other lamp beads and/or substrate, the connection with other lamp beads or device can be directly realized by the circuit layer of LED support itself, not only simplify connection structure, but also avoid the increase for leading to size and cost using circuit board；The insulating substrate back side of LED support is provided with the function electrical connection area being electrically connected with circuit layer, convenient for circuit layer and bracket outer are attached or convenient for the connection between each module in the device or circuit layer in circuit layer and bracket, while meeting various scenes to various connection requests between the LED chip in bracket, guarantee product quality and yields again, promotes LED product production efficiency.

Description

Novel LED support and LED
Technical field
The present invention relates to LED (Light Emitting Diode, light emitting diode) field, more particularly to one kind are novel LED support and LED.
Background technique
With the development of LED technology and the various scenes of every field application, produce the LED junction for meeting various demands Structure.In various LED structures, can all use substantially and arrive LED support, and in order to meet various demands, also derived various sizes, The LED support of structure and material.But the setting of current LED support structure is all only carrying LED chip, to LED chip Play the role of protection, and the positive and negative electrode of LED chip is drawn.Current various LED supports do not undertake wiring, It, can only be by additional when needing to be electrically connected LED with other LED or be electrically connected with other devices in application scenes Pcb board circuit realize the electrical connection.
In addition, when the LED chip for needing to be arranged in a LED support more serial or parallel connections or series-parallel Hybrid connections When, current way also can only be that multiple LED chips are arranged on the substrate of bracket, then additional again to be realized respectively by gold thread Connection between LED chip, for example, with reference to the existing typical LED structure of Fig. 1-one kind shown in Fig. 2, wherein Fig. 1 neglects for LED Slightly except the top view after fluorescent glue, Fig. 2 is the cross-sectional view of the LED of Fig. 1, in Fig. 1-Fig. 2, it is assumed that is needed in LED support 1 It is current to do rule and successively be realized on series circuit by gold thread when the more LED chips 11 being sequentially connected in series are set Electrical connection between 11 positive and negative anodes of adjacent LED chip.From shown in Fig. 1 it is found that by additionally using gold thread real in LED support bottom The now connection between each LED chip 11, the route for needing to connect is more and miscellaneous, realizes the welding process inefficiency of connection, and by It is limited to the limitation of LED support size and is easy to appear the situation that desoldering, rosin joint even weld mistake, causes product cost high, product matter Yields and poor reliability are measured, and it is only to require to realize that simplest series connection connects between LED chip 11 that Fig. 1-is shown in Fig. 2 It connects, if necessary to realize series-parallel Hybrid connections or other complicated connection types between LED chip in a LED support When, it can not achieve substantially in current LED support structure.
Summary of the invention
Novel LED support and LED provided by the invention, mainly solving the technical problems that: solving existing LED support cannot The problem of undertaking wiring.
In order to solve the above technical problems, the embodiment of the present invention provides a kind of Novel LED support, including insulating substrate, setting Circuit layer on insulating substrate front, the circuit layer include for will be to be placed in the lamp bead region on the substrate The circuit that is connect with the tie point of other devices in other lamp beads and/or the substrate of LED chip；The insulating substrate back side It is provided with the function electrical connection area being electrically connected with the circuit layer.
In an embodiment of the present invention, the insulating substrate is equipped with through the logical of insulating substrate front and back Hole is equipped with electric conductor in the through-hole, and the upper end of the electric conductor is electrically connected with the circuit layer, and through-hole described in lower end edge is to institute It states the insulating substrate back side and extends the electrical connection interface for being electrically connected area as function.
In an embodiment of the present invention, the electric conductor is to be embedded in the through-hole, size and the clear size of opening The metallic conductor to match；
Or,
The electric conductor is the metallic conduction for being attached in the through hole wall and extending to outside the through-hole both ends open Layer.
In an embodiment of the present invention, the electrical connection interface be for the jointing holes that are electrically connected, or it is described logical to extend The PIN foot terminal in hole, or to extend the golden finger interface of the through-hole, or to extend the pad of the through-hole.
In an embodiment of the present invention, function electrical connection area includes bracket positive electrode bonding pad and bracket negative electricity Pole bonding pad.
In an embodiment of the present invention, function electrical connection area include for the device outside Novel LED support The device bonding pad of connection.
In an embodiment of the present invention, the insulating substrate front have at least one be exposed to the circuit layer it Outside, for placing the crystal bonding area of LED chip, the crystal bonding area is equipped with the heat carrier through the insulating substrate front and back, The LED chip in the crystal bonding area is placed on the heat carrier, the thermal coefficient of the heat carrier is greater than the insulation The thermal coefficient of substrate；
Or,
It is used to place the chip rest area of LED chip on the circuit layer at least one.
In an embodiment of the present invention, the crystal bonding area is located at draws with the positive pin and cathode of same LED chip Between the positive pin welding section and negative pin welding section of foot connection.
In an embodiment of the present invention, the circuit layer is by circuit substrate layer, according to preset circuit Figure obtains after the circuit substrate layer is located at the removal of conductive material except the circuitous pattern.
In an embodiment of the present invention, protective coating, insulating protective film and metal are additionally provided on the circuit layer At least one of coating.
To solve the above-mentioned problems, the present invention also provides a kind of LED, including Multipurpose LED support as described above with And at least two LED chips on the substrate are set to, include by the circuit layer between at least two LED chips For realizing the circuit connection between LED chip.
To solve the above-mentioned problems, the present invention also provides a kind of LED, including Multipurpose LED support as described above and At least LED chip being set on the substrate in lamp bead region, the LED chip pass through the LED support and other its The tie point connection of other devices in his lamp bead and/or the substrate.
The beneficial effects of the present invention are:
Novel LED support and LED provided by the invention, Novel LED support used by LED includes insulating substrate and setting In the circuit layer on insulating substrate, which includes for by LED chip to be placed in the lamp bead region on substrate and its The circuit of the tie point connection of other devices in his lamp bead and/or substrate, in this way when needing for LED to be electrically connected with other LED or When being electrically connected with other devices, the connection with other lamp beads or device directly can be realized by the circuit layer of LED support itself, and It does not need additionally to use circuit board, connection structure and the increasing using size caused by circuit board and cost can be simplified Add, can preferably be applied to various application scenarios；
In addition, the insulating substrate back side of Novel LED support provided by the invention is provided with the function being electrically connected with circuit layer It is electrically connected area, in order to which circuit layer and bracket outer to be attached or convenient for the device or circuit in circuit layer and bracket The connection between each module in layer, better meets various scenes to the various connection requests between the LED chip in bracket While, and can guarantee the quality and yields of product, the production efficiency of LED product is promoted, is further reduced the cost.
Detailed description of the invention
Fig. 1 is a kind of top view of LED structure；
Fig. 2 is the top view of the LED structure in Fig. 1；
Fig. 3 is the LED support structural schematic diagram that circuit layer provided in an embodiment of the present invention is higher than substrate front side；
Fig. 4 is the LED support structural schematic diagram that circuit layer provided in an embodiment of the present invention is flushed with substrate front side；
Fig. 5 is that insulating layer provided in an embodiment of the present invention is integrally-built LED support structural schematic diagram；
Fig. 6 is insulating layer provided in an embodiment of the present invention LED support structural schematic diagram compatible with circuit layer shape；
Fig. 7 is the LED support structural schematic diagram provided in an embodiment of the present invention with multiple box dams；
Fig. 8 is the LED support crystal bonding area structural schematic diagram provided in an embodiment of the present invention with electrically-conductive backing plate；
Fig. 9 is the LED support crystal bonding area structural schematic diagram one provided in an embodiment of the present invention with insulating substrate；
Figure 10 is the LED support crystal bonding area structural schematic diagram two provided in an embodiment of the present invention with insulating substrate；
Figure 11 is that the LED support with electrically-conductive backing plate provided in an embodiment of the present invention is electrically connected in substrate back setting The structural schematic diagram in area；
Figure 12 is that the LED support with insulating substrate provided in an embodiment of the present invention is electrically connected in substrate back setting The structural schematic diagram one in area；
Figure 13-1 is that the LED support with insulating substrate provided in an embodiment of the present invention is electrically connected in substrate back setting Connect the structural schematic diagram two in area；
Figure 13-2 is the structural schematic diagram that connector is provided in Figure 13-1；
Figure 14-1 is that the LED support with insulating substrate provided in an embodiment of the present invention is electrically connected in circuit layer setting The structural schematic diagram in area；
Figure 14-2 is the golden finger interface schematic diagram that the first function in Figure 14-1 is electrically connected in area；
Figure 15-1 is that the LED support provided in an embodiment of the present invention with electrically-conductive backing plate is set simultaneously in substrate front side and the back side Set the structural schematic diagram in function electrical connection area；
Figure 15-2 is the electrical connection interface structural schematic diagram that the first function in Figure 15-1 is electrically connected in area；
Figure 16 is the LED support structural schematic diagram provided in an embodiment of the present invention that white oil layer is arranged on circuit layer；
Figure 17 is the LED support structure provided in an embodiment of the present invention that green oil layer and reflective flexible membrane are arranged on circuit layer Schematic diagram；
Figure 18 is a kind of LED structure schematic diagram connected in series and parallel with multi-chip provided in an embodiment of the present invention；
Figure 19 is LED cross-sectional view shown in Figure 18；
Figure 20 is LED support production method flow diagram one provided in an embodiment of the present invention；
Figure 21 is LED support production method flow diagram two provided in an embodiment of the present invention；
Wherein, the appended drawing reference 1 in Fig. 1-Fig. 2 is LED support, and 11 be LED chip；Appended drawing reference 31 in Fig. 3 is base Plate, 32 be circuit layer；Appended drawing reference 41 in Fig. 4 is substrate, and 42 be circuit layer；Appended drawing reference 51 in Fig. 5 is substrate, and 52 are Circuit layer, 53 be insulating layer；Appended drawing reference 61 in Fig. 6 is substrate, and 62 be circuit layer, and 63 be insulating layer；Attached drawing mark in Fig. 7 Note 71 is substrate, and 721 be circuit, and 74 be box dam；Appended drawing reference 81 in Fig. 8 is electrically-conductive backing plate, and 82 be circuit layer, and 83 be insulation Layer, 811 be crystal bonding area, and 80 be LED chip, and 88 be the tie point of other devices；Appended drawing reference 91 in Fig. 9 is insulating substrate, 92 be circuit layer, and 911 be crystal bonding area, and 95 be metal heat conducting-body；Appended drawing reference 101 in Figure 10 is insulating substrate, and 102 be circuit Layer, 1011 be crystal bonding area, and 105 be metal heat-conducting layer；Appended drawing reference 111 in Figure 11 is electrically-conductive backing plate, and 112 be circuit layer, 113 It is through-hole for the first insulating layer, 1112,114 be electric conductor, and 115 be second insulating layer；Appended drawing reference 121 in Figure 12 is insulation Substrate, 122 be circuit layer, and 1212 be through-hole, and 124 be metallic conductor；Appended drawing reference 131 in Figure 13-1 and Figure 13-2 is exhausted Edge substrate, 132 be circuit layer, and 1312 be through-hole, and 134 be metal conducting layer, and 135 be connector；In Figure 14-1 and Figure 14-2 Appended drawing reference 141 is insulating substrate, and 142 be circuit layer, and 146 are electrically connected area for the first function, and 1461 be golden finger interface；Figure Appended drawing reference 151 in 15-1 and Figure 15-2 is electrically-conductive backing plate, and 152 be circuit layer, and 153 be the first insulating layer, and 154 lead for metal Electric body, 1512 be through-hole, and 155 be second insulating layer, and 156 are electrically connected area for the first function, and 1561 is as electrical connection interfaces Pad；Appended drawing reference 161 in Figure 16 is electrically-conductive backing plate, and 162 be circuit layer, and 163 be insulating layer, 167 white oil layers；In Figure 17 Appended drawing reference 171 be insulating substrate, 172 be circuit layer, 177 green oil layers, and 178 be insulation reflective membrane；It is attached in Figure 18-Figure 19 Icon note 181 is electrically-conductive backing plate, and 182 be circuit layer, and 183 be insulating layer, and 1813 be box dam, and 180 be LED chip, and 1821 be to draw Foot welding section, 187 be white oil layer.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, below by specific embodiment knot Attached drawing is closed to be described in further detail the embodiment of the present invention.It should be appreciated that specific embodiment described herein is only used to It explains the present invention, is not intended to limit the present invention.
It is only capable of playing the positive and negative electrode extraction for playing protection conjunction for LED chip to LED chip to solve existing LED support Effect, and various problems caused by wiring cannot be undertaken, present embodiments provide a kind of LED support, the present embodiment The LED support of offer carries circuit, and the present embodiment is referred to as Novel LED support, and the included circuit of the Novel LED support can expire Foot by LED chip to be placed in the lamp bead region on substrate and other lamp beads (can be other lamp beads on same substrate, Can be the lamp bead formed on other substrates) and/or substrate on other devices (theoretically can be any other device, wrap The device etc. that various chips, resistance, capacitor and other circuits are constituted is included but is not limited to, and these devices can be set in substrate Upper to be encapsulated into an entirety with LED, can also be not arranged on substrate, and can be outside LED support) tie point (can be with The various contacts that are electrically connected) connection circuit.It, can be straight when needing to be electrically connected LED with other LED or be electrically connected with other devices The circuit layer for connecting LED support itself is realized and the connection of other lamp beads or device, does not need additionally to use circuit board, both Connection structure can be simplified, and be avoided that the increase using size caused by circuit board and cost.
In the present embodiment, when needing that plurality of LEDs chip is arranged in a lamp bead region, circuit layer may also include reality The circuit being electrically connected between LED chip in existing lamp bead region, without additionally using pcb board outside LED again or in LED support The interior additional electrical connection realized between LED chip by gold thread, the use of the LED support can largely promote LED production Reliability, versatility and the yields of product, reduce the cost of LED product.
In the present embodiment, a lamp bead region on substrate, which refers to, is arranged LED chip on substrate to form a lamp The region of pearl, and it should be understood that the lamp bead region on substrate in the present embodiment refers to is spatially located above substrate, packet It includes lamp bead region to be directly arranged on substrate, is also included within setting lamp bead region on the insulating layer or circuit layer on substrate, and have Body can flexibly be set according to application scenarios.
In order to make it easy to understand, the present embodiment combines a kind of LED support structure to be illustrated.LED branch provided in this embodiment Frame includes substrate and the circuit layer that is set on substrate and is dielectrically separated from substrate, and set circuit layer includes for by base The electricity that LED chip to be placed is connect with the tie point of other devices on other lamp beads and/or substrate in lamp bead region on plate Road optionally may also include the positive pin welding section for connecting respectively with LED chip anode pin and negative pin and bear Pole pin welding section, and realize the circuit being electrically connected between LED chip；It, only need to be by LED core in this way when LED chip is arranged Positive pin welding section corresponding on circuit layer and the connection of negative pin welding section respectively of the positive and negative pin of piece, and LED Connection relationship between chip is then realized by the circuit pre-set in circuit layer.Certainly, in the present embodiment, circuit layer Positive pin welding section and negative pin welding section can not included, and positive pin welding section and negative pin welding section are set It sets in bracket on other layer structures (such as substrate), as long as these positive pin welding sections and negative pin welding section and electricity Road floor realizes corresponding electrical connection.
It should be understood that in the present embodiment, being dielectrically separated from mode and can flexibly set between circuit layer and substrate. For example, then circuit layer can be arranged directly on substrate, at this time between circuit layer and substrate when substrate itself is insulating substrate It has been just to be dielectrically separated from state；Certainly, when substrate is insulating substrate, one layer can also be arranged again between substrate and circuit layer Insulating layer.In another example one layer insulating can be then set between substrate and circuit layer when substrate is electrically-conductive backing plate, or It is realized absolutely by other any modes (such as setting specific structure keeps the interval of circuit layer and substrate front side empty) that are dielectrically separated from Edge isolation.
In the present embodiment, when substrate uses insulating substrate, circuit layer can be set up directly on insulating substrate, and should Understand, the technique of the combination and use of circuit layer and insulating substrate can flexible choice at this time.
In the present embodiment, the substrate that electrically-conductive backing plate can be constituted for various conductive materials, may be, for example, various metals and leads Electric substrate, for example including but be not limited to copper base, aluminum substrate, iron substrate；Electrically-conductive backing plate may be mixed comprising conductive material Condensation material electrically-conductive backing plate, such as conductive rubber etc..
In the present embodiment, the substrate that insulating substrate can be constituted for various insulating materials, naturally it is also possible to include inside Containing conductive material, outside is made of insulating materials, whole nonconducting substrate.Such as insulative type material may include but unlimited epoxy Resinae (EP, Epoxide resin), high temperature resistant nylon (PPA plastics), polyphthalamide (PPA, Polyphthalamide), poly terephthalic acid 1,4-CHDM ester (PCT, Poly1,4-cyclohexylene Dimethylene terephthalate), liquid crystal polymer (LCP, Liquid Crystal Polymer), epoxy molding plastic (EMC, Epoxy molding compound), unsaturated polyester (UP) (UP) resin, sheet molding compound (SMC, Sheet molding Compound), polyester resin (PET, Polyethylene terephthalate), polycarbonate (PC, Polycarbonate), polyhexamethylene adipamide (nylon 66).
In the present embodiment, substrate can be planar substrates, or front has bulge-structure or concave configuration Non-planar substrate, and corresponding elevated regions and recessed area can be used for being arranged LED chip namely elevated regions or concave region Domain can be used as crystal bonding area.And in the present embodiment, circuit layer can be covered in whole or in part in elevated regions or recessed area, Circuit layer can not also be covered, specifically can flexibly be set with application scenarios according to actual needs.Additionally, it should be appreciated that It is that the circuit layer in the present embodiment may be that the generally circuit layer of plane or partial region is bulge-structure or recessed The entirety of structure is in nonplanar circuit layer, and these elevated regions or recessed area can be used for placing LED chip, namely As crystal bonding area.
In the present embodiment, the circuit layer upper surface on substrate and setting can be flushed between substrate front side, it can also To be higher than substrate front side, or it is lower than substrate front side, it specifically can be according to technique, the concrete application scene etc. using production LED support Factor flexible setting.For example, circuit layer is higher than substrate front side, shown in Figure 3, circuit layer in Fig. 3 in a kind of exemplary construction 32 are higher than the upper surface (namely substrate front side) of substrate 31.It is shown in Figure 4 in another example, in Fig. 4 circuit layer 42 with The upper surface of substrate 41 flushes.Specifically select which kind of structure that can flexibly determine.
In addition, it is to be understood that in the present embodiment, when needs increase insulating layer (this between substrate and circuit layer Embodiment is referred to as the first insulating layer), and when the insulating layer is for by being dielectrically separated between substrate and circuit layer, it is set The insulating layer set directly can entirely cover in region corresponding with circuit layer on substrate, and insulating layer at this time is an entirety knot Structure；For example, with reference to insulating layer 53 shown in Fig. 5, is provided between substrate 51 and circuit layer 52, insulating layer 53 is covered on substrate 51 Region corresponding with circuit layer 52.In the present embodiment, which can also be adapted with the shape of circuit layer, as long as energy can That leans on is dielectrically separated from circuit layer and substrate.For example, with reference to shown in Fig. 6, set between substrate 61 and circuit layer 62 It is equipped with insulating layer 63, insulating layer 63 and the geomery of circuit layer 62 match, the unlapped region insulation layer 63 of circuit layer 62 Also it does not cover；Certainly, the set-up mode of insulating layer is not limited to mode shown in Fig. 5 and Fig. 6 in the present embodiment, in reality On the basis of existing circuit layer and substrate are reliably dielectrically separated from, the area and specific shape covered can be arbitrarily arranged.
In addition, it is to be understood that used technique can be flexible when insulating layer is disposed on the substrate in the present embodiment Selection, for example including but be not limited to printing, pressing, paste etc..Correspondingly, the combination between circuit layer and insulating layer can also Including but not limited to pressing, stickup and direct printed circuit layer etc. on the insulating layer.In the present embodiment, insulating layer can be used The various insulating materials for being dielectrically separated from, for example including but be not limited to insulated paint, insulating cement, insulating paper, non-conductive fibre Product, plastics, rubber, varnished cloth paper, glass, ceramics etc..
In the present embodiment, when circuit layer includes positive pin welding section and negative pin welding section, positive pin welding Area and negative pin welding section specific distributing position and distribution mode on circuit layer can flexibly be set.In addition, circuit Layer further include realize a lamp bead region in each LED chip between connect circuit when, may include realize LED chip it Between be connected in series, be connected in parallel, at least one of circuits such as series-parallel Hybrid connections, and specifically can be according to LED support Application scenarios and demand are flexibly set.
In the present embodiment, the number in the lamp bead region on substrate can flexibly be set, and set in each lamp bead region LED chip number can also flexibly set.Such as can be set includes at least two lamp bead regions on substrate, circuit layer includes It realizes the circuit connected between each lamp bead region, and settable LED chip in a lamp bead region, may also set up at least two LED chip includes the pin welding section connecting with the LED chip in each lamp bead region on circuit layer.And optionally, this implementation Example in LED support can use box dam, box dam can not also be used, specifically all can pattern actual demand flexibly set.For example, In a kind of example, box dam can be used, and a lamp bead region can be set in a box dam at this time, it can also be according to demand Multiple lamp bead regions share a box dam.
When multiple box dams being arranged on substrate, the LED chip in a box dam and the box dam, which is equivalent to, at this time utilizes existing LED A LED component made from bracket namely LED support provided in this embodiment can realize the multiple lamps of setting on one substrate Pearl, and the connection that can be realized serial or parallel connection between multiple lamp bead by the circuit layer built in LED support or combine in series and parallel, Relatively existing LED support further improves integrated level, and the mode that relatively existing more LED combinations use, reduce product at This, reduces product size.
It is shown in Figure 7, (circuit layer is not drawn into figure, it should be appreciated that box dam may also be straight in substrate 71 in the figure Connect be arranged on circuit layer, or a part be located at circuit layer on, a part be located at substrate on) on be provided with multiple box dams 74, It may include at least one lamp bead region in box dam 74, and a LED chip at least can be only set in a lamp bead region, and In one box dam when setting plurality of LEDs chip, it can be parallel connection between this plurality of LEDs chip, be also possible to connect, or string, Parallel connection combines.In the present embodiment, circuit layer further includes being set to except box dam 74, for by the LED chip in each box dam 74 The circuit 721 of connection.It can regard as unit of box dam at this time, the LED chip in a box dam and the box dam and use are existing There is the LED of LED support equivalent, this sample embodiment just realizes similar existing integrally disposed by pcb board on one substrate The structure of plurality of LEDs, and cost is lower than existing set-up mode, size is also smaller, and integrated level is higher.
According to above-mentioned example it is found that in the present embodiment, set circuit layer is in addition to can be achieved between lamp bead on substrate Connection and/or lamp bead and other devices connection, can also be achieved the connection in lamp bead region between each LED chip.
According to demand, the circuit layer in the present embodiment can be also configured in the entire front of substrate, or at least part Extend the lamp bead region on substrate to lay the circuit connecting with other lamp beads and/or device, for example including but be not limited to (driving circuit can be the driving circuit of driving LED chip to driving circuit, can also be entire circuit layer or the drive of other devices Dynamic circuit), control the control circuit etc. of LED chip.
That is, in the present embodiment, circuit achieved by circuit layer, can also be according to specific other than above-mentioned example circuit Application scenarios etc. are flexibly set, such as above-mentioned for controlling the control circuit of LED chip, for driving the driving electricity of LED chip Road etc..In the present embodiment, above-mentioned control circuit and driving circuit can be only base required when realizing control and driving Plinth route, without include realize control and driving needed for various electronic components (such as resistance, capacitor, various chips (such as Driving chip), the point that various components connect on these ground lines is the tie point of above-mentioned device.And it is real in the present embodiment Various electronic components needed for now controlling or drive can be set on substrate front side according to demand, also can be set in base Back, or be set to except substrate.Such as when circuit layer includes driving circuit, the driving core of bare die form can be used Piece, and the driving chip can be set to substrate back or front, it also can be realized driving chip and/or other components It is integrated into LED support.
As it can be seen that being laid in the present embodiment by the extension of above-mentioned route, in the case where LED support size meets, can incite somebody to action At least part of driving circuit and/or control circuit is integrated on LED support, is further improved integrated level, is more conducively contracted The size of small LED application module and assembly etc..Such as the control circuit in the present embodiment may include but be not limited to region adjustment (local dimming) circuit.
In the present embodiment, circuit layer and bracket outer are attached or in order to realize convenient in circuit layer and bracket Device or circuit layer in each module between connection, can flexibly substrate back side and/or face side setting setting The function electrical connection area for being dielectrically separated from substrate, and being electrically connected with the circuit layer on substrate.And set function in the present embodiment The position that area and circuit layer are specifically connect can be electrically connected, and that the specific function to be realized in area can be electrically connected according to function is specifically true It is fixed.
In the present embodiment, the setting in function electrical connection area on LED support can flexibly be set.For example, can not Function is drawn in substrate back side and is electrically connected area, and is arranged in substrate front side side and is electrically connected area with the function that substrate is dielectrically separated from (area of function electrical connection at this time may be directly disposed on substrate, it is also possible to be located on circuit layer), or according to demand in substrate Function electrical connection area is arranged in the back side and front simultaneously.It in the present embodiment, can when in substrate front side side, setting function is electrically connected area It is referred to as the first function electrical connection area to be set to the function electrical connection area of substrate front side side, and the tie point of other devices can also be set It is placed in first function electrical connection area；When setting function is electrically connected area in substrate back side, the function of substrate back can be claimed Being electrically connected area is that the second function is electrically connected area, and according to demand, the tie point of other devices can also be electrically connected with second function Area's connection.In the present embodiment, function electrical connection area for the interface of external connection be referred to as electrical connection interface (as it appears from the above, May be the tie point of other devices), electrical connection interface may be configured as the jointing holes that are electrically connected, and foot or golden finger or pad connect Mouthful etc..
In the present embodiment, when basic back side is arranged the second function and is electrically connected area, the second function of substrate back setting The position that electrical connection area is specifically connect with circuit layer can be specific according to the specific function to be realized in the second function electrical connection area It determines.And in the present embodiment, the second function of back side electricity is realized in the path that the back side can be then arrived along substrate front side to side The connection of bonding pad and circuit layer directly rearwardly can also open up through-hole from substrate front side, pass through setting and circuit in through-hole The electric conductor that the corresponding position of floor is electrically connected realizes the setting in the second function electrical connection area.
In order to make it easy to understand, being said respectively below the present embodiment with being essentially two kinds of situations of electrically-conductive backing plate and insulating substrate It is bright.
When substrate is electrically-conductive backing plate (such as metal substrate), insulating layer (this is provided between electrically-conductive backing plate and circuit layer It is referred to as the first insulating layer in example) the electrically-conductive backing plate back side is provided with and is dielectrically separated from electrically-conductive backing plate, and is electrically connected with circuit layer The second function be electrically connected area.Optionally, the through-hole through electrically-conductive backing plate front and back can be set on electrically-conductive backing plate, logical Insulating layer (being referred to as second insulating layer in this example) is set on the inner sidewall of hole, electric conductor is set in through-hole, and electric conductor passes through Second insulating layer is dielectrically separated from electrically-conductive backing plate, and the upper end of electric conductor passes through the first insulating layer and is electrically connected with circuit layer, lower end edge Through-hole extends the electrical connection interface as the second function electrical connection area to the electrically-conductive backing plate back side.In order to make it easy to understand, the present embodiment The sectional structure in conjunction with shown in Figure 11 is described further for example.113 He of the first insulating layer is provided on electrically-conductive backing plate 111 Circuit layer 112, wherein offer through-hole 1112 on electrically-conductive backing plate 111, be formed with second insulating layer on the hole wall of through-hole 1112 115, electric conductor 114 is provided in through-hole 1112, it is corresponding on circuit layer 112 that electric conductor 114 passes through the first insulating layer 113 Position electrical connection.In the present embodiment, the lower end of electric conductor 114 electrical connection interface external as the second function electrical connection area, It can be flushed with the electrically-conductive backing plate back side, or be maintained in through-hole the slightly below position of the opening at the through-hole back side, or be stretched out conductive 111 back side of substrate, but extension need to insulate with electrically-conductive backing plate 111.When electrical connection interface is PIN foot terminal in the present embodiment, Through-hole is extended in 114 lower end of electric conductor, the PIN foot terminal of setting is isolated, or with electrically-conductive backing plate insulating backside to extend through-hole, The golden finger being arranged or the interface for being directly made into pad form etc. are isolated with electrically-conductive backing plate insulating backside namely electrical connection interface can To be set as the various various interface structures for realizing electrical connection.It should be understood that the electric conductor 114 in Figure 11 can be by various Conductive material is constituted, for example including but be not limited to copper, aluminium, silver etc..
When substrate is insulating substrate, the insulating substrate back side is provided with the second function electrical connection being electrically connected with circuit layer Area, optionally, setting runs through the through-hole of insulating substrate front and back on insulating substrate, and electric conductor is equipped in through-hole, conductive The upper end of body is electrically connected with the circuit layer, and lower end edge through-hole extends to the insulating substrate back side as the second function electrical connection area Electrical connection interface.In the present embodiment, the structural form of electric conductor includes but is not limited to following exemplary two kinds of forms.
A kind of form is, electric conductor is in insertion through-hole, the metallic conductor that size and clear size of opening match.Such as join As shown in Figure 12: being provided with circuit layer 122 in Figure 12 on insulating substrate 121, through-hole 1212 is offered on insulating substrate 121, lead to The metallic conductor 124 that setting size matches in hole 1212,124 upper end of metallic conductor is electrically connected with circuit layer corresponding position It connects, the lower end electrical connection interface external as the second function electrical connection area can flush, or be maintained at logical with the insulating substrate back side It is slightly below the position of the opening at the through-hole back side in hole, or stretches out the insulating substrate back side.It should be understood that the metal in Figure 12 Electric conductor 124 can be made of various metal conductive materials, for example including but be not limited to copper, aluminium, silver etc..
A kind of form is that electric conductor is the metallic conduction for being attached in through hole wall and extending to outside through-hole both ends open Layer, for example, see shown in Figure 13-1: being provided with circuit layer 132 in Figure 13-1 on insulating substrate 131, offered on insulating substrate logical Hole 1312,1312 inner wall of through-hole are equipped with metal conducting layer 134, and 134 upper end of metal conducting layer is electrically connected with circuit layer corresponding position, The lower end electrical connection interface external as the second function electrical connection area, can flush, or be maintained at through-hole with the insulating substrate back side The position of the interior slightly below opening at the through-hole back side, or extend the insulating substrate back side and formed in through-hole backside openings near zone Electrical connection interface.Electrical connection interface in Figure 13-1 is just a kind of exemplary jointing holes that are electrically connected, when being electrically connected, external device The pin or PIN foot or PIN needle of part (such as chip, resistance, capacitor, connector etc.), which can be inserted into, is electrically connected jointing holes and metal is led Electric layer 134 forms electrical connection.For example, see shown in Figure 13-2, the PIN needle of connector 135 is insertable through interior and metal conducting layer 134 form electrical connection, to realize the electrical connection in circuit layer 132 between two modules.
It should be understood that the metal conducting layer 134 in Figure 13-1 can be made of various metal conductive materials, such as wrap Include but be not limited to copper, aluminium, silver etc..
It should be understood that being electrically connected area in the second function that substrate back is drawn in the present embodiment may include by LED Bracket be connected with external power source bracket positive electrode bonding pad and bracket negative electrode bonding pad and for the device outside LED support (for example including but be not limited to resistance, inductance, capacitor, various switches, chip etc.) at least one of the device bonding pad of connection, It specifically can flexible setting according to demand.
In the present embodiment, when substrate front side side is arranged the first function and is electrically connected area, can specifically be arranged on circuit layer First function is electrically connected area；First function electrical connection area can also be directly set on substrate certainly, at this time when substrate is insulation base When plate, then the first function electrical connection area can be arranged directly on substrate, is directly formed be dielectrically separated from therebetween.When substrate is When electrically-conductive backing plate, then setting insulating layer is also required between the first function electrical connection area and electrically-conductive backing plate to carry out that place is isolated to the two Reason.It should be understood that it also includes for the electrical connection interface with external connection that the first function, which is electrically connected in area, in the present embodiment.
In addition, it is to be understood that the first function electrical connection area and the second function electrical connection area are in substrate in the present embodiment Specific location, number and the function in each function electrical connection area of upper setting etc., can flexibly set.In order to make it easy to understand, It is insulating substrate and substrate is that the setting example of electrically-conductive backing plate is illustrated that the present embodiment, which is respectively substrate,.
Referring to Figure 1 shown in 4-1, circuit layer 142 is provided on insulating substrate 141, and on 141 front of insulating substrate The first function electrical connection area 146 is additionally provided on circuit layer 142, first function electrical connection area 146 is provided with two in Figure 14-1 A, the specific link position that the first function is electrically connected other circuits in area 146 and circuit layer then can be according to specific circuit knot Structure flexibly determines.Certainly, according to actual needs, the second function can also be set at the insulating substrate back side simultaneously and is electrically connected area, or The second function only is set at the insulating substrate back side and is electrically connected area, is then not provided with the first function electrical connection area in insulating substrate front, It specifically can flexible choice.In the present embodiment, the first function electrical connection area can be made up of various conductive materials, including but unlimited In various metal conductive materials, naturally it is also possible to be made up of radio frequency material.
Referring to Figure 1 shown in 4-2, in the present embodiment, the electrical connection interface in the first function electrical connection area 146 can be made For golden finger interface 1461；It should be understood that the specific number and function of golden finger then can be according to tools in golden finger interface Body demand is flexibly set.Certainly, substrate back side setting each electrical connection interface also can be set into golden finger interface or Connector interface.
5-1 shows referring to Figure 1, the first insulating layer 153 and circuit layer 152 is provided on electrically-conductive backing plate 151, wherein lead Through-hole 1512 is offered on electric substrate 151, second insulating layer 155 is formed on the hole wall of through-hole 1512, in through-hole 1512 It is provided with electric conductor 154,154 upper end of electric conductor passes through the first insulating layer 153 and is electrically connected with position corresponding on circuit layer 152, The lower end of electric conductor 114 electrical connection interface external as the second function electrical connection area.In the right end circuit layer of electrically-conductive backing plate 151 The first function electrical connection area 156 is additionally provided on 152, namely the front and back of electrically-conductive backing plate 151 is arranged simultaneously in Figure 15 Functional electrical connection area, externally to provide more access ports for LED support, more conducively LED support flexibly makes in each scene With.
In the present embodiment, the electrical connection interface in the first function electrical connection area 156 be can be by directly by corresponding position The exposed pad formed outside of circuit substrate layer, for example, see shown in Figure 15-2,1561 be exactly to be used as electrical connection interface Pad；It is made into the tie point of similar PIN foot terminal it is of course also possible to extend outwardly, specific form can be according to concrete application Demand is flexibly set.
It should be understood that in the present embodiment, being electrically connected when the first function is respectively set simultaneously in substrate front side and the back side When meeting area and the second function electrical connection area, the corresponding realization in set the first function electrical connection area and the second function electrical connection area Function may be the same or different, be also possible to the first function electrical connection area and the second function electrical connection area cooperation realize A kind of function.Such as first function electrical connection area include bracket positive electrode bonding pad and bracket negative electrode bonding pad；Second function Electrical connection area includes the device bonding pad for connecting with the device outside LED support.In another example the first function is electrically connected Qu Weizhi Frame positive electrode bonding pad, it is bracket negative electrode bonding pad that the second function, which is electrically connected area, and LED support and external electrical are realized in the two cooperation The connection in source；In another example the first function electrical connection area includes bracket positive electrode bonding pad and bracket negative electrode bonding pad, the second function It includes that bracket positive electrode bonding pad and bracket negative electrode bonding pad in actual use can be according to current that area, which can be electrically connected, also Application scenarios flexibly select the bracket positive electrode bonding pad of substrate front side or the back side and bracket negative electrode bonding pad carry out using.
In addition, in the application scenes of the present embodiment, in addition to the pin of setting LED chip on the circuit layer on substrate Outside welding section, can also according to demand with specific circuit structure setting function be electrically connected area, such as be arranged for LED chip except Other devices (including but not limited to resistance, capacitor, inductance, switching device and various chips etc.) connect with circuit layer Device function is electrically connected area.And the position being specifically arranged and number etc. can flexibly be set according to demand.
In the present embodiment, it is provided with circuit layer on the substrate of LED support, therefore LED chip is set in LED support When, can be can be arranged directly on LED chip on circuit layer according to specific requirements (includes at least one use on circuit layer at this time In the chip rest area for placing LED chip), or LED chip is set up directly on substrate to (substrate includes at least one at this time It is exposed to the crystal bonding area except circuit layer), or when being provided between circuit layer and substrate insulating layer, LED chip is direct (at this time including the chip rest area that at least one is used to place LED chip on insulating layer) on the insulating layer is set.For example, one In a little examples, when substrate substrate lower for thermal conductivity ratio (such as insulating substrate or the lower heat-conducting substrate of thermal conductivity ratio), If circuit layer and substrate front side are flush or below basic front, and the thermal coefficient of material used by circuit layer be greater than or Equal to the substrate thermal coefficient when, LED chip can be set up directly on circuit layer, can be set on circuit layer at this time to Few one for placing the chip rest area of LED chip, and a chip rest area can place according to actual needs one or Multiple LED chips.And in the present embodiment, a chip rest area can be used as a lamp bead region, can also conduct according to demand The a part in one lamp bead region, or it is divided into multiple lamp bead regions.Certainly, in some instances, regardless of the thermally conductive system of substrate The several or layer structural relation between substrate and circuit layer, can all be arranged chip rest area directly on circuit layer.It should be understood that , in application scenes, a part of LED chip can be also arranged in the chip rest area of circuit layer, a part of LED Chip is then set up directly on substrate.
In another example if when circuit layer is higher than substrate front side, in order to realize quickly leading for the heat distributed to LED chip Out, can be set substrate front side at least one be exposed to except circuit layer for place LED chip crystal bonding area (at this time when When having insulating layer between substrate and circuit layer, insulating layer can not cover the crystal bonding area；Certainly, insulating layer can be in some instances The crystal bonding area is covered, LED chip is set up directly on insulating layer at this time, and the region of LED chip is arranged on insulating layer at this time Then it is the chip rest area of insulating layer), such LED chip can be arranged directly on substrate, be in contact with substrate, and LED is distributed Heat can be directly delivered to substrate, transmitted outward by substrate, to realize rapid cooling.And in the present embodiment, each LED It can be mutually isolated between the crystal bonding area of chip, it is then more sharp to be also possible to interconnected, interconnected structure setting In the synthesis Quick diffusing of thermoelectricity.
In the present embodiment, when being provided with box dam on substrate, then above-mentioned crystal bonding area or chip rest area are preferably disposed on In box dam.
In the present embodiment, when substrate is electrically-conductive backing plate, insulating layer is provided between electrically-conductive backing plate and circuit layer, and should Insulating layer does not cover crystal bonding area, since the thermal coefficient of electrically-conductive backing plate when metal substrate (such as electrically-conductive backing plate be) generally compares Greatly, therefore after LED chip is directly placed on the electrically-conductive backing plate, the heat which is distributed then can be with most quickly Degree distributes outward, various adverse effects caused by avoiding LED temperature excessively high.For example, a kind of exemplary construction of crystal bonding area is referring to Fig. 8 It is shown, in fig. 8, it is disposed with insulating layer 83 and circuit layer 82 on electrically-conductive backing plate (can be metal substrate) 81, wherein base The front of plate 81 has the crystal bonding area 811 being exposed to except circuit layer 82, is provided with LED chip 80 811, LED chip 80 due to The heat for being set up directly on electrically-conductive backing plate 81, therefore being distributed when its work is directly delivered on electrically-conductive backing plate 81；In Fig. 8, It can be the tie point of other devices shown in 88, can specifically make the connection of various devices needed for driving circuit or control circuit Point.
Certainly, in the present embodiment, pre-buried coefficient of heat transfer can also be dissipated than electrically-conductive backing plate in the crystal bonding area of electrically-conductive backing plate The bigger heat carrier of hot coefficient, the heat that set LED chip is distributed in such crystal bonding area can be faster by heat carrier Transmission outward, to increase radiating efficiency.
In the present embodiment, when substrate is insulating substrate, directly LED chip is arranged on insulating substrate, relatively will LED is arranged on circuit layer, and the thermoelectricity that LED chip generates is transmitted to the mode on substrate, heat dissipation effect by circuit layer More preferably.It in the present embodiment, can also be pre-buried thermally conductive in advance in the crystal bonding area of insulating substrate in order to further enhance radiating efficiency The big heat carrier of coefficient ratio insulating substrate thermal coefficient, so that promoting heat by heat carrier distributes speed and efficiency.
In the present embodiment, in crystal bonding area pre-buried heat carrier mode can by setting through insulating substrate front and The heat carrier that thermal coefficient is greater than the thermal coefficient of insulating substrate is arranged in the through-hole at the back side in through-hole, so that heat radiation is imitated Rate.And it should be understood that shape and size of through-hole etc. can flexibly be set according to radiating requirements in the present embodiment, and this The specific form and material for the heat carrier being arranged in through-holes in embodiment can also flexibly be set.
Such as: heat carrier can be embedded in the through-hole, metal heat conducting-body that size can match with clear size of opening (when So or the heat carrier of the big other materials of other thermal conductivity ratio insulating substrate thermal coefficients).It is one of exemplary Design structure is shown in Figure 9, is provided with circuit layer 92 on insulating substrate 91, and insulating substrate 91 has and is exposed to circuit layer Crystal bonding area 911 except 92 has the metal heat-conducting for running through insulating substrate front and back by rectangular through-hole in crystal bonding area Body 95.In the present embodiment, the upper end of metal heat conducting-body can be flushed with 91 upper end of insulating substrate, when LED chip is arranged, LED core Piece can be directly contacted with 95 upper end of metal heat conducting-body heat is directly passed to metal heat conducting-body 95, under metal heat conducting-body 95 End can also flush with insulating substrate 91 or stretch out through-hole, by outside heat derives LED support, to reach the mesh to radiate as early as possible as early as possible 's.Certainly, in the present embodiment, directly contact even if LED chip is set as not direct with metal heat conducting-body 95, led by metal The setting of hot body 95 is opposite thermally conductive merely with insulating substrate, can also promote heat transfer efficiency to a certain extent.
In another example heat carrier can also be the metal heat-conducting for being attached on the hole wall of through-hole and extending to outside through-hole both ends open Layer.One of exemplary design structure is shown in Figure 10, and circuit layer 102 is provided on insulating substrate 101, and the base that insulate Plate 101 has the crystal bonding area 1011 being exposed to except circuit layer 102, and circular through hole, heat carrier are provided in crystal bonding area 1011 The metal heat-conducting layer 105 extended on hole wall to be attached to through-hole 1011 and to outside through-hole both ends open, the heat that LED chip generates Amount can pass through the quickly export outward of metal heat-conducting layer 105.
It should be understood that the specific set-up mode of metal heat conducting-body and metal heat-conducting layer can be flexible in the present embodiment Setting.For example, for metal heat-conducting layer, thin copper layer can be specifically selected, a kind of set-up mode is to open on insulating substrate in advance If through-hole, the copper in copper-bath is displaced using displacement reaction principle using electroless copper (such as heavy process for copper) later, Thin copper heat-conducting layer is obtained to deposit one layer of thin copper in through-hole wall, and it is thin in the opening of through-hole upper and lower ends can also to form part Copper, to increase the direct contact area with LED chip.
In the present embodiment, the setting of the specific location of crystal bonding area can also be determined flexibly on substrate.For example, can be set The positive pin welding section and negative pin welding section that the positive pin that crystal bonding area is located at same LED chip is connected with negative pin Between, for example, see shown in Fig. 8.Also it can be set and connect just for the positive pin and negative pin with same LED chip Pole pin welding section and negative pin welding section are located at the same side (such as left and right or right side etc.) of crystal bonding area.
In the present embodiment, it for reliability, the light extraction efficiency etc. that promote LED support, optionally, can also be set on substrate On the circuit layer set, at least one of protective layer and the coat of metal are set, and the protective layer in the present embodiment includes but unlimited In at least one of protective coating and insulating protective film；The setting of the coat of metal can also be convenient for device company in the present embodiment Make contact when connecing.
For example, various protective coatings can be arranged on circuit layer, it should be appreciated that the protective coating does not cover circuit Welding section on layer, which can play the role of protecting circuit layer, and may also function as according to actual needs The effects of circuit structure on circuit layer is identified, and/or promotes LED support light extraction efficiency.For example, in the present embodiment Protective coating can be set to anti-solder ink coating, and the anti-solder ink coating may include white oil layer, green oil layer and dirty oil layer At least one of Deng, such as white oil layer can be set in some regions, some region setting green oil layers or some regions are set White oil layer is set, dirty oil layer is arranged in some regions, or white oil layer, green oil layer or dirty oil layer etc. is only arranged.Which is specifically chosen The ink layer of type and specific combination etc. all can flexibly be set.Part light can be absorbed in the setting of dirty oil layer, can be right The light finally launched is adjusted.The example that one of which is set as white oil layer is shown in Figure 16, on electrically-conductive backing plate 161 It is disposed with insulating layer 163 and circuit layer 162, white oil layer 167 is additionally provided on circuit layer 162, white oil layer 167 does not cover Each welding section on circuit layer, white oil layer 167 can be played to play 162 coated region of circuit layer and be isolated from the outside to To insulation and protective effect, while also the circuit structure on circuit layer 162 can be identified according to demand；Simultaneously because white Therefore color can promote light emission rate to a certain extent.
In another example various insulating protective films (namely being protected by way of overlay film) can be set on circuit layer, Insulating protective film in the present embodiment can be using insulation reflective membrane, such as reflective flexible membrane etc., to promote the light out of LED support Rate.Reflective flexible membrane also should not welding section on circuit layer in the present embodiment.And it should be understood that in a kind of example, absolutely Edge protective layer and protective coating may also be combined with setting, such as protective coating can first be arranged on circuit layer, then in protective coating Upper setting insulating protective layer.Such as the example that a kind of combination is arranged is shown in Figure 17.Circuit is provided on insulating substrate 171 Layer 172, green oil layer 177 (may be alternatively provided as white oil layer) is provided on circuit layer 172, is then also set up on green oil layer 177 There is reflective flexible membrane 178, this set can not only play double protection to circuit layer, but also can promote the light out of LED support Rate.
In the present embodiment, can also be using the coat of metal be directly arranged on circuit layer, which can be single layer Metal layer can also be the composite-layer metal layer being made of at least two metal layers；For example, single metal layer when, can for single layer plate Silver layer；It can be the composite-layer metal layer that is made of silver layer and layer gold or other metal layers when for complex metal layer.
The present embodiment additionally provides LED made from a kind of LED support using in above-described embodiment comprising is set to base An at least LED chip on plate in lamp bead region.
In the present embodiment, LED may also include the luminescent conversion glue, lens glue-line or diffusion being set on LED chip Glue-line, it should be appreciated that the luminescent conversion glue in the present embodiment can be the fluorescent glue comprising fluorescent powder, be also possible to include The colloid of the photic material of quantum dot or other can realize the luminescent conversion glue of luminescent conversion, and also may include as needed Spread powder or silicon powder etc.；Luminescent conversion glue, lens glue-line or the mode packet for spreading glue-line are formed in the present embodiment in LED chip Include but be not limited to dispensing, molding, spraying, stickup etc..
For example, needing to be arranged in LED support the LED chip of four rows series connection in a kind of application scenarios, then again will The LED chip that this four row is connected in series is in parallel again.For the application scenarios, the present embodiment provides a kind of LED branch of metal substrate Frame framework is disposed with insulating layer 183, circuit layer on the metal substrate 181 of the LED support referring to shown in Figure 18-Figure 19 182 and the white oil layer 187 that is set on circuit layer 182, and metal substrate 181 has and is exposed to circuit layer 182 and white oil Crystal bonding area except layer 187, white oil layer 187 do not cover pin welding section 1821, and 181 periphery of electrically-conductive backing plate is provided with box dam 1813.Structure in parallel again after the series connection that LED chip 180 in bracket passes through circuit layer four row LED chips 180 of realization, Circuit layer i.e. at this time includes circuit in parallel again that four row LED chips are first connected.Of course, it will be understood that circuit layer is wrapped The particular circuit configurations included can flexibly be set.In a kind of application scenarios, LED shown in Figure 18 can be schemed in it is empty Cut to obtain four LED lamp beads shown in wire frame, or according to shown in dotted line frame in 181 enterprising portable lighter pearl region of metal substrate Division, obtain four lamp bead regions, four concatenated LED chips be set in each lamp bead region, between each lamp bead region The circuit realization provided by circuit layer is connected in parallel.And the division in lamp bead region can be determined flexibly, such as can also vertically be divided Deng.
For the ease of the comprehensive understanding present invention, system of the present embodiment also to the LED support provided by the invention with circuit It is illustrated as process.
In the present embodiment, when making LED support, it can use but be not limited to following two production process:
Process 1: the substrate of the circuit substrate and LED support that make circuit is first combined together to form the LED with circuit Then bracket is processed circuit substrate to obtain circuit layer；And specifically combination and the processing to circuit substrate Mode can flexible choice.Circuit substrate in this process can be made of various conductive materials, for example including but it is unlimited In copper, aluminium, silver, gold etc..
Process 2: being first processed circuit substrate to obtain circuit layer, then again by the base of circuit layer and LED support Plate combines to form the LED support with circuit；Combination in the process and also all may be used to the processing method of circuit substrate With flexible choice, and circuit substrate can also be made of various conductive materials.
Above two process is illustrated respectively in conjunction with specific manufacturing process separately below.
It is shown in Figure 20 using a kind of LED support production method of process 1, comprising steps of
S201: forming compound laminar substrate, which includes substrate and be located on substrate front side, insulate with substrate The circuit substrate layer of setting is isolated.
In this step, when substrate is insulating substrate, then circuit substrate layer directly can be set in substrate front side；Work as base When plate is electrically-conductive backing plate, then needs that insulating layer first is arranged in substrate front side, then circuit substrate layer is set above the insulating layer.
S202: on circuit substrate layer, circuit substrate layer is located at except circuitous pattern according to preset circuitous pattern Conductive material removal, obtains circuit layer
In the present embodiment, when forming compound laminar substrate, the combined process between each layer can be with flexible choice, such as can adopt With bonding way, pressing mode can also be used, the setting even for insulating layer can also be using techniques such as printings.In order to just In understanding, it is illustrated below by example of pressing mode.
When the substrate used is the insulating substrate being made of insulating materials, forming compound laminar substrate includes:
Circuit substrate layer is pressed on substrate.
When the substrate used is electrically-conductive backing plate (such as the metal substrate) being constructed from a material that be electrically conducting, compound laminar substrate is formed Include:
By on circuit substrate layer and insulating layer one step press to substrate, circuit substrate layer and insulating layer are also pressed into upper and lower sequence After sequencing through one step press in conjunction with substrate；
Or first press to insulating layer on substrate, then circuit substrate layer is pressed on insulating layer, this mode then needs It is pressed twice.
It should be understood that specifically can flexible choice using which kind of pressing mode.
After forming compound laminar substrate, the circuit substrate layer on substrate is handled to obtain the mode of circuit layer It can be with flexible choice.For example, can be by circuit substrate layer, it, will be electric using etching mode according to preset circuitous pattern Road substrate layer is located at the removal of the material except circuitous pattern.A kind of exemplary etching can be by conductive base layer using chemically reacting Or physical shock acts on and circuit substrate layer is located at the removal of the material except circuitous pattern.Such as it is removed by chemical reaction When, circuit substrate layer can be located at material area within circuitous pattern carry out photoresist covering (such as covered using light-sensitive surface, It is that can specifically be made a plate by exposure, after development treatment in covering, the light-sensitive surface of etching area will be needed to remove, so that these regions Material in etching contact chemical solution and be corroded), then do not have using on chemical solution erosion removal circuit substrate layer Have by the conductive material of photoresist overlay area part, to obtain required circuit.And it should be understood that in the present embodiment Depth and width of etching etc. can be controlled flexibly.
In another example can also be on circuit substrate layer, according to preset circuitous pattern, using engraving mode by circuit substrate Layer is located at the conductive material removal except the circuitous pattern.A kind of example implementation process of engraving is as follows: being ground using metal saw blade The special engraving cutter of system firmly depicts on circuit substrate layer directly on circuit substrate layer according to preset circuitous pattern Then corresponding circuit diagram tears the conductive material outside circuitous pattern corresponding region to obtain corresponding circuit layer.For example, when electricity Road substrate layer using copper foil realize, then using engraving the direct copper foil of cutter on along the circuitous pattern set on copper foil Edge is firmly portrayed, and the copper foil other than circuitous pattern is then torn.
It should immediately, when needing to expose upper surface of base plate partial region to form crystal bonding area, so that LED core Piece is directly basic with substrate, when achieving the effect that thermoelectricity separation, if not having insulating layer between substrate and circuit substrate layer, only The material that circuit substrate layer is located at except circuitous pattern is needed to completely remove；But works as and have between substrate and circuit substrate layer When having insulating layer, then needs also to remove the insulating layer for corresponding to die bond region, when for example, by using artistic carving, can remove While conductive material, insulating layer is also removed simultaneously；Then it after forming circuit layer, is incited somebody to action in use engraving or other techniques The insulating layer in these regions removes.That is, in the present embodiment, it, will be electric according to preset circuitous pattern on circuit substrate layer After road substrate layer is located at the removal of the conductive material except the circuitous pattern, substrate front side can have at least one to be exposed to circuit Except layer, for placing the crystal bonding area of LED chip.
When producing LED support using process 1, function is formed if necessary to substrate front side and is electrically connected area, can produced After foregoing circuit layer, area is electrically connected in the corresponding region setting function of substrate front side.When function is arranged in substrate back in needs When being electrically connected area, and drawing the function by rearwardly opening hole from substrate front side and be electrically connected area, one kind is achieved in that can be with Before producing above-mentioned compound laminar substrate, set corresponding through-hole on present substrate, and it is optional can also be now pre- in through-hole Electric conductor is buried；For electrically-conductive backing plate, then also insulating layer can be formed on the hole wall of through-hole in advance.It is of course also possible to producing It obtains after above-mentioned compound laminar substrate or after obtaining foregoing circuit layer or is performed simultaneously above-mentioned setting electric conductor of opening Step.Specific execution timing and the technique of use can flexible choices.
Using a kind of LED support production method of process 2 referring to fig. 2 shown in 1, comprising steps of
S211: forming circuit layer, according to preset circuitous pattern that institute is electric on the circuit substrate being constructed from a material that be electrically conducting The conductive material that roadbed material is located at except the circuitous pattern removes to obtain circuit layer.
When using the process, etching or artistic carving is can also be used in the mode that circuit layer is produced on circuit substrate, herein It repeats no more.
S212: forming substrate on circuit layer, circuit layer upper surface be exposed to the substrate to be formed it is outer and with substrate insulation every From.
In the present embodiment, the technique that substrate is formed on circuit layer obtained can be with flexible choice.For example, when substrate is substrate When the insulating substrate being made of insulating materials (including but not limited to epoxy resin, PPA plastic cement, PCT, LCP, SMC), in circuit Forming substrate on layer includes:
Insulation class substrate raw materials are molded or are molded on circuit layer and obtain substrate, obtained structure can be circuit layer It is embedded in obtained substrate.
In order to make it easy to understand, showing below the process for forming substrate in the process and S212 for obtaining circuit layer in S211 Example explanation.
In a kind of example, circuit substrate is being located at by the removal of the material except circuitous pattern according to preset circuitous pattern Before obtaining circuit layer, one layer of insulation carrier film first can be set at the circuit substrate back side；Then by etching or being carved in electricity Circuit is formed on the substrate layer of road, the insulation carrier film that the circuit substrate back side is arranged in when forming circuit remains good working condition, this The sample insulation carrier film can condense together the circuit module that each section of circuit layer separates, convenient for being subsequently formed base Plate.
In another example, using the thicker circuit substrate layer of thickness, the thickness D of the substrate layer, which is greater than, requires most end form At circuit layer thickness.Then in the conductive material being located at circuit substrate according to preset circuitous pattern except circuitous pattern Removal obtains circuit layer and includes:
The circuit substrate back side is located at the removal of the electric material except circuitous pattern according to preset circuitous pattern, is removed The thickness d 1 of material is less than circuit substrate thickness D, such as the circuit substrate back side can be located at circuitous pattern using etch process Except electric material removal；
At this time will insulation class substrate raw materials be molded or is molded on circuit layer obtain substrate include: by insulation class substrate Material is molded or is molded at the circuit layer back side to obtain substrate；After this, further includes:
From circuit substrate front removal degree with a thickness of the conductive material of d2, d2 is less than the D, is greater than D-d1, thus electric Road floor just exposes outside substrate, for subsequent use.
In the present embodiment, when forming substrate using injection molding or molding, for the circuit module of circuit layer respectively separated Between gap may be alternatively formed to a part of substrate, and in the present embodiment can in injection molding or mould pressing process control circuitry layer with The front flush of substrate.What therefore circuit layer included is respectively used to connect with same LED chip anode pin and negative pin Gap between positive pin welding section and negative pin welding section will be isolated to form crystal bonding area by the substrate zone of protrusion, should Crystal bonding area is then used to place LED chip, to achieve the purpose that thermoelectricity separates.
In the present embodiment, when on circuit layer utilize insulating substrate insulation raw material using mould pressing process formed substrate When, the form for the raw material that insulate and specific press moulding mode can flexibly be set
Certainly, in this process 2, when substrate uses insulating substrate, since the thermal coefficient of insulating substrate generally compares It is low, it, can also be in advance in corresponding die bond zone position in above-mentioned injection molding or mold process when needing to be promoted substrate heat transfer efficiency The big heat carrier of pre-buried thermal conductivity ratio insulating substrate thermal coefficient, the substrate obtained later by injection molding or molding in this way are consolidated Heat carrier just bigger with thermal coefficient, the heat generated when LED chip can work are quickly led outward in crystalline region, and promotion is led The thermal efficiency.But it should be noted that in the pre-buried heat carrier in crystal bonding area, need to guarantee insulation between heat carrier and circuit layer every From.
When producing LED support using process 2, function is formed if necessary to substrate front side and is electrically connected area, can produced After foregoing circuit layer, area is electrically connected in the corresponding region setting function of substrate front side.When function is arranged in substrate back in needs When being electrically connected area, and drawing the function by rearwardly opening hole from substrate front side and be electrically connected area, one kind is achieved in that can be with Corresponding mold is set in requisition for the position of aperture in phase in injection molding or mold process, so that the substrate obtained after injection molding or molding It is just formed with through-hole, then electric conductor is set in through-hole again；It can certainly obtain substrate and then use to open accordingly Hole technique forms through-hole in corresponding position, specifically executes timing and the technique of use can flexible choice.
When producing LED support using process 2, substrate may be electrically-conductive backing plate, produce on circuit substrate layer at this time After circuit layer, it can be initially formed corresponding insulating layer on the electrically-conductive backing plate front pre-set, then by circuit layer On the insulating layer, set-up mode can be realized by modes such as stickups for setting.When the circuit layer back side of formation has above-mentioned insulation When carrier film, the insulation carrier film directly can also be carried out to stickup as insulating layer with the electrically-conductive backing plate pre-set and combined To the LED support with circuit.
It should be understood that LED support obtained and utilizing LED component made from the LED support by the above process Can be applied to various illumination fields, for example, its can be fabricated to backlight module applied to display backlight field (can be TV, The backlight module of the terminals such as display, mobile phone).Apply also for shooting field, home lighting field, lighting for medical use field, dress Gorget domain, automotive field, field of traffic etc..When applied to shooting field, the flash lamp of camera can be fabricated to；Applied to family When with lighting area, floor lamp, desk lamp, headlamp, ceiling lamp, downlight, projecting lamp etc. can be fabricated to；Applied to lighting for medical use When field, operating lamp, low electromagnetism headlamp etc. can be fabricated to；Various ornament lamps can be fabricated to when applied to furnishing fields, Such as various color lamps, landscape spotlight, advertising lamp；When applied to automotive field, automobile lamp, automobile indicator can be fabricated to Deng；When applied to field of traffic, various traffic lights can be made, various street lamps can also be made.Above-mentioned application is only this reality Apply several applications exemplified by example, it should be appreciated that application several fields that it is not limited to the above example of LED.
The above content is combining specific embodiment to be further described to made by the embodiment of the present invention, cannot recognize Fixed specific implementation of the invention is only limited to these instructions.For those of ordinary skill in the art to which the present invention belongs, Without departing from the inventive concept of the premise, a number of simple deductions or replacements can also be made, all shall be regarded as belonging to the present invention Protection scope.

Claims (11)

1. a kind of Novel LED support, which is characterized in that including insulating substrate, the circuit being set on the insulating substrate front Layer, the circuit layer include for by LED chip to be placed in the lamp bead region on the substrate and other lamp beads and/or institute State the circuit of the tie point connection of other devices on substrate；The insulating substrate back side, which is provided with, to be electrically connected with the circuit layer Function is electrically connected area.
2. Novel LED support as described in claim 1, which is characterized in that the insulating substrate, which is equipped with, runs through insulating substrate The through-hole of front and back, the through-hole is interior to be equipped with electric conductor, and the upper end of the electric conductor is electrically connected with the circuit layer, lower end Extend the electrical connection interface that area is electrically connected as function to the insulating substrate back side along the through-hole.
3. Novel LED support as claimed in claim 2, which is characterized in that the electric conductor is to be embedded in the through-hole, size The metallic conductor to match with the clear size of opening；
Or,
The electric conductor is the metal conducting layer for being attached in the through hole wall and extending to outside the through-hole both ends open.
4. Novel LED support as claimed in claim 2, which is characterized in that the electrical connection interface be for the jointing holes that are electrically connected, or For the PIN foot terminal for extending the through-hole, or to extend the golden finger interface of the through-hole, or to extend the through-hole Pad.
5. Novel LED support according to any one of claims 1-4, which is characterized in that function electrical connection area includes branch Frame positive electrode bonding pad and bracket negative electrode bonding pad, and/or include the device for being connect with the device outside Novel LED support Bonding pad.
6. Novel LED support according to any one of claims 1-4, which is characterized in that the insulating substrate front has extremely Few one is exposed to except the circuit layer, and for placing the crystal bonding area of LED chip, the crystal bonding area, which is equipped with, runs through the insulation The heat carrier of substrate front side and the back side, is placed in the LED chip in the crystal bonding area on the heat carrier, the heat carrier Thermal coefficient be greater than the insulating substrate thermal coefficient；
Or,
It is used to place the chip rest area of LED chip on the circuit layer at least one.
7. Novel LED support as claimed in claim 6, which is characterized in that the crystal bonding area is located at same LED chip just Between pole pin and the positive pin welding section and negative pin welding section of negative pin connection.
8. Novel LED support according to any one of claims 1-4, which is characterized in that the circuit layer is by circuit On substrate layer, the circuit substrate layer is located at by the removal of the conductive material except the circuitous pattern according to preset circuitous pattern It obtains afterwards.
9. Novel LED support according to any one of claims 1-4, which is characterized in that be additionally provided with guarantor on the circuit layer Protect coating, at least one of insulating protective film and the coat of metal.
10. a kind of LED, which is characterized in that including such as described in any item Novel LED supports of claim 1-9 and be set to At least two LED chips on the substrate, between at least two LED chips by the circuit layer include for real Circuit connection between existing LED chip.
11. a kind of LED, which is characterized in that including such as described in any item Novel LED supports of claim 1-9 and be set to institute State at least LED chip on substrate in lamp bead region, the LED chip by the LED support and other other lamp beads and/ Or the tie point of other devices connects on the substrate.
CN201810436828.XA 2018-05-09 2018-05-09 Novel LED support and LED Pending CN110473946A (en)

Priority Applications (1)

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Application Number Priority Date Filing Date Title
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Publications (1)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101290964A (en) * 2007-04-20 2008-10-22 丰田合成株式会社 Light emitting device, light source and method of making the device
CN102738317A (en) * 2011-04-12 2012-10-17 上海矽卓电子科技有限公司 Packaging method for light source used in LED fluorescent lamp and light source
CN103594464A (en) * 2013-11-25 2014-02-19 广东威创视讯科技股份有限公司 COB packaging structure of light-emitting diode
CN205944141U (en) * 2016-08-19 2017-02-08 厦门市欧特朗电子有限公司 Light emitting diode (LED) integrated light source panel
CN205960029U (en) * 2016-07-27 2017-02-15 佛山市国星光电股份有限公司 COB light source and collection moulding piece and lamps and lanterns

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101290964A (en) * 2007-04-20 2008-10-22 丰田合成株式会社 Light emitting device, light source and method of making the device
CN102738317A (en) * 2011-04-12 2012-10-17 上海矽卓电子科技有限公司 Packaging method for light source used in LED fluorescent lamp and light source
CN103594464A (en) * 2013-11-25 2014-02-19 广东威创视讯科技股份有限公司 COB packaging structure of light-emitting diode
CN205960029U (en) * 2016-07-27 2017-02-15 佛山市国星光电股份有限公司 COB light source and collection moulding piece and lamps and lanterns
CN205944141U (en) * 2016-08-19 2017-02-08 厦门市欧特朗电子有限公司 Light emitting diode (LED) integrated light source panel

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Application publication date: 20191119