CN106557741A - Fingerprint identification device, its manufacture method, display device - Google Patents
Fingerprint identification device, its manufacture method, display device Download PDFInfo
- Publication number
- CN106557741A CN106557741A CN201610914097.6A CN201610914097A CN106557741A CN 106557741 A CN106557741 A CN 106557741A CN 201610914097 A CN201610914097 A CN 201610914097A CN 106557741 A CN106557741 A CN 106557741A
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- CN
- China
- Prior art keywords
- fingerprint identification
- identification device
- conductive
- cover plate
- tie layers
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
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- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
A kind of fingerprint identification device, which includes a cover plate, a shielding layer, a conductive tie layers, a piezoelectric material layer and the signal transmitting unit being cascading, the cover plate is a touch surface away from the surface of the shielding layer, the conductive tie layers are folded between the cover plate and the piezoelectric material layer and the cover plate are bonded together with the piezoelectric material layer, and the conductive tie layers constitute a signal receiving unit with the piezoelectric material layer.The present invention also provides a kind of display device using the fingerprint identification device and a kind of manufacture method of fingerprint identification device.
Description
Technical field
The present invention relates to a kind of fingerprint identification device and its manufacture method.
Background technology
In recent years, the electronic installation such as smart mobile phone, panel computer often realizes data protection, identity using fingerprint identification device
The function such as certification and programme-control.Fingerprint identification device can be divided into optical profile type, condenser type, sound wave type etc..Wherein, sound wave type fingerprint
Identifying device is difficult to be affected by ambient temperature, humidity because of which, and there is life-span length, resolution is high and is extensively employed.
When carrying out fingerprint detecting using sound wave type fingerprint identification device, finger is placed on detecing for sound wave type fingerprint identification device
Surface is surveyed, is sent to the ultrasonic component of finger and is absorbed, another part is reflected.Due to the medium at finger print paddy and ridge
Respectively air and finger epidermis, the absorbance and reflectance to ultrasound wave are different, thus produce using the difference and correspondingly refer to
The serial signal of telecommunication of stricture of vagina valley and a ridge, ultimately forms the image of correspondence fingerprint shape.
A cover plate that the fingerprint identification device of prior art generally includes to be cascading, a signal receiving unit, one
Signal transmitting unit, a thin-film transistor array base-plate and a flexible PCB, the cover plate again by an adhesive with it is described
Signal receiving unit is fitted.On the cover plate, generally ink layer and a colored ink layers arc are covered in coating one, when finger is touched
During coverslip surface, the ultrasound wave of the signal transmitting unit transmitting sequentially passes through the thin-film transistor array base-plate, the letter
Number receiving unit, the adhesive, the masking ink layer, the colored ink layers arc and the cover plate reach contact surface and occur
Reflect, then sequentially pass through the cover plate, the masking ink layer, the colored ink layers arc and the adhesive and connect by the signal
Receive unit to receive.Have now been found that, ultrasonic transmission path is long, every layer of dielectric material in transmission path can all absorb described super
Sound wave, causes ultrasonic signal decay excessive, leverages the fingerprint detecting precision of sound wave type fingerprint identification device.
The content of the invention
In view of this, it is necessary to which a kind of fingerprint identification device and its manufacturer that precision is detected with higher fingerprint is provided
Method.
A kind of fingerprint identification device, a cover plate which includes being cascading, a shielding layer, a conductive tie layers, one
Piezoelectric material layer and a signal transmitting unit, the cover plate are a touch surface away from the surface of the shielding layer, and the conduction is even
Connect layer to be folded between the cover plate and the piezoelectric material layer and the cover plate is bonded together with the piezoelectric material layer,
The conductive tie layers constitute a signal receiving unit with the piezoelectric material layer.
A kind of manufacture method of fingerprint identification device, including：
A cover plate is provided, the cover plate has a touch surface, sequentially forms on surface of the cover plate away from the touch surface
The conductive connecting material of one shielding layer and one layer of semi-solid preparation state, the material of the conductive tie layers have curability energy；
One piezoelectric material layer is provided, be fitted on the conductive connecting material of the semi-solid preparation state and solidified described in be conductively connected
Material forms a conductive tie layers.
Compared to prior art, by semi-solid preparation in present invention conductive connecting material solidification process of the utilization with curing performance
State is changed into the characteristic of solid-state and piezoelectric material layer is fitted composition signal receiving unit, while by the cover plate and the piezoelectricity
Binding material layers are together so that the conductive connecting material functions simultaneously as the color oil in the fingerprint identification device of prior art
The electrode layer of layer of ink and signal receiving unit, while eliminating one layer of adhesive, effectively shortens the path of ultrasonic transmission, and then
Acoustic wave signal decays are effectively reduced, the precision of the fingerprint detecting of sound wave type fingerprint identification device is improved；Simplify technique system simultaneously
Journey, reduces process costs.
Description of the drawings
Schematic diagrams of the Fig. 1 for the electronic installation with fingerprint identification device of one embodiment of the invention.
Generalized sections of the Fig. 2 for the fingerprint identification device of a preferred embodiment of the present invention.
Flow charts of the Fig. 3 for the manufacture method of the fingerprint identification device of one embodiment of the invention.
Main element symbol description
| Fingerprint identification device | 10 |
| Cover plate | 110 |
| Contact surface | 111 |
| Signal receiving unit | 120 |
| Conductive tie layers | 121 |
| First piezoelectric material layer | 122 |
| Thin-film transistor array base-plate | 130 |
| Signal transmitting unit | 140 |
| First electrode layer | 141 |
| The second electrode lay | 143 |
| Second piezoelectric material layer | 142 |
| Flexible PCB | 150 |
| Adhesive | 170 |
| Display device | 20 |
| Cover plate | 210 |
| Viewing area | 211 |
| Non-display area | 212 |
| Shielding layer | 190 |
Following specific embodiment will further illustrate the present invention with reference to above-mentioned accompanying drawing.
Specific embodiment
Fig. 1 is the schematic diagram of the display device 20 of the fingerprint identification device 10 using a preferred embodiment of the present invention.This shows
Showing device 20 includes a transparent cover plate 210, and the transparent cover plate 210 is with a viewing area 211 for being used for display picture and surrounds
The non-display area 212 of the viewing area 211.The fingerprint identification device 10 is arranged on the non-display area 212.The display device 20
Can be smart mobile phone, panel computer etc..
See also Fig. 2, sectional views of the Fig. 2 for the II-II lines along Fig. 1 of fingerprint identification device 10.The fingerprint recognition
A cover plate 110 that device 10 includes stacking gradually, a shielding layer 190, a conductive tie layers 121, one first piezoelectric material layer
122nd, a thin-film transistor array base-plate 130, a signal transmitting unit 140 and a flexible PCB 150.The cover plate 110
It is coplanar with the cover plate 210.The cover plate 110 is away from the surface of the conductive tie layers 121 and carries out fingerprint recognition operation
Contact surface 111.
The material of the cover plate 110 can be selected from glass, polymethyl methacrylate (Polymethyl
Methacrylate, PMMA), sapphire, polyethersulfone resin (Polyethersulfone Resin, PES) and poly- to benzene two
Formic acid glycol ester (Polyethylene Terephthalate, PET) etc..
The material of the shielding layer 190 can be ink or coating etc., the shielding layer 190 be used for cover first piezoelectricity
Material layer 122 and each Rotating fields below which, to realize the aesthetic property of the fingerprint identification device 10.In order to print ICON
（Icon）Need, the shielding layer 190 be pattern structure, the part quilt that the cover plate 110 is not covered by the shielding layer 190
The conductive tie layers 121 are covered.
The material of the conductive tie layers 121 is the conductive material with curability energy, and its square resistance is less than 50m
Ω/sq.The cover plate 110 is bonded by the conductive tie layers 121 with first piezoelectric material layer 122.Meanwhile, it is described
Conductive tie layers 121 serve as an electrode layer, coordinate the signal for constituting the fingerprint identification device to connect with the first piezoelectric material layer 122
Receive unit 120.In the present embodiment, the material of the conductive tie layers 121 is electrically conductive ink.In other embodiments, it is described
The material of conductive tie layers 121 can be conductive carbon paste, conductive silver paste etc..In order to print ICON needs, the conductive tie layers 121
Can also be different colours.
First piezoelectric material layer 122 is pasted by adhesive 170 with the thin-film transistor array base-plate 130
Close, the thin-film transistor array base-plate 130 passes through the first electrode layer 141 of adhesive 170 and the signal transmitting unit 140
Fitted, the second electrode lay 143 and the flexible PCB 150 of the signal transmitting unit 140 are entered by adhesive 170
Row laminating.
First piezoelectric material layer 122 can be in following material with the material of second piezoelectric material layer 142
Plant or several combinations：Poly- vinylidene difluoride（Polyvinylidene Fluoride, PVDF）, Barium metatitanate., lead titanates, zirconium titanium
Lead plumbate (PZT), tantalum scandium acid plumbum（PST）, quartz and vinylidene fluoride and trifluoro-ethylene copolymer.
The signal transmitting unit 140 includes a first electrode layer 141, one second piezoelectric material layer 142 for stacking gradually
And a second electrode lay 143.
The flexible PCB 150 is electrical connected with the second electrode lay 143；While the flexible PCB 150
One end extend and the side surrounding along the fingerprint identification device 10 and the conductive tie layers 121 and the thin film transistor (TFT)
Array base palte 130 is electrical connected.
The first electrode layer 141 can be made up of the preferable metal material of conductivity with the second electrode lay 143, example
Such as, the high conductivity material such as aluminum, copper, nickel, gold, can with by such as transparent oxide conductive material (such as tin indium oxide, Indium sesquioxide.
Zinc), silver, the conductive material such as CNT or Graphene make, but be not limited to above material.
170 thickness of the adhesive is less than 5 microns.Preferably, the adhesive is epoxy resin adhesive.
When the fingerprint identification device 10 works, external circuit（It is not shown）By 150 pairs of institutes of the flexible PCB
The first electrode layer 141 and 143 applied voltage of the second electrode lay of signal transmitting unit 140 are stated, makes to form therebetween electric field, institute
State the second piezoelectric material layer 142 and vibration transmitting ultrasonic signal is produced under electric field action, the ultrasonic signal passes through signal
Receiving unit 120 reaches the contact surface 111 of the cover plate 110 and Jing after the contact surface 111 reflects to form reflected signal again by institute
State signal receiving unit 120 to receive.When there is finger touch on the contact surface 111, due to fingerprint ridge with fingerprint valley to super
The reflectance of sound wave is different, has been transferred to signal that the ultrasound wave of the contact surface 111 reflected at fingerprint ridge with fingerprint valley
Difference, the reflected signal are received by the signal receiving unit 120, and first piezoelectric material layer 122 is super in the reflection
Electric charge is produced in the presence of acoustic signals, the first film transistor array base palte 130 senses the electric charge and is converted to electricity
Signal, then external circuit is delivered to by the flexible PCB 150（It is not shown）.
The present embodiment is changed into by semi-cured state in the curing process using the conductive connecting material with curing performance
The characteristic of solid-state is fitted with the piezoelectric material layer 122 the composition signal receiving unit 120, at the same by the cover plate 110 with
The piezoelectric material layer 122 is bonded together so that the conductive connecting material functions simultaneously as the fingerprint recognition dress of prior art
The electrode layer of colored ink layers arc and signal receiving unit in putting, while eliminating one layer of adhesive, effectively shortens ultrasound wave and passes
Defeated path, and then the decay of acoustic signals is effectively reduced, improve the precision of the fingerprint detecting of the fingerprint identification device 10；Together
When simplify manufacturing process, reduce process costs.
The present invention provides the manufacture method of fingerprint identification device 10 in above-described embodiment, refers to Fig. 3, the manufacture method
Comprise the steps：
Step S301 a, there is provided cover plate 110, the cover plate have a touch surface 111, in the cover plate 110 away from the touch
The shielding layer 190 and the conductive connecting material of one layer of semi-solid preparation state of a pattern layers are sequentially formed on the surface in face 111.The lid
The part that piece 110 is not covered by the shielding layer 190 is covered by the conductive connecting material.
The material of the cover plate 110 can be selected from glass, polymethyl methacrylate (Polymethyl
Methacrylate, PMMA), sapphire, polyethersulfone resin (Polyethersulfone Resin, PES) and poly- to benzene two
Formic acid glycol ester (Polyethylene Terephthalate, PET) etc..
The conductive connecting material is the conductive material with curing performance.In the present embodiment, it is described to be conductively connected material
Expect for electrically conductive ink.In other embodiments, the conductive connecting material can be conductive carbon paste, conductive silver paste etc..
Step S302, there is provided one first piezoelectric material layer 122, makes first piezoelectric material layer 122 be fitted in described half
On the conductive connecting material of cure states and solidify the conductive connecting material and form conductive tie layers 121, and first piezoelectricity
Material layer 122 is brought into close contact one signal receiving unit 120 of composition with the conductive tie layers 121.The conductive tie layers 121
Square resistance is less than 50m Ω/sq.
The material of the piezoelectric material layer 122 can be poly- vinylidene difluoride（Polyvinylidene Fluoride,
PVDF）, Barium metatitanate., lead titanates, lead zirconate titanate (PZT), tantalum scandium acid plumbum（PST）, quartz and vinylidene fluoride and trifluoro-ethylene
Copolymer.
Step S303 a, there is provided thin-film transistor array base-plate 130, the thin-film transistor array base-plate 130 is passed through
Adhesive-layer 170 is fitted with first piezoelectric material layer 122.
Step S304 a, there is provided signal transmitting unit 140, the signal transmitting unit 140 include what is be cascading
First electrode layer 141, the second piezoelectric material layer 142 and the second electrode lay 143.The first electrode layer 141 is made to pass through adhesive-layer
170 are fitted with the thin-film transistor array base-plate 130.
Step S305 a, there is provided flexible PCB 150, the flexible PCB 150 are fitted by adhesive-layer 170；It is described
Flexible PCB 150 is electrical connected with the second electrode lay 143, and one end of the flexible PCB 150 extends and along described
The side surrounding of fingerprint identification device 10 carries out electricity with the conductive tie layers 121 and the thin-film transistor array base-plate 130
Property be connected.
The present embodiment is changed into by semi-cured state in the curing process using the conductive connecting material with curing performance
The characteristic of solid-state is fitted with the piezoelectric material layer 122 and constitutes the signal receiving unit 120, so as to without the need for connecting in the conduction
Extra setting adhesive between layer 121 and first piezoelectric material layer 122 is connect, a viscose glue oxidant layer is eliminated；It is simultaneously described to lead
Electric connection layer 121 serves as the electrode of the signal receiving unit 120, effectively shortens the path of ultrasonic transmission, and then effectively subtracts
The decay of few acoustic signals, improves the precision of the fingerprint detecting of the fingerprint identification device 10；Simplify manufacturing process simultaneously, drop
Low process costs.
Claims (10)
1. a kind of fingerprint identification device, a cover plate which includes being cascading, a shielding layer, a conductive tie layers, a pressure
Material layer and a signal transmitting unit, the cover plate are a touch surface away from the surface of the shielding layer, it is characterised in that：Institute
State conductive tie layers to be folded between the cover plate and the piezoelectric material layer and the cover plate is glued with the piezoelectric material layer
It is combined, the conductive tie layers constitute a signal receiving unit with the piezoelectric material layer.
2. fingerprint identification device as claimed in claim 1, it is characterised in that：The fingerprint identification device is applied to display dress
The non-display area put.
3. fingerprint identification device as claimed in claim 1, it is characterised in that：Formed the conductive tie layers material have lead
Electrical and curability energy, is electrically conductive ink, conductive carbon paste or conductive silver paste.
4. fingerprint identification device as claimed in claim 1, it is characterised in that：The square resistance of the conductive tie layers is less than
50mΩ/sq。
5. fingerprint identification device as claimed in claim 1, it is characterised in that：The fingerprint identification device also includes that a thin film is brilliant
Body pipe array base palte and a flexible PCB, the cover plate, the signal receiving unit, the thin-film transistor array base-plate,
The signal transmitting unit is cascading, and thin-film transistor array base-plate is electrical connected with the signal transmitting unit；
The flexible PCB is electrically connected with the signal receiving unit and the signal transmitting unit.
6. a kind of display device, it is characterised in that：Fingerprint identification device as described in claim 1 ~ 5 any one is applied to institute
State the non-display area of display device.
7. a kind of manufacture method of fingerprint identification device, including：
A cover plate is provided, the cover plate has a touch surface, sequentially forms on surface of the cover plate away from the touch surface
The conductive connecting material of one shielding layer and one layer of semi-solid preparation state, the material of the conductive tie layers have curability energy；
One piezoelectric material layer is provided, be fitted on the conductive connecting material of the semi-solid preparation state and solidified described in be conductively connected
Material forms a conductive tie layers.
8. the manufacture method of fingerprint identification device as claimed in claim 7, also includes：One thin-film transistor array base-plate is provided
With a signal transmitting unit, the thin-film transistor array base-plate is made to fit with the piezoelectric, the signal transmitting unit
Fit with the thin-film transistor array base-plate.
9. the manufacture method of fingerprint identification device as claimed in claim 7, also includes：One flexible PCB is provided, is made described
Signal transmitting unit laminating described in flexible PCB, and make the flexible PCB respectively with the signal transmitting unit, described
Conductive tie layers and the flexible PCB are electrical connected.
10. the manufacture method of the fingerprint identification device as described in right wants 7, it is characterised in that：The conductive connecting material is to lead
Electric ink, conductive carbon or conductive silver paste.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610914097.6A CN106557741A (en) | 2016-10-20 | 2016-10-20 | Fingerprint identification device, its manufacture method, display device |
| TW105139342A TWI621982B (en) | 2016-10-20 | 2016-11-30 | Fingerprint identification device, manufacturing method thereof and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610914097.6A CN106557741A (en) | 2016-10-20 | 2016-10-20 | Fingerprint identification device, its manufacture method, display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106557741A true CN106557741A (en) | 2017-04-05 |
Family
ID=58443666
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610914097.6A Pending CN106557741A (en) | 2016-10-20 | 2016-10-20 | Fingerprint identification device, its manufacture method, display device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106557741A (en) |
| TW (1) | TWI621982B (en) |
Cited By (4)
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| CN108171183A (en) * | 2018-01-02 | 2018-06-15 | 京东方科技集团股份有限公司 | Display base plate and preparation method thereof, display device and fingerprint identification method |
| CN108764162A (en) * | 2018-05-30 | 2018-11-06 | 江苏凯尔生物识别科技有限公司 | A kind of fingerprint module |
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| CN110245629A (en) * | 2019-06-19 | 2019-09-17 | 业成科技（成都）有限公司 | Electronic device and its manufacturing method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115101535A (en) * | 2022-06-22 | 2022-09-23 | 业泓科技(成都)有限公司 | Under-screen biometric identification device |
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Effective date of registration: 20180814 Address after: 610041 689 cooperation Road, hi-tech West District, Chengdu, Sichuan Applicant after: Cheng Cheng Technology (Chengdu) Co., Ltd. Applicant after: Interface Optoelectronic (Shenzhen) Co., Ltd. Address before: 518057 Room 201, building A, 1 Bay Road, Shenzhen Hong Kong cooperation zone, Qianhai, Shenzhen, Guangdong, Nanshan District Applicant before: MIICS BUSINESS CONSULTING (SHENZHEN) CO., LTD. |
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170405 |