CN107172812A - Supersonic sensing device assembly and manufacture method - Google Patents
Supersonic sensing device assembly and manufacture method Download PDFInfo
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- CN107172812A CN107172812A CN201710570888.6A CN201710570888A CN107172812A CN 107172812 A CN107172812 A CN 107172812A CN 201710570888 A CN201710570888 A CN 201710570888A CN 107172812 A CN107172812 A CN 107172812A
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- Prior art keywords
- flexible pcb
- supersonic generator
- supersonic
- sensing device
- device assembly
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Pressure Sensors (AREA)
Abstract
This application discloses supersonic sensing device assembly and its manufacture method.The supersonic sensing device assembly, including：Metal substrate；Flexible PCB, including each other relative first surface and second surface, the second surface are fixed on the metal substrate；And chip, the chip is fixed on the first surface of the flexible PCB, and including the supersonic generator and circuit layer stacked gradually, wherein, the first surface of the flexible PCB includes the first wiring and the first pad, the first surface of the supersonic generator and the flexible PCB is abutted, and the supersonic generator and the circuit layer are connected to first pad via bonding line respectively.The supersonic sensing device assembly realizes the electrical connection with flexible PCB using bonding line, so that anisotropy conductiving glue is saved, to reduce assembly volume and improve packaging efficiency.
Description
Technical field
The present invention relates to biometric sensor, more particularly, to supersonic sensing device assembly and manufacture method.
Background technology
Living things feature recognition is the technology for distinguishing different biological features, including fingerprint, palmmprint, face, DNA, sound
Etc. identification technology.Fingerprint refers to the convex uneven lines of the positive surface skin fovea superior of the finger tips of people, the regular arrangement form of lines
Different line types.Fingerprint recognition refers to by the details of relatively more different fingerprints to carry out identity authentication.Due to lifelong
Consistency, uniqueness and convenience, the application of fingerprint recognition are more and more extensive.
In fingerprint recognition, information in fingerprint is obtained using sensor.According to the difference of operation principle, fingerprint sensor
Optics, electric capacity, pressure, sonac can be divided into.Ultrasonic sensor is third generation fingerprint sensor, wherein utilizing piezoelectricity
The inverse piezoelectric effect of material produces ultrasonic wave.When ultrasonic wave touches fingerprint, shown in the ridge, valley in fingerprint different anti-
Penetrate rate and transmissivity.Finger print information can be read by the ultrasonic beam signal scanned in certain area.Ultrasonic sensor is produced
Raw ultrasonic wave can penetrate the phone housing being made up of glass, aluminium, stainless steel, sapphire or plastics and be scanned,
So as to which ultrasonic sensor is arranged in phone housing.The surface area of its occupancy can be reduced built in ultrasonic sensor,
Allow larger sized display screen is installed on mobile phone surface, thus the screen accounting of mobile phone can be improved.
Fig. 1 shows the schematic cross-section of the supersonic sensing device assembly according to prior art.The supersonic sensing device assembly
100 chip 110, flexible PCB 120 and metal substrates 130 including stacking gradually.The chip 110 includes reflected signal successively
Receiving layer 111, circuit layer 112 and supersonic generator 113.Supersonic generator 113 is connected using anisotropy conductiving glue 121
To flexible PCB 120, flexible PCB 120 is fixed on metal substrate 130 using adhesive 131.The ultrasonic sensor
Circuit layer 112 in component 100 is, for example, thin-film transistor array base-plate, including the multiple films formed on the glass substrate are brilliant
Body pipe.Reflected signal receiving layer 111 is connected with circuit layer 112, so as to optionally obtain corresponding pixel cell
Ultrasonic reflections signal.Circuit layer 112 includes pad 114, and flexible PCB is connected to for example with anisotropy conductiving glue
120.Further, circuit layer 112 and supersonic generator 113 are electrically connected via flexible PCB 120 with external circuit.
In above-mentioned supersonic sensing device assembly, two apparent surfaces of flexible PCB 120 are adhered to ultrasound respectively
Wave producer 113 and metal substrate 130, due to being mechanically fixed and being electrically connected using each guide property conducting resinl, therefore cause
The volume of supersonic sensing device assembly is big and packaging efficiency is low.
The content of the invention
In view of this, it is an object of the invention to provide supersonic sensing device assembly and manufacture method, wherein, using bonding line
Chip is connected into flexible PCB to reduce assembly volume and improve packaging efficiency.
According to an aspect of the present invention there is provided a kind of supersonic sensing device assembly, including：Metal substrate；Flexible PCB,
Including each other relative first surface and second surface, the second surface is fixed on the metal substrate；And chip, institute
Chip is stated to be fixed on the first surface of the flexible PCB, and supersonic generator and circuit including stacking gradually
Layer, wherein, the first surface of the flexible PCB includes the first wiring and the first pad, the supersonic generator with it is described
The first surface adjoining of flexible PCB, the supersonic generator and the circuit layer are connected to described via bonding line respectively
First pad.
Preferably, first adhesive and the second bonding is respectively adopted in the first surface and second surface of the flexible PCB
Agent is bonded on the chip and the metal substrate.
Preferably, the first adhesive and the second adhesive are merely provided for being mechanically fixed.
Preferably, the first surface of the flexible PCB is included positioned at the first area of diverse location and second area,
Wherein, the first area of the first surface of the flexible PCB is used to bond the chip, and the second area includes
First pad, is used as weld zone.
Preferably, the supersonic generator includes the 3rd surface abutted with the circuit layer, and the ultrasonic wave occurs
3rd surface of device includes the second wiring and the second pad, wherein, the second pad of the supersonic generator is via bonding line
It is connected to the first pad of the flexible PCB.
Preferably, in addition to：First encapsulating compound, at least partly covers the side of the bonding line and the supersonic generator
Side.
Preferably, the metal substrate is L-shaped, including the Part I and the Part II of Longitudinal extending extended laterally,
The Part II forms the receiving bonding line and first encapsulation together with the side of the supersonic generator
At least one of space of material.
Preferably, the height of the Part II of the metal substrate reach the thickness of the supersonic generator five/
/ 1st to two position.
Preferably, in addition to：Reflected signal receiving layer on the circuit layer.
Preferably, the circuit layer includes glass substrate and multiple thin film transistor (TFT)s on the glass substrate, its
In, the supersonic generator includes multiple pixel cells, and the multiple thin film transistor (TFT) is used to optionally obtain described many
The ultrasonic reflections signal of individual pixel cell.
According to another aspect of the present invention there is provided a kind of method for manufacturing supersonic sensing device assembly, including：Form core
Piece, the chip includes the supersonic generator and circuit layer stacked gradually；Fixing flexible circuit board on metallic substrates；Soft
Fixed chip on property circuit board；And the chip is connected with flexible PCB, wherein, the flexible PCB includes that
This relative first surface and second surface, the first surface of the flexible PCB includes the first wiring and the first pad, institute
The first surface for stating supersonic generator and the flexible PCB is abutted, the supersonic generator and circuit layer difference
First pad is connected to via bonding line.
Preferably, the chip is connected with flexible PCB, including uses first adhesive by the flexible circuit
The first surface of plate is bonded on the chip.
Preferably, in addition to, the second surface of the flexible PCB is bonded in by metal substrate using second adhesive
On.
Preferably, the first adhesive and the second adhesive are merely provided for being mechanically fixed.
Preferably, the first surface of the flexible PCB is included positioned at the first area of diverse location and second area,
Wherein, the first area of the first surface of the flexible PCB is used to bond the chip, and the second area includes
First pad, is used as weld zone.
Preferably, in addition to, super ask finger acoustic wave transducer to be connected to first pad by described using bonding line.
Preferably, in addition to, using the first encapsulating compound at least partly cover the bonding line and the supersonic generator
Side.
Preferably, the metal substrate is L-shaped, including the Part I and the Part II of Longitudinal extending extended laterally,
The Part II forms the receiving bonding line and first encapsulation together with the side of the supersonic generator
At least one of space of material.
Supersonic sensing device assembly according to embodiments of the present invention and its manufacture method, wherein, using in bonding line chip
Supersonic generator and circuit layer be connected to pad on flexible PCB.Used on two surfaces of flexible PCB
Adhesive offer be provided be mechanically fixed effect, without providing electrical connection effect.Flexible PCB is further realized
External circuit is electrically connected, for example outside signal drive circuit or signal processing circuit.Therefore, the component can be in flexible circuit
Common adhesive is used on the surface of plate, without using anisotropy conductiving glue, so as to reduce assembly volume and improve encapsulation effect
Rate.
In a preferred embodiment, flexible PCB is fixed on the metal substrate of L-shaped.The longitudinal extension part of metal substrate
Divide the space that weld zone is limited between the side of supersonic generator, at least partly accommodating bonding line and encapsulating compound.Should
Space can reduce the lateral dimension of the weld zone on the first surface of flexible PCB, and can reduce the use of encapsulating compound
Measure and additional mechanical protection effect is provided for bonding line, so as to further reduce assembly volume, and provide the reliable of component
Property.
Brief description of the drawings
By description referring to the drawings to the embodiment of the present invention, above-mentioned and other purposes of the invention, feature and
Advantage will be apparent from, in the accompanying drawings：
Fig. 1 shows the schematic cross-section of the supersonic sensing device assembly according to prior art；
Fig. 2 shows the schematic sectional view of supersonic sensing device assembly according to a first embodiment of the present invention；
Fig. 3 a to 3e show a part in the manufacture method of supersonic sensing device assembly according to a second embodiment of the present invention
The schematic cross-section in stage.
Embodiment
The present invention is more fully described hereinafter with reference to accompanying drawing.In various figures, identical element is using similar attached
Icon is remembered to represent.For the sake of clarity, the various pieces in accompanying drawing are not necessarily to scale.Furthermore, it is possible to not shown some
Known part.
It describe hereinafter many specific details of the present invention, structure, material, size, the processing work of such as device
Skill and technology, to be more clearly understood that the present invention.But just as the skilled person will understand, it can not press
The present invention is realized according to these specific details.
The present invention can be presented in a variety of manners, some of examples explained below.
Fig. 2 shows the schematic sectional view of supersonic sensing device assembly according to a first embodiment of the present invention.The ultrasonic wave
Sensor cluster 300 includes chip 110, flexible PCB 120 and the metal substrate 130 stacked gradually.
Chip 110 includes reflected signal receiving layer 111, circuit layer 112 and the supersonic generator stacked gradually successively
113.Supersonic generator 113 is connected to flexible PCB 120 using adhesive 122, and flexible PCB 120 uses adhesive
131 are fixed on metal substrate 130.Circuit layer 112 in the supersonic sensing device assembly 300 is, for example, thin film transistor (TFT) array
Substrate, including multiple thin film transistor (TFT)s on the glass substrate are formed, for optionally obtaining the super of corresponding pixel cell
Sound wave reflected signal.
Supersonic generator 113 includes each other relative first surface and second surface, wherein first surface adjoining circuit
Layer 112, second surface adjoining flexible PCB 120.Wiring and pad are formed on the first surface of supersonic generator 113,
For example, pad 114.The different zones of the first surface of the supersonic generator 113 are used to connect circuit layer 112 and form pad
114, so that pad 114 is exposed for being bonded.
Further, circuit layer 112 is connected via wiring with the pad 114 of supersonic generator 113, via bonding line
132 are connected to flexible PCB 120.Bonding line 132 can be gold thread, alloy wire or copper cash.In this embodiment, circuit layer
112 and supersonic generator 113 can via the surface of supersonic generator 113 pad 114 and bonding line 132 and flexible electrical
Road plate 120 is electrically connected.
The flexible PCB 120 provides the connection between circuit layer 112 and supersonic generator 113 and external circuit.It is soft
Property circuit board 120 include each other relative first surface and second surface, wherein first surface adjoining supersonic generator 113,
Second surface contiguous metal substrate 130.Wiring and pad are formed on the first surface of flexible PCB 120.The flexible circuit
The different zones of the first surface of plate 120 are used to connect supersonic generator 113 and form pad, so that pad is sudden and violent
Reveal for being bonded.The bonding line 132 via supersonic generator 113 side, from the first surface of supersonic generator 113
The pad that extends on the first surface of flexible PCB 120 of pad 114.Then, using the covering ultrasonic wave hair of encapsulating compound 123
The side of raw device 113, at least partly covering pad 114 and bonding line 132, so that fixed and protection bonding line 132.
Preferably, metal substrate 130 is L-shaped, including the Part I 130a extended laterally and second of Longitudinal extending
Divide 130b.Part II 130b bearing of trend is parallel for example with the side of supersonic generator 113, so as to be sent out with ultrasonic wave
The space of weld zone is limited between the side of raw device 113, at least partly accommodating bonding line 132 and encapsulating compound 123.The space
The lateral dimension of the weld zone on the first surface of flexible PCB 120 can be reduced, and making for encapsulating compound 123 can be reduced
Consumption and the mechanical protection effect for improving bonding line 123.Preferably, Part II 130b height reaches supersonic generator
/ to two/5th of 113 thickness calculated from second surface.
In this embodiment, anisotropy conductiving glue 121 is substituted using bonding line 132, for circuit layer 112 and ultrasonic wave
Electrical connection between generator 113 and flexible PCB 120.Flexible PCB 120 further realizes that external circuit is electrically connected, example
Such as outside signal drive circuit or signal processing circuit.
For form adhesion technique that the ultrasonic sensor of the embodiment uses and bonding technology be it is known in the art,
It will not be described in detail herein.
In above-mentioned supersonic sensing device assembly, two apparent surfaces of flexible PCB 120 are adhered to ultrasound respectively
Wave producer 113 and metal substrate 130, due to that can use common adhesive, rather than each guide property conducting resinl, therefore can be with
Reduce the volume of supersonic sensing device assembly and improve packaging efficiency.
Fig. 3 a to 3e show a part in the manufacture method of supersonic sensing device assembly according to a second embodiment of the present invention
The schematic cross-section in stage.
For brevity, structure and its connection of supersonic generator 113 and flexible PCB 120 are only shown in figure
Mode, and the detailed construction of not shown reflected signal receiving layer 111 and circuit layer 112.It is appreciated that reflected signal receiving layer
Wiring layer connection can be utilized between 111 and circuit layer 112.
As shown in Figure 3 a, the primary structure of chip 110 has been formed.Chip 110 includes the reflection letter stacked gradually successively
Number receiving layer 111, circuit layer 112 and supersonic generator 113.Reflected signal receiving layer 111 is for example including multiple pixel cells
Induction electrode.Circuit layer 112 is, for example, thin-film transistor array base-plate, including the multiple films formed on the glass substrate are brilliant
Body pipe, the ultrasonic reflections signal for optionally obtaining corresponding pixel cell.Supersonic generator 113 is for example including folder
Piezoelectric layer between two driving electrodes.Under the electric field action that driving electrodes apply, electric signal is transformed into machine by piezoelectric layer
Tool vibrates, so as to produce ultrasonic wave.
Piezoelectric layer is the functional layer of supersonic generator 113, for example, be made up of inorganic piezoelectric material or organic piezoelectric materials,
Inorganic piezoelectric material is included selected from barium titanate (BT), lead zirconate titanate (PZT), modified lead zirconate titanate, lead meta-columbute, lead niobate barium-lithium
(PBLN), one kind in modified lead titanate (PT), organic piezoelectric materials include selected from polyvinylidene fluoride (PVDF), gather inclined difluoro
Ethylene-trifluoroethylene (PVDF-TrFe), polytetrafluoroethylene (PTFE) (PTFE), polyvinylide pie (PVDC), bromination diisopropylamine
(DIPAB) one kind in.
Supersonic generator 113 includes each other relative first surface and second surface, wherein first surface adjoining circuit
Layer 112.Wiring and pad are formed on the first surface of supersonic generator 113, for example, pad 114.The supersonic generator
The different zones of 113 first surface are used to connect circuit layer 112 and form pad 114, so that pad 114 exposes
For being bonded.
Further, circuit layer 112 and supersonic generator 113 can via supersonic generator 113 first surface
The pad 114 that is each connected to of wiring.
Then, flexible PCB 120 is fixed on metal substrate 130 using adhesive 131, as shown in Figure 3 b.
Flexible PCB 120 includes each other relative first surface and second surface, and wherein first surface will be used to support
Supersonic generator 113, second surface contiguous metal substrate 130.On the first surface of flexible PCB 120 formed wiring and
Pad.The different zones of the first surface of the flexible PCB 120 are respectively used to support supersonic generator 113 and for being formed
Pad, so that pad is exposed for being bonded.
Preferably, metal substrate 130 is L-shaped, including the Part I 130a extended laterally and second of Longitudinal extending
Divide 130b.As described below, Part II 130b will be formed together with supersonic generator 113 for accommodating bonding line and envelope
The space of charging.
Then, chip 110 is fixed in flexible PCB 120 using adhesive 122, as shown in Figure 3 c.In the step
In, the supersonic generator 113 in chip 110 is connected to flexible PCB 120 using adhesive 122.Due to adhesive 122 only
Need only provide for being mechanically fixed effect, without providing electrical connection, therefore replace each to different using common adhesive in this step
Property conducting resinl.
In a preferred embodiment, metal substrate 130 is L-shaped.The Part II 130b of metal substrate 130 bearing of trend example
It is parallel such as with the side of supersonic generator 113, so as to limit the sky of weld zone between the side of supersonic generator 113
Between.Preferably, Part II 130b height reaches 1/5th of the thickness that supersonic generator 113 is calculated from second surface
To 1/2nd.
Then, the pad 114 of supersonic generator 113 is connected to by flexible PCB 120 using bonding line 132, such as schemed
Shown in 3d.The step can realize the connection of bonding line 132 using conventional bonding technology, and this is no longer described in detail.
Bonding line 132 can be gold thread, alloy wire or copper cash.In this embodiment, circuit layer 112 and ultrasonic wave occur
Device 113 can be electrically connected via the pad 114 and bonding line 132 on the surface of supersonic generator 113 with flexible PCB 120.
In above-mentioned preferred embodiment, metal substrate 130 is L-shaped.The Part II 130b of metal substrate 130 and ultrasonic wave
The weld zone limited between the side of generator 130 is used to accommodate bonding line 120, can not only reduce flexible PCB 120
The lateral dimension of weld zone on first surface, and the mechanical protection effect of bonding line 123 can be improved.
Then, the side of supersonic generator 113 is covered using encapsulating compound 123, so as to form supersonic sensing device assembly
200, as shown in Figure 3 e.Encapsulating compound 123 at least partly covers pad 114 and bonding line 132, so that fixed and protection bonding line
132。
Circuit layer 112 and supersonic generator 113 in chip 110 is via the first surface of supersonic generator 113
On pad 114 and bonding line 132 be connected with flexible PCB 120.Flexible PCB 120 further realizes external circuit electricity
Connection, such as externally connected signal drive circuit or signal processing circuit.
The adhesive 122 between supersonic generator 113 and flexible PCB 120 in chip 110 needs only to provide
Effect is mechanically fixed, without providing electrical connection, therefore anisotropy conductiving glue is replaced using common adhesive in this embodiment.
It should be noted that herein, such as first and second or the like relational terms are used merely to a reality
Body or operation make a distinction with another entity or operation, and not necessarily require or imply these entities or deposited between operating
In any this actual relation or order.Moreover, term " comprising ", "comprising" or its any other variant are intended to
Nonexcludability is included, so that process, method, article or equipment including a series of key elements not only will including those
Element, but also other key elements including being not expressly set out, or also include being this process, method, article or equipment
Intrinsic key element.In the absence of more restrictions, the key element limited by sentence "including a ...", it is not excluded that
Also there is other identical element in process, method, article or equipment including the key element.
According to embodiments of the invention as described above, these embodiments do not have all details of detailed descriptionthe, not yet
It is only described specific embodiment to limit the invention.Obviously, as described above, it can make many modifications and variations.This explanation
Book is chosen and specifically describes these embodiments, is in order to preferably explain the principle and practical application of the present invention, so that affiliated
Technical field technical staff can be used using modification of the invention and on the basis of the present invention well.The present invention is only by right
The limitation of claim and its four corner and equivalent.
Claims (18)
1. a kind of supersonic sensing device assembly, including：
Metal substrate；
Flexible PCB, including each other relative first surface and second surface, the second surface are fixed on the Metal Substrate
On plate；And
Chip, the chip is fixed on the first surface of the flexible PCB, and the ultrasonic wave hair including stacking gradually
Raw device and circuit layer,
Wherein, the first surface of the flexible PCB includes the first wiring and the first pad, the supersonic generator and institute
The first surface adjoining of flexible PCB is stated,
The supersonic generator and the circuit layer are connected to first pad via bonding line respectively.
2. supersonic sensing device assembly according to claim 1, wherein, the first surface of the flexible PCB and second
First adhesive is respectively adopted in surface and second adhesive is bonded on the chip and the metal substrate.
3. supersonic sensing device assembly according to claim 2, wherein, the first adhesive and the second adhesive
It is merely provided for being mechanically fixed.
4. supersonic sensing device assembly according to claim 2, wherein, the first surface of the flexible PCB includes position
In the first area of diverse location and second area, wherein, the first area of the first surface of the flexible PCB is used
In bonding the chip, the second area includes first pad, is used as weld zone.
5. supersonic sensing device assembly according to claim 4, wherein, the supersonic generator includes and the circuit
The 3rd adjacent surface of layer, the 3rd surface of the supersonic generator includes the second wiring and the second pad,
Wherein, the second pad of the supersonic generator is connected to the first pad of the flexible PCB via bonding line.
6. supersonic sensing device assembly according to claim 5, in addition to：First encapsulating compound, is at least partly covered described
The side of bonding line and the supersonic generator.
7. supersonic sensing device assembly according to claim 6, wherein, the metal substrate is L-shaped, including is extended laterally
Part I and Longitudinal extending Part II, Part II shape together with the side of the supersonic generator
Into at least one of space for accommodating the bonding line and first encapsulating compound.
8. supersonic sensing device assembly according to claim 7, wherein, the height of the Part II of the metal substrate reaches
To 1/1st to two/5th position of the thickness of the supersonic generator.
9. supersonic sensing device assembly according to claim 1, in addition to：Reflected signal on the circuit layer connects
Receive layer.
10. supersonic sensing device assembly according to claim 1, wherein, the circuit layer includes glass substrate and is located at
Multiple thin film transistor (TFT)s on the glass substrate,
Wherein, the supersonic generator includes multiple pixel cells, and the multiple thin film transistor (TFT) is used to optionally obtain
The ultrasonic reflections signal of the multiple pixel cell.
11. a kind of method for manufacturing supersonic sensing device assembly, including：
Chip is formed, the chip includes the supersonic generator and circuit layer stacked gradually；
Fixing flexible circuit board on metallic substrates；
The fixed chip on flexible PCB；And
The chip is connected with flexible PCB,
Wherein, the flexible PCB includes each other relative first surface and second surface, the first of the flexible PCB
Surface includes the first wiring and the first pad, and the first surface of the supersonic generator and the flexible PCB is abutted,
The supersonic generator and the circuit layer are connected to first pad via bonding line respectively.
12. method according to claim 11, wherein, the chip is connected with flexible PCB, including use
One adhesive bonds the first surface of the flexible PCB on the chip.
13. method according to claim 12, in addition to, using second adhesive by the second table of the flexible PCB
Face is bonded on metallic substrates.
14. method according to claim 13, wherein, the first adhesive and the second adhesive are merely provided for
It is mechanically fixed.
15. method according to claim 14, wherein, the first surface of the flexible PCB includes being located at diverse location
First area and second area, wherein, the first area of the first surface of the flexible PCB is used to bonding described
Chip, the second area includes first pad, is used as weld zone.
16. method according to claim 15, in addition to, super ask finger acoustic wave transducer to be connected to by described using bonding line
First pad.
17. method according to claim 16, in addition to, using the first encapsulating compound at least partly cover the bonding line and
The side of the supersonic generator.
18. method according to claim 17, wherein, the metal substrate is L-shaped, including the Part I extended laterally
With the Part II of Longitudinal extending, it is described that the Part II forms receiving together with the side of the supersonic generator
At least one of space of bonding line and first encapsulating compound.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710570888.6A CN107172812B (en) | 2017-07-13 | 2017-07-13 | Ultrasonic sensor assembly and method of manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710570888.6A CN107172812B (en) | 2017-07-13 | 2017-07-13 | Ultrasonic sensor assembly and method of manufacture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107172812A true CN107172812A (en) | 2017-09-15 |
| CN107172812B CN107172812B (en) | 2023-08-11 |
Family
ID=59818507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710570888.6A Active CN107172812B (en) | 2017-07-13 | 2017-07-13 | Ultrasonic sensor assembly and method of manufacture |
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| CN107172812B (en) | 2023-08-11 |
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