CN203630794U - Fingerprint identification device and mobile terminal - Google Patents

Fingerprint identification device and mobile terminal Download PDF

Info

Publication number
CN203630794U
CN203630794U CN201320827531.9U CN201320827531U CN203630794U CN 203630794 U CN203630794 U CN 203630794U CN 201320827531 U CN201320827531 U CN 201320827531U CN 203630794 U CN203630794 U CN 203630794U
Authority
CN
China
Prior art keywords
described
identification device
fingerprint identification
cover plate
electrically connected
Prior art date
Application number
CN201320827531.9U
Other languages
Chinese (zh)
Inventor
龙卫
Original Assignee
深圳市汇顶科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
Application filed by 深圳市汇顶科技股份有限公司 filed Critical 深圳市汇顶科技股份有限公司
Priority to CN201320827531.9U priority Critical patent/CN203630794U/en
Application granted granted Critical
Publication of CN203630794U publication Critical patent/CN203630794U/en
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=50817251&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CN203630794(U) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.

Links

Abstract

The utility model discloses a fingerprint identification device and a mobile terminal. The fingerprint identification device comprises a dielectric cover plate, a support having a through hole, a sensing chip, a control circuit board and a base plate. The dielectric cover plate is accommodated in the through hole and closed connected with the sensing chip. When a finger presses the dielectric cover plate, the sensing chip collects a fingerprint and generates an analog signal. The control circuit processes the analog signal and identifies the fingerprint. The sensing chip includes a sensing unit and a connection unit extending in the radial direction at the edge of the sensing unit. The sensing unit is connected with the dielectric cover plate. The connection unit is electrically connected with the base plate. According to the utility model, the connection unit is kept away from the dielectric cover plate, and the position of welding lines is avoided by making a groove or a notch on the support or arranging a boss to form a step shape on the dielectric cover plate, so that the position of welding lines is avoided without making a groove on the sensing chip, thereby reducing the processing difficulty and reducing the production cost.

Description

Fingerprint identification device and mobile terminal

Technical field

The utility model relates to fingerprint identification technology field, especially relates to a kind of capacitor type fingerprint identification device, and has the mobile terminal of this fingerprint identification device.

Background technology

Fingerprint identification device has started to be widely used in various terminal devices, as mobile terminal, banking system, attendance checking system etc.The most frequently used fingerprint identification device is finger paddling type and optical imagery type, wherein points the sensitivity of paddling type poor, finger have stain or direction not good all can cause responding to malfunctioning; Meanwhile, the poor stability of finger paddling type and optical imagery type fingerprint identification device, is easily cracked by fingerprint duplication mode.

At present, there is capacitor type fingerprint identification device, and started to be applied to mobile terminal.This capacitor type fingerprint identification device comprises dielectric cover plate, the sensing chip being connected with dielectric cover plate, the flexible PCB being electrically connected with sensing chip, the flexible PCB peripheral circuits such as plug-in control circuit, filtering circuit that stretch out.Sensing chip Base top contact bonding wire is electrically connected with flexible PCB, because sensing chip top is closely connected with dielectric cover plate, affects the flatness of dielectric cover plate for fear of bonding wire, therefore need on sensing chip, process groove to hold bonding wire.But the difficulty of processing of processing groove on sensing chip is larger, production yield and efficiency are lower, and therefore production cost is very high.Simultaneously plug-in peripheral circuit on flexible PCB, makes the complicated structure of whole module, and the requirement of former material technique and module packaging technical is all higher, has further improved production cost.

Utility model content

Fundamental purpose of the present utility model is to provide a kind of fingerprint identification device and mobile terminal, is intended to reduce difficulty of processing by structural improvement, improves yields and production efficiency, reduces production costs.

To achieve these objectives, the utility model proposes a kind of fingerprint identification device, comprise dielectric cover plate, there is the support of a through hole, sensing chip, control circuit and base plate, described dielectric cover plate is placed in described through hole and is connected with described sensing chip, described sensing chip is used for gathering fingerprint and generates simulating signal, described control circuit is processed described simulating signal and is identified fingerprint, described sensing chip comprises induction part and radially extends in this induction part edge and the connecting portion that forms, described induction part connects described dielectric cover plate, described connecting portion is electrically connected described base plate.

Preferably, described connecting portion is electrically connected with described base plate by bonding wire or through-silicon via structure.

Preferably, described connecting portion is electrically connected with described base plate by bonding wire, and the corresponding described position of bonding wire of described support place is provided with groove or breach.

Preferably, described connecting portion is electrically connected with described base plate by bonding wire, and described dielectric cover plate comprises a boss being connected with described induction part through described through hole, forms a space that holds described bonding wire between described boss and described support.

Preferably, described base plate is flexible PCB or substrate.

Preferably, described base plate is substrate, and described control circuit is located at a control chip, and this control chip is electrically connected described substrate, and described substrate is electrically connected a flexible PCB and is electrically connected with external circuit by this flexible PCB.

Preferably, described fingerprint identification device also comprises a bottom, and described substrate, sensing chip and control chip are between described bottom and dielectric cover plate.

Preferably, described dielectric cover plate is recessed to be placed in described through hole, and described control circuit is electrically connected with described support.

Preferably, described control circuit is electrically connected with described base plate, and described base plate is provided with the conducting terminal that at least one and described support is electrically connected, and described control circuit is electrically connected with described support by described conducting terminal.

The utility model proposes a kind of mobile terminal simultaneously, it comprises a fingerprint identification device, this fingerprint identification device comprises dielectric cover plate, there is the support of a through hole, sensing chip, control circuit and base plate, described dielectric cover plate is placed in described through hole and is connected with described sensing chip, described sensing chip is used for gathering fingerprint and generates simulating signal, described control circuit is processed described simulating signal and is identified fingerprint, described sensing chip comprises induction part and radially extends in this induction part edge and the connecting portion that forms, described induction part connects described dielectric cover plate, described connecting portion is electrically connected described base plate.

A kind of fingerprint identification device provided by the utility model, by radially extending and form a junction in sensing chip induction part edge, makes connecting portion avoid dielectric cover plate.Thereby only need on support, process groove or breach, or a boss is set on dielectric cover plate and stepped, avoid position of bonding wire; Or allow the connecting portion of sensing chip be electrically connected with base plate by through-silicon via structure.Finally avoid processing groove and avoid position of bonding wire on sensing chip, therefore reduced difficulty of processing, improved yields and production efficiency, reduced production cost.

Accompanying drawing explanation

Fig. 1 is the structural representation of fingerprint identification device the first embodiment of the present utility model;

Fig. 2 is the explosive view of the fingerprint identification device in Fig. 1;

Fig. 3 is the structural representation of fingerprint identification device the second embodiment of the present utility model;

Fig. 4 is the A-A cut-open view of fingerprint identification device in Fig. 3;

Fig. 5 is the cut-open view of fingerprint identification device of the present utility model the 3rd embodiment;

Fig. 6 is the cut-open view of fingerprint identification device of the present utility model the 4th embodiment.

Realization, functional characteristics and the advantage of the utility model object, in connection with embodiment, are described further with reference to accompanying drawing.

Embodiment

Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.

Fingerprint identification device of the present utility model is capacitor type fingerprint identification device, can be applied to the mobile terminals such as mobile phone, panel computer, notebook computer, also can be applied to the financial terminal equipments such as ATM.

Referring to Fig. 1, Fig. 2, fingerprint identification device the first embodiment of the present utility model is proposed, described fingerprint identification device comprises support 100, dielectric cover plate 200, sensing chip 300, control chip (not shown) and base plate, described base plate can be substrate 410 or flexible PCB 420, the present embodiment preferable substrate 410 now need connect other conducting parts such as a flexible PCB 420(or wire on substrate 410) external external circuit.

Dielectric cover plate 200 is anisotropic dielectric material, preferably with Al 2o 3for synthetic sapphire glass or the tempered glass of principal ingredient, it provides a smooth interface for finger contact for the protection of inner structure.The specific inductive capacity of dielectric cover plate 200 preferably 9.3~11.5, below thickness 350um, flatness is less than 10um, surface figure accuracy 0.1 λ, the parameter of aforementioned dielectric cover plate 200 is only done preferred embodiment, it is not limited.The color level of dielectric cover plate 200 mainly comes from deposition and forms or form coating or in beneath laminating ink layer by special technique, object is to guarantee that dielectric cover plate 200 is opaque, avoid user to see bottom device architecture, dielectric cover plate 200 edges can use heat-activated films and perimeter seal to be bonded in support 100.

Support 100 is conductive material, and preferable alloy material plays on the one hand frame supports and does in order to fixing whole module, on the other hand for marker pulse signal.Support 100 has a through hole 110, and this through hole 110 is for accommodating dielectric cover plate 200.In certain embodiments, dielectric cover plate 200 is provided with ground loop with the surrounding that support 100 through hole 110 inwalls contact.

Sensing chip 300 is gathered fingerprint and is generated simulating signal by finger presses dielectric cover plate 200, it is multichannel high-efficient sensing chip 300, comprise induction part 310 and radially extend in these induction part 310 edges and the connecting portion 320 that forms, induction part 310 has sensing circuit and connects dielectric cover plate 200, and connecting portion 320 is electrically connected base plate.Sensing circuit is for perception user fingerprints and convert fingerprint signal to simulating signal; it can be encapsulated in single in-line packages (SiP), or single chips, can add components and parts below; can fill colloid protection, or directly underfill fills protection.Sensing circuit can be packaged in epoxy resin or other elastomeric material is interior (or alternatively; be packaged in pottery or transparent high dielectric constant material); then remove colloid or the overcover of induction region; completely out exposed; or just expose reluctantly top and form an Exposed die encapsulation; make sensor chip can use less vertical space, and obtain Reasonable Protection, while avoiding assembling, be damaged by collision.Sensing circuit presents capacitor type connection mode, with the ridge of user's finger print and another utmost point of paddy formation electric capacity, the epidermis characteristic of user's finger has permanent dielectric coefficient, in the time that body fluid changes or changes finger, can cause the capacitance difference of reading, thereby reach the object of distinguishing different fingers or fingerprint.

Thereby control chip receives and Analog signals identification fingerprint, on it, integrated control circuit, is electrically connected with base plate.Simulating signal is changed into digital signal by control circuit, generates fingerprint image, and then realize fingerprint recognition by corresponding algorithm.

Sensing circuit and control circuit can be by plastic packaging in overall package, and sensing chip 300 is pasted in top, and control chip 700 or flash chip are pasted in below, if space allows even can paste more peripheral cell.Overall package is carried out circuit connection by base plate, and base plate can be substrate 410 or flexible PCB 420.If substrate 410, need to consider separately to add other conducting parts such as flexible PCB 420(or wire) connect to be electrically connected with external circuit, and the quantity of stitch (pin) and position are by limited; If 420 of flexible PCBs directly connect, do not need to add again other flexible PCB 420, but need possess COF/COB process capability.

In the present embodiment, dielectric cover plate 200 is placed in the through hole 110 of support 100, its front touches and presses for staff, the adhesive film 800(that the back side forms by non-conductive glued membrane or liquid non-conductive adhesive is as Figure 4-Figure 6) be closely connected with the induction part 310 of sensing chip 300, the thickness of this adhesive film 800 is preferably less than 50um, so that guarantee not can undue weakening signal, affect the sensitivity that instruction is read.Sensing chip 300 is positioned at substrate 410 fronts, and its connecting portion 320 is electrically connected with substrate 410 by bonding wire 500, stable in order to ensure bonding wire 500, avoids the line that collapses, and does the filling of underfill bottom and solidifies, to guarantee Stability Analysis of Structures after having welded.The corresponding bonding wire of support 100 500 positions are provided with a breach 120, to form the clearance position of bonding wire 500; In certain embodiments, the corresponding bonding wire of support 100 500 positions also can arrange groove and hold bonding wire 500.Control chip is positioned at substrate 410 back sides, and is electrically connected with substrate 410 by bonding wire 500; In certain embodiments, control chip and sensing chip 300 are set up in parallel in substrate 410 fronts, and bonding wire 500 positions of the corresponding control chip 700 of support 100 arrange groove or breach 120.Can also integrated filter circuit on substrate 410 etc. peripheral circuit, be connected on substrate 410 outward extending flexible PCB 420 and can also connect the peripheral circuits such as DC-DC booster circuit, flexible PCB 420 is electrically connected the motherboard of terminal device.

Further, control circuit is electrically connected with support 100, guarantees basic pulse signal or the pulse signal that adds high pressure can be stablized and passes out to support 100 through hole 110 edges; In the recessed through hole 110 that is placed in support 100 of dielectric cover plate 200, be that the surface of dielectric cover plate 200 is lower than support 100 through hole 110 tops (greatly between 0.1~0.25mm), thereby guide and guarantee that user's finger can touch support 100 through hole 110 edges in the time pressing dielectric cover plate 200, to form pulse circuit, the pulse signal of conduction support 100 through hole 110 edge-emission, makes sensing chip 300 can read electric field change numerical value.As preferably, in the present embodiment, base plate is provided with at least one conducting terminal 411(as metal terminal) so that base plate keeps at least one contact point and is electrically connected with support 100, then make control circuit pass through conducting terminal 411 and be electrically connected with support 100.Thereby without through hole 110 inwalls at support 100, electrode is additionally set, has saved raw material and assembly cost.

Further; fingerprint identification device also comprises a bottom 600; this bottom 600 on the one hand fixing flexible PCB 420 of drawing from substrate 410 is guaranteed stable connection; make on the other hand substrate 410, sensing chip 300 and control chip between bottom 600 and dielectric cover plate 200, protect them to avoid colliding impaired.In certain embodiments; need to physical button (as " Home " key) be set in fingerprint identification device bottom; because physical button signal also needs to walk the port of control circuit; such as same flexible PCB 420 is drawn out to the main circuit of terminal device together; now bottom 600 just can be kept apart fingerprint recognition system and physical button, protection inner structure.

In certain embodiments, base plate is flexible PCB 420, and these flexible PCB 420 parts are positioned at fingerprint identification device inside, and another part stretches out.Sensing chip 300 is all electrically connected with this flexible PCB 420 with control circuit, and it is inner or outside that control circuit can be positioned at fingerprint identification device, also can be hung on outward on the motherboard of terminal device.

Fingerprint identification device of the present utility model, can combine with control knob or on-off element, also can be arranged on the screen master control panel below of terminal device, may approach the master control borad position of physics Home key or virtual Home key in smart mobile phone.In certain embodiments, can utilize the high rigidity of sapphire glass, the feature such as wear-resisting, directly the combination of formation control button or display element.Or be embedded in the housing of a cover glass system or fixed sturcture or device.In a word, can carry out some appropriate accommodation according to the condition of terminal device, so as can to facilitate, the sensitive fingerprint characteristic that identifies, as system password lock, prevent information leakage, protection privacy.

As shown in Fig. 3-Fig. 6, for fingerprint identification device second of the present utility model is to the 4th embodiment, their common feature is that its dielectric cover plate 200 comprises a boss 210, this boss 210 is connected with the induction part 310 of sensing chip 300 through support 100 through holes, thereby makes to form between boss 210 and support 100 space that holds bonding wire 500.Therefore without breach 120 being additionally set on support 100 or groove is avoided bonding wire 500, control chip 700 and sensing chip 300 all can be electrically connected on the same side of substrate 410, can make fingerprint identification device more frivolous.Meanwhile, control chip 700, sensing chip 300 and base plate (substrate 410 or flexible PCB 420) are placed in the accommodation space that dielectric cover plate 200, support 100 and bottom 600 form completely, can better be protected.

The second embodiment of fingerprint identification device as shown in Figure 4, described fingerprint identification device comprises the dielectric cover plate 200 with through hole, there is the support 100 of through hole, there is the sensing chip 300 of induction part 310 and connecting portion 320, be provided with the control chip 700 of control circuit, substrate 410 and bottom 600, in the recessed through hole that is placed in support 100 of dielectric cover plate 200, the boss 210 of dielectric cover plate 200 is closely connected with the induction part 310 of sensing chip 300 through through hole and by an adhesive film 800, the connecting portion 320 of sensing chip 300 is electrically connected with substrate 410 by bonding wire 500, control chip 700 is positioned at the same side of substrate 410 with sensing chip 300 and is electrically connected with substrate 410 by bonding wire 500, bottom 600 is connected in support 100 bottoms with protection sensing chip 300, control chip 700 and substrate 410, on substrate 410, connect a flexible PCB 420, this flexible PCB 420 stretches out through the motherboard of bottom 600 external devices.

The 3rd embodiment of fingerprint identification device as shown in Figure 5, the difference of itself and the second embodiment is, control chip 700 is electrically connected with substrate 410 by through-silicon via structure, thereby avoid bonding wire 500 draw and cause the problem of dielectric cover plate 200 flatnesses from control chip 700 top layers, can guarantee that the circuit on control chip 700 can link other places simultaneously.

The 4th embodiment of fingerprint identification device as shown in Figure 6, wherein substrate 410 is close to or connection bracket 100 bottoms, on substrate 410, have a perforation of passing for the boss 210 of dielectric cover plate 200, control chip 700 and sensing chip 300 are all electrically connected on substrate 410(or flexible PCB 420 by silicon through hole) back side.Thereby make fingerprint identification device more lightening.

Because through-silicon via structure can be avoided the Base top contact of bonding wire 500 from circuit board, therefore in the first embodiment, control chip 700 and sensing chip 300 also can be by through-silicon via structure and substrate 410(or flexible PCBs 420) be electrically connected, and without breach 120 or groove are set on support 100.

Accordingly, fingerprint identification device of the present utility model has following advantage:

(1) by radially extending and form a junction 320 in sensing chip 300 induction part 310 edges, make connecting portion 320 avoid dielectric cover plate 200.Thereby only need on support 100, process groove or breach 120, or a boss 210 is set on dielectric cover plate 200 and stepped, avoid bonding wire 500 positions; Or allow the connecting portion 320 of sensing chip 300 be electrically connected with base plate by through-silicon via structure.Finally avoid processing groove and avoid bonding wire 500 positions on sensing chip 300, therefore reduced difficulty of processing, reduced production cost.

(2) simultaneously, by the peripheral circuit such as control circuit and filtering circuit together with sensing chip 300 integration packaging in fingerprint identification device inside, simplify on the one hand circuit structure, reduce manufacturing cost, improved production yield (can reach more than 85%), module one-piece construction and composition number of devices are simplified, and assembling process does not have bottleneck, mounting equipment can based on or revise original equipment realize, packaging technology does not have specific (special) requirements; Improve on the other hand the stability of circuit, signal intensity and induction sensitivity are promoted, can holding signal consistance and accurately algorithm understand and feedback procedure, make inner sensing circuit and control circuit energy stabilized communication also can within the shortest time, read and feed back finger print information.

(3) control circuit is electrically connected with support 100, in the recessed through hole that is placed in support 100 of dielectric cover plate 200, just can touch support 100 through hole edges and form pulse circuit while making user press dielectric cover plate 200.Thereby without the through-hole wall at support 100, electrode is additionally set, has further saved raw material and assembly cost.

The utility model proposes a kind of mobile terminal simultaneously, this mobile terminal comprises motherboard and fingerprint identification device, described fingerprint identification device comprises dielectric cover plate, there is the support of a through hole, sensing chip, control circuit and base plate, described dielectric cover plate is placed in described through hole and is connected with described sensing chip, described sensing chip is used for gathering fingerprint and generates simulating signal, described control circuit is processed described simulating signal and is identified fingerprint, described sensing chip comprises induction part and radially extends in this induction part edge and the connecting portion that forms, described induction part connects described dielectric cover plate, described connecting portion is electrically connected described base plate, described base plate is electrically connected described motherboard.Fingerprint identification device described in the present embodiment is the related fingerprint identification device of above-described embodiment in the utility model, does not repeat them here.

Mobile terminal of the present utility model, has adopted above-mentioned fingerprint identification device, by radially extending and form a junction in sensing chip induction part edge, makes connecting portion avoid dielectric cover plate.Thereby only need on support, process groove or breach, or a boss is set on dielectric cover plate and stepped, avoid position of bonding wire; Or allow the connecting portion of sensing chip be electrically connected with base plate by through-silicon via structure.Finally avoid processing groove and avoid position of bonding wire on sensing chip, therefore reduced difficulty of processing, reduced production cost.

Meanwhile, the peripheral circuit such as control circuit and filtering circuit integration packaging together with sensing chip, in fingerprint identification device inside, is simplified to circuit structure on the one hand, reduced production cost; The stability that has improved on the other hand circuit, has promoted product quality.

In addition, control circuit is electrically connected with support, in the recessed through hole that is placed in support of dielectric cover plate, just can touch rack ventilating hole edge and form pulse circuit while making user press dielectric cover plate.Thereby without the through-hole wall at support, electrode is additionally set, has further saved raw material and assembly cost.

Should be understood that; these are only preferred embodiment of the present utility model; can not therefore limit the scope of the claims of the present utility model; every equivalent structure or conversion of equivalent flow process that utilizes the utility model instructions and accompanying drawing content to do; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present utility model.

Claims (10)

1. a fingerprint identification device, comprise dielectric cover plate, there is support, sensing chip, control circuit and the base plate of a through hole, described dielectric cover plate is placed in described through hole and is connected with described sensing chip, described sensing chip is used for gathering finger print information and generates simulating signal, described control circuit is for the treatment of described simulating signal and identify fingerprint, it is characterized in that: described sensing chip comprises induction part and radially extends in this induction part edge and the connecting portion that forms, described induction part connects described dielectric cover plate, and described connecting portion is electrically connected described base plate.
2. fingerprint identification device according to claim 1, is characterized in that: described connecting portion is electrically connected with described base plate by bonding wire or through-silicon via structure.
3. fingerprint identification device according to claim 1, is characterized in that: described connecting portion is electrically connected with described base plate by bonding wire, and the corresponding described position of bonding wire of described support place is provided with groove or breach.
4. fingerprint identification device according to claim 1, it is characterized in that: described connecting portion is electrically connected with described base plate by bonding wire, described dielectric cover plate comprises a boss being connected with described induction part through described through hole, forms a space that holds described bonding wire between described boss and described support.
5. according to the fingerprint identification device described in claim 1-4 any one, it is characterized in that: described base plate is flexible PCB or substrate.
6. according to the fingerprint identification device described in claim 1-4 any one, it is characterized in that: described base plate is substrate, described control circuit is located at a control chip, this control chip is electrically connected described substrate, and described substrate is electrically connected a flexible PCB and is electrically connected with external circuit by this flexible PCB.
7. fingerprint identification device according to claim 6, is characterized in that: described fingerprint identification device also comprises a bottom, and described substrate, sensing chip and control chip are between described bottom and dielectric cover plate.
8. according to the fingerprint identification device described in claim 1-4 any one, it is characterized in that: described dielectric cover plate is recessed to be placed in described through hole, and described control circuit is electrically connected with described support.
9. fingerprint identification device according to claim 8, it is characterized in that: described control circuit is electrically connected with described base plate, described base plate is provided with the conducting terminal that at least one and described support is electrically connected, and described control circuit is electrically connected with described support by described conducting terminal.
10. a mobile terminal, is characterized in that: comprise the fingerprint identification device as described in claim 1-9 any one.
CN201320827531.9U 2013-12-13 2013-12-13 Fingerprint identification device and mobile terminal CN203630794U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320827531.9U CN203630794U (en) 2013-12-13 2013-12-13 Fingerprint identification device and mobile terminal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320827531.9U CN203630794U (en) 2013-12-13 2013-12-13 Fingerprint identification device and mobile terminal

Publications (1)

Publication Number Publication Date
CN203630794U true CN203630794U (en) 2014-06-04

Family

ID=50817251

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201320827531.9U CN203630794U (en) 2013-12-13 2013-12-13 Fingerprint identification device and mobile terminal

Country Status (1)

Country Link
CN (1) CN203630794U (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103699881A (en) * 2013-12-13 2014-04-02 深圳市汇顶科技股份有限公司 Fingerprint identification device and mobile terminal
CN104267858A (en) * 2014-06-20 2015-01-07 敦泰科技有限公司 Sensing chip, manufacturing method thereof, and electronic device with sensing chip
WO2015113396A1 (en) * 2014-01-28 2015-08-06 深圳市汇顶科技股份有限公司 Fingerprint identification device and mobile terminal having same
CN105260707A (en) * 2015-09-17 2016-01-20 南昌欧菲生物识别技术有限公司 Fingerprint sensor module and electronic device
CN105426873A (en) * 2015-12-17 2016-03-23 昆山嘉华电子有限公司 Fingerprint recognition device and terminal with fingerprint recognition device
CN105488474A (en) * 2015-11-30 2016-04-13 信利光电股份有限公司 Fingerprint detection module, manufacturing method thereof and electronic device
WO2016180053A1 (en) * 2015-05-08 2016-11-17 苏州迈瑞微电子有限公司 Fingerprint identification module
CN107040621A (en) * 2014-06-16 2017-08-11 深圳市汇顶科技股份有限公司 A kind of mobile terminal

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103699881A (en) * 2013-12-13 2014-04-02 深圳市汇顶科技股份有限公司 Fingerprint identification device and mobile terminal
WO2015085786A1 (en) * 2013-12-13 2015-06-18 深圳市汇顶科技股份有限公司 Fingerprint recognition device and mobile terminal
WO2015113396A1 (en) * 2014-01-28 2015-08-06 深圳市汇顶科技股份有限公司 Fingerprint identification device and mobile terminal having same
US9971923B2 (en) 2014-01-28 2018-05-15 Shenzhen GOODIX Technology Co., Ltd. Fingerprint identification device and mobile terminal having same
CN107040621A (en) * 2014-06-16 2017-08-11 深圳市汇顶科技股份有限公司 A kind of mobile terminal
CN104267858A (en) * 2014-06-20 2015-01-07 敦泰科技有限公司 Sensing chip, manufacturing method thereof, and electronic device with sensing chip
CN104267858B (en) * 2014-06-20 2017-07-14 敦泰电子有限公司 Sensor chip and its manufacture method, and configure the electronic installation of the sensor chip
WO2016180053A1 (en) * 2015-05-08 2016-11-17 苏州迈瑞微电子有限公司 Fingerprint identification module
CN105260707A (en) * 2015-09-17 2016-01-20 南昌欧菲生物识别技术有限公司 Fingerprint sensor module and electronic device
CN105488474A (en) * 2015-11-30 2016-04-13 信利光电股份有限公司 Fingerprint detection module, manufacturing method thereof and electronic device
CN105426873A (en) * 2015-12-17 2016-03-23 昆山嘉华电子有限公司 Fingerprint recognition device and terminal with fingerprint recognition device
CN105426873B (en) * 2015-12-17 2019-03-19 昆山嘉华电子有限公司 A kind of fingerprint identification device and the terminal with the fingerprint identification device

Similar Documents

Publication Publication Date Title
KR101798800B1 (en) Biometric sensor stack structure
CN208044621U (en) Electronic equipment covers the one-piece type fingerprint sensor module component of window
CN206489573U (en) A kind of mobile terminal and the device with touch function
US10565425B2 (en) Under-screen biometric identification apparatus, biometric identification component and terminal device
JP5963951B2 (en) Fingerprint sensor package and manufacturing method thereof
CN203102316U (en) Biological sensor module, component and electronic device using same
US9971923B2 (en) Fingerprint identification device and mobile terminal having same
TWI578239B (en) Fingerprint sensor and button combinations and methods of making same
US20150296622A1 (en) Flexible Printed Circuit With Semiconductor Strain Gauge
TWI442325B (en) Semiconductor memory device and manufacturing method thereof
US8837754B2 (en) Microelectromechanical transducer and corresponding assembly process
US10102409B2 (en) Personal mobile terminal device with fingerprint identification function
EP2755401B1 (en) Semiconductor device and microphone
CN102707851B (en) The manufacture method of input media and input media
US9743564B2 (en) Electromagnetic shielding structures
TWI639814B (en) Optical module, method of manufacturing the same and electronic device
CN103886299B (en) A kind of encapsulating structure of capacitive fingerprint sensing device
JP6219659B2 (en) Display device
CN104051366B (en) Fingerprint recognition chip-packaging structure and method for packing
US8803258B2 (en) Finger sensor including capacitive lens and associated methods
CN204178377U (en) Fingerprint identification device and terminal device
CN105940413B (en) Fingerprint identification device, its manufacturing method and electronic equipment
GB2502682A (en) Fingerprint sensor housing
US20110019370A1 (en) Flexible circuit module
CN104156714B (en) Fingerprint Identification sensor and electronic device

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
IW01 Full invalidation of patent right

Decision date of declaring invalidation: 20150630

Decision number of declaring invalidation: 26326

Granted publication date: 20140604