CN206601718U - A kind of fingerprint module and touch control terminal - Google Patents
A kind of fingerprint module and touch control terminal Download PDFInfo
- Publication number
- CN206601718U CN206601718U CN201720079720.0U CN201720079720U CN206601718U CN 206601718 U CN206601718 U CN 206601718U CN 201720079720 U CN201720079720 U CN 201720079720U CN 206601718 U CN206601718 U CN 206601718U
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- China
- Prior art keywords
- fingerprint module
- circuit board
- binding agent
- cover plate
- sensor encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
The utility model discloses a kind of fingerprint module, it is related to field of biological recognition, the fingerprint module includes：Cover plate, sensor encapsulation, circuit board, support frame and binding agent；The cover plate lower surface is provided with ink layer, and the sensor encapsulation is positioned at the lower section of the ink layer, and in the lower section of the ink layer covered with binding agent, the cover plate is fixedly connected by the binding agent below the ink layer with sensor encapsulation；The sensor encapsulation is fixed on the top of circuit board；The both sides of the circuit board are provided with support frame；The binding agent is filled in the gap between each above-mentioned part.Described fingerprint module possesses more preferable structural stability and thinner integral thickness compared to prior art, can be saved in complete machine application and more occupy space, with preferably application effect.
Description
Technical field
The utility model is related to field of biological recognition, more particularly to a kind of fingerprint module and touch control terminal.
Background technology
At present, along with pursuit more and more higher of the consumer to product appearance, the internal component of consumer electronics product
And module also increasingly pursues ultimate attainment, either performance and technique are all pursuing the limit.
And existing fingerprint module can not then meet this demand.
Utility model content
In order to overcome the shortcomings of Related product in the prior art, the utility model proposes a kind of fingerprint module and touch-control are whole
End, the partially thick volume of the existing fingerprint module packaging of solution is excessive, causes the shortcoming taken up space in application process.
The utility model solves the technical scheme that its technical problem used：
The utility model provides a kind of fingerprint module, including：Cover plate, sensor encapsulation, circuit board, support frame and viscous
Tie agent；The cover plate lower surface is provided with ink layer, and the sensor encapsulation is positioned at the lower section of the ink layer, in the ink
The lower section of layer passes through the binding agent below the ink layer and the fixed company of sensor encapsulation covered with binding agent, the cover plate
Connect；The sensor encapsulation is fixed on the top of circuit board；The both sides of the circuit board are provided with support frame；The binding agent
It is filled in the gap between each above-mentioned part.
As further improvement of the utility model, the sensor encapsulation is wafer-level packaging.
As further improvement of the utility model, the fingerprint module also include stiffening plate, support frame as described above with it is described
Circuit board is separately fixed at the top of the stiffening plate.
As further improvement of the utility model, the cover plate is located at the inner side of support frame as described above.
As further improvement of the utility model, the oriented inner side in lower end that support frame as described above is connected with the stiffening plate
Projection, closes on the both sides of the circuit board and sensor encapsulation respectively.
As further improvement of the utility model, the sensor encapsulation is fixed on the top of circuit board by tin ball,
And be electrically connected with the circuit board.
As further improvement of the utility model, the cover plate is light-transmitting materials and thickness between tens millimeters to hundreds of
Organic matter or inorganic matter between millimeter.
As further improvement of the utility model, the dielectric constant of the cover plate is more than or equal to 3.
As further improvement of the utility model, described binding agent is silica gel system bonding agent or mixes silica
Bonding agent.
The utility model provides a kind of touch control terminal, including the fingerprint module described in any of the above-described.
Compared with prior art, the utility model has the advantage that：
Described fingerprint module possesses more preferable structural stability and thinner integral thickness compared to prior art,
It can be saved in complete machine application and more occupy space, with preferably application effect.
Brief description of the drawings
In order to illustrate more clearly of the technical scheme in the utility model embodiment, it will make below to required in embodiment
Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present utility model,
For those of ordinary skill in the art, on the premise of not paying creative work, it can also be obtained according to these accompanying drawings
Other accompanying drawings.
Fig. 1 is the structural representation of existing fingerprint module；
Fig. 2 is the structural representation of the biometric sensor case chip of existing fingerprint module；
Fig. 3 is the structural representation of fingerprint module one embodiment described in the utility model embodiment；
Fig. 4 is the structural representation of another embodiment of fingerprint module described in the utility model embodiment.
Embodiment
For the ease of understanding the utility model, the utility model is more fully retouched below with reference to relevant drawings
State.Preferred embodiment of the present utility model is given in accompanying drawing.But, the utility model can come real in many different forms
It is existing, however it is not limited to embodiment described herein.On the contrary, the purpose for providing these embodiments is made to public affairs of the present utility model
The understanding for opening content is more thorough comprehensive.
Unless otherwise defined, all of technologies and scientific terms used here by the article is led with belonging to technology of the present utility model
The implication that the technical staff in domain is generally understood that is identical.It is herein to be in term used in the description of the present utility model
The purpose of description specific embodiment, it is not intended that in limitation the utility model.
As shown in fig.1, existing fingerprint module is by cover plate, biometric sensor case chip, circuit board and support frame group
Into, and current fingerprint module using case chip due to being assembled, and described biometric sensor case chip such as Fig. 2 institutes
Show, be mainly made up of sensor wafer, substrate and plastic-sealed body, thus it is partially thick on the whole, because packaging body thickness partially causes overall mould
Group is relatively thick, so that more space-consuming in complete machine application process.
Embodiment one
As shown in fig.3, being the structural representation of fingerprint module one embodiment described in the utility model, the fingerprint mould
Group includes cover plate 1, sensor encapsulation 2, support frame 3, circuit board 4, binding agent 5 and stiffening plate 6.
The sensor encapsulation 2 is fixed on the top of the circuit board 4 by tin ball, and electrically connects with the circuit board 4
Connect, sensor encapsulation 2 is wafer-level packaging, described wafer scale sensor encapsulation 2 is direct in being made of wafer
The sensor chip arrived, for gathering finger print information；2 are encapsulated with traditional sensor shown in Fig. 1 to compare, traditional sensing
The substrate thickness of device case chip is generally 0.2mm (millimeter) left and right, and the thickness of adhesive film is in 0.05mm or so, the utility model
Sensor encapsulation described in embodiment 2 due to being wafer-level packaging, than traditional sensor case chip on integral thickness at least
Thin 0.25mm is wanted, less space is occupied during the installation of the fingerprint module, makes described in the utility model embodiment
Fingerprint module integral thickness be less than 0.4mm；On the other hand, the sensor encapsulation 2 passes through tin ball and the circuit board 4
In fixed process, because tin ball is carried in wafer-level packaging forming process, and the conductive characteristic due to tin ball in itself, and
Need not be again during SMT (Surface Mount Technology surface mounting technologies) by the operation of pad brush tin
To realize welding, installation effectiveness is improved.
The lower surface of cover plate 1 is provided with the ink layer 11 for shading, in embodiment of the present utility model, the lid
Plate 1 is the organic matter or inorganic matter of light-transmitting materials and thickness between tens millimeters to hundreds of millimeters, such as sapphire, pottery
Porcelain, glass etc., the cover plate 1 have certain light transmittance, can pass through the light of certain wavelength, and the dielectric constant of the cover plate 1 is big
In equal to 3, in other embodiment of the present utility model, the relevant featuring parameters of the cover plate 1 can enter according to the actual requirements
The corresponding adjustment of row；The sensor encapsulation 2 is located at the lower section of the ink layer 11, is covered in the lower section of the ink layer 11
There is binding agent 5, the cover plate 1 is fixedly connected by the binding agent 5 of the lower section of ink layer 11 with sensor encapsulation 2.
The both sides of the circuit board 4 are provided with below support frame 3, the circuit board 4 and are fixedly installed stiffening plate 6,
The bottom of support frame as described above 3 is fixed on the top of stiffening plate 6, the reinforcement by way of structure glue, conductive silver glue or welding
Plate 6 is to support the circuit board 4 and support frame 3 of top and the ductile strength of the lifting circuit board 4, and the cover plate 1 is located at
The inner side of support frame as described above 3.
Each part of the inside of the fingerprint module can produce gap in installation process between mutual alignment；For example,
Between support frame as described above 3 and sensor encapsulation 2, between support frame as described above 3 and the circuit board 4 etc., in the utility model
Embodiment in, the gap between each part of the inside of the fingerprint module is filled with the binding agent 5, institute
The binding agent 5 stated is silica gel system bonding agent or the bonding agent for mixing silica, with low thermal coefficient of expansion and high impact-resistant
The characteristic of intensity, the space structure to support each part of the fingerprint module internal, simultaneously because its characteristic can be with
Effectively protection sensor encapsulation 2 structure and performance stability, it also avoid because external cause as collide etc. caused by as described in finger
Skew or damage of each part of the inside of line module etc..
In embodiment of the present utility model, described fingerprint module possesses more preferable Stability Analysis of Structures compared to prior art
Property and thinner integral thickness, can save in complete machine application and more occupy space, with preferably application effect.
Embodiment two
On the basis of above-described embodiment, as shown in fig.4, being another reality of fingerprint module described in the utility model embodiment
Apply the structural representation of example.
The projection for the oriented inner side in lower end that described support frame 3 is connected with the stiffening plate 6, closes on the circuit board respectively
4 and the both sides of sensor encapsulation 2, because the projection has filled up the portion void of the fingerprint module internal, fill described refer to
The binding agent 5 used in gap between each part of the inside of line module is reduced.
When the thermal coefficient of expansion of the binding agent 5 selected by the fingerprint module is higher, due to the binding agent 5 outside
Volume can expand after portion's temperature rise, and the quantity of binding agent 5 used is more, and the overall Volume Changes of binding agent 5 are bigger, in order to drop
The influence of the Volume Changes of the low binding agent 5, the binding agent 5 is reduced by the structure described in the utility model embodiment
Usage amount, the structural stability of the fingerprint module can be effectively improved, on the other hand, in the thermal expansion system of binding agent 5
When number is relatively low, the structure of the fingerprint module described in above-described embodiment can also be selected, is selected according to the actual requirements.
Embodiment three
On the basis of above-described embodiment, the utility model embodiment additionally provides a kind of touch control terminal, and the touch-control is whole
End includes the fingerprint module described in above-described embodiment, and the touch control terminal possesses the above-mentioned corresponding functional module of fingerprint module and had
Beneficial effect, specifically refers to the embodiment of above-mentioned fingerprint module, and the embodiment of the present invention will not be repeated here.
Above-described embodiment is the utility model preferably embodiment, but embodiment of the present utility model is not by above-mentioned
The limitation of embodiment, it is other it is any without departing from Spirit Essence of the present utility model with made under principle change, modify, replace
Generation, combination, simplification, should be equivalent substitute mode, are included within protection domain of the present utility model.
Claims (10)
1. a kind of fingerprint module, it is characterised in that including：
Cover plate, sensor encapsulation, circuit board, support frame and binding agent；
The cover plate lower surface is provided with ink layer, and the sensor encapsulation is positioned at the lower section of the ink layer, in the ink
The lower section of layer passes through the binding agent below the ink layer and the fixed company of sensor encapsulation covered with binding agent, the cover plate
Connect；
The sensor encapsulation is fixed on the top of circuit board；
The both sides of the circuit board are provided with support frame；
The binding agent is filled in the gap between each above-mentioned part.
2. fingerprint module according to claim 1, it is characterised in that：The sensor encapsulation is wafer-level packaging.
3. fingerprint module according to claim 1, it is characterised in that the fingerprint module also includes stiffening plate, the branch
Support is separately fixed at the top of the stiffening plate with the circuit board.
4. fingerprint module according to claim 3, it is characterised in that：The cover plate is located at the inner side of support frame as described above.
5. fingerprint module according to claim 4, it is characterised in that：The lower end that support frame as described above is connected with the stiffening plate
The projection of oriented inner side, closes on the both sides of the circuit board and sensor encapsulation respectively.
6. fingerprint module according to claim 1, it is characterised in that：The sensor encapsulation is fixed on circuit by tin ball
The top of plate, and be electrically connected with the circuit board.
7. fingerprint module according to claim 1, it is characterised in that：The cover plate is light-transmitting materials and thickness between tens
Millimeter is to the organic matter or inorganic matter between hundreds of millimeters.
8. fingerprint module according to claim 7, it is characterised in that：The dielectric constant of the cover plate is more than or equal to 3.
9. fingerprint module according to claim 1, it is characterised in that：Described binding agent is silica gel system bonding agent or ginseng
The bonding agent of miscellaneous silica.
10. a kind of touch control terminal, it is characterised in that including the fingerprint module as described in claim any one of 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720079720.0U CN206601718U (en) | 2017-01-22 | 2017-01-22 | A kind of fingerprint module and touch control terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720079720.0U CN206601718U (en) | 2017-01-22 | 2017-01-22 | A kind of fingerprint module and touch control terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206601718U true CN206601718U (en) | 2017-10-31 |
Family
ID=60148919
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720079720.0U Active CN206601718U (en) | 2017-01-22 | 2017-01-22 | A kind of fingerprint module and touch control terminal |
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| Country | Link |
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| CN (1) | CN206601718U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108038470A (en) * | 2017-12-27 | 2018-05-15 | 北京康力优蓝机器人科技有限公司 | For the fingerprint identification device of intelligent robot, touch screen displays, smart machine |
| CN108764162A (en) * | 2018-05-30 | 2018-11-06 | 江苏凯尔生物识别科技有限公司 | A kind of fingerprint module |
-
2017
- 2017-01-22 CN CN201720079720.0U patent/CN206601718U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108038470A (en) * | 2017-12-27 | 2018-05-15 | 北京康力优蓝机器人科技有限公司 | For the fingerprint identification device of intelligent robot, touch screen displays, smart machine |
| CN108038470B (en) * | 2017-12-27 | 2018-11-23 | 北京康力优蓝机器人科技有限公司 | For the fingerprint identification device of intelligent robot, touch screen displays, smart machine |
| CN108764162A (en) * | 2018-05-30 | 2018-11-06 | 江苏凯尔生物识别科技有限公司 | A kind of fingerprint module |
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