CN105047655B - A kind of AC power supply full angle LED illuminator and its manufacturing method - Google Patents
A kind of AC power supply full angle LED illuminator and its manufacturing method Download PDFInfo
- Publication number
- CN105047655B CN105047655B CN201510489120.7A CN201510489120A CN105047655B CN 105047655 B CN105047655 B CN 105047655B CN 201510489120 A CN201510489120 A CN 201510489120A CN 105047655 B CN105047655 B CN 105047655B
- Authority
- CN
- China
- Prior art keywords
- led
- constant current
- current circuit
- layer
- fluorescence substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Led Device Packages (AREA)
- Led Devices (AREA)
Abstract
The invention discloses a kind of AC power supply full angle LED illuminators, including fluorescence substrate and the printed wire layer being attached on fluorescence substrate, fluorescence substrate is equipped at least one circle LED Luminous Rings, several LED luminescence chips are equipped in LED Luminous Rings, LED Luminous Ring outer layers are coated with fluorescent adhesive layer, linear constant current circuit is equipped on fluorescence substrate in LED Luminous Rings, heat-conducting glue layer is coated in linear constant current circuit, linear constant current circuit is connect by printed wire layer with LED Luminous Rings, and printed wire layer is set there are two AC electrodes.Manufacturing method is to arrange printed wire layer on fluorescence substrate and cleaned and dried, the element in LED luminescence chips and linear constant current circuit is fixed on the line by toasting with glue, it is connected with metal wire between LED luminescence chips, is coating fluorescent glue and high heat conduction glue.It is an advantage of the invention that:It is capable of providing the light emitting angle of omnidirectional lighting, by small current driving and highly heat-conductive material low thermal resistance, improves light efficiency, ensure that the service life of LED.
Description
Technical field
The present invention relates to a kind of AC power supply full angle LED illuminators and its manufacturing methods.
Background technology
Lighting engineering is low with its operating voltage, operating current is small, shock resistance by LED (Lighting emitting diode)
With anti-seismic performance is good, reliability is high, long lifespan, convenient for adjusting the features such as receive welcome, have become and be currently widely used
Lighting engineering.
LED light engine (light engine) refers to comprising LED encapsulation (component) or LED arrays (module), LED drivings
Device and other brightness, calorifics, mechanically and electrically pneumatic module entire combination.It is that driving power is existed with LED patches in the market
The technology of patch processing is done on the same circuit, these schemes can be many due to peripheral component, and there may be more not
Stability, there are many security risks, and substrate is all to use aluminum substrate, limits light emitting angle and cannot get better light
Efficiency and light application.
Invention content
It is in view of the deficiencies in the prior art and insufficient, and a kind of use more reasonable the purpose of the present invention is to propose to structure
Driving power naked core, luminescence chip and highly heat-conductive material are combined with each other by semiconductor technology, are capable of providing specular removal and omnidirectional
The full angle illuminator and its manufacturing method of illumination.
In order to solve the above-mentioned technical problem, the present invention is achieved by the following technical solutions:A kind of AC power supplies full angle
LED illuminator, including fluorescence substrate and the printed wire layer being attached on fluorescence substrate, the fluorescence substrate is equipped at least one
LED Luminous Rings are enclosed, several LED luminescence chips are equipped in the LED Luminous Rings, the LED Luminous Rings outer layer is coated with fluorescent glue
Layer, it is equipped with linear constant current circuit on the fluorescence substrate in the LED Luminous Rings, heat-conducting glue is coated in linear constant current circuit
Layer, the linear constant current circuit connect by printed wire layer with LED Luminous Rings, the printed wire layer set there are two AC it is electric
Pole.
Preferably, it is combined by metal wire or printed wire series, parallel or connection in series-parallel between the LED luminescence chips
Mode is connected with linear constant current circuit;LED luminescence chips are connected by metal wire, interference will not be generated to neighbouring other elements,
Ensure connected ratio simultaneously.
Preferably, the fluorescence substrate is the either glass plate with fluorescent powder or with fluorescence of the ceramic wafer with fluorescent powder
The sapphire plate of powder;Good fluorescent effect can be generated, realizes omnidirectional lighting.
Preferably, the LED luminescence chips are transparent color chips or flip-chip;Ensure the hair of LED luminescence chips
Light rate.
Preferably, the linear constant current circuit includes IC chip, rectification bridge chip and circuit constant current protection element, rectification
Bridge chip by printed wire layer with circuit constant current protection element with IC chip to be connected;Ensure that entire LED illuminator has for a long time
The normal operation of effect.
Preferably, the element in the LED luminescence chips and linear constant current circuit is fixed on fluorescence substrate by glue
On;Bonding is securely easily operated.
Preferably, the fluorescent adhesive layer and the thickness of heat-conducting glue layer are equal;Ensure uniform light transmitting.
A kind of manufacturing method of AC power supplies full angle LED illuminator, includes the following steps successively:
A. printed wire layer will be arranged by being electroplated or being sintered on fluorescence substrate, as LED luminescence chips and linear perseverance
The conductive layer and articulamentum of element in current circuit;
B. the fluorescence substrate for being disposed with printed wire layer is cleaned and is dried, then LED is shone core by glue
Element in piece and linear constant current circuit is fixed on by toasting sizing on the circuit set;
C. use metal wire in such a way that design series, parallel or connection in series-parallel mix by corresponding LED luminescence chips
Connection;
D. the fluorescent glue configured is coated in the surface of LED luminescence chips by dispensing mode and toasts sizing, formed
Fluorescent adhesive layer;
E. heat conduction glue is coated in linear constant current circuit surface, and keeps the thickness and fluorescent glue thickness of high heat conduction glue-line
Degree is consistent.
Compared with prior art, it is an advantage of the invention that:By above-mentioned conceptual design, linear constant current circuit setting is existed
In LED Luminous Rings and fluorescence substrate is used, is capable of providing the light emitting angle of omnidirectional lighting, luminescence chip passes through encapsulation technology and height
Heat conduction fluorescence substrate is combined with each other, and by small current driving and highly heat-conductive material low thermal resistance, improves light efficiency, ensure that
The service life of LED.
Description of the drawings
Fig. 1 is a kind of structural schematic diagram of AC power supplies full angle LED illuminator of the present invention.
Specific implementation mode
It is the embodiment of a kind of AC power supply full angle LED illuminators of the present invention and its manufacturing method, a kind of AC confessions refering to fig. 1
Electric full angle LED illuminator, including fluorescence substrate 1 and the printed wire layer 2 that is attached on fluorescence substrate 1 are set on fluorescence substrate 1
There are at least one circle LED Luminous Rings 3, several LED luminescence chips are equipped in LED Luminous Rings 3, LED luminescence chips are transparent color core
Piece either passes through metal wire or printed wire series, parallel or connection in series-parallel combination between flip-chip LED luminescence chips
It is connected with linear constant current circuit 5,3 outer layer of LED Luminous Rings is coated with fluorescent adhesive layer 4, on the fluorescence substrate in LED Luminous Rings 3
Equipped with linear constant current circuit 5, it is coated with heat-conducting glue layer 6 in linear constant current circuit 5, linear constant current circuit 5 passes through printed wire layer 2
It is connect with LED Luminous Rings 3, linear constant current circuit 5 includes IC chip, rectification bridge chip and circuit constant current protection element, linearly
Constant-current circuit 5 includes IC chip, rectification bridge chip and circuit constant current protection element, and rectification bridge chip with circuit constant current to protect
Element is connected by printed wire layer 2 with IC chip, and printed wire layer 2 is set there are two AC electrodes 7.
Above-mentioned fluorescence substrate 1 is the either glass plate with fluorescent powder or the indigo plant with fluorescent powder of the ceramic wafer with fluorescent powder
Jewel plate, the element in LED luminescence chips and linear constant current circuit 5 are fixed on by glue on fluorescence substrate 1, fluorescent adhesive layer
4 is equal with the thickness of heat-conducting glue layer 6.
A kind of manufacturing method of AC power supplies full angle LED illuminator, includes the following steps successively:
A. printed wire layer 2 will be arranged by being electroplated or being sintered on fluorescence substrate 1, as LED luminescence chips and linearly
The conductive layer and articulamentum of element in constant-current circuit 5;
B. the fluorescence substrate 1 for being disposed with printed wire layer 2 is cleaned and is dried, then LED is shone by glue
Element in chip and linear constant current circuit 5 is fixed on by toasting sizing on the circuit set;
C. use metal wire in such a way that design series, parallel or connection in series-parallel mix by corresponding LED luminescence chips
Connection;Do not have to connect using metal wire if using flip-chip, can be directly connected by printed wire;
D. the fluorescent glue configured is coated in the surface of LED luminescence chips by dispensing mode and toasts sizing, formed
Fluorescent adhesive layer 4;
E. heat conduction glue is coated in 5 surface of linear constant current circuit, and keeps the thickness and fluorescent adhesive layer of high heat conduction glue-line 6
4 consistency of thickness.
By above-mentioned conceptual design, by driving power naked core, luminescence chip passes through encapsulation technology and high heat conduction fluorescent base
Plate 1 is combined with each other, and is capable of providing the light emitting angle of 360 degree of omnidirectional lightings, passes through small current driving and highly heat-conductive material low-heat
Resistance, improves light efficiency, ensure that the service life of LED.
Above is only a specific embodiment of the present invention, but the technical characteristic of the present invention is not limited thereto, Ren Heben
The technical staff in field in the field of the invention, made by changes or modifications all cover the present invention the scope of the claims among.
Claims (1)
- The full angle LED illuminator 1. a kind of AC powers, it is characterised in that:Including fluorescence substrate(1)Be attached to fluorescence substrate(1) On printed wire layer(2), the fluorescence substrate(1)It is equipped at least one circle LED Luminous Rings(3), the LED Luminous Rings(3) It is interior to be equipped with several LED luminescence chips, the LED Luminous Rings(3)Outer layer is coated with fluorescent adhesive layer(4), in the LED Luminous Rings (3)Interior fluorescence substrate is equipped with linear constant current circuit(5), linear constant current circuit(5)It is upper to be coated with heat-conducting glue layer(6), described Linear constant current circuit(5)Pass through printed wire layer(2)With LED Luminous Rings(3)Connection, the printed wire layer(2)There are two if AC electrodes(7);By metal wire or printed wire series, parallel or connection in series-parallel combination and linearly between the LED luminescence chips Constant-current circuit(5)It is connected;The fluorescence substrate(1)For the ceramic wafer with fluorescent powder, either the glass plate with fluorescent powder or the indigo plant with fluorescent powder are precious Slabstone;The LED luminescence chips are transparent color chips or flip-chip;The linear constant current circuit(5)Including IC chip, rectification bridge chip and circuit constant current protection element, rectification bridge chip with Pass through printed wire layer with circuit constant current protection element(2)It is connected with IC chip;The LED luminescence chips and linear constant current circuit(5)In element fluorescence substrate is fixed on by glue(1)On;The fluorescent adhesive layer(4)And heat-conducting glue layer(6)Thickness it is equal;When manufacture, include the following steps successively:It A. will be by being electroplated or being sintered in fluorescence substrate(1)Upper arrangement printed wire layer(2), as LED luminescence chips and linearly Constant-current circuit(5)The conductive layer and articulamentum of middle element;B. to being disposed with printed wire layer(2)Fluorescence substrate(1)It is cleaned and is dried, then LED is shone by glue Chip and linear constant current circuit(5)In element by toast sizing be fixed on the circuit set;C. metal wire is used to connect corresponding LED luminescence chips in such a way that design series, parallel or connection in series-parallel mix;D. the fluorescent glue configured is coated in the surface of LED luminescence chips by dispensing mode and toasts sizing, form fluorescence Glue-line(4);E. heat conduction glue is coated in linear constant current circuit(5)Surface, and keep heat-conducting glue layer(6)Thickness and fluorescent adhesive layer (4)Consistency of thickness.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510489120.7A CN105047655B (en) | 2015-08-11 | 2015-08-11 | A kind of AC power supply full angle LED illuminator and its manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510489120.7A CN105047655B (en) | 2015-08-11 | 2015-08-11 | A kind of AC power supply full angle LED illuminator and its manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105047655A CN105047655A (en) | 2015-11-11 |
CN105047655B true CN105047655B (en) | 2018-09-11 |
Family
ID=54454072
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510489120.7A Expired - Fee Related CN105047655B (en) | 2015-08-11 | 2015-08-11 | A kind of AC power supply full angle LED illuminator and its manufacturing method |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN105047655B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109519735A (en) * | 2017-09-19 | 2019-03-26 | 盐城金意光电科技有限公司 | A kind of LED polishing mould group production method |
CN108417691A (en) * | 2018-04-18 | 2018-08-17 | 东莞市恩瑞精密电子有限公司 | Linear light source preparation method |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101800270A (en) * | 2009-02-11 | 2010-08-11 | 亿光电子工业股份有限公司 | Light emitting diode device and packaging method therefore |
CN103236427A (en) * | 2013-01-05 | 2013-08-07 | 天津金玛光电有限公司 | LED with luminous front and rear sides |
CN104534402A (en) * | 2015-01-19 | 2015-04-22 | 深圳市圣诺光电科技有限公司 | Light guide lampshade and LED lighting device |
CN204760381U (en) * | 2015-08-11 | 2015-11-11 | 杭州恒星高虹光电科技股份有限公司 | Full angle LED luminous element of AC power supply |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI535043B (en) * | 2011-06-29 | 2016-05-21 | 國立屏東科技大學 | Electrodes of solar cell formed by active solder and method therefor |
-
2015
- 2015-08-11 CN CN201510489120.7A patent/CN105047655B/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101800270A (en) * | 2009-02-11 | 2010-08-11 | 亿光电子工业股份有限公司 | Light emitting diode device and packaging method therefore |
CN103236427A (en) * | 2013-01-05 | 2013-08-07 | 天津金玛光电有限公司 | LED with luminous front and rear sides |
CN104534402A (en) * | 2015-01-19 | 2015-04-22 | 深圳市圣诺光电科技有限公司 | Light guide lampshade and LED lighting device |
CN204760381U (en) * | 2015-08-11 | 2015-11-11 | 杭州恒星高虹光电科技股份有限公司 | Full angle LED luminous element of AC power supply |
Also Published As
Publication number | Publication date |
---|---|
CN105047655A (en) | 2015-11-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN105226167B (en) | A kind of luminous flexible LED filament of full angle and its manufacture method | |
US9240528B2 (en) | Solid state lighting apparatus with high scotopic/photopic (S/P) ratio | |
US10453827B1 (en) | LED apparatuses and methods | |
CN203277498U (en) | Light-emitting component and device base of light-emitting device thereof | |
JP5469176B2 (en) | Lighting device, heat transfer structure, and heat transfer element | |
CN101839403B (en) | AC-driven light emitting device | |
KR20110017405A (en) | Light emitting device | |
KR20090048640A (en) | Lighting device and lighting method | |
JP2011192703A (en) | Light emitting device, and illumination apparatus | |
CN104976547A (en) | Light emitting diode assembly and light emitting diode bulb using same | |
CN109148429A (en) | Light-emitting diode encapsulation structure | |
CN105047655B (en) | A kind of AC power supply full angle LED illuminator and its manufacturing method | |
CN103470968A (en) | Light emitting diode lamp core with large light emitting angle and illumination device with lamp core | |
CN110622325A (en) | Tunable integrated optical LED assembly and method | |
CN203223777U (en) | Illuminating device | |
CN204760381U (en) | Full angle LED luminous element of AC power supply | |
TWI564854B (en) | Lighting apparatuses and driving methods regarding to light-emitting diodes | |
CN102506315A (en) | High-color-rendering-property light-emitting diode (LED) device | |
CN206619611U (en) | A kind of bare crystalline encapsulates light engine | |
CN203322806U (en) | LED (light-emitting diode) light source module capable of linear light emitting | |
CN103839511B (en) | Light-emitting device and driving method on light emitting diode | |
US8633639B2 (en) | Multichip package structure and light bulb of using the same | |
TW201209992A (en) | Light emitting apparatus and solar cell apparatus | |
CN204885156U (en) | LED light source module | |
CN201758138U (en) | Packaging mechanism for high power LED |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180911 Termination date: 20200811 |
|
CF01 | Termination of patent right due to non-payment of annual fee |