CN201174387Y - High-efficient LED - Google Patents
High-efficient LED Download PDFInfo
- Publication number
- CN201174387Y CN201174387Y CNU2007200595120U CN200720059512U CN201174387Y CN 201174387 Y CN201174387 Y CN 201174387Y CN U2007200595120 U CNU2007200595120 U CN U2007200595120U CN 200720059512 U CN200720059512 U CN 200720059512U CN 201174387 Y CN201174387 Y CN 201174387Y
- Authority
- CN
- China
- Prior art keywords
- connecting pin
- outer connecting
- light source
- negative pole
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model relates to a high-efficiency LED. The high-efficiency LED is to solve such problems in the prior art as low cooling efficiency of a light source wafer, low light-emission efficiency, complex structure, troublesome application and connection, and high application cost. The key points of the technical proposal comprises: the high-efficiency LED comprises a support, the light source wafer, a cathode external connecting pin, an anode external connecting pin and an apparent encapsulating housing, wherein the support is provided with an inverted cone concave cup, the light source wafer is arranged inside the inverted cone concave cup, the cathode external connecting pin is the extending part of the support, the anode external connecting pin is connected with the electrode at the top surface of the light source wafer, the support, the light source wafer, the cathode external connecting pin and the anode external connecting pin are encapsulated in the apparent encapsulating housing, and a connecting end of the external connecting pin is exposed out of the housing. The high-efficiency LED is characterized in that the width of the connecting end of the cathode external connecting pin is between 4 and 12 millimeters, and the support and the cathode external connecting pin both can be composed of a same metal plate formed by punching.
Description
Technical field
The utility model relates to electronic device, specifically is the efficient LED of the outer connecting pin of a kind of plug-in type or welded type.
Background technology
The present similar efficient LED that generally uses, be in a kind of recessed cup of back taper that the light source wafer is arranged on cradle top surface central authorities, with the outer connecting pin that connects support be negative pole, with the outer connecting pin that connects light source wafer top surface electrode be positive pole, by the light-emitting diode that only exposes connecting pin outside plug-in type or the welded type after the transparent material encapsulation.The defective of this light-emitting diode is that the radiating efficiency of light source wafer is relatively poor, can make its luminous efficiency variation.Chinese patent proposes a kind of structure improved efficient LED ZL01200780.3 number for this reason, it is characterized in that thickening the top board of support, make the outer bottom of the recessed cup of the back taper of cradle top surface central authorities can not protrude from the bottom surface of rack plate, and the bottom surface of rack plate exposed, uses to fit with the thermal paste of outer setting or fin contact, with this radiating efficiency that improves the light source wafer, it is stable to reach luminous efficiency.But this structure improved defective is that complex structure, application connect trouble, use cost is higher.
Summary of the invention
For overcome the existing existing light source wafer of similar efficient LED radiating efficiency poor, can make luminous efficiency variation or complex structure, application connect trouble, the higher defective of use cost, the purpose of this utility model provides a kind of improved efficient LED, can overcome the defective of prior art.
The technical scheme that its technical problem that solves the utility model adopts is: a kind of efficient LED, comprise support, the light source wafer, the outer connecting pin of negative pole, anodal outer connecting pin, the transparent material encapsulating housing, the end face central authorities of its medium-height trestle are provided with the recessed cup of back taper, the light source wafer is arranged in the recessed cup of back taper, the outer connecting pin of negative pole is the extending part of support, anodal outer connecting pin is connected with light source wafer top surface electrode, support, the light source wafer, outer connecting pin of negative pole and anodal outer connecting pin are encapsulated in the transparent material encapsulating housing, and have only the link of outer connecting pin of negative pole and anodal outer connecting pin to expose outside the transparent material encapsulating housing, it is characterized in that: the link width of the outer connecting pin of negative pole is 4～12 millimeters.
Above-mentioned support, the outer connecting pin of negative pole, anodal outer connecting pin are metal material; Above-mentioned transparent material encapsulating housing is the insulated non-metal material.
Above-mentioned support all can be by constituting through stamping forming same metal sheet together with the outer connecting pin of the negative pole on it.The recessed cup of the back taper of above-mentioned cradle top surface central authorities also can be by the rack plate punch forming, because rack plate does not need special thickening, so the outer bottom of recessed glass of back taper generally can protrude from the bottom surface of rack plate.
The general desirable link width more than or equal to the outer connecting pin of negative pole of width on one side that links to each other with the outer connecting pin of negative pole on the above-mentioned support is beneficial to dispel the heat.
Above-mentioned outer connecting pin is plug-in type or welded type.
The beneficial effects of the utility model: because the link width of the outer connecting pin of negative pole reaches 4～12 millimeters, link peg graft or be welded to circuit board after itself just have enough area of dissipations, can be effectively the heating of light source wafer be directly led outside light-emitting diode, is delivered on the circuit board and dissipates, light-emitting diode need not to go radiator structure to be set or to add thermal paste, fin etc. again, so it is simple in structure, application is easy to connect, use cost is low; Owing to the heating of light source wafer fully can be dissipated, so light-emitting diode has stable luminous efficiency.
The utility model is described in further detail below in conjunction with drawings and Examples.
Description of drawings
Fig. 1 is the A-A cross-sectional schematic of an embodiment of the utility model.
Fig. 2 is looking up of Fig. 1 and the schematic diagram of cutting the transparent material encapsulating housing open.
Among the figure: 1, support; 2, light source wafer; 3, the outer connecting pin of negative pole; 4, anodal outer connecting pin; 5, transparent material encapsulating housing; 6, the recessed cup of back taper; 7, the link of the outer connecting pin of negative pole; 8, the link of anodal outer connecting pin; 9, the width of link; 10, false pin; 11, the link of false pin.
Embodiment
With reference to Fig. 1～Fig. 2, this efficient LED, comprise support 1, light source wafer 2, the outer connecting pin 3 of negative pole, anodal outer connecting pin 4, transparent material encapsulating housing 5, the end face central authorities of its medium-height trestle 1 are provided with the recessed cup 6 of back taper, light source wafer 2 is arranged in the recessed cup 6 of back taper, the outer connecting pin 3 of negative pole is the extending part of support 1, anodal outer connecting pin 4 is connected with light source wafer 2 end face electrodes, support 1, light source wafer 2, outer connecting pin 3 of negative pole and anodal outer connecting pin 4 are encapsulated in the transparent material encapsulating housing 5, and have only the link 7 of the outer connecting pin 3 of negative pole and the link 8 of anodal outer connecting pin 4 to expose outside the transparent material encapsulating housing 5, it is characterized in that: the width 9 of the link 7 of the outer connecting pin 3 of negative pole is 4～12 millimeters.In addition, outer connecting pin 3 of negative pole and link 7 thereof are made as each one of left and right side, are better for the stationarity that light-emitting diode is connected on the circuit board, also can further improve heat dissipation; The left side also is provided with false pin 10 and a link 11 thereof corresponding with the outer connecting pin of positive pole 4, also be for the stationarity that light-emitting diode is connected on the circuit board better; Support 1 all is by constituting through stamping forming same metal sheet together with the outer connecting pin 3 of the negative pole on it; The recessed cup 6 of the back taper of support 1 end face central authorities also is by support 1 roof plate punching.
Claims (4)
1, a kind of efficient LED, comprise support, the light source wafer, the outer connecting pin of negative pole, anodal outer connecting pin, the transparent material encapsulating housing, the end face central authorities of its medium-height trestle are provided with the recessed cup of back taper, the light source wafer is arranged in the recessed cup of back taper, the outer connecting pin of negative pole is the extending part of support, anodal outer connecting pin is connected with light source wafer top surface electrode, support, the light source wafer, outer connecting pin of negative pole and anodal outer connecting pin are encapsulated in the transparent material encapsulating housing, and have only the link of outer connecting pin of negative pole and anodal outer connecting pin to expose outside the transparent material encapsulating housing, it is characterized in that: the link width of the outer connecting pin of negative pole is 4～12 millimeters.
2, by the described efficient LED of claim 1, it is characterized in that described support together with the outer connecting pin of the negative pole on it by constituting through stamping forming same metal sheet.
3, by claim 1 or 2 described efficient LEDs, the recessed cup of back taper that it is characterized in that described cradle top surface central authorities by the rack plate punch forming on rack plate.
4, by claim 1 or 2 described efficient LEDs, the width on one side that it is characterized in that on the described support linking to each other with the outer connecting pin of negative pole is got more than or equal to the negative pole link width of connecting pin outward.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200595120U CN201174387Y (en) | 2007-11-10 | 2007-11-10 | High-efficient LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200595120U CN201174387Y (en) | 2007-11-10 | 2007-11-10 | High-efficient LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201174387Y true CN201174387Y (en) | 2008-12-31 |
Family
ID=40201513
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007200595120U Expired - Fee Related CN201174387Y (en) | 2007-11-10 | 2007-11-10 | High-efficient LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201174387Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104954709A (en) * | 2014-03-31 | 2015-09-30 | 中强光电股份有限公司 | Light source module and projector |
-
2007
- 2007-11-10 CN CNU2007200595120U patent/CN201174387Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104954709A (en) * | 2014-03-31 | 2015-09-30 | 中强光电股份有限公司 | Light source module and projector |
| US20150276191A1 (en) * | 2014-03-31 | 2015-10-01 | Coretronic Corporation | Light source module and projector |
| CN104954709B (en) * | 2014-03-31 | 2018-05-22 | 中强光电股份有限公司 | Light source module and projector |
| US10215388B2 (en) * | 2014-03-31 | 2019-02-26 | Coretronic Corporation | Light source module and projector |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201599769U (en) | LED street lamp with over-current heat-dissipating function | |
| CN212851202U (en) | Novel LED drive circuit board | |
| CN203812910U (en) | High-utilization-rate and high-luminous-efficiency LED array support | |
| CN201174387Y (en) | High-efficient LED | |
| CN101363609B (en) | Light source assembly of high-power LED lamp and installation method thereof in lamp holder | |
| CN102290523A (en) | LED (light emitting diode) heat radiation structure | |
| CN205956787U (en) | Thermoelectric separation type LED dot matrix light source | |
| CN201112407Y (en) | High power light-emitting diode structure | |
| CN208620092U (en) | A kind of steady type luminous lamp strip | |
| CN101329057A (en) | LED luminous module with heat radiation structure | |
| CN201378598Y (en) | Encapsulation structure of high-power light emitting diode with high light emitting rate | |
| CN201844235U (en) | LED mining lamp | |
| CN201487755U (en) | LED ceiling lamp | |
| CN220439660U (en) | Large-size chip LED | |
| CN201218488Y (en) | Radiating device | |
| CN204834676U (en) | LED light source module based on mirror aluminum substrate | |
| CN210467831U (en) | Laser LED light source SMD packaging structure | |
| CN204029801U (en) | Adopt the integrated module LED light source of Flip-Chip Using | |
| CN204678114U (en) | A kind of New type of S MD light source module | |
| CN219530783U (en) | Efficient radiating patch light-emitting diode structure | |
| CN202281091U (en) | Novel LED (light emitting diode) module | |
| CN203453839U (en) | LED (light emitting diode) module | |
| CN203707166U (en) | All-metal integrated LED lamp bead packaging structure | |
| CN220306284U (en) | Direct-insert type LED | |
| CN213577351U (en) | LED lamp stand convenient to dismouting is overhauld |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081231 Termination date: 20101110 |