CN104197227A - Strip-shaped combined light source - Google Patents
Strip-shaped combined light source Download PDFInfo
- Publication number
- CN104197227A CN104197227A CN201410402011.2A CN201410402011A CN104197227A CN 104197227 A CN104197227 A CN 104197227A CN 201410402011 A CN201410402011 A CN 201410402011A CN 104197227 A CN104197227 A CN 104197227A
- Authority
- CN
- China
- Prior art keywords
- led unit
- rectangular substrate
- light source
- led
- bus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The invention relates to a strip-shaped combined light source. The strip-shaped combined light source is composed of an LED units, long-strip-shaped substrates, packaging modules and the like. Different kinds of series and parallel connection and combination of strip-shaped combined light sources can be achieved by selecting the positions of insulation fractures, the production process is simple, and the strip-shaped combined light source can meet all kinds of needs flexibly.
Description
Technical field
The present invention relates to LED lighting engineering, relate in particular to a kind of strip combined light source.
Background technology
Low-carbon (LC), green, energy-conservation environmental protection life style have become the target that people pursue and practice, and by LED illumination replacement conventional incandescent and fluorescent lamp, are just becoming main flow.Along with development for many years.LED lighting engineering has occurred that one is made strip wick by LED unit combination, and is equipped with transmissive bulb, makes the light source that exactly likes incandescent lamp, is called LED bubble lamp.
The illuminator of LED bubble lamp is strip wick, and because the little heating of strip wick size is large, heat radiation becomes the key of LED bubble lamp.Because strip wick size is little, the wick of producing different size requires different size mould, and cost is very high, causes the producer to be only ready to produce the product of a few specification, and the leeway that client can select is few.
In view of this, a kind of novel LED bubble of necessary design lamp, to satisfy the demands.
Summary of the invention
The object of the invention is to, a kind of strip combined light source is provided, strip combined light source reasonable in design of the present invention, can arbitrarily be combined into multiple circuit connects, and can arbitrarily be cut to random length to meet different specification demands, strip combined light source structure energy flexible adaptation of the present invention is without heat dissipation design requirement simultaneously.
In order to reach the present invention's object, the invention provides two cover technical schemes, as follows respectively.
First set technical scheme of the present invention is:
A kind of strip combined light source, by LED unit, rectangular substrate and package module, formed, it is characterized in that: a plurality of described rectangular substrates are the electric conductors that are arranged in parallel, described LED unit is arranged on described rectangular substrate, described package module parcel LED unit and rectangular substrate; Described LED unit and the electrical connection of rectangular substrate, in the rectangular on-chip adjacent LED units in series of difference; On described rectangular substrate, at interval of two LED unit, there is insulation fracture, described rectangular substrate is broken into several short-movies; Described insulation fracture mutually staggers on the position of the rectangular substrate of difference, and makes on the rectangular substrate of difference and the first LED unit of the short-movie that order is adjacent and LED unit, position, end keep series connection.
In certain embodiments, rectangular substrate is connected with the radiator of LED unit, and rectangular substrate is thermal conductive metal plate, comprises copper base and alumina-base material, especially comprises copper silver coating material.
In certain embodiments, package module will independently wrap up in the rectangular on-chip adjacent LED of difference unit.
In certain embodiments, the packed module parcel of insulation fracture.
The second cover technical scheme of the present invention is:
A strip combined light source, consists of LED unit, rectangular substrate, bus and package module, it is characterized in that: rectangular substrate and bus are arranged in parallel, and described bus at least comprises a pair of positive wire and cathode wire; Described LED unit is arranged on rectangular substrate, at least one LED cell formation LED unit group, the LED units in series in same LED unit group group; The first LED unit and LED unit, end in described LED unit group are connected respectively to positive wire or cathode wire; In described bus, the same number of LED in interval unit group has insulation fracture, and described bus is cut to several subsegments; Stagger mutually in the position of the described insulation fracture in same bus inner anode wire and cathode wire; Described package module parcel LED unit and rectangular substrate.
In certain embodiments, each LED group comprises same number of LED unit.
In certain embodiments, even number LED unit, bus interval group has insulation fracture.
In certain embodiments, rectangular substrate is connected with the radiator of LED unit, and rectangular substrate is thermal conductive metal plate, comprises copper base and alumina-base material, especially comprises copper silver coating material.
In certain embodiments, package module independently wraps up LED unit group.
In certain embodiments, the packed module parcel of insulation fracture.
First set technical scheme of the present invention can construct flexible and changeable full tandem strip combined light source, can adapt to multiple application demand, because the number of rectangular substrate is more than existing strip-shaped light source, and can arbitrarily increase as required, under equal-wattage requires, same package module can form by a plurality of low-power LED unit combination, and than prior art, single rectangular substrate is when the LED unit of the same number of carrying, total heat radiation power of carrying reduces at double, has greatly improved thermal diffusivity.
The second cover technical scheme of the present invention can construct flexible and changeable series-parallel combined light source, can adapt to multiple application demand, wherein, when the LED unit number in LED unit group is only one, can also degenerates and help cascaded structure.The LED unit of the second cover technical scheme of the present invention is connected on a continuous rectangular substrate, can be easily by increasing distance between LED unit group (extending the length of rectangular substrate) mode, play the effect that increases area of dissipation, its structure has very strong flexibility.
No matter be first set technical scheme of the present invention or the rectangular light source of the second cover technical scheme, can be truncated to arbitrarily as required Len req and use.
Below with reference to accompanying drawing, by embodiment, the present invention is further elaborated.
Accompanying drawing explanation
Fig. 1 a is the structural representation that first set technical scheme embodiment mono-of the present invention does not have insulation fracture;
Fig. 1 b is structure and the schematic diagram that first set technical scheme embodiment mono-of the present invention has insulation fracture;
Fig. 2 a is that of first set technical scheme embodiment mono-of the present invention blocks use schematic diagram;
Fig. 2 b is that another of first set technical scheme embodiment mono-of the present invention blocks use schematic diagram;
Fig. 2 c is that another of first set technical scheme embodiment mono-of the present invention blocks use schematic diagram;
Fig. 3 is the structural representation of first set technical scheme embodiment bis-of the present invention;
Fig. 4 a is the structural representation that the present invention the second cover technical scheme embodiment mono-does not have insulation fracture;
Fig. 4 b is structure and the schematic diagram that the present invention the second cover technical scheme embodiment mono-has insulation fracture;
Fig. 5 is the structural representation of the present invention the second cover technical scheme embodiment bis-;
Fig. 6 a is that of the present invention the second cover technical scheme embodiment bis-blocks use schematic diagram;
Fig. 6 b is that another of the present invention second cover technical scheme embodiment bis-blocks use schematic diagram;
Fig. 6 c is that another of the present invention second cover technical scheme embodiment bis-blocks use schematic diagram;
Fig. 6 d is that another of the present invention second cover technical scheme embodiment bis-blocks use schematic diagram;
Fig. 7 is the structural representation of the present invention the second cover technical scheme embodiment tri-;
Fig. 8 is the structural representation of the present invention the second cover technical scheme embodiment tetra-.
The specific embodiment
First set technical scheme
Embodiment mono-
As shown in Figure 1a, the strip combined light source of the present embodiment one, consists of LED unit 100, rectangular substrate 110 and package module 120.LED unit 100 is arranged on rectangular substrate 110, package module 120 parcel LED unit 100 and rectangular substrates 110.In the present embodiment, package module 120 is existing structures, by fluorophor, colloid and fixation kit, formed, that plays that scattering LED unit 100 sends selects light and is connected and fixed the effect of LED unit 100 and rectangular substrate 110, and the package module 120 of the present embodiment will independently wrap up in the rectangular on-chip adjacent LED of difference unit.Rectangular substrate 110 is sheet metals of a kind of heat conduction, especially by copper base or alumina-base material, is made, and particularly by copper silver coating material, is made, and the present embodiment is selected copper silver coating material.As shown in Figure 1a, LED unit 100 and rectangular substrate 110 form electrical connection by wire 140.In Fig. 1 a, connect by wire 130 in the adjacent LED unit 100 on the rectangular substrate 110 of difference.
In Fig. 1 a, on rectangular substrate 110, at interval of two LED unit 100, there is insulation fracture, described rectangular substrate is broken into several short-movies; Described insulation fracture is the clearance for insulation between short-movie, and the width in this gap can be set as required.In Fig. 1 a, with mark 150, express the position of place's insulation fracture, though the position of other insulation fractures does not indicate, can contrast mark 150 and identify; Fig. 1 a has clearly illustrated that the position on the rectangular substrate 110 of difference staggers mutually, and makes on the rectangular substrate 110 of difference and the first LED unit 101 and the LED unit, position, end 102 of the short-movie that order is adjacent keep series connection.
Comparison diagram 1a and Fig. 2 b, its difference is, packed module 120 parcels of insulation fracture in Fig. 1 a, the insulation fracture of Fig. 1 b is outside package module 120.
As Fig. 2 a, Fig. 2 b, shown in Fig. 2 c, the strip combined light source of embodiment mono-can intercept into all lengths and use, and for the intercepting of different length, is only that to choose the position of external electrode point 160 different, can adapt to very expediently various instructions for uses; In addition, by bending or reverse the strip combined light source that rectangular substrate 110 outside package module 120 can be realized different shape.
Embodiment bis-
As shown in Figure 3, can, by increasing the quantity of rectangular substrate 110, increase the length that is insulated the short-movie that fracture is partitioned into, reach the object that increases area of dissipation.
The second cover technical scheme
Embodiment mono-
As shown in Fig. 4 a, the strip combined light source of the present embodiment, consists of LED unit 200, rectangular substrate 210, bus 220 and package module 230, and rectangular substrate 210 and bus 220 are arranged in parallel.Rectangular substrate 210 is connected with the radiator of LED unit 200, and rectangular substrate 210 is thermal conductive metal plates, comprises copper base and alumina-base material, and the present embodiment is selected the copper silver coating material that thermal conductivity is high.
In the present embodiment, bus 220 is comprised of couple of conductor, and wherein a wire is as positive wire, and another wire is as cathode wire; In certain embodiments, bus 220 can be comprised of multipair wire.
In the present embodiment, LED unit 200 is arranged on rectangular substrate 210, and is combined into one group with two LED unit 200, forms LED unit group, and in LED unit group, each LED unit 200 is cascaded.In LED unit group, the first LED unit 201 and LED unit 202, position, end are connected respectively on positive wire or cathode wire, form a kind of structure of full series connection.
As shown in Figure 4 b, in the present embodiment, in bus 220, at interval of two LED unit groups, there is insulation fracture, bus 220 is divided into several fields.Insulation fracture is the gap that disconnects bus 220, and the width in gap and pattern can be selected as required, in Fig. 4 b, indicates the position of an insulation fracture with mark 250, and the position versus mark 250 of other insulation fractures finds.
" staggering mutually in the position of the described insulation fracture in same bus inner anode wire and cathode wire " of the present invention, because the present embodiment only has a pair of bus, so stagger mutually in the position that the present invention's performance is in the present embodiment positive wire and cathode wire, in the embodiment of other more multipair buses, can implement according to the present embodiment.
Package module 230 parcel LED unit 200 and the rectangular substrates 210 of the present embodiment, especially, by the independent parcel in LED unit 200, insulation fracture is also in package module 230.
Embodiment bis-
As shown in Figure 5, than embodiment mono-, in the present embodiment bus 220, at interval of 4 LED unit groups, there is insulation fracture, formed a kind of serial parallel mechanism.From the present embodiment, the number that the LED unit group at interval between insulation fracture is set can be combined into the parallel-connection structure needing, but this number must be even number; The number of the LED unit 200 in LED unit group is set, can be combined into the series arm needing; When the number of the LED unit group at interval between insulation fracture is 2, be degenerated to the full cascaded structure as embodiment mono-.
In conjunction with the embodiments one and embodiment bis-, the present invention can set out the series connection number in series arm by changing the number of LED unit 200 in same group, and the number (even number) that simultaneously changes the LED unit group at interval between insulation fracture can be combined into the number of needed parallel branch.
As Fig. 6 a, Fig. 6 b, Fig. 6 c, shown in Fig. 6 d, the strip combined light source of embodiment bis-can intercept into all lengths and use, and for the intercepting of different length, is only that to choose the position of external electrode point 260 different, can adapt to very expediently various instructions for uses.Because package module 230 wraps up separately a LED unit group, by bending or torsion, the rectangular substrate 210 outside package module 230 can be realized the strip combined light source of different shape.
Embodiment tri-
As shown in Figure 7, the difference of the present embodiment and front embodiment is, between insulation fracture, the number of the LED unit group at interval is 6, be combined into 3 tunnel parallel connections structure.
Embodiment tetra-
As shown in Figure 8, the difference of the present embodiment and front embodiment is, between insulation fracture, the number of the LED unit group at interval is 4, simultaneously, the number of the LED unit 200 in LED unit group is 3, is combined into the also series hybrid structure of 3 LED unit 200 of series connection, two-way Qie Mei in parallel road.
Above-mentioned enforcement has clearly illustrated the number of LED unit, interval group between serial number that this cover technical scheme can be by LED unit in selecting on the same group and insulation fracture, is combined into multiple series parallel structure, or multiple series-parallel mixed structure.Have very strong flexibility, technique is simple, and capability of industrialization is high, can produce easily plurality of specifications product.
Above-mentioned each embodiment can only be interpreted as elaboration of the present invention, can not be with for limiting the present invention.Protection scope of the present invention is as the criterion with claims, and the modified conversion that those skilled in the art make on the basis of above-described embodiment or the conversion being equal to do not depart from protection scope of the present invention.
Claims (10)
1. a strip combined light source, by LED unit, rectangular substrate and package module, formed, it is characterized in that: a plurality of described rectangular substrates are the electric conductors that are arranged in parallel, described LED unit is arranged on described rectangular substrate, described package module parcel LED unit and rectangular substrate; Described LED unit and the electrical connection of rectangular substrate, in the rectangular on-chip adjacent LED units in series of difference; On described rectangular substrate, at interval of two LED unit, there is insulation fracture, described rectangular substrate is broken into several short-movies; Described insulation fracture mutually staggers on the position of the rectangular substrate of difference, and makes on the rectangular substrate of difference and the first LED unit of the short-movie that order is adjacent and LED unit, position, end keep series connection.
2. light source as claimed in claim 1, is characterized in that: rectangular substrate is connected with the radiator of LED unit, and rectangular substrate is thermal conductive metal plate, comprises copper base and alumina-base material, especially comprises copper silver coating material.
3. light source as claimed in claim 1 or 2, is characterized in that: package module will independently wrap up in the rectangular on-chip adjacent LED of difference unit.
4. light source as claimed in claim 3, is characterized in that: the packed module parcel of insulation fracture.
5. a strip combined light source, consists of LED unit, rectangular substrate, bus and package module, it is characterized in that: rectangular substrate and bus are arranged in parallel, and described bus at least comprises a pair of positive wire and cathode wire; Described LED unit is arranged on rectangular substrate, at least one LED cell formation LED unit group, the LED units in series in same LED unit group group; The first LED unit and LED unit, end in described LED unit group are connected respectively to positive wire or cathode wire; In described bus, the same number of LED in interval unit group has insulation fracture, and described bus is cut to several subsegments; Stagger mutually in the position of the described insulation fracture in same bus inner anode wire and cathode wire; Described package module parcel LED unit and rectangular substrate.
6. light source as claimed in claim 5, is characterized in that: each LED group comprises same number of LED unit.
7. light source as claimed in claim 5, is characterized in that: even number LED unit, bus interval group has insulation fracture.
8. light source as claimed in claim 5, is characterized in that: rectangular substrate is connected with the radiator of LED unit, and rectangular substrate is thermal conductive metal plate, comprises copper base and alumina-base material, especially comprises copper silver coating material.
9. the light source as described in claim 5 to 8, is characterized in that: package module independently wraps up LED unit group.
10. light source as claimed in claim 9, is characterized in that: the packed module parcel of insulation fracture.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410402011.2A CN104197227B (en) | 2014-08-15 | 2014-08-15 | A kind of strip combined light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410402011.2A CN104197227B (en) | 2014-08-15 | 2014-08-15 | A kind of strip combined light source |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104197227A true CN104197227A (en) | 2014-12-10 |
| CN104197227B CN104197227B (en) | 2016-02-17 |
Family
ID=52082563
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410402011.2A Active CN104197227B (en) | 2014-08-15 | 2014-08-15 | A kind of strip combined light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104197227B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104930372A (en) * | 2015-06-11 | 2015-09-23 | 吴少健 | LED (light-emitting diode) bulb with arched lens |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080094828A1 (en) * | 2006-10-24 | 2008-04-24 | Shu-Fa Shao | Light-emitting diode lamp bank |
| CN101173739A (en) * | 2006-11-01 | 2008-05-07 | 光宝科技股份有限公司 | Light source |
| CN201187696Y (en) * | 2008-01-07 | 2009-01-28 | 史杰 | Flexible circuit board of LED illumination array |
| CN201425272Y (en) * | 2009-05-15 | 2010-03-17 | 宋光� | LED packaging structure |
| CN201531786U (en) * | 2009-11-02 | 2010-07-21 | 广州市鸿利光电股份有限公司 | Waterproof light strip with connectors inside |
| CN201651950U (en) * | 2010-02-10 | 2010-11-24 | 林锡煌 | Serially connected lamp string |
| CN102705743A (en) * | 2012-06-01 | 2012-10-03 | 明基电通有限公司 | Illuminating device |
| CN103256511A (en) * | 2012-02-21 | 2013-08-21 | 隆达电子股份有限公司 | Lamp strip combination |
| CN103542314A (en) * | 2013-10-23 | 2014-01-29 | 周肇炎 | LED light string |
| CN103899965A (en) * | 2014-03-11 | 2014-07-02 | 东莞市田津电子科技有限公司 | LED lamp strip and forming technology thereof |
| CN103974525A (en) * | 2014-04-28 | 2014-08-06 | 鹤山丽得电子实业有限公司 | Flexible circuit board, flexible LED lamp bar and manufacturing method of flexible LED lamp bar |
-
2014
- 2014-08-15 CN CN201410402011.2A patent/CN104197227B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080094828A1 (en) * | 2006-10-24 | 2008-04-24 | Shu-Fa Shao | Light-emitting diode lamp bank |
| CN101173739A (en) * | 2006-11-01 | 2008-05-07 | 光宝科技股份有限公司 | Light source |
| CN201187696Y (en) * | 2008-01-07 | 2009-01-28 | 史杰 | Flexible circuit board of LED illumination array |
| CN201425272Y (en) * | 2009-05-15 | 2010-03-17 | 宋光� | LED packaging structure |
| CN201531786U (en) * | 2009-11-02 | 2010-07-21 | 广州市鸿利光电股份有限公司 | Waterproof light strip with connectors inside |
| CN201651950U (en) * | 2010-02-10 | 2010-11-24 | 林锡煌 | Serially connected lamp string |
| CN103256511A (en) * | 2012-02-21 | 2013-08-21 | 隆达电子股份有限公司 | Lamp strip combination |
| CN102705743A (en) * | 2012-06-01 | 2012-10-03 | 明基电通有限公司 | Illuminating device |
| CN103542314A (en) * | 2013-10-23 | 2014-01-29 | 周肇炎 | LED light string |
| CN103899965A (en) * | 2014-03-11 | 2014-07-02 | 东莞市田津电子科技有限公司 | LED lamp strip and forming technology thereof |
| CN103974525A (en) * | 2014-04-28 | 2014-08-06 | 鹤山丽得电子实业有限公司 | Flexible circuit board, flexible LED lamp bar and manufacturing method of flexible LED lamp bar |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104930372A (en) * | 2015-06-11 | 2015-09-23 | 吴少健 | LED (light-emitting diode) bulb with arched lens |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104197227B (en) | 2016-02-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102090149A (en) | Light emitting device, lighting device, lighting system, light emitting diode circuit, mounting substrate, and light emitting method for light emitting diode | |
| CN103939870A (en) | Cooling fin suitable for high-power LED lamp heat radiator | |
| CN103974598A (en) | Circuit board | |
| CN203868766U (en) | Efficient heat-dissipation LED lamp | |
| CN203119000U (en) | Lighting device | |
| CN203743877U (en) | Spiral-shaped light-emitting diode lamp filament | |
| CN104197227B (en) | A kind of strip combined light source | |
| CN202103085U (en) | Thermoelectric separation type LED integrated light source board | |
| CN101834175A (en) | LED lighting COB (Chip on Board) packaging structure and bubble sphere | |
| CN102252279B (en) | Thermoelectric separation-type LED integrated light source plate and manufacturing method thereof | |
| CN203800084U (en) | Three-dimensional luminous LED device | |
| CN203052256U (en) | Light emitting diode (LED) light source | |
| CN202733550U (en) | Screw type light-emitting diode (LED) light source module | |
| CN201994294U (en) | Chip on board packaging structure and LED lamp bead | |
| CN204905290U (en) | LED encapsulates support | |
| CN209517602U (en) | The straight-through two-sided copper base of heat dissipation of one kind | |
| CN103742885A (en) | Light-emitting diode (LED) lamp heat conduction structure | |
| CN103298246B (en) | LED high pressure resistant circuit pcb board and the high voltage bearing circuit connecting method of LED | |
| CN210491272U (en) | Array arrangement circuit board for three-primary-color LED lamp set | |
| CN203967113U (en) | LED filament support flitch | |
| CN106024803A (en) | Light Irradiation Module | |
| CN106704885A (en) | Improved flexible LED lamp net | |
| CN201844251U (en) | Replaceable LED (light-emitting diode) lamp with independent heat-dissipation structure | |
| CN204905300U (en) | LED encapsulation | |
| CN202434235U (en) | Wire arranging unit provided with light-emitting components |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170727 Address after: 361010, Huli District, Fujian City, Xiamen Province Wo town after pit village, No. 557, No. two, Lake Community Patentee after: Xiamen City Superlite Lighting Co., Ltd. Address before: Siming District of Xiamen city in Fujian province 361008 three road No. 267 Pu Xi an Xiamen Han Feng Photoelectric Technology Co. Ltd. Patentee before: XIAMEN HANFENG OPTOELECTRONICS TECHNOLOGY CO., LTD. |