CN108764162A - A kind of fingerprint module - Google Patents
A kind of fingerprint module Download PDFInfo
- Publication number
- CN108764162A CN108764162A CN201810540931.9A CN201810540931A CN108764162A CN 108764162 A CN108764162 A CN 108764162A CN 201810540931 A CN201810540931 A CN 201810540931A CN 108764162 A CN108764162 A CN 108764162A
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- CN
- China
- Prior art keywords
- cover board
- ink layer
- conductive ink
- circuit board
- fingerprint
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
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- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Image Input (AREA)
Abstract
The invention discloses a kind of fingerprint modules, including cover board, fingerprint sensing module and substrate, wherein, fingerprint sensing module includes fingerprint recognition chip and circuit board, and the fingerprint recognition chip is electrically connected between the cover board and the circuit board and with the circuit board；Cover board includes cover board body, the non-conductive ink layer for being arranged on the cover board body medial surface and capable of covering the fingerprint recognition chip and the conductive ink layer for being located on the non-conductive ink layer lower edge and being electrically connected with the circuit board；Substrate supports the circuit board.The fingerprint film group of the present invention is by setting cover board to stepped construction, i.e., upper layer is cover board body, centre is non-conductive ink layer, bottom margin is conductive ink layer, to form the cover board of a capacitance structure, alternative becket is realized Trigger Function or release electrostatic, is not limited by metal in the material selection of ring.
Description
Technical field
The present invention relates to technical field of semiconductor encapsulation more particularly to a kind of fingerprint modules.
Background technology
Fingerprint identification technology has become the standard configuration of mainstream mobile terminal manufacturer flagship type, and fingerprint recognition not only can be with
The functions such as unlock and wake-up for mobile terminal, while the barrier of data information in protection terminal device is can also be used as, together
When, with the development of terminal technology, realize that it is more and more extensive that mobile security payment is also applied using fingerprint identification technology.
Existing fingerprint module includes cover board, fingerprint recognition chip, circuit board, substrate and quoit, quoit bottom brush
Elargol is connected with circuit board, that is, existing fingerprint module passes through quoit connectivity capabilities or release electrostatic.When fingerprint module is band
When function scheme, human body and circuit board are connected to by quoit, realize triggering arousal function, and under the program, quoit must be
Stainless steel, appearance processing are conductive target；When fingerprint module be ground connection release electrostatic scheme when, by quoit be connected to human body and
Circuit board realizes that Electro-static Driven Comb, quoit are stainless steel or aluminium alloy.As it can be seen that existing fingerprint film group can directly connect with human body
Tactile only becket, cover board, chip (faces coating), and limited in becket type selecting.
In view of the above shortcomings, the designer, is actively subject to research and innovation, it is a kind of on the cover board plus conductive to found
Ink alternative metals ring realizes the fingerprint film group of Trigger Function or release electrostatic, makes it with more the utility value in industry.
Invention content
It is an object of the invention to propose a kind of fingerprint module, by adding electrically conductive ink alternative metals ring to realize on the cover board
Trigger Function or release electrostatic reduce fingerprint module to the limitation in material selection.
For this purpose, the present invention uses following technical scheme：
A kind of fingerprint module, including cover board, fingerprint sensing module and substrate, wherein
The fingerprint sensing module includes fingerprint recognition chip and circuit board, and the fingerprint recognition chip is located at the cover board
It is electrically connected between the circuit board and with the circuit board；
The cover board includes cover board body, is arranged on the cover board body medial surface and can cover the fingerprint recognition core
The non-conductive ink layer of piece and the conductive oil for being located on the non-conductive ink layer lower edge and being electrically connected with the circuit board
Layer of ink；
The substrate supports the circuit board.
Further, non-on the conductive ink layer lower edge to be electrically connected with a ring circle.
Further, the ring is equipped with the groove passed through for the circuit board.
Further, the material of the ring is one kind in plastic cement, stainless steel, aluminium alloy.
Further, the circuit board is connect by conducting foam with the conductive ink layer.
Further, the material of the cover board body is one kind in glass, sapphire, ceramics.
Further, the non-conductive ink layer is printed on the cover board body medial surface.
Further, the conductive ink layer is printed on the non-conductive ink layer lower edge.
Further, the substrate is steel disc.
Further, the circuit board is flexible PCB.
Beneficial effects of the present invention are：By setting cover board to stepped construction, that is, upper layer is cover board body, and centre is
Non-conductive ink layer, bottom margin are conductive ink layer, and to form the cover board of a capacitance structure, cover board upper surface is connected to people
Body, conductive ink layer are connected to FPC (flexible PCB) by conducting foam, and when fingerprint module is band function scheme, finger touches
It touches cover board and triggering arousal function can be thus achieved, when fingerprint module is ground connection release electrostatic scheme, energization can be thus achieved quiet
Electricity release, the material of ring select not limited by metal.
Description of the drawings
Fig. 1 is the structural schematic diagram for the fingerprint module that the specific embodiment of the invention provides；
Fig. 2 is the structural schematic diagram of another angle of fingerprint module；
Fig. 3 is the vertical view of fingerprint module；
Fig. 4 is the sectional view along line A-A of Fig. 3；
Fig. 5 is the sectional view of fingerprint module cover plate.
In figure：10- cover boards, 11- cover board bodies, 12- non-conductive ink layers, 13- conductive ink layers, 21- fingerprint recognition cores
Piece, 22- circuit boards, 30- substrates, 40- rings, 41- grooves, 50- conducting foams.
Specific implementation mode
Technical solution to further illustrate the present invention below with reference to the accompanying drawings and specific embodiments.
As shown in Fig. 1 to 5, fingerprint module of the invention includes cover board 10, fingerprint sensing module and substrate 30, wherein is referred to
Line sensing module includes fingerprint recognition chip 21 and circuit board 22, and fingerprint recognition chip 21 is between cover board 10 and circuit board 22
And it is electrically connected with circuit board 22；Cover board 10 includes cover board body 11, is arranged on 11 medial surface of cover board body and can cover and refer to
The non-conductive ink layer 12 of line identification chip 21 and be located on 12 lower edge of non-conductive ink layer and with circuit board 22 be electrically connected
Conductive ink layer 13；Substrate 30 supports circuit board 22.
In order to keep the fingerprint module more firm, the present invention is non-on 13 lower edge of conductive ink layer to be electrically connected with a ring
Circle 40, and ring 40 is equipped with the groove 41 that power circuit board 22 passes through.
The present invention is by setting cover board 10 to stepped construction, that is, upper layer is cover board body 11, and centre is non-conductive ink
Layer 12, bottom margin are conductive ink layer 13, and to form the cover board 10 of a capacitance structure, 10 upper surface of cover board is connected to human body,
Conductive ink layer 13 is by being electrically connected circuit board 22, and when the fingerprint module is band function scheme, finger touches cover board 10 and is
Triggering arousal function may be implemented；When the fingerprint module is ground connection release electrostatic scheme, Electro-static Driven Comb can be thus achieved in energization,
So that not limited by metal in the material selection of ring 40, therefore, the material of ring 40 can be plastic cement, stainless steel, aluminium alloy
Deng.
Specifically, the circuit board 22 that the present invention uses can pass through conducting foam 50 and conductive oil for flexible PCB (FPC)
Layer of ink 13 connects.
The present invention can be used glass, sapphire, ceramics etc. and be used as cover board body 11, and non-conductive ink layer 12 is printed on lid
On 11 medial surface of plate ontology, conductive ink layer 13 is printed on 12 lower edge of non-conductive ink layer, you can capacitance structure is made
Cover board 10.
Substrate 30 in the present invention is steel disc, plays strengthening action.
To sum up, fingerprint module of the invention by cover board 10 plus electrically conductive ink alternative metals ring realize Trigger Function and
Release electrostatic reduces fingerprint module to the limitation in material selection.
The technical principle of the present invention is described above in association with specific embodiment.These descriptions are intended merely to explain the present invention's
Principle, and it cannot be construed to limiting the scope of the invention in any way.Based on the explanation herein, the technology of this field
Personnel would not require any inventive effort the other specific implementation modes that can associate the present invention, these modes are fallen within
Within protection scope of the present invention.
Claims (10)
1. a kind of fingerprint module, which is characterized in that including cover board (10), fingerprint sensing module and substrate (30), wherein
The fingerprint sensing module includes fingerprint recognition chip (21) and circuit board (22), and the fingerprint recognition chip (21) is located at
It is electrically connected between the cover board (10) and the circuit board (22) and with the circuit board (22)；
The cover board (10) includes cover board body (11), is arranged on the cover board body (11) medial surface and can cover the finger
The non-conductive ink layer (12) of line identification chip (21) and be located on non-conductive ink layer (12) lower edge and with the electricity
The conductive ink layer (13) that road plate (22) is electrically connected；
The substrate (30) supports the circuit board (22).
2. fingerprint module according to claim 1, which is characterized in that non-electrical on conductive ink layer (13) lower edge
It is connected with a ring circle (40).
3. fingerprint module according to claim 2, which is characterized in that the ring (40), which is equipped with, supplies the circuit board
(22) groove (41) passed through.
4. fingerprint module according to claim 2, which is characterized in that the material of the ring (40) be plastic cement, stainless steel,
One kind in aluminium alloy.
5. fingerprint module according to claim 1, which is characterized in that the circuit board (22) by conducting foam (50) with
Conductive ink layer (13) connection.
6. fingerprint module according to claim 1, which is characterized in that the material of the cover board body (11) is glass, indigo plant
One kind in jewel, ceramics.
7. fingerprint module according to claim 1, which is characterized in that the non-conductive ink layer (12) is printed on the lid
On plate ontology (11) medial surface.
8. fingerprint module according to claim 1, which is characterized in that the conductive ink layer (13) is printed on described non-lead
On electric ink layer (12) lower edge.
9. fingerprint module according to claim 1, which is characterized in that the substrate (30) is steel disc.
10. fingerprint module according to claim 1, which is characterized in that the circuit board (22) is flexible PCB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810540931.9A CN108764162A (en) | 2018-05-30 | 2018-05-30 | A kind of fingerprint module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810540931.9A CN108764162A (en) | 2018-05-30 | 2018-05-30 | A kind of fingerprint module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108764162A true CN108764162A (en) | 2018-11-06 |
Family
ID=64004504
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810540931.9A Pending CN108764162A (en) | 2018-05-30 | 2018-05-30 | A kind of fingerprint module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108764162A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111554583A (en) * | 2020-04-28 | 2020-08-18 | 深圳芯邦科技股份有限公司 | Fingerprint chip module preparation method, fingerprint chip module and electronic equipment |
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| CN205581893U (en) * | 2016-02-24 | 2016-09-14 | 深圳信炜科技有限公司 | Electronic equipment with fingerprint sensing function |
| CN106156719A (en) * | 2016-02-24 | 2016-11-23 | 深圳信炜科技有限公司 | There is the electronic equipment of fingerprint sensing function |
| CN106156721A (en) * | 2016-02-24 | 2016-11-23 | 深圳信炜科技有限公司 | There is the electronic equipment of fingerprint sensing function |
| CN205863158U (en) * | 2016-05-05 | 2017-01-04 | 深圳信炜科技有限公司 | Bio-identification module, bio-identification module, electronic equipment |
| CN106557741A (en) * | 2016-10-20 | 2017-04-05 | 麦克思商务咨询(深圳)有限公司 | Fingerprint identification device, its manufacture method, display device |
| CN106934367A (en) * | 2017-03-13 | 2017-07-07 | 信利光电股份有限公司 | A kind of fingerprint identification device cover sheet and preparation method thereof and a kind of mobile terminal |
| CN206601718U (en) * | 2017-01-22 | 2017-10-31 | 深圳市汇顶科技股份有限公司 | A kind of fingerprint module and touch control terminal |
| CN206975665U (en) * | 2017-07-25 | 2018-02-06 | 南昌欧菲生物识别技术有限公司 | Fingerprint module and the fingerprint recognition panel provided with the fingerprint module |
| CN108052228A (en) * | 2017-12-22 | 2018-05-18 | 维沃移动通信有限公司 | A kind of display module, the production method of display module and mobile terminal |
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2018
- 2018-05-30 CN CN201810540931.9A patent/CN108764162A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205581893U (en) * | 2016-02-24 | 2016-09-14 | 深圳信炜科技有限公司 | Electronic equipment with fingerprint sensing function |
| CN106156719A (en) * | 2016-02-24 | 2016-11-23 | 深圳信炜科技有限公司 | There is the electronic equipment of fingerprint sensing function |
| CN106156721A (en) * | 2016-02-24 | 2016-11-23 | 深圳信炜科技有限公司 | There is the electronic equipment of fingerprint sensing function |
| CN205863158U (en) * | 2016-05-05 | 2017-01-04 | 深圳信炜科技有限公司 | Bio-identification module, bio-identification module, electronic equipment |
| CN106557741A (en) * | 2016-10-20 | 2017-04-05 | 麦克思商务咨询(深圳)有限公司 | Fingerprint identification device, its manufacture method, display device |
| CN206601718U (en) * | 2017-01-22 | 2017-10-31 | 深圳市汇顶科技股份有限公司 | A kind of fingerprint module and touch control terminal |
| CN106934367A (en) * | 2017-03-13 | 2017-07-07 | 信利光电股份有限公司 | A kind of fingerprint identification device cover sheet and preparation method thereof and a kind of mobile terminal |
| CN206975665U (en) * | 2017-07-25 | 2018-02-06 | 南昌欧菲生物识别技术有限公司 | Fingerprint module and the fingerprint recognition panel provided with the fingerprint module |
| CN108052228A (en) * | 2017-12-22 | 2018-05-18 | 维沃移动通信有限公司 | A kind of display module, the production method of display module and mobile terminal |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111554583A (en) * | 2020-04-28 | 2020-08-18 | 深圳芯邦科技股份有限公司 | Fingerprint chip module preparation method, fingerprint chip module and electronic equipment |
| CN111554583B (en) * | 2020-04-28 | 2022-05-31 | 深圳芯邦科技股份有限公司 | Fingerprint chip module preparation method, fingerprint chip module and electronic equipment |
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| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181106 |