CN201827835U - Circuit board facilitating heat dissipation of low-power LED - Google Patents

Circuit board facilitating heat dissipation of low-power LED Download PDF

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Publication number
CN201827835U
CN201827835U CN2009203064902U CN200920306490U CN201827835U CN 201827835 U CN201827835 U CN 201827835U CN 2009203064902 U CN2009203064902 U CN 2009203064902U CN 200920306490 U CN200920306490 U CN 200920306490U CN 201827835 U CN201827835 U CN 201827835U
Authority
CN
China
Prior art keywords
circuit board
led
circular
plate body
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2009203064902U
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Chinese (zh)
Inventor
郑成乐
朱钢海
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FUJIAN DAJING PHOTOELECTRIC Co Ltd
Original Assignee
FUJIAN DAJING PHOTOELECTRIC Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FUJIAN DAJING PHOTOELECTRIC Co Ltd filed Critical FUJIAN DAJING PHOTOELECTRIC Co Ltd
Priority to CN2009203064902U priority Critical patent/CN201827835U/en
Application granted granted Critical
Publication of CN201827835U publication Critical patent/CN201827835U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The utility model discloses a circuit board facilitating heat dissipation of a low-power LED. The circuit board comprises a circular circuit board body, wherein a plurality of square notches are distributed at the outer edge of the circular circuit board body, and a circular through hole is formed in the middle of the circular circuit board body; a plurality of printed circuit bodies are distributed around the outer edge and in the middle of a panel of the circular circuit board body, and copper foils with LED pins correspondingly welded thereon are distributed on the printed circuit bodies; the printed circuit bodies correspondingly used for connecting LEDs are designed to be printed circuit pieces with larger areas than originally structured printed circuits; the copper foils with the LED pins correspondingly welded thereon are designed to be copper foil blocks with larger areas than the originally structured copper foils; a small amount of the LED pins extend into welding holes of the circular circuit board bodies, and a large amount of the LED pins are kept outside the circular circuit board bodies. By adopting the circuit board facilitating heat dissipation of the low-power LED, the heat-dissipating capacity of an LED circuit board is greatly improved.

Description

A kind of circuit board that helps the low-power LED heat radiation
Technical field
The utility model relates to a kind of led circuit plate, especially a kind of circuit board that helps the low-power LED heat radiation.
Background technology
Plurality of advantages such as LED has that volume is little, simple in structure, little power consumption, life-span long (can reach 100,000 hours), shock-resistant, anti-vibration, its principle of luminosity is solid luminescence, by the solid luminescence physics principle, the spectrum of LED almost all concentrates on visible light frequency band, and luminous efficiency is up to more than 90%.Therefore, LED is described as the 21 century new light sources, promptly it will become after incandescent lamp, fluorescent lamp, high-intensity gas discharge lamp the 4th generation light source, and be acknowledged as one of current ten big cutting edge technologies.
The LED advantage is numerous, but its shortcoming also can not be ignored, and as can producing a large amount of heats in the LED luminescence process, and the temperature resistant capability of LED itself is relatively poor, and these heats will directly have influence on the luminous mass of LED as can't effectively shedding.Therefore, heat radiation is that LED wants one of problem that emphasis solves.Its printed circuit area of traditional led circuit plate is generally less, and the area of the particularly corresponding Copper Foil that is welded with the LED pin is general also very little, and this heat that causes producing in the LED luminescence process is deposited in one and be difficult in time distribute easily.In addition, in the LED welding process, generally be that the pin with LED almost all stretches in the circuit board plate body, even the bulb of LED is close to the circuit board plate body, the more unnecessary pin length of LED in the circuit board plate body another side is cut after having welded.This way is no doubt quite right, but is unfavorable for that LED in time distributes the heat that produces, thereby causes the luminous mass of LED influenced deeply.
The utility model content
The purpose of this utility model is to overcome the deficiency of prior art, a kind of circuit board that helps the low-power LED heat radiation is provided, and this circuit board that helps the low-power LED heat radiation has improved the heat-sinking capability of led circuit plate greatly by changing printed circuit area, Copper Foil area and the LED pin length on the circuit board plate body.
The technical scheme that its technical problem that solves the utility model adopts is: a kind of circuit board that helps the low-power LED heat radiation comprises a circular circuit board plate body; Around the panel outer of this circle circuit board plate body and mid portion be distributed with many printed circuit bodies, be distributed with correspondence on the printed circuit body and be welded with the Copper Foil of LED pin, be made as than the original structure printed circuit and have more large-area printed circuit sheet corresponding to being used for connecting printed circuit body between the LED; The Copper Foil that correspondence is welded with the LED pin is made as than the original structure Copper Foil has more large-area Copper Foil piece; The pin fraction of this LED stretches in the welding hole of circular circuit board plate body, and the pin major part of this LED is stayed circular circuit board plate body outside.
The pin length of staying circular circuit board plate body outside of described LED is 1~3mm.
The pin length of staying circular circuit board plate body outside of described LED is 3mm.
Described circular circuit board plate body outer is distributed with some square breach, and the mid portion of circular circuit board plate body is provided with a manhole.
Couple together with lead between the printed circuit of position, described circular circuit board plate body outer and the printed circuit of medium position.
A kind of circuit board that helps the low-power LED heat radiation of the present utility model, design has than the original structure printed circuit and has more large-area printed circuit sheet on corresponding to the printed circuit body that is used for connecting between the LED, particularly being welded with on the Copper Foil of LED pin design in correspondence has than the original structure Copper Foil and has more large-area Copper Foil piece, the heat that the LED luminescence process is produced can be delivered on the Copper Foil piece by pin, by the Copper Foil piece heat is distributed again.In addition, the pin length outside the circular circuit board plate body of staying of LED is designed to 1~3mm or 3mm, makes it expose the certain length of circular circuit board plate body, then can enlarge the radiating surface of LED, thereby help the LED heat radiation better.
The beneficial effects of the utility model are: because design has than the original structure printed circuit and has more large-area printed circuit sheet on corresponding to the printed circuit body that is used for connecting between the LED, particularly being welded with on the Copper Foil of LED pin design in correspondence has than the original structure Copper Foil and has more large-area Copper Foil piece, make the heat that produces in the LED luminescence process to be delivered on the Copper Foil piece, by the Copper Foil piece heat is distributed again by pin; Owing to the pin length of the circular circuit board plate body of staying of LED outside is designed to 1~3mm or 3mm, makes the radiating surface of LED increase greatly, thereby improved the heat-sinking capability of led circuit plate greatly.
Below in conjunction with drawings and Examples the utility model is described in further detail; But a kind of circuit board that helps the low-power LED heat radiation of the present utility model is not limited to embodiment.
Description of drawings
Fig. 1 is an embodiment structure schematic diagram of the present utility model.
The specific embodiment
Embodiment, referring to shown in Figure 1, a kind of circuit board that helps the low-power LED heat radiation of the present utility model comprises circular circuit board plate body 10; These circle circuit board plate body 10 outers are distributed with some square breach 17, and the mid portion of circular circuit board plate body 10 is provided with a manhole 18.Around the panel outer of this circle circuit board plate body 10 and mid portion be distributed with many printed circuit bodies 11, be distributed with correspondence on the printed circuit body 11 and be welded with the Copper Foil 12 of LED pin, be made as than the original structure printed circuit and have more large-area printed circuit sheet 16 corresponding to being used for connecting printed circuit body between the LED; The Copper Foil that correspondence is welded with LED pin 13 is made as than the original structure Copper Foil has more large-area Copper Foil piece 15; Couple together with lead 14 between the printed circuit of position, circular circuit board plate body 10 outer and the printed circuit of medium position.Pin 13 fractions of LED stretch in the welding hole of circular circuit board plate body, and pin 13 major parts of LED are stayed circular circuit board plate body outside, and the pin length of staying circular circuit board plate body 10 outsides of this LED is 1~3mm or 3mm.
A kind of circuit board that helps the low-power LED heat radiation of the present utility model, design has than the original structure printed circuit and has more large-area printed circuit sheet 16 on corresponding to the printed circuit body that is used for connecting between the LED, particularly being welded with on the Copper Foil of LED pin design in correspondence has than the original structure Copper Foil and has more large-area Copper Foil piece 15, the heat that the LED luminescence process is produced can be delivered on the Copper Foil piece 15 by pin, by Copper Foil piece 15 heat is distributed again.In addition, the pin length of the circular circuit board plate body of staying of LED 10 outsides is designed to 1~3mm or 3mm, makes it expose the certain length of circular circuit board plate body, then can enlarge the radiating surface of LED, thereby help the LED heat radiation better.
The foregoing description only is used for further specifying a kind of circuit board that helps the low-power LED heat radiation of the present utility model; but the utility model is not limited to embodiment; every foundation technical spirit of the present utility model all falls into the protection domain of technical solutions of the utility model to any simple modification, equivalent variations and modification that above embodiment did.

Claims (5)

1. a circuit board that helps the low-power LED heat radiation comprises a circular circuit board plate body; Around the panel outer of this circle circuit board plate body and mid portion be distributed with many printed circuit bodies, be distributed with correspondence on the printed circuit body and be welded with the Copper Foil of LED pin, it is characterized in that: be made as the printed circuit sheet corresponding to the printed circuit body that is used for connecting between the LED; The Copper Foil that correspondence is welded with the LED pin is made as the Copper Foil piece; The pin fraction of this LED stretches in the welding hole of circular circuit board plate body, and the pin major part of this LED is stayed circular circuit board plate body outside.
2. the circuit board that helps the low-power LED heat radiation according to claim 1 is characterized in that: the pin length of staying circular circuit board plate body outside of described LED is 1~3mm.
3. the circuit board that helps the low-power LED heat radiation according to claim 2 is characterized in that: the pin length of staying circular circuit board plate body outside of described LED is 3mm.
4. the circuit board that helps the low-power LED heat radiation according to claim 1, it is characterized in that: described circular circuit board plate body outer is distributed with some square breach, and the mid portion of circular circuit board plate body is provided with a manhole.
5. the circuit board that helps the low-power LED heat radiation according to claim 1 is characterized in that: couple together with lead between the printed circuit of position, described circular circuit board plate body outer and the printed circuit of medium position.
CN2009203064902U 2009-07-20 2009-07-20 Circuit board facilitating heat dissipation of low-power LED Expired - Fee Related CN201827835U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009203064902U CN201827835U (en) 2009-07-20 2009-07-20 Circuit board facilitating heat dissipation of low-power LED

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009203064902U CN201827835U (en) 2009-07-20 2009-07-20 Circuit board facilitating heat dissipation of low-power LED

Publications (1)

Publication Number Publication Date
CN201827835U true CN201827835U (en) 2011-05-11

Family

ID=43966365

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009203064902U Expired - Fee Related CN201827835U (en) 2009-07-20 2009-07-20 Circuit board facilitating heat dissipation of low-power LED

Country Status (1)

Country Link
CN (1) CN201827835U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102748637A (en) * 2012-07-24 2012-10-24 沈镇旭 Directly-inserted high-power LED (Light Emitting Diode) honeycomb type ceramic spotlight
CN106332440B (en) * 2016-10-28 2019-09-10 浙江宏友电气有限公司 A kind of LED circuit board structure and LED lamp holder

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102748637A (en) * 2012-07-24 2012-10-24 沈镇旭 Directly-inserted high-power LED (Light Emitting Diode) honeycomb type ceramic spotlight
CN106332440B (en) * 2016-10-28 2019-09-10 浙江宏友电气有限公司 A kind of LED circuit board structure and LED lamp holder

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110511

Termination date: 20160720