CN108417691A - Linear light source preparation method - Google Patents
Linear light source preparation method Download PDFInfo
- Publication number
- CN108417691A CN108417691A CN201810346752.1A CN201810346752A CN108417691A CN 108417691 A CN108417691 A CN 108417691A CN 201810346752 A CN201810346752 A CN 201810346752A CN 108417691 A CN108417691 A CN 108417691A
- Authority
- CN
- China
- Prior art keywords
- light source
- linear light
- substrate
- source preparation
- preparation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 239000000463 material Substances 0.000 claims abstract description 23
- 239000011248 coating agent Substances 0.000 claims abstract description 22
- 238000000576 coating method Methods 0.000 claims abstract description 22
- 238000000465 moulding Methods 0.000 claims abstract description 7
- 238000005538 encapsulation Methods 0.000 claims abstract description 6
- 238000003466 welding Methods 0.000 claims abstract description 6
- 238000005452 bending Methods 0.000 claims description 3
- 229910052594 sapphire Inorganic materials 0.000 claims description 3
- 239000010980 sapphire Substances 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 2
- 238000007711 solidification Methods 0.000 claims description 2
- 230000008023 solidification Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000005516 engineering process Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 238000003491 array Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
A kind of linear light source preparation method provided by the invention, the linear light source preparation method include the following steps：Feed, linear light source holder and point light source are provided, the linear light source holder includes two spaced holders and the substrate that is set between two holders, and the substrate includes first surface equipped with the first fluorescence coating and the second surface being oppositely arranged with the first surface；Welding welds circuit in the second surface；Encapsulation, encapsulates the point light source on the circuit；Coating coats fluorescent material in the second surface；Curing molding carries out the fluorescent material on the second surface to be formed by curing the second fluorescence coating.Compared with the relevant technologies, linear light source preparation method provided by the invention is cost-effective and improves production efficiency.
Description
Technical field
The present invention relates to field of illuminating device, more particularly, to a kind of linear light source making side of LED lamp
Method.
Background technology
LED filament can realize that 360 ° of full angles shine, and without installing the optical device of lens etc additional, can be applied to crystal
The illuminating products such as pendent lamp, candle lamp, bulb lamp, wall lamp bring unprecedented lighting experience.
The existing LED filament product made of the transparent substrates such as sapphire, glass needs to realize that full light shines
It is molded fluorescent glue in the surrounding of transparent substrate filament or carries out two-sided dispensing in the front and back of transparent substrate filament, still
The two-sided fluorescent glue mode of fluorescent glue or substrate of molding, processing procedure is cumbersome, and material amounts are big, of high cost.
Therefore, it is necessary to provide a kind of new linear light source preparation method to solve the above problems.
Invention content
The technical problem to be solved in the invention is to provide linear light source that is a kind of cost-effective and improving production efficiency and makes
Method.
To solve the above problems, the present invention provides a kind of linear light source preparation method, the linear light source preparation method includes
Following steps：
S1, feed, provide linear light source holder and point light source, the linear light source holder include two spaced holders with
And it is set to the substrate between two holders, the substrate includes first surface equipped with the first fluorescence coating and with described the
The second surface that one surface is oppositely arranged；
S2, welding weld circuit in the second surface；
S3, encapsulation encapsulate the point light source on the circuit；
S4, coating coat fluorescent material in the second surface；
S5, curing molding carry out the fluorescent material on the second surface to be formed by curing the second fluorescence coating.
Preferably, in the S1 steps, the holder includes the multiple intervals setting extended to the direction of the substrate
Electrode, one end of the electrode is electrically connected to the holder, and the other end packet of the electrode sets the end of the substrate.
Preferably, the electrode is equipped with clamping limb and sets the substrate, the clamping limb bending by the clamping limb packet
Extend and presses set on first fluorescence coating.
Preferably, in the S2 steps, the circuit is electrically connected with the electrode.
Preferably, in the S5 steps, solidification temperature is 120 °.
Preferably, the substrate is made of ceramics or sapphire material.
Compared with the relevant technologies, linear light source preparation method of the invention has the advantages that, by with fluorescence
After carrying out welding and encapsulation step on the substrate of material, then it is coated fluorescent material, and carries out curing molding, finally made
Make linear light source, entire manufacturing process is only carried out once being coated with without carrying out double spread fluorescent material, be reduced together
Process reduces cost, improves production efficiency.
Description of the drawings
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing is briefly described, and drawings in the following description are only some embodiments of the invention, common for this field
For technical staff, without creative efforts, other attached drawings are can also be obtained according to these attached drawings,
In：
Fig. 1 is the method flow diagram of linear light source preparation method of the present invention；
Fig. 2 is linear light source preparation method center line light source bracket structural schematic diagram of the present invention；
Fig. 3 is the structural schematic diagram of electrode and substrate in linear light source preparation method of the present invention.
Specific implementation mode
The technical scheme in the embodiments of the invention will be clearly and completely described below, it is clear that described implementation
Example is only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, this field is common
All other embodiment that technical staff is obtained without making creative work belongs to the model that the present invention protects
It encloses.
Referring to Fig. 1, the present invention provides a kind of linear light source preparation method, the linear light source preparation method includes following step
Suddenly：
S1, feed, provide linear light source holder and point light source, the linear light source holder include two spaced holders with
And it is set to the substrate between two holders, the substrate includes first surface equipped with the first fluorescence coating and with described the
The second surface that one surface is oppositely arranged；
Fig. 2 and Fig. 3 are please referred to, the linear light source holder 100 includes two relatively spaced holders 1 and multiple arrays
The substrate 2 being set between two holders, the substrate 2 include equipped with the first fluorescence coating 21 first surface 201 and with
The second surface 202 that the first surface 201 is oppositely arranged.The thickness of first fluorescence coating 21 is 0.5-1.5mm.Described
Two surfaces 202 are used to provide installation site to the point light source (not shown).
The holder 1 includes the multiple spaced electrodes 11 extended to the direction of the substrate 2.The electrode 11
One end is electrically connected to the holder 1, and the other end packet of the electrode 11 sets the end of the substrate 2, and the electrode 11 is equipped with folder
Gripping arm 110 simultaneously sets the substrate 2 by the packet of the clamping limb 110, and the clamping limb 110 is from 11 end of the electrode to the base
The direction bending of plate 2 extends and presses set on first fluorescence coating 21.
Two electrodes 11 for being connected to 2 both ends of the substrate are respectively used to serve as positive electrode and negative electrode.This implementation
In mode, the electrode 11 for serving as positive electrode is equipped with through-hole 111.
S2, welding weld circuit in the second surface；
In the S2 steps, the opposite second surface 202 of first fluorescence coating 21 is equipped in the substrate 2
The conducting wire for being connect with the electrode 11 is welded, the conducting wire is used to power to the point light source (not shown).
S3, encapsulation encapsulate the point light source on the circuit；
In the S3 steps, point described in the circuit post package is welded in the second surface 202 of the substrate 2
Light source (not shown), and the point light source (not shown) is connect with the conducting wire.
S4, coating coat fluorescent material in the second surface；
In the S4 steps, the second surface 202 that the point light source (not shown) is encapsulated in the substrate 2 is coated with
Fluorescent material makes the fluorescent material coat the point light source (not shown) and the substrate 2, can be more preferable using fluorescent material
The change point light source (not shown) colour temperature.
S5, curing molding carry out the fluorescent material on the second surface to be formed by curing the second fluorescence coating.
In the S5 steps, the fluorescent material being coated on the second surface 202 of the substrate 2 is cured,
Temperature is 120 ° so that fluorescent material the second fluorescence coating (not shown) of formation, passes through 21 He of the first fluorescence coating when being cured
The second fluorescence coating (not shown) coats the substrate 2 and the point light source (not shown), is allowed to form a linear light source whole
Body and not light leakage, light are soft bright.The thickness of the second fluorescence coating (not shown) can be set according to actual demand.
Compared with the relevant technologies, linear light source preparation method of the invention has the advantages that, by with fluorescence
After carrying out welding and encapsulation step on the substrate of material, then it is coated fluorescent material, and carries out curing molding, finally made
Make linear light source, entire manufacturing process is only carried out once being coated with without carrying out double spread fluorescent material, be reduced together
Process reduces cost, improves production efficiency.
Example the above is only the implementation of the present invention is not intended to limit the scope of the invention, every to utilize this hair
Equivalent structure or equivalent flow shift made by bright specification and accompanying drawing content is applied directly or indirectly in other relevant skills
Art field, is included within the scope of the present invention.
Claims (6)
1. a kind of linear light source preparation method, which is characterized in that the linear light source preparation method includes the following steps：
S1, feed, provide linear light source holder and point light source, and the linear light source holder includes two spaced holders and sets
The substrate being placed between two holders, the substrate include equipped with the first fluorescence coating first surface and with first table
The second surface that face is oppositely arranged；
S2, welding weld circuit in the second surface；
S3, encapsulation encapsulate the point light source on the circuit；
S4, coating coat fluorescent material in the second surface；
S5, curing molding carry out the fluorescent material on the second surface to be formed by curing the second fluorescence coating.
2. linear light source preparation method according to claim 1, it is characterised in that：In the S1 steps, the holder packet
The multiple spaced electrodes extended to the direction of the substrate are included, one end of the electrode is electrically connected to the holder, institute
The other end packet for stating electrode sets the end of the substrate.
3. linear light source preparation method according to claim 2, it is characterised in that：The electrode is equipped with clamping limb and passes through institute
It states clamping limb packet and sets the substrate, the clamping limb bending extends and presses set on first fluorescence coating.
4. linear light source preparation method according to claim 1, it is characterised in that：In the S2 steps, the circuit with
The electrode electrical connection.
5. linear light source preparation method according to claim 1, it is characterised in that：In the S5 steps, solidification temperature is
120°。
6. linear light source preparation method according to claim 1, it is characterised in that：The substrate is using ceramics or sapphire material
Material makes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810346752.1A CN108417691A (en) | 2018-04-18 | 2018-04-18 | Linear light source preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810346752.1A CN108417691A (en) | 2018-04-18 | 2018-04-18 | Linear light source preparation method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108417691A true CN108417691A (en) | 2018-08-17 |
Family
ID=63134231
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810346752.1A Pending CN108417691A (en) | 2018-04-18 | 2018-04-18 | Linear light source preparation method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108417691A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103456869A (en) * | 2012-05-29 | 2013-12-18 | 璨圆光电股份有限公司 | Light-emitting device, light-emitting diode chip for forming multi-directional light emission and sapphire substrate thereof |
| CN104600181A (en) * | 2015-01-29 | 2015-05-06 | 江西合晶科技有限公司 | LED (Light Emitting Diode) light bar and preparation method thereof |
| CN204464275U (en) * | 2015-02-11 | 2015-07-08 | 江西远球电器科技有限公司 | A kind of sealing device of New LED filament |
| CN105047655A (en) * | 2015-08-11 | 2015-11-11 | 杭州恒星高虹光电科技股份有限公司 | AC power supplied full-angle light emitting diode (LED) luminous body and fabrication method thereof |
-
2018
- 2018-04-18 CN CN201810346752.1A patent/CN108417691A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103456869A (en) * | 2012-05-29 | 2013-12-18 | 璨圆光电股份有限公司 | Light-emitting device, light-emitting diode chip for forming multi-directional light emission and sapphire substrate thereof |
| CN104600181A (en) * | 2015-01-29 | 2015-05-06 | 江西合晶科技有限公司 | LED (Light Emitting Diode) light bar and preparation method thereof |
| CN204464275U (en) * | 2015-02-11 | 2015-07-08 | 江西远球电器科技有限公司 | A kind of sealing device of New LED filament |
| CN105047655A (en) * | 2015-08-11 | 2015-11-11 | 杭州恒星高虹光电科技股份有限公司 | AC power supplied full-angle light emitting diode (LED) luminous body and fabrication method thereof |
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