CN110411400A - A kind of punching control system and method for smart card module manufacture - Google Patents
A kind of punching control system and method for smart card module manufacture Download PDFInfo
- Publication number
- CN110411400A CN110411400A CN201910653714.5A CN201910653714A CN110411400A CN 110411400 A CN110411400 A CN 110411400A CN 201910653714 A CN201910653714 A CN 201910653714A CN 110411400 A CN110411400 A CN 110411400A
- Authority
- CN
- China
- Prior art keywords
- module
- smart card
- punching
- test
- control system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/10—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring diameters
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/12—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2894—Aspects of quality control [QC]
Abstract
The invention belongs to technical field of intelligent card, disclose the punching control system and method for smart card module manufacture, comprising: power supply module, inside diameter measurement module, main control module, fuel oil supply unit, drive module, push module, punching module, test module, display module.The present invention can quickly calculate the tolerance of measured hole by aperture measurement module, and computational accuracy reaches micron order;The accuracy of measurement is improved, so that reaching reduces cost;Meanwhile the consistent test laminate of quantity for being set to smart card circuitry plate via hole to be tested is utilized by test module, thus the different layers in analog smart card circuitry plate, to obtain the electrical performance data between different layers;Test equipment two instrument connections of connection can be used and form a circuit since instrument connection is electrically connected with the conductive sheet, thus analog smart card circuitry plate, the proof voltage energy of each layer of smart card circuitry plate is arrived in test.
Description
Technical field
The invention belongs to technical field of intelligent card more particularly to a kind of punching control systems for smart card module manufacture
And method.
Background technique
Currently, the immediate prior art: smart card (Smart Card): being embedded with the plastic clip of microchip (usually
The size of one credit card) common name.Some smart cards include a microelectronic chip, and smart card needs to carry out by reader
Data interaction.Smart card can voluntarily handle a fairly large number of data without interfering with host CPU equipped with CPU, RAM and I/O
Work.Smart card also may filter that the data of mistake, to mitigate the burden of host CPU.Be adapted to port number it is more and communicate
The faster occasion of speed requirement.Integrated circuit in card include central processor CPU, programmable read only memory EEPROM, with
Machine memory RAM and the card internal operating system COS being solidificated in read only memory ROM (Chip Operating System).Card
Middle data are divided into external read and inter-process part.However, existing smart card punching inside diameter measurement inaccuracy;Meanwhile it is existing
Smart card circuitry Board Test System it is more complex, need multiple individual test boxs not have to complete the test of different situations
There is method to accomplish integrated testing.
In conclusion problem of the existing technology is: existing smart card punching inside diameter measurement inaccuracy;Meanwhile it is existing
Smart card circuitry Board Test System it is more complex, need multiple individual test boxs not have to complete the test of different situations
There is method to accomplish integrated testing.
Summary of the invention
In view of the problems of the existing technology, the present invention provides a kind of punchings for smart card module manufacture to control system
System and method.
The invention is realized in this way a kind of punching control method for smart card module manufacture, described for intelligence
Card module manufacture punching control method include:
The first step is that the punching control system manufactured for smart card module is powered by power supply module;Inside diameter measurement mould
The punching pore size data that block is manufactured using measuring device measurement smart card module;
Second step, main control module are punching control system fuel feeding using oil cylinder by fuel oil supply unit;Pass through drive module benefit
With the associated mechanisms of hydraulic pump driving punching control system;The formed punch of punching control system is pushed using push shaft by push module
It is punched out;Operation is punched out to smart card using formed punch by punching module;
Third step carries out test operation to smart card circuitry plate by test module;
4th step utilizes the punching pore size data of the smart card module manufacture of display display measurement by display module.
Further, the bore diameter measuring method of the punching control method for smart card module manufacture is as follows:
(1) zero shift point is set by zero reference hole and taper measuring head, sets the shift value of zero shift point as L1;
(2) traverse measurement head is inserted into measuring head in measured hole and contacts with measured hole, measures survey by measuring probe
The shift value for measuring head is L2;
(3) relative displacement of measuring head is calculated, it may be assumed that L3=L2—L1, wherein L3It is measuring head with respect to zero-bit datum hole
Relative displacement;
(4) tolerance value in measured hole aperture is calculated, it may be assumed that α=L3× K, wherein α is tolerance value, and K is the taper of measuring head.
Further, the punching control method for smart card module manufacture to smart card circuitry plate carries out test behaviour
It is as follows to make method:
(1) it according to the hole count of via hole to be tested on smart card circuitry plate, is made identical as the hole count of the via hole
The test laminate of quantity, and be each described test layer plate mark;
(2) instrument connection corresponding with the hole count of the via hole is opened up on each described test laminate;
(3) conductive sheet is installed on each described test laminate, and according to the label, by the conductive sheet with it is corresponding
The instrument connection of the via hole is electrically connected;
(4) test laminate is successively folded and sets to form test sample plate, wherein multiple in multiple test laminates described lead
Electric piece is electrically connected, and the instrument connection of the same via hole of correspondence on multiple test laminates corresponds;
(5) instrument connection being electrically connected on the different test laminates, obtains corresponding voltage data.
Another object of the present invention is to provide the punching control methods that smart card module manufacture is used for described in a kind of operation
For smart card module manufacture punching control system, it is described for smart card module manufacture punching control system include:
Power supply module is connect with main control module, for the punching control system power supply to manufacture for smart card module;
Inside diameter measurement module, connect with main control module, for measuring the punching of smart card module manufacture by measuring device
Pore size data;
Main control module, with power supply module, inside diameter measurement module, fuel oil supply unit, drive module, push module, punching module,
Test module, display module connection, work normally for controlling modules by single-chip microcontroller;
Fuel oil supply unit is connect with main control module, for being punching control system fuel feeding by oil cylinder;
Drive module is connect with main control module, for driving the associated mechanisms of punching control system by hydraulic pump;
Push module is connect with main control module, for pushing the formed punch of punching control system to be punched out by push shaft;
Punching module, connect with main control module, for being punched out operation to smart card by formed punch;
Test module is connect with main control module, for carrying out test operation to smart card circuitry plate by test circuit;
Display module is connect with main control module, the punching for the smart card module manufacture by display display measurement
Pore size data.
Further, the power supply module includes:
DC power supply unit, for providing DC power supply for load;
Alternating Current Power Supply unit, for providing AC power source for load.
Further, the DC power supply unit is provided with DC supply input, the DC supply input it is just defeated
Enter end to connect with the input terminal of direct current conversion chip, negative input end ground connection.
Further, the Alternating Current Power Supply unit includes for providing the first power output end and use of supply voltage for load
In the second source output end for generating high level signal, second source output end is connect with DC power supply unit, is direct current supply
Unit power supply.
Further, the main control module includes:
Processing unit, for carrying out processing analysis to data information;
Acquisition unit is fed back for receiving the operating parameters of each controlled device, and by result to processing unit;
Communication unit is connect with each controlled device, for being communicated between single-chip microcontroller and each controlled device;
Control unit, for generating control instruction according to data parameters.
Further, the display module includes:
Display control unit, for being set by display screen to control parameter;
Data display unit, for being shown by operating parameters of the display screen to each controlled device.
Another object of the present invention is to provide the punching control methods that smart card module manufacture is used for described in a kind of application
Intelligent information card.
Advantages of the present invention and good effect are as follows: the present invention can quickly calculate measured hole by aperture measurement module
Tolerance, computational accuracy reaches micron order;The mesh of accurate measurement is realized by simple device and the measuring probe of general precision
, mechanical mechanism is stablized, and repeatable accuracy is high, the accuracy of measurement is improved, so that reaching reduces cost;Meanwhile passing through test
Module is using the consistent test laminate of quantity for being set to smart card circuitry plate via hole to be tested, thus analog intelligence
Different layers in energy card circuit board, to obtain the electrical performance data between different layers;Test equipment can be used to connect described in two
Instrument connection forms a circuit since instrument connection is electrically connected with the conductive sheet, thus analog smart card circuitry plate, test
To the proof voltage energy of each layer of smart card circuitry plate.
Detailed description of the invention
Fig. 1 is the punching control system architecture schematic diagram provided in an embodiment of the present invention for smart card module manufacture;
In figure: 1, power supply module;2, inside diameter measurement module;3, main control module;4, fuel oil supply unit;5, drive module;6, it pushes away
Dynamic model block;7, punching module;8, test module;9, display module.
Fig. 2 is inside diameter measurement module measuring method flow chart provided in an embodiment of the present invention.
Fig. 3 is test module test method flow chart provided in an embodiment of the present invention.
Specific embodiment
In order to further understand the content, features and effects of the present invention, the following examples are hereby given, and cooperate attached drawing
Detailed description are as follows.
In view of the problems of the existing technology, the present invention provides a kind of punchings for smart card module manufacture to control system
System and method, are with reference to the accompanying drawing explained in detail the present invention.
As shown in Figure 1, the punching control system provided in an embodiment of the present invention for smart card module manufacture includes: power supply
Module 1, inside diameter measurement module 2, main control module 3, fuel oil supply unit 4, drive module 5, push module 6, punching module 7, test mould
Block 8, display module 9.
Power supply module 1 is connect with main control module 3, for the punching control system power supply to manufacture for smart card module;
Inside diameter measurement module 2 is connect with main control module 3, for measuring rushing for smart card module manufacture by measuring device
Hole pore size data;
Main control module 3, with power supply module 1, inside diameter measurement module 2, fuel oil supply unit 4, drive module 5, push module 6, punching
Hole module 7, test module 8, display module 9 connect, and work normally for controlling modules by single-chip microcontroller;
Fuel oil supply unit 4 is connect with main control module 3, for being punching control system fuel feeding by oil cylinder;
Drive module 5 is connect with main control module 3, for driving the associated mechanisms of punching control system by hydraulic pump;
Push module 6 is connect with main control module 3, for pushing the formed punch of punching control system to be punched out by push shaft;
Punching module 7 is connect with main control module 3, for being punched out operation to smart card by formed punch;
Test module 8 is connect with main control module 3, for carrying out test operation to smart card circuitry plate by test circuit;
Display module 9 is connect with main control module 3, for rushing for the smart card module manufacture by display display measurement
Hole pore size data.
As shown in Fig. 2, 2 measurement method of inside diameter measurement module provided by the invention is as follows:
S201 sets zero shift point by zero reference hole and taper measuring head, sets the shift value of zero shift point as L1;
S202, traverse measurement head are inserted into measuring head in measured hole and contact with measured hole, measured by measuring probe
The shift value of measuring head is L2;
S203 calculates the relative displacement of measuring head, it may be assumed that L3=L2—L1, wherein L3It is measuring head with respect to zero reference
The relative displacement in hole;
S204 calculates the tolerance value in measured hole aperture, it may be assumed that α=L3× K, wherein α is tolerance value, and K is the cone of measuring head
Degree.
As shown in figure 3,8 test method of test module provided by the invention is as follows:
The hole count phase with the via hole is made according to the hole count of via hole to be tested on smart card circuitry plate in S301
It with the test laminate of quantity, and is each described test layer plate mark;
S302 opens up instrument connection corresponding with the hole count of the via hole on each described test laminate;
S303, installs conductive sheet on each described test laminate, and according to the label, by the conductive sheet with it is right
The instrument connection of the via hole is answered to be electrically connected;
Test laminate is successively folded and sets to form test sample plate by S304, wherein multiple described in multiple test laminates
Conductive sheet is electrically connected, and the instrument connection of the same via hole of correspondence on multiple test laminates corresponds;
S305, the instrument connection being electrically connected on the different test laminates, obtains corresponding voltage data.
Further, the power supply module includes:
DC power supply unit, for providing DC power supply for load;
Alternating Current Power Supply unit, for providing AC power source for load.
Further, the DC power supply unit is provided with DC supply input, the DC supply input it is just defeated
Enter end to connect with the input terminal of direct current conversion chip, negative input end ground connection.
Further, the Alternating Current Power Supply unit includes for providing the first power output end and use of supply voltage for load
In the second source output end for generating high level signal, second source output end is connect with DC power supply unit, is direct current supply
Unit power supply.
Further, the main control module includes:
Processing unit, for carrying out processing analysis to data information;
Acquisition unit is fed back for receiving the operating parameters of each controlled device, and by result to processing unit;
Communication unit is connect with each controlled device, for being communicated between single-chip microcontroller and each controlled device;
Control unit, for generating control instruction according to data parameters.
Further, the display module includes:
Display control unit, for being set by display screen to control parameter;
Data display unit, for being shown by operating parameters of the display screen to each controlled device.
When the invention works, firstly, being that the punching control system manufactured for smart card module supplies by power supply module 1
Electricity;The punching pore size data of smart card module manufacture is measured using measuring device by aperture measurement module 2;Secondly, master control mould
Block 3 is punching control system fuel feeding using oil cylinder by fuel oil supply unit 4;Punching control is driven using hydraulic pump by drive module 5
The associated mechanisms of system processed;The formed punch of punching control system is pushed to be punched out using push shaft by push module 6;Pass through punching
Module 7 is punched out operation to smart card using formed punch;Then, utilize test circuit to smart card circuitry by test module 8
Plate carries out test operation;Finally, utilizing the punching aperture of the smart card module manufacture of display display measurement by display module 9
Data.
The above is only the preferred embodiments of the present invention, and is not intended to limit the present invention in any form,
Any simple modification made to the above embodiment according to the technical essence of the invention, equivalent variations and modification, belong to
In the range of technical solution of the present invention.
Claims (10)
1. a kind of punching control method for smart card module manufacture, which is characterized in that described to be manufactured for smart card module
Punching control method include:
The first step is that the punching control system manufactured for smart card module is powered by power supply module;Inside diameter measurement module benefit
The punching pore size data manufactured with measuring device measurement smart card module;
Second step, main control module are punching control system fuel feeding using oil cylinder by fuel oil supply unit;Liquid is utilized by drive module
The associated mechanisms of press pump driving punching control system;The formed punch of punching control system is pushed to carry out using push shaft by push module
Punching;Operation is punched out to smart card using formed punch by punching module;
Third step carries out test operation to smart card circuitry plate by test module;
4th step utilizes the punching pore size data of the smart card module manufacture of display display measurement by display module.
2. the punching control method for smart card module manufacture as described in claim 1, which is characterized in that described to be used for intelligence
The bore diameter measuring method of the punching control method of energy card module manufacture is as follows:
(1) zero shift point is set by zero reference hole and taper measuring head, sets the shift value of zero shift point as L1;
(2) traverse measurement head is inserted into measuring head in measured hole and contacts with measured hole, measures measuring head by measuring probe
Shift value be L2;
(3) relative displacement of measuring head is calculated, it may be assumed that L3=L2—L1, wherein L3It is opposite with respect to zero-bit datum hole for measuring head
Shift value;
(4) tolerance value in measured hole aperture is calculated, it may be assumed that α=L3× K, wherein α is tolerance value, and K is the taper of measuring head.
3. the punching control method for smart card module manufacture as described in claim 1, which is characterized in that described to be used for intelligence
Can card module manufacture punching control method to smart card circuitry plate carry out test operation method it is as follows:
(1) according to the hole count of via hole to be tested on smart card circuitry plate, quantity identical as the hole count of the via hole is made
Test laminate, and be each described test layer plate mark;
(2) instrument connection corresponding with the hole count of the via hole is opened up on each described test laminate;
(3) conductive sheet is installed on each described test laminate, and according to the label, by the conductive sheet with it is corresponding described in
The instrument connection of via hole is electrically connected;
(4) test laminate is successively folded and sets to form test sample plate, wherein multiple conductive sheets in multiple test laminates
It is electrically connected, and the instrument connection of the same via hole of correspondence on multiple test laminates corresponds;
(5) instrument connection being electrically connected on the different test laminates, obtains corresponding voltage data.
4. being used for smart card module system for the punching control method of smart card module manufacture described in a kind of operation claim 1
The punching control system made, which is characterized in that it is described for smart card module manufacture punching control system include:
Power supply module is connect with main control module, for the punching control system power supply to manufacture for smart card module;
Inside diameter measurement module, connect with main control module, for measuring the punching aperture of smart card module manufacture by measuring device
Data;
Main control module, with power supply module, inside diameter measurement module, fuel oil supply unit, drive module, push module, punching module, test
Module, display module connection, work normally for controlling modules by single-chip microcontroller;
Fuel oil supply unit is connect with main control module, for being punching control system fuel feeding by oil cylinder;
Drive module is connect with main control module, for driving the associated mechanisms of punching control system by hydraulic pump;
Push module is connect with main control module, for pushing the formed punch of punching control system to be punched out by push shaft;
Punching module, connect with main control module, for being punched out operation to smart card by formed punch;
Test module is connect with main control module, for carrying out test operation to smart card circuitry plate by test circuit;
Display module is connect with main control module, the punching aperture for the smart card module manufacture by display display measurement
Data.
5. the punching control system for smart card module manufacture as claimed in claim 4, which is characterized in that the power supply mould
Block includes:
DC power supply unit, for providing DC power supply for load;
Alternating Current Power Supply unit, for providing AC power source for load.
6. the punching control system for smart card module manufacture as claimed in claim 5, which is characterized in that the direct current supplies
Electric unit is provided with DC supply input, the positive input terminal of the DC supply input and the input terminal of direct current conversion chip
Connection, negative input end ground connection.
7. the punching control system for smart card module manufacture as claimed in claim 5, which is characterized in that the exchange supplies
Electric unit includes the first power output end for providing supply voltage for load and the second electricity for generating high level signal
Source output terminal, second source output end are connect with DC power supply unit, are powered for DC power supply unit.
8. the punching control system for smart card module manufacture as claimed in claim 4, which is characterized in that the master control mould
Block includes:
Processing unit, for carrying out processing analysis to data information;
Acquisition unit is fed back for receiving the operating parameters of each controlled device, and by result to processing unit;
Communication unit is connect with each controlled device, for being communicated between single-chip microcontroller and each controlled device;
Control unit, for generating control instruction according to data parameters.
9. the punching control system for smart card module manufacture as claimed in claim 4, which is characterized in that the display mould
Block includes:
Display control unit, for being set by display screen to control parameter;
Data display unit, for being shown by operating parameters of the display screen to each controlled device.
10. a kind of intelligence using the punching control method for being used for smart card module manufacture described in claims 1 to 3 any one
Release.
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CN201910653714.5A CN110411400A (en) | 2019-07-19 | 2019-07-19 | A kind of punching control system and method for smart card module manufacture |
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CN201910653714.5A CN110411400A (en) | 2019-07-19 | 2019-07-19 | A kind of punching control system and method for smart card module manufacture |
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Cited By (1)
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CN114296368A (en) * | 2021-11-19 | 2022-04-08 | 上海西埃实业有限公司 | Flexible punching shear hole control system |
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