CN102881810A - Light emitting source device - Google Patents

Light emitting source device Download PDF

Info

Publication number
CN102881810A
CN102881810A CN2011102049362A CN201110204936A CN102881810A CN 102881810 A CN102881810 A CN 102881810A CN 2011102049362 A CN2011102049362 A CN 2011102049362A CN 201110204936 A CN201110204936 A CN 201110204936A CN 102881810 A CN102881810 A CN 102881810A
Authority
CN
China
Prior art keywords
light emitting
groove
base plate
reflector
installation base
Prior art date
Application number
CN2011102049362A
Other languages
Chinese (zh)
Other versions
CN102881810B (en
Inventor
李学旻
Original Assignee
李学旻
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 李学旻 filed Critical 李学旻
Priority to CN201110204936.2A priority Critical patent/CN102881810B/en
Publication of CN102881810A publication Critical patent/CN102881810A/en
Application granted granted Critical
Publication of CN102881810B publication Critical patent/CN102881810B/en

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/49105Connecting at different heights
    • H01L2224/49107Connecting at different heights on the semiconductor or solid-state body
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors

Abstract

A light emitting source device comprises a transparent mounting substrate, at least one light emitting diode chip and a reflector, wherein the substrate is provided with a chip mounting surface, predetermining circuit tracks formed on the chip mounting surface, and external circuit connection points formed on the chip mounting surface, positioned at the two terminal parts and electrically connected with the predetermining circuit tracks; the light emitting diode chip(s) is (are) mounted on the chip mounting surface of the mounting substrate in a flip-chip manner, so that an electrode of each light emitting diode chip is electrically connected the corresponding circuit track; the reflector is mounted on the chip mounting surface of the mounting substrate to cover the light emitting diode chip(s), but exposed out of the external circuit connection points positioned at the two terminal parts of the mounting substrate, so that the external connection points can be electrically connected with an external circuit in an appropriate manner; an irregularly-shaped groove is formed on the surface of the reflector, facing towards the mounting surface of the mounting substrate; and a reflecting layer for reflecting light emitted by the light emitting diode chip(s) to the mounting substrate is arranged on the surface of the groove.

Description

Light emitting source apparatus

[technical field]

The invention relates to a kind of light emitting source apparatus, the light emitting source apparatus that is particularly promoted relevant for a kind of brightness.

[background technology]

See also illustrated in figures 1 and 2ly, at present on the market the light emitting source apparatus that is formed by LED wafer is to comprise a LED wafer 1 mostly.The main light-emitting area 10 of this LED wafer 1 is for being provided with the surface of electrode 11, and therefore about at least 30% light from the emitted light in this surface 10 can be blocked and can't be utilized by electrode 11 and wire 12.On the other hand, other five surface emitting light out from this LED wafer 1 also is to be utilized.Therefore, this case inventor proposes a kind ofly can fill part a light emitting source apparatus that utilizes to the light that emits from the LED wafer all surface.

In view of this, the inventor then is engaged in the many years of experience of the sector with it, and in line with the spirit of keeping on improving, the active research improvement has the present invention's " a kind of light emitting source apparatus " to produce then.

[summary of the invention]

Light emitting source apparatus for providing a kind of brightness to be promoted is provided.

The feature one of according to the present invention, a kind of light emitting source apparatus is provided, the feature of this light emitting source apparatus is to be to comprise: a transparent installation base plate, this substrate have wafer the surface is installed, be formed at this wafer lip-deep predetermining circuit track is installed and be formed on this wafer install be positioned on surface two terminal parts and with the outside tie point of this predetermining circuit track electrical connection; At least one LED wafer, this at least one LED wafer are to cover wafer that crystal type is installed on this installation base plate the upper so that electrode of this at least one LED wafer in surface is installed is and corresponding circuit trace electrical connection; And reflector, it is upper in order to do covering these LED wafer but expose the position in the external circuit connecting points of the two terminal parts of this installation base plate so that these outside tie points can come to be electrically connected with external circuit by rights that this reflector is that the wafer that is installed on this installation base plate is installed the surface, this reflector is to be formed with one to become erose groove on the surface towards the installation surface of this installation base plate, and the surface of this groove is to be provided with one deck to be used for the reflector of the light reflection that emits from these LED wafer to this installation base plate.

[description of drawings]

Fig. 1 is a diagrammatic side view that shows existing light emitting source apparatus;

Fig. 2 is a schematic top plan view that shows the existing light emitting source apparatus of Fig. 1;

Fig. 3 is a signal exploded perspective view that shows the light emitting source apparatus of the first embodiment of the present invention;

Fig. 4 is a signal combination of side view that shows the light emitting source apparatus of the first embodiment of the present invention;

Fig. 5 is a signal combination of side view that shows the light emitting source apparatus of the second embodiment of the present invention.

1 LED wafer, 22 external circuit connecting points

10 main light-emitting area 3 LED wafer

11 electrodes, 30 electrodes

12 wires, 4 reflectors

2 installation base plates, 40 grooves

20 wafers are installed surperficial 41 reflection grooves

21 circuit trace, 5 heat sink materials

[embodiment]

In the detailed description of the preferred embodiment of the present invention of back, same or similar element is to be indicated by identical label, and their detailed description will be omitted.In addition, for clear announcement feature of the present invention, the element in graphic is not to describe by actual ratio.

Fig. 3 is a signal exploded perspective view that shows the light emitting source apparatus of embodiments of the invention.

As shown in FIG. 3, light emitting source apparatus of the present invention comprises a transparent installation base plate 2, at least one LED wafer 3, reaches a reflector 4.

In the present embodiment, this transparent installation base plate 2 is to be made by glass, yet this installation base plate 2 also can be to be made by any other material that is fit to, as long as can fit foot ground printing opacity.Be more preferably, this installation base plate 2 is to be made by the material that has printing opacity and heat dissipation characteristics concurrently.This installation base plate 2 have wafer surface 20 is installed, be formed at this wafer the predetermining circuit track 21 on the surface 20 is installed and be formed on this wafer install be positioned on the surface 20 two terminal parts and with the external circuit connecting points 22 of these predetermining circuit track 21 electrical connections.

These LED wafer 3 are that the wafer that is installed in any suitable manner this installation base plate 2 is installed on the surface 20 so that the electrode 30 of each LED wafer 3 is and corresponding circuit trace 21 is electrically connected.In the present embodiment, these LED wafer 3 are that the mode of covering crystalline substance (Flip-Chip) is installed on this installation base plate 2.Certainly, these LED wafer 3 also can be by similarly being that mode as the routing (wire bonding) is installed on this installation base plate 2.

As shown in Figure 4, thus this reflector 4 is wafers of being installed on this installation base plate 2 to be installed and can cover these LED wafer 3 on the surface 20 but do not cover or not exclusively cover the position at the outside tie points 22 of two terminal parts of this installation base plate 2 so that these outside tie points 22 can come to be electrically connected with external circuit by rights.This reflector 4 can be to be made and be to be formed with a roughly groove 40 of W shape on the surface towards the installation surface 20 of this installation base plate 2 by the material that is fit to of any tool great heat radiation effect.The surface of this groove 40 is to be provided with one deck for the reflector 41 of the light reflection that all surface from this LED wafer 3 is emitted to this installation base plate 2.

Should be noted that this groove 40 also can be a roughly groove of V-arrangement.Perhaps, this groove 40 also can be the groove of other shapes, as long as can allow the light reflection that emits from all surface of this LED wafer 3 to this installation base plate 2.

In the present embodiment, be more to be filled with any suitable heat sink material 5 that is in as liquid state, solid-state or jelly shape etc. between this installation base plate 2 and this reflector 4.Perhaps, as shown in FIG. 5, this reflector 4 is designed so that is contact with the groove face of the central part of this groove 40 to be beneficial to dispel the heat in the surface towards the groove 40 of this reflector 4 of each LED wafer 3.In the embodiment of Fig. 5, because the surface towards the groove 40 of reflector 4 of these wafers 3 is to contact with the groove face of the central part of this groove 40, between this installation base plate 2 and this reflector 4, be to fill heat sink material 5.

By aforesaid structure, electrical path is to reach via reflector 4 because reach via transparent installation base plate 2 in the path of light, therefore reaches photodetachment, can not produce radiant heat and makes light decay serious.On the other hand, the light that is penetrated by other surfaces except towards the surface of installation base plate 2 of LED wafer 3 can all penetrate outside the installation base plate 2 under via the reflection of reflector 4, does not have the unemployed situation of light and occurs.

In sum, " light emitting source apparatus " of the present invention, really the above-mentioned disclosed structure of energy mat, device reach purpose and the effect of expection, and do not see also unexposed use of publication before the application, meet the important documents such as the novelty of patent of invention, progress.

Above-mentioned graphic and explanation of being taken off only is the present invention's embodiment, and is non-for limiting the present invention's embodiment; Generally be familiar with people's bodyguard of this skill, its institute is according to the present invention's feature category, and other equivalences of being done change or modify, and all should be encompassed in the present invention's the claim.

Claims (5)

1. light emitting source apparatus is characterized in that: comprise:
A transparent installation base plate, this substrate have wafer the surface is installed, be formed at this wafer lip-deep predetermining circuit track is installed and be formed on this wafer install be positioned on surface two terminal parts and with the external circuit connecting points of this predetermining circuit track electrical connection;
At least one LED wafer, this at least one LED wafer have at least two electrodes and are to cover wafer that crystal type is installed on this installation base plate the upper so that electrode of this at least one LED wafer in surface is installed is and corresponding circuit trace electrical connection; And
A reflector, it is upper in order to do covering these LED wafer but expose the position in the external circuit connecting points of two terminal parts of this installation base plate so that these external circuit connecting points can be come to be electrically connected with external circuit by rights that this reflector is that the wafer that is installed on this installation base plate is installed the surface, this reflector is to be formed with one to become erose groove on the surface towards the installation surface of this installation base plate, and the surface of this groove is to be provided with one deck to be used for all light reflections that all surface from this at least one LED wafer is emitted to the reflector of this installation base plate.
2. light emitting source apparatus as claimed in claim 1 is characterized in that: be to be filled with any one any suitable heat sink material that is in liquid state, the solid-state or jelly shape between this installation base plate and this reflector.
3. light emitting source apparatus as claimed in claim 1 is characterized in that: the surface towards the groove of this reflector of each LED wafer is to contact with the groove face of the central part of this groove.
4. light emitting source apparatus as claimed in claim 1, it is characterized in that: this groove is a roughly groove of W shape.
5. light emitting source apparatus as claimed in claim 1 is characterized in that, this groove is a roughly groove of V-arrangement.
CN201110204936.2A 2011-07-13 2011-07-13 Light emitting source apparatus CN102881810B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201110204936.2A CN102881810B (en) 2011-07-13 2011-07-13 Light emitting source apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201110204936.2A CN102881810B (en) 2011-07-13 2011-07-13 Light emitting source apparatus

Publications (2)

Publication Number Publication Date
CN102881810A true CN102881810A (en) 2013-01-16
CN102881810B CN102881810B (en) 2016-06-22

Family

ID=47483068

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201110204936.2A CN102881810B (en) 2011-07-13 2011-07-13 Light emitting source apparatus

Country Status (1)

Country Link
CN (1) CN102881810B (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005250394A (en) * 2004-03-08 2005-09-15 Fujinon Corp Illuminator
JP2007142173A (en) * 2005-11-18 2007-06-07 Koha Co Ltd Illuminator
CN101782204A (en) * 2010-04-21 2010-07-21 广东昭信光电科技有限公司 LED backlighting structure provided with converted light source and using free-form surface reflector
CN101800270A (en) * 2009-02-11 2010-08-11 亿光电子工业股份有限公司 Light emitting diode device and packaging method therefore
CN101819967A (en) * 2009-02-27 2010-09-01 夏普株式会社 Led module and led light source device
CN101984284A (en) * 2010-12-02 2011-03-09 安徽莱德光电技术有限公司 Reflective LED grille lamp

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005250394A (en) * 2004-03-08 2005-09-15 Fujinon Corp Illuminator
JP2007142173A (en) * 2005-11-18 2007-06-07 Koha Co Ltd Illuminator
CN101800270A (en) * 2009-02-11 2010-08-11 亿光电子工业股份有限公司 Light emitting diode device and packaging method therefore
CN101819967A (en) * 2009-02-27 2010-09-01 夏普株式会社 Led module and led light source device
CN101782204A (en) * 2010-04-21 2010-07-21 广东昭信光电科技有限公司 LED backlighting structure provided with converted light source and using free-form surface reflector
CN101984284A (en) * 2010-12-02 2011-03-09 安徽莱德光电技术有限公司 Reflective LED grille lamp

Also Published As

Publication number Publication date
CN102881810B (en) 2016-06-22

Similar Documents

Publication Publication Date Title
JP6505286B2 (en) Light emitting device package
US9425236B2 (en) Light emitting device
US10281123B2 (en) Illumination device
JP2018195831A (en) Light emitting device
US8860072B2 (en) Light emitting device and light unit having the same
JP5676395B2 (en) Light emitting element
JP5768435B2 (en) Light emitting device
US9048404B2 (en) Thin flat solid state light source module
CN102272951B (en) Multi-chip light emitting diode modules
EP2346100B1 (en) Light emitting apparatus and lighting system
KR101621811B1 (en) LED light source and Manufacturing Method Thereof
US9159892B2 (en) LED light source device and manufacturing method for the same
TWI232598B (en) Linear light source apparatus, its manufacturing method and surface light-emitting apparatus
KR100986380B1 (en) Light emitting apparatus
US9791119B2 (en) Light emitting module and head lamp including the same
US8203157B2 (en) Light emitting device having heat generating color conversion members
KR100732267B1 (en) Linear light source and production method therefor and surface emission device
US8916887B2 (en) Light emitting device package and lighting system using the same
KR101788723B1 (en) Light emitting device package
US8471287B2 (en) LED package and method for making the same
TWI289947B (en) Bendable solid state planar light source, a flexible substrate therefor, and a manufacturing method therewith
JP5038147B2 (en) Luminescent body and method for producing the luminous body
CN102157504B (en) Light emitting diode package and light unit having the same
JP2014187305A (en) Light-emitting device
JP4706085B2 (en) Semiconductor light emitting module and manufacturing method thereof

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant