CN102610912B - Based on antenna electric sublayer and the processing technology thereof of hard contact - Google Patents
Based on antenna electric sublayer and the processing technology thereof of hard contact Download PDFInfo
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- CN102610912B CN102610912B CN201210109500.XA CN201210109500A CN102610912B CN 102610912 B CN102610912 B CN 102610912B CN 201210109500 A CN201210109500 A CN 201210109500A CN 102610912 B CN102610912 B CN 102610912B
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Abstract
The present invention relates to a kind of antenna electric sublayer based on hard contact and processing technology thereof, by the preparation of the first electronic shell to the antenna electric sublayer be provided with, the uniqueness of technique and the technological parameter thereof such as add that metalwork and antenna are buried underground is arranged, solving this area cannot avoid chip and antenna to bury underground simultaneously, low and the with high costs and antenna of speed of production firmly and the technical problem of the consistency difference of electric property, reach the technique that chip and antenna can be avoided simultaneously to bury underground, thus first can bury antenna underground aborning, independent production antenna electric sublayer, carry out filling and the welding of chip again, enable the settling mode Advantageous Effects more flexibly of smart card production and test job.
Description
Technical field
The present invention relates to the antenna technical field of smart card and card reader, particularly relate to a kind of antenna electric sublayer based on hard contact and processing technology thereof.
Background technology
At present, contactless smart card etc. adopt the equipment of radio-frequency technique, and its core generally adopts an additional antenna circuit 2 of coding/decoding module 1 to realize, and antenna circuit comprises antenna 3 and antenna-matching circuit 4.The signal decoding that antenna circuit 2 receives is become valid data by coding/decoding module 1 wherein, or is sent by antenna circuit after being encoded by valid data.In order to mate the load impedance of the output port of coding/decoding module 1, between coding/decoding module 1 and antenna-matching circuit 4, be connected with an impedance matching capacitances 15.
Some equipment needs the coding/decoding module using two or more, but in order to avoid the interference between antenna, so can only adopt an antenna, causes multiple coding/decoding module to use an antenna.Such as: at the radio-frequency apparatus of multi-protocol adaptive, a coding/decoding module is all needed for each agreement; There is in double-interface card multiple coding/decoding module; When general radio-frequency apparatus increases radio-frequency card reader in addition, need to increase corresponding coding/decoding module.When multiple coding/decoding module shares an antenna, its structure as shown in Figure 2, the signal lead of two/multiple coding/decoding module is received on antenna circuit 2 by impedance matching capacitances 15 simultaneously, when reality uses, the same time, only have a coding/decoding module in running order, other coding/decoding module does not work.
Owing to can not shield the connection of coding/decoding module and antenna circuit, inventor finds: coding/decoding module is directly connected to antenna circuit and there will be following problem:
1, the current coding/decoding module do not used may export some faint signals to antenna circuit, or being equivalent to a passive load is added on antenna circuit, can have influence on the modulation-demodulation signal of antenna circuit like this, there is deviation in the signal that antenna circuit is sent.
2, after antenna circuit receives signal, can by signal simultaneously to the transmission of all coding/decoding modules, this decays with regard to the signal causing in running order coding/decoding module and receive.
For overcoming above-mentioned defect, can to the coding/decoding module power-off do not used in prior art.But after the coding/decoding module power-off do not used, its artificial circuit part still can have an impact to antenna circuit and other coding/decoding module.
Nowadays, radio frequency communication terminal especially radio-frequency card is popularized, and by transformation, makes mobile or fixed communication terminal possess short-range communication function, particularly utilizes the mobile radio communication terminals such as mobile phone to realize the demand of the functions such as E-Payment more and more stronger.At present, occur subscriber identification module SIM (the Subscriber Identity Module) card in mobile phone increases radio-frequency enabled (being called radio-frequency SIM card) or on cell phone mainboard, increases proximity communication module to realize the method for mobile phone short-range communication, the appearance of this method makes mobile phone become one can to supplement with money, consume, conclude the business and the super intelligent terminal of authentication, greatly meet the active demand in market.
Wherein, based on radio-frequency SIM mobile phone closely solution simple with it, paid close attention to widely without the need to changing the advantages such as mobile phone, in this scenario, radio-frequency SIM adopts UHF (Ultra HighFrequency, hyperfrequency) etc. technology when making radio-frequency SIM card be embedded in interior of mobile phone radiofrequency signal still can transmit from mobile phone, thus realize need not carrying out any structural change to existing mobile phone mobile phone just can be made to possess short-range communication function.But, different mobile phone causes radiofrequency signal transmission effects to there is very large difference because internal structure is different, strong its radio-frequency SIM card radio frequency communication distance of mobile phone of transmission may reach the distance of several meters far away, and weak its communication distance of radio frequency SIM card of mobile phone of transmission also can reach tens centimetres.In mobile payment application, as public transport subway is swiped the card, usually all can have strict requirement to guarantee the safety of concluding the business for transaction distance, required distance of such as concluding the business is limited in below 10cm, to prevent user from missing brush in unwitting situation, causes damage; On the other hand, the reliability ensureing to communicate below predetermined distance is also required, to improve the efficiency of transaction.Therefore, based on the mobile phone of radio-frequency SIM while increase short-range communication function, the distance range that it is concluded the business also must be effectively controlled.
In existing technology for radio frequency, non-contact card technology based on ISO14443 standard can realize controllable distance transaction, in this technology, card reader constantly launches alternating magnetic field transmission signal and energy, during the nearly card reader of clamping, its Inside coil can induce energy to for the work of non-contact card internal circuit, the signal that simultaneously can also demodulate wherein realizes the communication between card and card reader, because magnetic field energy is violent with range attenuation, be difficult to be sent to comparatively remote, therefore adopt this technology can realize controllable distance communication; And in fact, this technology is difficult to be applied on the radio-frequency card in built-in device, as in SIM card.This is because this series products of picture SIM card, area own is very little, and be embedded in interior of mobile phone, battery is there is and other contain the parts of metal due to interior of mobile phone, alternating magnetic field can produce eddy current and decay rapidly, makes the magnetic field energy of card reader radiation and signal cannot penetrate mobile phone and realizes communicating with radio-frequency SIM.For many years all can not address this problem in the industry, such as, mobile phone is used to carry out paying comparatively universal in Japan, but custom-made mobile phone can only be used to realize paying the short-range communication required, this mode realizes the business cost of mobile payment far away higher than only changing SIM card to realize the mode of mobile payment, and why Japan does not adopt the mode only changing SIM card to be exactly because ISO14443 technology can not realize on the sim card.
Patent of invention CN200810142624.1 proposes a kind of system and method controlling mobile terminal radio frequency communication distance, and first the method sets up corresponding near field collection of illustrative plates by the radio frequency mobile terminal of test method for each type on radio frequency control terminal; Utilize detector array by between the field intensity of the current radio frequency mobile terminal detected with its near field collection of illustrative plates by the matching degree being used for comparing that matching algorithm obtains; The threshold value of the matching degree obtained with the corresponding the type radio frequency mobile terminal pre-set in radio frequency control terminal is compared, thus within the limits prescribed whether the distance judging current radio frequency mobile terminal and radio frequency control terminal.The method needs the near field collection of illustrative plates being obtained each radio frequency control terminal in advance by methods such as tests, is called calibration, and this process entails is high, comparatively complicated; And the method is based on radiofrequency signal field intensity, be easily subject to radiofrequency signal interference, system will shield and eliminate this interference to be needed to adopt complicated method to realize.
On existing 2.4G wireless short-distance RFID card reader printed circuit board (PCB) use antenna element to be ceramic paster antenna, the shortcomings such as the consistency of antenna element is poor, antenna performance is poor, printed circuit board (PCB), processing procedure complexity, the production cycle is long, production cost is high, product thickness is large that adopt the printed circuit board (PCB) of ceramic paster antenna to exist.
At present, conventional 13.56MHz high frequency non-contact card reader antenna is made up of aerial coil and match circuit.It is for the transmitting and receiving of 13.56MHz high-frequency signal.In this type of common antenna, match circuit is generally made up of electric capacity and resistance, and aerial coil forms by being coiled into a few conductors with certain area.Match circuit is mostly identical, the current useful printed circuit board (PCB) (PCB) of implementation of aerial coil, flexible PCB (FPC), wound coil and electrically conductive ink printing etc.In these modes, printed circuit board (PCB) is large by product design restriction owing to can only make flat panel contours; Flexible PCB cost of manufacture is high; Wound coil is because fixed form, electrically conductive ink are due to defects such as print thickness and material composition very difficult control distributed constants.The puzzlements such as these modes may cause product design limited in the product design of high frequency Non-contact Media Reader, cost high or antenna performance consistency difference.Therefore be necessary to improve existing non-contact card reader antenna.
And under current state, smart card production aspect: antenna electric sublayer is a kind of semi-finished product in the production process of smart card, first loads chip usually on sheet material, and then carry out burying underground of antenna, chip welds with antenna, and final layer is pressed into card; The welding of chip and antenna electric sublayer can not be allowed to be divided into twice processing technology.
Card reader production aspect: in the antenna applications of card reader, the card reading antennas of usual card reader is produced by PCB, and some card reader air core coil is as card reading antennas.
In the technique of the smart card manufactured at present, because chip must be buried underground and lamination with antenna simultaneously, antenna electric sublayer is made not possess the function of chipless and follow-up interpolation chip.
, there is price more expensive in the pcb board antenna in the antenna applications of card reader, due to shortcoming that processing technology causes cost high and time to grow in low yield and test; The antenna of air core coil then has shape not easily standard, holds yielding shortcoming in use procedure.
Summary of the invention
The object of the invention is the above-mentioned deficiency for prior art, for the defect of prior art, a kind of antenna electric sublayer based on hard contact and processing technology thereof are provided, by the preparation of the first electronic shell to the antenna electric sublayer be provided with, add metalwork, antenna is buried underground, antenna welds with metalwork, collocation before lamination, lamination synthesizes and peels off the uniqueness setting of additional materials technique and technological parameter thereof after lamination, solve the technical problem that this area does not solve for a long time: chip and antenna cannot be avoided to bury underground simultaneously, speed of production consistency that is firm and electric property that is low and with high costs and antenna is poor, achieve preferably: (1) is in production of intelligent card, the technique that chip and antenna are buried underground simultaneously can be avoided, thus first can bury antenna underground aborning, independent production antenna electric sublayer, carry out filling and the welding of chip again, enable the settling mode of smart card production and test job more flexible.Such as: for the external antenna of the double-interface SIM card of mobile phone NFC function; (2) make card reader produce and in test, compare pcb board antenna, realizing speed of production and cost reduction; Compare the consistency that air core coil realizes the firm of antenna and electric property, good basis has been laid in the preparation for the high performance card reading antennas of low price.
For achieving the above object, the present invention is achieved by the following technical solutions:
A kind of antenna electric sublayer based on hard contact of the present invention and processing technology thereof, it is characterized in that, by slotting in the wherein layer of material of described antenna electric sublayer, placing sectional area is rectangle or circular metal part, antenna described in being embedded in wherein on layer of material is welded on described metalwork, then one is laminated into, described in the one side of described metalwork is exposed to wherein outside layer of material, described in the electrical connection of described antenna being extended to, wherein layer of material is surperficial, and makes the solder side of described antenna carry out area increase and thickness increase; Described in the tie point of described antenna electric sublayer is distributed in, wherein layer of material is outside, make the coil of described antenna carry out spring layer in described wherein layer of material inside, the antenna electric sublayer production technology of the described hard contact based on smart card or card reader also specifically comprises following production stage:
(1) preparation of the first electronic shell of described antenna electric sublayer; In the sheet surface of described first electronic shell, multiple independent region evenly arranges corresponding multiple paired rectangle dead slot, and the cross section of described rectangle dead slot is identical with corresponding metalwork shape;
(2) metalwork is added; In described paired rectangle dead slot, place the metalwork of described correspondence;
(3) antenna is buried underground; On the sheet material of described first electronic shell of the metalwork of the described correspondence of placement, in each independent region, carry out burying underground of antenna, and the start bit of antenna and end position are welded on metalwork;
(4) antenna welds with metalwork; By the position that antenna and metalwork weld, carry out butt-joint by low pressure height stream butt-welding machine; Wherein, the surface finish of antenna is carried out low temperature scolding tin welding at a slow speed the part of 3/to seven/7ths of antenna to be squeezed in metalwork after removing insulating barrier;
(5) collocation before lamination; Inside antenna in described first electronic shell sheet material and the A face of metal bond pad, the B face in exposed metal face; Described A face covers the sheet material of the same material of one deck, and thickness is arranged on 100-250nm (original text: thickness is arranged on 100-120nm); Described B face covers metal covering that one deck avoids exposing in lamination and the screen that metal laminate plate bonds, this screen plays buffer protection to the sheet material of described same material and metalwork, and after the lamination stating card base, described screen does not bond with the sheet material of described same material but strippable;
(6) lamination synthesis; By the material of collocation before above-mentioned steps (5) lamination, successively be placed in metal laminate plate, and by temperature be arranged on 120-180 DEG C, pressure be 2-8MPa, the time keep 10-30 minute, (original text: and by temperature be arranged on 340 DEG C, pressure be 850N, the time keep 7 ~ 9 minutes,) the first electronic shell sheet material and the second electronic shell sheet material are synthesized together, outer surface is smooth;
(7) additional materials is peeled off after lamination; After the synthesis of above-mentioned steps (6) lamination, described screen is stripped out from the sheet material after synthesis, forms the antenna electric sublayer with hard contact.
Wherein: in step (4), the surface finish of antenna is carried out low temperature scolding tin welding at a slow speed the part of 2/7ths of antenna to be squeezed in metalwork after removing insulating barrier.
On described A face, cover the sheet material of the same material of one deck in step (5), thickness is arranged on 100-250nm (original text: thickness is arranged on 100-120nm).
According to the antenna electric sublayer based on hard contact that the processing technology of the described antenna electric sublayer based on hard contact prepares.
Take the above antenna electric sublayer based on hard contact and processing technology thereof, in production of intelligent card, the technique that chip and antenna are buried underground simultaneously can be avoided, thus first can bury antenna underground aborning, independent production antenna electric sublayer.Because antenna electric sublayer has the metal solder joint exposed, in smart card and card reader are produced, many-sided application can be carried out.
Accompanying drawing explanation
Fig. 1 is the partial schematic diagram in regularly arranged region on the ground floor material that uses of the present invention;
Fig. 2 is the cutaway view of Fig. 1;
Fig. 3 is the rough schematic of the metalwork in the present invention, the vertical view that (1) is metalwork, the cutaway view that (2) are metalwork;
Fig. 4 is in the groove of ground floor material of the present invention, has loaded the material after metalwork, has had the schematic diagram of the side of substrate portion;
Fig. 5 is in the groove of ground floor material of the present invention, has loaded the material after metalwork, has had the schematic diagram of the side in exposed metal face;
Fig. 6 is the cutaway view of Fig. 4 and Fig. 5;
Fig. 7 be carry out after filling metalwork of the present invention antenna bury underground after the part-structure schematic diagram of ground floor material;
Fig. 8 is the cutaway view of Fig. 7;
Fig. 9 is of the present invention carry out antenna and metalwork weld schematic sectional view;
Figure 10 is the assembly structure schematic diagram of ground floor material of the present invention, second layer material and third layer shielding material layer;
Figure 11 is the structural representation after lamination of the present invention;
Figure 12 is the structure cutaway view after peeling off shielding material layer after lamination of the present invention;
Figure 13 is the part-structure schematic diagram after peeling off shielding material layer after lamination of the present invention;
Figure 14 is that of the present invention individual has the antenna electric sublayer schematic diagram of hard contact.
Embodiment
Be described according to production procedure of the present invention and technical characterstic, below in conjunction with embodiment, set forth the present invention further.
The antenna electric sublayer processing technology with hard contact of the present invention, has following steps:
A) production stage of ground floor material
On ground floor material sheet 101, the region 102 of the standard that can arrange as required, outputs two rectangular dead slots 103 according to the metalwork shape of correspondence in each scope; Specifically see Fig. 1 and Fig. 2.
B) production stage of metalwork is added
Fig. 3 is the structural representation of metalwork 104, specifically see Fig. 3.
The exposed parts of metalwork 104 is filled in the position of dead slot 103, connects a metalwork placement location relatively (specifically placing according to product requirement); See Fig. 4 and Fig. 5, Fig. 6.
C) production stage that antenna is buried underground is carried out
On the sheet material 101 placing metalwork, carry out carrying out burying underground of antenna 105 in each independent scope, and the start bit of antenna 105 and end position are passed through on the welding position of metalwork 104; See Fig. 7 and Fig. 8.
D) antenna and metalwork carry out the production stage that welds
By antenna 105 and metalwork 104 welding position, carry out butt-joint by low pressure height stream butt-welding machine, the outer paint of antenna destroyed and general for antenna half is squeezed in metalwork, forming good welding effect; If antenna outside does not have insulating material, weld by eutectic welding process of tin; See Fig. 9
E) to arrange in pairs or groups the production stage of material before lamination
To in ground floor sheet material 101, there is the side of antenna and metal bond pad to be called A face, the side in exposed metal face will be called B face; A face covers the sheet material 106 of the same material of one deck, and thickness can change as required; B face covers one deck screen 107, and (so-called screen is in order in lamination, avoids the metal covering that exposes and metal laminate plate to bond; and buffer protection function is played to sheet material and metalwork; and screen after laminating, can not bond with material sheet, can strip down.); See Figure 10.
F) production stage of lamination synthetic material
Lamination step, be the material (106+101+107) that will match, be successively placed in metal laminate plate, and by the temperature that arranges certain value, pressure, time, effectively ground floor sheet material 101 and second layer sheet material 106 are synthesized together formation 108, flat appearance; See Figure 11.
G) production stage of additional materials is peeled off after lamination
After lamination, be stripped out peel ply 107 from synthetic sheet material 108, form the antenna electric sublayer 109 with hard contact; See Figure 12 and Figure 13.
H) individual antenna Step is cut.
Cut individual antennas some from material 108, often open antenna and all there is the hard contact exposed, see Figure 14.
Compared with antenna electric sublayer during the antenna electric sublayer with hard contact of the present invention produces with traditional smart card, there is following characteristics:
1) there is the hard contact exposed; And traditional antenna electric sublayer is the hard contact do not exposed.
2) intelligent card chip can after antenna electronics is pressed layer by layer, then be connected on antenna electric sublayer; And traditional processing technology is after to be chip and sky wire bonding good, can lamination.
3) can be used as the radio-frequency antenna of intelligent card chip and smart card reader, various radio-frequency apparatus; And traditional antenna electric sublayer is only for smart card antenna function, there is no external hard contact, can not as the radio-frequency antenna of card reader and radio-frequency apparatus.
Scope of the present invention is not by the restriction of described specific embodiments, and described scheme, only as the single example of illustrating various aspects of the present invention, also comprises method and the component of functional equivalent in the scope of the invention.In fact, except content as herein described, those skilled in the art can easily grasp multiple improvement of the present invention with reference to description above and accompanying drawing.Described improvement also falls within the scope of claims.
Claims (4)
1. based on the processing technology of the antenna electric sublayer of hard contact, it is characterized in that, by slotting in the wherein layer of material of described antenna electric sublayer, placing sectional area is rectangle or circular metal part, antenna described in being embedded in wherein on layer of material is welded on described metalwork, then one is laminated into, described in the one side of described metalwork is exposed to wherein outside layer of material, described in the electrical connection of described antenna being extended to, wherein layer of material is surperficial, and makes the solder side of described antenna carry out area increase and thickness increase; Described in the tie point of described antenna electric sublayer is distributed in, wherein layer of material is outside, make the coil of described antenna carry out spring layer in described wherein layer of material inside, the antenna electric sublayer production technology based on the hard contact of smart card or card reader also specifically comprises following production stage:
(1) preparation of the first electronic shell of described antenna electric sublayer; In the sheet surface of described first electronic shell, multiple independent region evenly arranges corresponding multiple paired rectangle dead slot, and the cross section of described rectangle dead slot is identical with corresponding metalwork shape;
(2) metalwork is added; In described paired rectangle dead slot, place the metalwork of described correspondence;
(3) antenna is buried underground; On the sheet material of described first electronic shell of the metalwork of the described correspondence of placement, in each independent region, carry out burying underground of antenna, and the start bit of antenna and end position are welded on metalwork;
(4) antenna welds with metalwork; By the position that antenna and metalwork weld, carry out butt-joint by low pressure height stream butt-welding machine; Wherein, the surface finish of antenna is carried out low temperature scolding tin welding at a slow speed the part of 3/to seven/7ths of antenna to be squeezed in metalwork after removing insulating barrier;
(5) collocation before lamination; There is the side of antenna and metal bond pad to be called A face in described first electronic shell sheet material, the side in exposed metal face will be called B face; Described A face covers the sheet material of the same material of one deck, and thickness is arranged on 100-250nm; Described B face covers metal covering that one deck avoids exposing in lamination and the screen that metal laminate plate bonds, this screen plays buffer protection to the sheet material of described same material and metalwork, and described screen does not bond with the sheet material of described same material but strippable after laminating;
(6) lamination synthesis; By the material of collocation before above-mentioned steps (5) lamination, successively be placed in metal laminate plate, and by temperature be arranged on 120-180 DEG C, pressure be 2-8MPa, the time keep 10-30 minute, be synthesized together by the sheet material of the first electronic shell sheet material and described same material, outer surface is smooth;
(7) additional materials is peeled off after lamination; After the synthesis of above-mentioned steps (6) lamination, described screen is stripped out from the sheet material after synthesis, forms the antenna electric sublayer with hard contact.
2. the processing technology of the antenna electric sublayer based on hard contact according to claim 1, it is characterized in that, in step (4), the surface finish of antenna is carried out low temperature scolding tin welding at a slow speed the part of 2/7ths of antenna to be squeezed in metalwork after removing insulating barrier.
3. the processing technology of the antenna electric sublayer based on hard contact according to claim 1, is characterized in that, on described A face, cover the sheet material of the same material of one deck in step (5), thickness is arranged on 100-120nm.
4. the antenna electric sublayer based on hard contact for preparing of the processing technology of the antenna electric sublayer based on hard contact according to claim 1.
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| CN201210109500.XA CN102610912B (en) | 2012-04-16 | 2012-04-16 | Based on antenna electric sublayer and the processing technology thereof of hard contact |
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| CN201210109500.XA CN102610912B (en) | 2012-04-16 | 2012-04-16 | Based on antenna electric sublayer and the processing technology thereof of hard contact |
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| CN102610912B true CN102610912B (en) | 2015-08-05 |
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| CN103020561A (en) * | 2012-12-10 | 2013-04-03 | 北京神州龙芯集成电路设计有限公司 | Card reader containing flexible printed circuit antenna |
| JP2013219404A (en) * | 2013-08-02 | 2013-10-24 | Sumida Corporation | Method for manufacturing antenna component |
| CN110340610B (en) * | 2019-05-24 | 2024-12-06 | 武汉天之然知识产权运营有限公司 | A welding method for spot welding of mobile phone antenna contacts |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011085973A (en) * | 2009-10-13 | 2011-04-28 | Toppan Printing Co Ltd | Method of manufacturing non-contact ic card |
| CN102231193A (en) * | 2011-07-06 | 2011-11-02 | 黄艳 | Double-interface smart card |
| CN102339404A (en) * | 2010-07-20 | 2012-02-01 | 上海长丰智能卡有限公司 | Novel intelligent card module and productive technology thereof |
| CN102360443A (en) * | 2011-09-28 | 2012-02-22 | 张开兰 | Method for producing dual-interface card |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2011215865A (en) * | 2010-03-31 | 2011-10-27 | Sony Corp | Signal processing apparatus and signal processing method |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011085973A (en) * | 2009-10-13 | 2011-04-28 | Toppan Printing Co Ltd | Method of manufacturing non-contact ic card |
| CN102339404A (en) * | 2010-07-20 | 2012-02-01 | 上海长丰智能卡有限公司 | Novel intelligent card module and productive technology thereof |
| CN102231193A (en) * | 2011-07-06 | 2011-11-02 | 黄艳 | Double-interface smart card |
| CN102360443A (en) * | 2011-09-28 | 2012-02-22 | 张开兰 | Method for producing dual-interface card |
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