CN106951887B - Micro-capacitance ultrasonic transducer linear array device for identification - Google Patents
Micro-capacitance ultrasonic transducer linear array device for identification Download PDFInfo
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- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
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Abstract
The invention discloses a micro-capacitance ultrasonic transducer linear array device for identification, which comprises a shell (7), wherein an array chip PCB (printed circuit board) lead plate (4) is arranged in the shell (7), the upper surface of the array chip PCB lead plate (4) is electrically connected with a CMUT (micro acoustic transducer) array chip (3), sound-transmitting reinforced glass (1) is hermetically arranged in front of the CMUT array chip (3) on the shell (7), and a silicon oil sound-transmitting medium (2) is filled between the CMUT array chip (3) and the sound-transmitting reinforced glass (1). The device has the advantages of simple structure, miniaturization, low cost, easy array processing, suitability for mass production and the like, can realize the non-hole type design of the intelligent terminal shell, and improves the waterproof and dustproof performance of the intelligent terminal; meanwhile, the identification precision, efficiency and safety and reliability of wet hand and underwater fingerprint identification are effectively improved.
Description
Technical Field
The invention relates to a Micro-capacitance ultrasonic transducer array in the field of MEMS (Micro-Electro-Mechanical System) sensors, in particular to a Micro-capacitance ultrasonic transducer linear array device for fingerprint identification of a waterproof intelligent terminal, which can realize three-dimensional imaging and identification of fingerprints and a skin bottom layer structure thereof in a wet hand state and an underwater environment.
Background
With the advent of the internet communication and information-oriented times, more and more high-tech intelligent products (mobile phones, tablet computers, notebooks and the like) are widely applied to daily life, and the convenience and rapidness brought by mobile information communication enable the use of intelligent terminals for storing privacy information and managing electronic property to be common phenomena, and meanwhile, the increasingly prominent potential safety hazard of identity verification and identification is brought, just as the traditional 'account number + password' and magnetic card identity verification and identification methods have the problems of forgetting, losing, copying, revealing, breaking, stealing and the like. Biometric identification techniques (fingerprints, irises, DNA, handwriting, gait, etc.) are increasingly the focus of research by people as more convenient, safe and reliable identification techniques. Among numerous biometric identification technologies, fingerprint attributes have characteristics of uniqueness, invariance, convenience, ten-finger combination safety, easy acquisition and storage and the like, so that the fingerprint identification technology becomes the most extensive and mature identity identification technology applied to mobile intelligent terminals at present.
The most important and foremost task of a fingerprint identification system is how to efficiently, conveniently and reliably acquire rich fingerprint characteristic information. With the explosive situation increase of the fingerprint identification technology in the intelligent terminal in recent years, the requirements of people on the fingerprint acquisition sensing unit are higher and higher, and the large-area fingerprint acquisition sensing unit in the optical identification is difficult to use in the mobile intelligent terminal due to the limitation of the cost and the size of the intelligent terminal; capacitive identification's integrated small area low cost's semiconductor fingerprint collection sensing unit becomes the mainstream technique for current market mobile intelligent terminal fingerprint identification, however along with people's use, new shortcoming exposes once more, because the electric capacity signal is more weak, electric capacity fingerprint collection technique needs to point as far as possible with the sensing unit usually, information collection receives the interference of finger condition (greasy, sweat stain, wet) very easily, gather environmental restriction (like waterproof cell-phone, the camera, the wrist-watch is difficult to discern under water), bring very big use puzzlement for the user, often appear discernment inefficiency, the problem that the discernment rate of accuracy is low, the phenomenon that does not discern appears even. In view of the above problems, an ultrasonic fingerprint acquisition technology is proposed. The ultrasonic fingerprint collection technology utilizes the characteristics of good ultrasonic directionality, strong penetrating power, no harm to human bodies and the like, combines the feedback principle of the difference of fingerprint ridges and valleys in a detection area and even sweat pores on the sound wave impedance, and realizes fingerprint characteristic collection by transmitting and receiving ultrasonic signals through an ultrasonic fingerprint sensor. Because the acoustic impedance is close mutually, the ultrasonic wave of supersound fingerprint sensor transmission can better pierce through common spot, grease, liquid on the finger and the intelligent terminal shell of being made by glass, stainless steel or plastics, combines the strong advantage of supersound directive property simultaneously, can better realize pressing the deformation problem to fingerprint and the collection of bottom organizational structure three-dimensional characteristic information, has avoided close contact two-dimentional fingerprint characteristic collection line, has increased substantially the fingerprint matching rate. Although the ultrasonic fingerprint collection technology has many advantages in the application of intelligent terminal fingerprint identification, the ultrasonic fingerprint collection technology still cannot replace the existing contact type fingerprint identification technology to be popularized and applied after years of research, and the main reasons are that the content of the miniaturization processing technology of the ultrasonic fingerprint sensor is high, the problems of high process difficulty and high cost exist in manufacturing a plurality of high-consistency and miniaturized array elements, and the requirements of the intelligent terminal on the synchronous development of the fingerprint collection technology in the aspects of high precision, miniaturization, low power consumption and the like are difficult to meet.
Disclosure of Invention
The invention aims to provide an identification device utilizing a Capacitive MEMS (micro electro mechanical System) Ultrasonic sensor (CMUT) based on the characteristics of miniaturization, low cost, easiness in batch processing, integration and the like of an MEMS technology, and the identification device can realize the collection and identification of wet hand and underwater fingerprint characteristic information.
The invention is realized by adopting the following technical scheme:
a micro-capacitance ultrasonic transducer linear array device for identification comprises a shell, wherein an array chip PCB (printed Circuit Board) is installed in the shell, the upper surface of the array chip PCB is electrically connected with a CMUT (micro-machined) array chip, sound-transmitting reinforced glass is hermetically installed in front of the CMUT array chip on the shell, and a silicon oil sound-transmitting medium is filled between the CMUT array chip and the sound-transmitting reinforced glass; a copper foil for shielding interference signals is packaged on the back of the array chip PCB lead plate in the shell, and an epoxy resin lined sound absorption material is packaged around the array chip PCB lead plate and the copper foil in the shell; and the lead-out wire of the array chip PCB lead device penetrates out of the shell.
The CMUT linear array chip comprises a common silicon substrate, an integrated lower electrode is arranged on the lower surface of the common silicon substrate, an oxide layer is arranged on the upper surface of the common silicon substrate, a plurality of cylindrical cavities are formed in the upper surface of the oxide layer, the cylindrical cavities are arranged in rows and columns, a vibrating membrane is bonded to the upper surface of the oxide layer, an isolating layer is arranged on the upper surface of the vibrating membrane, sunken isolating grooves are formed around the peripheral edges of the isolating layer, the bottom of each isolating groove is formed in the oxide layer (the isolating grooves are used for isolating the array elements) after the isolating layer and the vibrating membrane penetrate through the isolating layer, the cylindrical cavities in the oxide layer are located in the isolating grooves, patterned upper electrodes are formed on the upper surface of the isolating layer at positions opposite to the centers of the cylindrical cavities, one upper surface of the isolating layer is located at each of two end edges of each array element, metal leads are interconnected between adjacent upper electrodes in each element, and the pads are connected with the nearest upper electrode through metal leads.
The operation mode of the micro-capacitance ultrasonic transducer linear array probe device is shown in fig. 6a and 6b, and it can be seen from the figure that no matter the CMUT works in a transmitting mode or a receiving mode, a direct current bias voltage is applied to upper and lower electrodes of the sensitive unit, and an electrostatic force generated by the direct current bias voltage pulls a vibrating membrane of the sensitive unit to the lower end of the polar plate, but because the membrane itself has a reverse restoring force, the membrane is quickly static to reach an equilibrium state. If an alternating current excitation voltage with a certain frequency is applied to the film again at the moment, the vibration film can be bent, and ultrasonic waves with corresponding frequencies are radiated; if the film is deflected due to sound pressure change in a balanced state, a weak current signal is generated due to capacitance change between the polar plates, and then echo voltage signal receiving is achieved through processing circuits such as trans-resistance amplification and the like. In a wet hand environment, fingers do not need to be in close contact, the fingers are temporarily parked on a screen shell of the intelligent terminal, and fingerprint identification can be realized by induction or manual starting; under water, the finger does not need to contact the intelligent terminal (the distance from the skin of the finger to the screen of the terminal is kept within 5 mm), and the non-contact fingerprint identification of the finger can be realized by temporary parking.
The CMUT linear array device disclosed by the invention comprises an array device acoustic transmission sealing package, a receiving and transmitting integrated high-frequency CMUT linear array chip and an array electrode PCB lead package. By using the advantage that ultrasonic waves penetrate through the material of the intelligent terminal shell, the non-hole type design of the intelligent terminal shell can be realized, and the waterproof and dustproof performance of the intelligent terminal is improved; simultaneously, the novel CMUT array chip has the advantages of wide frequency band and high receiving sensitivity of the capacitive ultrasonic sensor, the MEMS micro-machining technology is fully utilized and is suitable for manufacturing a miniature high-density array, high-consistency mass production of array elements is realized, integration of the sensor and a signal processing circuit is facilitated, the cost and the manufacturing difficulty of the ultrasonic fingerprint sensor can be effectively reduced, the bottleneck of the current ultrasonic fingerprint acquisition technology is broken through, the comprehensive performance of the ultrasonic fingerprint sensor is improved, and technical support is provided for development of future miniaturization, low cost, high precision and high reliability mobile intelligent terminal identity authentication industry in China.
The device has the advantages of reasonable design, simple structure, miniaturization, low cost, easy array processing, suitability for mass production and the like, can realize the holeless design of the shell of the intelligent terminal, and improves the waterproof and dustproof performance of the intelligent terminal; meanwhile, the identification precision, efficiency and safety and reliability of wet hand and underwater fingerprint identification are effectively improved.
Drawings
Fig. 1 shows a schematic diagram of the packaging structure of the CMUT linear array device of the present invention.
Fig. 2 shows a schematic layout of a CMUT linear array chip of the present invention.
Fig. 3 shows a schematic diagram of the structure of a single sensitive unit of the transducer of the invention.
Figure 4 shows a schematic diagram of the CMUT array fabrication of the present invention.
Figure 5 shows a schematic diagram of a CMUT array wire electrode wire-bonded PCB board of the present invention.
Figure 6a shows a diagram of the operation mode (transmit) of the CMUT array of the present invention.
Figure 6b shows a diagram of the operation of the CMUT array of the present invention (reception).
In the figure: the acoustic transducer comprises 1-sound-transmitting reinforced glass, 2-silicon oil sound-transmitting medium, 3-CMUT array chips, 4-array chip PCB lead plates, 5-copper foil for shielding interference signals, 6-epoxy resin backing sound absorption material, 7- (PVC) shell, 8-array elements, 9-isolation grooves, 10-chip bonding pads, 11-sensitive unit structure, 12-upper electrodes, 13-isolation layers, 14-vibration films, 15-vacuum cavities, 16-oxidation layers (insulation layers), 17-common silicon substrates, 18-lower electrodes, 19-PCB rectangular gold-clad areas, 20-PCB lower electrode lead-out holes, 21-metal leads, 22-PCB connecting bonding pads, 23-PCB upper electrode lead-out holes and 24-lead-out wires.
Detailed Description
The following detailed description of specific embodiments of the invention refers to the accompanying drawings.
The invention provides a micro-capacitance ultrasonic transducer linear array device for identification, which is mainly used for waterproof intelligent terminal ultrasonic fingerprint identification, and aims at the development front of an MEMS (micro electro mechanical system) technology and an ultrasonic fingerprint identification technology against the key scientific problems and application requirements in the MEMS ultrasonic fingerprint identification at present against the background of an automatic fingerprint identification mode which is mainly developed in the field of current mobile intelligent terminal communication.
The micro-capacitance ultrasonic transducer linear array device for the ultrasonic fingerprint identification of the waterproof intelligent terminal comprises an array device, a transmitting and receiving integrated high-frequency CMUT linear array chip and an array electrode lead wire package. The high-impedance high-attenuation sound-absorbing material mainly comprises sound-transmitting reinforced glass, a silicon oil sound-transmitting medium, a CMUT array chip, PCB lead packaging, a copper foil for shielding interference signals, an epoxy resin backing sound-absorbing material with high impedance and high attenuation, and a PVC shell which eliminates a stray sound field and is easy to process.
As shown in fig. 1, an array chip PCB lead plate 4 is mounted in a PVC housing 7, the upper surface of the array chip PCB lead plate 4 is electrically connected to a CMUT array chip 3, acoustically transparent reinforced glass 1 is hermetically mounted in front of the CMUT array chip 3 on the PVC housing 7, and a silicone oil acoustically transparent medium 2 is filled between the CMUT array chip 3 and the acoustically transparent reinforced glass 1; a copper foil 5 for shielding interference signals is packaged on the back of the array chip PCB lead plate 4 in the PVC shell, and an epoxy resin lined sound absorption material 6 is packaged around the array chip PCB lead plate 4 and the copper foil 5 in the PVC shell; the lead-out wires 24 of the array chip PCB lead plate 4 penetrate out of the shell 7 and are connected with a subsequent processing circuit.
The linear CMUT array has the working frequency of 15MHz, is formed by arranging 384 same transceiving CMUT array element chips at equal intervals (0.5 times wavelength), and connects the CMUT chips to an external control circuit through a lead wire by a gold wire bonding packaging technology, concretely, as shown in figure 2, the CMUT array chip 3 is formed by arranging 384 array elements 8 in a row, each array element is formed by arranging 2 × 88 sensitive units 11, concretely, as shown in figure 3, the linear CMUT array chip comprises a common silicon substrate 17, the upper surface of the common silicon substrate 17 is an oxide layer (an insulating layer) 16, the lower surface of the common silicon substrate is covered with an integrated lower electrode 18, the upper surface of the oxide layer 16 is provided with a plurality of cylindrical vacuum cavities 15, the upper surface of the oxide layer 16 is bonded with a vibrating membrane 14, the upper surface of the vibrating membrane 14 is provided with an isolating layer 13, the isolating groove 9 surrounding the peripheral edge of the isolating layer 13 and the inner part of the isolating layer is provided with a sunken isolating layer 9, the isolating groove 9 penetrates through the isolating layer 13 and the vibrating membrane 14, the groove is provided with the bottom of the isolating groove provided on the oxide layer 16, the isolating layer 13 and the vibrating membrane 14, the bottom of the isolating groove is provided with the upper electrode pad 16, the upper electrode pad of the metal chip, the metal array element is electrically connected with the upper electrode 12 of the upper chip, the upper die is electrically connected with the upper die, the upper die and the lower die, the upper die, the lower die, the upper die, the.
As shown in fig. 5, the lower electrode 18 of the CMUT array chip 3 is attached to a PCB rectangular gold-coated region 19 in the middle of the upper surface of the array chip PCB lead plate 4 by a conductive adhesive, the PCB rectangular gold-coated region 19 is connected to a PCB lower electrode lead-out hole 20 by a metal lead, the PCB lower electrode lead-out hole 20 is connected to lead-out wires, and the chip pads 10 of the N array elements 8 of the CMUT array chip 3 are connected to the PCB connection pads 22 at corresponding positions of the array chip PCB lead plate 4 one by metal leads 21; each PCB connecting pad 22 is connected with a respective PCB upper electrode leading-out hole 23 through a metal lead, and the PCB upper electrode leading-out holes 23 are uniformly connected with leading-out wires and connected with a subsequent processing circuit; or, in order to realize phase control, n adjacent channel conductors can be unified together, and are led out by 384/n scattered conductors to be connected with a control circuit. The specific processing method is designed by the existing programming technology according to the actual situation by those skilled in the art, and is not described herein again.
Specifically, the CMUT array chip 3 was prepared to have a length of 10mm and a width of 8 mm. The thickness and radius of the upper electrode 12 are 1.1 μm and 12.25 μm, respectively; the thickness of the isolation layer 13 is 0.1 μm; the thickness and radius of the vibration film 14 are 2.2 μm and 24.5 μm, respectively; the radius and height of the cylindrical vacuum chamber 15 are 24.5 μm and 0.25 μm, respectively; the bottom surface of the cylindrical vacuum cavity 15 is 0.15 μm away from the upper surface of the common silicon substrate 17; the common silicon substrate 17 has a thickness of 300 μm; the lower electrode 18 has a thickness of 1 μm.
The processing technology of the CMUT linear array chip comprises the following steps:
1. as shown in FIG. 4 (a), a preparation was carried out. Selecting a silicon wafer and an SOI wafer, and carrying out standard RCA cleaning to remove various organic matters, gold dust, a natural oxide layer and the like; in the figure, Wafer1 is a silicon Wafer, and Wafer2 is an SOI Wafer.
2. As shown in fig. 4 (b), the silicon wafer is subjected to a double-sided thermal oxidation treatment to form oxide layers on both the upper and lower surfaces thereof. Then etching the silicon oxide on the upper surface to form a vacuum cavity, and simultaneously reserving silicon dioxide with the thickness of 0.15 mu m as an insulating layer;
3. as shown in fig. 4 (c), the silicon wafer is subjected to standard RCA cleaning and activated, and after activation, the oxide layer on the upper surface of the silicon wafer and the SOI wafer are subjected to low-temperature bonding in a vacuum environment by using a silicon-silicon bonding process.
4. As shown in fig. 4 (d), after bonding, etching the substrate silicon of the SOI wafer with TMAH solution, cleaning, and then etching off the oxide layer on the lower surface of the silicon wafer and the oxide layer on the SOI wafer with BOE solution, where the silicon wafer is the silicon substrate and the remaining silicon layer of the SOI wafer is the vibrating film, to initially form the structure of the micro-capacitive ultrasonic sensor.
5. As shown in fig. 4 (e), a silicon dioxide layer is deposited on the vibration film as an isolation layer with a thickness of 0.1 μm by LPCVD; sputtering metal on the upper surface of the isolation layer, forming an upper electrode and a bonding pad by using a stripping method, etching isolation grooves around the peripheral edge and inside of the isolation layer to form an array element array, corroding the isolation grooves by using a TMAH solution, and after the isolation grooves penetrate through the isolation layer and the vibration film, opening the bottom of the groove on the oxide layer; connecting each upper electrode and each bonding pad through a metal lead; injecting phosphorus into the back of the silicon wafer to form good ohmic contact with the silicon wafer, and sputtering metal Al to form an integrated lower electrode.
The specific packaging process is as follows:
(a) fixing the copper foil tape, and sticking the copper foil tape to the inside of the PVC shell (below the PCB fixing table).
(b) And chip leads are fixedly packaged, CMUT lower electrodes are adhered to the rectangular gold-coated area of the PCB through conductive adhesive, and chip bonding pads of upper electrodes of array elements of 384 CMUT chips are connected with connecting bonding pads at corresponding positions of the PCB lead plates by gold wire bonding.
(c) One end of the lead-out wire is led into the PVC shell and welded at the upper and lower electrode lead holes of the PCB lead plate, and the other end is connected with the control circuit.
(d) And placing the cured epoxy resin sound absorption material below the PCB lead plate mounting table, and screwing the cured epoxy resin sound absorption material on the PCB by using screws to fix the cured epoxy resin sound absorption material on the mounting table.
(e) And (3) sticking the sound-transmitting reinforced glass by using polyurethane glue for sealing.
(f) Silicone oil is injected from the outer side of the PVC cavity shell by an injector to discharge air bubbles in the cavity, so that vacuum is ensured as much as possible.
(g) And screwing down screws on the injection holes and coating polyurethane glue to finish final sealing.
The working mode of the micro-capacitance ultrasonic transducer linear array probe device for ultrasonic fingerprint identification of the waterproof intelligent terminal is shown in fig. 6a and 6b, and it can be seen from the figure that no matter the CMUT works in a transmitting mode or a receiving mode, direct-current bias voltage is applied to the upper electrode and the lower electrode of the sensitive unit, electrostatic force generated by the direct-current bias voltage pulls the vibrating membrane of the sensitive unit to the lower end of the polar plate, but the membrane is enabled to be static quickly and reach a balanced state due to the reverse restoring force of the membrane. If an alternating current excitation voltage with a certain frequency is applied to the film again at the moment, the vibration film can be bent, and ultrasonic waves with corresponding frequencies are radiated; if the film is deflected due to sound pressure change in a balanced state, a weak current signal is generated due to capacitance change between the polar plates, and then echo voltage signal receiving is achieved through processing circuits such as trans-resistance amplification and the like.
In the intelligent terminal miniaturized ultrasonic fingerprint identification linear array device, fingers do not need to be in close contact in a wet hand environment, the fingers are temporarily parked on a screen shell of the intelligent terminal, and the fingerprint identification can be realized by induction or manual starting; under water, the finger does not need to contact the intelligent terminal (the distance from the skin of the finger to the screen of the terminal is kept within 5 mm), and the non-contact fingerprint identification of the finger can be realized by temporary parking.
The invention combines the technology of combining the beam control and the linear scanning imaging mode, realizes the deflection focusing effect of ultrasonic beams by controlling the transmitting/receiving delay and the amplitude of each array element beam of the array, and scans the core part of the fingerprint epidermis and the subcutaneous tissue in a large range; and then respectively carrying out signal processing methods such as dynamic filtering, envelope detection, logarithmic compression, gray scale conversion, three-dimensional coordinate system construction, pixel mapping, interpolation filling and the like on the scanning echo signals to realize three-dimensional image reconstruction of the fingerprint. Finally, the stored fingerprint library information and the collected fingerprint information are matched and compared with each other to realize the scanning imaging identification of the fingerprint.
The invention provides a micro-capacitance ultrasonic transducer linear array device for fingerprint identification of a waterproof intelligent terminal, which is innovatively provided for solving the problems that the existing contact type fingerprint acquisition technology is easily influenced by finger environment, the reliability is difficult to guarantee, the application of the existing contact type fingerprint acquisition technology in a waterproof mobile terminal is difficult, and the existing ultrasonic fingerprint sensor array is high in cost and poor in batch manufacturing consistency, and has better identification precision and reliability for wet hand and underwater fingerprint identification technologies. The advantage that ultrasonic waves penetrate through the material of the terminal shell is utilized, the non-hole type design of the terminal shell can be realized, and the waterproof and dustproof performance of the intelligent terminal is improved; novel CMUT both had capacitanc ultrasonic sensor's broadband and high receiving sensitivity's advantage simultaneously, also make full use of MEMS microfabrication technique is fit for making miniature high density array, realize the high uniformity mass production of array element, be favorable to advantages such as sensor and signal processing circuit integration, can effectively reduce ultrasonic fingerprint sensor's the cost and the preparation degree of difficulty, break through the bottleneck of current ultrasonic fingerprint collection technique, improve ultrasonic fingerprint sensor's comprehensive properties, provide new power for intelligent terminal field fingerprint identification technology's development.
It should be noted that the above-mentioned embodiments are only for illustrating the technical solutions of the present invention and not for limiting, and although the detailed description is made with reference to the embodiments of the present invention, it should be understood by those skilled in the art that modifications or equivalent substitutions may be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, which shall be covered by the claims of the present invention.
Claims (3)
1. A micro-capacitance ultrasonic transducer linear array device for identification is characterized in that: the acoustic transmission reinforced glass comprises a shell (7), an array chip PCB (printed circuit board) lead plate (4) is installed in the shell (7), the upper surface of the array chip PCB lead plate (4) is electrically connected with a CMUT (CMUT) array chip (3), acoustic transmission reinforced glass (1) is hermetically installed in front of the CMUT array chip (3) on the shell (7), and a silicon oil acoustic transmission medium (2) is filled between the CMUT array chip (3) and the acoustic transmission reinforced glass (1); a copper foil (5) which shields interference signals is packaged on the back of the array chip PCB lead plate (4) in the shell (7), and an epoxy resin lined sound absorption material (6) is packaged around the array chip PCB lead plate (4) and the copper foil (5) in the shell (7); a lead-out wire (24) of the array chip PCB lead device (4) penetrates out of the shell (7);
the CMUT array chip (3) is formed by arranging N array elements (8) in a row, each array element is formed by arranging 2 × X sensitive units (11), and specifically comprises a common silicon substrate (17), wherein the upper surface of the common silicon substrate (17) is an oxide layer (16), the lower surface of the common silicon substrate is covered with a lower electrode (18), the upper surface of the oxide layer (16) is provided with a plurality of vacuum cavities (15), the vacuum cavities (15) are cylindrical, the upper surface of the oxide layer (16) is bonded with a vibrating film (14), the upper surface of the vibrating film (14) is provided with an isolation layer (13), sunken isolation grooves (9) are arranged around the peripheral edge of the isolation layer (13) and inside the isolation layer, the bottoms of the isolation grooves are arranged on the oxide layer (16) after the isolation layer (9) penetrates through the isolation layer (13) and the vibrating film (14), the bottoms of the isolation grooves are arranged on the upper surface of the isolation layer (14), the upper surface of the isolation layer (13) is provided with an upper electrode (12) at the position right opposite to the center of each vacuum cavity (15), two adjacent array elements are connected with an electrode (10) through a lead wire (21), and a metal wire (21) is arranged in the position of the chip which is connected with the upper surface of the chip (10) which is adjacent array element (10);
the lower electrode (18) of the CMUT array chip (3) is adhered to a PCB rectangular gold-coated area (19) in the middle of the upper surface of an array chip PCB lead plate (4) through conductive adhesive, the PCB rectangular gold-coated area (19) is connected with a PCB lower electrode lead-out hole (20) through a metal lead, the PCB lower electrode lead-out hole (20) is connected with lead-out wires, and chip bonding pads (10) of N array elements (8) of the CMUT array chip (3) are connected with PCB connecting bonding pads (22) in corresponding positions of the array chip PCB lead plate (4) one by one through metal leads (21); each PCB connecting pad (22) is connected with a respective PCB upper electrode leading-out hole (23) through a metal lead, and the PCB upper electrode leading-out holes (23) are uniformly connected with leading-out wires;
the thickness and the radius of the upper electrode (12) are respectively 1.1 μm and 12.25 μm; the thickness of the isolation layer (13) is 0.1 mu m; the thickness and the radius of the vibrating membrane (14) are respectively 2.2 mu m and 24.5 mu m; the radius and the height of the cylindrical vacuum cavity (15) are respectively 24.5 μm and 0.25 μm; the bottom surface of the cylindrical vacuum cavity (15) is 0.15 mu m away from the upper surface of the common silicon substrate (17); the thickness of the common silicon substrate (17) is 300 mu m; the thickness of the lower electrode (18) is 1 mu m;
the CMUT array chip (3) is 10mm in length and 8mm in width.
2. The micro-capacitance ultrasonic transducer linear array device for identification according to claim 1, wherein: the shell (7) is made of PVC.
3. The micro-capacitance ultrasonic transducer linear array device for identification as claimed in claim 2, wherein: n = 384; x = 88.
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| CN108229409B (en) * | 2018-01-12 | 2021-01-08 | 京东方科技集团股份有限公司 | Ultrasonic fingerprint detection assembly and method and display device |
| WO2019235988A1 (en) * | 2018-06-04 | 2019-12-12 | Fingerprint Cards Ab | Acoustic biometric imaging system with acoustic impedance matched opaque masking layer, and manufacturing method |
| CN109817679B (en) * | 2019-01-31 | 2020-10-16 | 武汉华星光电半导体显示技术有限公司 | OLED display screen module |
| CN110057921B (en) * | 2019-04-11 | 2021-07-02 | 成都华芯微医疗科技有限公司 | Three-dimensional ultrasonic imaging system |
| CN113145431A (en) * | 2021-02-09 | 2021-07-23 | 深圳市赛禾医疗技术有限公司 | Micro-electromechanical ultrasonic transducer and array |
| CN113008353B (en) * | 2021-02-10 | 2022-07-01 | 西北工业大学 | Integrated multi-array-element small transducer array design method and small transducer array |
| CN113406648B (en) * | 2021-06-15 | 2024-05-07 | 江苏英特神斯科技有限公司 | PMUT-based image sonar receiving array and manufacturing method thereof |
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