CN108807355A - A kind of adopting surface mounted LED that two sided is luminous - Google Patents
A kind of adopting surface mounted LED that two sided is luminous Download PDFInfo
- Publication number
- CN108807355A CN108807355A CN201810583611.1A CN201810583611A CN108807355A CN 108807355 A CN108807355 A CN 108807355A CN 201810583611 A CN201810583611 A CN 201810583611A CN 108807355 A CN108807355 A CN 108807355A
- Authority
- CN
- China
- Prior art keywords
- bottom plate
- sided
- surface mounted
- adopting surface
- mounted led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052802 copper Inorganic materials 0.000 claims abstract description 15
- 239000010949 copper Substances 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 14
- 238000005538 encapsulation Methods 0.000 claims abstract description 6
- 230000003760 hair shine Effects 0.000 claims abstract 3
- 229920005989 resin Polymers 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 12
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical group [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 7
- 239000000843 powder Substances 0.000 claims description 7
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 239000000565 sealant Substances 0.000 claims description 5
- 239000003292 glue Substances 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 239000004568 cement Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 241000218202 Coptis Species 0.000 abstract description 4
- 235000002991 Coptis groenlandica Nutrition 0.000 abstract description 4
- 238000009434 installation Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910002114 biscuit porcelain Inorganic materials 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002146 bilateral effect Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002372 labelling Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses the adopting surface mounted LEDs that a kind of two sided shines, it includes the copper material bottom plate of T shapes and the patch frame of the encapsulation bottom plate, the external pin for connecting external circuit and the inside pin for connecting the copper electrode are provided on the bottom plate, the left and right sides of the bottom plate is fixedly installed LED chip, and the positive and negative anodes of the LED chip connect the bottom plate by gold thread.Since the bottom plate is T shapes, the left and right sides can install LED chip, to achieve the purpose that dual-side emissive, moreover, because bottom plate is T shapes, it is not only convenient for the installation of patch, and its heat-conducting area is larger so that the bottom plate can high temperature resistant, have excellent heat conductivility.
Description
Technical field
The present invention relates to the luminous adopting surface mounted LEDs in LED technology field more particularly to a kind of two sided.
Background technology
SMD LED are surface labeling LED, also referred to as paster LED, are a kind of solid state semiconductor devices, are
By the way that LED chip is fixed on copper material bottom plate, positive and negative anodes connecting line is carried out to chip and bottom plate, by being powered positive and negative anodes with point
Bright LED, it is luminous to achieve the effect that, it is widely used in lighting system, decoration, electronic equipment indicator, backlight, display and device
The fields such as tool.
Invention content
For overcome the deficiencies in the prior art, the technical purpose that the present invention is realized is to provide a kind of simple in structure, volume
Smaller optoelectronic switch.
To reach above-mentioned technical purpose, the technical solution adopted in the present invention content is specific as follows：
A kind of adopting surface mounted LED that two sided is luminous comprising the copper material bottom plate of T shapes and the patch frame of the encapsulation bottom plate
Frame is provided with the external pin for connecting external circuit on the bottom plate and the inside for connecting the copper electrode is drawn
The left and right sides of foot, the bottom plate is fixedly installed LED chip, and the positive and negative anodes of the LED chip are connected by gold thread
The bottom plate.
Preferably, the bottom plate is an integral structure.
Preferably, the bottom plate is spliced by two L-shaped copper materials.
Further, bottom plate described in the patch framework encapsulation is by the way that the bottom plate to be put into after shaper to described
Resin is injected in shaper.
Further, the resin is epoxy resin or PCT resins or PPA resins.
Further, the outside of the LED chip is provided with phosphor powder layer.
Further, the outside of the phosphor powder layer is additionally provided with sealant.
Further, the material of the sealant is silica gel or epoxy resin.
Preferably, the LED chip is the chip for the light that can emit different wave length.
Preferably, the LED chip is fixedly connected on by conductive silver glue or insulating cement on the bottom plate.
Compared with prior art, the beneficial effects of the present invention are：
1, the bottom plate be T shapes copper material bottom plate, can the left and right sides be respectively mounted LED chip, to reach bilateral hair
The purpose of light.
2, since the bottom plate is T shapes, it is not only convenient for the installation of patch, and its heat-conducting area is larger so that described
Bottom plate can high temperature resistant, have excellent heat conductivility.
3, easy for installation, production efficiency is improved, the patch for being suitable for all surface mounting technology is installed.
Above description is only the general introduction of technical solution of the present invention, in order to better understand the technical means of the present invention,
And can be implemented in accordance with the contents of the specification, and in order to allow the above and other objects, features and advantages of the present invention can
It is clearer and more comprehensible, it is special below to lift preferred embodiment, and coordinate attached drawing, detailed description are as follows.
Description of the drawings
Fig. 1 is the structural schematic diagram of the SMD LED of double-side of the present invention；
Fig. 2 is the stereogram of Fig. 1；
Wherein, the reference numeral in Fig. 1 and Fig. 2 is as follows：
1, bottom plate；2, patch frame；3, LED chip.
Specific implementation mode
It is of the invention to reach the technological means and effect that predetermined goal of the invention is taken further to illustrate, below in conjunction with
Attached drawing and preferred embodiment, to specific implementation mode, structure, feature and its effect according to the present invention, detailed description are as follows：
As depicted in figs. 1 and 2 is the luminous adopting surface mounted LED of two sided of the present invention comprising the copper material bottom of T shapes
The patch frame 2 of plate 1 and the encapsulation bottom plate 1, be provided on the bottom plate 1 for connect the external pin of external circuit with
And the inside pin for connecting the copper electrode, the left and right sides of the bottom plate 1 are fixedly installed LED chip 3, and institute
The positive and negative anodes for stating LED chip 3 connect the bottom plate 1 by gold thread.
It, can be in the left and right two for the patch frame 2 for encapsulating the bottom plate 1 due to the copper material bottom plate that the bottom plate 1 is T shapes
Side is respectively mounted LED chip 3, to achieve the purpose that dual-side emissive, moreover, the bottom plate 1 is T shapes, is not only convenient for patch
Installation, and its heat-conducting area is larger so that the bottom plate 1 can high temperature resistant, there is excellent heat conductivility.
When specific connection, the LED chip 3 is fixedly connected on by conductive silver glue or insulating cement on the bottom plate 1.
Specifically, on the both sides of the bottom plate 1 " | " it is respectively used to connect the LED chip 3 and described in being connected with gold thread
The positive and negative anodes of LED chip 3；It is separated on the both sides of " | " in "-", is respectively used to that the external pin for connecting external circuit is arranged
And the inside pin for connecting internal circuit.
Specifically in the present embodiment, the bottom plate 1 is an integral structure, and is that copper material punching press is T-shaped；Alternatively, described
Bottom plate 1 is spliced by two L-shaped copper materials.
It is by the way that the bottom plate 1 to be put into after shaper to the stock mould that the patch frame 2, which encapsulates the bottom plate 1,
Resin is injected in tool, specifically, the resin is epoxy resin or PCT resins or PPA resins.
In order to allow the SMD LED of the double-side to send out the light of different colours, the outside of the LED chip 3 is set
It is equipped with phosphor powder layer.
In order to ensure that the SMD LED have good sealing performance, the outside of the phosphor powder layer is additionally provided with sealing
Layer, specifically, the material of the sealant is silica gel or epoxy resin, so that the SMDLED is with preferable heat-resisting
Property, moisture resistance, insulating properties, high mechanical properties and chemical stability.
The LED chip 3 is the chip for the light that can emit different wave length, specifically in the present embodiment, the LED chip
The wave-length coverage of 3 missile light includes：Ultraviolet light is sent out, wave-length coverage makes 360~410nm；Red light, wave-length coverage make
610~660nm；Green light, wave-length coverage make 500~550nm；Blue light, wave-length coverage make 410~490nm；Near-infrared
Light, wave-length coverage are 780~940nm.Moreover, when the wave-length coverage for the light that the LED chip 3 emits is 360~410nm
When, the phosphor powder layer is reddish yellow green fluorescence bisque, since reddish yellow green fluorescence bisque is the purple of 360~410nm in wave-length coverage
Can be sent out after the irradiation of outer light wave-length coverage be 480~590nm, reference color temperature 3000K~6000K white light.
It should be noted that in the description of the present invention, term " first ", " second " etc. are used for description purposes only, without
It can be interpreted as indicating or implying relative importance.
The above embodiment is only the preferred embodiment of the present invention, and the scope of protection of the present invention is not limited thereto,
The variation and replacement for any unsubstantiality that those skilled in the art is done on the basis of the present invention belong to institute of the present invention
Claimed range.
Claims (10)
1. a kind of luminous adopting surface mounted LED of two sided, it is characterised in that：Copper material bottom plate including T shapes and the encapsulation bottom plate
Patch frame, external pin for connecting external circuit is provided on the bottom plate and for connecting the copper electrode
The left and right sides of internal pin, the bottom plate is fixedly installed LED chip, and the positive and negative anodes of the LED chip pass through gold
Line connects the bottom plate.
2. the luminous adopting surface mounted LED of two sided as described in claim 1, it is characterised in that：The bottom plate is an integral structure.
3. the luminous adopting surface mounted LED of two sided as described in claim 1, it is characterised in that：The bottom plate is by two L-shaped copper
Material is spliced.
4. the luminous adopting surface mounted LED of two sided as described in claim 1, it is characterised in that：Described in the patch framework encapsulation
Bottom plate is to inject resin into the shaper by the way that the bottom plate to be put into after shaper.
5. the luminous adopting surface mounted LED of two sided as claimed in claim 2, it is characterised in that：The resin be epoxy resin or
PCT resins or PPA resins.
6. the luminous adopting surface mounted LED of two sided as described in claim 1, it is characterised in that：The external setting of the LED chip
There is phosphor powder layer.
7. the luminous adopting surface mounted LED of two sided as claimed in claim 6, it is characterised in that：The outside of the phosphor powder layer is also
It is provided with sealant.
8. the luminous adopting surface mounted LED of two sided as claimed in claim 8, it is characterised in that：The material of the sealant is silicon
Glue or epoxy resin.
9. the adopting surface mounted LED that the two sided as described in claim 1-8 any one shines, it is characterised in that：The LED chip
For can emit different wave length light chip.
10. the adopting surface mounted LED that the two sided as described in claim 1-8 any one shines, it is characterised in that：The LED core
Piece is fixedly connected on by conductive silver glue or insulating cement on the bottom plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810583611.1A CN108807355A (en) | 2018-06-05 | 2018-06-05 | A kind of adopting surface mounted LED that two sided is luminous |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810583611.1A CN108807355A (en) | 2018-06-05 | 2018-06-05 | A kind of adopting surface mounted LED that two sided is luminous |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108807355A true CN108807355A (en) | 2018-11-13 |
Family
ID=64087636
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810583611.1A Pending CN108807355A (en) | 2018-06-05 | 2018-06-05 | A kind of adopting surface mounted LED that two sided is luminous |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108807355A (en) |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009003142A (en) * | 2007-06-21 | 2009-01-08 | Funai Electric Co Ltd | Liquid crystal display |
| JP2009267318A (en) * | 2008-04-28 | 2009-11-12 | Eeshikku Kk | Both-side light-emitting led package |
| JP2011159526A (en) * | 2010-02-02 | 2011-08-18 | Stanley Electric Co Ltd | Linear light emitting device |
| KR20140087446A (en) * | 2012-12-31 | 2014-07-09 | 박찬희 | Illumination LED lamps module fixed at both faces of T type flat by heat conductor |
| CN203733794U (en) * | 2014-01-13 | 2014-07-23 | 深圳市瑞丰光电子股份有限公司 | LED filament and lamp |
| CN204573715U (en) * | 2015-04-21 | 2015-08-19 | 北京京东方茶谷电子有限公司 | A kind of LED lamp bar, backlight and display unit |
| CN106838770A (en) * | 2017-03-31 | 2017-06-13 | 施希华 | The LED electro-optical device of electric motor car |
| CN106847800A (en) * | 2017-03-28 | 2017-06-13 | 山东晶泰星光电科技有限公司 | QFN surface-adhered types RGB LED encapsulation modules and its manufacture method |
| CN206340542U (en) * | 2017-03-28 | 2017-07-18 | 山东晶泰星光电科技有限公司 | A kind of QFN surface-adhered types RGB LED encapsulation modules |
| CN206774571U (en) * | 2017-02-21 | 2017-12-19 | 东莞市长晟电子科技有限公司 | Novel LED support structure and its thin-type LED monomer |
| CN208538850U (en) * | 2018-06-05 | 2019-02-22 | 深圳市汉华光电子有限公司 | A kind of adopting surface mounted LED that two sided is luminous |
-
2018
- 2018-06-05 CN CN201810583611.1A patent/CN108807355A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009003142A (en) * | 2007-06-21 | 2009-01-08 | Funai Electric Co Ltd | Liquid crystal display |
| JP2009267318A (en) * | 2008-04-28 | 2009-11-12 | Eeshikku Kk | Both-side light-emitting led package |
| JP2011159526A (en) * | 2010-02-02 | 2011-08-18 | Stanley Electric Co Ltd | Linear light emitting device |
| KR20140087446A (en) * | 2012-12-31 | 2014-07-09 | 박찬희 | Illumination LED lamps module fixed at both faces of T type flat by heat conductor |
| CN203733794U (en) * | 2014-01-13 | 2014-07-23 | 深圳市瑞丰光电子股份有限公司 | LED filament and lamp |
| CN204573715U (en) * | 2015-04-21 | 2015-08-19 | 北京京东方茶谷电子有限公司 | A kind of LED lamp bar, backlight and display unit |
| CN206774571U (en) * | 2017-02-21 | 2017-12-19 | 东莞市长晟电子科技有限公司 | Novel LED support structure and its thin-type LED monomer |
| CN106847800A (en) * | 2017-03-28 | 2017-06-13 | 山东晶泰星光电科技有限公司 | QFN surface-adhered types RGB LED encapsulation modules and its manufacture method |
| CN206340542U (en) * | 2017-03-28 | 2017-07-18 | 山东晶泰星光电科技有限公司 | A kind of QFN surface-adhered types RGB LED encapsulation modules |
| CN106838770A (en) * | 2017-03-31 | 2017-06-13 | 施希华 | The LED electro-optical device of electric motor car |
| CN208538850U (en) * | 2018-06-05 | 2019-02-22 | 深圳市汉华光电子有限公司 | A kind of adopting surface mounted LED that two sided is luminous |
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