CN202352727U - LED packaging substrate with bulge-shaped reflection surfaces - Google Patents
LED packaging substrate with bulge-shaped reflection surfaces Download PDFInfo
- Publication number
- CN202352727U CN202352727U CN2011205047523U CN201120504752U CN202352727U CN 202352727 U CN202352727 U CN 202352727U CN 2011205047523 U CN2011205047523 U CN 2011205047523U CN 201120504752 U CN201120504752 U CN 201120504752U CN 202352727 U CN202352727 U CN 202352727U
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- CN
- China
- Prior art keywords
- reflecting surface
- shape reflecting
- base plate
- mound shape
- led
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- Expired - Fee Related
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Abstract
The utility model relates to an LED packaging substrate with bulge-shaped reflection surfaces, which comprises a printed circuit board substrate, and a heat radiating metal layer arranged on the bottom of the substrate, wherein the end face of the substrate is provided with a slot, and an LED chip is packaged in the slot. The LED packaging substrate is characterized in that at least one bulge-shaped reflection surface is arranged on the side surface of the LED chip. The bulge-shaped reflection surfaces can reflect light rays emitted by the LED chip in a horizontal direction, thus the light utilization rate of the LED packaging substrate is effectively increased.
Description
Technical field
The utility model relates to a kind of LED base plate for packaging that has mound shape reflecting surface.
Background technology
In recent years, rising again and rising of the COB that cost is low, thermal diffusivity is good (wafer is directly adorned on the Chip On Board plate) LED encapsulation technology proposed new challenge to the luminous efficiency that improves the LED substrate.
The utility model content
In view of this, be necessary the problem that is directed against a kind of new type of substrate that can effectively improve the luminous efficiency of LED substrate to be provided.
The purpose of the utility model realizes through following technical scheme:
A kind of LED base plate for packaging that has mound shape reflecting surface comprises printed circuit board base board and is packaged in the led chip of this substrate end-face that it is characterized in that: the side of said led chip is provided with at least one mound shape reflecting surface.
The end face fluting of said printed circuit board base board, said led chip is packaged in this groove.
This LED base plate for packaging that has mound shape reflecting surface also comprises the heat radiating metallic layer that is arranged at this base plate bottom.
Said mound shape reflecting surface is cone surface, pyramid protrusion surface or ridge shape protrusion surface.
The side of said led chip is provided with a plurality of mounds shape reflecting surface, and this a plurality of mounds shape reflector shape is identical, and its distance with said led chip is identical.
Said mound shape reflecting surface is the surface of the hollow or solid of metal level formation.
Said mound shape reflecting surface is the surface of the hollow or solid of copper layer or aluminium lamination formation.
Said mound shape reflecting surface is the surface that the surface scribbles plastic cement or the metal hollow or the solid of reflector layer.
Said mound shape reflecting surface is the surface of plastic cement or the metal hollow or the solid of plating zinc on surface.
Compared to prior art, the utility model has the advantages that: mound shape reflecting surface can effectively improve the light utilization efficiency of LED base plate for packaging with the light reflection of the horizontal direction of led chip emission.
Description of drawings
Fig. 1 is the structural representation of the utility model execution mode.
Embodiment
As shown in Figure 1; The LED base plate for packaging that has mound shape reflecting surface of this execution mode comprises: printed circuit board base board 20, be arranged at the heat radiating metallic layer 10 of this base plate bottom; The end face fluting of this substrate 20; With packaging plastic 40 encapsulation two led chips 30, the both sides of each led chip 30 are equipped with a mound shape reflecting surface 50 in the groove.The surface of the hollow body of these mound shape reflecting surface 50 city's ridge shapes, its material is a thin metal layer, selected metal can be copper, aluminium; Its material also can be zinc-plated thin metal layer or plastic cement thin layer, and for example: zinc-plated FR4 layer is also passable.
When led chip 30 work are luminous; The light of emission is installed the plane of reflection by led chip downwards; The bottom surface that is the substrate 20 end faces groove that is used to encapsulate two led chips 30 absorbs or reflection, and upwards the light of emission sees through packaging plastic 40 and penetrates, and the light of launching on the horizontal direction can be by 50 reflections of mound shape reflecting surface; See through packaging plastic 40 again and penetrate, improved light utilization efficiency.
The shape of the mound shape reflecting surface of the utility model also can be: cone surface, pyramid protrusion surface.
The mound shape reflecting surface of the utility model can be arranged at the one or both sides of led chip, can also a plurality of mounds shape reflecting surface be set around led chip.For making the led chip illumination effect symmetrically, preferred, around led chip, be symmetrical set mound shape reflecting surface, and if be provided with a plurality of mounds shape reflecting surface around led chip, the distance of this a plurality of mounds shape reflecting surface to led chip equates.
Said mound shape reflecting surface also can be the surface of real new body, and its material can be identical with above-mentioned hollow body.
The above embodiment has only expressed several kinds of execution modes of the utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model claim.Should be pointed out that for the person of ordinary skill of the art under the prerequisite that does not break away from the utility model design, can also make some distortion and improvement, these all belong to the protection range of the utility model.Therefore, the protection range of the utility model patent should be as the criterion with accompanying claims.
Claims (9)
1. LED base plate for packaging that has mound shape reflecting surface comprises printed circuit board base board and is packaged in the led chip of this substrate end-face that it is characterized in that: the side of said led chip is provided with at least one mound shape reflecting surface.
2. the LED base plate for packaging that has mound shape reflecting surface according to claim 1 is characterized in that: also comprise the heat radiating metallic layer that is arranged at this base plate bottom.
3. the LED base plate for packaging that has mound shape reflecting surface according to claim 1 and 2 is characterized in that: said mound shape reflecting surface is cone surface, pyramid protrusion surface or ridge shape protrusion surface.
4. the LED base plate for packaging that has mound shape reflecting surface according to claim 3 is characterized in that: the side of said led chip is provided with a plurality of mounds shape reflecting surface, and this a plurality of mounds shape reflector shape is identical, and its distance with said led chip is identical.
5. the LED base plate for packaging that has mound shape reflecting surface according to claim 4 is characterized in that: said mound shape reflecting surface is the surface of the hollow or solid of metal level formation.
6. the LED base plate for packaging that has mound shape reflecting surface according to claim 5 is characterized in that: said mound shape reflecting surface is the surface of the hollow or solid of copper layer or aluminium lamination formation.
7. the LED base plate for packaging that has mound shape reflecting surface according to claim 6 is characterized in that: said mound shape reflecting surface is the surface that the surface scribbles plastic cement or the metal hollow or the solid of reflector layer.
8. the LED base plate for packaging that has mound shape reflecting surface according to claim 7 is characterized in that: said mound shape reflecting surface is the surface of plastic cement or the metal hollow or the solid of plating zinc on surface.
9. the LED base plate for packaging that has mound shape reflecting surface according to claim 1 is characterized in that: the end face fluting of said printed circuit board base board, said led chip is packaged in this groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205047523U CN202352727U (en) | 2011-12-07 | 2011-12-07 | LED packaging substrate with bulge-shaped reflection surfaces |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205047523U CN202352727U (en) | 2011-12-07 | 2011-12-07 | LED packaging substrate with bulge-shaped reflection surfaces |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202352727U true CN202352727U (en) | 2012-07-25 |
Family
ID=46541700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011205047523U Expired - Fee Related CN202352727U (en) | 2011-12-07 | 2011-12-07 | LED packaging substrate with bulge-shaped reflection surfaces |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202352727U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103363357A (en) * | 2013-07-17 | 2013-10-23 | 晶科电子（广州）有限公司 | LED light source with well heat dissipation effect |
-
2011
- 2011-12-07 CN CN2011205047523U patent/CN202352727U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103363357A (en) * | 2013-07-17 | 2013-10-23 | 晶科电子（广州）有限公司 | LED light source with well heat dissipation effect |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: RAYBEN TECHNOLOGY (ZHUHAI) CO., LTD. Free format text: FORMER NAME: LEJIAN CIRCUIT BOARD (ZHUHAI) CO., LTD. |
|
| CP03 | Change of name, title or address |
Address after: Doumen Xinqing Technology Industrial Park West District Po Road 519180 Guangdong city of Zhuhai province No. 8 Patentee after: Lejian Technology (Zhuhai) Co., Ltd. Address before: Xinqing Technology Industrial Park Doumen District Guangdong city Zhuhai Province West Po Road No. 8 Patentee before: Happy circuit board (Zhuhai) Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120725 Termination date: 20191207 |