CN103700758A - LED (Light-emitting Diode) package unit, package methods thereof, and array area light source - Google Patents
LED (Light-emitting Diode) package unit, package methods thereof, and array area light source Download PDFInfo
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- CN103700758A CN103700758A CN201310689080.1A CN201310689080A CN103700758A CN 103700758 A CN103700758 A CN 103700758A CN 201310689080 A CN201310689080 A CN 201310689080A CN 103700758 A CN103700758 A CN 103700758A
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- 238000004519 manufacturing process Methods 0.000 claims abstract description 34
- 239000000758 substrate Substances 0.000 claims description 108
- 238000005538 encapsulation Methods 0.000 claims description 44
- 238000012856 packing Methods 0.000 claims description 27
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 10
- 239000003153 chemical reaction reagent Substances 0.000 claims description 7
- 208000002925 dental caries Diseases 0.000 claims description 5
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- 238000009434 installation Methods 0.000 claims description 4
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to an LED (Light-emitting Diode) package unit, package methods thereof, and an array area light source. The LED package unit comprises an LED chip, a base plate for installing the LED chip, an optical thin film covering on the LED chip and a reflective layer, and a scattering component for uniformly scattering light emitted by the LED chip, wherein the base plate is covered with the reflective layer on an end face for installing the LED chip; a reflective piece is arranged at a position of the optical thin film along a vertical upper surface, corresponding to the LED chip; compared with an edge LED light guiding module, components such as a light guiding plate and a diffusion plate are omitted, so that the cost for manufacturing an area light source by utilizing the LED chip is effectively reduced. The invention also provides the array area light source, batch production is convenient, and the cost is reduced. The invention also provides two LED package methods, and through utilization of the LED package unit manufactured by the two methods, the cost for manufacturing the area light source by utilizing the LED light source can be effectively reduced.
Description
Technical field
The present invention relates to technical field of semiconductor illumination, relate in particular to a kind of LED encapsulation unit and method for packing thereof and array surface light source.
Background technology
LED light source has the advantages such as life-span length, power saving, is therefore applied to more and more lighting field.
As everyone knows, LED light source point-source of light normally.At present LED light source being converted into the mode that area source mainly takes by point-source of light is to utilize light guide plate scattering principle that LED light source is made to area source.Its concrete structure comprises: adopt metal material to make framework, the LED lamp bar that is provided as incident light source along the inner side of frame side wall (wherein can all arrange LED lamp bar in the inner side of four sidewalls of framework, the inner side of two sidewalls that also can be relative on framework arranges LED lamp bar), and in framework inner side, light-emitting area this three part substantially vertical with this incident light source is set.Wherein light-emitting area is by order to reflect the meal mating plate of the light that LED lamp bar sends and to form in order to change and to conduct the light guide plate of the light that LED lamp bar sends and diffuser plate etc.Form the light that LED lamp bar is sent and change into the brightness side entering type leaded light module of area source comparatively uniformly.
But above-mentioned side entering type leaded light module needs the members such as light guide plate, diffuser plate, reflector are set during fabrication, and it has increased the manufacturing cost of LED light source being made to area source greatly.
Summary of the invention
For above-mentioned deficiency of the prior art, the object of the present invention is to provide a kind of LED encapsulation unit, it has reduced the cost that utilizes LED light source to manufacture area source effectively.
The object of the present invention is to provide a kind of LED method for packing, utilize the LED encapsulation unit that the method produces can effectively reduce the cost that utilizes LED light source to manufacture area source.
The object of the present invention is to provide a kind of array surface light source, it has reduced the cost that utilizes LED light source to manufacture area source effectively.
A kind of LED encapsulation unit provided by the invention, comprising:
LED chip,
For the substrate of described LED chip is installed, described substrate is coated with reflector layer on the end face that described LED chip is installed,
Cover the optical thin film on described LED chip and described reflector layer, at described optical thin film, along corresponding described LED chip place on vertical upper surface, be provided with reflecting piece, and,
Scattering member for the even scattering of light that described LED chip is sent.
Optionally, on described optical thin film, corresponding described LED chip place is formed with the cavity along vertical perforation, and described reflecting piece is covered in described cavity along vertical one end, and described LED chip is positioned at the inside of described cavity;
In described cavity, be filled with phosphor gel.
Optionally, described scattering member is to be arranged on described optical thin film along a plurality of blind holes on vertical upper surface.
Optionally, described blind hole is shaped as any one or more combination in cylinder, truncated cone, square and cuboid.
Optionally, described LED chip formal dress or upside-down mounting are on described substrate.
Optionally, described substrate is a kind of in soft base plate or metal substrate or ceramic substrate;
Described soft base plate is followed successively by circuit layer, dielectric layer and the metal level for being electrically connected to described LED chip from top to bottom.
A kind of array surface light source provided by the invention, comprises a plurality of above-mentioned LED encapsulation units, and a plurality of described LED encapsulation units become array to distribute and form a face array.
A kind of LED method for packing provided by the invention, comprising:
Manufacture substrate;
Reflector layer is covered to described substrate for the end face of LED chip is installed;
Described LED chip is arranged on described substrate;
Optical thin film is covered on described LED chip and described reflector layer, described optical thin film solidify and at described optical thin film along forming blind hole on vertical upper surface;
The position of the corresponding described LED chip of reflecting piece is covered to described optical thin film along on vertical upper surface.
Optionally, described optical thin film is covered on described LED chip and described reflector layer, described optical thin film solidify and at described optical thin film along forming blind hole on vertical upper surface, be specially:
Described optical thin film is covered on described LED chip and described reflector layer;
Before described optical thin film solidifies, by mould at described optical thin film along forming blind hole on vertical upper surface.
Optionally, described optical thin film is covered on described LED chip and described reflector layer, described optical thin film solidify and at described optical thin film along forming blind hole on vertical upper surface, be specially:
Described optical thin film is covered on described LED chip and described reflector layer;
After described optical thin film solidifies, by laser or chemical reagent at described optical thin film along forming blind hole on vertical upper surface.
Optionally, described described LED chip is installed on described substrate, is specially:
Described LED chip formal dress installation or upside-down mounting are arranged on described substrate.
Optionally, described described LED chip be arranged on described substrate and comprised:
A plurality of described LED chips are arranged on described substrate.
A kind of LED method for packing provided by the invention, comprising:
Manufacture substrate;
Reflector layer is covered to described substrate for the end face of LED chip is installed;
Optical thin film is covered on described reflector layer, described optical thin film solidify and at described optical thin film along forming blind hole on vertical upper surface, and the corresponding described LED chip place of installing forms the cavity along vertical perforation on described optical thin film;
Described LED chip is placed in described cavity and is arranged on described substrate;
Phosphor gel is coated in described cavity and is solidified, and described LED chip is covered;
The position of the corresponding described LED chip of reflecting piece is covered to described optical thin film along on vertical upper surface, and described cavity is covered.
Optionally, described optical thin film is covered on described reflector layer, described optical thin film solidify and at described optical thin film along forming blind hole on vertical upper surface, and on described optical thin film, the corresponding described LED chip place of installing forms the cavity along vertical perforation, is specially:
Described optical thin film is covered on described reflector layer;
Before described optical thin film solidifies, by mould at described optical thin film along forming blind hole on vertical upper surface, and the corresponding described LED chip place of installing forms the cavity along vertical perforation on described optical thin film.
Optionally, described optical thin film is covered on described reflector layer, described optical thin film solidify and at described optical thin film along forming blind hole on vertical upper surface, and on described optical thin film, the corresponding described LED chip place of installing forms the cavity along vertical perforation, is specially:
Described optical thin film is covered on described reflector layer;
After described optical thin film solidifies, by laser or chemical reagent at described optical thin film along forming blind hole on vertical upper surface, and the corresponding described LED chip place of installing forms the cavity along vertical perforation on described optical thin film.
Optionally, described described LED chip be placed in described cavity and be arranged on described substrate, being specially:
Described LED chip is placed in described cavity, and described LED chip formal dress installation or upside-down mounting are arranged on described substrate.
Optionally, described optical thin film is covered on described reflector layer, described optical thin film solidify and at described optical thin film along forming blind hole on vertical upper surface, and the corresponding described LED chip place of installing forms along the cavity of vertical perforation and comprises on described optical thin film:
Optical thin film is covered on described reflector layer, described optical thin film solidify and at described optical thin film along forming blind hole on vertical upper surface, and the corresponding described LED chip place of installing forms a plurality of cavitys along vertical perforation on described optical thin film.
Compared with prior art, LED encapsulation unit provided by the invention, it is by being arranged on LED chip on the substrate that is coated with reflector layer, the light that utilizes reflector layer and reflecting piece that LED chip is sent reflects, the light that simultaneously utilizes scattering member that LED chip is sent reflects and is uniform surface scattering, thereby the point-source of light that LED chip is formed converts area source to; It,, compared to side entering type leaded light module, has saved the members such as light guide plate, diffuser plate, thereby has effectively reduced the cost that utilizes LED light source to manufacture area source.
In further technical scheme, on optical thin film, form the cavity that is perfused with phosphor gel, utilize phosphor gel that LED chip is covered, wrapped up, thereby the light that LED chip is sent convert white light output to.
In further technical scheme, scattering member is to be arranged at optical thin film along a plurality of blind holes on vertical upper surface, controls the light that LED chip sends and is uniform surface scattering, thereby convert the point-source of light of LED chip formation to area source by blind hole.
In further technical scheme, LED chip formal dress, on substrate, is convenient to install setting.
In further technical scheme, LED chip upside-down mounting is on substrate, and compared to LED chip formal dress, on substrate, it can skip routing process, is more convenient to install, and also possesses better heat dispersion simultaneously.
Compared with prior art, array surface light source provided by the invention, its packaging technology is simple, be easy to realize, a plurality of encapsulation units can whole making, and a plurality of encapsulation units form a face array, from LED encapsulation unit, directly send planar light, make design liberalization, the variation of area source; And be convenient to batch production, further reduced manufacturing cost.
Compared with prior art, a kind of LED method for packing provided by the invention, the LED encapsulation unit that utilizes the method to make, it is by being arranged on LED chip on the substrate that is coated with reflector layer, the light that utilizes reflector layer and reflecting piece that LED chip is sent reflects, the light that simultaneously utilizes scattering member that LED chip is sent reflects and is uniform surface scattering, thereby the point-source of light that LED chip is formed converts area source to; It,, compared to side entering type leaded light module, has saved the members such as light guide plate, diffuser plate, thereby has effectively reduced the cost that utilizes LED light source to manufacture area source.
Meanwhile, its packaging technology is simple, is easy to realize, and is convenient to batch production, thereby has further reduced manufacturing cost.
Compared with prior art, another kind of LED method for packing provided by the invention, the LED encapsulation unit that utilizes the method to make, it is by being arranged on LED chip on the substrate that is coated with reflector layer, the light that utilizes reflector layer and reflecting piece that LED chip is sent reflects, the light that simultaneously utilizes scattering member that LED chip is sent reflects and is uniform surface scattering, thereby the point-source of light that LED chip is formed converts area source to; It,, compared to side entering type leaded light module, has saved the members such as light guide plate, diffuser plate, thereby has effectively reduced the cost that utilizes LED light source to manufacture area source.
Meanwhile, its packaging technology is simple, is easy to realize, and is convenient to batch production, thereby has further reduced manufacturing cost.
Above-mentioned technical characterictic can various applicable modes combine or be substituted by equivalent technical characterictic, as long as can reach object of the present invention.
Accompanying drawing explanation
Hereinafter by based on only for the embodiment of indefiniteness and with reference to accompanying drawing, the present invention being described in more detail.Wherein:
The structural representation of LED chip formal dress in the LED encapsulation unit that Fig. 1 provides for the embodiment of the present invention one;
The structural representation of LED chip upside-down mounting in the LED encapsulation unit that Fig. 2 provides for the embodiment of the present invention one;
The procedure structure schematic diagram of the LED method for packing that Fig. 3 to Fig. 7 provides for the embodiment of the present invention three;
The structural representation of the array surface light source that Fig. 8 provides for the embodiment of the present invention four;
The structural representation of LED chip formal dress in the LED encapsulation unit that Fig. 9 provides for the embodiment of the present invention five;
The structural representation of LED chip upside-down mounting in the LED encapsulation unit that Figure 10 provides for the embodiment of the present invention five;
The procedure structure schematic diagram of the LED method for packing that Figure 11 to Figure 17 provides for the embodiment of the present invention seven;
The structural representation of the array surface light source that a plurality of LED encapsulation units that Figure 18 provides for the embodiment of the present invention eight form.
Accompanying drawing explanation:
1-LED chip;
2-substrate; 3-reflector layer;
4-optical thin film, 41-cavity, 42-phosphor gel, 43-blind hole;
5-reflecting piece; 6-mould.
Embodiment
For making the object, technical solutions and advantages of the present invention clearer; to technical scheme of the present invention be carried out to clear, complete description below; embodiment based in the present invention; those of ordinary skills are resulting all other execution modes under the prerequisite of not making creative work, all belong to the scope that the present invention protects.
Before describing embodiment, first the directivity noun occurring in the present invention is done to following restriction:
In LED encapsulation unit, as shown in Figure 1, along substrate 2, be vertical (direction in figure shown in V) stipulated in this patent with the vertical direction of optical thin film 4; Along vertical one end that deviates from substrate 2, being top, is below along vertical one end towards substrate 2.
Embodiment mono-:
As shown in Figure 1, the LED encapsulation unit providing in the present embodiment, comprise: LED chip 1, for the substrate 2 of LED chip 1 is installed, substrate 2 is coated with reflector layer 3 on the end face that LED chip 1 is installed, and covers the optical thin film 4 on LED chip 1 and reflector layer 3, at optical thin film 4, along corresponding LED chip 1 place on vertical upper surface, is provided with reflecting piece 5, and, for the scattering member of the even scattering of light that LED chip 1 is sent.
It is by being arranged on LED chip 1 on the substrate 2 that is coated with reflector layer 3, the light that utilizes reflector layer 3 and reflecting piece 5 that LED chip 1 is sent reflects, the light that simultaneously utilizes scattering member that LED chip 1 is sent reflects and is uniform surface scattering, thereby the point-source of light that LED chip 1 is formed converts area source to; It,, compared to side entering type leaded light module, has saved the members such as light guide plate, diffuser plate, thereby has effectively reduced the cost that utilizes LED light source to manufacture area source.
Wherein, optical thin film 4 can adopt any one or more combination in the light transmissive materials such as silica gel, silicones, epoxy resin, modified epoxy to make.
In the present embodiment, scattering member is to be arranged on optical thin film 4 along a plurality of blind holes 43 of (end face that deviates from substrate 2) on vertical upper surface.Its light sending by blind hole 43 control LED chips 1 is uniform surface scattering, thereby the point-source of light that LED chip 1 is formed converts area source to.Further, blind hole 43 is shaped as any one or more combination in cylinder, truncated cone, square and cuboid.
It should be noted that, the scattering member providing in the present invention is to be arranged on optical thin film 4 along a plurality of blind holes 43 on vertical upper surface.But be understood that scattering member concrete structure is not unique; after reflecting, other light that LED chip 1 can be sent is uniform surface scattering the final scattering member that the point-source of light of LED chip 1 formation is converted to area source output of realizing; be the replacement of simple technical scheme, all should fall into protection scope of the present invention.
In the present embodiment, LED chip 1 formal dress is on substrate 2, as shown in Figure 1.
In the present embodiment, LED chip 1 also can upside-down mounting on substrate 2, as shown in Figure 2.
In the present embodiment, substrate 2 is a kind of in soft base plate 2 or metal substrate 2 or ceramic substrate 2.
Wherein, preferably adopt soft base plate 2, and soft base plate 2 is followed successively by the circuit layer being electrically connected to LED chip 1 from top to bottom, dielectric layer and metal level.Further, on circuit layer, by designing requirement, etch required circuit, but one or both combinations in its circuit connecting mode serial or parallel connection.
Embodiment bis-:
The LED method for packing providing in the present embodiment, comprising:
Step 101, manufacture substrate 2;
Step 102, reflector layer 3 is covered to described substrate 2 for the end face of LED chip 1 is installed;
Step 103, described LED chip 1 is arranged on described substrate 2;
Step 104, optical thin film 4 is covered on described LED chip 1 and described reflector layer 3, described optical thin film 4 solidify and at described optical thin film 4 along forming blind hole 43 on vertical upper surface;
Step 105, the position of the corresponding described LED chip 1 of reflecting piece 5 is covered to described optical thin film 4 along on vertical upper surface.
The LED method for packing that the present embodiment provides, the LED encapsulation unit that utilizes the method to make, it is by being arranged on LED chip 1 on the substrate 2 that is coated with reflector layer 3, the light that utilizes reflector layer 3 and reflecting piece 5 that LED chip 1 is sent reflects, the light that simultaneously utilizes scattering member that LED chip 1 is sent reflects and is uniform surface scattering, thereby the point-source of light that LED chip 1 is formed converts area source to; It,, compared to side entering type leaded light module, has saved the members such as light guide plate, diffuser plate, thereby has effectively reduced the cost that utilizes LED light source to manufacture area source.
Meanwhile, its packaging technology is simple, is easy to realize, and is convenient to batch production, thereby has further reduced manufacturing cost.
Embodiment tri-:
The LED method for packing providing in the present embodiment, comprising:
Step 201, manufacture substrate 2;
Step 202, reflector layer 3 is covered to described substrate 2 for the end face of LED chip 1 is installed;
Step 203, described LED chip 1 is arranged on described substrate 2;
Step 204, described optical thin film 4 is covered on described LED chip 1 and described reflector layer 3;
Step 205, before described optical thin film 4 solidifies, by mould 6 at described optical thin film 4 along forming blind hole 43 on vertical upper surface;
Step 206, the position of the corresponding described LED chip 1 of reflecting piece 5 is covered to described optical thin film 4 along on vertical upper surface.
Wherein, step 204 and step 205 are also replaceable is:
Step 304, described optical thin film 4 is covered on described LED chip 1 and described reflector layer 3;
Step 305, after described optical thin film 4 solidifies, by laser or chemical reagent at described optical thin film 4 along forming blind hole 43 on vertical upper surface.
Wherein, when substrate 2 adopts soft base plate 2, manufacturing substrate 2 comprises: substrate 2, by being divided into circuit layer, dielectric layer and metal level under upper, etches required circuit by designing requirement on circuit layer, but one or both combinations in its circuit connecting mode serial or parallel connection.
Wherein, solidifying in step 205 and step 305 can adopt temperature-curable or photocuring etc.
Wherein, in step 203, described LED chip 1 is arranged on described substrate 2, can adopts LED chip 1 formal dress is installed on substrate 2, detailed process is for being fixedly mounted on LED chip 1 on substrate 2 by die bond, the processes such as glue, routing of putting, it is convenient to install and arranges, can be with reference to shown in figure 3.
Meanwhile, also can adopt LED chip 1 upside-down mounting is installed on substrate 2, detailed process is for process point glue, cure package are on substrate 2, it on substrate 2, can skip routing process compared to LED chip 1 formal dress, is more convenient to install, also possess better heat dispersion simultaneously, can be with reference to shown in figure 7.
For the ease of understanding, the LED method for packing providing in the present embodiment, can be with reference to the procedure structure schematic diagram shown in figure 3 to Fig. 7, concrete:
Step 201 can be with reference to shown in figure 3 to step step 204, and wherein in step 203, LED chip 1 inverted structure can be with reference to shown in figure 7;
Step 205 can be with reference to shown in figure 4;
Step 206 can be with reference to shown in figure 6;
Step 304 and step 305 can be with reference to shown in Fig. 5.
In the present embodiment, for the ease of a plurality of LED encapsulation units are formed to array surface light source, step 201 also can be: a plurality of LED chips 1 are arranged on substrate 2.Concrete structure can be with reference to shown in figure 8.
Need to further illustrate, when a plurality of LED chips 1 are arranged on substrate 2, a plurality of LED chips 1 all formal dress are arranged on substrate 2; In like manner a plurality of LED chips 1 also all upside-down mounting be arranged on substrate 2; Further, a plurality of LED chips 1 can partly take formal dress to install, and part upside-down mounting is installed.Its concrete mounting means needs to determine according to Practical manufacturing process and design, but all should fall into protection scope of the present invention.
Embodiment tetra-:
As shown in Figure 8, the array surface light source providing in the present embodiment, comprises the LED encapsulation unit described in any one in a plurality of above-described embodiments one, and a plurality of LED encapsulation units become array to distribute and form a face array.
Its packaging technology is simple, is easy to realize, and a plurality of encapsulation units can whole making, and a plurality of encapsulation units form a face array, from LED encapsulation unit, directly send planar light, make design liberalization, the variation of area source; And be convenient to batch production, further reduced manufacturing cost.
Embodiment five:
As shown in Figure 9, the LED encapsulation unit providing in the present embodiment, comprise: LED chip 1, for the substrate 2 of LED chip 1 is installed, substrate 2 is coated with reflector layer 3 on the end face that LED chip 1 is installed, and covers the optical thin film 4 on LED chip 1 and reflector layer 3, at optical thin film 4, along corresponding LED chip 1 place on vertical upper surface, is provided with reflecting piece 5, and, for the scattering member of the even scattering of light that LED chip 1 is sent.
It is by being arranged on LED chip 1 on the substrate 2 that is coated with reflector layer 3, the light that utilizes reflector layer 3 and reflecting piece 5 that LED chip 1 is sent reflects, the light that simultaneously utilizes scattering member that LED chip 1 is sent reflects and is uniform surface scattering, thereby the point-source of light that LED chip 1 is formed converts area source to; It,, compared to side entering type leaded light module, has saved the members such as light guide plate, diffuser plate, thereby has effectively reduced the cost that utilizes LED light source to manufacture area source.
Wherein, optical thin film 4 can adopt any one or more combination in the light transmissive materials such as silica gel, silicones, epoxy resin, modified epoxy to make.
In the present embodiment, (such as blue, green, red etc.) only with certain color of self sending due to LED chip 1, and LED chip 1 application at present more be white light.For this reason, can on optical thin film 4, be formed with the cavity 41 along vertical perforation in corresponding LED chip 1 place, reflecting piece 5 is covered in cavity 41 along vertical one end, and LED chip 1 is positioned at the inside of cavity 41; In cavity 41, be filled with phosphor gel 42.After converting white light to, sends again its colored light LED chip 1 being sent by phosphor gel 42.
It should be noted that, phosphor gel 42 should be filled cavity 41 to expire and cover on LED chip 1, further should guarantee LED chip 1 to cover completely, guarantees that the light that LED chip 1 sends all outwards sends after phosphor gel 42 again.
Wherein, phosphor gel 42 is to be mixed in proportion by fluorescent material, fluorescent glue, organic solvent etc.; Further, fluorescent material is that any one or more mixing in yellow fluorescent powder, red fluorescence powder, green emitting phosphor etc. forms, specifically the LED chip 1 depending on choosing.
In the present embodiment, scattering member is to be arranged on optical thin film 4 along a plurality of blind holes 43 of (end face that deviates from substrate 2) on vertical upper surface.Its light sending by blind hole 43 control LED chips 1 is uniform surface scattering, thereby the point-source of light that LED chip 1 is formed converts area source to.Further, blind hole 43 is shaped as any one or more combination in cylindrical, square and cuboid.
It should be noted that, the scattering member providing in the present invention is to be arranged on optical thin film 4 along a plurality of blind holes 43 on vertical upper surface.But be understood that scattering member concrete structure is not unique; after reflecting, other light that LED chip 1 can be sent is uniform surface scattering the final scattering member that the point-source of light of LED chip 1 formation is converted to area source output of realizing; be the replacement of simple technical scheme, all should fall into protection scope of the present invention.
In the present embodiment, LED chip 1 formal dress is on substrate 2, as shown in Figure 9.
In the present embodiment, LED chip 1 also can upside-down mounting on substrate 2, as shown in figure 10.
In the present embodiment, substrate 2 is a kind of in soft base plate 2 or metal substrate 2 or ceramic substrate 2.
Wherein, preferably adopt soft base plate 2, and soft base plate 2 is followed successively by the circuit layer being electrically connected to LED chip 1 from top to bottom, dielectric layer and metal level.Further, on circuit layer, by designing requirement, etch required circuit, but one or both combinations in its circuit connecting mode serial or parallel connection.
Embodiment six:
The LED method for packing providing in the present embodiment, comprising:
Step 401, manufacture substrate 2;
Step 402, reflector layer 3 is covered to described substrate 2 for the end face of LED chip 1 is installed;
Step 403, optical thin film 4 is covered on described reflector layer 3, described optical thin film 4 solidify and at described optical thin film 4 along forming blind hole 43 on vertical upper surface, and corresponding described LED chip 1 place of installing forms the cavity 41 along vertical perforation on described optical thin film 4;
Step 404, described LED chip 1 is placed in described cavity 41 and is arranged on described substrate 2;
Step 405, phosphor gel 42 spraying point glue are interior curing at described cavity 41, and described LED chip 1 is covered;
Step 406, the position of the corresponding described LED chip 1 of reflecting piece 5 is covered to described optical thin film 4 along on vertical upper surface, and described cavity 41 is covered.
The LED method for packing that the present embodiment provides, the LED encapsulation unit that utilizes the method to make, it is by being arranged on LED chip 1 on the substrate 2 that is coated with reflector layer 3, the light that utilizes reflector layer 3 and reflecting piece 5 that LED chip 1 is sent reflects, the light that simultaneously utilizes scattering member that LED chip 1 is sent reflects and is uniform surface scattering, thereby the point-source of light that LED chip 1 is formed converts area source to; It,, compared to side entering type leaded light module, has saved the members such as light guide plate, diffuser plate, thereby has effectively reduced the cost that utilizes LED light source to manufacture area source.
Meanwhile, its packaging technology is simple, is easy to realize, and is convenient to batch production, thereby has further reduced manufacturing cost.
In the present embodiment, for the ease of a plurality of LED encapsulation units are formed to array surface light source, step 403 also can be:
Optical thin film 4 is covered on described reflector layer 3, described optical thin film 4 solidify and at described optical thin film 4 along forming blind hole 43 on vertical upper surface, and corresponding described LED chip 1 place of installing forms a plurality of cavitys 41 along vertical perforation on described optical thin film 4.
Then a plurality of LED chips 1 be placed in described cavity 41 and be arranged on described substrate 2, LED chip 1 is identical and corresponding one by one with the quantity of cavity 41, and the corresponding cavity 41 of each LED chip 1 arranges.
Need to further illustrate, when a plurality of LED chips 1 are arranged on substrate 2, a plurality of LED chips 1 all formal dress are arranged on substrate 2; In like manner a plurality of LED chips 1 also all upside-down mounting be arranged on substrate 2; Further, a plurality of LED chips 1 can partly take formal dress to install, and part upside-down mounting is installed.Its concrete mounting means needs to determine according to Practical manufacturing process and design, but all should fall into protection scope of the present invention.
Embodiment seven:
The LED method for packing providing in the present embodiment, comprising:
Step 501, manufacture substrate 2;
Step 502, reflector layer 3 is covered to described substrate 2 for the end face of LED chip 1 is installed;
Step 503, described optical thin film 4 is covered on described reflector layer 3;
Step 504, before described optical thin film 4 solidifies, by mould 6 at described optical thin film 4 along forming blind hole 43 on vertical upper surface, and corresponding described LED chip 1 place of installing forms the cavity 41 along vertical perforation on described optical thin film 4;
Step 505, described LED chip 1 is placed in described cavity 41 and is arranged on described substrate 2;
Step 506, phosphor gel 42 spraying point glue are interior curing at described cavity 41, and described LED chip 1 is covered;
Step 507, the position of the corresponding described LED chip 1 of reflecting piece 5 is covered to described optical thin film 4 along on vertical upper surface, and described cavity 41 is covered.
Wherein, step 503 and step 504 are also replaceable is:
Step 603, described optical thin film 4 is covered on described reflector layer 3;
Step 604, after described optical thin film 4 solidifies, by laser or chemical reagent at described optical thin film 4 along forming blind hole 43 on vertical upper surface, and corresponding described LED chip 1 place of installing forms the cavity 41 along vertical perforation on described optical thin film 4.
Wherein, when substrate 2 adopts soft base plate 2, manufacturing substrate 2 comprises: substrate 2, by being divided into circuit layer, dielectric layer and metal level under upper, etches required circuit by designing requirement on circuit layer, but one or both combinations in its circuit connecting mode serial or parallel connection.
Wherein, solidifying in step 504, step 506 and step 604 can adopt temperature-curable or photocuring etc.
Wherein, in step 505, described LED chip 1 be placed in described cavity 41 and be arranged on described substrate 2, can adopt LED chip 1 formal dress is installed on substrate 2, detailed process is for being fixedly mounted on LED chip 1 on substrate 2 by die bond, the processes such as glue, routing of putting, it is convenient to install and arranges, can be with reference to shown in Figure 14.
Meanwhile, also can adopt LED chip 1 upside-down mounting is installed on substrate 2, detailed process is for process point glue, cure package are on substrate 2, it on substrate 2, can skip routing process compared to LED chip 1 formal dress, is more convenient to install, also possess better heat dispersion simultaneously, can be with reference to shown in Figure 17.
For the ease of understanding, the LED method for packing providing in the present embodiment, can be with reference to figures 11 to the procedure structure schematic diagram shown in Figure 17, concrete:
Step 501 to step step 503 can be with reference to shown in Figure 11;
Step 504 can be with reference to shown in Figure 12;
In step 505, when LED chip 1 adopts formal dress to install, can be with reference to shown in Figure 14, can be with reference to shown in Figure 17 when LED chip 1 adopts upside-down mounting to install;
Step 506 can be with reference to shown in Figure 15;
Step 507 can be with reference to shown in Figure 16;
Step 603 and step 604 can be with reference to shown in Figure 13.
In the present embodiment, for the ease of a plurality of LED encapsulation units are formed to array surface light source, step 503 and step 504 also can be:
Step 703, described optical thin film 4 is covered on described reflector layer 3;
Step 704, before described optical thin film 4 solidifies, by mould 6 at described optical thin film 4 along forming blind hole 43 on vertical upper surface, and corresponding described LED chip 1 place of installing forms a plurality of cavitys 41 along vertical perforation on described optical thin film 4.Concrete structure is with reference to shown in Figure 18.
In like manner, step 603 and step 604 also can be:
Step 803, described optical thin film 4 is covered on described reflector layer 3;
Step 804, after described optical thin film 4 solidifies, by laser or chemical reagent at described optical thin film 4 along forming blind hole 43 on vertical upper surface, and corresponding described LED chip 1 place of installing forms a plurality of cavitys 41 along vertical perforation on described optical thin film 4.Concrete structure is with reference to shown in Figure 18.
Then a plurality of LED chips 1 be placed in described cavity 41 and be arranged on described substrate 2, LED chip 1 is identical and corresponding one by one with the quantity of cavity 41, and the corresponding cavity 41 of each LED chip 1 arranges.
Need to further illustrate, when a plurality of LED chips 1 are arranged on substrate 2, a plurality of LED chips 1 all formal dress are arranged on substrate 2; In like manner a plurality of LED chips 1 also all upside-down mounting be arranged on substrate 2; Further, a plurality of LED chips 1 can partly take formal dress to install, and part upside-down mounting is installed.Its concrete mounting means needs to determine according to Practical manufacturing process and design, but all should fall into protection scope of the present invention.
Embodiment eight:
As shown in figure 18, the array surface light source providing in the present embodiment, comprises the LED encapsulation unit described in any one in a plurality of above-described embodiments five, and a plurality of LED encapsulation units become array to distribute and form a face array.
Its packaging technology is simple, is easy to realize, and a plurality of encapsulation units can whole making, and a plurality of encapsulation units form a face array, from LED encapsulation unit, directly send planar light, make design liberalization, the variation of area source; And be convenient to batch production, further reduced manufacturing cost.
Finally it should be noted that: above execution mode and embodiment only, in order to technical scheme of the present invention to be described, are not intended to limit; Although the present invention is had been described in detail with reference to aforementioned embodiments and embodiment, those of ordinary skill in the art is to be understood that: its technical scheme that still can record aforementioned embodiments or embodiment is modified, or part technical characterictic is wherein equal to replacement; And these modifications or replacement do not make the essence disengaging embodiment of the present invention of appropriate technical solution or the spirit and scope of embodiment technical scheme.
Claims (17)
1. a LED encapsulation unit, comprising:
LED chip,
For the substrate of described LED chip is installed, described substrate is coated with reflector layer on the end face that described LED chip is installed,
Cover the optical thin film on described LED chip and described reflector layer, at described optical thin film, along corresponding described LED chip place on vertical upper surface, be provided with reflecting piece, and,
Scattering member for the even scattering of light that described LED chip is sent.
2. LED encapsulation unit according to claim 1, it is characterized in that, on described optical thin film, corresponding described LED chip place is formed with the cavity along vertical perforation, and described reflecting piece is covered in described cavity along vertical one end, and described LED chip is positioned at the inside of described cavity;
In described cavity, be filled with phosphor gel.
3. LED encapsulation unit according to claim 1 and 2, is characterized in that, described scattering member is to be arranged on described optical thin film along a plurality of blind holes on vertical upper surface.
4. LED encapsulation unit according to claim 3, is characterized in that, described blind hole be shaped as any one or more combination in cylinder, truncated cone, square and cuboid.
5. according to the LED encapsulation unit described in any one in claim 1 to 4, it is characterized in that, described LED chip formal dress or upside-down mounting are on described substrate.
6. according to the LED encapsulation unit described in any one in claim 1 to 5, it is characterized in that, described substrate is a kind of in soft base plate or metal substrate or ceramic substrate;
Described soft base plate is followed successively by circuit layer, dielectric layer and the metal level for being electrically connected to described LED chip from top to bottom.
7. an array surface light source, comprises the LED encapsulation unit described in any one in a plurality of the claims 1 to 6, and a plurality of described LED encapsulation units become array to distribute and form a face array.
8. a LED method for packing, comprising:
Manufacture substrate;
Reflector layer is covered to described substrate for the end face of LED chip is installed;
Described LED chip is arranged on described substrate;
Optical thin film is covered on described LED chip and described reflector layer, described optical thin film solidify and at described optical thin film along forming blind hole on vertical upper surface;
The position of the corresponding described LED chip of reflecting piece is covered to described optical thin film along on vertical upper surface.
9. LED method for packing according to claim 8, is characterized in that, described optical thin film is covered on described LED chip and described reflector layer, described optical thin film solidify and at described optical thin film along forming blind hole on vertical upper surface, be specially:
Described optical thin film is covered on described LED chip and described reflector layer;
Before described optical thin film solidifies, by mould at described optical thin film along forming blind hole on vertical upper surface.
10. LED method for packing according to claim 8, is characterized in that, described optical thin film is covered on described LED chip and described reflector layer, described optical thin film solidify and at described optical thin film along forming blind hole on vertical upper surface, be specially:
Described optical thin film is covered on described LED chip and described reflector layer;
After described optical thin film solidifies, by laser or chemical reagent at described optical thin film along forming blind hole on vertical upper surface.
11. according to Claim 8 to the LED method for packing described in any one in 10, it is characterized in that, described described LED chip is installed on described substrate, is specially:
Described LED chip formal dress installation or upside-down mounting are arranged on described substrate.
12. according to Claim 8 to the LED method for packing described in any one in 11, it is characterized in that, described described LED chip is arranged on described substrate and is comprised:
A plurality of described LED chips are arranged on described substrate.
13. 1 kinds of LED method for packing, comprising:
Manufacture substrate;
Reflector layer is covered to described substrate for the end face of LED chip is installed;
Optical thin film is covered on described reflector layer, described optical thin film solidify and at described optical thin film along forming blind hole on vertical upper surface, and the corresponding described LED chip place of installing forms the cavity along vertical perforation on described optical thin film;
Described LED chip is placed in described cavity and is arranged on described substrate;
Phosphor gel is coated in described cavity and is solidified, and described LED chip is covered;
The position of the corresponding described LED chip of reflecting piece is covered to described optical thin film along on vertical upper surface, and described cavity is covered.
14. LED method for packing according to claim 13, it is characterized in that, described optical thin film is covered on described reflector layer, described optical thin film solidify and at described optical thin film along forming blind hole on vertical upper surface, and on described optical thin film, the corresponding described LED chip place of installing forms the cavity along vertical perforation, is specially:
Described optical thin film is covered on described reflector layer;
Before described optical thin film solidifies, by mould at described optical thin film along forming blind hole on vertical upper surface, and the corresponding described LED chip place of installing forms the cavity along vertical perforation on described optical thin film.
15. LED method for packing according to claim 13, it is characterized in that, described optical thin film is covered on described reflector layer, described optical thin film solidify and at described optical thin film along forming blind hole on vertical upper surface, and on described optical thin film, the corresponding described LED chip place of installing forms the cavity along vertical perforation, is specially:
Described optical thin film is covered on described reflector layer;
After described optical thin film solidifies, by laser or chemical reagent at described optical thin film along forming blind hole on vertical upper surface, and the corresponding described LED chip place of installing forms the cavity along vertical perforation on described optical thin film.
16. according to the LED method for packing described in any one in claim 13 to 15, it is characterized in that, described described LED chip is placed in described cavity and is arranged on described substrate, is specially:
Described LED chip is placed in described cavity, and described LED chip formal dress installation or upside-down mounting are arranged on described substrate.
17. according to the LED method for packing described in any one in claim 13 to 16, it is characterized in that, described optical thin film is covered on described reflector layer, described optical thin film solidify and at described optical thin film along forming blind hole on vertical upper surface, and the corresponding described LED chip place of installing forms along the cavity of vertical perforation and comprises on described optical thin film:
Optical thin film is covered on described reflector layer, described optical thin film solidify and at described optical thin film along forming blind hole on vertical upper surface, and the corresponding described LED chip place of installing forms a plurality of cavitys along vertical perforation on described optical thin film.
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