CN202281091U - Novel LED (light emitting diode) module - Google Patents

Novel LED (light emitting diode) module Download PDF

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Publication number
CN202281091U
CN202281091U CN2011204139886U CN201120413988U CN202281091U CN 202281091 U CN202281091 U CN 202281091U CN 2011204139886 U CN2011204139886 U CN 2011204139886U CN 201120413988 U CN201120413988 U CN 201120413988U CN 202281091 U CN202281091 U CN 202281091U
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CN
China
Prior art keywords
module
led
constant current
pin
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2011204139886U
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Chinese (zh)
Inventor
熊继承
林春权
石玕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HANGZHOU PANASHINE OPTOELECTRONICS CO Ltd
Original Assignee
HANGZHOU PANASHINE OPTOELECTRONICS CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HANGZHOU PANASHINE OPTOELECTRONICS CO Ltd filed Critical HANGZHOU PANASHINE OPTOELECTRONICS CO Ltd
Priority to CN2011204139886U priority Critical patent/CN202281091U/en
Application granted granted Critical
Publication of CN202281091U publication Critical patent/CN202281091U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to a novel LED (light emitting diode) module. The existing LED modules have a poor radiating effect, thus causing high LED light attenuation and short service life. The module is characterized in that the module adopts a flat metal shell; a groove is arranged on the top surface of the metal shell; a base board is arranged in the groove; a plurality of SMD (surface mounted devices) LED light sources and circuit components are arranged on the base board and are connected to form a light emitting circuit; the base board is packaged with waterproof glue; a cathode formed after parallel connection of the SMD LED light sources in the light emitting circuit is connected with a pin 5 of a constant current IC (integrated circuit) module and an anode is connected with a pin 1 and pin 4 of the constant current IC module, one end of an SMD ceramic capacitor and a cathode of a diode; a pin 3 of the constant current IC module is connected with one end of an SMD resistor; a pin 2 of the constant current IC module, the other end of the SMD resistor and the other end of the SMD ceramic capacitor are connected with a ground wire; and the anode of the diode is connected with a 12V power wire. The LED module has the following beneficial effects that: the radiating capability of the LED module is improved; the junction temperature inside the LED chips is reduced; the light attenuation is reduced; and the service life is prolonged.

Description

A kind of New LED module
Technical field
The utility model belongs to LED luminescence technology field, is specifically related to a kind of New LED module.
Background technology
LED (Light Emitting Diode, light emitting diode) lamp is used at aspects such as illumination, lamp boxes more and more.The LED lamp normally is fixed on many LED on the substrate, and many LED carry out connection in series-parallel, forms the LED module.In actual the use, as required the LED module is carried out connection in series-parallel again.The same with conventional light source, the LED lamp also can produce heat when luminous.The adopting surface mounted LED light source generally is installed on the glass fibre substrate in the LED module of using always on the at present present market, and the position of corresponding each adopting surface mounted LED light source is provided with local fin.It is bad to dispel the heat in the use of this LED module, causes the module temperature higher, causes LED light decay height, life-span weak point.
Summary of the invention
The purpose of the utility model is exactly the deficiency to prior art, and the LED module of a kind of high heat conduction, low light decay is provided.
The utility model comprises metal shell, substrate, adopting surface mounted LED light source, constant current IC module U, Chip-R R, chip ceramic capacitor C, diode D;
Described metal shell integral body is plate shaped, and the center has the heat radiation through hole, and the end face of metal shell is provided with groove, and groove is between heat radiation through hole and dull and stereotyped edge; Be provided with substrate in the groove of metal shell; Adopting surface mounted LED light source, constant current IC module U, Chip-R R, chip ceramic capacitor C, diode D, an end of earth connection and an end of 12V power line are arranged on the substrate; And connect into illuminating circuit through circuit, on the substrate through the marine glue encapsulation.
Described metal shell is a zinc alloy material, and substrate is aluminum pcb board (Printed Circuit Board, a printed substrate), and described constant current IC module U is a DW8505 LED driving IC chip.
LED negative pole end in the described illuminating circuit after the parallel connection of a plurality of adopting surface mounted LED light source is connected with 5 pin of constant current IC module U; LED positive terminal after the parallel connection is connected with 1 pin and the end of 4 pin, chip ceramic capacitor C, the negative pole of diode D of constant current IC module U; 3 pin of constant current IC module U are connected with the end of Chip-R R; 2 pin of constant current IC module U, the other end of Chip-R R, the other end of chip ceramic capacitor C are connected with earth connection, and the positive pole of diode D is connected with the 12V power line.
Metal shell in the utility model has adopted the zinc alloy material die cast of high heat conduction; The anti-gold in surface is handled; Substrate adopts high heat conduction aluminum pcb board; The heat that LED sent all arrives metal shell through board transport, through metal shell heat is distributed in the air again, has effectively improved the heat-sinking capability of LED module.This LED module is coated with attaches high thermal conductive silicon fat, not only has good waterproof effect, and has reduced the inner junction temperature of led chip, has reduced light decay, and the life-span is longer.The utility model has adopted high-accuracy IC constant current design, makes the LED operating current stable, has improved the luminous efficiency of LED module.
Description of drawings
Fig. 1 is the schematic cross-section of the utility model;
Fig. 2 is the floor map of the utility model;
Fig. 3 is the circuit diagram of illuminating circuit in the utility model.
The specific embodiment
Below in conjunction with accompanying drawing the utility model is described further.
As illustrated in fig. 1 and 2, a kind of New LED module comprises metal shell 1, substrate 3, adopting surface mounted LED light source 5, constant current IC module U, Chip-R R, chip ceramic capacitor C, diode D.
Metal shell 1 integral body is plate shaped, and the center has heat radiation through hole 2, and the end face of metal shell 1 is provided with groove, and groove is between heat radiation through hole 2 and dull and stereotyped edge; Be provided with substrate 3 in the groove of metal shell 1; One end of adopting surface mounted LED light source 5, constant current IC module U, Chip-R R, chip ceramic capacitor C, diode D, earth connection 6 and an end of 12V power line 7 are arranged on the substrate 3; And connect into illuminating circuit through circuit, on the substrate 3 through marine glue 4 encapsulation.Metal shell is a zinc alloy material, and substrate is the aluminum pcb board, and constant current IC module U is a DW8505 LED driving IC chip.
As shown in Figure 3; LED negative pole end in the illuminating circuit after a plurality of adopting surface mounted LED light source 5 parallel connections is connected with 5 pin of constant current IC module U; LED positive terminal after the parallel connection is connected with 1 pin and the end of 4 pin, chip ceramic capacitor C, the negative pole of diode D of constant current IC module U; 3 pin of constant current IC module U are connected with the end of Chip-R R; The other end of 2 pin of constant current IC module U, the other end of Chip-R R, chip ceramic capacitor C is connected with earth connection 6, and the positive pole of diode D is connected with 12V power line 7.

Claims (2)

1. New LED module; Comprise metal shell, substrate, adopting surface mounted LED light source, constant current IC module, Chip-R, chip ceramic capacitor, diode; It is characterized in that: described metal shell is whole for plate shaped; The center has the heat radiation through hole, and the end face of metal shell is provided with groove, and groove is between heat radiation through hole and dull and stereotyped edge; Be provided with substrate in the groove of metal shell; One end of adopting surface mounted LED light source, constant current IC module, Chip-R, chip ceramic capacitor, diode, earth connection and an end of 12V power line are arranged on the substrate; And connect into illuminating circuit through circuit, on the substrate through the marine glue encapsulation; Described constant current IC module is a DW8505 LED driving IC chip;
LED negative pole end in the described illuminating circuit after the parallel connection of a plurality of adopting surface mounted LED light source is connected with 5 pin of constant current IC module; LED positive terminal after the parallel connection is connected with 1 pin and an end of 4 pin, chip ceramic capacitor, the negative pole of diode of constant current IC module; 3 pin of constant current IC module are connected with an end of Chip-R; The other end of 2 pin of constant current IC module, the other end of Chip-R, chip ceramic capacitor is connected with earth connection, and the positive pole of diode is connected with the 12V power line.
2. a kind of New LED module as claimed in claim 1 is characterized in that: described metal shell is a zinc alloy material, and described substrate is the aluminum pcb board.
CN2011204139886U 2011-10-27 2011-10-27 Novel LED (light emitting diode) module Expired - Fee Related CN202281091U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011204139886U CN202281091U (en) 2011-10-27 2011-10-27 Novel LED (light emitting diode) module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011204139886U CN202281091U (en) 2011-10-27 2011-10-27 Novel LED (light emitting diode) module

Publications (1)

Publication Number Publication Date
CN202281091U true CN202281091U (en) 2012-06-20

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011204139886U Expired - Fee Related CN202281091U (en) 2011-10-27 2011-10-27 Novel LED (light emitting diode) module

Country Status (1)

Country Link
CN (1) CN202281091U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105989781A (en) * 2015-03-06 2016-10-05 联想(北京)有限公司 Display device and sub display device thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105989781A (en) * 2015-03-06 2016-10-05 联想(北京)有限公司 Display device and sub display device thereof

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120620

Termination date: 20181027

CF01 Termination of patent right due to non-payment of annual fee