CN203733792U - Led filament - Google Patents
Led filament Download PDFInfo
- Publication number
- CN203733792U CN203733792U CN201320859050.6U CN201320859050U CN203733792U CN 203733792 U CN203733792 U CN 203733792U CN 201320859050 U CN201320859050 U CN 201320859050U CN 203733792 U CN203733792 U CN 203733792U
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- Prior art keywords
- led
- bar shaped
- luminescence chip
- shaped substrate
- led luminescence
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 239000000758 substrate Substances 0.000 claims abstract description 54
- 238000004020 luminiscence type Methods 0.000 claims abstract description 41
- 239000000084 colloidal system Substances 0.000 claims abstract description 24
- 238000002834 transmittance Methods 0.000 claims description 13
- 241000218202 Coptis Species 0.000 claims description 3
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- 238000000465 moulding Methods 0.000 abstract description 7
- 238000005516 engineering process Methods 0.000 abstract description 3
- 230000005540 biological transmission Effects 0.000 abstract 4
- 238000004806 packaging method and process Methods 0.000 abstract 2
- 230000005611 electricity Effects 0.000 abstract 1
- 239000003292 glue Substances 0.000 description 7
- 229920001187 thermosetting polymer Polymers 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000010412 perfusion Effects 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 238000007476 Maximum Likelihood Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000001795 light effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 230000005144 thermotropism Effects 0.000 description 1
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- Led Device Packages (AREA)
Abstract
The application discloses an LED filament which comprises a U-shaped or straight-shaped strip substrate with transmission parts and pins, LED luminescence chip sets which are fixed on the strip substrate and gets electricity through the pins, and fluorescent colloid encloses the straight-shaped strip substrate and the LED luminescence chip sets. The transmission parts are light holes arranged in the straight-shaped strip substrate. The LED luminescence chip sets are fixedly arranged in the areas of the straight-shaped strip substrate without light holes. Because the substrate is provided with transmission parts and is in a strip shape, the LED luminescence chips can emit light through the transmission parts, thus the luminescence angle of the LED filament is enlarged, and the luminescence performance of LED packaging products is improved. In addition, because the fluorescent colloid encloses the straight-shaped strip substrate and the LED luminescence chip sets, the moulding technology and the moulding technology accuracy of the fluorescent colloid are simplified, and the moulding efficiency of the fluorescent colloid and the yield of the LED packaging products are improved.
Description
Technical field
The application relates to LED field, relates in particular to a kind of LED filament.
Background technology
Light-emitting diode (Light Emitting Diode, LED) is a kind of semiconductor element that converts electrical energy into luminous energy.That existing LED encapsulating products mainly comprises is direct insertion, SMD, substrate-type, K1 are high-power, integrated high-power etc. is multi-form.Take substrate-type LED as example, and due to the light tight design of baseplate material, even at LED luminescence chip additional secondary optical lens around, the lighting angle Maximum likelihood of its product can not surpass 120 degree, and therefore, the lighting angle of LED encapsulating products is less.In addition, optical lens is plane formula point rubber seal dress, and some glue accuracy is had relatively high expectations, and makes invocation point glue efficiency and yields all lower.
Summary of the invention
The application provides a kind of LED filament, to improve luminescent properties and the yields of LED encapsulating products.
The application provides a kind of LED filament, comprising:
Be provided with the U-shaped of transmittance section and pin or vertical bar type bar shaped substrate, be fixedly arranged on this bar shaped substrate and by the LED luminescence chip group of described pin powered, and the fluorescent colloid that is wrapped in described bar shaped substrate and LED luminescence chip group periphery, described transmittance section is the loophole arranging on bar shaped substrate, and described LED luminescence chip group is fixedly arranged on the region that described bar shaped substrate does not arrange loophole.
Further, described bar shaped substrate single or double arranges described LED luminescence chip group.
Further, LED luminescence chip is fixedly arranged on described bar shaped substrate by die bond bonding wire mode.
Further, described LED luminescence chip group comprise blue chip group and with the spaced red light chips group of this blue chip group, between LED luminescence chip, by gold thread bonding wire, connect.
Further, described blue chip group comprises at least two blue chips, and described red light chips group comprises a red light chips, and described fluorescent colloid is yellow fluorescence colloid.
Further, described bar shaped substrate adopts steel.
The application's beneficial effect is:
By a kind of LED filament is provided, comprise: be provided with the U-shaped of transmittance section and pin or vertical bar type bar shaped substrate, be fixedly arranged on this bar shaped substrate and by the LED luminescence chip group of described pin powered, and the fluorescent colloid that is wrapped in strip substrate and LED luminescence chip group periphery, described transmittance section is the loophole arranging on bar shaped substrate, and described LED luminescence chip group is fixedly arranged on the region that described bar shaped substrate does not arrange loophole.Like this, owing to being provided with transmittance section on substrate and substrate is bar shaped, making LED luminescence chip can see through transmittance section bright dipping, thereby expanded the lighting angle of LED filament, improved the luminescent properties of LED encapsulating products.In addition, because fluorescent colloid bag is located at substrate and LED luminescence chip group periphery, simplify moulding process and the accuracy thereof of fluorescent colloid, improved the yields of fluorescent colloid shaping efficiency and LED encapsulating products.In addition, comparatively simple owing to opening loophole technique on substrate, and less demanding to substrate, make whole LED filament and bulb manufacture process comparatively simple and, simplified technique, reduced production cost.
Accompanying drawing explanation
Fig. 1 is the side structure schematic diagram of the LED filament of the embodiment of the present application one;
Fig. 2 is the Facad structure schematic diagram of the LED filament of the embodiment of the present application one;
Fig. 3 is the distribution curve flux figure of the LED filament of the embodiment of the present application one.
Embodiment
Below by embodiment, by reference to the accompanying drawings the application is described in further detail.
The LED bulb of the present embodiment, comprising: LED filament, be electrically connected to and be its power supply and/or the lamp socket that drives signal with this LED filament, and be arranged at the lampshade of establishing LED filament on this lamp socket with cover.Wherein, please refer to Fig. 1-2, LED filament mainly comprises: be provided with transmittance section 11 and pin 12, U-shaped or vertical bar type bar shaped substrate 1, be fixedly arranged on this bar shaped substrate 1 and by the LED luminescence chip group 2 of pin (PIN pin) 12 power supplies and the fluorescent colloid 3 that is wrapped in bar shaped substrate 1 and LED luminescence chip group 2 peripheries.Wherein, bar shaped substrate 1 adopts steel.The loophole of transmittance section 11 for arranging on bar shaped substrate 1, LED luminescence chip group 3 is fixedly arranged on the region that bar shaped substrate 1 does not arrange loophole.Bar shaped substrate 1 one side arranges described LED luminescence chip group.LED luminescence chip is fixedly arranged on bar shaped substrate 1 by die bond bonding wire mode.Like this, on bar shaped substrate 1, be provided with transmittance section 11 and substrate and be bar shaped, make LED luminescence chip can see through transmittance section bright dipping, thereby expanded the lighting angle of LED filament, improved the luminescent properties of LED encapsulating products.Going out light effect can represent with a distribution curve flux figure, and as shown in Figure 3, LED filament Integral luminous angle even can reach 360 degree omnibearing luminous more than can reaching 300 degree.
And LED luminescence chip group 2 comprise blue chip group and with the spaced red light chips group of this blue chip group, between LED luminescence chip, by gold thread 21 bonding wires, connect.Wherein, blue chip group comprises at least two blue chips 22, and red light chips group comprises a red light chips 23, and fluorescent colloid 3 is yellow fluorescence colloid.Bar shaped substrate 1 is U-shaped strip.Like this, blue chip and yellow fluorescence colloid can produce white light.Fluorescent colloid 3 can be pouring type fluorescent colloid.
Above-mentioned LED filament specification can be: long 5 ~ 400mm, wide 0.5 ~ 50mm and high 0.1 ~ 5mm, finished product filament diameter is about 1.0 ~ 10mm.
The production principle of above-mentioned LED filament can be roughly as is following:
In blender, to being mixed with the fluorescent glue of fluorescent material, stir, make fluorescent glue by before injecting in perfusion channel thermotropism solid model tool, can not produce fluorescent material precipitation and make fluorescent glue skewness in the fluorescent colloid of LED filament and affect product quality.By setting firmly after LED luminescence chip group by die bond bonding wire mode on the bar shaped substrate of moulding, the bar shaped substrate after moulding is sent in thermosetting mould, in thermosetting mould, there is a fixed mechanism to be fixed this bar shaped substrate.Fluorescent glue in blender is filled in thermosetting mould by perfusion channel subsequently.To thermosetting mould, adopt heater to heat afterwards, fluorescent glue in thermosetting mould is heated be cured to bar shaped substrate and LED luminescence chip group is peripheral.After thermosetting completes, take out above-mentioned LED filament.Like this, because fluorescent colloid is located at substrate and LED luminescence chip group periphery by above-mentioned thermosetting mode bag, simplify moulding process and the accuracy thereof of fluorescent colloid, improved the yields of fluorescent colloid shaping efficiency and LED encapsulating products.
Embodiment bis-:
Differently from above-described embodiment be mainly: above-mentioned transmittance section 11 is the transparent firmware on bar shaped substrate 1, and can be installed with LED luminescence chip on this transparent firmware.Like this, because transparent firmware has substituted loophole, thereby the space on bar shaped substrate can greatly be utilized, thereby whole LED filament light-emitting angle is further strengthened, further expand the lighting angle of LED filament, improved the luminescent properties of LED encapsulating products.
Embodiment tri-:
Differently from above-described embodiment be mainly: the two-sided LED of the setting luminescence chip of bar shaped substrate 1 group.Like this, due at the two-sided LED luminescence chip that arranges of bar shaped substrate, the space on substrate is greatly utilized, thereby whole LED filament light-emitting angle is further strengthened, further expand the lighting angle of LED filament, improved the luminescent properties of LED encapsulating products.
Above content is the further description of the application being done in conjunction with concrete execution mode, can not assert that the application's concrete enforcement is confined to these explanations.For the application person of an ordinary skill in the technical field, not departing under the prerequisite of the application's design, can also make some simple deduction or replace.
Claims (6)
1. a LED filament, is characterized in that, comprising:
Be provided with the U-shaped of transmittance section and pin or vertical bar type bar shaped substrate, be fixedly arranged on this bar shaped substrate and by the LED luminescence chip group of described pin powered, and the fluorescent colloid that is wrapped in described bar shaped substrate and LED luminescence chip group periphery, described transmittance section is the loophole arranging on bar shaped substrate, and described LED luminescence chip group is fixedly arranged on the region that described bar shaped substrate does not arrange loophole.
2. LED filament as claimed in claim 1, is characterized in that, described bar shaped substrate single or double arranges described LED luminescence chip group.
3. LED filament as claimed in claim 1, is characterized in that, LED luminescence chip is fixedly arranged on described bar shaped substrate by die bond bonding wire mode.
4. LED filament as claimed in claim 1, is characterized in that, described LED luminescence chip group comprise blue chip group and with the spaced red light chips group of this blue chip group, between LED luminescence chip, by gold thread bonding wire, connect.
5. LED filament as claimed in claim 4, is characterized in that, described blue chip group comprises at least two blue chips, and described red light chips group comprises a red light chips, and described fluorescent colloid is yellow fluorescence colloid.
6. LED filament as claimed in claim 1, is characterized in that, described bar shaped substrate adopts steel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320859050.6U CN203733792U (en) | 2013-12-24 | 2013-12-24 | Led filament |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320859050.6U CN203733792U (en) | 2013-12-24 | 2013-12-24 | Led filament |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203733792U true CN203733792U (en) | 2014-07-23 |
Family
ID=51203842
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320859050.6U Expired - Lifetime CN203733792U (en) | 2013-12-24 | 2013-12-24 | Led filament |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203733792U (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104300070A (en) * | 2014-09-30 | 2015-01-21 | 杭州电子科技大学 | Bendable LED lamp filament and bulb structure thereof |
| CN104393143A (en) * | 2014-10-20 | 2015-03-04 | 深圳市迈克光电子科技有限公司 | U-shaped high-voltage 360-degree luminescent device and production process thereof |
| WO2015096023A1 (en) * | 2013-12-24 | 2015-07-02 | 深圳市源磊科技有限公司 | Led filament and light bulb |
| CN105336832A (en) * | 2015-09-29 | 2016-02-17 | 杭州派尼澳电子科技有限公司 | LED lamp filament and preparation method thereof |
| CN105845804A (en) * | 2014-11-28 | 2016-08-10 | 宏齐科技股份有限公司 | Light emitting diode device and light emitting device using same |
| CN107248512A (en) * | 2017-06-27 | 2017-10-13 | 黄琴 | A kind of flexible LED filament and manufacture method |
| EP3336411A4 (en) * | 2015-08-14 | 2018-12-26 | Chi Keung Yeung | Substrate for led packaging, led package, and led bulb |
| CN109119516A (en) * | 2018-09-11 | 2019-01-01 | 台山鸿隆光电科技有限公司 | A kind of LED light vermicelli production technique |
| CN111081845A (en) * | 2019-12-25 | 2020-04-28 | 温州大学新材料与产业技术研究院 | Quantum dot material LED filament and preparation method thereof |
| CN114068787A (en) * | 2020-07-31 | 2022-02-18 | 鸿盛国际有限公司 | Light emitting diode packaging structure capable of emitting light laterally |
-
2013
- 2013-12-24 CN CN201320859050.6U patent/CN203733792U/en not_active Expired - Lifetime
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015096023A1 (en) * | 2013-12-24 | 2015-07-02 | 深圳市源磊科技有限公司 | Led filament and light bulb |
| CN104300070A (en) * | 2014-09-30 | 2015-01-21 | 杭州电子科技大学 | Bendable LED lamp filament and bulb structure thereof |
| CN104393143A (en) * | 2014-10-20 | 2015-03-04 | 深圳市迈克光电子科技有限公司 | U-shaped high-voltage 360-degree luminescent device and production process thereof |
| US9887179B2 (en) | 2014-11-28 | 2018-02-06 | Harvatek Corporation | Light emitting diode device and light emitting device using the same |
| CN105845804A (en) * | 2014-11-28 | 2016-08-10 | 宏齐科技股份有限公司 | Light emitting diode device and light emitting device using same |
| CN105845804B (en) * | 2014-11-28 | 2018-08-31 | 宏齐科技股份有限公司 | Light emitting diode device and light emitting device using same |
| EP3336411A4 (en) * | 2015-08-14 | 2018-12-26 | Chi Keung Yeung | Substrate for led packaging, led package, and led bulb |
| CN105336832A (en) * | 2015-09-29 | 2016-02-17 | 杭州派尼澳电子科技有限公司 | LED lamp filament and preparation method thereof |
| CN105336832B (en) * | 2015-09-29 | 2017-09-22 | 旭宇光电（深圳）股份有限公司 | A kind of LED filament |
| CN107248512A (en) * | 2017-06-27 | 2017-10-13 | 黄琴 | A kind of flexible LED filament and manufacture method |
| CN109119516A (en) * | 2018-09-11 | 2019-01-01 | 台山鸿隆光电科技有限公司 | A kind of LED light vermicelli production technique |
| CN111081845A (en) * | 2019-12-25 | 2020-04-28 | 温州大学新材料与产业技术研究院 | Quantum dot material LED filament and preparation method thereof |
| CN114068787A (en) * | 2020-07-31 | 2022-02-18 | 鸿盛国际有限公司 | Light emitting diode packaging structure capable of emitting light laterally |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140723 |