CN106156719A - There is the electronic equipment of fingerprint sensing function - Google Patents
There is the electronic equipment of fingerprint sensing function Download PDFInfo
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- CN106156719A CN106156719A CN201610102270.2A CN201610102270A CN106156719A CN 106156719 A CN106156719 A CN 106156719A CN 201610102270 A CN201610102270 A CN 201610102270A CN 106156719 A CN106156719 A CN 106156719A
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- capacitance type
- electronic equipment
- sensor chip
- fingerprint sensor
- conductive layer
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
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- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Image Input (AREA)
Abstract
The invention discloses a kind of electronic equipment with fingerprint sensing function.Described electronic equipment includes cover sheet, and including Part I and Part II, the thickness of described Part II is less than the thickness of Part I；Capacitance type fingerprint sensor chip, for sensing the finger print information of user；With conductive layer, and the homonymy that described capacitance type fingerprint sensor chip is respectively positioned on described cover sheet, and described conductive layer are positioned at around described capacitance type fingerprint sensor chip, described conductive layer is used for loading ground signalling；Described Part II completely or partially covers described conductive layer.The fingerprint sensing sensitivity of the described electronic equipment with fingerprint sensing function is higher.
Description
Technical field
The present invention relates to fingerprint sensing technical field, particularly relate to a kind of there is fingerprint sensing function
Electronic equipment.
Background technology
At present, it is positioned over the fingerprint sensing devices in electronic equipment front, is typically employed in electronic equipment
Cover sheet on carry out perforate, by fingerprint sensing devices with control button (Home key) be combined in one
Rise, be placed in described perforate, so, be so designed that for those are not opened at cover sheet on the market
Hole but use virtual controlling button electronic equipment from the point of view of and inapplicable.
Correspondingly, on the cover sheet of electronic equipment not perforate and dispose fingerprint sensing devices in guarantor
Below protecting cover plate, the market demand of (that is, the inside of electronic equipment) is strong.So, below cover sheet
The scheme disposing fingerprint sensing devices makes the sensing signal of fingerprint sensing devices become more weak, causes
Fingerprint sensing is the sensitiveest.
Summary of the invention
In order to solve above-mentioned technical problem, the present invention provides a kind of fingerprint that arranges under cover sheet to pass
Inductor component and the higher electronic equipment of fingerprint sensing sensitivity.
For achieving the above object, the present invention provides following technical scheme:
A kind of electronic equipment, including:
Cover sheet, including Part I and Part II, the thickness of described Part II is less than the
The thickness of a part；
Capacitance type fingerprint sensor chip, for sensing the finger print information of user；With
Conductive layer, and the homonymy that described capacitance type fingerprint sensor chip is respectively positioned on described cover sheet,
And described conductive layer is positioned at around described capacitance type fingerprint sensor chip；
Described Part II completely or partially covers described conductive layer.
Alternatively, described conductive layer is closed or non-enclosed ring-shaped conductive layer.
Alternatively, described capacitance type fingerprint sensor chip is positioned at described conductive layer area encompassed.
Alternatively, described conductive layer is used for loading ground signalling.
Alternatively, described conductive layer is for holding when capacitance type fingerprint sensor chip performs fingerprint sensing
Continuous loading ground signalling.
Alternatively, described conductive layer for capacitance type fingerprint sensor chip perform fingerprint sensing time only
Load ground signalling.
Alternatively, described electronic equipment includes that equipment ground, described equipment ground load ground signalling, institute
Electrically connect with stating conductive layer and described equipment.
Alternatively, described conductive layer is for performing fingerprint sensing at described capacitance type fingerprint sensor chip
Time load ground signalling, with described capacitance type fingerprint sensor chip, constitute a closing of circuit equipment
Loop.
Alternatively, described electronic equipment farther includes touch sensing layer；Described cover sheet includes
First surface and the second surface relative with first surface；Described touch sensing layer, described conductive layer,
With the second surface side that described capacitance type fingerprint sensor chip is arranged at cover sheet.
Alternatively, described Part II is to be formed to second surface depression by first surface, or/and,
Described Part II is to be formed to first surface depression by second surface.
Alternatively, described Part II completely or partially covers described capacitance type fingerprint sensor chip.
Alternatively, the Part II covering described conductive layer senses core with covering described capacitance type fingerprint
The Part II of sheet is with a part of or different parts.
Alternatively, described Part I is just arranged by described capacitance type fingerprint sensor chip, with second
Part is not overlapping.
Alternatively, described conductive layer adheres on a second surface.
Alternatively, described electronic equipment farther includes substrate, and described touch sensing layer is arranged on institute
Stating on substrate, described substrate arranges through hole, described conductive layer senses core with described capacitance type fingerprint
Sheet is positioned in described through hole.
Alternatively, described electronic equipment farther includes substrate, and described substrate refers to described condenser type
Stricture of vagina sensor chip, conductive layer are respectively positioned on the homonymy of described cover sheet, and described substrate arranges through hole,
Described conductive layer and described capacitance type fingerprint sensor chip are positioned in described through hole.
Alternatively, described capacitance type fingerprint sensor chip includes induction electrode array and and induction electrode
The testing circuit that array is connected, described testing circuit is used for providing pumping signal to induction electrode battle array
Row, drive described induction electrode array to perform fingerprint sensing.
Alternatively, described testing circuit includes signal transmission ends and the first earth terminal, and described first connects
Ground end is for load-modulate signal, and described signal transmission ends is used for providing pumping signal to induction electrode
Array, described pumping signal raises, with described modulated signal with the rising of described modulated signal
Reduce and reduce.
Alternatively, described electronic equipment includes that fingerprint sensing module, described fingerprint sensing module include
Described capacitance type fingerprint sensor chip, the second earth terminal and modulation circuit；Described second earth terminal
For loading described ground signalling, described modulation circuit is connected to described second earth terminal and first and connects
Between ground end, drive signal to produce described modulated signal according to described ground signalling with one, and provide
Described modulated signal gives the first earth terminal.
Alternatively, described electronic equipment farther includes mainboard, and described fingerprint sensing module is further
Including flexible PCB, described flexible PCB is used for connecting described mainboard and described capacitance type fingerprint
Sensor chip, transmits signal between described mainboard and described capacitance type fingerprint sensor chip.
Alternatively, described capacitance type fingerprint sensor chip is self-capacitance fingerprint sensing chip.
Alternatively, described electronic equipment is portable electronic product or household formula electronic product.
Owing to described electronic equipment arranges conductive layer around capacitance type fingerprint sensor chip further,
Thus, the intensity of the fingerprint sensing signal of capacitance type fingerprint sensor chip can be improved, and then,
The fingerprint sensing sensitivity of electronic equipment is improved.Further, cover sheet conducts electricity in correspondence
The position of layer is thinning, can further improve the intensity of fingerprint sensing signal.
Although disclosing multiple embodiment, change including it, but by illustrate and describing this
The following detailed description of bright disclosed illustrative embodiment, other embodiments disclosed by the invention are by right
Those skilled in the art is apparent.Can be in various showing it will be recognized that the present invention is open
The aspect amendment being clear to, all modifications is all without departing from the spirit and scope of the present invention.Correspondingly,
Accompanying drawing and detailed description substantially should be considered illustrative and not restrictive.
Accompanying drawing explanation
Describe its example embodiment, inventive feature and advantage in detail by referring to accompanying drawing will become
Must become apparent from.
Fig. 1 is the decomposed structural representation of electronic equipment of the present invention.
Fig. 2 is the part assembling structure schematic diagram of electronic equipment shown in Fig. 1.
Fig. 3 is the fingerprint sensing circuit diagram omitting conductive layer.
Fig. 4 is the fingerprint sensing circuit diagram including loading the conductive layer of ground signalling.
Fig. 5 is the schematic diagram of the another embodiment of Fig. 2 conductive layer.
Fig. 6 is the electrical block diagram of electronic equipment shown in Fig. 2.
Fig. 7 is the partial sectional schematic view of electronic equipment shown in Fig. 1.
Fig. 8 is the partial sectional schematic view of a change embodiment of electronic equipment shown in Fig. 1.
Fig. 9 is the partial sectional schematic view of the another change embodiment of electronic equipment shown in Fig. 1.
Figure 10 is the partial sectional schematic view of the another change embodiment of electronic equipment shown in Fig. 1.
Figure 11 is the partial sectional schematic view of the another change embodiment of electronic equipment shown in Fig. 1.
Figure 12 is the partial sectional schematic view of the another change embodiment of electronic equipment shown in Fig. 1.
Figure 13 is the partial sectional schematic view of the another change embodiment of electronic equipment shown in Fig. 1.
Figure 14 is the partial sectional schematic view of the another change embodiment of electronic equipment shown in Fig. 1.
Detailed description of the invention
It is described more fully with example embodiment referring now to accompanying drawing.But, example embodiment
Can implement in a variety of forms, and be not understood as limited to embodiment set forth herein；On the contrary,
These embodiments are provided so that the present invention will fully and completely, and by the design of example embodiment
Convey to those skilled in the art all sidedly.For convenience or clear, may exaggerate, omit or
It is schematically illustrated in thickness and the size of every layer shown in accompanying drawing and schematically illustrates relevant unit
The quantity of part.It addition, the size of element not exclusively reflects actual size, and the number of related elements
Amount incomplete reaction actual quantity.
Additionally, described feature, structure can be combined in one or more in any suitable manner
In many embodiments.In the following description, it is provided that many details thus be given the present invention
The fully understanding of embodiment.But, one of ordinary skill in the art would recognize that there is no described spy
That determines in details is one or more, or uses other structure, constituent element etc., it is also possible to practice this
The technical scheme of invention.In other cases, it is not shown in detail or describes known features or operation
To avoid the fuzzy present invention.
Embodiments of the invention are described below in detail, and the example of described embodiment is shown in the drawings,
The most same or similar label represents same or similar element or has identical or class
Element like function.The embodiment described below with reference to accompanying drawing is exemplary, it is intended to user
Explain the present invention, and be not considered as limiting the invention.
In describing the invention, it is to be understood that term " thickness ", " on ", D score,
"front", "rear", "left", "right", " vertically ", " level ", " top ", " end ",
Orientation or the position relationship of the instruction such as " interior ", " outward " are based on orientation shown in the drawings or position
Relation, is for only for ease of the description present invention and simplifies description rather than instruction or imply indication
Position or element must have specific method, with specific azimuth configuration and operation, therefore can not
It is interpreted as limitation of the present invention.
In the present invention, unless otherwise clearly defined and limited, term " install ", " being connected ",
" connect ", the term such as " fixing " should be interpreted broadly, and connects, also for example, it may be fixing
Can be to removably connect, or integral；Can be to be mechanically connected, it is also possible to be electrical connection；Can
Being to be directly connected to, it is also possible to be to be indirectly connected with by intermediary, can be two element internals
Connection or the interaction relationship of two elements.For the ordinary skill in the art,
Above-mentioned term concrete meaning in the present invention can be understood as the case may be.
Further, in describing the invention, it is to be understood that: " multiple " include two
And two or more, unless the present invention separately has the most concrete restriction.It addition, each element title and
The word such as " first ", " second " occurred in signal name is not to limit element or signal goes out
Existing sequencing, but name for convenience of element, clearly distinguish each element so that describe simpler
Clean.
At present, the electronic equipment being provided with fingerprint sensing chip in front would generally configure one around referring to
The becket of stricture of vagina sensor chip, described becket for loading the pumping signal of change, with and fingerprint
Sensor electrode array in sensor chip forms mutual capacitance, thus performs fingerprint sensing.
Found by the lot of experiments of inventor, by equal to fingerprint sensing chip and becket dislocation
Below cover sheet if (electronic equipment internal), in view of thickness, the pumping signal of cover sheet exist
Decay and pumping signal in transmitting procedure are protected the factors such as the interference inside and outside cover plate,
It is strong that pumping signal on becket passes the signal coupleding on fingerprint sensing chip after cover sheet
Degree becomes more weak, therefore, uses the fingerprint sense of the electronic equipment of above-mentioned capacitance type fingerprint sensing mode
Survey sensitivity is relatively low.
For improving the strong of the fingerprint sensing signal that is arranged on fingerprint sensing chip below cover sheet
Degree, it is following that inventor tests proposition the application through a large amount of creative works and experimentation
Electronic equipment.
Before introducing the electronic equipment of the application, in addition it is also necessary to further illustrate mutual capacitance type fingerprint sense
Survey the basic functional principle of module and self-capacitance sensing module.
In fingerprint sensing module based on mutual capacitance type, fingerprint sensing module includes fingerprint sensing core
Sheet and becket, described fingerprint sensing chip include sensor electrode array and sensor electrode array and
The testing circuit that becket connects respectively.Formed between described becket and described sensor electrode array
Mutual capacitance.Described testing circuit provide change pumping signal to becket, described sensing electrode array
Row export corresponding fingerprint sensing signal to testing circuit.Described testing circuit is according to described sensing letter
Number obtain information in fingerprint.
Relatively, in fingerprint sensing module based on self-capacitance, fingerprint sensing module can be saved
The becket of the aforementioned pumping signal loading change.The testing circuit of self-capacitance fingerprint sensing chip
By data wire offer pumping signal to sensor electrode array, and by identical data wire from sensing
Electrod-array receives fingerprint sensing signal.Described sensor electrode array include multiple formation over the ground from
The sensing electrode of electric capacity.An object (e.g., finger) close to described sensing electrode time, another is the most electric
Appearance can be formed between this object and described sensing electrode.
See also the decomposed that Fig. 1 and Fig. 2, Fig. 1 are electronic equipment one embodiment of the present invention
Structural representation.Fig. 2 is the part assembling structure schematic diagram of electronic equipment shown in Fig. 1.Described electricity
Subset 100 is such as portable electronic product or household formula electronic product.Wherein, portable electronic
Product is as various mobile terminals, such as, and mobile phone, panel computer, notebook computer and wear
Wear each electronic product such as formula product；Household formula electronic product as intelligent door lock, TV, refrigerator,
Each electronic product such as desktop computer.It should be noted that electronic equipment 100 can increase further
Element not shown in diagram or some element shown in minimizing diagram, produce according to different electronics
Product can corresponding selection.Described electronic equipment 100 includes cover sheet 10, capacitance type fingerprint sense
Survey chip 12 and conductive layer 14.Described cover sheet 10 is arranged on the front side of electronic equipment 100,
Electronic equipment 100 is played the effect of protection, such as, prevents the materials such as grieshoch from entering electronic equipment 100
Internal etc..Described capacitance type fingerprint sensor chip 12 is for sensing the finger print information of target object.Institute
Stating the target object such as finger for user, so, described target object is not limited to finger, described mesh
Mark object can also be other suitable objects such as toe, below mainly illustrate as a example by finger.
Described conductive layer 14 is used for loading ground signalling, to improve the sense of capacitance type fingerprint sensor chip 12
Survey signal intensity.
Generally, electronic equipment 100 includes equipment ground.Described equipment ground is also known as systematically, for example,
The negative pole of the power supply of electronic equipment 100, power supply is such as battery, described power supply end
Such as the positive pole for battery.Being used for loading ground signalling, therefore, ground signalling is also known as equipment equipment
Earth signal or systematically signal.Described ground signalling is constant voltage signal, as electronic equipment 100
In the voltage reference of each circuit, described ground signalling for example, 0V (volt), 2V, (-1) V etc.
Voltage signal.Generally, the equipment ground of electronic equipment 100 or the most not earth ground or definitely
Greatly.So, when electronic equipment 100 is connected with earth ground by conductor, described equipment ground is also
It can be earth ground.
Described cover sheet 10 includes first surface 101 and second table relative with first surface 101
Face 103.Described first surface 101 is the outer surface of electronic equipment 100, described second surface 103
It is positioned at the inside of described electronic equipment 100.Glass that described cover sheet 10 is the most transparent or indigo plant
Gem cover plate, so, the material of described cover sheet 10 is alternatively other suitable material, does not limit
It is made as glass or sapphire cover plate, the most alternatively thin film cover plate.Further, described protection cap
Plate 10 is alternatively translucent or nontransparent cover plate, and the application is not limiting as cover sheet 10 and is
Bright cover plate.
Described capacitance type fingerprint sensor chip 12 is arranged on the second surface 103 1 of cover sheet 10
Side, for sensing the finger print information that user inputs from the first surface 101 of cover sheet 10.At this
In embodiment, described capacitance type fingerprint sensor chip 12 is self-capacitance fingerprint sensing chip.So,
It should be noted that described capacitance type fingerprint sensor chip 12 is alternatively the electricity certainly of other suitable type
The capacitance type fingerprint sensor chips such as appearance formula or mutual capacitance type, however it is not limited to herein described type from
Capacitance type fingerprint sensor chip.
Described conductive layer 14 is arranged on second surface 103 side of cover sheet 10, and is positioned at institute
State around capacitance type fingerprint sensor chip 12.Described conductive layer 14 is for sensing at capacitance type fingerprint
Chip 12 performs to load ground signalling during fingerprint sensing.Preferably, cover sheet is touched when finger
Time on 10 just to the region of capacitance type fingerprint sensor chip 12, can together touch cover sheet 10
On just region to conductive layer 14.
Seeing also Fig. 3 and Fig. 4, Fig. 3 is the fingerprint sensing circuit signal omitting conductive layer 14
Figure.Fig. 4 is the fingerprint sensing circuit diagram including loading the conductive layer 14 of ground signalling.By scheming
3 is visible, at finger F, capacitance type fingerprint sensor chip 12 and is systematically formed between GND
In circuit loop, formed between finger F, cover sheet 10 and capacitance type fingerprint sensor chip 12
There is an electric capacity Cf, finger F, cover sheet 10 and be systematically formed with electric capacity Cs between GND.
Relatively, in the diagram, the conductive layer of loading ground signalling is included due to electronic equipment 100
14, therefore, be equal to an electric capacity Ci the most in parallel at electric capacity Cs two ends, described electric capacity Ci by
Finger F, cover sheet 10, conductive layer 14 are constituted.According to circuit theory, finger F is to being
Impedance between system ground GND diminishes, correspondingly, and the fingerprint sense of capacitance type fingerprint sensor chip 12
The intensity surveying signal can be improved.
Owing to the electronic equipment 100 of the present invention enters one in second surface 103 side of cover sheet 10
Step arranges the conductive layer 14 loading ground signalling, thus, the fingerprint of capacitance type fingerprint sensor chip 12
The intensity of sensing signal is improved, and then, the fingerprint sensing sensitivity of electronic equipment 100 obtains
Improve.
Usually, described capacitance type fingerprint sensor chip 12 be shaped as elongated rectangular shape, it addition, be
Increasing the visual range of electronic equipment 100, in the present embodiment, described conductive layer 14 is one
Rectangular ring, closed around the setting of described capacitance type fingerprint sensor chip 12 region.So,
Changing ground, described conductive layer 14 is alternatively other shape, as circular, oval ring-type, it addition,
Described conductive layer 14 also can non-enclosed be arranged around described capacitance type fingerprint sensor chip 12, example
As it is shown in figure 5, as described in conductive layer 14 be divided into several sections.
Described conductive layer 14 is as used silver slurry, molybdenum lithium molybdenum, tin indium oxide, nanometer silver or Graphene
Make etc. suitable conductive material.Described conductive layer 14 closes for example with coating, spraying or impressing etc.
Suitable production method is formed on second surface 103.
Described capacitance type fingerprint sensor chip 12 is attached to second surface for example with the mode pasted
On 103.So, described capacitance type fingerprint sensor chip 12 is formed at second surface with conductive layer 14
Mode on 103 is not limited to the mode of aforementioned stickup, it is possible to use other suitable set-up mode,
Such as impressing etc..It addition, described capacitance type fingerprint sensor chip 12 also can directly and second surface 103
Press close to or fit, and and unrestricted employing third party's physical medium secure the two together.Enter one
Step ground, described conductive layer 14 is alternatively near the second table with described capacitance type fingerprint sensor chip 12
Face 103 is arranged, and non-limiting contacts with second surface 103.
Refer to the circuit structure of the embodiment that Fig. 6, Fig. 6 are electronic equipment 100 shown in Fig. 2
Schematic diagram.Described conductive layer 14 connects equipment ground GND.Described capacitance type fingerprint sensor chip 12
Including induction electrode array 121 and the testing circuit 123 that is connected with induction electrode array 121.Institute
State testing circuit 123 for providing pumping signal to induction electrode array 121, drive described faradism
Pole array 121 performs capacitance type fingerprint sensing.Described testing circuit 123 is further used for receiving sense
Answer the sensing signal (also referred to as " fingerprint sensing signal ") that electrod-array 121 exports, and according to sensing
Signal obtains information in fingerprint.In the present embodiment, described testing circuit 123 is used for driving
Innervation answers electrod-array 121 to perform self-capacitance fingerprint sensing.
Described induction electrode array 121 includes multiple induction electrode 122.The plurality of induction electrode
122 arrange in array, the shape for example, rectangle of each electrode 122, so, it is possible to each for other
Plant suitable shape.It addition, the size and shape of each electrode 122 is identical, so, it is possible to select not
With.The plurality of induction electrode 122 can be capacitively coupled to finger F (see Fig. 3 and Fig. 4).
Further, described testing circuit 123 includes signal transmission ends T and the first earth terminal G1.
Described first earth terminal G1 is used for load-modulate signal, and described signal transmission ends T is used for providing excitation
Signal changes with the change of described modulated signal to induction electrode 122, described pumping signal.Wherein,
Described pumping signal raises with the rising of described modulated signal, with described modulated signal reduction and
Reduce.
Described testing circuit 123 farther includes power end P1, described power end P1 and is used for loading
Supply voltage, described supply voltage changes with the change of described modulated signal.Described supply voltage
And the pressure reduction between described modulated signal keeps constant, and described pressure reduction is described testing circuit 123 work
Rated voltage when making.
Signal in described testing circuit 123 the most all raises with the rising of described modulated signal,
Reduce with the reduction of described modulated signal.That is, the signal in described testing circuit 123 is unified is subject to
Modulated signal is modulated.
Comparative apparatus ground GND loads constant ground signalling, and the first earth terminal G1 loads change
Modulated signal rather than described ground signalling, thus be conducive to improving the signal to noise ratio of fingerprint sensing signal,
And then the fingerprint sensing sensitivity of electronic equipment 100 can be improved further.
It should be noted that in the present embodiment, the first earth terminal G1 is used for load-modulate signal,
So, change ground, other suitable terminals in testing circuit 123 also can load-modulate signal, and
It is not limited to the first earth terminal G1 for load-modulate signal.Such as, the electricity in testing circuit 123
Source P1 can also be used for load-modulate signal, correspondingly, described pumping signal and the first earth terminal
The change of the modulated signal that the signal that G1 is loaded is loaded with power end P1 and change.
Described modulated signal for example, includes described ground signalling and a signal driving signal.At this
In embodiment, described driving signal is higher than ground signalling, and described driving signal is believed compared to ground connection
Number it is boost signal.Further, the most periodically variable square-wave signal of described modulated signal.
So, changing ground, described modulated signal is alternatively nonperiodic signal, it addition, described modulated signal
It is alternatively the signal of other suitable waveform, it is not limited to square-wave signal.Described driving signal also may be used
Less than ground signalling, described driving signal is buck signal compared to ground signalling.
Owing to described capacitance type fingerprint sensor chip 12 provides the excitation changed with modulated signal change
Signal is to induction electrode 122, therefore, can improve the signal to noise ratio of fingerprint sensing signal, correspondingly, energy
Enough improve the intensity of fingerprint sensing signal.So, below cover sheet 10, capacitance type fingerprint sense is set
The sensitivity surveying chip 12 improves further.
In the above-described embodiment, the first earth terminal G1 is for loading the modulated signal of change.So,
The application is not limited thereto, and changes ground, and it is described that described first earth terminal G1 can also be used for loading
Ground signalling.
Referring again to Fig. 1 and Fig. 6, described electronic equipment 100 includes fingerprint sensing module 1.Described
Fingerprint sensing module 1 includes described capacitance type fingerprint sensor chip the 12, second earth terminal G2 and adjusts
Circuit 16 processed.Described second earth terminal G2, for being connected with equipment ground GND, loads described ground connection
Signal.Described modulation circuit 16 be connected to described second earth terminal G2 and the first earth terminal G1 it
Between, and receive described driving signal, produce described according to described ground signalling and described driving signal
Modulated signal, and export described modulated signal to the first earth terminal G1.In the present embodiment, institute
State the signal in testing circuit 123 all to change with the change of modulated signal of the first earth terminal G1.
With changing, in other embodiments, also can partial circuit in described testing circuit 123
Signal modulated signal modulation, change with the change of modulated signal of the first earth terminal G1,
The signal of partial circuit is not modulated by the modulated signal of the first earth terminal G1.
Described modulation circuit 16 such as includes two-transistor and a controller, and wherein a transistor receives
Described driving signal, a transistor receives described ground signalling, and described controller is described by controlling
Two-transistor alternate conduction controls described two-transistor and alternately exports described ground signalling and drive with described
Dynamic signal forms described modulated signal.So, described modulation circuit 16 is not limited to described herein
Structure, it is possible to for other suitable circuit structure.
Please continue to refer to Fig. 1 and Fig. 6, described electronic equipment 100 farther includes mainboard 2, described
Mainboard 2 includes main control chip 21.Described main control chip 21 includes the 3rd earth terminal G3 and power end
P2.Described 3rd earth terminal G3 is used for connecting equipment ground GND.Described power end P2 is used for exporting
Supply voltage gives described power end P1.Described main control chip 21 and described capacitance type fingerprint sensor chip
Communication interface (sign) is set between 12 further, to communicate.
Described main control chip 21 can be one chip, it is also possible to be a chipset.Work as main control chip
21 when being chipset, and described chipset includes application processor (Application Processor, AP)
And power supply chip.It addition, described chipset can farther include storage chip.Answer it addition, described
Also central processing unit (Central Processing Unit, CPU) can be replaced by with processor.
Further, in order to avoid power supply occurring when the signal on the first earth terminal G1 is for driving signal
The current flowing backwards of end P1 is back to the situation of power end P2, and described fingerprint sensing module 1 wraps further
Include the protection circuit 17 being arranged between power end P1 and power end P2.Described protection circuit 17
It is higher than the supply voltage on power end P2 or higher than power supply for the supply voltage on power end P1
When supply voltage on end P2 is predetermined value, the connection between deenergization end P2 and power end P1.
Described protection circuit 17 such as include one be connected between power end P2 and power end P1 two
Pole is managed, or includes control unit and the transistor being connected, and the control end of described transistor is (such as,
Grid) connect control unit, the control two of described transistor connects end (such as, source electrode and drain electrode) and connects
Between power end P2 and power end P1.
Change ground, when the first earth terminal G1 be used for loading ground signalling and during unmodulated signal, institute
State modulation circuit 16, described protection circuit 17 etc. all can be omitted accordingly.
The most in the lump refering to Fig. 1 and Fig. 2, described fingerprint sensing module 1 farther includes flexible circuit
Plate 18.Described flexible PCB 18 is used for connecting described mainboard 2 and senses core with described capacitance type fingerprint
Sheet 12, transmits signal between described mainboard 2 and described capacitance type fingerprint sensor chip 12.
In the present embodiment, described modulation circuit 16, protection circuit 17 and described second ground connection
End G2 is formed on described flexible PCB 18.So, modifiable ground, described modulation circuit 16,
Protection circuit 17 and described second earth terminal G2 may alternatively be integrated within a control chip, described control
Coremaking sheet is packaged together with described capacitance type fingerprint sensor chip 12, forms chipset.Described core
The most also can be packaged with power management chip (not shown) in sheet group, described power management chip is used for carrying
Power supply source voltage is to capacitance type fingerprint sensor chip 12.It addition, described modulation circuit 16, protection electricity
Road 17 and described second earth terminal G2 also may be formed on described mainboard 2.
Described capacitance type fingerprint sensor chip 12 may also include more circuit, such as store circuit,
Control circuit, level shifting circuit, filter circuit etc..Similarly, described mainboard 2 also can wrap
Include more circuit.
In the present embodiment, described conductive layer 14 is for holding at capacitance type fingerprint sensor chip 12
Loading ground signalling during row fingerprint sensing, so, with changing, in other embodiments, such as,
In the type of drive using above-mentioned capacitance type fingerprint sensor chip 12 to use modulation the first earth terminal G1
Time, described conductive layer 14 also can load described modulated signal；Or described conductive layer 14 is unsettled.
Compared to being not provided with the situation of conductive layer 14, the application arranges conductive layer 14 all can be to a certain degree
The intensity of the fingerprint sensing signal of upper raising capacitance type fingerprint sensor chip 12.
Please continue to refer to Fig. 1 and Fig. 2, alternatively, described electronic equipment 100 farther includes display
Screen 3, described display screen 3 are respectively positioned on described cover sheet with described capacitance type fingerprint sensor chip 12
The homonymy of 10.Define described cover sheet 10 and just described display screen 3 being shown, the region of picture is aobvious
Show district 31, define described cover sheet 10 anon-normal and described display screen 3 is shown, and the region of picture is non-
Viewing area 33.Described capacitance type fingerprint sensor chip 12 and described conductive layer 14 are arranged at non-aobvious
Show district 33.
Generally, described electronic equipment 100 is formed with color at the non-display area 33 of cover sheet 10
Layer 19, such as color layers or the color layers etc. of black of white.Described conductive layer 14 and described condenser type
Fingerprint sensing chip 12 is formed in color layers 19.Changing ground, described electronic equipment 100 exists
Face also can be omitted in the position of corresponding described capacitance type fingerprint sensor chip 12 and/or described conductive layer 14
Chromatograph 19；Described electronic equipment 100 is in corresponding described capacitance type fingerprint sensor chip 12 and/or institute
The position stating conductive layer 14 may also set up the marker different from color layers 19, is used for indicating described
Capacitance type fingerprint sensor chip 12 and/or the position at described conductive layer 14 place.
Seeing also Fig. 1 and Fig. 7, Fig. 7 is that shown in Fig. 1, the partial cross section of electronic equipment 100 shows
It is intended to.Alternatively, described electronic equipment 100 farther includes touch sensing layer 4, and described touch passes
Sense layer 4 is used for sensing whether electronic equipment 100 is touched by user.Described touch sensing layer 4 can be
External hanging type is formed on display screen 3, it is possible to be formed at display screen 3 for (On-Cell) mode on box
In, it addition, alternatively interior (In-Cell) mode of box is formed in display screen 3.In present embodiment
In, touch sensing layer 4 illustrates as a example by employing external hanging type is formed on display screen 3.Described
Touch sensing layer 4 is arranged with described display screen 3 stacking.Described touch sensing layer 4, described condenser type
Fingerprint sensing chip 12 and described conductive layer 14 are respectively positioned on the homonymy of described cover sheet 10, and
Described capacitance type fingerprint sensor chip 12 and described conductive layer 14 may be contained within color layers 19.
For the touch sensing layer 4 of external hanging type, described touch sensing layer 4 can be formed directly in protection cap
On plate 10, it is possible to be formed on an extra substrate, or be formed at the outer surface of display screen 3
On.
It should be noted that when touch tactile layer 4 whether by box or box in the way of
It is formed in display screen 3, a substrate (figure can be additionally set between display screen 3 and cover sheet 10
Non-formula), described substrate arranges through hole, described capacitance type fingerprint sensor chip 12 and described conduction
Layer 14 is arranged in the through hole of described substrate, or described capacitance type fingerprint sensor chip 12 is arranged
In the through hole of described substrate, described conductive layer 14 be arranged on cover sheet 10 second surface 103,
Or the surface that real estate is to cover sheet 10, or the surface that real estate is to display screen 3.Described substrate
For example, transparent glass substrate or sapphire substrate.
Refer to the partial sectional schematic view of the change embodiment that Fig. 8, Fig. 8 are electronic equipment 100.
Described cover sheet 10 includes Part I A and Part II B, the thickness of described Part II B
Thickness less than described Part I A.In the present embodiment, described Part II B is by second
Surface 103 is formed to first surface 101 depression.Described Part II B completely or partially covers institute
State conductive layer 14.Correspondingly, then see also Fig. 4, from circuit theory, described electric capacity
Ci becomes big, thus finger F diminishes to the impedance between systematically GND, correspondingly, and condenser type
The intensity of the fingerprint sensing signal of fingerprint sensing chip 12 can be further enhanced.And then, electronics
The fingerprint sensing sensitivity of equipment 100 obtains correspondence and is further enhanced.
Refer to the partial cross section signal of the another change embodiment that Fig. 9, Fig. 9 are electronic equipment 100
Figure.Described cover sheet 10 includes Part I A and Part II B, described Part II B's
The thickness thickness less than described Part I A.In the present embodiment, described Part II B serves as reasons
First surface 101 is formed to second surface 103 depression.Described Part II B completely or partially covers
Cover described conductive layer 14.Correspondingly, then see also Fig. 4, from circuit theory, described
Electric capacity Ci becomes big, thus finger F diminishes to the impedance between systematically GND, correspondingly, and electricity
The intensity of the fingerprint sensing signal of appearance formula fingerprint sensing chip 12 can be further enhanced.And then,
The fingerprint sensing sensitivity of electronic equipment 100 obtains correspondence and is further enhanced.
The partial cross section referring to the another change embodiment that Figure 10, Figure 10 are electronic equipment 100 shows
It is intended to.Described cover sheet 10 includes Part I A and Part II B, described Part II B
Thickness less than the thickness of described Part I A.In the present embodiment, described Part II B is
Caved in and by second surface 103 to first surface to second surface 103 by first surface 101
101 depressions are formed.Described Part II B completely or partially covers described conductive layer 14.Correspondingly,
Seeing also Fig. 4 again, from circuit theory, described electric capacity Ci becomes big, thus finger F is extremely
Systematically the impedance between GND diminishes, correspondingly, and the fingerprint of capacitance type fingerprint sensor chip 12
The intensity of sensing signal can be further enhanced.And then, the fingerprint sensing spirit of electronic equipment 100
Sensitivity obtains correspondence and is further enhanced.
In the electronic equipment 100 of three change embodiments of above-mentioned Fig. 8 to Figure 10, described electric capacity
Described Part I A is the most just arranged by formula fingerprint sensing chip 12, does not weigh with Part II B
Folded.
The partial cross section referring to the another change embodiment that Figure 11, Figure 11 are electronic equipment 100 shows
It is intended to.Described cover sheet 10 includes Part I A and Part II B, described Part II B
Thickness less than the thickness of described Part I A.In the present embodiment, described Part II B is
Caved in second surface 103 by first surface 101 and formed.Described Part II B is all or part of
Cover described conductive layer 14 and described capacitance type fingerprint sensor chip 12.Correspondingly, more in the lump join
Readding Fig. 4, from circuit theory, described electric capacity Ci becomes big, thus finger F is to systematically GND
Between impedance diminish, further, since the corresponding capacitance type fingerprint sensor chip 12 of cover sheet 10
Position thinning, correspondingly, the intensity meeting of the fingerprint sensing signal of capacitance type fingerprint sensor chip 12
It is further enhanced.And then, the fingerprint sensing sensitivity of electronic equipment 100 obtains correspondence and enters one
Step is improved.
The partial cross section referring to the another change embodiment that Figure 12, Figure 12 are electronic equipment 100 shows
It is intended to.Described cover sheet 10 includes Part I A and Part II B, described Part II B
Thickness less than the thickness of described Part I A.In the present embodiment, described Part II B is
Caved in first surface 101 by second surface 103 and formed.Described Part II B is all or part of
Cover described conductive layer 14 and described capacitance type fingerprint sensor chip 12.Correspondingly, more in the lump join
Readding Fig. 4, from circuit theory, described electric capacity Ci becomes big, thus finger F is to systematically GND
Between impedance diminish, further, since the corresponding capacitance type fingerprint sensor chip 12 of cover sheet 10
Position thinning, correspondingly, the intensity meeting of the fingerprint sensing signal of capacitance type fingerprint sensor chip 12
It is further enhanced.And then, the fingerprint sensing sensitivity of electronic equipment 100 obtains correspondence and enters one
Step is improved.
The partial cross section referring to the another change embodiment that Figure 13, Figure 13 are electronic equipment 100 shows
It is intended to.Described cover sheet 10 includes Part I A and Part II B, described Part II B
Thickness less than the thickness of described Part I A.In the present embodiment, described Part II B is
Caved in and by second surface 103 to first surface to second surface 103 by first surface 101
101 depressions are formed.Described Part II B completely or partially covers described conductive layer 14 and described electricity
Appearance formula fingerprint sensing chip 12.Correspondingly, then see also Fig. 4, from circuit theory,
Described electric capacity Ci becomes big, further, since the corresponding capacitance type fingerprint sensor chip 12 of cover sheet 10
Position thinning, thus finger F diminishes to the impedance between systematically GND, correspondingly, electric capacity
The intensity of the fingerprint sensing signal of formula fingerprint sensing chip 12 can be further enhanced.And then, electricity
The fingerprint sensing sensitivity of subset 100 obtains correspondence and is further enhanced.
In the electronic equipment 100 of 6 change embodiments of above-mentioned Fig. 8 to Figure 13, described second
Part B by cover sheet 10 first surface 101 and a surface in second surface 103 to
Another surface indentation is formed, or caves in formation to each other in two surfaces, and so, the application is not
Being limited to this, internal the hollowing out of described Part II B alternatively cover sheet 10 forms, so that
The thickness of the Part II B thickness less than Part I A.
Further, for the cover sheet 10 of above-mentioned 6 embodiments, wherein, described second
The thickness of point B is 0.2mm (millimeter) to 0.7mm, the thickness of described Part I be 0.4mm extremely
2.0mm。
It addition, the surface for example, plane of Part II B formed through depression or sphere.
It should be noted that what the Part II B in Fig. 9 Yu Figure 10, Figure 12 Yu Figure 13 was formed
Depression can further function as instruction user's capacitance type fingerprint sense side core sheet 12 or/and the position of conductive layer 14
The effect put.
Need it is further noted that capacitance type fingerprint sensor chip in Figure 11 to Figure 13 12 and conductive layer 14
It is arranged at the region at same Part II B place.So, changing ground, described cover sheet 10 can include multiple
Part II B separately.The Part II B covering described conductive layer 14 senses with covering described capacitance type fingerprint
The Part II B of chip 12 is different part.
The partial cross section referring to the another change embodiment that Figure 14, Figure 14 are electronic equipment 100 shows
It is intended to.Second surface 103 side of described cover sheet 10 is arranged on a substrate 40 further.
Through hole 401, described capacitance type fingerprint sensor chip 12 and conductive layer it is formed with on described substrate 40
14 are arranged in described through hole 401.
It should be noted that as it was previously stated, described conductive layer 14 may be provided on second surface 103,
Also can be not disposed on second surface 103.It addition, may also be arranged on the surface of substrate 40.Enter
One step ground, changes ground, and described cover sheet 10 is alternatively if Fig. 8 is to embodiment illustrated in fig. 13
In cover sheet.
Glass that described substrate 40 is the most transparent or sapphire substrate, so, described substrate 40
Material is alternatively other suitable material, is not limited to glass or sapphire substrate, the most also may be used
For film substrate.Further, described substrate 40 is alternatively translucent or nontransparent cover plate, this
It is transparency carrier that application is not limiting as substrate 40.
In the present embodiment, described touch sensing layer 4 is arranged on described substrate 40, and is one
Layer.Described touch sensing layer 4 is positioned at described substrate 40 in the face of the side of described cover sheet 10.
So, changing ground, described touch sensing layer 4 is alternatively two-layer, is separately positioned on the phase of substrate 40
To both sides.Whether described touch sensing layer 40 includes touch-sensing electrode (not shown), for sensing
There is the touch operation of user.
It addition, described touch sensing layer 4 also may be formed in display screen 3, thus formed embedded
Touch display unit.
Further, described touch sensing layer 4 can be self-capacitance touch sensing layer, it is possible to for mutually
Capacitance touch sensing layer.
Please continue to refer to Fig. 1, alternatively, described electronic equipment 100 farther includes back cover 5, uses
In forming receiving space with described cover sheet 10, house aforementioned touch sensing layer 4, display screen 3,
The elements such as mainboard 2, fingerprint sensing module 1 are in described receiving space.
It is open despite describing the present invention with reference to each embodiment, it will be appreciated that these are implemented
Example is illustrative, and the scope of the present invention is not limited only to them.Many changes, revises, adds
It is all possible for adding and improving.More generally, according to each embodiment disclosed by the invention it is
Describe in the context of specific embodiments.Function can be in each embodiment disclosed by the invention
The most separately or in combination, or utilize different terms to describe.These and
Other change, revise, add and improve can be as defined in subsequent claim
In scope disclosed by the invention.
Claims (20)
1. an electronic equipment, including:
Cover sheet, including Part I and Part II, the thickness of described Part II is less than the thickness of Part I
Degree；
Capacitance type fingerprint sensor chip, for sensing the finger print information of user；With
Conductive layer, and the homonymy that described capacitance type fingerprint sensor chip is respectively positioned on described cover sheet, and described conduction
Layer is positioned at around described capacitance type fingerprint sensor chip；
Described Part II completely or partially covers described conductive layer.
Electronic equipment the most according to claim 1, it is characterised in that: described conductive layer is closed or non-close
The ring-shaped conductive layer of formula.
Electronic equipment the most according to claim 2, it is characterised in that: described capacitance type fingerprint sensor chip is positioned at
Described conductive layer area encompassed.
Electronic equipment the most according to claim 1, it is characterised in that: described conductive layer is used for loading ground signalling.
Electronic equipment the most according to claim 1, it is characterised in that: described electronic equipment includes equipment ground, institute
Load ground signalling with stating equipment, electrically connect described conductive layer and described equipment.
Electronic equipment the most according to claim 5, it is characterised in that: described conductive layer is at described condenser type
Fingerprint sensing chip performs to load ground signalling during fingerprint sensing, with described capacitance type fingerprint sensor chip, equipment ground
Constitute a closing of circuit loop.
7. according to the electronic equipment described in any one in claim 1-6, it is characterised in that: described electronic equipment enters
One step includes touch sensing layer；Described cover sheet includes first surface and the second surface relative with first surface；
Described touch sensing layer, described conductive layer and described capacitance type fingerprint sensor chip are arranged at the of cover sheet
Two side, surfaces.
Electronic equipment the most according to claim 7, it is characterised in that: described Part II be by first surface to
Second surface depression is formed, or/and, described Part II is to be formed to first surface depression by second surface.
Electronic equipment the most according to claim 8, it is characterised in that: described Part II completely or partially covers
Described capacitance type fingerprint sensor chip.
Electronic equipment the most according to claim 9, it is characterised in that: cover the Part II of described conductive layer
It is with a part of or different parts from the Part II covering described capacitance type fingerprint sensor chip.
11. electronic equipments according to claim 8, it is characterised in that: described capacitance type fingerprint sensor chip is just
Described Part I is arranged, the most overlapping with Part II.
12. electronic equipments according to claim 1, it is characterised in that: described conductive layer is arranged on second surface
On.
13. electronic equipments according to claim 8, it is characterised in that: described electronic equipment farther includes base
Plate, described touch sensing layer arranges on the substrate, described substrate arranges through hole, and described conductive layer is with described
Capacitance type fingerprint sensor chip is positioned in described through hole.
14. electronic equipments according to claim 1, it is characterised in that: described electronic equipment farther includes base
Plate, described substrate and described capacitance type fingerprint sensor chip, conductive layer are respectively positioned on the homonymy of described cover sheet, institute
Stating and arrange through hole on substrate, described conductive layer and described capacitance type fingerprint sensor chip are positioned in described through hole.
15. electronic equipments according to claim 7, it is characterised in that: described capacitance type fingerprint sensor chip bag
Including induction electrode array and the testing circuit being connected with induction electrode array, described testing circuit is used for providing excitation
Signal, to induction electrode array, drives described induction electrode array to perform fingerprint sensing.
16. electronic equipments according to claim 15, it is characterised in that: described testing circuit includes that signal transmits
End and the first earth terminal, described first earth terminal is used for load-modulate signal, and described signal transmission ends is used for providing sharp
Encourage signal to raise, with described modulation with the rising of described modulated signal to induction electrode array, described pumping signal
The reduction of signal and reduce.
17. electronic equipments according to claim 16, it is characterised in that: described electronic equipment includes fingerprint sensing
Module, described fingerprint sensing module includes described capacitance type fingerprint sensor chip, the second earth terminal and modulation circuit；
Described second earth terminal is used for loading described ground signalling, and described modulation circuit is connected to described second earth terminal and
Between one earth terminal, drive signal to produce described modulated signal according to described ground signalling with one, and described tune is provided
Signal processed gives the first earth terminal.
18. electronic equipments according to claim 17, it is characterised in that: described electronic equipment farther includes main
Plate, described fingerprint sensing module farther includes flexible PCB, and described flexible PCB is used for connecting described mainboard
With described capacitance type fingerprint sensor chip, between described mainboard and described capacitance type fingerprint sensor chip, transmit signal.
19. electronic equipments as claimed in claim 1, it is characterised in that: described capacitance type fingerprint sensor chip is certainly
Capacitance type fingerprint sensor chip.
20. electronic equipments as claimed in claim 1, it is characterised in that: described electronic equipment is that portable electronic produces
Product or household formula electronic product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610102270.2A CN106156719A (en) | 2016-02-24 | 2016-02-24 | There is the electronic equipment of fingerprint sensing function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610102270.2A CN106156719A (en) | 2016-02-24 | 2016-02-24 | There is the electronic equipment of fingerprint sensing function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106156719A true CN106156719A (en) | 2016-11-23 |
Family
ID=57353102
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610102270.2A Withdrawn CN106156719A (en) | 2016-02-24 | 2016-02-24 | There is the electronic equipment of fingerprint sensing function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106156719A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108256382A (en) * | 2016-12-28 | 2018-07-06 | 创智能科技股份有限公司 | Optical biologic device for identifying |
| CN108764162A (en) * | 2018-05-30 | 2018-11-06 | 江苏凯尔生物识别科技有限公司 | A kind of fingerprint module |
-
2016
- 2016-02-24 CN CN201610102270.2A patent/CN106156719A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108256382A (en) * | 2016-12-28 | 2018-07-06 | 创智能科技股份有限公司 | Optical biologic device for identifying |
| CN108764162A (en) * | 2018-05-30 | 2018-11-06 | 江苏凯尔生物识别科技有限公司 | A kind of fingerprint module |
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Application publication date: 20161123 |