CN113145431A - Micro-electromechanical ultrasonic transducer and array - Google Patents
Micro-electromechanical ultrasonic transducer and array Download PDFInfo
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- CN113145431A CN113145431A CN202110183162.3A CN202110183162A CN113145431A CN 113145431 A CN113145431 A CN 113145431A CN 202110183162 A CN202110183162 A CN 202110183162A CN 113145431 A CN113145431 A CN 113145431A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
Abstract
The application provides a micro-electromechanical ultrasonic transducer and array, micro-electromechanical ultrasonic transducer includes: a base layer, a bottom electrode (30), a piezoelectric layer (40), a top electrode (50), and a passive layer (60); the top surface of the base layer is sequentially stacked with a bottom electrode (30), a piezoelectric layer (40), a top electrode (50) and a passive layer (60); the bottom electrode (30) and the top electrode (50) are used for being respectively connected with different electrode terminals; the top surface of the substrate layer is provided with a groove-shaped vacuum cavity (70), the top end of the groove-shaped vacuum cavity (70) is in contact with the bottom electrode (30) and is used for providing space for downward vibration of the bottom electrode (30), the piezoelectric layer (40), the top electrode (50) and the passive layer (60); the passive layer (60) is intended to be in direct contact with a conventional acoustic transmission medium. The ultrasonic transducer solves the problems that the existing ultrasonic transducer is large in size, complex in assembly process and low in overall integration level.
Description
Technical Field
The application relates to the technical field of ultrasonic transducers, in particular to a micro-electromechanical ultrasonic transducer and an array.
Background
With the rapid development of scientific technology, the ultrasonic technology and the computer technology are closely combined, and the wide application of ultrasonic detection and ultrasonic echo imaging technology in the fields of medical treatment, industry, aerospace, automobiles, even consumer electronics and the like is promoted. Particularly in the field of medical ultrasonic imaging, medical ultrasonic has the unique advantages of good real-time performance, no damage, no pain, no ionizing radiation, low cost and the like, is widely used for clinical examination and diagnosis at present, and is popular among medical workers and patients.
An ultrasonic transducer (also called an ultrasonic probe) is one of the key components of a medical ultrasonic imaging device, and the performance of the ultrasonic transducer directly influences and even limits the performance of the whole device. Traditional ultrasonic transducer generally comprises piezoceramics, acoustic lens, the backing, the electrode, metal casing etc. and for the acoustic impedance of solving traditional ultrasonic transducer and the lower problem of vocal efficiency that leads to of traditional acoustic transmission medium (air, water) mismatch, traditional ultrasonic transducer still need additionally set up the acoustic matching layer, utilize the acoustic matching layer to accomplish the acoustic matching between human skin and the piezoceramics, make more ultrasonic energy enter into human tissue, can lead to traditional ultrasonic transducer's bulky like this, assembly process is complicated, whole integrated level is low.
Disclosure of Invention
The embodiment of the application provides a micro-electromechanical ultrasonic transducer and an array, and solves the problems of large volume, complex assembly process and low overall integration level of the conventional ultrasonic transducer.
In a first aspect, a microelectromechanical ultrasonic transducer is provided, comprising: a base layer, a bottom electrode, a piezoelectric layer, a top electrode, and a passive layer; the bottom electrode, the piezoelectric layer, the top electrode and the passive layer are sequentially stacked on the top surface of the substrate layer; a groove-shaped vacuum cavity is formed in the top surface of the substrate layer, the top end of the groove-shaped vacuum cavity is in contact with the bottom electrode, and a space is provided for downward vibration of the bottom electrode, the piezoelectric layer, the top electrode and the passive layer; the passive layer is used for being in direct contact with a traditional sound transmission medium; the bottom electrode and the top electrode are used for being respectively connected with different electrode terminals.
According to the micro-electromechanical ultrasonic transducer provided by the embodiment of the application, the passive layer can be in direct contact with the traditional sound transmission medium, and an acoustic matching layer is not required to be additionally arranged, so that the number of components of the micro-electromechanical ultrasonic transducer is reduced, the size is reduced, and the process consistency and the integration degree of the micro-electromechanical ultrasonic transducer are improved.
In one possible design, the material of the passive layer is silicon nitride, and the thickness of the passive layer is 1-10 μm; the piezoelectric layer is made of aluminum nitride or scandium aluminum nitride, and the thickness of the piezoelectric layer is 1-10 mu m.
In one possible design, the bottom electrode is made of metal materials such as gold, platinum, aluminum or tin, and the thickness of the bottom electrode is 100-500 nm; the top electrode is made of metal materials such as gold, platinum, aluminum or tin, and the thickness of the top electrode is 100-500 nm.
In one possible design, the vacuum chamber is of a positive cylinder structure, and the top end face of the vacuum chamber is square; the side length of the top end face of the vacuum cavity is 10-120 mu m, and the depth of the vacuum cavity is 50-1000 nm.
In one possible design, the base layer includes a silicon substrate and an insulating layer stacked together;
the bottom electrode is connected with the insulating layer, the insulating layer is made of silicon dioxide, and the thickness of the insulating layer is less than or equal to 5 micrometers;
the thickness of the silicon substrate is less than or equal to 200 μm.
In one possible design, the microelectromechanical ultrasonic transducer further includes a metal layer and a pad;
the metal layer is arranged in the insulating layer and used for forming an electronic circuit and connecting the bottom electrode or the top electrode to the bonding pad;
the bonding pad is used for connecting a positive electrode or a negative electrode to form the positive electrode or the negative electrode of the micro-electromechanical ultrasonic transducer.
In one possible design, the insulating layer is provided with an electrode through hole and a pad through hole therein;
the bonding pads comprise a top surface bonding pad and a bottom surface bonding pad;
a conductive connector is arranged in the electrode through hole and used for connecting the bottom electrode or the top electrode to the metal layer;
a conductive connector is arranged in the bonding pad through hole and used for connecting the top surface bonding pad to the bottom surface bonding pad;
the bottom surface of the silicon substrate may be provided with electronic circuitry for moving and relocating the location of the bottom surface pads.
In one possible design, the diameter of the electrode perforations is less than or equal to 1 μm; the pad through-hole has a diameter of 80 μm or less.
In one possible design, the piezoelectric layer is fabricated by a piezoelectric thin film process, and the mems ultrasonic transducer is fabricated by a piezoelectric mems ultrasonic transducer fabrication process.
In a second aspect, a micro-electromechanical ultrasonic transducer array is provided, which comprises a plurality of micro-electromechanical ultrasonic transducers, wherein bottom electrodes of the micro-electromechanical ultrasonic transducers are connected together in parallel;
the bottom electrode of the micro-electromechanical ultrasonic transducer and the top electrode of the micro-electromechanical ultrasonic transducer are respectively connected with the top surface bonding pad and the bottom surface bonding pad, or the bottom electrode of the micro-electromechanical ultrasonic transducer and the top electrode of the micro-electromechanical ultrasonic transducer are respectively connected with the bottom surface bonding pad and the top surface bonding pad;
the isolator is arranged between the two adjacent groups of the micro-electromechanical ultrasonic transducers and used for isolating acoustic signal crosstalk between the two adjacent groups of the micro-electromechanical ultrasonic transducers.
The invention has the beneficial effects that: the piezoelectric micro-electromechanical ultrasonic transducer is integrally manufactured by adopting a piezoelectric micro-electromechanical ultrasonic transducer manufacturing process, so that the piezoelectric micro-electromechanical ultrasonic transducer is small in size, higher in process consistency and integration degree, and more suitable for being applied to the medical ultrasonic imaging fields of intravascular ultrasound, intracardiac ultrasound and the like; in addition, the passive layer of this application can with traditional acoustic transmission medium direct contact, need not additionally to set up the acoustic matching layer again, and then has reduced micro electromechanical ultrasonic transducer's component part, has reduced the volume, and the passive layer can vibrate together with the piezoelectric layer in addition, can not influence the vibration frequency of piezoelectric layer, and then can not influence the ultrasonic wave transduction performance of this application.
Drawings
Fig. 1 is a schematic cross-sectional structure diagram of a microelectromechanical ultrasonic transducer provided in an embodiment of the present application.
Fig. 2 is a schematic cross-sectional structure diagram of a microelectromechanical ultrasonic transducer array provided in an embodiment of the present application.
Reference numerals: 10. a silicon substrate; 20. an insulating layer; 30. a bottom electrode; 31. a metal layer; 40. a piezoelectric layer; 50. a top electrode; 60. a passive layer; 70. a vacuum chamber; 80. a pad; 35. perforating the electrode; 81. punching the bonding pad; 90. an isolator.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative and are only for the purpose of explaining the present application and are not to be construed as limiting the present application.
In the description of the present application, it is to be understood that the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted" and "connected" are to be interpreted broadly, e.g., as being either fixedly connected, detachably connected, or integrally connected; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
It should be noted that the same reference numerals are used to denote the same components or parts in the embodiments of the present application, and for the same parts in the embodiments of the present application, only one of the parts or parts may be given the reference numeral, and it should be understood that the reference numerals are also applicable to the other same parts or parts.
The embodiment of the application provides a micro-electromechanical ultrasonic transducer and an array, and solves the problems of large volume, complex assembly process and low overall integration level of the conventional ultrasonic transducer.
Fig. 1 is a schematic cross-sectional structure diagram of a microelectromechanical ultrasonic transducer provided in an embodiment of the present application.
As shown in fig. 1, a microelectromechanical ultrasonic transducer provided by the embodiment of the present application includes a substrate layer, a bottom electrode 30, a piezoelectric layer 40, a top electrode 50, and a passive layer 60; the bottom electrode 30, the piezoelectric layer 40, the top electrode 50 and the passive layer 60 are sequentially stacked on the top surface of the base layer; the bottom electrode 30 and the top electrode 50 are used to connect different electrode terminals, respectively; the top surface of the base layer is provided with a groove-shaped vacuum cavity 70, the top end of the groove-shaped vacuum cavity 70 is in contact with the bottom electrode 30 and is used for providing space for downward vibration of the bottom electrode 30, the piezoelectric layer 40, the top electrode 50 and the passive layer 60; the passive layer 60 is intended to be in direct contact with a conventional acoustic transmission medium.
According to the micro-electromechanical ultrasonic transducer provided by the embodiment of the application, the passive layer 60 can be in direct contact with the traditional sound transmission medium, and an additional sound matching layer is not needed, so that the number of components of the micro-electromechanical ultrasonic transducer is reduced, the size is reduced, and the process consistency and the integration degree of the micro-electromechanical ultrasonic transducer are improved.
In the present application, the bottom electrode 30 and the top electrode 50 are respectively connected to different electrodes, and the conversion from mechanical energy to electrical energy or from electrical energy to mechanical energy is realized by utilizing the forward and reverse piezoelectric effects. When the transducer of the present application is used as a transmitting terminal, alternating voltages are applied to the bottom electrode 30 and the top electrode 50, and the piezoelectric layer 40 is driven by the inverse piezoelectric effect and the passive layer 60 is driven to vibrate out of plane, so as to generate ultrasonic waves; when the transducer serves as a receiving end, the piezoelectric effect is utilized to convert the vibration of the piezoelectric layer 40 and the passive layer 60 caused by external ultrasonic excitation into an electric signal to be output; because the piezoelectric layer 40 drives the passive layer 60 to vibrate together when vibrating, and the passive layer 60 can directly contact with the traditional sound transmission medium (air, liquid), the acoustic impedance of the micro-electromechanical ultrasonic transducer is matched with the traditional sound transmission medium (air, liquid), and the vibration efficiency is improved. The groove-shaped vacuum chamber 70 can provide a vibration space for the vibration of the piezoelectric layer 40 and the passive layer 60, so that the base layer does not obstruct the vibration of the piezoelectric layer 40 and the passive layer 60, and the vibration frequency is increased.
In the embodiment of the application, the structural parameters of each part are as follows: the passive layer 60 is made of silicon nitride, and the thickness of the passive layer 60 is 1-10 mu m; the piezoelectric layer 40 is made of aluminum nitride or scandium aluminum nitride, and the thickness of the piezoelectric layer 40 is 1-10 μm; the bottom electrode 30 is made of metal materials such as gold, platinum, aluminum or tin, and the thickness of the bottom electrode 30 is 100-500 nm; the top electrode 50 is made of metal materials such as gold, platinum, aluminum or tin, and the thickness of the top electrode 50 is 100-500 nm; the vacuum chamber 70 has a positive cylinder structure, and the top end surface of the vacuum chamber 70 is square; the side length of the top end face of the vacuum chamber 70 is 10 to 120 μm, and the depth of the vacuum chamber 70 is 50 to 1000 nm.
Through above setting, the material of passive layer 60 can direct contact air and liquid for this application need not to set up acoustic matching layer and also can take place the coupling with air and liquid, this is very favorable to using this application in medical cavity image technical field such as intravascular supersound (IVUS), heart intracavity supersound (ICE), passive layer 60 direct vibration produces the ultrasonic wave or will directly be converted into the signal of telecommunication by vibration conversion that outside ultrasonic excitation caused, there is not blocking of acoustic matching layer can promote vocal efficiency.
The preparation material of piezoelectric layer 40 and passive layer 60 can make the preparation thickness of transducer vibrating diaphragm become very little than traditional piezoceramics's thickness in this application, because the vibrating diaphragm size is less, its resonant frequency is higher, therefore the vibration frequency of this application has obtained the promotion.
The thicknesses of the passive layer 60, the piezoelectric layer 40, the bottom electrode 30 and the top electrode 50 are set to be smaller, so that the volume of the transducer can be effectively reduced, and the resonant frequency of the transducer can be improved; the vacuum chamber 70 of the present application can provide a vibration space for the vibration of the piezoelectric layer 40 and the passive layer 60, and cannot make the base layer block the vibration of the piezoelectric layer 40 and the passive layer 60, which is beneficial to improving the vibration frequency, and it should be noted that the area of the bottom electrode 30 is larger than the area of the opening of the vacuum chamber 70, so that the vacuum environment can be maintained in the vacuum chamber 70, and the vibration of the piezoelectric layer 40 and the passive layer 60 can also have the largest vibration space. The vacuum chamber 70 may be configured using an etching process.
As shown in fig. 1, the base layer includes a silicon substrate 10 and an insulating layer 20 stacked together; the bottom electrode 30 is connected with the insulating layer 20, the insulating layer 20 is made of silicon dioxide, and the thickness of the insulating layer 20 is less than or equal to 5 micrometers; the thickness of the silicon substrate 10 is less than or equal to 200 μm. With the above arrangement, the thicknesses of the insulating layer 20 and the silicon substrate 10 are both small, i.e., the thickness of the base layer is small, which effectively reduces the volume of the transducer.
As shown in fig. 1, the microelectromechanical ultrasonic transducer further includes a metal layer 31 and a bonding pad 80; the metal layer 31 is disposed in the insulating layer 20 and is used for forming an electronic circuit and connecting the bottom electrode 30 or the top electrode 50 to the bonding pad 80, and the bonding pad 80 is used for connecting a positive electrode or a negative electrode to form the positive electrode or the negative electrode of the micro-electromechanical ultrasonic transducer.
Through the arrangement, the bottom electrode 30 or the top electrode 50 is connected with the bonding pad 80 through the metal layer 31, the bonding pad 80 is a metal conductive bonding pad 80, the bottom electrode 30 and the top electrode 50 are electrified by electrifying the bonding pad 80, wiring is simple, the metal layer 31 is arranged in the insulating layer 20, the metal layer 31 and the insulating layer 20 can share a part of space, occupied volume is reduced, and the insulating layer 20 wraps the metal layer 31 to well avoid current leakage passing through the metal layer 31.
As shown in fig. 1, the insulating layer 20 is provided therein with an electrode through-hole 35 and a pad through-hole 81; pads 80 include top pads and bottom pads; a conductive connector is disposed in the electrode through hole 35 for connecting the bottom electrode 30 or the top electrode 50 to the metal layer 31; a conductive connector is provided in the pad through hole 81 for connecting the top pad to the bottom pad; the bottom surface of the silicon substrate 10 may be provided with electronic circuitry for moving and relocating the location of the bottom surface pads.
In the above arrangement, the conductive connector in the electrode through hole 35 may be made of the same metal material as the metal layer 31, or may be made of another conductive wire; the conductive connector provided in the pad penetration hole 81 may be a metal of the same material as the pad 80. The pads 80 may include a top pad and a bottom pad, the top pad and the bottom pad are connected together, the top pad is configured as a window structure, the bottom pad is disposed at the bottom of the silicon substrate 10, the bottom pad and the top pad can both be connected to an electrode to supply power to the top electrode 50 and the bottom electrode 30, and the top pad and the bottom pad can be specifically selected according to actual installation requirements.
Optionally, the diameter of the electrode perforations 35 is less than or equal to 1 μm; the diameter of the pad penetration 81 is less than or equal to 80 μm.
The piezoelectric layer 40 of the present application is fabricated using a piezoelectric thin film process, and the microelectromechanical ultrasonic transducer is fabricated using a piezoelectric microelectromechanical ultrasonic transducer fabrication process. Through the arrangement, the ultrasonic transducer can get rid of the constraint of the traditional piezoelectric ceramic material, and the manufacturing with high consistency, high integration, large scale and low cost is realized by means of the microelectronic technology. The piezoelectric micro-electromechanical ultrasonic transducer manufacturing process is adopted, the CMOS large-scale manufacturing process can be well compatible, the ultrasonic transducer and the analog front-end transceiver chip can be integrated on a single chip, in addition, the piezoelectric micro-electromechanical ultrasonic transducer manufacturing process supports the array manufacturing of the ultrasonic transducer, the size precision of the single ultrasonic transducer is controllable, the consistency is high, and the complexity of a later imaging algorithm is reduced.
Fig. 2 is a schematic cross-sectional structure diagram of a microelectromechanical ultrasonic transducer array provided in an embodiment of the present application.
As shown in fig. 2, there is provided a microelectromechanical ultrasonic transducer array comprising: the bottom electrodes of the micro-electromechanical ultrasonic transducers are connected together in parallel; the bottom electrode of the micro-electromechanical ultrasonic transducer and the top electrode of the micro-electromechanical ultrasonic transducer are respectively connected with the top surface bonding pad and the bottom surface bonding pad, or the bottom electrode 30 of the micro-electromechanical ultrasonic transducer and the top electrode 50 of the micro-electromechanical ultrasonic transducer are respectively connected with the bottom surface bonding pad and the top surface bonding pad; and the isolator is arranged between the two adjacent groups of the micro-electromechanical ultrasonic transducers and is used for isolating acoustic signal crosstalk between the two adjacent groups of the micro-electromechanical ultrasonic transducers.
In the above arrangement, when the micro-electromechanical ultrasonic transducer is used for manufacturing the ultrasonic transducer array, a plurality of micro-electromechanical ultrasonic transducers are required, the plurality of micro-electromechanical ultrasonic transducers are arranged according to a linear, annular, cake-shaped or matrix-shaped array, then the bottom electrodes 30 of all the micro-electromechanical ultrasonic transducers are connected in parallel for connecting the negative electrodes, and the top electrodes 50 of all the micro-electromechanical ultrasonic transducers are respectively connected in series with the positive electrodes, so that the ultrasonic transducers meeting the use requirements can be selected according to the use requirements, and the ultrasonic transducer array is converted into various different array units to meet different use requirements.
A substrate layer with a large area can be arranged when the ultrasonic transducer array is manufactured, then a plurality of groove-shaped vacuum cavities 70 are arranged on the substrate layer, and then bottom electrodes 30, piezoelectric layers 40, top electrodes 50 and passive layers 60 are sequentially stacked on the top ends of the groove-shaped vacuum cavities 70, so that a plurality of ultrasonic transducers can be connected into a whole, of course, the bottom electrodes 30 of the plurality of ultrasonic transducers can be connected together in series for supplying power to the bottom electrodes 30, and then the power is supplied through a general bonding pad 80, so that the structure of the ultrasonic transducer array can be simplified.
An isolator is arranged between two adjacent groups of ultrasonic transducers to isolate acoustic signal crosstalk between the two adjacent groups of ultrasonic transducers; the isolator is arranged in a groove structure, the groove is arranged from the passive layer 60 between two adjacent groups of ultrasonic transducers downwards, and the bottom of the groove is the upper surface of the substrate layer.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. A microelectromechanical ultrasonic transducer, comprising: a base layer, a bottom electrode (30), a piezoelectric layer (40), a top electrode (50), and a passive layer (60);
the bottom electrode (30), the piezoelectric layer (40), the top electrode (50) and the passive layer (60) are stacked on the top surface of the base layer in sequence;
the bottom electrode (30) and the top electrode (50) are used for being respectively connected with different electrode terminals;
a groove-shaped vacuum cavity (70) is formed in the top surface of the base layer, the top end of the groove-shaped vacuum cavity (70) is in contact with the bottom electrode (30) and is used for providing a space for downward vibration of the bottom electrode (30), the piezoelectric layer (40), the top electrode (50) and the passive layer (60);
the passive layer (60) is adapted to be in direct contact with a conventional acoustic transmission medium.
2. The micro-electromechanical ultrasonic transducer according to claim 1, wherein the passive layer (60) is made of silicon nitride, and the thickness of the passive layer (60) is 1-10 μm;
the piezoelectric layer (40) is made of aluminum nitride or scandium aluminum nitride, and the thickness of the piezoelectric layer (40) is 1-10 mu m.
3. The micro-electromechanical ultrasonic transducer according to claim 1, wherein the bottom electrode (30) is made of a metal material such as gold, platinum, aluminum or tin, and the thickness of the bottom electrode (30) is 100-500 nm; the top electrode (50) is made of metal materials such as gold, platinum, aluminum or tin, and the thickness of the top electrode (50) is 100-500 nm.
4. The microelectromechanical ultrasonic transducer of claim 1, characterized in that the vacuum chamber (70) is a positive cylinder structure and the top end face of the vacuum chamber (70) is square; the side length of the top end face of the vacuum cavity (70) is 10-120 mu m, and the depth of the vacuum cavity (70) is 50-1000 nm.
5. A microelectromechanical ultrasonic transducer according to claim 1, characterized in that the substrate layer comprises a silicon substrate (10) and an insulating layer (20) stacked together;
the bottom electrode (30) is connected with the insulating layer (20), the insulating layer (20) is made of silicon dioxide, and the thickness of the insulating layer (20) is less than or equal to 5 mu m;
the thickness of the silicon substrate (10) is less than or equal to 200 [ mu ] m.
6. A microelectromechanical ultrasonic transducer of claim 5, characterized in that the microelectromechanical ultrasonic transducer further comprises a metal layer (31) and a bonding pad (80);
the metal layer (31) is arranged in the insulating layer (20) and is used for forming an electronic circuit and connecting the bottom electrode (30) or the top electrode (50) to the bonding pad (80);
the bonding pad (80) is used for connecting a positive electrode or a negative electrode to form the positive electrode or the negative electrode of the micro-electromechanical ultrasonic transducer.
7. A microelectromechanical ultrasonic transducer according to claim 6, characterized in that the insulating layer (20) is provided with electrode through holes (35) and pad through holes (81);
the pads (80) include top pads and bottom pads;
a conductive connector is arranged in the electrode through hole (35) and is used for connecting the bottom electrode (30) or the top electrode (50) to the metal layer (31);
a conductive connector is arranged in the pad through hole (81) and is used for connecting the top surface pad to the bottom surface pad;
the bottom surface of the silicon substrate (10) may be provided with electronic circuitry for moving and relocating the location of the bottom surface pads.
8. The microelectromechanical ultrasonic transducer of claim 7, characterized in that the diameter of the electrode perforations (35) is smaller than or equal to 1 μ ι η; the pad via hole (81) has a diameter of 80 [ mu ] m or less.
9. A microelectromechanical ultrasonic transducer according to any of claims 1-8, characterized in that the piezoelectric layer (40) is fabricated using a piezoelectric thin film process and the microelectromechanical ultrasonic transducer is fabricated using a piezoelectric microelectromechanical ultrasonic transducer fabrication process.
10. A microelectromechanical ultrasonic transducer array, comprising:
a number of microelectromechanical ultrasound transducer according to any of the claims 7-9, the bottom electrodes (30) of the number of microelectromechanical ultrasound transducer being connected together in parallel;
the bottom electrode (30) of the micro-electromechanical ultrasonic transducer and the top electrode (50) of the micro-electromechanical ultrasonic transducer are respectively connected with the top surface bonding pad and the bottom surface bonding pad, or the bottom electrode (30) of the micro-electromechanical ultrasonic transducer and the top electrode (50) of the micro-electromechanical ultrasonic transducer are respectively connected with the bottom surface bonding pad and the top surface bonding pad;
the isolator (90) is arranged between two adjacent groups of the micro-electromechanical ultrasonic transducers and used for isolating acoustic signal crosstalk between the two adjacent groups of the micro-electromechanical ultrasonic transducers.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110183162.3A CN113145431A (en) | 2021-02-09 | 2021-02-09 | Micro-electromechanical ultrasonic transducer and array |
| PCT/CN2021/131525 WO2022170805A1 (en) | 2021-02-09 | 2021-11-18 | Microelectromechanical ultrasonic transducer and array |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110183162.3A CN113145431A (en) | 2021-02-09 | 2021-02-09 | Micro-electromechanical ultrasonic transducer and array |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113145431A true CN113145431A (en) | 2021-07-23 |
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| CN202110183162.3A Pending CN113145431A (en) | 2021-02-09 | 2021-02-09 | Micro-electromechanical ultrasonic transducer and array |
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| WO (1) | WO2022170805A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114007175A (en) * | 2021-10-19 | 2022-02-01 | 上海交通大学 | Ultrasonic transducer array and method of forming the same |
| WO2022170805A1 (en) * | 2021-02-09 | 2022-08-18 | 深圳市赛禾医疗技术有限公司 | Microelectromechanical ultrasonic transducer and array |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CA2950919A1 (en) * | 2014-07-08 | 2016-01-14 | Qualcomm Incorporated | Piezoelectric ultrasonic transducer and process |
| JP2016039512A (en) * | 2014-08-08 | 2016-03-22 | キヤノン株式会社 | Device having electrode connected with through wiring and manufacturing method of the same |
| US10618079B2 (en) * | 2016-02-29 | 2020-04-14 | Qualcomm Incorporated | Piezoelectric micromechanical ultrasonic transducers and transducer arrays |
| US10632500B2 (en) * | 2016-05-10 | 2020-04-28 | Invensense, Inc. | Ultrasonic transducer with a non-uniform membrane |
| CN106951887B (en) * | 2017-04-25 | 2020-07-03 | 太原科技大学 | Micro-capacitance ultrasonic transducer linear array device for identification |
| CN109225789B (en) * | 2018-09-06 | 2020-07-14 | 西安知象光电科技有限公司 | Combined variable-stiffness film pMUTs and preparation method thereof |
| CN111817682A (en) * | 2020-07-27 | 2020-10-23 | 松山湖材料实验室 | Film bulk acoustic resonator and preparation method thereof |
| CN113145431A (en) * | 2021-02-09 | 2021-07-23 | 深圳市赛禾医疗技术有限公司 | Micro-electromechanical ultrasonic transducer and array |
| CN214718133U (en) * | 2021-02-09 | 2021-11-16 | 深圳市赛禾医疗技术有限公司 | Micro-electromechanical ultrasonic transducer and array |
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- 2021-02-09 CN CN202110183162.3A patent/CN113145431A/en active Pending
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022170805A1 (en) * | 2021-02-09 | 2022-08-18 | 深圳市赛禾医疗技术有限公司 | Microelectromechanical ultrasonic transducer and array |
| CN114007175A (en) * | 2021-10-19 | 2022-02-01 | 上海交通大学 | Ultrasonic transducer array and method of forming the same |
| CN114007175B (en) * | 2021-10-19 | 2022-08-23 | 上海交通大学 | Ultrasonic transducer array and method of forming the same |
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| WO2022170805A1 (en) | 2022-08-18 |
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