CN108171299A - A kind of processing technology of smart card - Google Patents
A kind of processing technology of smart card Download PDFInfo
- Publication number
- CN108171299A CN108171299A CN201711373881.1A CN201711373881A CN108171299A CN 108171299 A CN108171299 A CN 108171299A CN 201711373881 A CN201711373881 A CN 201711373881A CN 108171299 A CN108171299 A CN 108171299A
- Authority
- CN
- China
- Prior art keywords
- support plate
- smart card
- encapsulating compound
- processing technology
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005516 engineering process Methods 0.000 title claims abstract description 49
- 150000001875 compounds Chemical class 0.000 claims abstract description 48
- 239000003292 glue Substances 0.000 claims description 42
- 239000011521 glass Substances 0.000 claims description 16
- 239000012530 fluid Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 239000002699 waste material Substances 0.000 abstract description 4
- 229940126214 compound 3 Drugs 0.000 description 37
- 238000010586 diagram Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 238000003912 environmental pollution Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
- G06K19/0727—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs the arrangement being a circuit facilitating integration of the record carrier with a hand-held device such as a smart phone of PDA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Signal Processing (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Computer Networks & Wireless Communication (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
The present invention relates to technical field of intelligent card more particularly to a kind of processing technologys of smart card.The smart card include support plate and the chip that is arranged on the support plate side and is connect with the support plate circuit and by the chip package in the support plate side and substantially with the encapsulating compound concordant with the support plate contact edges of chip opposite side of the support plate；The processing technology includes the following steps that the chip is fixed on the support plate by S1；S2 connects the chip with the support plate circuit；S3 using encapsulating compound by the chip package in the side of the support plate, and so that the edge of the encapsulating compound is substantially concordant with the edge of the support plate contact on the support plate.The processing technology of the smart card of the present invention production cost is low, production efficiency is high and not waste of resource.
Description
Technical field
The present invention relates to technical field of intelligent card more particularly to a kind of processing technologys of smart card.
Background technology
Smart card is 21 century smart electronics product with the fastest developing speed, by multi-field application, has incorporated society
Each corner of meeting, such as bank card, access card, mass transit card and SIM cards of mobile phones.Traditional smart card is a 85X54mm
Slim card, thickness 0.76mm meet the mechanical dimension of ISO7816 and the requirement of electrical characteristic.Its core is embedding
In a smart card module in card body, it is made of substrate, chip and some auxiliary materials.
Bank card, access card and mass transit card etc. are used generally in the form of kilocalorie, and the SIM card of mobile phone is without an example
Other places is used by the way of lesser calorie.User breaks down lesser calorie in the card slot for being placed on mobile phone after SIM cards of mobile phones is had purchased,
Without using remaining card base section.The manufacturing process of SIM cards of mobile phones include module processing technology, card base processing technology and
By the processing technology of Module-embedding card base, it is card base processing technology and two by Module-embedding card base to be directed to card base
Processing technology, the processing technology for being related to card base is more, makes production cost high, low production efficiency, and in card base processing technology
A large amount of card matrix material is used, this causes the waste of resource again.And lesser calorie is broken down after SIM cards of mobile phones is had purchased in family
It is placed in the card slot of mobile phone, remaining card base section discards and polluted environment.
Invention content
Therefore, the technical problem to be solved in the present invention is to overcome the of high cost, raw of prior art production of intelligent clipping technique
It produces that efficiency is low and the problem of waste of resource, provides that a kind of production cost is low, production efficiency is high and the not smart card of waste of resource
Processing technology.
To solve the above problems, a kind of processing technology of smart card of the present invention, the smart card includes support plate and setting
The support plate side and the chip that is connect with the support plate circuit and by the chip package in the support plate side and base
This encapsulating compound concordant with the support plate contact edges of chip opposite side with the support plate；The processing technology includes following step
Suddenly,
The chip is fixed on the support plate by S1；
S2 connects the chip with the support plate circuit；
S3 using encapsulating compound by the chip package in the side of the support plate, and causes the edge base of the encapsulating compound
This is concordant with the edge of the support plate contact on the support plate.
In step s3, the side surface far from the support plate of the encapsulating compound is processed as and support plate contact phase
Corresponding and parallel plane.
The glue that is not easy to flow that the encapsulating compound includes liquid character flows glue with easy.
In the step S3, following steps are further included,
By it is described be not easy to flow glue connect along the outside of the support plate contact circumferential direction with the support plate, it is described to be not easy to flow
It is to be not easy to flow the accommodating chamber of glue that glue forms outer wall after being connect with the support plate；
The easy flowing glue is filled into the accommodating chamber；
It is not easy to flow glue and the easy flowing glue described in curing.
In the step S3, following steps are further included,
Mold is set to the side for being fixed with the chip of the support plate；
The encapsulating compound is filled into the mold；
Cure the encapsulating compound；
The mold is taken out from the support plate.
The inner cavity of the mold is substantially concordant with the edge of the support plate contact.
In the step S3, following steps are further included,
The encapsulating compound is connect with the support plate；
Cure the encapsulating compound；
Polish the part opposite with support plate contact in the side wall far from the support plate of the encapsulating compound, make the part with
The support plate contact is parallel.
After the step S3, following steps are further included,
After setting can print the pasting board of information on the side wall far from the support plate of the encapsulating compound, in the pasting board
Upper printing information.
After the step S3, following steps are further included,
Information is printed on the side wall far from the support plate of the encapsulating compound.
Several support plates are arranged on slide glass.
After the step S3, following steps are further included：
Several support plates on the slide glass are separated from each other；
Test the support plate, the chip, the encapsulating compound and its connection structure.
It is arranged on the slide glass with being connected with each other between several support plates.
Several support plates are arranged on by connector on the slide glass, and the encapsulating compound may pass through the connector and institute
The offside side wall equipped with the chip for stating support plate is parallel.
Technical solution of the present invention has the following advantages that：
1. in the processing technology of the smart card of the present invention, the smart card includes support plate and is arranged on the support plate side
And the chip that is connect with the support plate circuit and by the chip package in the support plate side and substantially with the support plate
The encapsulating compound concordant with the support plate contact edges of chip opposite side；The processing technology includes the following steps that S1 consolidates chip
It is scheduled on the support plate；S2 connects the chip with the support plate circuit；S3, using encapsulating compound by the chip package in
The side of the support plate, and edge of the edge of the encapsulating compound substantially with the support plate contact on the support plate is put down
Together.The processing technology of the smart card of the present invention is not involved with the relevant processing technology of card base, and the smart card produced does not block
Base, processing technology is relatively simple, and production efficiency is high, and saves a large amount of card matrix material, economizes on resources, and saves production cost；
During using smart card, avoid by without using card base section discard, it is more environmentally friendly and hence it is also possible to reduce environmental pollution.
2. in the processing technology of the smart card of the present invention, by by side table of the encapsulating compound far from the support plate
Face is processed as the plane corresponding and parallel with the support plate contact so that smart card is mounted on using behind place, and encapsulating compound supports
The support plate contact is in close contact with the contact at the application of IC cards, is made at the support plate contact and the application of IC cards
Contact portion effect it is good.
3. the present invention smart card processing technology in, the encapsulating compound include liquid character be not easy to flow glue and easily
Flow glue, by it is described be not easy to flow glue connect along the outside of the support plate contact circumferential direction with the support plate, be not easy using described
Flow itself not easy mobility of glue, described to be not easy to flow formation outer wall after glue is connect with the support plate be to be not easy to flow the appearance of glue
Receive chamber；The easy flowing glue is filled into the accommodating chamber, utilizes the easy mobility of the easy flowing glue, the easy flowing glue
The accommodating chamber can be filled up, and is plane by the upper surface that the easy flowing glue is formed, because, it is described to be not easy to flow glue and institute
Outer wall is formed in the outside of the support plate contact circumferential direction after stating support plate connection, so the upper surface that the easy flowing glue is formed covers
Where the support plate contact on the support plate of part, the plane of the upper surface and the support plate contact of the easy flowing glue is put down
Row；It is not easy to flow glue and the easy flowing glue described in curing, the smart card is just made.
4. in the processing technology of the smart card of the present invention, mold is set to the chip of being fixed with of the support plate
Side；The encapsulating compound is filled into the mold；After the full mold of mobility filling of the encapsulating compound, cure institute
State encapsulating compound；After the mold is taken out from the support plate, the smart card is made.
5. in the processing technology of the smart card of the present invention, the edge of the inner cavity of the mold substantially with the support plate contact
Concordantly, it can be ensured that the edge of the encapsulating compound is substantially concordant with the edge of the support plate contact on the support plate, and then makes
It obtains smart card to be mounted on using behind place, encapsulating compound supports the support plate contact closely to connect with the contact at the application of IC cards
It touches, the support plate contact and the contact portion effect at the application of IC cards are good.
6. in the processing technology of the smart card of the present invention, in the step S3, following steps are further included, it will be fluid
The encapsulating compound of shape is connect with the support plate；Cure the encapsulating compound；At this point, the table far from the support plate of the encapsulating compound
There are protrusion or uneven surface in face, at this moment polishes opposite with support plate contact in the side wall far from the support plate of the encapsulating compound
Part makes the part parallel with the support plate contact, so that the support plate contact in smart card and the application of IC cards
The contact portion effect at place is good.
Description of the drawings
It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution of the prior art
Embodiment or attached drawing needed to be used in the description of the prior art are briefly described, it should be apparent that, in being described below
Attached drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not making the creative labor
It puts, can also be obtained according to these attached drawings other attached drawings.
Fig. 1 is the processing step schematic diagram in the embodiment of the present invention one；
Fig. 2 is the processing step schematic diagram in the embodiment of the present invention two；
Fig. 3 is the processing step schematic diagram in the embodiment of the present invention three；
Fig. 4 is the processing step schematic diagram in the embodiment of the present invention four；
Fig. 5 is the processing step schematic diagram in the embodiment of the present invention six；
Fig. 6 is a kind of schematic cross-sectional view of the front view of smart card of the present invention；
Fig. 7 is the schematic cross-sectional view of the front view of another smart card of the present invention；
Reference sign：
1- support plates；2- chips；3- encapsulating compounds.
Specific embodiment
Technical scheme of the present invention is clearly and completely described below in conjunction with attached drawing, it is clear that described implementation
Example is part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill
Personnel's all other embodiments obtained without making creative work, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that term " " center ", " on ", " under ", "left", "right", " vertical ",
The orientation or position relationship of the instructions such as " level ", " interior ", " outer " be based on orientation shown in the drawings or position relationship, merely to
Convenient for the description present invention and simplify description rather than instruction or imply signified device or element must have specific orientation,
With specific azimuth configuration and operation, therefore it is not considered as limiting the invention.
Embodiment one：
As shown in Figure 1, Figure 6, Figure 7, the smart card that the processing technology of the smart card of the present embodiment is produced include support plate 1,
Chip 2 and encapsulating compound 3.
Chip 2 is arranged on 1 side of support plate and is connect with 1 circuit of support plate.
Encapsulating compound 3 by chip 2 be packaged in 1 side of support plate and substantially with the support plate contact with 2 opposite side of chip of support plate 1
Edge is concordant.
As shown in Figure 1, the processing technology of the smart card of the present embodiment includes the following steps：
Chip 2 is fixed on support plate 1 by S1；
S2 connects chip 2 with 1 circuit of support plate；
Chip 2, is packaged in the side of support plate 1 using encapsulating compound 3 by S3, and cause the edge of encapsulating compound 3 substantially with support plate 1
On support plate contact edge it is concordant；
Several support plates 1 on slide glass are separated from each other by S4；
S5, test.
The processing technology of the smart card of the present embodiment is not involved with the relevant processing technology of card base, the smart card produced
Not card base, processing technology is relatively simple, and production efficiency is high, and saves a large amount of card matrix material, economizes on resources, saving is produced into
This；When using smart card, avoid by without using card base section discard, and hence it is also possible to reduce environmental pollution, more
Environmental protection.
It is arranged on slide glass with being connected with each other between several support plates 1 in the present embodiment.Slide glass includes two sides, and the
One side is equipped with the support plate contact being in close contact with the contact at application of IC cards, and the side opposite to first side is used to set
Put chip 2.
Encapsulating compound 3 is substantially concordant with the support plate contact edges in the first side of support plate 1, i.e. the edge of encapsulating compound 3 can be with
It is concordant with support plate contact edges, support plate contact edges can also be slightly less than, as long as meeting requirement；Certainly do not limit to
In this, the edge of encapsulating compound 3 can also be more than the edge of support plate contact, as long as ensureing that smart card is inserted into the card slot using place
In.
In the step S3 of the present embodiment, in order to enable smart card is mounted on after applying place, 3 supports loadboard contact of encapsulating compound
It is in close contact with the contact at application of IC cards, support plate contact and the contact portion effect at application of IC cards are good, by encapsulating compound 3
A side surface of separate support plate 1 be processed as the plane corresponding and parallel with support plate contact.
Test includes test carrier plate 1, chip 2, encapsulating compound 3 and its connection structure.
Embodiment two：
As shown in Fig. 2, the character of encapsulating compound 3 is different, the technique of use can be corresponding different, encapsulating compound in the present embodiment
3 glue that are not easy to flow for including liquid character flow glue with easy, and therefore, the processing technology of smart card includes the following steps：
Chip 2 is fixed on support plate 1 by S1；
S2 connects chip 2 with 1 circuit of support plate；
S3, will be not easy to flow glue and is connect along the outside of support plate contact circumferential direction with support plate 1, is not easy to flow glue and connects with support plate 1
It is to be not easy to flow the accommodating chamber of glue that outer wall is formed after connecing；
Glue will easily be flowed to fill into accommodating chamber；
Curing is not easy to flow glue and easily flowing glue；
Several support plates 1 on slide glass are separated from each other by S4；
S5, test.
Embodiment three：
As shown in figure 3, the difference between the present embodiment and the second embodiment lies in that, with the injecting glue amount and packet of mold control encapsulating compound 3
The flow direction of sealing 3, the processing technology of the smart card in this implementation include the following steps：
Chip 2 is fixed on support plate 1 by S1；
S2 connects chip 2 with 1 circuit of support plate；
Mold is set to the side for being fixed with chip 2 of support plate 1 by S3；
Encapsulating compound 3 is filled into mold；
Cure encapsulating compound 3；
Mold is taken out from support plate 1.
Several support plates 1 on slide glass are separated from each other by S4；
S5, test.
In the present embodiment, the inner cavity of mold is substantially concordant with the edge of support plate contact, to ensure the edge base of encapsulating compound 3
This with support plate contact edge it is concordant.
In this embodiment, the character of encapsulating compound 3 can be liquid, naturally it is also possible to which, for solid-state, encapsulating compound 3 is entering setting
Become liquid before the mold on support plate 1 or in mold process is entered, certainly, encapsulating compound 3 may be powdered
Character in powder form into mold, and changes, chip 2 is packaged in the side of support plate 1 in a mold.
Example IV：
As shown in figure 4, the present embodiment and above-described embodiment be difference lies in, the injecting glue mode of encapsulating compound 3 in step S3, this
The processing technology of smart card in implementation includes the following steps：
Chip 2 is fixed on support plate 1 by S1；
S2 connects chip 2 with 1 circuit of support plate；
Encapsulating compound 3 is connect by S3 with support plate 1；
Cure encapsulating compound 3；
Part opposite with support plate contact in the side wall of the separate support plate 1 of encapsulating compound 3 is polished, part is made to be put down with support plate contact
Row；
Several support plates 1 on slide glass are separated from each other by S4；
S5, test.
Embodiment five：
Difference lies in several support plates 1 are arranged on by connector on slide glass, are being encapsulated for the present embodiment and above-described embodiment
When chip 2 is packaged in the side of support plate 1 by glue 3, encapsulating compound 3 can make the table of encapsulating compound 3 to pass through the connector between support plate 1
The flush in face and support plate contact, i.e. encapsulating compound 3 are parallel with the offside side wall equipped with chip 2 of support plate 1.In present embodiment
The edge of the encapsulating compound 3 of the smart card of production is more than the edge of support plate contact.The surface of encapsulating compound 3 and the surface of support plate contact are put down
Together suitable for such as mobile phone card slot, in special requirement, or the surface of encapsulating compound 3 is higher than the table of support plate contact
Face can be at the slot bottom of slot encircled a city with the surface of the contact at application in encapsulating compound 3 of support plate contact at this time.
Embodiment six：
As shown in figure 5, difference lies on the side wall of the separate support plate 1 of encapsulating compound 3 for the present embodiment and above-described embodiment
Information is printed, the present embodiment is applicable in the case of embodying information on smart cards, and the smart card in the present embodiment adds
Work technique includes the following steps：
Chip 2 is fixed on support plate 1 by S1；
S2 connects chip 2 with 1 circuit of support plate；
Chip 2, is packaged in the side of support plate 1 using encapsulating compound 3 by S3, and cause the edge of encapsulating compound 3 substantially with support plate 1
On support plate contact edge it is concordant；
S4 prints information on the side wall of the separate support plate 1 of encapsulating compound 3；
Several support plates 1 on slide glass are separated from each other by S5；
S6, test carrier plate 1, chip 2, encapsulating compound 3, connection structure and its quality for printing information.
Certainly, the setting for the step of information is printed on the side wall of the separate support plate 1 of encapsulating compound 3 is that comparison is flexible, such as may be used
After being arranged on and be separated from each other several support plates 1 on slide glass, as long as being detected printing information after ensureing the implementation of the step
Quality.
Certainly, it needs the information printed that can print according to requirements, is such as printed on connecting with support plate 1 for encapsulating compound 3
Side wall on.
Embodiment seven：
The present embodiment and embodiment six are difference lies in step S4, and step S4 may be replaced by walking as follows in embodiment six
Suddenly:
After setting can print the pasting board of information on the side wall of the separate support plate 1 of encapsulating compound 3, letter is printed on pasting board
Breath.It is of course also possible to the paster for having printed information is attached on the side wall of separate support plate 1 of encapsulating compound 3.
Obviously, the above embodiments are merely examples for clarifying the description, and is not intended to limit the embodiments.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of variation or
It changes.There is no necessity and possibility to exhaust all the enbodiments.And the obvious variation thus extended out or
Among changing still in the protection domain of the invention.
Claims (13)
1. a kind of processing technology of smart card, which is characterized in that the smart card includes support plate (1) and is arranged on the support plate
(1) side and the chip (2) that is connect with the support plate (1) circuit and the chip (2) is packaged in the support plate (1) one
Side and substantially with the encapsulating compound (3) concordant with the support plate contact edges of the chip (2) opposite side of the support plate (1)；Institute
Processing technology is stated to include the following steps,
The chip (2) is fixed on the support plate (1) by S1；
S2 connects the chip (2) with the support plate (1) circuit；
The chip (2) is packaged in the side of the support plate (1) using encapsulating compound (3), and causes the encapsulating compound (3) by S3
Edge it is substantially concordant with the edge of the support plate contact on the support plate (1).
2. the processing technology of smart card according to claim 1, which is characterized in that in step s3, by the encapsulating compound
(3) the side surface far from the support plate (1) is processed as the plane corresponding and parallel with the support plate contact.
3. the processing technology of smart card according to claim 1, which is characterized in that the encapsulating compound (3) is including fluid
Shape is not easy to flow glue and easily flowing glue.
4. the processing technology of smart card according to claim 3, which is characterized in that in the step S3, further include as
Lower step,
By it is described be not easy to flow glue connect along the outside of the support plate contact circumferential direction with the support plate (1), it is described to be not easy to flow
Glue forms outer wall and is not easy to flow the accommodating chamber of glue to be described after being connect with the support plate (1)；
The easy flowing glue is filled into the accommodating chamber；
It is not easy to flow glue and the easy flowing glue described in curing.
5. the processing technology of smart card according to claim 1, which is characterized in that in the step S3, further include as
Lower step,
Mold is set to the side for being fixed with the chip (2) of the support plate (1)；
The encapsulating compound (3) is filled into the mold；
Cure the encapsulating compound (3)；
The mold is taken out from the support plate (1).
6. the processing technology of smart card according to claim 5, which is characterized in that the inner cavity of the mold substantially with it is described
The edge of support plate contact is concordant.
7. the processing technology of smart card according to claim 1, which is characterized in that in the step S3, further include as
Lower step,
The encapsulating compound (3) is connect with the support plate (1)；
Cure the encapsulating compound (3)；
Part opposite with the support plate contact in the side wall far from the support plate (1) of the encapsulating compound (3) is polished, is made described
Part is parallel with the support plate contact.
8. the processing technology of smart card according to claim 1, which is characterized in that after the step S3, further include
Following steps,
After setting can print the pasting board of information on the side wall far from the support plate (1) of the encapsulating compound (3), in the patch
Information is printed on plate.
9. the processing technology of smart card according to claim 1, which is characterized in that after the step S3, further include
Following steps,
Information is printed on the side wall far from the support plate (1) of the encapsulating compound (3).
10. the processing technology of smart card according to claim 1, which is characterized in that several support plates (1) are arranged on load
On piece.
11. the processing technology of smart card according to claim 10, which is characterized in that after the step S3, also wrap
Include following steps：
Several support plates (1) on the slide glass are separated from each other；
Test.
12. the processing technology of the smart card according to claim 10 or 11, which is characterized in that several support plates (1) it
Between be connected with each other be arranged on the slide glass.
13. the processing technology of the smart card according to claim 10 or 11, which is characterized in that several support plates (1) are logical
It crosses connector to be arranged on the slide glass, the encapsulating compound (3) may pass through the connector and being equipped with for the support plate (1) is described
The offside side wall of chip (2) is parallel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711373881.1A CN108171299A (en) | 2017-12-19 | 2017-12-19 | A kind of processing technology of smart card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711373881.1A CN108171299A (en) | 2017-12-19 | 2017-12-19 | A kind of processing technology of smart card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108171299A true CN108171299A (en) | 2018-06-15 |
Family
ID=62522853
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711373881.1A Pending CN108171299A (en) | 2017-12-19 | 2017-12-19 | A kind of processing technology of smart card |
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| CN (1) | CN108171299A (en) |
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|---|---|---|---|---|
| CN1924903A (en) * | 2005-08-30 | 2007-03-07 | 资重兴 | Manufacture of storage card |
| CN101359636A (en) * | 2007-07-31 | 2009-02-04 | 昆山达鑫电子有限公司 | Encapsulation construction of electronic component and encapsulation method thereof |
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