WO2017054248A1

WO2017054248A1 - Flip-chip led module

Info

Publication number: WO2017054248A1
Application number: PCT/CN2015/091418
Authority: WO
Inventors: 魏晓敏
Original assignee: 魏晓敏
Priority date: 2015-10-02
Filing date: 2015-10-02
Publication date: 2017-04-06

Abstract

A flip-chip LED module comprising: a substrate and flip-chip LED chips (2) provided on the substrate (1). The flip-chip LED module also comprises: a fluorescent powder layer (3). The fluorescent powder layer (3) covers at least two of the flip-chip LED chips (2); and, the fluorescent powder layer is provided with a fluorescent powder at the areas of the flip-chip LED chips. As such, with the fluorescent powder layer covering directly the flip-chip LED chips, a work process of applying the fluorescent powder is obviated, the evenness of the fluorescent powder on the flip-chip LED chips is ensured, production efficiency is increased, and usage of the fluorescent powder is reduced.

Description

Flip chip module

Technical field

The present application relates to the field of light emitting diodes, and more particularly to a flip chip LED module.

Background technique

A light-emitting diode (LED) is a low-voltage semiconductor solid-state light-emitting device that uses a solid semiconductor wafer as a light-emitting material. When a forward voltage is applied to both ends, carriers in the semiconductor recombine to cause photon emission to generate light. It is the most popular light source technology today. The characteristics of LED white light source are: energy saving; use low voltage power supply (between 6 and 24V), good safety; small size; long life; fast response time; no harmful metal mercury to the environment Pollution, etc. With the development and application of high-power LED lamps, LED lamps have evolved from point sources to functional lighting, and their prospects are quite broad. A conventional LED is manufactured by epitaxially growing a stacked structure including an n-type semiconductor material layer, a light-emitting layer, and a p-type semiconductor material layer on a substrate. For blue and green diodes, sapphire is usually used as the substrate, and gallium nitride indium epitaxial structure is used as the stacked structure. Since the sapphire substrate is an insulating substrate, both the positive electrode and the negative electrode of the LED are disposed on the front side.

As the requirements for LED luminous efficiency and brightness continue to increase, flip-chip LED devices have gradually replaced the conventional LED devices described above as high-power LED devices. The flip-chip LED has a back surface as a light-emitting surface, and an electrode on the front side of the chip is bonded to a heat sink region of a silicon substrate as a heat-conducting structure. Therefore, the heat sink region of the flip-chip LED chip and the substrate is close to each other, and the heat dissipation effect is increased. In addition, the area of the device can be increased to 1mm × 1mm, the drive current can even reach 300 or 500mA, and the power reaches 1W.

High-power LED devices are mainly used for white light illumination. The Chinese patent application No. CN201110266599.X discloses a high whiteness substrate LED light bar, which comprises a lamp head, a heat sink, an LED light source module, a power supply part and a lamp tube, and the LED light source module comprises a base and an LED chip. The base comprises a substrate and a reflective cup arranged in a line on the substrate, and each of the reflector cups is fixed with at least one LED chip by an insulating adhesive, and the upper surface of the LED chip is coated with a phosphor and a glue layer. The whiteness of the light-emitting surface for mounting the LED on the reflective cup is ≥70, and the light-collecting efficiency of the chip is greatly improved, thereby reducing the loss of light energy into heat energy, thereby improving heat dissipation performance and improving life. However, the LED strip requires a packaging process for encapsulating the phosphor, and during the encapsulation process, the coating of the phosphor is difficult to control, resulting in uneven color of the white light, affecting the color temperature and color coordinates of the emitted white light, thereby resulting in a finished product. Yield is reduced.

Summary of the invention

The present application aims to solve at least one of the above technical problems to some extent.

The present application provides a flip-chip LED module, including: a substrate and a flip-chip LED core disposed on the substrate The flip chip LED module further includes: a phosphor layer covering the at least two of the flip chip LED chips, and the phosphor layer is only disposed in the flip chip LED chip area There are phosphors.

Further, the flip chip LED chip protrudes from a surface of the substrate.

Further, the substrate is provided with a recessed reflector, and the flip chip LED chip is placed in the reflector.

Further, the phosphor layer is provided with a recess sized to fit the flip-chip LED chip to position the region onto the flip-chip LED chip.

Further, the phosphor layer is a soft material or a hard material.

Further, the soft material is a film or a strip.

Further, the flip chip LED chip is soldered to the substrate by solder balls.

Further, the substrate is an aluminum substrate or a copper substrate.

Further, the flip chip LED chips are connected in series or in parallel.

The beneficial effects of the application are:

By providing a flip-chip LED module, comprising: a substrate and a flip-chip LED chip disposed on the substrate, the flip-chip LED module further includes: a phosphor layer, the phosphor layer covering at least two The flip-chip LED chip, and the phosphor layer is provided with phosphor only in the area of the flip-chip LED chip. In this way, the phosphor layer is directly covered on the flip-chip LED chip, which can reduce the process of coating the phosphor, ensure the uniformity of the phosphor on the flip-chip LED chip, improve the production efficiency, and save the phosphor material.

DRAWINGS

FIG. 1 is a schematic structural view of a flip-chip LED module according to an embodiment of the present application.

detailed description

The embodiments of the present application are described in detail below, and the examples of the embodiments are illustrated in the drawings, wherein the same or similar reference numerals are used to refer to the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are intended to be illustrative, and are not to be construed as limiting.

In the description of the present application, it is to be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation or position of indications such as "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc. The relationship is based on the orientation or positional relationship shown in the drawings, and is merely for the convenience of the description and the simplified description, and is not intended to indicate or imply that the device or component referred to has a specific orientation, and is constructed and operated in a specific orientation. It is not to be construed as limiting the application.

Moreover, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first" and "second" can be clearly indicated Or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality" is two or more unless specifically and specifically defined otherwise.

In the present application, the terms "installation", "connected", "connected", "fixed" and the like shall be understood broadly, and may be either a fixed connection or a detachable connection, unless otherwise explicitly stated and defined. , or connected integrally; may be mechanical connection or electrical connection; may be directly connected, or may be indirectly connected through an intermediate medium, and may be internal communication between the two elements. For those skilled in the art, the specific meanings of the above terms in the present application can be understood on a case-by-case basis.

In the present application, the first feature "on" or "under" the second feature may include direct contact of the first and second features, and may also include first and second features, unless otherwise specifically defined and defined. It is not in direct contact but through additional features between them. Moreover, the first feature "above", "above" and "above" the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature. The first feature "below", "below" and "below" the second feature includes the first feature directly above and above the second feature, or merely the first feature level being less than the second feature.

The present application will be further described in detail below with reference to the accompanying drawings.

Referring to FIG. 1, the embodiment provides a flip-chip LED module, which can be mainly used for illumination, signal indication or display, and can be used in an ordinary bulb, a signal lamp or a display screen.

The flip-chip LED module mainly comprises: a substrate 1 and a flip-chip LED chip 2 disposed on the substrate 1. The substrate mainly provides support, power supply and heat dissipation functions for the flip-chip LED chip. The flip-chip LED module further includes a phosphor layer 3, and the phosphor layer 3 covers the at least two flip-chip LED chips 2, and the phosphor layer 3 is provided with the phosphor 31 only in the area of the flip-chip LED chip 2.

In this way, the phosphor layer is directly covered on the flip-chip LED chip, which can reduce the process of coating the phosphor, ensure the uniformity of the phosphor on the flip-chip LED chip, improve the production efficiency, and save the phosphor material.

In the present embodiment, the flip-chip LED chip 2 is protruded from the surface of the substrate 1. In other embodiments, the substrate 1 is provided with a recessed reflector, and the flip-chip LED chip can be placed in the reflector.

As a preferred embodiment, in order to achieve alignment between the phosphor region on the phosphor layer and the flip-chip LED chip, the phosphor layer 3 is provided with a recess adapted to the size of the flip-chip LED chip 2 to be provided with phosphor The above area is positioned on the flip chip LED chip 2.

The phosphor layer 3 may be a soft material or a hard material. When it is a soft material, the soft material may be a film or a strip.

In a specific application, the flip-chip LED chip 2 may be soldered to the substrate by solder balls or may be soldered by gold wires. Base The board 1 may be an aluminum substrate, a copper substrate, a ceramic substrate or the like. The flip chip LED chips 2 can be connected in series, in parallel or in series and parallel.

In the description of the present specification, reference is made to the descriptions of the terms "one embodiment", "some embodiments", "one embodiment", "some embodiments", "example", "specific examples", or "some examples" The specific features, structures, materials, or characteristics described in connection with the embodiments or examples are included in at least one embodiment or example of the application. In the present specification, the schematic representation of the above terms does not necessarily mean the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples.

The above content is a further detailed description of the present application in conjunction with the specific embodiments, and the specific implementation of the present application is not limited to the description. For the ordinary person skilled in the art to which the present invention pertains, a number of simple deductions or substitutions may be made without departing from the spirit of the present application.

Claims

A flip-chip LED module, comprising: a substrate and a flip-chip LED chip disposed on the substrate, wherein the flip-chip LED module further comprises: a phosphor layer, the phosphor layer covering at least On the two flip chip LED chips, and the phosphor layer is provided with phosphor only in the flip chip LED chip region.
The flip-chip LED module of claim 1 wherein said flip-chip LED chip protrudes from a surface of said substrate.
The flip-chip LED module according to claim 1, wherein the substrate is provided with a recessed reflector, and the flip-chip LED chip is placed in the reflector.
The flip-chip LED module of claim 1 wherein said phosphor layer is provided with a recess sized to fit said flip-chip LED chip to position said region onto said flip-chip LED chip .
The flip-chip LED module according to claim 1, wherein the phosphor layer is a soft material or a hard material.
The flip-chip LED module according to claim 5, wherein the soft material is a film or a strip.
The flip-chip LED module of claim 1 wherein said flip chip LED chip is soldered to said substrate by solder balls.
The flip-chip LED module according to claim 1, wherein the substrate is an aluminum substrate or a copper substrate.
The flip-chip LED module according to claim 1, wherein the flip-chip LED chips are connected in series or in parallel.