CN218525127U - Ultrasonic fingerprint identification module and device - Google Patents
Ultrasonic fingerprint identification module and device Download PDFInfo
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- CN218525127U CN218525127U CN202222627004.5U CN202222627004U CN218525127U CN 218525127 U CN218525127 U CN 218525127U CN 202222627004 U CN202222627004 U CN 202222627004U CN 218525127 U CN218525127 U CN 218525127U
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Abstract
The application relates to the field of fingerprint identification, and discloses an ultrasonic fingerprint identification module and an ultrasonic fingerprint identification device, which comprise a medium layer, a silicon-based substrate layer and an ultrasonic sensing module which are arranged in a stacked manner; the surface of the dielectric layer, which is far away from the silicon-based substrate layer, is a touch surface contacted by a finger; the ultrasonic sensing module comprises a piezoelectric layer, a driving electrode and a receiving electrode, wherein the driving electrode and the receiving electrode are respectively arranged on two opposite surfaces of the piezoelectric layer. In this application ultrasonic fingerprint identification module, the silicon substrate layer is located between dielectric layer and the ultrasonic sensing module, the silicon substrate layer and the tight laminating of ultrasonic sensing module are together, can have certain clearance when assembling between ultrasonic fingerprint identification module and other parts, ultrasonic sensing module can be to the orientation vibration of keeping away from the silicon substrate layer, also to the clearance orientation vibration between other parts, thereby avoid making the cavity in ultrasonic fingerprint identification module, simplify the preparation technology, reduce cost.
Description
Technical Field
The application relates to the field of fingerprint identification, in particular to an ultrasonic fingerprint identification module and device.
Background
Ultrasonic fingerprint identification technique passes through the ultrasonic wave (the frequency is higher than 20 kHz's sound wave) and discerns the verification to the fingerprint, and the ultrasonic wave can pierce through materials such as glass, aluminium, stainless steel, sapphire or plastics and scan the fingerprint to the precision of scanning fingerprint also receives the influence of finger dirt, grease and sweat very little, and the recognition effect is more stable and accurate.
MEMS (Micro-Electro-Mechanical systems) ultrasonic fingerprinting is a commonly used solution at present. MEMS Ultrasonic wave fingerprint identification module is including the dielectric layer, ultrasonic sensor and the silicon substrate layer of range upon range of setting, and the silicon substrate layer sets up the one side of keeping away from the finger at Ultrasonic sensor, and MEMS Ultrasonic wave fingerprint identification module contains two kinds again, one kind need form the cavity of PMUT (Piezoelectric micro-machined Ultrasonic Transducer), another kind need form the cavity of CMUT (capacitive micro-machined Ultrasonic Transducer). The cavity is formed in such a way that the sensor can vibrate after receiving a driving signal, so as to generate an ultrasonic signal, and then transmits the ultrasonic wave to the finger of a user, the ultrasonic wave is reflected by the finger to generate a reflected ultrasonic signal, and the sensor receives the reflected ultrasonic signal to generate a sensing signal, so as to generate fingerprint information corresponding to the finger. However, the process required for forming the cavity is very complicated, which results in high manufacturing cost of the MEMS ultrasonic fingerprint identification module.
Therefore, how to solve the above technical problems should be a great concern to those skilled in the art.
SUMMERY OF THE UTILITY MODEL
The utility model provides an ultrasonic fingerprint identification module and device to reduce the cost of ultrasonic fingerprint identification module.
For solving the technical problem, the application provides an ultrasonic fingerprint identification module, include:
the ultrasonic sensor comprises a dielectric layer, a silicon substrate layer and an ultrasonic sensing module which are arranged in a stacked manner;
the surface of the dielectric layer, which is far away from the silicon-based substrate layer, is a touch surface contacted by a finger;
the ultrasonic sensing module comprises a piezoelectric layer, a driving electrode and a receiving electrode, wherein the driving electrode and the receiving electrode are respectively arranged on two opposite surfaces of the piezoelectric layer.
Optionally, in the ultrasonic fingerprint identification module, the driving electrode is disposed on one side of the piezoelectric layer, which is far away from the silicon substrate layer, and the receiving electrode is disposed on one side of the piezoelectric layer, which is close to the silicon substrate layer.
Optionally, among the ultrasonic fingerprint identification module, still include:
and the anti-oxidation layer is arranged on one side of the driving electrode, which is far away from the piezoelectric layer.
Optionally, in the ultrasonic fingerprint identification module, the receiving electrode is disposed on one side of the piezoelectric layer, which is far away from the silicon substrate layer, and the driving electrode is disposed on one side of the piezoelectric layer, which is close to the silicon substrate layer.
Optionally, in the ultrasonic fingerprint identification module, the receiving electrodes are distributed in a pixel manner.
Optionally, in the ultrasonic fingerprint identification module, the driving electrode is an integral electrode.
The application also provides an ultrasonic fingerprint identification device, which comprises a driving circuit, a detection circuit and any one of the ultrasonic fingerprint identification modules; drive circuit with drive electrode in the ultrasonic fingerprint identification module is connected, detection circuitry with the receiving electrode of ultrasonic fingerprint identification module is connected.
Optionally, the ultrasonic fingerprint identification apparatus further includes:
the fingerprint chip, drive circuit with detection circuitry all integrates in the fingerprint chip.
Optionally, the ultrasonic fingerprint identification apparatus further includes:
the shell is used for containing the shell of ultrasonic fingerprint identification module, the shell with there is the clearance between the ultrasonic fingerprint identification module.
The application provides an ultrasonic fingerprint identification module, include: the ultrasonic sensor comprises a dielectric layer, a silicon substrate layer and an ultrasonic sensing module which are arranged in a stacked manner; the surface of the dielectric layer, which is far away from the silicon-based substrate layer, is a touch surface contacted by fingers; the ultrasonic sensing module comprises a piezoelectric layer, a driving electrode and a receiving electrode, wherein the driving electrode and the receiving electrode are respectively arranged on two opposite surfaces of the piezoelectric layer.
It is thus clear that ultrasonic fingerprint identification module includes dielectric layer, silica-based substrate layer and ultrasonic sensing module in this application, and the surface that silica-based substrate layer was kept away from to the dielectric layer is the touch surface of finger contact, and silica-based substrate layer is located between dielectric layer and the ultrasonic sensing module, so silica-based substrate layer sets up in ultrasonic sensing module to one side of finger transmission ultrasonic wave, also the silica-based substrate layer sets up the one side that leans on the finger at ultrasonic sensing module. Silicon substrate layer and dielectric layer, the tight lamination of ultrasonic sensing module are together, do not have the space, can have certain clearance when assembling between ultrasonic fingerprint identification module and other parts, and ultrasonic sensing module can vibrate to the direction of keeping away from silicon substrate layer, also vibrates to the clearance direction between other parts to avoid making the cavity in ultrasonic fingerprint identification module, simplify the preparation technology, reduce cost.
In addition, the application also provides a fingerprint identification device with the advantages.
Drawings
For a clearer explanation of the embodiments or technical solutions of the prior art of the present application, the drawings needed for the description of the embodiments or prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an ultrasonic fingerprint identification module according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of another ultrasonic fingerprint identification module according to an embodiment of the present disclosure;
FIG. 3 is an exploded view of an ultrasonic fingerprint identification device provided in accordance with FIG. 1;
in the figure, 1, a silicon substrate layer, 2, an ultrasonic sensing module, 21, a receiving electrode, 22, a piezoelectric layer, 23, a driving electrode, 3, an anti-oxidation layer, 4, a detection circuit, 5, a driving circuit and 6, a dielectric layer.
Detailed Description
In order that those skilled in the art will better understand the disclosure, the following detailed description will be given with reference to the accompanying drawings. It should be apparent that the described embodiments are only a few embodiments of the present application, and not all embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, other ways of implementing the invention may be devised different from those described herein, and it will be apparent to those skilled in the art that the invention can be practiced without departing from the spirit and scope of the invention.
As described in the background section, at present, an MEMS ultrasonic fingerprint recognition module includes a dielectric layer, an ultrasonic sensor, and a silicon substrate layer stacked together, where the sensor generates vibration after receiving a driving signal, thereby generating an ultrasonic signal, and further transmits the ultrasonic wave to a finger placed on the surface of the dielectric layer, and the ultrasonic wave is reflected by the finger to generate a reflected ultrasonic signal, and the sensor receives the reflected ultrasonic signal to generate a sensing signal, thereby generating fingerprint information corresponding to the finger.
The ultrasonic fingerprint identification technology mainly utilizes different interfaces formed by fingerprints on the surface of a fingerprint identification area, as shown in figure 1. When the ultrasonic wave reaches the interface, echo signal characteristics of the ultrasonic wave at the interface are different due to the difference of acoustic impedance of the interface medium. The ultrasonic sensor detects the electric signals generated by the characteristic difference of the echo signals, so that the information of ridge lines and valley lines of fingerprints can be obtained, and the fingerprint detection is realized. By extracting and analyzing the ultrasonic echo signals for multiple times, the information of the dermis can be obtained, living body judgment and extraction of physiological characteristics of the dermis are further completed, and 3D fingerprint detection is realized.
In view of the above, the present application provides an ultrasonic fingerprint identification module, please refer to fig. 1 to 2, which includes:
the ultrasonic sensor comprises a dielectric layer 6, a silicon substrate layer 1 and an ultrasonic sensing module 2 which are arranged in a stacked manner;
the surface of the dielectric layer 6, which is far away from the silicon-based substrate layer 1, is a touch surface contacted by a finger;
the ultrasonic sensing module 2 comprises a piezoelectric layer 22, and a driving electrode 23 and a receiving electrode 21 respectively arranged on two opposite surfaces of the piezoelectric layer 22.
The driving electrode 23 is used for receiving a high-frequency high-voltage ultrasonic driving signal (TX signal) to cause the piezoelectric layer 22 to vibrate at high frequency and emit ultrasonic waves, wherein the frequency and amplitude of the driving signal are adjustable; when the ultrasonic wave meets the finger to reflect the ultrasonic echo signal, the receiving electrode 21 receives the ultrasonic echo signal and transmits the ultrasonic echo signal to the detection circuit, so as to extract and detect the fingerprint information to be identified.
The dielectric layer 6 includes, but is not limited to, a glass layer, a transparent film layer, and a mylar layer. The dielectric layer 6 may be a single dielectric or a composite dielectric. For example, the dielectric layer 6 is formed by bonding a copper-based PSA (pressure sensitive adhesive) tape and a TFT (Thin Film Transistor) layer, and the TFT layer and the silicon-based substrate are bonded by the copper-based PSA tape.
The silicon substrate layer 1 can be realized by directly adopting a mature silicon-based process, and has the characteristics of compact whole and small area, so that the ultrasonic fingerprint identification module has high integration level.
The driving electrode 23 may be a one-piece electrode and made of a metal material, such as a silver electrode; the receiving electrode 21 may be an ITO (Indium Tin oxide) electrode or an electrode formed by other conductive materials, and the receiving electrodes 21 are distributed in a pixel manner, that is, in an array manner. The accuracy of fingerprint recognition can be adjusted by the size of the receiving electrode 21, and by setting the size of the receiving electrode 21, one valley-ridge period of a fingerprint corresponds to a plurality of electrical receiving electrodes 21.
It is to be noted that the piezoelectric layer 22 is not limited in the present application as long as it is a material having a piezoelectric effect.
Furthermore, the ultrasonic fingerprint identification module can further comprise an anti-oxidation layer 3 arranged on one side of the driving electrode 23, which is far away from the piezoelectric layer 22, so as to absorb ultrasonic echo signals, weaken the interference of the ultrasonic echo to the signals and avoid the driving electrode 23 from being oxidized. Furthermore, the anti-oxidation layer 3 can increase damping and prevent over-oscillation.
In the present application, the positions of the driving electrode 23 and the receiving electrode 21 are not limited, and may be set by themselves. The following are described separately.
As an implementation manner, as shown in fig. 1, the driving electrode 23 is disposed on a side of the piezoelectric layer 22 away from the silicon-based substrate layer 1, and the receiving electrode 21 is disposed on a side of the piezoelectric layer 22 close to the silicon-based substrate layer 1.
In this embodiment, the distance between the receiving electrode 21 and the fingerprint to be identified is shorter, the propagation path of the ultrasonic echo signal is shorter when the ultrasonic echo signal is received by the receiving electrode 21, the energy of the ultrasonic echo signal received by the receiving electrode 21 is higher, and the fingerprint identification is facilitated.
As another possible implementation manner, as shown in fig. 2, the receiving electrode 21 is disposed on a side of the piezoelectric layer 22 away from the silicon-based substrate layer 1, and the driving electrode 23 is disposed on a side of the piezoelectric layer 22 close to the silicon-based substrate layer 1.
Ultrasonic wave fingerprint identification module includes dielectric layer 6, silicon substrate layer 1 and ultrasonic sensing module 2 in this application, and the surface that dielectric layer 6 keeps away from silicon substrate layer 1 is the touch-sensitive surface of finger contact, and silicon substrate layer 1 is located between dielectric layer 6 and the ultrasonic sensing module 2, so silicon substrate layer 1 sets up in ultrasonic sensing module 2 to the one side of waiting to discern fingerprint transmission ultrasonic wave, also silicon substrate layer 1 sets up in ultrasonic sensing module 2 one side that is close to waiting to discern the fingerprint promptly. Silicon substrate layer 1 and dielectric layer 6, the tight lamination of ultrasonic sensing module 2 are together, do not have the space, can have certain clearance when assembling between ultrasonic fingerprint identification module and other parts, and ultrasonic sensing module 2 can vibrate to the direction of keeping away from silicon substrate layer 1, also vibrates to the clearance direction between other parts to avoid making the cavity in ultrasonic fingerprint identification module, simplify the preparation technology, reduce cost. In addition, ultrasonic fingerprint identification module in this application is MEMS ultrasonic fingerprint identification module, has the advantage of drive voltage low, high performance equally.
The following describes a manufacturing process of the ultrasonic fingerprint identification module in the present application.
and 4, sputtering the piezoelectric material film by adopting a sputtering method to form a whole layer of silver electrode.
The present application further provides an ultrasonic fingerprint identification apparatus, please refer to fig. 3, which includes a driving circuit, a detecting circuit and the ultrasonic fingerprint identification module according to any of the above embodiments; drive circuit 5 with drive electrode 23 in the ultrasonic fingerprint identification module is connected, detection circuitry 4 with receiving electrode 21 of ultrasonic fingerprint identification module is connected.
The detection circuit 4 is used to detect the electrical signal generated by the ultrasonic echo on the piezoelectric layer 22.
The detection circuits 4 may be disposed on the silicon substrate layer 1, the receiving electrodes 21 are distributed in a pixel manner, and the detection circuits 4 are also distributed in a pixel manner and correspond to the receiving electrodes 21 one by one.
The driving circuit 5 is used for driving the piezoelectric layer 22 to generate a driving signal, so as to excite the piezoelectric layer 22 to vibrate to generate ultrasonic waves, and the driving circuit 5 can be a TX chip.
It should be noted that, in the ultrasonic fingerprint identification apparatus, the dielectric layer may be located on the front, back, side, etc. of the ultrasonic fingerprint identification apparatus, and all fall within the protection scope of the present application.
On the basis of the foregoing embodiment, in an embodiment of the present application, the ultrasonic fingerprint identification device may further include:
the fingerprint chip, drive circuit 5 with detection circuit all integrates in the fingerprint chip.
On the basis of any one of the above embodiments, in an embodiment of the present application, the ultrasonic fingerprint identification device may further include:
be used for holding the shell of ultrasonic fingerprint identification module, the shell with there is the clearance between the ultrasonic fingerprint identification module.
The required cavity of ultrasonic fingerprint identification module vibration can be regarded as in the clearance between shell and the ultrasonic fingerprint identification module.
In the present specification, the embodiments are described in a progressive manner, and each embodiment focuses on differences from other embodiments, and the same or similar parts between the embodiments are referred to each other.
The ultrasonic fingerprint identification module, the ultrasonic fingerprint identification device and the electronic equipment provided by the application are described in detail above. The principles and embodiments of the present application are explained herein using specific examples, which are provided only to help understand the method and the core idea of the present application. It should be noted that, for those skilled in the art, without departing from the principle of the present application, the present application can also make several improvements and modifications, and those improvements and modifications also fall into the protection scope of the claims of the present application.
Claims (9)
1. The utility model provides an ultrasonic fingerprint identification module which characterized in that includes:
the ultrasonic sensor comprises a dielectric layer, a silicon substrate layer and an ultrasonic sensing module which are arranged in a stacked manner;
the surface of the dielectric layer, which is far away from the silicon-based substrate layer, is a touch surface contacted by a finger;
the ultrasonic sensing module comprises a piezoelectric layer, and a driving electrode and a receiving electrode which are respectively arranged on two opposite surfaces of the piezoelectric layer.
2. The ultrasonic fingerprint recognition module of claim 1, wherein said driving electrodes are disposed on a side of said piezoelectric layer away from said silicon-based substrate layer, and said receiving electrodes are disposed on a side of said piezoelectric layer close to said silicon-based substrate layer.
3. The ultrasonic fingerprint identification module of claim 2 further comprising:
and the anti-oxidation layer is arranged on one side, away from the piezoelectric layer, of the driving electrode.
4. The ultrasonic fingerprint identification module of claim 1, wherein the receiving electrode is disposed on a side of the piezoelectric layer away from the silicon-based substrate layer, and the driving electrode is disposed on a side of the piezoelectric layer close to the silicon-based substrate layer.
5. The ultrasonic fingerprint identification module of claim 1 wherein the receiving electrodes are distributed in pixels.
6. The ultrasonic fingerprint recognition module of claim 1, wherein the drive electrode is a one-piece electrode.
7. An ultrasonic fingerprint identification device, which is characterized by comprising a driving circuit, a detection circuit and the ultrasonic fingerprint identification module set as claimed in any one of claims 1 to 6; the drive circuit with drive electrode in the ultrasonic fingerprint identification module is connected, detection circuitry with the receiving electrode of ultrasonic fingerprint identification module is connected.
8. The ultrasonic fingerprint recognition device of claim 7, further comprising:
the fingerprint chip, drive circuit with detection circuitry all integrates in the fingerprint chip.
9. The ultrasonic fingerprint recognition apparatus as set forth in claim 7 or 8, further comprising:
be used for holding the shell of ultrasonic fingerprint identification module, the shell with there is the clearance between the ultrasonic fingerprint identification module.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222627004.5U CN218525127U (en) | 2022-09-30 | 2022-09-30 | Ultrasonic fingerprint identification module and device |
| TW112200313U TWM642391U (en) | 2022-09-30 | 2023-01-10 | Ultrasonic fingerprint recognition module and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222627004.5U CN218525127U (en) | 2022-09-30 | 2022-09-30 | Ultrasonic fingerprint identification module and device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218525127U true CN218525127U (en) | 2023-02-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222627004.5U Active CN218525127U (en) | 2022-09-30 | 2022-09-30 | Ultrasonic fingerprint identification module and device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN218525127U (en) |
| TW (1) | TWM642391U (en) |
-
2022
- 2022-09-30 CN CN202222627004.5U patent/CN218525127U/en active Active
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- 2023-01-10 TW TW112200313U patent/TWM642391U/en unknown
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| Publication number | Publication date |
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| TWM642391U (en) | 2023-06-11 |
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