CN107068836A - Vertical great power LED multidigit support and vertical great power LED preparation method - Google Patents
Vertical great power LED multidigit support and vertical great power LED preparation method Download PDFInfo
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- CN107068836A CN107068836A CN201710124667.6A CN201710124667A CN107068836A CN 107068836 A CN107068836 A CN 107068836A CN 201710124667 A CN201710124667 A CN 201710124667A CN 107068836 A CN107068836 A CN 107068836A
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- support
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- 238000002360 preparation method Methods 0.000 title claims abstract description 16
- 239000011159 matrix material Substances 0.000 claims abstract description 42
- 239000003292 glue Substances 0.000 claims description 12
- 239000000843 powder Substances 0.000 claims description 8
- 238000001556 precipitation Methods 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 239000000741 silica gel Substances 0.000 claims description 7
- 229910002027 silica gel Inorganic materials 0.000 claims description 7
- 239000002245 particle Substances 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 238000004062 sedimentation Methods 0.000 claims description 4
- 239000000499 gel Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 238000000034 method Methods 0.000 abstract description 7
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 238000007493 shaping process Methods 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 239000007789 gas Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000004378 air conditioning Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 206010057855 Hypotelorism of orbit Diseases 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000004313 glare Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 210000003205 muscle Anatomy 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a kind of vertical great power LED multidigit support, including support plate and the multiple LED supports being arranged on support plate, multiple LED support arrangements are in matrix, and LED support includes two pins and matrix, two pins are both secured to matrix, and extend opposite to each other upwards in X from matrix；Matrix is connected in support plate；Between the upward two adjacent LEDs supports of X, two pins closed on exist overlapping in the Y direction along Y-direction arrangement；X is two mutually orthogonal directions to Y-direction.So that a part for two pins closed between two adjacent LEDs support is at the upward co-located places of X, so as to reduce the distance between upward two adjacent LEDs supports of X, progress reduces whole vertical great power LED multidigit support in size upward X, reduce space-consuming, form high density support, beneficial to the progress of subsequent technique, production cost is reduced.In addition, present invention also offers a kind of preparation method of the vertical great power LED using above-mentioned vertical great power LED multidigit support.
Description
Technical field
The present invention relates to vertical great power LED field, more particularly to a kind of vertical great power LED multidigit support and vertical big
Power LED preparation method.
Background technology
When preparing vertical great power LED, it is necessary to which multiple LED supports are arranged, form an entirety and carry out subsequently
Technique.In the prior art, multiple LED supports arrangement defective tightness, on pin bearing of trend, two adjacent LEDs support draws
Dowel is provided between pin, dowel takes certain space so that the size that two adjacent LEDs support takes is larger, overall
Space-consuming is big, influence processing preparation efficiency, and processing preparation cost is higher.
The content of the invention
The technical problems to be solved by the invention are that there is provided a kind of vertical great power LED multidigit support and vertical big work(
Rate LED preparation method, to reduce space-consuming, improves production efficiency.
In order to solve the above-mentioned technical problem, on the one hand, The embodiment provides a kind of vertical great power LED multidigit
Support, including support plate and multiple LED supports for being arranged on support plate, the multiple LED support arrangement is in matrix, the LED branch
Frame includes two pins and matrix, and two pins are both secured to described matrix, and prolong opposite to each other upwards in X from described matrix
Stretch；Described matrix is connected in the support plate；Between the X upwards two neighboring LED support, draw described in two closed on
Pin is arranged along the Y-direction and existed in the Y-direction overlapping；The X is two mutually orthogonal directions to the Y-direction.
Wherein, the pin includes main body and connection sheet, and the connection sheet is set on the body away from described matrix
End.
Wherein, between the X upwards two neighboring LED support, the connection of two pins closed on
Piece exists overlapping in the Y-direction.
Wherein, exist between the overlapping pin the X is two neighboring upwards, the connection sheet of pin described in one with it is another
The main body of one pin exists overlapping in the Y-direction.
Wherein, multiple dowels are provided with the support plate, the dowel is the bar shaped along the X to setting, adjacent
Form hollow out position between dowel described in two, the LED support, which is correspondingly arranged at, described engraves empty place, described matrix and the company
Muscle is connect to be connected.
Wherein, the concave arc groove being engaged with described matrix side face is provided with the dowel, described matrix is connected to phase
In the concave arc groove of adjacent two dowels.
On the other hand, the invention provides a kind of preparation method of vertical great power LED, comprise the following steps successively：
Foregoing vertical great power LED multidigit support is provided；
Die bond is carried out to multiple LED supports of the vertical great power LED multidigit support；
Bonding wire is carried out to multiple LED supports；
Multiple LED supports are carried out with point powder；
The lid lens on the vertical great power LED multidigit support, and flanging, injecting glue.
Wherein, it is described bonding wire is carried out to multiple LED supports the step of in, use line footpath for 1.2MIL alloy wires work
Industry, and operating environment sets gas shield；Enter next step operation after the completion of welding in 4 hours.
Wherein, it is described multiple LED supports are carried out with point powder the step of in, by vertical great power LED multidigit support
It is placed in the sealing space of constant temperature and humidity, fluorescent material precipitation is carried out on multiple LED supports, precipitation ambient humidity is 20
DEG C -30 DEG C, humidity is 30%-50%；Fluorescent material particle diameter is 7-9 μm, and the sedimentation time is 11-13 hours.
Wherein, in the injecting glue step, filling glue, which uses to exempt to toast, has certain degree of hardness after silica gel, filling gel.
The preparation method of vertical great power LED multidigit support provided in an embodiment of the present invention and vertical great power LED, in X
Between upward two adjacent LEDs support, two pins closed on are arranged and existed in the Y direction overlapping along Y-direction so that adjacent two
A part for two pins closed between individual LED support is at the upward co-located places of X, so as to reduce the upward phases of X
The distance between adjacent two LED supports, progress reduces whole vertical great power LED multidigit support in size upward X, reduces
Space-consuming, forms high density support, beneficial to the progress of subsequent technique, reduces production cost.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the accompanying drawing used required in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is the structural representation for the vertical great power LED multidigit support that first embodiment of the invention is provided；
Fig. 2 is sectional view at A-A in Fig. 1；
Fig. 3 is the structural representation for the vertical great power LED multidigit support that second embodiment of the invention is provided；
Fig. 4 is the flow chart of the preparation method for the vertical great power LED that the preferred embodiment of the present invention is provided.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described.In the following description, X is two mutually orthogonal directions to Y-direction.
Referring to Fig. 1 and Fig. 2, a kind of vertical great power LED multidigit support provided for first embodiment in the present invention, including
Support plate 1 and the multiple LED supports 2,3 being arranged on support plate 1.
Multiple arrangements of LED support 2,3 are in matrix.In the present embodiment, LED support 2,3 is 48, and 4 are formed along X to arrangement
Row, arranges to form 12 row along Y-direction.Each row is respectively positioned on same straight line, and each row are respectively positioned on same straight line.LED support 2 includes two
Individual pin 21 and matrix 22, two pins 21 are both secured to matrix 22, and extend opposite to each other upwards in X from matrix 22；LED support 3
Including two pins 31 and matrix 32, between the upward two adjacent LEDs supports 2,3 of X, two pins 21,31 closed on are along Y side
To arrangement and exist in the Y direction overlapping.LED support 2 further comprises radiating copper post 23, and radiating copper post 23 is fixed on whole base
The center of body 22, to be radiated for whole LED.
Between the upward two adjacent LEDs supports 2,3 of X, two pins 21,31 closed on along Y-direction arrange and in the Y direction
Exist overlapping so that a part for two pins 21,31 closed between two adjacent LEDs support 2,3 is located at same upwards in X
At position, so as to reduce the upward two adjacent LEDs supports 2, the distance between 3 of X, progress reduces whole vertical high-power
LED multidigits support reduces space-consuming in size upward X, forms high density support, beneficial to the progress of subsequent technique, reduction
Production cost.
Pin 21 includes main body 211 and connection sheet 212, and connection sheet 212 is arranged on the end away from matrix 22 in main body 211
End, in Y-direction, the size of connection sheet 212 is more than the size of main body 211.Accordingly, pin 31 includes main body 311 and connection sheet
312.Using connection sheet 212, the welding between pin 21 and circuit board can be facilitated, improved between shaping LED and circuit board
Bonding strength.
Between the upward two adjacent LEDs supports 2,3 of X, the connection sheet 212,312 of two pins 21,31 closed on is in Y-direction
It is overlapping.The size of part connection sheet 212 can be saved upwards in X.
Multiple dowels 11 are provided with support plate 1, the dowel 11 is the bar shaped along the X to setting, adjacent two institute
Formation hollow out position 10 between dowel 11 is stated, the LED support 2,3 is correspondingly arranged at the hollow out position 10, described matrix 22,
32 are connected with the dowel 11.It can be facilitated using hollow out position 10 and remove the LED punching presses after machine-shaping, while dowel
11 can be that whole LED support 2 provides support for matrix 22.Multiple positioning holes are provided with dowel 11, so as to LED support
Position positioned, improve yields.
The concave arc groove 12 being engaged with the side face of described matrix 22 is provided with the dowel 11, described matrix 22 is connected to
In the concave arc groove 12 of the two neighboring dowel 11.Using the concave arc groove 12 matched with the outer peripheral face radian of matrix 22,
During injection forms matrix 22, the part that dowel 11 is embedded in matrix 22 can be reduced, consequently facilitating in LED processing
Separated after shaping using by matrix from dowel 11, improve production efficiency, reduce production cost.
Brace rod is connected between part that pin 21 is embedded in matrix 22 and dowel 11, utilizing brace rod to realize will
Pin 21 is connected as one with support plate 1, when injection forms matrix, and the top of brace rod and pin 21 is embedded in matrix 22.
The junction of brace rod and dowel 11 is thrust, you can remove LED from support plate 1.Pin 21 and support plate 1 are metal material
Matter, and be integrally formed.
The end of pin 21 of LED support is separated with support plate 1, i.e. the connection sheet 212 and support plate 1 of pin 21 are separately positioned,
Merely with the connection realized at the position of matrix 22 between support plate 1, consequently facilitating the LED after shaping is removed from support plate.
Pin 21 is bending-like or flat, according to the different purposes of the LED of shaping, pin 21 can be arranged into bending-like
Or flat.
Gap in Y-direction between adjacent two LED support 2,3 is less than the 1/5 of the diameter of matrix 22, to improve multiple LED branch
The density of frame 2,3.
In the vertical great power LED multidigit support provided in second embodiment of the invention, its structure is substantially real with first
Example is applied identical, difference is, as shown in figure 3, existing between overlapping pin 21a, 31a X is two neighboring upwards, pin
21a connection sheet 212a exist in the Y direction with another pin 31a main body 311a it is overlapping, pin 31a connection sheet 312a with it is another
One pin 21a main body 211a exists overlapping in the Y direction so that overlapping range is bigger between two pins 21a, 31a, Ke Yijin
One step reduces overall in size upward X.
To avoid the position of connection sheet 212a, 312a between two pins 21a, 31a from interfering, on connection sheet 212a
Chamfering is provided with, chamfering is located at connection sheet 212a and main body 211a junctions.The chamfering phase of two neighboring connection sheet 212a, 312a
To setting, so as to avoid connection sheet 212a, 312a hypotelorism and be not readily separated.
Present invention also offers a kind of preparation method of vertical great power LED, as shown in figure 4, comprising the following steps successively.
Step S1, the vertical great power LED multidigit support provided in foregoing any embodiment.It is vertical high-power using this
LED multidigit supports, can reduce space-consuming, reduce job area, improve operating efficiency, reduce production cost.
Step S2, multiple LED supports to vertical great power LED multidigit support carry out die bond.In this step, using elargol
Carry out 2 hours, and toasted 2 hours in 165 DEG C of ± 5 DEG C of die bonds at 25 DEG C of normal temperature.
Step S3, to multiple LED supports carry out bonding wire.In this step, due to produce in batches, being entered using automatic bonding equipment
Row operation.Line footpath is used for 1.2MIL alloy wire operations, and operating environment sets gas shield, gas shield can use nitrogen
Deng, it is bad to solve wire bonding process center line oxidation etc., and there is good extensibility and stability using alloy wire, can be preferably
Ground solves product quality and cost control.
After the completion of welding, it can be placed in nitrogen cabinet and deposit, next step operation is entered in 4 hours, is deposited here
Time is no more than 4 hours, to improve product quality, reduces fraction defective.
Step S4, to multiple LED supports carry out point a powder.High Precision Automatic spot gluing equipment is used in this step, glue amount is lifted
Uniformity, and be equipped with automatic online detecting instrument, facilitate quality management and control of the technical staff to On-line Product.
Vertical great power LED multidigit branch is placed in the sealing space of constant temperature and humidity, carried out on multiple LED supports glimmering
Light powder is precipitated, and precipitation ambient humidity is 20 DEG C -30 DEG C, and humidity is 30%-50%；Fluorescent material particle diameter is 7-9 μm, and the sedimentation time is
11-13 hours.
As preferential, the controllable workshop of constant temperature and humidity can be designed, i.e., certain face is divided into using blank wall in manufacturing area
Long-pending closed room, and self-contained vertical air-conditioning is equipped with, either inside sets air-conditioning, dehumidifier, moisture-resistant cabinet, Hygrothermograph, warm and humid
Spend control standard：25 DEG C ± 5 DEG C of temperature, humidity 30%-50%, it is ensured that the uniformity of fluorescent material precipitation.
Fluorescent material particle diameter is preferably 8 μm or so, and particle size is reasonable, it is ensured that optimal sedimentation effect.
It is 20 DEG C -30 DEG C to precipitate ambient humidity, i.e., can carry out precipitation operation at room temperature, eliminates the sides such as heating precipitation
Method, precipitating can complete to precipitate operation in the present context for 12 hours, it is possible to increase production efficiency, reduce production cost.
Step S5 lid lens on vertical great power LED multidigit support, and flanging, injecting glue.
In this step, lid lens, flanging and injecting glue three process are completed using automation integrated formula board synchronization job, matched somebody with somebody
The high density support of vertical great power LED multidigit support is closed, can effectively deduct a percentage operating efficiency and quality.
In injecting glue step, filling glue, which uses to exempt to toast, has certain degree of hardness after silica gel, filling gel, and non-resilient solidifying
Glue, can effectively solve in encapsulation process to products application optics, it is heat-resisting the problems such as, it is ensured that light source meet 150 degree of high temperature do not rise
Bubble, not dead lamp the features such as.Using exempt from baking silica gel with being arranged in pairs or groups with powder with silica gel, it is ensured that with powder silica gel, exempt from baking silica gel
Combined between lens is not in that interface is abnormal, it is to avoid veiling glare is produced in interface, the experience effect of whole lamp is improved.
Step S6, finally, can also carry out light splitting, can use full-automatic light splitting machine operation, effectively ensure product light,
Electricity, color uniformity.
Embodiment above, does not constitute the restriction to the technical scheme protection domain.It is any in above-mentioned embodiment
Spirit and principle within the modifications, equivalent substitutions and improvements made etc., should be included in the technical scheme protection domain it
It is interior.
Claims (10)
1. a kind of vertical great power LED multidigit support, it is characterised in that including support plate and be arranged on multiple on the support plate
LED support, the multiple LED support arrangement is in matrix, and the LED support includes two pins and matrix, two pins
Described matrix is both secured to, and is extended opposite to each other upwards in X from described matrix；Described matrix is connected in the support plate；The X to
Between the upper two neighboring LED support, two pins closed on are arranged along the Y-direction and existed in the Y-direction
It is overlapping；The X is two mutually orthogonal directions to the Y-direction.
2. vertical great power LED multidigit support according to claim 1, it is characterised in that the pin include main body and
Connection sheet, the connection sheet sets the end away from described matrix on the body.
3. vertical great power LED multidigit support according to claim 2, it is characterised in that two neighboring upwards in the X
Between the LED support, the connection sheets of two pins closed on exists overlapping in the Y-direction.
4. vertical great power LED multidigit support according to claim 2, it is characterised in that two neighboring upwards in the X
Exist between the overlapping pin, the connection sheet of pin described in one exists overlapping with the main body of another pin in the Y-direction.
5. vertical great power LED multidigit support according to claim 1, it is characterised in that be provided with the support plate many
Individual dowel, the dowel forms hollow out position for the bar shaped along the X to setting, between dowel described in adjacent two, described
LED support engraves empty place described in being correspondingly arranged at, and described matrix is connected with the dowel.
6. vertical great power LED multidigit support according to claim 5, it is characterised in that be provided with the dowel
The concave arc groove being engaged with described matrix side face, described matrix is connected in the concave arc groove of the two neighboring dowel.
7. a kind of preparation method of vertical great power LED, it is characterised in that comprise the following steps successively：
Vertical great power LED multidigit support as described in claim any one of 1-6 is provided；
Die bond is carried out to multiple LED supports of the vertical great power LED multidigit support；
Bonding wire is carried out to multiple LED supports；
Multiple LED supports are carried out with point powder；
The lid lens on the vertical great power LED multidigit support, and flanging, injecting glue.
8. the preparation method of vertical great power LED according to claim 7, it is characterised in that described to multiple described
In the step of LED support carries out bonding wire, line footpath is used for 1.2MIL alloy wire operations, and operating environment sets gas shield；Weldering
Enter next step operation after the completion of connecing in 4 hours.
9. the preparation method of vertical great power LED according to claim 7, it is characterised in that described to multiple described
In the step of LED support carries out point powder, vertical great power LED multidigit branch is placed in the sealing space of constant temperature and humidity, many
Fluorescent material precipitation is carried out on the individual LED support, precipitation ambient humidity is 20 DEG C -30 DEG C, and humidity is 30%-50%；Fluorescent material
Particle diameter is 7-9 μm, and the sedimentation time is 11-13 hours.
10. the preparation method of vertical great power LED according to claim 7, it is characterised in that in the injecting glue step
In, filling glue, which uses to exempt to toast, has certain degree of hardness after silica gel, filling gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710124667.6A CN107068836A (en) | 2017-03-03 | 2017-03-03 | Vertical great power LED multidigit support and vertical great power LED preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710124667.6A CN107068836A (en) | 2017-03-03 | 2017-03-03 | Vertical great power LED multidigit support and vertical great power LED preparation method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107068836A true CN107068836A (en) | 2017-08-18 |
Family
ID=59622769
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710124667.6A Pending CN107068836A (en) | 2017-03-03 | 2017-03-03 | Vertical great power LED multidigit support and vertical great power LED preparation method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107068836A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110190017A (en) * | 2019-03-12 | 2019-08-30 | 深圳市长方集团股份有限公司 | A kind of magazine for promoting SMD product packaging operation turnover nothing in LED and dropping off risk |
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| CN101276866A (en) * | 2008-04-01 | 2008-10-01 | 佛山市国星光电股份有限公司 | High power LED bracket as well as high power LED made by the same |
| CN201242105Y (en) * | 2008-08-19 | 2009-05-20 | 东莞市宏磊达塑胶电子有限公司 | Density type large power LED support |
| CN202308033U (en) * | 2011-09-22 | 2012-07-04 | 江苏盛业光电科技有限公司 | Heavy-power LED product |
| CN204204351U (en) * | 2014-10-08 | 2015-03-11 | 木林森股份有限公司 | A kind of high pixel LED display screen |
| CN206992143U (en) * | 2017-03-03 | 2018-02-09 | 深圳市长方集团股份有限公司 | Vertical great power LED multidigit support |
-
2017
- 2017-03-03 CN CN201710124667.6A patent/CN107068836A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101276866A (en) * | 2008-04-01 | 2008-10-01 | 佛山市国星光电股份有限公司 | High power LED bracket as well as high power LED made by the same |
| CN201242105Y (en) * | 2008-08-19 | 2009-05-20 | 东莞市宏磊达塑胶电子有限公司 | Density type large power LED support |
| CN202308033U (en) * | 2011-09-22 | 2012-07-04 | 江苏盛业光电科技有限公司 | Heavy-power LED product |
| CN204204351U (en) * | 2014-10-08 | 2015-03-11 | 木林森股份有限公司 | A kind of high pixel LED display screen |
| CN206992143U (en) * | 2017-03-03 | 2018-02-09 | 深圳市长方集团股份有限公司 | Vertical great power LED multidigit support |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110190017A (en) * | 2019-03-12 | 2019-08-30 | 深圳市长方集团股份有限公司 | A kind of magazine for promoting SMD product packaging operation turnover nothing in LED and dropping off risk |
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Application publication date: 20170818 |
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