CN105413997A - Flexible capacitor type micromachining ultrasonic transducer (CMUT) and preparation method thereof - Google Patents
Flexible capacitor type micromachining ultrasonic transducer (CMUT) and preparation method thereof Download PDFInfo
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- CN105413997A CN105413997A CN201510907459.4A CN201510907459A CN105413997A CN 105413997 A CN105413997 A CN 105413997A CN 201510907459 A CN201510907459 A CN 201510907459A CN 105413997 A CN105413997 A CN 105413997A
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- ultrasonic transducer
- organic polymer
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- vibration film
- micromachined ultrasonic
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
Abstract
The invention discloses a flexible capacitor type micromachining ultrasonic transducer (CMUT). The flexible CMUT comprises a flexible substrate, a lower electrode, an etching sacrificial layer, an organic polymer support layer, an organic polymer vibration thin film and an upper electrode which are arranged sequentially. The organic polymer support layer is provided with a groove, and the groove and the organic polymer vibration thin film form a cavity of the ultrasonic transducer. The invention further discloses a preparation method of the flexible CMUT. According to the flexible CMUT, ultrasonic loss caused by poor coupling is effectively reduced, and the flexible ultrasonic transducer is achieved. The flexible CMUT is suitable for detection objects, including animals' epidermal tissue, of any shapes, so that the application range of the CMUT is effectively widened. The preparation method is simple in preparation process and low in cost.
Description
Technical field
The present invention relates to ultrasonic transducer field, particularly a kind of flexibility capacitance type micromachined ultrasonic transducer and preparation method thereof.
Background technology
Ultrasonic transducer and array probe are the critical components in supersonic sounding and ultrasonic imaging technique, be widely used in the technical fields such as medical diagnosis and therapy, subsurface communication and detection, defect Non-Destructive Testing, ranging localization, remote sensing and remote control, all significant to physical and mental health of improving the health of the people, ensure, Improving The Quality of Products, detection seabed resources, the aspect such as to safeguard national security.It is high, easily and Circuit Matching, stable performance, easily to process and low cost and other advantages that conventional piezoelectric pottery (PZT) ultrasonic transducer has electromechanical conversion efficiency, is current widely used a kind of acoustic-electric conversion element.But due to piezoceramic material, to there is acoustic impedance high, not easily mates with the acoustic impedance of human body soft tissue and water; Mechanical quality factor is high, narrow bandwidth; The defects such as fragility is large, tensile strength is low, high density array element and ultra-thin high-frequency transducer are not easily processed, thus the space more and more restricting its application.Comparatively speaking, capacitance type micromachined ultrasonic transducer (CMUT) but has obvious advantage, such as bandwidth is better, sensitivity is higher, noise is lower, easy making two-dimensional array etc., thus making up many deficiencies of PZT PZT (piezoelectric transducer), the technical fields such as CMUT will detect in medical science, wearable device, Non-Destructive Testing play a significant role.
CMUT both can convert ultrasonic wave to the signal of telecommunication, also can convert the electrical signal to ultrasonic wave.When namely applying DC voltage between two electrodes between film and matrix, film is pulled to matrix by strong electrostatic field, and then applies alternating voltage at two interpolars, and film will occur vibrate and produce ultrasonic wave; On the contrary, after applying suitable DC offset voltage between two electrodes, film vibrates under ul-trasonic irradiation, and the electric capacity between two battery lead plates changes, and realizes hyperacoustic reception by detecting this change.
Current capacitance type micromachined ultrasonic transducer (CMUT) matrix is generally silicon materials, vibration film material is also silicon compounds, its manufacture craft and si-substrate integrated circuit compatibility, easily integrated with transmitting and receiving circuit, realize high-density integrated ultrasonic plane array probe.But adopt silicon single crystal material do substrate, cannot flexible array be made, can not with detected object intimate surface contact, especially the irregular detected object coupling efficiency of effects on surface will reduce greatly, have very large bandwidth restrictions simultaneously.
Summary of the invention
In order to the above-mentioned shortcoming overcoming prior art is with not enough, the object of the present invention is to provide a kind of flexibility capacitance type micromachined ultrasonic transducer, effectively reducing because being coupled bad and ultrasonic wave loss that is that cause.
The object of the present invention is to provide the preparation method of above-mentioned flexibility capacitance type micromachined ultrasonic transducer, preparation technology is simple, and cost is low.
Object of the present invention is achieved through the following technical solutions:
Flexibility capacitance type micromachined ultrasonic transducer, comprises the flexible substrates, bottom electrode, etching sacrificial layer, organic polymer supporting layer, organic polymer vibration film, the top electrode that set gradually; Described organic polymer supporting layer is provided with groove, and described groove and organic polymer vibration film form the cavity of ultrasonic transducer.
The degree of depth of described groove is 2.0 ~ 4.0 μm, and basal diameter is 20 ~ 200 μm.
Described groove is multiple.
The thickness of described organic polymer vibration film is 0.5 ~ 2.5 μm.
Described organic polymer vibration film is rubber film or polyvinyl chloride plastic film.
Described flexible substrates is flexible PCB.
Described very aluminium film or the silverskin of powering on.
Described bottom electrode is copper film.
When flexibility capacitance type micromachined ultrasonic transducer, between upper/lower electrode, apply DC voltage, organic polymer vibration film is pulled to flexible substrates by strong electrostatic field, and then is applying alternating voltage between the upper and lower, and vibration film occurs vibrate and produce ultrasonic wave;
When property softening capacitance type micromachined ultrasonic transducer is used as ultrasonic receiver, DC offset voltage is applied between upper/lower electrode, organic polymer vibration film vibrates under ul-trasonic irradiation, electric capacity between two battery lead plates changes, and realizes hyperacoustic reception by the change of Detection capacitance.
The preparation method of described flexibility capacitance type micromachined ultrasonic transducer, comprises the following steps:
(1) adopt photoetching technique on silicon chip, etch projection, obtain the impressing mould for the formation of cavity;
(2) spin coating organic polymer material on metal level is on a flexible substrate being laid;
(3) adopt stamping technique, the impressing mould utilizing step (1) to obtain impresses out groove on the organic polymer material of step (2), is formed and establishes reeded organic polymer supporting layer and etching sacrificial layer;
(4) aluminium flake on the surface spin coating one deck organic polymer diaphragm materials as vibration film;
(5) adopt heat cure bonding techniques to be bonded by the organic polymer supporting layer of the vibration film of step (4) and step (3), form the cavity of ultrasonic transducer;
(6) aluminium flake on erosion removal vibration film surface;
(7) in the surperficial evaporation layer of metal film of vibration film, and etching forms top electrode.
Compared with prior art, the present invention has the following advantages and beneficial effect:
(1) flexibility capacitance type micromachined ultrasonic transducer of the present invention, adopts flexible substrates, overcomes the shortcoming and defect of silica-based CMUT, effectively reduces because being coupled bad and ultrasonic wave loss that is that cause.On the other hand, adopt organic polymer as vibration film, overcome the bandwidth restrictions of silicon compounds, improve frequency bandwidth, the coefficient of coup, sensitivity and antijamming capability.
(2) flexibility capacitance type micromachined ultrasonic transducer of the present invention, achieves the ultrasonic transducer of flexibility, is applicable to the detecting object of any shape, comprise the epidermal tissue of animal, has effectively expanded the range of application of CMUT.
(3) flexibility capacitance type micromachined ultrasonic transducer of the present invention, uses organic polymer as material, greatly reduces manufacture technics cost, be convenient to apply on a large scale.
(4) flexibility capacitance type micromachined ultrasonic transducer of the present invention, improves frequency bandwidth, the coefficient of coup, sensitivity and antijamming capability.
(5) preparation method of flexibility capacitance type micromachined ultrasonic transducer of the present invention, preparation technology is simple, and cost is low.
Accompanying drawing explanation
Fig. 1 is the flexibility capacitance type micromachined ultrasonic transducer architecture side view of embodiments of the invention.
Fig. 2 is the silicon materials impressing mould schematic diagram of embodiments of the invention.
Fig. 3 is spin coating organic polymer material schematic diagram on substrate in the step 2 of embodiments of the invention.
Fig. 4 is the impressing mould in the step 3.3 of embodiments of the invention and the organic polymer effect schematic diagram on substrate.
Fig. 5 is the final step of stamping technique in the step 3.4 of embodiments of the invention, the schematic diagram after the demoulding.
Fig. 6 is the schematic diagram of spin coating diaphragm materials on aluminum slice in the step 4 of embodiments of the invention.
Fig. 7 is the schematic diagram that in the step 5 of embodiments of the invention, diaphragm materials and support layer material bond.
Fig. 8 is the schematic diagram eroding top-level metallic in the step 6 of embodiments of the invention.
Fig. 9 be in the step 8 of embodiments of the invention electrode etch complete after schematic diagram.
Figure 10 is the top view of the 3*3 unit top section electrode of embodiments of the invention.
Detailed description of the invention
Below in conjunction with embodiment, the present invention is described in further detail, but embodiments of the present invention are not limited thereto.
Embodiment
The flexibility capacitance type micromachined ultrasonic transducer of the present embodiment, comprise set gradually flexible PCB substrate 1, bottom electrode 2, etching sacrificial layer 3, organic polymer supporting layer 4, organic polymer vibration film 5, top electrode 6; Described organic polymer supporting layer 4 is provided with groove 41, and described groove 41 and organic polymer vibration film 5 form the cavity of ultrasonic transducer.
Described groove is the degree of depth is 2.0 ~ 4.0 μm, and basal diameter is the cylindrical groove of 20 ~ 200 μm.
The thickness of described organic polymer vibration film is 0.5 ~ 2.5 μm, adopts rubber or igelite.
Described very aluminium film or the silverskin of powering on, bottom electrode is copper film.
When flexibility capacitance type micromachined ultrasonic transducer, between upper/lower electrode, apply DC voltage, vibration film is pulled to flexible substrates by strong electrostatic field, and then is applying alternating voltage between the upper and lower, and vibration film occurs vibrate and produce ultrasonic wave;
When flexibility capacitance type micromachined ultrasonic transducer is used as ultrasonic receiver, DC offset voltage is applied between upper/lower electrode, vibration film vibrates under ul-trasonic irradiation, and the electric capacity between two battery lead plates changes, and realizes hyperacoustic reception by the change of Detection capacitance.
The preparation method of the flexibility capacitance type micromachined ultrasonic transducer of the present embodiment, comprises the following steps:
Step 1: adopt photoetching technique to etch the projection of 3*3 unit on silicon chip, for the formation of cavity impressing mould, as shown in Figure 2.
Wherein, the preparation process of impressing mould:
Step 1.1: spin coating is carried out to the silicon chip cleaning, dry, and carry out front baking process;
Step 1.2: use mask plate to carry out exposure-processed to the silicon chip after front baking, make above Graphic transitions to photoresist;
Step 1.3: development and rear baking are carried out to the silicon chip after exposure, photoresist and silicon chip is binded firm;
Step 1.4: the rear silicon chip processed that dries is corroded, the pattern on lithography mask version is accurately transferred to wafer surface;
Step 1.5: remove photoresist, forms impressing mould figure, as shown in Figure 2.
Step 2: the organic polymer thin film layer that spin coating one deck 2.0 ~ 5.0 μm is thick on the Cu film of deposited Cu flexible PCB substrate (FPC), as shown in Figure 3.
Step 3: adopt stamping technique, utilize impressing mould that the organic material in flexible PCB is impressed out groove, produce etching sacrificial layer and establish the supporting layer of groove, wherein etches sacrificial layer thickness is 0.1 ~ 0.5 μm, and cavity diameter is 20 ~ 200 μm;
Wherein, impression is formed and produces etching sacrificial layer and establish the manufacturing process of the supporting layer of groove as follows:
Step 3.1: be fixed on heating platform by substrate Cu film depositing organic polymer thin layer, is warming up to the glassy state softening temperature of organic polymer material;
Step 3.2: the impressing mould made is pressed on organic polymer thin film layer, and apply suitable pressure, ensure that polymer thickness is larger than mould cavity thickness, as shown in Figure 4, organic polymer fills the cavity in mould, forms supporting layer and etching stop layer;
Step 3.3: after mold pressing terminates, reduces temperature, organic polymer material is solidified, and has the figure overlapped with mould;
Step 3.4: remove mould, non-fill area will as cavity groove, as shown in Figure 5.
Step 4: at the diaphragm materials of ultra-thin aluminum slice 7 spin coating one deck 0.5 ~ 2.5 μm on the surface as vibration film 5, as shown in Figure 6.
Step 5: adopt heat cure bonding techniques diaphragm materials and support layer material to be bonded together, form micro-structural cavity, as shown in Figure 7;
Wherein, micro-structural cavity manufacturing process:
Step 5.1: about temperature being elevated to the glass transition temperature of diaphragm materials;
Step 5.2: by applying certain ambient pressure, makes softening wetting bonding surface close contact;
Step 5.3: intermolecular formation active force, realizes the Direct Bonding of diaphragm materials and support layer material;
Step 6: use the aluminium film of certain density solution to vibration film surface corrode and clean diaphragm surface, as shown in Figure 8;
Step 7: at the thick aluminium film of surperficial evaporation one deck 100 ~ 200nm of vibration film or silverskin, and etching forms top electrode, as shown in Figure 9, Figure 10.
Above-described embodiment is the present invention's preferably embodiment; but embodiments of the present invention are not limited by the examples; change, the modification done under other any does not deviate from Spirit Essence of the present invention and principle, substitute, combine, simplify; all should be the substitute mode of equivalence, be included within protection scope of the present invention.
Claims (10)
1. flexibility capacitance type micromachined ultrasonic transducer, is characterized in that, comprises the flexible substrates, bottom electrode, etching sacrificial layer, organic polymer supporting layer, organic polymer vibration film, the top electrode that set gradually; Described organic polymer supporting layer is provided with groove, and described groove and organic polymer vibration film form the cavity of ultrasonic transducer.
2. flexibility capacitance type micromachined ultrasonic transducer according to claim 1, is characterized in that, the degree of depth of described groove is 2.0 ~ 4.0 μm, and basal diameter is 20 ~ 200 μm.
3. flexibility capacitance type micromachined ultrasonic transducer according to claim 1 and 2, is characterized in that, described groove is multiple.
4. flexibility capacitance type micromachined ultrasonic transducer according to claim 1, is characterized in that, the thickness of described organic polymer vibration film is 0.5 ~ 2.5 μm.
5. the flexibility capacitance type micromachined ultrasonic transducer according to claim 1 or 4, is characterized in that, described organic polymer vibration film is rubber film or polyvinyl chloride plastic film.
6. flexibility capacitance type micromachined ultrasonic transducer according to claim 1, is characterized in that, described flexible substrates is flexible PCB.
7. flexibility capacitance type micromachined ultrasonic transducer according to claim 1, is characterized in that, described in power on very aluminium film or silverskin.
8. flexibility capacitance type micromachined ultrasonic transducer according to claim 1, is characterized in that, described bottom electrode is copper film.
9. flexibility capacitance type micromachined ultrasonic transducer according to claim 1, is characterized in that,
When flexibility capacitance type micromachined ultrasonic transducer, between upper/lower electrode, apply DC voltage, organic polymer vibration film is pulled to flexible substrates by strong electrostatic field, and then is applying alternating voltage between the upper and lower, and vibration film occurs vibrate and produce ultrasonic wave;
When flexibility capacitance type micromachined ultrasonic transducer is used as ultrasonic receiver, DC offset voltage is applied between upper/lower electrode, organic polymer vibration film vibrates under ul-trasonic irradiation, electric capacity between two battery lead plates changes, and realizes hyperacoustic reception by the change of Detection capacitance.
10. the preparation method of the flexibility capacitance type micromachined ultrasonic transducer according to any one of claim 1 ~ 9, is characterized in that, comprise the following steps:
(1) adopt photoetching technique on silicon chip, etch projection, obtain the impressing mould for the formation of cavity;
(2) spin coating organic polymer material on metal level is on a flexible substrate being laid;
(3) adopt stamping technique, the impressing mould utilizing step (1) to obtain impresses out groove on the organic polymer material of step (2), is formed and establishes reeded organic polymer supporting layer and etching sacrificial layer;
(4) aluminium flake on the surface spin coating one deck organic polymer diaphragm materials as vibration film;
(5) adopt heat cure bonding techniques to be bonded by the organic polymer supporting layer of the vibration film of step (4) and step (3), form the cavity of ultrasonic transducer;
(6) aluminium flake on erosion removal vibration film surface;
(7) in the surperficial evaporation layer of metal film of vibration film, and etching forms top electrode.
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| CN106925496A (en) * | 2017-01-06 | 2017-07-07 | 中北大学 | Microelectromechanical ultrasound is popped one's head in and circuit |
| CN106951887A (en) * | 2017-04-25 | 2017-07-14 | 太原科技大学 | Micro- electric capacity ultrasonic transducer linear array device for identification |
| CN108722837A (en) * | 2018-05-22 | 2018-11-02 | 清华大学 | A kind of capacitive ultrasound transducer and its manufacturing method |
| CN108918662A (en) * | 2018-05-16 | 2018-11-30 | 西安交通大学 | A kind of CMUTs fluid density sensor and preparation method thereof |
| CN109909140A (en) * | 2019-03-06 | 2019-06-21 | 中国工程物理研究院电子工程研究所 | A kind of piezoelectricity micromachined ultrasonic transducer and preparation method thereof |
| US10509013B2 (en) | 2017-12-19 | 2019-12-17 | The University Of British Columbia | Method for fabricating a layered structure using wafer bonding |
| WO2020024815A1 (en) * | 2018-08-01 | 2020-02-06 | 京东方科技集团股份有限公司 | Ultrasonic generator and manufacturing method thereof, display panel, and sound-emitting screen system |
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| CN111024213A (en) * | 2019-12-27 | 2020-04-17 | 安徽芯淮电子有限公司 | Flexible capacitive vibration sensor and manufacturing method thereof |
| CN111039251A (en) * | 2018-10-15 | 2020-04-21 | 中国科学院上海微系统与信息技术研究所 | Piezoelectric miniature ultrasonic transducer and preparation method thereof |
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| CN106925496A (en) * | 2017-01-06 | 2017-07-07 | 中北大学 | Microelectromechanical ultrasound is popped one's head in and circuit |
| CN106951887A (en) * | 2017-04-25 | 2017-07-14 | 太原科技大学 | Micro- electric capacity ultrasonic transducer linear array device for identification |
| CN106951887B (en) * | 2017-04-25 | 2020-07-03 | 太原科技大学 | Micro-capacitance ultrasonic transducer linear array device for identification |
| CN110997165B (en) * | 2017-08-08 | 2021-09-28 | 皇家飞利浦有限公司 | Capacitive Micromachined Ultrasonic Transducer (CMUT) apparatus and control method |
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| US10509013B2 (en) | 2017-12-19 | 2019-12-17 | The University Of British Columbia | Method for fabricating a layered structure using wafer bonding |
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| CN108918662A (en) * | 2018-05-16 | 2018-11-30 | 西安交通大学 | A kind of CMUTs fluid density sensor and preparation method thereof |
| CN108722837A (en) * | 2018-05-22 | 2018-11-02 | 清华大学 | A kind of capacitive ultrasound transducer and its manufacturing method |
| WO2020024815A1 (en) * | 2018-08-01 | 2020-02-06 | 京东方科技集团股份有限公司 | Ultrasonic generator and manufacturing method thereof, display panel, and sound-emitting screen system |
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| CN109433571B (en) * | 2018-09-25 | 2020-10-20 | 中国科学院电工研究所 | Flexible photoinduced ultrasonic film transducer and preparation method thereof |
| WO2020062383A1 (en) * | 2018-09-28 | 2020-04-02 | 天津大学 | Flexible piezoelectric micromachined ultrasonic transducer (pmut) and forming method therefor, and flexible pmut array and forming method therefor |
| CN111039251A (en) * | 2018-10-15 | 2020-04-21 | 中国科学院上海微系统与信息技术研究所 | Piezoelectric miniature ultrasonic transducer and preparation method thereof |
| CN111039251B (en) * | 2018-10-15 | 2023-05-02 | 中国科学院上海微系统与信息技术研究所 | Piezoelectric miniature ultrasonic transducer and preparation method thereof |
| WO2020082256A1 (en) * | 2018-10-24 | 2020-04-30 | 深圳市汇顶科技股份有限公司 | Ultrasonic transducer and manufacturing method therefor |
| CN109909140B (en) * | 2019-03-06 | 2021-06-04 | 中国工程物理研究院电子工程研究所 | Piezoelectric micromechanical ultrasonic transducer and preparation method thereof |
| CN109909140A (en) * | 2019-03-06 | 2019-06-21 | 中国工程物理研究院电子工程研究所 | A kind of piezoelectricity micromachined ultrasonic transducer and preparation method thereof |
| CN111024213A (en) * | 2019-12-27 | 2020-04-17 | 安徽芯淮电子有限公司 | Flexible capacitive vibration sensor and manufacturing method thereof |
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