CN220439660U - Large-size chip LED - Google Patents

Abstract

The utility model relates to a large-size chip LED, which comprises a substrate, an insulating part and an LED module, wherein the two ends of the substrate are respectively provided with a positive plate and a negative plate, the center of the substrate is provided with a containing groove, the substrate is provided with a first connecting hole, the first connecting hole is communicated with the containing groove, the LED module is arranged in the containing groove and is respectively and electrically connected with the positive plate and the negative plate through gold wires, the LED module comprises three LED chips, the three LED chips are connected in series, the insulating part is arranged in the containing groove, the insulating part is provided with a second connecting hole, the second connecting hole is communicated with the first connecting hole, and the first connecting hole is also provided with a waterproof and breathable film.

Description

Large-size chip LED

Technical Field

The utility model belongs to the technical field of LEDs, and particularly relates to a large-size chip LED.

Background

LED (Light Emitting Diode) as an excellent semiconductor photoelectric device has the advantages of small volume, low power consumption, long service life, environmental protection and the like, and is expected to become an ideal solid-state energy-saving illumination light source of a new generation. At present, after the LED is packaged, the core protection of the LED chip can be ensured, but along with the development of the LED to a large size, high light intensity and high power, the heat dissipation problem of the LED is gradually outstanding, and the LED is easy to influence the luminous intensity due to poor heat dissipation, so that the service life is reduced. Accordingly, there are still shortcomings and drawbacks in the prior art.

Disclosure of Invention

The utility model aims to provide a large-size chip LED, which solves the problems that the existing LED is easy to influence the luminous intensity and reduce the service life because of poor heat dissipation.

In order to solve the problems, the utility model adopts the following technical scheme:

the utility model provides a jumbo size chip LED, includes base plate, insulating part and LED module, the both ends of base plate are provided with positive plate and negative plate respectively, the holding tank has been seted up to the center department of base plate, first connecting hole has been seted up on the base plate, first connecting hole with the holding tank intercommunication, the LED module sets up in the holding tank, the LED module pass through the gold thread respectively with positive plate the negative plate electricity is connected, the LED module includes three LED chip, three LED chip series connection, the insulating part sets up in the holding tank, be provided with the second connecting hole on the insulating part, the second connecting hole with first connecting hole intercommunication, still be provided with waterproof ventilated membrane in the first connecting hole.

Further, be provided with a plurality of sand grip on the insulating part, the sand grip sets up the outside side of insulating part, be provided with a plurality of draw-in grooves in the holding tank, the draw-in groove is followed the depth direction of holding tank extends, the draw-in groove with sand grip one-to-one block is connected.

Further, the LED chip is bonded in the accommodating groove of the substrate and then encapsulated by resin sealing.

Further, the three LED chips are distributed in a circular array.

Further, a reflecting layer is arranged on the inner wall of the insulating piece, and the reflecting layer adopts a Cr material layer or a Mo material layer.

Further, a heat conductive silicone grease is arranged between the substrate and the LED chip.

Further, the substrate is provided with a plurality of heat dissipation holes.

Further, the LED chip is a rectangular chip.

By adopting the technical scheme, the utility model has the beneficial effects that:

the large-size chip LED comprises a substrate, an insulating part and an LED module, wherein the two ends of the substrate are respectively provided with a positive plate and a negative plate, the center of the substrate is provided with a containing groove, the substrate is provided with a first connecting hole, the first connecting hole is communicated with the containing groove, the LED module is arranged in the containing groove and is respectively and electrically connected with the positive plate and the negative plate through gold wires, the LED module comprises three LED chips, the three LED chips are connected in series, and the arrangement replaces the transmission of one large-size LED chip, so that the processing difficulty is reduced; the insulating part sets up in the holding tank, is provided with the second connecting hole on the insulating part, and the second connecting hole communicates with first connecting hole, still is provided with waterproof ventilated membrane in the first connecting hole, and the heat that the LED chip produced can be discharged through second connecting hole and first connecting hole, improves the radiating effect, and waterproof ventilated membrane can play waterproof function moreover.

Drawings

Fig. 1 is a schematic top view of a large-sized chip LED according to the present utility model.

Fig. 2 is a schematic front view of the large-sized chip LED shown in fig. 1.

Fig. 3 is a schematic top view of the large-sized chip LED of fig. 1 (excluding the insulator).

Fig. 4 is a front view of an insulator in a large-sized chip LED.

Reference numerals: 10. a substrate; 11. a positive plate; 12. a negative electrode sheet; 13. a receiving groove; 131. a clamping groove; 14. a first connection hole; 15. a waterproof breathable film; 16. a heat radiation hole; 20. an insulating member; 21. a convex strip; 22. a second connection hole; 23. a reflective layer; 30. an LED module; 31. an LED chip.

Detailed Description

In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the utility model is described in detail with reference to the accompanying drawings. This figure is a simplified schematic diagram illustrating the basic of the utility model only by way of illustration, and therefore shows only the constitution related to the utility model. It will be apparent that the described embodiments are some, but not all, embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

As shown in fig. 1, the present utility model provides a large-sized chip LED including a substrate 10, an insulating member 20, and an LED module 30.

As shown in fig. 1 to 3, the two ends of the substrate 10 are respectively provided with a positive electrode plate 11 and a negative electrode plate 12, a containing groove 13 is formed in the center of the substrate 10, the LED module 30 is disposed in the containing groove 13, and the LED module 30 is electrically connected with the positive electrode plate 11 and the negative electrode plate 12 through gold wires.

As shown in fig. 1 and 3, the LED module 30 includes three LED chips 31, and in this embodiment, the LED chips 31 are rectangular chips. The three LED chips 31 are distributed in a circular array, the LED chips 31 are adhered in the accommodating groove 13, the three LED chips 31 are connected in series through gold wires, and the LED chips 31 are adhered in the accommodating groove 13 of the substrate 10 and then sealed and packaged through resin.

As shown in fig. 1 and 4, the insulating member 20 is disposed in the accommodating groove 13 of the substrate 10, the insulating member 20 is substantially annular, a plurality of protruding strips 21 are disposed on the insulating member 20, the protruding strips 21 are disposed on an outer side surface of the insulating member 20, a plurality of clamping grooves 131 are disposed in the accommodating groove 13, the clamping grooves 131 extend along a depth direction of the accommodating groove 13, the clamping grooves 131 are in one-to-one correspondence with the protruding strips 21, and when the insulating member 20 is inserted into the accommodating groove 13, the protruding strips 21 are in one-to-one correspondence with each other and are connected in the clamping grooves 131.

The first connecting hole 14 is formed in the substrate 10, the first connecting hole 14 is communicated with the accommodating groove 13, the second connecting hole 22 is formed in the insulating member 20, and when the insulating member 20 is inserted into the accommodating groove 13, the first connecting hole 14 is communicated with the second connecting hole 22, and the heat dissipation effect can be improved by arranging the first connecting hole 14 and the second connecting hole 22.

In some embodiments, a heat-conducting silicone grease layer is disposed between the substrate 10 and the LED chip 31, so that the heat exchange efficiency between the substrate 10 and the LED chip 31 can be improved. Specifically, the heat-conducting silicone grease layer is a graphene heat-conducting silicone grease layer.

In some embodiments, the inner wall of the insulating member 20 is provided with a reflective layer 23, and in particular, the reflective layer 23 is a Cr material layer or a Mo material layer, so that the reflective efficiency can be improved by providing the reflective layer 23, thereby improving the light efficiency.

In some embodiments, the waterproof and breathable film 15 is disposed in the first connecting hole 14, so that the heat dissipation effect through the first connecting hole 14 and the second connecting hole 22 is not affected by the waterproof and breathable film 15, and on the other hand, the service life of the large-size chip LED can be prolonged by waterproof treatment, and the luminous intensity is ensured.

In some embodiments, the substrate 10 is provided with a plurality of heat dissipation holes 16, so as to further improve the heat dissipation effect.

The working principle of the large-size chip LED in the utility model is as follows: because the processing difficulty of the large-size LED chips 31 is high, the utility model replaces the transmission of one large-size LED chip 31 by utilizing the mode of connecting three LED chips 31 in series, so that the processing difficulty is reduced under the condition of ensuring bright light emission, and the manufacturing and production cost of products is reduced; and since the small-sized LED chip 31 is conveniently processed, the production efficiency of the product can be effectively improved.

In the description of the present utility model, it should be noted that, unless the terms "mounted," "connected," and "connected" are to be construed broadly, for example, they may be fixedly connected, or they may be detachably connected or integrally connected, or they may be mechanically connected, or they may be directly connected or indirectly connected through an intermediate medium, or they may be in communication with each other inside two elements or in an interaction relationship between the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

It is to be understood that the terms "length," "width," "upper," "lower," "front-to-back," "left-to-right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are merely for convenience in describing the utility model and simplifying the description based on the orientation or positional relationship shown in the drawings, and are not to be construed as limiting the utility model, as the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, or be implied.

While the foregoing is directed to the preferred embodiment of the present utility model, other and further embodiments of the utility model may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow. The technical scope of the present utility model is not limited to the description, but must be determined according to the scope of claims.

Claims (8)

1. A large-size chip LED, characterized in that: including base plate, insulating part and LED module, the both ends of base plate are provided with positive plate and negative plate respectively, the holding tank has been seted up to the center department of base plate, first connecting hole has been seted up on the base plate, first connecting hole with the holding tank intercommunication, the LED module sets up in the holding tank, the LED module pass through the gold thread respectively with positive plate the negative plate electricity is connected, the LED module includes three LED chip, three LED chip series connection, the insulating part sets up in the holding tank, be provided with the second connecting hole on the insulating part, the second connecting hole with first connecting hole intercommunication, still be provided with waterproof ventilated membrane in the first connecting hole.

2. The large-sized chip LED of claim 1, wherein: be provided with a plurality of sand strips on the insulating part, the sand strip sets up the outside side of insulating part, be provided with a plurality of draw-in grooves in the holding tank, the draw-in groove is followed the depth direction of holding tank extends, the draw-in groove with sand strip one-to-one block is connected.

3. The large-sized chip LED of claim 1, wherein: and the LED chip is adhered in the accommodating groove of the substrate and then sealed and packaged by resin.

4. The large-sized chip LED of claim 1, wherein: the three LED chips are distributed in a circular array.

5. The large-sized chip LED of claim 1, wherein: the inner wall of the insulating piece is provided with a reflecting layer, and the reflecting layer adopts a Cr material layer or a Mo material layer.

6. The large-sized chip LED of claim 1, wherein: and heat conduction silicone grease is arranged between the substrate and the LED chip.

7. The large-sized chip LED of claim 1, wherein: the substrate is provided with a plurality of heat dissipation holes.

8. The large-sized chip LED of claim 1, wherein: the LED chip is a rectangular chip.