CN110411400A - A punching control system and method for smart card module manufacturing - Google Patents

A punching control system and method for smart card module manufacturing Download PDF

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Publication number
CN110411400A
CN110411400A CN201910653714.5A CN201910653714A CN110411400A CN 110411400 A CN110411400 A CN 110411400A CN 201910653714 A CN201910653714 A CN 201910653714A CN 110411400 A CN110411400 A CN 110411400A
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module
smart card
punching
test
control system
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张云鹏
苏燕云
胡志超
曾秦
曾佳鉴
林恩基
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Minnan University of Science and Technology
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Minnan University of Science and Technology
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/10—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring diameters
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/12—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2894—Aspects of quality control [QC]

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  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

本发明属于智能卡技术领域，公开了用于智能卡模块制造的冲孔控制系统及方法，包括：供电模块、孔径测量模块、主控模块、供油模块、驱动模块、推动模块、冲孔模块、测试模块、显示模块。本发明通过孔径测量模块能够快速的计算出被测孔的公差，计算精度达到微米级；提高了测量的准确度，从而达到降低成本；同时，通过测试模块利用设置于所述智能卡电路板待测试的导通孔的数量一致的测试层板，从而可模拟智能卡电路板中的不同层，以获得不同层之间的电性能数据；可采用测试仪器连接两个所述测试孔，由于测试孔与所述导电片电连接，形成一个回路，从而可模拟智能卡电路板，测试到智能卡电路板各层的耐电压性能。

The invention belongs to the technical field of smart cards, and discloses a punching control system and method for manufacturing smart card modules, including: a power supply module, an aperture measurement module, a main control module, an oil supply module, a drive module, a push module, a punching module, a test module, display module. The invention can quickly calculate the tolerance of the measured hole through the aperture measurement module, and the calculation accuracy reaches the micron level; the accuracy of the measurement is improved, thereby reducing the cost; at the same time, the test module is used to be installed on the smart card circuit board to be tested The number of through-holes is the same as the test laminate, so that different layers in the smart card circuit board can be simulated to obtain electrical performance data between different layers; a test instrument can be used to connect two of the test holes, because the test hole and The conductive sheets are electrically connected to form a loop, so that the circuit board of the smart card can be simulated to test the withstand voltage performance of each layer of the circuit board of the smart card.

Description

一种用于智能卡模块制造的冲孔控制系统及方法A punching control system and method for smart card module manufacturing

技术领域technical field

本发明属于智能卡技术领域，尤其涉及一种用于智能卡模块制造的冲孔控制系统及方法。The invention belongs to the technical field of smart cards, in particular to a punching control system and method for manufacturing smart card modules.

背景技术Background technique

目前，最接近的现有技术：智能卡(Smart Card)：内嵌有微芯片的塑料卡(通常是一张信用卡的大小)的通称。一些智能卡包含一个微电子芯片，智能卡需要通过读写器进行数据交互。智能卡配备有CPU、RAM和I/O，可自行处理数量较多的数据而不会干扰到主机CPU的工作。智能卡还可过滤错误的数据，以减轻主机CPU的负担。适应于端口数目较多且通信速度需求较快的场合。卡内的集成电路包括中央处理器CPU、可编程只读存储器EEPROM、随机存储器RAM和固化在只读存储器ROM中的卡内操作系统COS(Chip Operating System)。卡中数据分为外部读取和内部处理部分。然而，现有智能卡冲孔孔径测量不准确；同时，现有的智能卡电路板测试系统较较为复杂，需要多个单独的测试箱，以完成不同情况的测试，没有办法做到一体化测试。At present, the closest existing technology: smart card (Smart Card): a general term for a plastic card (usually the size of a credit card) embedded with a microchip. Some smart cards contain a microelectronic chip, and smart cards need to exchange data through a reader. The smart card is equipped with CPU, RAM and I/O, and can process a large amount of data by itself without interfering with the work of the host CPU. Smart cards can also filter erroneous data to reduce the burden on the host CPU. It is suitable for occasions where the number of ports is large and the communication speed is required to be fast. The integrated circuit in the card includes a central processing unit CPU, a programmable read-only memory EEPROM, a random access memory RAM, and a card operating system COS (Chip Operating System) solidified in the read-only memory ROM. The data in the card is divided into external reading and internal processing. However, the existing smart card punching aperture measurement is inaccurate; at the same time, the existing smart card circuit board test system is relatively complicated, requiring multiple separate test boxes to complete the test in different situations, and there is no way to achieve integrated testing.

综上所述，现有技术存在的问题是：现有智能卡冲孔孔径测量不准确；同时，现有的智能卡电路板测试系统较较为复杂，需要多个单独的测试箱，以完成不同情况的测试，没有办法做到一体化测试。To sum up, the existing problems in the prior art are: the measurement of the punching aperture of the existing smart card is inaccurate; at the same time, the existing smart card circuit board test system is relatively complicated, requiring multiple separate test boxes to complete the testing of different situations. There is no way to do an integrated test.

发明内容Contents of the invention

针对现有技术存在的问题，本发明提供了一种用于智能卡模块制造的冲孔控制系统及方法。Aiming at the problems existing in the prior art, the invention provides a punching control system and method for manufacturing smart card modules.

本发明是这样实现的，一种用于智能卡模块制造的冲孔控制方法，所述用于智能卡模块制造的冲孔控制方法包括：The present invention is achieved in this way, a punching control method for smart card module manufacturing, the punching control method for smart card module manufacturing includes:

第一步，通过供电模块为用于智能卡模块制造的冲孔控制系统供电；孔径测量模块利用测量设备测量智能卡模块制造的冲孔孔径数据；The first step is to supply power to the punching control system used for smart card module manufacturing through the power supply module; the aperture measurement module uses measuring equipment to measure the punching aperture data of smart card module manufacturing;

第二步，主控模块通过供油模块利用油缸为冲孔控制系统供油；通过驱动模块利用液压泵驱动冲孔控制系统的相关机构；通过推动模块利用推轴推动冲孔控制系统的冲头进行冲孔；通过冲孔模块利用冲头对智能卡进行冲孔操作；In the second step, the main control module uses the oil cylinder to supply oil to the punching control system through the oil supply module; the driving module uses the hydraulic pump to drive the relevant mechanisms of the punching control system; the push module uses the push shaft to push the punch of the punching control system Punching; use the punch to punch the smart card through the punching module;

第三步，通过测试模块对智能卡电路板进行测试操作；The third step is to test the smart card circuit board through the test module;

第四步，通过显示模块利用显示器显示测量的智能卡模块制造的冲孔孔径数据。In the fourth step, the display module uses a display to display the measured punching aperture data manufactured by the smart card module.

进一步，所述用于智能卡模块制造的冲孔控制方法的孔径测量方法如下：Further, the aperture measurement method of the punching control method for smart card module manufacturing is as follows:

(1)通过零位基准孔和锥形测量头设定零位移点，设定零位移点的位移值为L1；(1) Set the zero displacement point by the zero reference hole and the tapered measuring head, and set the displacement value of the zero displacement point as L 1 ;

(2)移动测量头，使测量头插入到被测孔内并与被测孔接触，通过测量探头测得测量头的位移值为L2；(2) Move the measuring head so that the measuring head is inserted into the measured hole and contacts the measured hole, and the displacement value of the measuring head measured by the measuring probe is L 2 ;

(3)计算测量头的相对位移值，即：L3＝L2—L1，其中，L3为测量头相对零位基准孔的相对位移值；(3) Calculate the relative displacement value of the measuring head, namely: L 3 =L 2 −L 1 , wherein, L 3 is the relative displacement value of the measuring head relative to the zero reference hole;

(4)计算被测孔孔径的公差值，即：α＝L3×K，其中，α为公差值，K为测量头的锥度。(4) Calculate the tolerance value of the measured hole diameter, namely: α=L 3 ×K, where α is the tolerance value and K is the taper of the measuring head.

进一步，所述用于智能卡模块制造的冲孔控制方法的对智能卡电路板进行测试操作方法如下：Further, the operation method for testing the smart card circuit board of the punching control method used for smart card module manufacturing is as follows:

(1)根据智能卡电路板上待测试的导通孔的孔数，制成与所述导通孔的孔数相同数量的测试层板，并为每一个所述测试层板标号；(1) according to the number of holes to be tested on the smart card circuit board, make the same number of test laminates as the number of holes of the through holes, and label each of the test laminates;

(2)在每一个所述测试层板上均开设与所述导通孔的孔数相对应的测试孔；(2) test holes corresponding to the number of holes of the via holes are opened on each of the test laminates;

(3)在每一个所述测试层板上安装导电片，并根据所述标号，将所述导电片与对应所述导通孔的测试孔电连接；(3) installing a conductive sheet on each of the test laminates, and electrically connecting the conductive sheet to the test hole corresponding to the via hole according to the label;

(4)将测试层板依次叠设形成测试样板，其中，多个所述测试层板中的多个所述导电片电连通，并且多个所述测试层板上的对应同一所述导通孔的测试孔一一对应；(4) The test laminates are sequentially stacked to form a test sample, wherein a plurality of the conductive sheets in the plurality of test laminates are electrically connected, and the corresponding conductive sheets on the plurality of test laminates are the same. There is a one-to-one correspondence between the test holes of the holes;

(5)电连接不同的所述测试层板上的所述测试孔，得到相应的电压数据。(5) Electrically connecting the test holes on different test layer boards to obtain corresponding voltage data.

本发明的另一目的在于提供一种运行所述用于智能卡模块制造的冲孔控制方法的用于智能卡模块制造的冲孔控制系统，所述用于智能卡模块制造的冲孔控制系统包括：Another object of the present invention is to provide a punching control system for smart card module manufacturing that operates the punching control method for smart card module manufacturing. The punching control system for smart card module manufacturing includes:

供电模块，与主控模块连接，用于为用于智能卡模块制造的冲孔控制系统供电；The power supply module is connected with the main control module, and is used to supply power for the punching control system used for smart card module manufacturing;

孔径测量模块，与主控模块连接，用于通过测量设备测量智能卡模块制造的冲孔孔径数据；Aperture measurement module, connected with the main control module, used to measure the punching aperture data manufactured by the smart card module through the measuring device;

主控模块，与供电模块、孔径测量模块、供油模块、驱动模块、推动模块、冲孔模块、测试模块、显示模块连接，用于通过单片机控制各个模块正常工作；The main control module is connected with the power supply module, aperture measurement module, oil supply module, drive module, push module, punching module, test module and display module, and is used to control the normal operation of each module through the single-chip microcomputer;

供油模块，与主控模块连接，用于通过油缸为冲孔控制系统供油；The oil supply module is connected with the main control module and is used to supply oil to the punching control system through the oil cylinder;

驱动模块，与主控模块连接，用于通过液压泵驱动冲孔控制系统的相关机构；The driving module is connected with the main control module, and is used to drive the relevant mechanisms of the punching control system through the hydraulic pump;

推动模块，与主控模块连接，用于通过推轴推动冲孔控制系统的冲头进行冲孔；The pushing module is connected with the main control module, and is used to push the punch of the punching control system to punch through the pushing shaft;

冲孔模块，与主控模块连接，用于通过冲头对智能卡进行冲孔操作；The punching module is connected with the main control module and is used for punching the smart card through the punch;

测试模块，与主控模块连接，用于通过测试电路对智能卡电路板进行测试操作；The test module is connected with the main control module, and is used to test the smart card circuit board through the test circuit;

显示模块，与主控模块连接，用于通过显示器显示测量的智能卡模块制造的冲孔孔径数据。The display module is connected with the main control module, and is used for displaying measured punching aperture data manufactured by the smart card module through the display.

进一步，所述供电模块包括：Further, the power supply module includes:

直流供电单元，用于为负载提供直流电源；A DC power supply unit, used to provide DC power for the load;

交流供电单元，用于为负载提供交流电源。The AC power supply unit is used to provide AC power for the load.

进一步，所述直流供电单元设置有直流电源输入端，所述直流电源输入端的正输入端与直流转换芯片的输入端连接，负输入端接地。Further, the DC power supply unit is provided with a DC power input terminal, the positive input terminal of the DC power input terminal is connected to the input terminal of the DC conversion chip, and the negative input terminal is grounded.

进一步，所述交流供电单元包括用于为负载提供电源电压的第一电源输出端和用于产生高电平信号的第二电源输出端，第二电源输出端与直流供电单元连接，为直流供电单元供电。Further, the AC power supply unit includes a first power supply output terminal for providing a power supply voltage for the load and a second power supply output terminal for generating a high-level signal, and the second power supply output terminal is connected to the DC power supply unit to supply DC power. unit powered.

进一步，所述主控模块包括：Further, the main control module includes:

处理单元，用于对数据信息进行处理分析；The processing unit is used to process and analyze the data information;

采集单元，用于接收各个受控器件的运转参数，并将结果反馈到处理单元；The acquisition unit is used to receive the operating parameters of each controlled device and feed back the results to the processing unit;

通信单元，与各个受控器件连接，用于在单片机和各个受控器件之间进行通信；The communication unit is connected with each controlled device, and is used for communicating between the single-chip microcomputer and each controlled device;

控制单元，用于根据数据参数生成控制指令。The control unit is used for generating control instructions according to the data parameters.

进一步，所述显示模块包括：Further, the display module includes:

显示控制单元，用于通过显示屏对控制参数进行设定；A display control unit is used to set the control parameters through the display screen;

数据显示单元，用于通过显示屏对各个受控器件的运转参数进行显示。The data display unit is used to display the operating parameters of each controlled device through the display screen.

本发明的另一目的在于提供一种应用所述用于智能卡模块制造的冲孔控制方法的智能信息卡。Another object of the present invention is to provide a smart information card applying the punching control method for smart card module manufacturing.

本发明的优点及积极效果为：本发明通过孔径测量模块能够快速的计算出被测孔的公差，计算精度达到微米级；通过简单的装置和一般精度的测量探头实现精密测量的目的，机械机构稳定，重复精度高，提高了测量的准确度，从而达到降低成本；同时，通过测试模块利用设置于所述智能卡电路板待测试的导通孔的数量一致的测试层板，从而可模拟智能卡电路板中的不同层，以获得不同层之间的电性能数据；可采用测试仪器连接两个所述测试孔，由于测试孔与所述导电片电连接，形成一个回路，从而可模拟智能卡电路板，测试到智能卡电路板各层的耐电压性能。The advantages and positive effects of the present invention are: the present invention can quickly calculate the tolerance of the measured hole through the aperture measurement module, and the calculation accuracy reaches the micron level; the purpose of precise measurement is realized through a simple device and a general-precision measuring probe, and the mechanical mechanism Stable, high repeatability, improved measurement accuracy, thereby reducing costs; at the same time, through the test module, the smart card circuit can be simulated by using a test laminate with the same number of through holes to be tested on the smart card circuit board Different layers in the board to obtain electrical performance data between different layers; a test instrument can be used to connect the two test holes, since the test hole is electrically connected to the conductive sheet to form a loop, which can simulate a smart card circuit board , to test the withstand voltage performance of each layer of the smart card circuit board.

附图说明Description of drawings

图1是本发明实施例提供的用于智能卡模块制造的冲孔控制系统结构示意图；Fig. 1 is a schematic structural diagram of a punching control system for smart card module manufacturing provided by an embodiment of the present invention;

图中：1、供电模块；2、孔径测量模块；3、主控模块；4、供油模块；5、驱动模块；6、推动模块；7、冲孔模块；8、测试模块；9、显示模块。In the figure: 1. Power supply module; 2. Aperture measurement module; 3. Main control module; 4. Oil supply module; 5. Drive module; 6. Push module; 7. Punching module; 8. Test module; 9. Display module.

图2是本发明实施例提供的孔径测量模块测量方法流程图。Fig. 2 is a flow chart of the measurement method of the aperture measurement module provided by the embodiment of the present invention.

图3是本发明实施例提供的测试模块测试方法流程图。Fig. 3 is a flowchart of a testing method for a testing module provided by an embodiment of the present invention.

具体实施方式Detailed ways

为能进一步了解本发明的发明内容、特点及功效，兹例举以下实施例，并配合附图详细说明如下。In order to further understand the content, features and effects of the present invention, the following examples are given, and detailed descriptions are given below with reference to the accompanying drawings.

针对现有技术存在的问题，本发明提供了一种用于智能卡模块制造的冲孔控制系统及方法，下面结合附图对本发明作详细的描述。Aiming at the problems existing in the prior art, the present invention provides a punching control system and method for manufacturing smart card modules. The present invention will be described in detail below in conjunction with the accompanying drawings.

如图1所示，本发明实施例提供的用于智能卡模块制造的冲孔控制系统包括：供电模块1、孔径测量模块2、主控模块3、供油模块4、驱动模块5、推动模块6、冲孔模块7、测试模块8、显示模块9。As shown in Figure 1, the punching control system for smart card module manufacturing provided by the embodiment of the present invention includes: a power supply module 1, an aperture measurement module 2, a main control module 3, an oil supply module 4, a drive module 5, and a push module 6 , a punching module 7 , a testing module 8 , and a display module 9 .

供电模块1，与主控模块3连接，用于为用于智能卡模块制造的冲孔控制系统供电；The power supply module 1 is connected with the main control module 3, and is used to supply power for the punching control system used for smart card module manufacturing;

孔径测量模块2，与主控模块3连接，用于通过测量设备测量智能卡模块制造的冲孔孔径数据；Aperture measurement module 2 is connected with main control module 3, and is used for measuring punching aperture data manufactured by smart card module through measuring equipment;

主控模块3，与供电模块1、孔径测量模块2、供油模块4、驱动模块5、推动模块6、冲孔模块7、测试模块8、显示模块9连接，用于通过单片机控制各个模块正常工作；The main control module 3 is connected with the power supply module 1, the aperture measurement module 2, the oil supply module 4, the driving module 5, the pushing module 6, the punching module 7, the testing module 8, and the display module 9, and is used to control each module to be normal through the single-chip microcomputer Work;

供油模块4，与主控模块3连接，用于通过油缸为冲孔控制系统供油；The oil supply module 4 is connected with the main control module 3, and is used to supply oil to the punching control system through the oil cylinder;

驱动模块5，与主控模块3连接，用于通过液压泵驱动冲孔控制系统的相关机构；The driving module 5 is connected with the main control module 3, and is used to drive the relevant mechanisms of the punching control system through the hydraulic pump;

推动模块6，与主控模块3连接，用于通过推轴推动冲孔控制系统的冲头进行冲孔；The pushing module 6 is connected with the main control module 3, and is used to push the punch of the punching control system through the pushing shaft to punch holes;

冲孔模块7，与主控模块3连接，用于通过冲头对智能卡进行冲孔操作；The punching module 7 is connected with the main control module 3, and is used for punching the smart card through a punch;

测试模块8，与主控模块3连接，用于通过测试电路对智能卡电路板进行测试操作；The test module 8 is connected with the main control module 3, and is used to test the smart card circuit board through the test circuit;

显示模块9，与主控模块3连接，用于通过显示器显示测量的智能卡模块制造的冲孔孔径数据。The display module 9 is connected with the main control module 3, and is used for displaying the measured punching aperture data manufactured by the smart card module through the display.

如图2所示，本发明提供的孔径测量模块2测量方法如下：As shown in Figure 2, the measuring method of aperture measurement module 2 provided by the present invention is as follows:

S201，通过零位基准孔和锥形测量头设定零位移点，设定零位移点的位移值为L1；S201, set the zero displacement point through the zero reference hole and the tapered measuring head, and set the displacement value of the zero displacement point to L 1 ;

S202，移动测量头，使测量头插入到被测孔内并与被测孔接触，通过测量探头测得测量头的位移值为L2；S202, moving the measuring head so that the measuring head is inserted into the measured hole and in contact with the measured hole, and the displacement value of the measuring head is measured by the measuring probe as L 2 ;

S203，计算测量头的相对位移值，即：L3＝L2—L1，其中，L3为测量头相对零位基准孔的相对位移值；S203, calculating the relative displacement value of the measuring head, namely: L 3 =L 2 −L 1 , wherein, L 3 is the relative displacement value of the measuring head relative to the zero reference hole;

S204，计算被测孔孔径的公差值，即：α＝L3×K，其中，α为公差值，K为测量头的锥度。S204. Calculate the tolerance value of the measured hole diameter, namely: α=L 3 ×K, where α is the tolerance value and K is the taper of the measuring head.

如图3所示，本发明提供的测试模块8测试方法如下：As shown in Figure 3, the test module 8 testing methods provided by the present invention are as follows:

S301，根据智能卡电路板上待测试的导通孔的孔数，制成与所述导通孔的孔数相同数量的测试层板，并为每一个所述测试层板标号；S301, according to the number of via holes to be tested on the smart card circuit board, make test laminates with the same number of holes as the via holes, and label each of the test laminates;

S302，在每一个所述测试层板上均开设与所述导通孔的孔数相对应的测试孔；S302, opening test holes corresponding to the number of the via holes on each of the test layer boards;

S303，在每一个所述测试层板上安装导电片，并根据所述标号，将所述导电片与对应所述导通孔的测试孔电连接；S303, installing a conductive sheet on each of the test layer boards, and electrically connecting the conductive sheet to the test hole corresponding to the via hole according to the label;

S304，将测试层板依次叠设形成测试样板，其中，多个所述测试层板中的多个所述导电片电连通，并且多个所述测试层板上的对应同一所述导通孔的测试孔一一对应；S304, stacking the test laminates in sequence to form a test sample, wherein the multiple conductive sheets in the multiple test laminates are electrically connected, and the multiple test laminates correspond to the same via hole The test holes correspond one by one;

S305，电连接不同的所述测试层板上的所述测试孔，得到相应的电压数据。S305. Electrically connect the test holes on different test layer boards to obtain corresponding voltage data.

进一步，所述供电模块包括：Further, the power supply module includes:

直流供电单元，用于为负载提供直流电源；A DC power supply unit, used to provide DC power for the load;

交流供电单元，用于为负载提供交流电源。The AC power supply unit is used to provide AC power for the load.

进一步，所述直流供电单元设置有直流电源输入端，所述直流电源输入端的正输入端与直流转换芯片的输入端连接，负输入端接地。Further, the DC power supply unit is provided with a DC power input terminal, the positive input terminal of the DC power input terminal is connected to the input terminal of the DC conversion chip, and the negative input terminal is grounded.

进一步，所述交流供电单元包括用于为负载提供电源电压的第一电源输出端和用于产生高电平信号的第二电源输出端，第二电源输出端与直流供电单元连接，为直流供电单元供电。Further, the AC power supply unit includes a first power supply output terminal for providing a power supply voltage for the load and a second power supply output terminal for generating a high-level signal, and the second power supply output terminal is connected to the DC power supply unit to supply DC power. unit powered.

进一步，所述主控模块包括：Further, the main control module includes:

处理单元，用于对数据信息进行处理分析；The processing unit is used to process and analyze the data information;

采集单元，用于接收各个受控器件的运转参数，并将结果反馈到处理单元；The acquisition unit is used to receive the operating parameters of each controlled device and feed back the results to the processing unit;

通信单元，与各个受控器件连接，用于在单片机和各个受控器件之间进行通信；The communication unit is connected with each controlled device, and is used for communicating between the single-chip microcomputer and each controlled device;

控制单元，用于根据数据参数生成控制指令。The control unit is used for generating control instructions according to the data parameters.

进一步，所述显示模块包括：Further, the display module includes:

显示控制单元，用于通过显示屏对控制参数进行设定；A display control unit is used to set the control parameters through the display screen;

数据显示单元，用于通过显示屏对各个受控器件的运转参数进行显示。The data display unit is used to display the operating parameters of each controlled device through the display screen.

本发明工作时，首先，通过供电模块1为用于智能卡模块制造的冲孔控制系统供电；通过孔径测量模块2利用测量设备测量智能卡模块制造的冲孔孔径数据；其次，主控模块3通过供油模块4利用油缸为冲孔控制系统供油；通过驱动模块5利用液压泵驱动冲孔控制系统的相关机构；通过推动模块6利用推轴推动冲孔控制系统的冲头进行冲孔；通过冲孔模块7利用冲头对智能卡进行冲孔操作；然后，通过测试模块8利用测试电路对智能卡电路板进行测试操作；最后，通过显示模块9利用显示器显示测量的智能卡模块制造的冲孔孔径数据。During the present invention work, at first, be used for the punching control system power supply that smart card module is made by power supply module 1; Utilize the punching aperture data that measuring equipment measures smart card module to make by aperture measurement module 2; Secondly, main control module 3 passes through power supply The oil module 4 utilizes the oil cylinder to supply oil for the punching control system; the relevant mechanism of the punching control system is driven by the hydraulic pump through the drive module 5; the punch of the punching control system is pushed by the pushing module 6 to punch holes; Hole module 7 utilizes punch to carry out punching operation to smart card; Then, utilizes test circuit to carry out test operation to smart card circuit board by test module 8; Finally, utilizes the punching hole diameter data that the smart card module of display measurement is made by display module 9.

以上所述仅是对本发明的较佳实施例而已，并非对本发明作任何形式上的限制，凡是依据本发明的技术实质对以上实施例所做的任何简单修改，等同变化与修饰，均属于本发明技术方案的范围内。The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention in any form. Any simple modifications made to the above embodiments according to the technical essence of the present invention, equivalent changes and modifications, all belong to this invention. within the scope of the technical solution of the invention.

Claims (10)

1. a kind of punching control method for smart card module manufacture, which is characterized in that described to be manufactured for smart card module Punching control method include:
The first step is that the punching control system manufactured for smart card module is powered by power supply module；Inside diameter measurement module benefit The punching pore size data manufactured with measuring device measurement smart card module；
Second step, main control module are punching control system fuel feeding using oil cylinder by fuel oil supply unit；Liquid is utilized by drive module The associated mechanisms of press pump driving punching control system；The formed punch of punching control system is pushed to carry out using push shaft by push module Punching；Operation is punched out to smart card using formed punch by punching module；
Third step carries out test operation to smart card circuitry plate by test module；
4th step utilizes the punching pore size data of the smart card module manufacture of display display measurement by display module.
2. the punching control method for smart card module manufacture as described in claim 1, which is characterized in that described to be used for intelligence The bore diameter measuring method of the punching control method of energy card module manufacture is as follows:
(1) zero shift point is set by zero reference hole and taper measuring head, sets the shift value of zero shift point as L1；
(2) traverse measurement head is inserted into measuring head in measured hole and contacts with measured hole, measures measuring head by measuring probe Shift value be L2；
(3) relative displacement of measuring head is calculated, it may be assumed that L3=L2—L1, wherein L3It is opposite with respect to zero-bit datum hole for measuring head Shift value；
(4) tolerance value in measured hole aperture is calculated, it may be assumed that α=L3× K, wherein α is tolerance value, and K is the taper of measuring head.
3. the punching control method for smart card module manufacture as described in claim 1, which is characterized in that described to be used for intelligence Can card module manufacture punching control method to smart card circuitry plate carry out test operation method it is as follows:
(1) according to the hole count of via hole to be tested on smart card circuitry plate, quantity identical as the hole count of the via hole is made Test laminate, and be each described test layer plate mark；
(2) instrument connection corresponding with the hole count of the via hole is opened up on each described test laminate；
(3) conductive sheet is installed on each described test laminate, and according to the label, by the conductive sheet with it is corresponding described in The instrument connection of via hole is electrically connected；
(4) test laminate is successively folded and sets to form test sample plate, wherein multiple conductive sheets in multiple test laminates It is electrically connected, and the instrument connection of the same via hole of correspondence on multiple test laminates corresponds；
(5) instrument connection being electrically connected on the different test laminates, obtains corresponding voltage data.
4. being used for smart card module system for the punching control method of smart card module manufacture described in a kind of operation claim 1 The punching control system made, which is characterized in that it is described for smart card module manufacture punching control system include:
Power supply module is connect with main control module, for the punching control system power supply to manufacture for smart card module；
Inside diameter measurement module, connect with main control module, for measuring the punching aperture of smart card module manufacture by measuring device Data；
Main control module, with power supply module, inside diameter measurement module, fuel oil supply unit, drive module, push module, punching module, test Module, display module connection, work normally for controlling modules by single-chip microcontroller；
Fuel oil supply unit is connect with main control module, for being punching control system fuel feeding by oil cylinder；
Drive module is connect with main control module, for driving the associated mechanisms of punching control system by hydraulic pump；
Push module is connect with main control module, for pushing the formed punch of punching control system to be punched out by push shaft；
Punching module, connect with main control module, for being punched out operation to smart card by formed punch；
Test module is connect with main control module, for carrying out test operation to smart card circuitry plate by test circuit；
Display module is connect with main control module, the punching aperture for the smart card module manufacture by display display measurement Data.
5. the punching control system for smart card module manufacture as claimed in claim 4, which is characterized in that the power supply mould Block includes:
DC power supply unit, for providing DC power supply for load；
Alternating Current Power Supply unit, for providing AC power source for load.
6. the punching control system for smart card module manufacture as claimed in claim 5, which is characterized in that the direct current supplies Electric unit is provided with DC supply input, the positive input terminal of the DC supply input and the input terminal of direct current conversion chip Connection, negative input end ground connection.
7. the punching control system for smart card module manufacture as claimed in claim 5, which is characterized in that the exchange supplies Electric unit includes the first power output end for providing supply voltage for load and the second electricity for generating high level signal Source output terminal, second source output end are connect with DC power supply unit, are powered for DC power supply unit.
8. the punching control system for smart card module manufacture as claimed in claim 4, which is characterized in that the master control mould Block includes:
Processing unit, for carrying out processing analysis to data information；
Acquisition unit is fed back for receiving the operating parameters of each controlled device, and by result to processing unit；
Communication unit is connect with each controlled device, for being communicated between single-chip microcontroller and each controlled device；
Control unit, for generating control instruction according to data parameters.
9. the punching control system for smart card module manufacture as claimed in claim 4, which is characterized in that the display mould Block includes:
Display control unit, for being set by display screen to control parameter；
Data display unit, for being shown by operating parameters of the display screen to each controlled device.
10. a kind of intelligence using the punching control method for being used for smart card module manufacture described in claims 1 to 3 any one Release.
CN201910653714.5A 2019-07-19 2019-07-19 A punching control system and method for smart card module manufacturing Pending CN110411400A (en)

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Application publication date: 20191105