CN208400885U - A kind of conduction LED substrate semi-flexible, LED component - Google Patents
A kind of conduction LED substrate semi-flexible, LED component Download PDFInfo
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- CN208400885U CN208400885U CN201820852834.9U CN201820852834U CN208400885U CN 208400885 U CN208400885 U CN 208400885U CN 201820852834 U CN201820852834 U CN 201820852834U CN 208400885 U CN208400885 U CN 208400885U
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Abstract
The utility model discloses a kind of conduction LED substrate semi-flexible, LED component.Wherein, conductive LED substrate semi-flexible, including flexible layer；Circuit on flexible layer is set；Die bond region on circuit is set；It is arranged on die bond region, for welding the tin paste layer of LED chip；Positioned at the flexible layer back side, and the rigid layer immediately below tin paste layer is set.At the back side of flexible layer and the underface of tin paste layer, one layer of rigid layer is set; for protecting the LED chip being welded on tin paste layer; reduce the probability that LED chip and substrate snap; reduce LED chip damage; to improve the reliability of LED component, while meeting the needs of market images curved surface illumination and curved surface.
Description
Technical field
The utility model relates to LED technology field more particularly to a kind of conduction LED substrate semi-flexible, LED device
Part.
Background technique
LED (Light Emitting Diode, light emitting diode) be it is a kind of using Carrier recombination when release energy shape
At luminous semiconductor devices, LED chip is with power consumption is low, coloration is pure, the service life is long, small in size, the response time is fast, energy conservation and environmental protection
Equal many advantages.
With the continuous maturation of LED technology, will be used wider and wider for LED is general.LED is in addition to replacing conventional illumination sources
In addition, it also constantly applies in fields such as VR/AR equipment, indoor large-screen display, smart phone, plates.These fields are to LED song
The demand of face imaging is continuously increased；Meanwhile LED is when making the special applications such as ornament lamp, also requires LED curved surface is made and shines
Light source.
Existing curved surface light source and curved surface imaging LED device are packaged using Grazing condition substrate, that is, by Grazing condition base
Plate is carrying out welding encapsulation with LED chip.
Existing Grazing condition substrate is inevitably snapped after bend repeatedly or LED chip damage, thus
Cause LED chip poor contact or dead lamp, is unable to satisfy the requirement of curved surface imaging and curved surface lighting area.
Summary of the invention
Technical problem to be solved by the utility model is to provide a kind of conduction LED substrate semi-flexible, for encapsulating
LED chip, substrate are not easy to snap with LED chip, meet the requirement of curved surface imaging with curved surface illumination.
Technical problem to be solved by the utility model is to provide a kind of LED components, using conductive LED base semi-flexible
Plate meets the requirement of curved surface imaging with curved surface illumination.
In order to solve the above-mentioned technical problem, the utility model provides a kind of conduction LED substrate semi-flexible, comprising:
Flexible layer；
Circuit on flexible layer is set；
Die bond region on circuit is set；
It is arranged on die bond region, for welding the tin paste layer of LED chip；
Positioned at the flexible layer back side, and the rigid layer immediately below tin paste layer is set.
As an improvement of the above scheme, the area of the rigid layer is greater than the area of LED chip, and is less than the face of flexible layer
Product.
As an improvement of the above scheme, the thickness of the rigid layer is greater than 1mm.
As an improvement of the above scheme, the rigid layer is made of rigid high-temperature insulation material.
As an improvement of the above scheme, the flexible layer with a thickness of 0.01-0.1mm.
As an improvement of the above scheme, the flexible layer is made of flexible insulation material.
As an improvement of the above scheme, the circuit is to prolong volt circuit, etched circuit or copper plating circuit.
As an improvement of the above scheme, the tin paste layer is made of metal.
Correspondingly, the utility model additionally provides a kind of production method of conduction LED substrate semi-flexible, including any of the above-described
The conductive LED substrate semi-flexible of item and LED chip, wherein LED chip is welded on tin paste layer.
Implement the utility model, has the following beneficial effects:
The utility model provides a kind of conduction LED substrate semi-flexible, in the back side of flexible layer and the underface of tin paste layer
One layer of rigid layer is set, for protecting the LED chip being welded on tin paste layer, reduces the probability that LED chip and substrate snap, subtracts
Few LED chip damage to improve the reliability of LED component, while meeting market to the need of curved surface illumination and curved surface imaging
It asks.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the conductive LED substrate semi-flexible of the utility model；
Fig. 2 is the production flow diagram of the conductive LED substrate semi-flexible of the utility model.
Specific embodiment
It is practical new to this below in conjunction with attached drawing to keep the purpose of this utility model, technical solution and advantage clearer
Type is described in further detail.
Referring to Fig. 1, the utility model provides a kind of conduction LED substrate semi-flexible, comprising: flexible layer 1, circuit 2, die bond
Region, tin paste layer 3 and rigid layer 4.
Bottom of the flexible layer 1 as substrate, needs to be formed on the structures such as circuit, plays a part of load-bearing, in addition, being
It can be bent, the thickness of flexible layer 1 is preferably 0.01-0.1mm.When the thickness of flexible layer 1 is less than 0.01mm, flexible layer
1 is easy to be bent, and LED chip and substrate is caused to snap or damage LED chip.When the thickness of flexible layer 1 is greater than 1mm,
Not only increase cost, also reduces the bending angle of flexible layer.Wherein, need to make circuit 1 on flexible layer 1, therefore, flexible layer 1
It must be made of insulating material.Preferably, flexible layer 1 is made of flexible insulating material.
The surface of flexible layer 1 is arranged in the circuit 2.Wherein, circuit 2 is for controlling LED chip, and the application is to circuit 2
Structure be not especially limited, with specific reference to actual requirement.Preferably, circuit 2 is to prolong volt circuit, etched circuit or copper facing electricity
Road.
The circuit 2 is equipped with die bond region.Wherein, die bond region is the region that connection is formed with LED chip.In addition,
Non- die bond region is additionally provided on circuit 2.
The tin paste layer 3 is arranged on die bond region, for welding LED chip.Wherein, tin paste layer 3 is made of metal, main
LED chip is fixed on die bond region, and is formed and is conductively connected with circuit 2.Preferably, tin paste layer 3 is made of metal.
The back side of flexible layer 1 is arranged in the rigid layer 4, and is located at immediately below tin paste layer 3.Wherein, rigid layer 4 is
Continuous bent flexible layer 1 is separated next, so that flexible layer 1 can not connect bending, but the bending of monolith substrate is not influenced.
And the underface of tin paste layer 3 is arranged in rigid layer 4, for protecting the LED chip being welded on tin paste layer 3.Specifically, in substrate
When bending, since rigid layer 4 is not bent, LED chip can be close with the tin paste layer 3 right above rigid layer 4
Welding together, LED chip is snapped or damaging without should be substrate bending, to improve the reliable of LED component
Property, while meeting the needs of market images curved surface illumination and curved surface.
In order to reduce the probability that LED chip and substrate snap, the damage of LED chip is reduced, the area of rigid layer 4 is big
In the area of LED chip, and it is less than the area of flexible layer 1.Preferably, the thickness of rigid layer 4 is greater than 1mm.Due to rigid layer 4
Area is small, and when the thickness of rigid layer 4 is less than 1mm, rigid layer 4 can be bent with the bending of substrate, therefore cannot protect LED
Chip.The application to the upper limit of 4 thickness of rigid layer make it is specific limit, according to the needs in different application field, rigid layer 4
Thickness is designed according to actual requirement.
When LED chip is welded on tin paste layer 3, the temperature of welding is up to 280 DEG C, in order to guarantee that rigid layer 4 does not become
Shape, rigid layer 4 are preferably made of rigid high-temperature insulation material.
Fig. 2 is a kind of production flow diagram of conduction LED substrate semi-flexible of the utility model, a kind of conduction of the utility model
The production method of LED substrate semi-flexible, comprising the following steps:
S101: flexible layer is provided.
Bottom of the flexible layer as substrate, needs to be formed on the structures such as circuit, plays a part of load-bearing, in addition, being
It can be bent, the thickness of flexible layer is preferably 0.01-0.1mm.When the thickness of flexible layer is less than 0.01mm, flexible layer holds
It is easily bent, LED chip and substrate is caused to snap or damage LED chip.When the thickness of flexible layer is greater than 1mm, not only
Increase cost, also reduces the bending angle of flexible layer.Wherein, it needs to make circuit 1 on flexible layer, therefore, flexible layer must be by
Insulating materials is made.
S102: circuit is made in flexible layer surface.
The surface of flexible layer is arranged in the circuit.Wherein, circuit is for controlling LED chip, knot of the application to circuit
Structure is not especially limited, with specific reference to actual requirement.Preferably, circuit is to prolong volt circuit, etched circuit or copper plating circuit.
S103: die bond region is set in circuit surface.
Die bond region is the region that connection is formed with LED chip.In addition, being additionally provided with non-die bond region on circuit.
S104: tin paste layer is formed in die bond region surface, wherein tin paste layer is for welding LED chip.
The tin paste layer is arranged on die bond region, for welding LED chip.Wherein, tin paste layer is made of metal, mainly
LED chip is fixed on die bond region, and is formed and is conductively connected with circuit.
S105: rigid layer is formed at the flexible layer back side, and the rigid layer is located at the underface of tin paste layer.
The back side of flexible layer is arranged in the rigid layer, and is located at immediately below tin paste layer.Wherein, rigid layer only will even
It is separated next to continue bent flexible layer, so that flexible layer can not connect bending, but does not influence the bending of monolith substrate.And rigidity
The underface of tin paste layer is arranged in layer, for protecting the LED chip being welded on tin paste layer.Specifically, when substrate is bent
It waits, since rigid layer is not bent, LED chip can closely weld together with the tin paste layer being located at right above rigid layer,
LED chip is snapped or being damaged without should be substrate bending, to improve the reliability of LED component, being met simultaneously
Market is illuminated to curved surface and the demand of curved surface imaging.
In order to reduce the probability that LED chip and substrate snap, the damage of LED chip is reduced, the area of rigid layer is big
In the area of LED chip, and it is less than the area of flexible layer.Preferably, the thickness of rigid layer is greater than 1mm.Due to the face of rigid layer
Product is small, and when the thickness of rigid layer is less than 1mm, rigid layer can be bent with the bending of substrate, therefore cannot protect LED core
Piece.The application does not make specific restriction to the upper limit of rigid layer thickness, according to the needs in different application field, the thickness of rigid layer
It is designed according to actual requirement.
When LED chip is welded on tin paste layer, the temperature of welding is up to 280 DEG C, in order to guarantee that rigid layer does not deform,
Rigid layer is preferably made of high-temperature insulation material.
The utility model additionally provides a kind of LED component, including the conductive LED substrate semi-flexible of any of the above-described and LED core
Piece, wherein LED chip is welded on tin paste layer.
The utility model is further described with specific embodiment below
Embodiment 1
A kind of LED component, including conductive LED substrate semi-flexible and flip LED chips, conductive LED substrate semi-flexible include
Flexible layer, the circuit being arranged on flexible layer, the die bond region being arranged on circuit, the tin paste layer being arranged in fixed area and
Rigid layer, the LED chip are arranged on tin paste layer, wherein flexible layer with a thickness of 0.1mm, circuit is to prolong volt circuit, rigidity
The back side of flexible layer is arranged in layer, and is located at the underface of tin paste layer, and the area of the rigid layer is greater than LED chip area 1%,
Rigid layer with a thickness of 1mm.
Embodiment 2
A kind of LED component, including conductive LED substrate semi-flexible and flip LED chips, conductive LED substrate semi-flexible include
Flexible layer, the circuit being arranged on flexible layer, the die bond region being arranged on circuit, the tin paste layer being arranged in fixed area and
Rigid layer, the LED chip are arranged on tin paste layer, wherein flexible layer with a thickness of 0.3mm, circuit is etched circuit, rigidity
The back side of flexible layer is arranged in layer, and is located at the underface of tin paste layer, and the area of the rigid layer is greater than LED chip area
1.5%, rigid layer with a thickness of 1.8mm.
Embodiment 3
A kind of LED component, including conductive LED substrate semi-flexible and flip LED chips, conductive LED substrate semi-flexible include
Flexible layer, the circuit being arranged on flexible layer, the die bond region being arranged on circuit, the tin paste layer being arranged in fixed area and
Rigid layer, the LED chip are arranged on tin paste layer, wherein flexible layer with a thickness of 0.6mm, circuit is copper plating circuit, rigidity
The back side of flexible layer is arranged in layer, and is located at the underface of tin paste layer, and the area of the rigid layer is greater than LED chip area 2%,
Rigid layer with a thickness of 2.5mm.
Embodiment 4
A kind of LED component, including conductive LED substrate semi-flexible and flip LED chips, conductive LED substrate semi-flexible include
Flexible layer, the circuit being arranged on flexible layer, the die bond region being arranged on circuit, the tin paste layer being arranged in fixed area and
Rigid layer, the LED chip are arranged on tin paste layer, wherein flexible layer with a thickness of 0.8mm, circuit is copper plating circuit, rigidity
The back side of flexible layer is arranged in layer, and is located at the underface of tin paste layer, and the area of the rigid layer is greater than LED chip area
2.5%, rigid layer with a thickness of 3mm.
Comparative example 1
A kind of LED component, including flexible base board and flip LED chips, wherein flip LED chips are welded on flexible base board
On.
LED component each 100 for choosing embodiment 1-4 and comparative example 1 are tested, test content are as follows: connect LED component
Continuous to carry out 100 bendings, bending angle is 30 degree.As a result as follows:
As can be known from the above table, compared with existing flexible base board, the conduction LED substrate semi-flexible of the utility model, Ji Keman
The requirement of sufficient curved surface imaging and curved surface illumination, and guarantee the yield of LED component, improve the reliability of LED component.
Above disclosed is only a kind of preferred embodiment of the utility model, certainly cannot be practical to limit with this
Novel interest field, therefore equivalent variations made according to the claim of the utility model still belong to what the utility model was covered
Range.
Claims (9)
1. a kind of conduction LED substrate semi-flexible, comprising:
Flexible layer；
Circuit on flexible layer is set；
Die bond region on circuit is set；
It is arranged on die bond region, for welding the tin paste layer of LED chip；
Positioned at the flexible layer back side, and the rigid layer immediately below tin paste layer is set.
2. conductive LED substrate semi-flexible as described in claim 1, which is characterized in that the area of the rigid layer is greater than LED core
The area of piece, and it is less than the area of flexible layer.
3. conductive LED substrate semi-flexible as described in claim 1, which is characterized in that the thickness of the rigid layer is greater than 1mm.
4. conductive LED substrate semi-flexible as described in claim 1, which is characterized in that the rigid layer is exhausted by rigid high temperature resistant
Edge material is made.
5. LED substrate semi-flexible as described in claim 1 conductive, which is characterized in that the flexible layer with a thickness of 0.01-
0.1mm。
6. conductive LED substrate semi-flexible as described in claim 1, which is characterized in that the flexible layer is by flexible insulating material
It is made.
7. conductive LED substrate semi-flexible as described in claim 1, which is characterized in that the circuit is to prolong volt circuit, etching electricity
Road or copper plating circuit.
8. conductive LED substrate semi-flexible as described in claim 1, which is characterized in that the tin paste layer is made of metal.
9. a kind of LED component, which is characterized in that including the conductive LED substrate semi-flexible of any one of claim 1-8 and LED chip,
Wherein, LED chip is welded on tin paste layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820852834.9U CN208400885U (en) | 2018-06-04 | 2018-06-04 | A kind of conduction LED substrate semi-flexible, LED component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820852834.9U CN208400885U (en) | 2018-06-04 | 2018-06-04 | A kind of conduction LED substrate semi-flexible, LED component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208400885U true CN208400885U (en) | 2019-01-18 |
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| CN201820852834.9U Active CN208400885U (en) | 2018-06-04 | 2018-06-04 | A kind of conduction LED substrate semi-flexible, LED component |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108550686A (en) * | 2018-06-04 | 2018-09-18 | 佛山市国星半导体技术有限公司 | A kind of conduction semi-flexible LED substrate and preparation method thereof, LED component |
-
2018
- 2018-06-04 CN CN201820852834.9U patent/CN208400885U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108550686A (en) * | 2018-06-04 | 2018-09-18 | 佛山市国星半导体技术有限公司 | A kind of conduction semi-flexible LED substrate and preparation method thereof, LED component |
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