201209992 六、發明說明： 、 【發明所屬之技術領域】 本發明係關於一種發光裝置及太陽能電池裝置。 【先前技術】 近年來，由於發光二極體（Light Emitting Diode, LED ) 在製程與材料方面的不斷改良，使得發光二極體的發光效 率大幅提升。不同於一般的日光燈或省電燈泡，發光二極 體具有低耗電量、使用壽命長、安全性rt]、發光響應時間 短及體積小等特性，因此，已被廣泛地運用至許多種類的 電子產品中。 然而，散熱一直是發光二極體作為光源的一個問題， 隨著照明時間的增加，發光裝置也會因發光二極體的光電 轉換不完全而產生可觀的熱量，使得發光二極體因熱量散 發不良而造成發光效率降低甚至損毁。 請參照圖1所示，其為習知一種發光裝置1的侧視 圖。發光裝置1包含複數發光二極體元件11以及一驅動 電路板12。其中，驅動電路板12具有一基板121及複數 電子元件122，電子元件122係設置於基板121。其中， 發光二極體元件11係以表面黏著技術或插件（DIP)方式 設置於基板121，而驅動電路板12可驅動及控制發光二極 體元件11發光。 然而，為了使發光二極體元件11的熱量可快速散發， 因此，驅動電路板12之基板121 —般需使用具有良好導 201209992 熱效果的材質。例如，以銅板當金屬基層，另外於金屬基 層的表面覆蓋一絕緣層，而絕緣層上再形成一電路層，而 發光二極體元件11可藉由電路層電性連接至驅動電路板 12。藉此，可將發光二極體元件11所發出的熱量藉由導 - 熱效果良好的基板121快速地散發，避免發光二極體元件 .11因熱量散發不良而造成發光效率降低甚至損毁。 雖然，使用導熱效果佳的銅基板121雖可快速地散發 發光二極體元件11之熱量，但其成本相當高，使得發光 φ 裝置1的製作成本無法降低。 因此，如何提供一種發光裝置，可具有良好的散熱效 果，又可降低製作成本，已逐漸成為重要課題之一。 【發明内容】 - 有鑑於上述課題，本發明之目的為提供一種可具有良 好的散熱效果，又可降低製作成本之發光裝置及太陽能電 池裝置。 • 為達上述目的，依據本發明之一種發光裝置包括一發 光單元以及一驅動電路板。發光單元具有一基板及複數發 光二極體晶粒，該等發光二極體晶粒以打線接合或覆晶接 . 合設置於基板。驅動電路板與發光單元之基板直接連接 並接受電壓變動之一電源訊號且將其轉換成一驅動訊號 以驅動該等發光二極體晶粒發光，驅動電路板具有一開 口，發光單元位於開口。 在本發明之一實施例中，該等發光二極體晶粒係區分 201209992 為複數群組，各群組具有一正極與一負極，各正極與各負 極係直接連接至驅動電路板。 在本發明之一實施例中，各群組中，該等發光二極體 晶粒係相互串聯、或並聯、或串聯與並聯。 在本發明之一實施例中，該等發光二極體晶粒之至少 其中之二係經由一導線直接電性連接。 在本發明之一實施例中，驅動電路板具有複數連接墊 環設於開口。 在本發明之一實施例中，發光單元更具有一封膠體， 覆蓋該等發光二極體晶粒。 在本發明之一實施例中，基板更具有一反射表面，以 反射該等發光二極體晶粒所發出之光線。 在本發明之一實施例中，發光單元更包含一散熱結 構，散熱結構設置於基板設置有該等發光二極體晶粒之相 對侧。 在本發明之一實施例中，散熱結構與驅動電路板或基 板連結。 在本發明之一實施例中，係藉由複數螺絲透過複數通 孔，而鎖合基板與驅動電路板至散熱結構，至少一通孔之 戽圍係設置有複數焊球。 在本發明之一實施例中，基板具有相對設置之一第一 表面與一第二表面，該等發光二極體晶粒係設置於第一表 面。基板之第一表面或第二表面與驅動電路板直接連接。 在本發明之一實施例中，驅動電路板更具有一電路板 201209992 及複數電子元件，該等電子元件設置於電路板，電路板具 有相對設置之一第三表面及一第四表面，第三表面與基板 連結，該等電子元件設置於第三表面及第四表面之至少其 中之一。 _ 為達上述目的，依據本發明之一種太陽能電池裝置， 包括一太陽能電池單元以及一電路板。太陽能電池單元具 有一基板及至少一太陽能電池元件，太陽能電池元件設置 於基板。電路板與太陽能電池單元之基板直接連接，電路 Φ 板具有一開口，太陽能電池元件位於開口。 承上所述，依據本發明之一種發光裝置之驅動電路板 係與發光單元之基板直接連接，並可驅動發光單元之發光 二極體晶粒發光，且發光單元係位於驅動電路板之開口。 _ 藉此，使發光單元所發出的熱量可藉由導熱效果良好的基 - 板（例如銅基板）快速地散發，避免發光單元因熱量散發 不良而造成發光效率降低甚至損毁。另外，因驅動電路板 可使用價格較低廉的電路板，因此，本發明之發光裝置亦 ® 可降低製作的成本。此外，太陽能電池裝置亦可應用本發 明之結構，使得太陽能電池裝置達到較佳的散熱效果。 - 【實施方式】 以下將參照相關圖式，說明依本發明較佳實施例之發 光裝置及太陽能電池裝置，其中相同的元件將以相同的參 照符號加以說明。 請參照圖2A至圖2D以說明本發明之發光裝置2的結 201209992 構。本發明較佳實施例之一種發光裝置2包括一發光單元 21以及一驅動電路板22。其中，圖2A係為發光單元21 之俯視圖，圖2B係為驅動電路板22之俯視圖，圖2C係 為發光裝置2之組合俯視圖，而圖2D係為發光裝置2之 側視圖。 發光單元21具有一基板211及複數發光二極體晶粒 212，發光二極體晶粒212係以打線接合或覆晶接合設置 於基板211。換言之，發光二極體晶粒212係以晶粒直接 構裝（chip-on-board，COB)的技術直接設置於基板211 上。其中，基板211係使用具有良好導熱效果之材料製作， 例如以銅板當基板211之金屬基層（metal core)，於金屬 基層的表面可覆蓋一絕緣層，而絕緣層上再形成一電路 層，而發光二極體晶粒212可藉由基板211上的電路層進 行電性連接。其中，基板211可具有相對設置之一第一表 面213與一第二表面214,發光二極體晶粒212係設置於 第一表面213。當然，發光二極體晶粒212亦可設置於第 二表面214。 另外，發光二極體晶粒212之數量及排列方式，並不 受限制。本實施例是以複數發光二極體晶粒212呈二維陣 列排列設置於基板211為例來說明。當然，使用者亦可依 據其需求，將複數發光二極體晶粒212呈一維陣列排列或 其他排列，甚至是不規則排列而設置於基板211上。 由於發光二極體晶粒212係直接設置於基板（銅板） 211的中央部，基板211的中央部並沒有絕緣層及電路層 201209992 的設置（絕緣層及電路層係設置於基板211周圍部），故 在本實施例中，發光二極體晶粒212之至少其中之二係經 由一導線C直接電性連接，也就是導線C的二端均在發光 二極體晶粒212上，而使得導線C騰空。於此，更將發光 - 二極體晶粒212區分為複數群組，其中，各群組可只有一 • 發光二極體晶粒212，亦可為複數發光二極體晶粒212， 而且各發光二極體晶粒212的發光顏色可為白色或是該等 發光二極體晶粒212混光成白色或其他色光，於此並不限 制。因此’在各群組中’發光二極體晶粒212可依使用者 之需要以導線C相互串聯、或並聯、或同時串聯與並聯。 另外，各群組對外部而言，可分別具有一正極與一負 極，各正極與各負極係電性連接至驅動電路板22。換今 之，發光二極體晶粒212可依使用者之需要以導線Γ相 串聯、或並聯、或同時串聯與並聯，以將複數的發光= 體晶粒212 H分為複數群組’而各群組具有—正極與 極，正極與負極分別再以打線電性連接 巧之 複數第一連接墊21S π—丄斤^ U周圍之 5，再猎由笫一連接墊215分 接至驅動電路板22，姑 ^ ^ Α 刀別電性連 2使驅動電路板22可藉由各群鈿々χ 負極分別‘驅動各群έ 群、'且之正、 2Α之群組A #出二 ^光。例如圖 後 t 、發光二極體晶粒212串^ & 係以一正極（+ )伽 π娜組成，且 '、〜負極（-)與外部電性連挺 電路板22可藉由雜* 电r遇接’使驅動 稽由群級A之正、負極驅動群 極體晶粒212發來, 、、、A之發光二 "尤。本實施例中’藉由不同數 杻體晶粒212串聯，u 个j数目的發光二 述分成不同群組，以分別驅動該等發 201209992 群組點滅，故發光裝置2還可具有多段 極體線c直接電性連接該等發光二 量，以節金線)C的用 光二極體日& 219 Q為―線c二端直接連接於發 验日曰粒212，而能節省製程步驟。 驅動電路板22與發光單元2 接。換言之，基板211之第4面213二直接連 與驅動電路板22直接連接:或弟二表… 锥連接，於此，係以基板211之第一 ^ 13與驅動電路板22直接連接。直接連接的定義係 為動電路板22與基板211之間例如係以銲接 er) ^^^^^^t#(anisotropic conductive film, ACF)、或其他金屬或連結劑直接電性連接。其中，異方性 導電膠是以高品質的樹脂及導電粒子合成而成，其主要係 用於連接一種不同基材和線路，並兼具導電及膠合固定的 功能。本實施例以驅動電路板22與發光單元21之基板211 以烊球（solder bump)焊接連接為例。另外，本實施例之 發光裝置2係為一發光二極體燈泡，因此，驅動電路板22 係為圓形，以容置於燈殼内，當然，驅動電路板22也可 以疋其他形狀，例如為矩形、菱形、或橢圓形等等。 驅動電路板22具有一電路板221及複數電子元件（例 如電容、電感或電阻等等）222，且電子元件222係設置 於電路板221。其中，電路板221具有相對設置之一第三 表面223及一苐四表面224。第三表面223係與基板211 10 201209992 連結，而電子元件222係設置於第三表面223及第四表面 224之至少其中之一。於此，電路板221之材質例如係可 包含金屬、玻璃、陶瓷或樹脂，於此並不加以限制。電子 元件222則以設置於第四表面224為例。當然，電子元件 -222亦可設置於第三表面223。也可於第三表面223及第 . 四表面224同時設置驅動之電子元件222。 驅動電路板22係接受電壓變動之一電源訊號且將其 轉換成一驅動訊號以驅動該等發光二極體晶粒212發光。 φ 電源訊號例如可為一交流訊號或一直流訊號。而電壓變動 之電源訊號例如為汽車電瓶輸出之電壓。汽車電瓶輸出的 電壓若未再經穩壓線路整流時，可能有些微之漣波存在， 因此，其可視為電廢變動（voltage changing )之電源訊號。 另外，或者例如為一交流電經橋式整流器整流後輸出之電 " 壓，其亦存在些微之漣波，因此，也可視為電壓變動之電 源訊號。當然，本發明並不限制驅動電路板22接受之電 壓變動的電源訊號僅為上述兩種，只要是接受之電源訊號 • 可轉換成驅動訊號，以驅動該等發光二極體晶粒212發光 即可。 另外，驅動電路板22更具有一開口 0，而發光單元 21係位於開口 0,該等發光二極體晶粒212係由開口 0露 . 出。此外，驅動電路板22更可具有複數第二連接墊225 環設於開口 0，並使基板211周圍之第一連接墊215分別 對應設置並疊合於第二連接墊225，並使第一連接墊215 焊接於第二連接墊225,使驅動電路板22可驅動各群組之 201209992 發光二極體晶粒212發光。由於電子元件222設置於電你 板221時’常利用表面黏著（SMT)製程，而焊接於電格 板221 °因此，第一連接墊215與第二連接墊225也是利 用焊接的手段相互連接時，則可減少製程所需要的時間。 特別§兄明的是，本發明之驅動電路板22可依據代表 各群組之發光狀態的參數控制各群組之間的連接拓撲 (topology)’以及可控制發光二極體晶粒212點亮的數 罝。而上述發光狀態的參數例如係為各群組之電流值、電 壓值電功率、發光強度及或發光功率。換句話說，驅動 電路板22可自動透過改變各群組之間的連接抬撲而因應 當前之外部電源的電壓變化，並調整流經各群組之電流， 以控制發光單元21之發光特性。另外，驅動電路板22也 可使各群組之間具有多種不同的連接方式，因此，也可大 幅提升各群組之發光二極體晶粒212在可變電源驅動下之 利用率。 另外，發光單元21更可具有一封膠體216，封膠體 216係覆蓋該等發光二極體晶粒212。其中，封膠體216 亦可包含螢光物質，並受發光二極體晶粒212激發而混光 後，可使發光單元21產生所需要的色光，例如為白光。 此外，如圖2D所示，發光裝置2之基板211更可具 有一反射表面，以反射該等發光二極體晶粒212所發出之 光線。在本實施例中，以發光單元21之第—表面213即 為高反射率材質所製成而具有反射表面為例。另外，也可 例如圖3所示，於發光單元21之第一表面213上貼附一 201209992 高反射率、金屬鍍膜之反射層217或反射片而形成一反射 表面。藉由反射表面可反射發光二極體晶粒212所發出的 光線，而提升發光單元21之光線利用率。再者，驅動電 路板22之電子元件222係可設置於驅動電路板22之第三 . 表面223，第三表面223係與基板211連結的表面，如此 _ 一來，電子元件222即可容置於驅動電路板22與基板211 之段差範圍中，而不額外增加發光裝置2a之高度，有助於 產品的薄型化。 φ 另外，請參照圖4A所示，其為本發明另一態樣之發 光裝置2b的示意圖。 為了更加提高發光裝置2b之散熱效率，發光裝置2b 更可包含一散熱結構23，例如散熱鰭片，以協助其散熱。 散熱結構23係設置於基板211設置有發光二極體晶粒212 — 之相對侧。於此，散熱結構23係設置於基板211之第二 表面214為例。另外，散熱結構23係可與驅動電路板22 或基板211連結。於此，係以散熱結構23與基板211連結 ® 為例，或者在其他實施例中，散熱結構23可鎖合於驅動 電路板22。 請參照圖4B所示，其為本發明又一態樣之發光裝置 - 2c的不意圖。 發光裝置2c與圖4A之發光裝置2b主要不同在於， 發光裝置2c之基板211係藉由第二表面214與驅動電路板 221直接連接。於此，基板211之第二表面214係與驅動 電路板221之第四表面224直接連接。 13 201209992 另外’請參照圖5A及圖5B所示，其分別為本發明之 另一較佳實施例之發光裝置3的分解示意圖及組合示意 圖。 發光裝置3與發光裝置2b主要的不同在於，發光裝 置3除了藉由第一連接墊315焊接於第二連接墊325外， -亦使用複數螺絲S透過複數通孔01至03，鎖合基板311 . 與電路板321至散熱結構33，使發光單元31之基板311 與驅動電路板32之電路板321可更穩定地與散熱結構33 連結。值得一提的是，於基板311與電路板321鎖合至散 籲 熱結構33之前，可於電路板321連接用之一通孔01或於 基板311連接用一通孔02的周緣設置複數焊球S1，一來 可具有緩衝作用，能分散鎖合基板311及電路板321之應 力，二來焊球S1具有的高度與鄰近之第一連接墊315與 第二連接墊325加上它們之間焊球S2的高度約略相等， 故可避免因基板311與電路板321之間的間距不同，鎖合 時造成基板311或電，路板321的彎曲變形。焊球SI、S2 於此係以設置於電路板321為例，其亦可設置於基板311。 ® 發光裝置3之其它元件與發光裝置2相同元件具有相 同結構及功能，於此不再贅述。 以下，請參照圖6所示，以說明本發明之發光裝置所 - 具有之多段亮度調整功能。圖6之多段亮度調整功能之電 路可應用於發光裝置所有實施例中。 發光裝置4之發光單元係包含三個發光二極體晶粒群 組41a〜41c，且群組41a〜41c分別具有一、二及四個發光 - CS) 14 201209992 二極體晶粒。在本實施例中，群組41 a〜41 c係為相互並聯 連接之方式而與外部電源V之第一電源端1與第二電源 端丁2電性連接，且第一電源端乃係為外部電源V之一電 源輸入端，而第二電源端為一接地端T2。 . 於此說明的是，本實施例之發光裝置4之發光單元係 . 具有三個發光二極體晶粒群組41a〜41c，且各群組41a、 41b、41c分別具有一、二及四個發光二極體晶粒為例。然 而，在操作上，係可依據實際的需求，使用其他數量之群 φ 組及發光二極體晶粒進行操作，且各群組之發光二極體晶 粒係可為相互串聯及或相互並聯的連接方式。 群組41a具有一連接切換單元SW31，群組41b具有二 連接切換單元SW32、SW33，而群組41c則具有二連接切 換單元SW34、SW35。其中，群組41a之連接切換單元SW31 — 係與群組41b之連接切換單元SW32以及群組41c之連接 切換單元SW34電性連接，而群組41b之連接切換單元SW33 與群組41c之連接切換單元SW35電性連接。 ® 在本實施例中，各群組41a〜41c之連接切換單元，係 與和連接切換單元連接之群組中之連接切換單元串聯連 接。舉例來說，群組41a之連接切換單元SW31，係與和連 - 接切換單元SW31連接之群組41b中之連接切換單元SW32 . 串聯連接。此外，在實際運用上，各群組41a〜41c之一第 一切換單元SWn〜SW14、一第二切換單元SW2广SW24及連 接切換單元SW31〜SW35係分別為一半導體元件，例如是雙 載子電晶體（BJT)或場效電晶體（FET)。 15 201209992 發光裝置4之驅動電路板更包含一控制電路42，其係 包含一偵測單元421及一控制單元422。偵測單元421係 偵測代表群組41a〜41c之發光狀態之參數並產生一參數訊 號SP。在實施上，偵測單元421係包含一電阻器、一光偵 測器、一感光二極體、一感應線圈、一電磁感應元件及或 -一磁電感應元件，且偵測單元421可為一即時偵測單元。 . 控制單元422與偵測單元421電性連接，並依據參數 訊號SP，控制第一切換單元SWu〜SW14、第二切換單元 SW21〜SW24及或連接切換單元SW3广SW35以調整流經群組 ❿ 41a〜41c之電流。此外，控制電路42係可依據產品的需求， 而為一數位控制電路或一類比控制電路。 在實際操作時，當外部電源V輸入發光裝置4，控制 單元422將控制群組41a之第一切換單元SW„&第二切 換單元SW21為導通狀態，而使群組41 a發亮。當外部電 源V之電壓準位上升時，流經群組41a之電流值亦同時增 加，控制單元422將依據偵測單元421所產生之參數訊號 _ SP而將第一切換單元SWu、第二切換單元SW22及連接切 換單元SW31、SW32導通，以使群組41a、41b形成串聯連 接並同時發亮。亦即，增加外部電源之負載，而使施加於 發光裝置4之電壓及流經其群組41a〜41c之電流符合設計 · 者之需求及元件所能承受之規格，以避免因外部電源的變 ·. 動而造成群組41a〜41c的毀損。若外部電源V之電壓準位 持續增加，控制單元422係控制第一切換單元SWn、第二 切換單元SW24及連接切換單元SW31〜SW33及SW35為導通 16 ⑤ 201209992 狀態，而使群組41a~41c同時發亮。 由於本實施例中之群組41 a〜4 lc分別具有一、二及四 個發光二極體晶粒，因而控制單元422係可依據參數訊號 SP而使發光裝置4分別導通群組41a.、群組41b及或群組 .41c，而點亮一至七個發光二極體晶粒。 < 此外，在本實施例中，亦可以藉由導通不同的切換單 元而使各群組形成相互並聯及或相互串聯的連接方式。例 如：控制單元422係可同時導通第一切換單元SWu-SWm φ 及第二切換單元SW2!〜SW24而使群組41a〜41c形成並聯連 接，或是導通第一切換單元SWu、SW14、第二切換單元 SW22、SW24及連接切換單元SW31、SW32，以使群組41a、 41b為串聯連接，且其係與群組41c為並聯連接。換句話 說，控制單元422係可依據參數訊號SP，而使各群組 ' 41a〜41c形成多種並聯連接的態樣，以達成分流的效果， 進而控制發光裝置4中發光單元之各群組41a〜41c的發光 強度。因此，發光裝置4具有多段亮度調整的功能。 ® 以上，是以發光裝置為例，然本發明並不限制為發光 裝置，其亦可應用於發電裝置，例如圖7之太陽能電池裝 置5。 - 太陽能電池裝置5包括一太陽能電池單元51以及一 _ 電路板52。 太陽能電池單元51具有一基板511及至少一太陽能 電池元件512，太陽能電池元件512係設置於基板511。 本實施例並不限制太陽能電池元件512之材質，其可例如 17 201209992 為非晶矽、單晶矽或多晶矽。電路板52與太陽能電池單 元51之基板511直接連接，電路板52具有一開口 P，太 陽能電池元件512位於開口 P。 綜上所述，因依據本發明之一種發光裝置之驅動電路 板係與發光單元之基板直接連接，並可驅動發光單元之發 - 光二極體晶粒發光，且發光單元係位於驅動電路板之開 . 口。藉此，使發光單元所發出的熱量可藉由導熱效果良好 的基板（例如銅基板）快速地散發，避免發光單元因熱量 散發不良而造成發光效率降低甚至損毀。另外，因驅動電 _ 路板可使用價格較低廉的電路板，因此，本發明之發光裝 置亦可降低製作的成本。此外，太陽能電池裝置亦可應用 本發明之結構，使得太陽能電池裝置達到較佳的散熱效 果。 以上所述僅為舉例性，而非為限制性者。任何未脫離 本發明之精神與範疇，而對其進行之等效修改或變更，均 應包括於後附之申請專利範圍中。 、 ^ 【圖式簡單說明】 圖1為習知一種發光裝置的侧面示意圖； 圖2A為本發明之發光單元的俯視圖； _ 圖2B為本發明之驅動電路板的俯視圖， 圖2C及圖2D分別為本發明之發光裝置的組合俯視圖 及侧視圖； 圖3至圖4B分別為本發明另一態樣之發光裝置的侧 18 ⑤ 201209992 視圖； 圖5A及圖5B分別為本發明 裝置的分解示意圖及組合示意圖；以―之發光 圖6為本發明發光裝置之多段亮度調整功能的電路示 意圖；以及 圖7為本發明之太陽能電池裝置之側視圖。 【主要元件符號說明】 春 2、2a、2b、2c、3、4 :發光裝置 21、31 :發光單元 211、 311 :基板 212、 312 :發光二極體晶粒 213、 313.第一表面 _ 214、314 :第二表面 215、 225 ' 315、325 :連接墊 216、 316 :封膠體 籲217 :反射層 2 2、3 2 .驅動電路板 221、321 ··電路板 • 222、322:電子元件 .223、323 ··第三表面 224、324 :第四表面 23、33 :散熱結構 41 a〜41 c、A :群組 19 201209992 42 :控制電路 421 :偵測單元 422 :控制單元 5:太陽能電池裝置 51:太陽能電池單元 _ 511 :基板 . 512 :太陽能電池元件 52 :電路板 C :導線 · 0、 P :開口 01、 02、03 :通孔 S :螺絲 SI、S2 :焊球 S P .訊號 sw1]t〜sw14:第一切換單元 sw2广sw24:第二切換單元 _ sw3广sw35 :連接切換單元 ΤΙ 、 T2 :端 V :電源 20 ⑤201209992 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a light-emitting device and a solar cell device. [Prior Art] In recent years, the luminous efficiency of the light-emitting diode has been greatly improved due to the continuous improvement of the process and materials of the Light Emitting Diode (LED). Unlike general fluorescent lamps or power-saving bulbs, LEDs have low power consumption, long service life, safety rt], short response time and small size, so they have been widely used in many types of electronics. In the product. However, heat dissipation has always been a problem of light-emitting diodes as a light source. As the illumination time increases, the light-emitting device also generates considerable heat due to incomplete photoelectric conversion of the light-emitting diodes, so that the light-emitting diodes are emitted due to heat. Poor, resulting in reduced luminous efficiency or even damage. Referring to Figure 1, there is shown a side view of a conventional illumination device 1. The light-emitting device 1 comprises a plurality of light-emitting diode elements 11 and a drive circuit board 12. The driving circuit board 12 has a substrate 121 and a plurality of electronic components 122, and the electronic components 122 are disposed on the substrate 121. The light-emitting diode element 11 is disposed on the substrate 121 by a surface adhesion technique or a plug-in (DIP) method, and the driving circuit board 12 can drive and control the light-emitting diode element 11 to emit light. However, in order to allow the heat of the light-emitting diode element 11 to be quickly dissipated, the substrate 121 of the driving circuit board 12 generally needs to use a material having a good thermal conductivity of 201209992. For example, the copper plate is a metal base layer, and the surface of the metal base layer is covered with an insulating layer, and a circuit layer is further formed on the insulating layer, and the light emitting diode element 11 can be electrically connected to the driving circuit board 12 by a circuit layer. Thereby, the heat generated by the light-emitting diode element 11 can be quickly dissipated by the substrate 121 having a good heat-conducting effect, thereby preventing the light-emitting diode element from being degraded or damaged due to poor heat dissipation. Although the use of the copper substrate 121 having a good heat conduction effect can quickly dissipate the heat of the light-emitting diode element 11, the cost is relatively high, so that the manufacturing cost of the light-emitting φ device 1 cannot be lowered. Therefore, how to provide a light-emitting device can have a good heat-dissipating effect and can reduce the manufacturing cost, and has gradually become one of important topics. SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide a light-emitting device and a solar battery device which can have a good heat-dissipating effect and can reduce the manufacturing cost. In order to achieve the above object, a light-emitting device according to the present invention comprises a light-emitting unit and a drive circuit board. The light-emitting unit has a substrate and a plurality of light-emitting diode crystal grains, and the light-emitting diode crystal grains are arranged on the substrate by wire bonding or flip chip bonding. The driving circuit board is directly connected to the substrate of the light emitting unit and receives a power signal of the voltage variation and converts it into a driving signal to drive the light emitting diodes to emit light. The driving circuit board has an opening, and the light emitting unit is located at the opening. In one embodiment of the present invention, the LED dies are distinguished by a group of 201209992. Each group has a positive pole and a negative pole, and each positive pole and each negative pole are directly connected to the driving circuit board. In one embodiment of the invention, the groups of light-emitting diodes are connected in series, or in parallel, or in series and in parallel, in each group. In an embodiment of the invention, at least two of the light emitting diode dies are directly electrically connected via a wire. In one embodiment of the invention, the drive circuit board has a plurality of connection pads disposed in the opening. In an embodiment of the invention, the light emitting unit further has a gel covering the light emitting diode crystal grains. In an embodiment of the invention, the substrate further has a reflective surface for reflecting the light emitted by the illuminating diode dies. In an embodiment of the invention, the light emitting unit further includes a heat dissipation structure, and the heat dissipation structure is disposed on the opposite side of the substrate on which the light emitting diode crystal grains are disposed. In one embodiment of the invention, the heat dissipation structure is coupled to the drive circuit board or substrate. In one embodiment of the present invention, the plurality of screws are passed through the plurality of through holes to lock the substrate and the driving circuit board to the heat dissipation structure, and at least one of the through holes is provided with a plurality of solder balls. In an embodiment of the invention, the substrate has a first surface and a second surface disposed opposite to each other, and the LED arrays are disposed on the first surface. The first surface or the second surface of the substrate is directly connected to the driving circuit board. In an embodiment of the present invention, the driving circuit board further has a circuit board 201209992 and a plurality of electronic components. The electronic components are disposed on the circuit board, and the circuit board has a third surface and a fourth surface disposed opposite to each other. The surface is coupled to the substrate, and the electronic components are disposed on at least one of the third surface and the fourth surface. In order to achieve the above object, a solar cell apparatus according to the present invention comprises a solar cell unit and a circuit board. The solar cell unit has a substrate and at least one solar cell element, and the solar cell element is disposed on the substrate. The circuit board is directly connected to the substrate of the solar cell unit, and the circuit Φ board has an opening, and the solar cell element is located at the opening. As described above, the driving circuit board of the light-emitting device according to the present invention is directly connected to the substrate of the light-emitting unit, and can drive the light-emitting diode of the light-emitting unit to emit light, and the light-emitting unit is located at the opening of the driving circuit board. _ Thereby, the heat generated by the light-emitting unit can be quickly dissipated by a base plate (for example, a copper substrate) having a good heat conduction effect, thereby preventing the light-emitting unit from being degraded or even damaged due to poor heat dissipation. In addition, since the driving circuit board can use a less expensive circuit board, the light-emitting device of the present invention can also reduce the manufacturing cost. In addition, the solar cell device can also be applied to the structure of the present invention to achieve a better heat dissipation effect of the solar cell device. [Embodiment] Hereinafter, a light-emitting device and a solar cell device according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings, wherein the same elements will be described with the same reference numerals. 2A to 2D, the structure of the light-emitting device 2 of the present invention 201209992 will be described. A light-emitting device 2 according to a preferred embodiment of the present invention includes a light-emitting unit 21 and a drive circuit board 22. 2A is a plan view of the light-emitting unit 21, FIG. 2B is a plan view of the drive circuit board 22, FIG. 2C is a combined plan view of the light-emitting device 2, and FIG. 2D is a side view of the light-emitting device 2. The light emitting unit 21 has a substrate 211 and a plurality of light emitting diode dies 212, and the light emitting diode dies 212 are disposed on the substrate 211 by wire bonding or flip chip bonding. In other words, the light-emitting diode die 212 is directly disposed on the substrate 211 by a chip-on-board (COB) technique. The substrate 211 is made of a material having a good heat conduction effect, for example, a copper plate is used as a metal core of the substrate 211, and an insulating layer is covered on the surface of the metal substrate, and a circuit layer is formed on the insulating layer. The LED die 212 can be electrically connected by a circuit layer on the substrate 211. The substrate 211 may have a first surface 213 and a second surface 214 disposed opposite to each other, and the LED die 212 is disposed on the first surface 213. Of course, the LED die 212 can also be disposed on the second surface 214. In addition, the number and arrangement of the light-emitting diode chips 212 are not limited. This embodiment is described by taking an example in which the plurality of light-emitting diode dies 212 are arranged in a two-dimensional array on the substrate 211. Of course, the user can also arrange the plurality of LED dies 212 in a one-dimensional array or other arrangement according to their requirements, or even arrange them on the substrate 211 in an irregular arrangement. Since the light-emitting diode die 212 is directly disposed at the center of the substrate (copper plate) 211, the central portion of the substrate 211 is not provided with the insulating layer and the circuit layer 201209992 (the insulating layer and the circuit layer are disposed around the substrate 211). Therefore, in this embodiment, at least two of the LEDs 212 are directly electrically connected via a wire C, that is, both ends of the wire C are on the LED die 212, so that Wire C is vacated. In this case, the illuminating-diode die 212 is further divided into a plurality of groups, wherein each group may have only one illuminating diode die 212, or a plurality of illuminating diode dies 212, and each The illuminating color of the LED dies 212 may be white or the illuminating diodes 212 may be mixed into white or other colored light, which is not limited thereto. Therefore, the 'light-emitting diode dies 212' can be connected to each other in series, or in parallel, or simultaneously in series and in parallel with the wires C as required by the user. In addition, each group may have a positive electrode and a negative electrode for the outside, and each positive electrode and each negative electrode are electrically connected to the driving circuit board 22. In other words, the LED die 212 can be connected in series or in parallel, or in series and in parallel, according to the needs of the user, to divide the plurality of luminescence = body dies 212 H into a plurality of groups. Each group has a positive pole and a pole, and the positive pole and the negative pole are electrically connected to each other by a plurality of first connection pads 21S π-丄金^5, and then hooked to the driving circuit by a connection pad 215. The board 22, the ^ ^ 别 别 电 电 使 使 使 使 驱动 驱动 驱动 驱动 驱动 驱动 驱动 驱动 驱动 驱动 驱动 驱动 驱动 驱动 驱动 驱动 驱动 驱动 驱动 驱动 驱动 驱动 驱动 驱动 驱动 驱动 驱动 驱动 驱动 驱动 驱动 驱动 驱动 驱动 驱动 驱动 驱动 驱动 驱动. For example, after the figure t, the light-emitting diode die 212 string ^ & is composed of a positive (+) gamma π, and the ', ~ negative (-) and external electrical connecting circuit board 22 can be made by When the electric r encounters, the driver is sent by the positive and negative driving group of the group A, and the second is "lighting". In this embodiment, 'the different numbers of the dies are connected in series, and the ninth number of illuminating lights are divided into different groups to drive the genre 201209992 group to be off, so the illuminating device 2 can also have multiple segments. The body line c is directly electrically connected to the two types of light-emitting diodes, and the light-emitting diodes C are used for the photodiode day & 219 Q, and the two ends of the line c are directly connected to the test day particle 212, and the process steps can be saved. . The driving circuit board 22 is connected to the light emitting unit 2. In other words, the fourth surface 213 of the substrate 211 is directly connected to the driving circuit board 22 directly: or the second surface of the substrate 211 is connected by a cone. Here, the first substrate 13 of the substrate 211 is directly connected to the driving circuit board 22. The definition of the direct connection is that the dynamic circuit board 22 and the substrate 211 are directly electrically connected, for example, by soldering er) ^^^^^^^^# (anisotropic conductive film, ACF), or other metal or bonding agent. Among them, the anisotropic conductive adhesive is synthesized by high-quality resin and conductive particles, and is mainly used for connecting a different substrate and circuit, and has the functions of conducting and bonding. In this embodiment, the driving circuit board 22 and the substrate 211 of the light emitting unit 21 are exemplified by a solder bump solder connection. In addition, the illuminating device 2 of the embodiment is a light-emitting diode bulb. Therefore, the driving circuit board 22 is circular to be accommodated in the lamp housing. Of course, the driving circuit board 22 can also be in other shapes, for example. It is a rectangle, a diamond, an ellipse, and the like. The driving circuit board 22 has a circuit board 221 and a plurality of electronic components (e.g., capacitors, inductors, resistors, etc.) 222, and the electronic components 222 are disposed on the circuit board 221. The circuit board 221 has a third surface 223 and a fourth surface 224 disposed opposite to each other. The third surface 223 is coupled to the substrate 211 10 201209992, and the electronic component 222 is disposed on at least one of the third surface 223 and the fourth surface 224. Here, the material of the circuit board 221 may be, for example, metal, glass, ceramic or resin, and is not limited thereto. The electronic component 222 is exemplified by being disposed on the fourth surface 224. Of course, the electronic component -222 can also be disposed on the third surface 223. The driven electronic component 222 can also be disposed on the third surface 223 and the fourth surface 224 simultaneously. The driving circuit board 22 receives a power signal of a voltage change and converts it into a driving signal to drive the light emitting diode chips 212 to emit light. The φ power signal can be, for example, an AC signal or a DC signal. The power signal of the voltage change is, for example, the voltage of the car battery output. If the voltage output from the car battery is not rectified by the regulated line, there may be some slight ripples. Therefore, it can be regarded as the power signal of the voltage changing. In addition, or for example, an alternating current is outputted by a bridge rectifier, and the output voltage is also slightly chopped. Therefore, it can also be regarded as a power signal with a voltage change. Of course, the present invention does not limit the power supply signals received by the driving circuit board 22 to only the above two types, as long as the received power signal can be converted into a driving signal to drive the LEDs 212 to emit light. can. In addition, the driving circuit board 22 has an opening 0, and the light emitting unit 21 is located at the opening 0, and the light emitting diode chips 212 are exposed by the opening 0. In addition, the driving circuit board 22 further has a plurality of second connecting pads 225 looped on the opening 0, and the first connecting pads 215 around the substrate 211 are respectively disposed and overlapped with the second connecting pads 225, and the first connection is made. The pad 215 is soldered to the second connection pad 225, so that the drive circuit board 22 can drive the groups of the 201209992 LED die 212 to emit light. Since the electronic component 222 is disposed on the board 221, it is often "surface-adhesive (SMT) process, and is soldered to the grid board 221 °. Therefore, when the first connection pad 215 and the second connection pad 225 are also connected by soldering means. , it can reduce the time required for the process. In particular, the driver circuit board 22 of the present invention can control the connection topology between groups according to the parameters representing the lighting states of the groups, and can control the illumination of the LED die 212. The number of 罝. The parameters of the above-mentioned light-emitting state are, for example, the current value, the voltage value electric power, the light-emitting intensity, and the light-emitting power of each group. In other words, the driving circuit board 22 can automatically control the current flowing through the groups to change the light-emitting characteristics of the light-emitting unit 21 by changing the connection between the groups to respond to the current voltage change of the external power source. In addition, the driving circuit board 22 can also have a plurality of different connection modes between groups, and therefore, the utilization ratio of the light-emitting diode chips 212 of each group under variable power driving can be greatly improved. In addition, the light-emitting unit 21 may further have a glue body 216, and the sealant 216 covers the light-emitting diode chips 212. The encapsulant 216 may also contain a fluorescent substance, and after being excited by the light emitting diode die 212 to be mixed, the light emitting unit 21 may generate desired color light, for example, white light. In addition, as shown in FIG. 2D, the substrate 211 of the illuminating device 2 may further have a reflective surface for reflecting the light emitted by the illuminating diode dies 212. In the present embodiment, the first surface 213 of the light-emitting unit 21 is made of a high reflectivity material and has a reflective surface as an example. Alternatively, as shown in FIG. 3, a 201209992 high reflectivity, metallized reflective layer 217 or reflective sheet may be attached to the first surface 213 of the light emitting unit 21 to form a reflective surface. The light emitted by the light emitting diodes 212 can be reflected by the reflective surface to enhance the light utilization efficiency of the light emitting unit 21. Furthermore, the electronic component 222 of the driving circuit board 22 can be disposed on the third surface 223 of the driving circuit board 22. The third surface 223 is a surface connected to the substrate 211, so that the electronic component 222 can be accommodated. In the range of the difference between the driving circuit board 22 and the substrate 211, the height of the light-emitting device 2a is not additionally increased, contributing to the thinning of the product. φ In addition, please refer to Fig. 4A, which is a schematic view of a light-emitting device 2b according to another aspect of the present invention. In order to further improve the heat dissipation efficiency of the light-emitting device 2b, the light-emitting device 2b may further include a heat-dissipating structure 23, such as a heat-dissipating fin, to assist in heat dissipation. The heat dissipation structure 23 is disposed on the opposite side of the substrate 211 on which the light emitting diode die 212 is disposed. Here, the heat dissipation structure 23 is disposed on the second surface 214 of the substrate 211 as an example. In addition, the heat dissipation structure 23 can be coupled to the driving circuit board 22 or the substrate 211. Here, the heat dissipation structure 23 is connected to the substrate 211 as an example, or in other embodiments, the heat dissipation structure 23 can be locked to the driving circuit board 22. Referring to FIG. 4B, it is a schematic view of a light-emitting device-2c according to still another aspect of the present invention. The illuminating device 2c is mainly different from the illuminating device 2b of Fig. 4A in that the substrate 211 of the illuminating device 2c is directly connected to the driving circuit board 221 via the second surface 214. Here, the second surface 214 of the substrate 211 is directly connected to the fourth surface 224 of the driving circuit board 221. 13 201209992 Further, please refer to FIG. 5A and FIG. 5B, which are respectively an exploded schematic view and a combined schematic view of a light-emitting device 3 according to another preferred embodiment of the present invention. The main difference between the illuminating device 3 and the illuminating device 2b is that the illuminating device 3 is soldered to the second connecting pad 325 by the first connecting pad 315, and the plurality of through holes 01 to 03 are also used to lock the substrate 311. With the circuit board 321 to the heat dissipation structure 33, the substrate 311 of the light-emitting unit 31 and the circuit board 321 of the drive circuit board 32 can be more stably coupled to the heat dissipation structure 33. It is to be noted that, before the substrate 311 and the circuit board 321 are locked to the heat dissipation structure 33, a plurality of solder balls S1 may be disposed on one of the through holes 01 for connecting the circuit board 321 or a through hole 02 for connecting the substrate 311. The buffering function can be used to disperse the stress of the locking substrate 311 and the circuit board 321, and the solder ball S1 has a height and a solder ball between the adjacent first connecting pad 315 and the second connecting pad 325. Since the heights of S2 are approximately equal, it is possible to avoid bending deformation of the substrate 311 or the electric circuit board 321 due to the difference in the pitch between the substrate 311 and the circuit board 321 during the locking. The solder balls SI and S2 are disposed on the circuit board 321 as an example, and may be disposed on the substrate 311. The other components of the illuminating device 3 have the same structure and function as those of the illuminating device 2, and will not be described again. Hereinafter, please refer to FIG. 6 for explaining the multi-segment brightness adjustment function of the light-emitting device of the present invention. The circuit of the multi-segment brightness adjustment function of Figure 6 can be applied to all embodiments of the illumination device. The light-emitting unit of the light-emitting device 4 comprises three light-emitting diode group groups 41a to 41c, and the groups 41a to 41c respectively have one, two and four light-emitting lights - CS) 14 201209992. In this embodiment, the groups 41 a to 41 c are electrically connected to the first power source 1 and the second power terminal 2 of the external power source V in a manner of being connected in parallel with each other, and the first power source is One of the external power sources V is a power input terminal, and the second power source is a ground terminal T2. It is explained that the light-emitting unit of the light-emitting device 4 of the present embodiment has three light-emitting diode die groups 41a to 41c, and each of the groups 41a, 41b, and 41c has one, two, and four, respectively. For example, a light-emitting diode grain is used. However, in operation, other numbers of group φ groups and light-emitting diode dies can be operated according to actual needs, and the LED dies of each group can be connected in series or in parallel with each other. Connection method. The group 41a has a connection switching unit SW31, the group 41b has two connection switching units SW32, SW33, and the group 41c has two connection switching units SW34, SW35. The connection switching unit SW31 of the group 41a is electrically connected to the connection switching unit SW32 of the group 41b and the connection switching unit SW34 of the group 41c, and the connection switching unit SW33 of the group 41b is switched with the group 41c. The unit SW35 is electrically connected. In the present embodiment, the connection switching unit of each of the groups 41a to 41c is connected in series with the connection switching unit in the group connected to the connection switching unit. For example, the connection switching unit SW31 of the group 41a is connected in series with the connection switching unit SW32 in the group 41b connected to the switching unit SW31. In addition, in practical use, one of the first switching units SWn SW14, a second switching unit SW2, and the connection switching units SW31 to SW35 of each of the groups 41a to 41c are respectively a semiconductor component, for example, a dual carrier. A transistor (BJT) or a field effect transistor (FET). 15 201209992 The driving circuit board of the illuminating device 4 further comprises a control circuit 42 which comprises a detecting unit 421 and a control unit 422. The detecting unit 421 detects the parameters representing the lighting states of the groups 41a to 41c and generates a parameter signal SP. In an implementation, the detecting unit 421 includes a resistor, a photodetector, a photodiode, an inductive coil, an electromagnetic inductive component, and/or a magnetoelectric sensing component, and the detecting unit 421 can be a Instant detection unit. The control unit 422 is electrically connected to the detecting unit 421, and controls the first switching units SWu SWSW, the second switching units SW21 SWSW24, and or the switching unit SW3 wide SW35 according to the parameter signal SP to adjust the flow through the group. The current of 41a~41c. In addition, the control circuit 42 can be a digital control circuit or an analog control circuit depending on the requirements of the product. In actual operation, when the external power source V is input to the light-emitting device 4, the control unit 422 turns on the first switching unit SW's & second switching unit SW21 of the control group 41a to turn on the state, and causes the group 41a to illuminate. When the voltage level of the external power source V rises, the current value flowing through the group 41a also increases, and the control unit 422 will switch the first switching unit SWu and the second switching unit according to the parameter signal _SP generated by the detecting unit 421. The SW22 and the connection switching units SW31 and SW32 are turned on, so that the groups 41a and 41b are connected in series and simultaneously lit. That is, the load of the external power source is increased, and the voltage applied to the light-emitting device 4 flows through the group 41a. The current of ~41c meets the requirements of the design and the specifications of the components, so as to avoid damage to the groups 41a to 41c due to changes in the external power supply. If the voltage level of the external power supply V continues to increase, control The unit 422 controls the first switching unit SWn, the second switching unit SW24, and the connection switching units SW31 to SW33 and SW35 to be in the state of 16 5 201209992, and causes the groups 41a to 41c to be simultaneously illuminated. The groups 41 a to 4 lc respectively have one, two and four light emitting diode dies, so that the control unit 422 can make the illuminating device 4 turn on the group 41a., the group 41b and the group respectively according to the parameter signal SP. Group .41c, and illuminate one to seven light-emitting diode dies. In addition, in this embodiment, groups may be connected in parallel or in series with each other by turning on different switching units. For example, the control unit 422 can simultaneously turn on the first switching unit SWu-SWm φ and the second switching unit SW2!~SW24 to form the parallel connection of the groups 41a to 41c, or to turn on the first switching units SWu, SW14, The second switching units SW22 and SW24 and the connection switching units SW31 and SW32 are connected in series so that the groups 41a and 41b are connected in series, and are connected in parallel with the group 41c. In other words, the control unit 422 can be based on the parameter signal SP. The groups '41a to 41c are formed in a plurality of parallel connection modes to achieve the effect of the component flow, thereby controlling the luminous intensity of each of the groups 41a to 41c of the light-emitting units in the light-emitting device 4. Therefore, the light-emitting device 4 has a plurality of segments. Brightness adjustment The above is an example of a light-emitting device, but the invention is not limited to a light-emitting device, and can also be applied to a power-generating device, such as the solar cell device 5 of Fig. 7. - The solar cell device 5 includes a solar cell unit 51 And a circuit board 52. The solar battery unit 51 has a substrate 511 and at least one solar cell element 512, and the solar cell element 512 is disposed on the substrate 511. This embodiment does not limit the material of the solar cell element 512, which may be, for example, 17 201209992 is amorphous germanium, single crystal germanium or polycrystalline germanium. The circuit board 52 is directly connected to the substrate 511 of the solar battery unit 51. The circuit board 52 has an opening P, and the solar battery element 512 is located at the opening P. In summary, the driving circuit board of the light-emitting device according to the present invention is directly connected to the substrate of the light-emitting unit, and can drive the light-emitting diode of the light-emitting unit to emit light, and the light-emitting unit is located on the driving circuit board. Open. Mouth. Thereby, the heat generated by the light-emitting unit can be quickly dissipated by a substrate having a good heat-conducting effect (for example, a copper substrate), thereby preventing the light-emitting unit from being degraded or even damaged due to poor heat dissipation. Further, since the driving board can use a less expensive board, the lighting apparatus of the present invention can also reduce the manufacturing cost. In addition, the solar cell device can also be applied to the structure of the present invention to achieve a better heat dissipation effect of the solar cell device. The above is intended to be illustrative only and not limiting. Any equivalent modifications or alterations to the spirit and scope of the invention are intended to be included in the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a side view of a conventional light-emitting device; FIG. 2A is a plan view of a light-emitting unit of the present invention; FIG. 2B is a plan view of the driving circuit board of the present invention, and FIG. 2C and FIG. FIG. 3 to FIG. 4B are respectively a side view of a light-emitting device of the present invention; FIG. 5A and FIG. 5B are respectively an exploded view of the device of the present invention; FIG. 7 is a schematic side view of a multi-segment brightness adjustment function of the light-emitting device of the present invention; and FIG. 7 is a side view of the solar cell device of the present invention. [Major component symbol description] Spring 2, 2a, 2b, 2c, 3, 4: Light-emitting device 21, 31: Light-emitting unit 211, 311: Substrate 212, 312: Light-emitting diode die 213, 313. First surface _ 214, 314: second surface 215, 225 '315, 325: connection pads 216, 316: sealant 217: reflective layer 2 2, 3 2 . drive circuit board 221, 321 · · circuit board • 222, 322: electronic Components .223, 323 · Third surface 224, 324: Fourth surface 23, 33: Heat dissipation structure 41 a to 41 c, A: Group 19 201209992 42: Control circuit 421: Detection unit 422: Control unit 5: Solar cell device 51: solar cell unit _511: substrate. 512: solar cell element 52: circuit board C: wire · 0, P: opening 01, 02, 03: through hole S: screw SI, S2: solder ball SP. Signal sw1]t~sw14: first switching unit sw2 wide sw24: second switching unit_sw3 wide sw35: connection switching unit ΤΙ, T2: terminal V: power supply 20 5