CN108423632A - A kind of electronic equipment and its manufacturing method that can realize supersonic sensing - Google Patents
A kind of electronic equipment and its manufacturing method that can realize supersonic sensing Download PDFInfo
- Publication number
- CN108423632A CN108423632A CN201810420677.9A CN201810420677A CN108423632A CN 108423632 A CN108423632 A CN 108423632A CN 201810420677 A CN201810420677 A CN 201810420677A CN 108423632 A CN108423632 A CN 108423632A
- Authority
- CN
- China
- Prior art keywords
- sensor circuit
- ultrasonic sensor
- substrate
- sinker area
- cover plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000000758 substrate Substances 0.000 claims abstract description 49
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000011230 binding agent Substances 0.000 claims abstract description 22
- 239000011521 glass Substances 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims abstract description 8
- 239000010409 thin film Substances 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 claims description 3
- 238000002604 ultrasonography Methods 0.000 claims 2
- 239000013078 crystal Substances 0.000 claims 1
- 230000005611 electricity Effects 0.000 claims 1
- 239000010408 film Substances 0.000 claims 1
- 239000011159 matrix material Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/48—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using wave or particle radiation means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0264—Pressure sensors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measurement Of Velocity Or Position Using Acoustic Or Ultrasonic Waves (AREA)
Abstract
The present invention discloses a kind of electronic equipment that can realize supersonic sensing, including：Substrate, the substrate are glass substrate, which has sinker area；Ultrasonic sensor circuit forms non-sinker area on the substrate；External lead wire, the part external lead wire are arranged in the sinker area；Cover plate above the ultrasonic sensor circuit includes binder course between the cover plate and the ultrasonic sensor circuit.By in the sinker area on external lead wire be installed on substrate surface, the position of cover plate is lowered the present invention, therefore the thickness of the binder course above ultrasonic sensor circuit substantially reduces, and is reduced ultrasonic signal and is being emitted and the loss in receive process.
Description
Technical field
The invention patent relates to supersonic sensing fields.
Background technology
Traditional ultrasonic sensor is by the monomer ultrasonic sensor assembling based on piezoelectric ceramics, and this scheme can not
Realize the ultrasonic sensor of high density dot matrix, high density dot matrix ultrasonic sensor can be manufactured by mems techniques, but cost
Excessively high, high density dot matrix ultrasonic sensor can also be based on TFT techniques, can be used for fingerprint collecting, TFT on the glass substrate
（Thin film transistor (TFT)）The structure that piezoelectric membrane is covered on array realizes the ultrasonic sensor structure of high density dot matrix, the ultrasonic wave
Sensing arrangement is as shown in Figure 1.
Such as Fig. 1, ultrasonic sensor circuit 16 and pad 14 are arranged on glass substrate 11；Ultrasonic sensor circuit 16
Including forming pixel circuit and piezoelectric membrane etc. on the substrate 11, pixel circuit includes tft array, and tft array is deposited on
On glass substrate 11；Include pad 14 on substrate 11, external lead wire 15 is arranged in the top of substrate, and external lead wire 15 with it is super
Sonic sensor circuit 16 is electrically connected by pad；Cover plate 13 is arranged by binder course 12 in ultrasonic sensor circuit 16
Top.
The ultrasonic signal that ultrasonic sensor circuit 16 emits passes through binder course 12 and 13 detected target of cover plate anti-
It penetrates, the ultrasonic signal after reflection is received using cover plate 13 and binder course 12 by ultrasonic sensor circuit 16, due to knot
It is low to close 12 rigidity of layer, stronger, the thickness positive correlation of ultrasonic signal loss and binder course is received to ultrasonic wave.External lead wire is long-range
In the thickness of ultrasonic sensor circuit, raised the installation site of cover plate 13, cause joint thickness by external lead wire and
The thickness difference of ultrasonic sensor circuit influences, and the thickness difference is bigger, then joint thickness is thicker, and ultrasonic signal loss is got over
Greatly.Invention content
The present invention discloses a kind of electronic equipment that can realize supersonic sensing, including glass substrate, the upper surface of base plate edge
With sinker area；Ultrasonic sensor circuit forms non-sinker area on the substrate；External lead wire, part are described external
Lead is arranged in the sinker area；Cover plate above the ultrasonic sensor circuit, the cover plate and the ultrasonic wave
It include binder course between sensor circuit.
External lead wire is mounted in the sinker area of substrate by the present invention, and the position of cover plate is lowered, therefore ultrasonic wave passes
The thickness of binder course above sensor circuit substantially reduces, and reduces ultrasonic signal and is emitting and the loss in receive process.
Description of the drawings
Fig. 1 is the existing electronic equipment that can realize supersonic sensing；
Fig. 2 is the electronic equipment that can realize supersonic sensing of the embodiment of the present invention；
Fig. 3 A-D are the schematic diagrames of the manufacturing method of the electronic equipment that can realize supersonic sensing of the embodiment of the present invention.
Fig. 4 is the schematic diagram of the substrate of the embodiment of the present invention.
Specific implementation mode
As shown in Fig. 2, the electronic equipment of the present invention includes substrate 21, which is glass substrate.21 upper surface of substrate
There is sinker area 28, ultrasonic sensor circuit 26 to form non-sinker area on the base plate (21 at edge, and partial circumscription lead 25 is set
It sets in sinker area 28, which can be the metal wire that flexible PCB or routing are formed, therefore external lead wire 25
Surface level reduces, it is preferable that the level height on 25 surface of external lead wire is no more than 26 surface of ultrasonic sensor circuit
Level height.Preferably, electrode 24 is set in sinker area 28, electrode 24 is electrically connected with external lead wire 25, electrode 24 with it is described
Ultrasonic sensor circuit 26 is electrically connected.Cover plate 23 is arranged on ultrasonic sensor circuit 26, cover plate 23 and ultrasonic wave
It include binder course 22 between sensor circuit 26.
The ultrasonic signal that ultrasonic sensor circuit 26 emits reaches detection mesh by binder course 22 and cover plate 23
Mark is then passed through cover plate 23 and binder course 22 is received by ultrasonic sensor circuit 26 after the reflection of ultrasonic wave detected target.By
It is arranged in sinker area in external lead wire 25, the level height on 25 surface of external lead wire reduces, therefore compared with the existing technology, covers
The distance between cover board 23 and ultrasonic sensor circuit 26 are reduced, and the thickness of binder course 22 is lowered, and reduce ultrasonic wave letter
Number loss.
Ultrasonic sensor circuit includes thin film transistor (TFT), piezoelectric material and electrode, and ultrasonic sensor circuit includes
The ultrasonic sensor units that one or more is made of thin film transistor (TFT), piezoelectric material and electrode, the thin film transistor (TFT)
Transistor is formed on substrate.
The present embodiment also provides a kind of method preparing above-mentioned electronic equipment, and this approach includes the following steps：
（1）Substrate 21 is provided, which is glass substrate.
（2）Such as Fig. 3 A, sinker area 28 is formed in 21 upper surface of the substrate, can by existing machinery, laser ablation or
The methods of chemical etching forms the sinker area 28, the sinker area 28 there are Cutting Road 210, behind the step of in, will be along cutting
Substrate 21 is cut into discrete substrate by road 210, and for each discrete substrate, Fig. 3 A illustrate only the cutting of sinker area side
Road situation.Fig. 4 is the vertical view of substrate, and each sinker area is after two discrete substrates, later stage cutting, discrete substrate two
Side can all have sinker area, which can be asymmetric relative to Cutting Road, but the present invention is not limited to the structure, Cutting Roads 210
Also it can pass through other cutting modes along the edge of sinker area（Such as there are two Cutting Roads between two neighboring discrete substrate）,
The discrete substrate after cutting is set to only have side to have sinker area.Sinker area is rectangle in Fig. 4, and sinker area may be other geometry
Shape, such as round, square.
（3）Such as Fig. 3 B, electrode 24 is formed in the sinker area 28, the non-sinker area in surface forms ultrasonic wave and passes on the base plate (21
Sensor circuit 26, the ultrasonic sensor circuit include one or more supersonic sensing units, ultrasonic sensor circuit
26 are electrically connected with electrode 24.
（4）Cut the substrate along Cutting Road to form discrete substrate, include on the discrete substrate it is described it is non-under
The ultrasonic sensor circuit in heavy area and the electrode of the sinker area, on the discrete substrate, the electrode with it is described
Ultrasonic sensor circuit is electrically connected, therefore each discrete substrate and structure forms discrete ultrasonic sensor member thereon
Part.
（5）Such as Fig. 3 C, partial circumscription lead 25 is arranged in the sinker area 28, external lead wire 25 is electrically connected with electrode 24
It connects, which can be the metal wire that flexible PCB or routing are formed, since the setting of external lead wire 25 being sunk
The level height of Qu Zhong, external lead wire upper surface reduce, it is preferable that the level height of external lead wire upper surface is no more than described super
The level height of sonic sensor circuit upper surface.
（6）Such as Fig. 3 D, cover plate 23 is arranged above ultrasonic sensor circuit 26, the cover plate 23 surpasses with described
It include binder course 22 between sonic sensor circuit 26.The ultrasonic signal of the ultrasonic sensor circuit transmission passes through described
The ultrasonic signal of binder course and the cover plate, detected target reflection passes through the cover plate and the binder course described
Ultrasonic sensor circuit receives.Since external lead wire 25 is disposed on the substrate in the sinker area 28 of marginal surface, external lead wire
The level height on 25 surfaces reduces, and the distance between cover plate 23 and ultrasonic sensor circuit 26 are reduced, binder course 22
Thickness is lowered, and reduces the loss of ultrasonic signal.
Note that above are only presently preferred embodiments of the present invention and institute's application technology principle.It will be appreciated by those skilled in the art that
The present invention is not limited to specific embodiments described here, can carry out for a person skilled in the art it is various it is apparent variation,
It readjusts and substitutes without departing from protection scope of the present invention.Therefore, although being carried out to the present invention by above example
It is described in further detail, but the present invention is not limited only to above example, without departing from the inventive concept, also
May include other more equivalent embodiments, and the scope of the present invention is determined by scope of the appended claims.
Claims (11)
1. a kind of electronic equipment that can realize supersonic sensing, which is characterized in that including：
Substrate, the substrate are glass substrate, which has sinker area；
Ultrasonic sensor circuit forms non-sinker area on the substrate；
External lead wire, the part external lead wire are arranged in the sinker area；
Cover plate above the ultrasonic sensor circuit includes between the cover plate and the ultrasonic sensor circuit
Binder course.
2. electronic equipment according to claim 1, which is characterized in that further include the electrode formed in sinker area, it is described outer
It connects lead to be electrically connected with the electrode, the ultrasonic sensor circuit is electrically connected with the electrode.
3. electronic equipment according to claim 1, which is characterized in that the level height of the external lead wire upper surface does not surpass
Cross the level height of ultrasonic sensor circuit upper surface.
4. electronic equipment according to claim 1, which is characterized in that the ultrasonic sensor circuit includes being formed in institute
State the thin film transistor (TFT) on substrate.
5. electronic equipment according to claim 1, which is characterized in that the ultrasonic sensor circuit includes one or more
A ultrasonic sensor units.
6. electronic equipment according to claim 1, which is characterized in that the ultrasonic wave of the ultrasonic sensor circuit transmission
Signal passes through the binder course and the cover plate, the ultrasonic signal of detected target reflection pass through the cover plate with it is described
Binder course is received by the ultrasonic sensor circuit.
7. a kind of manufacturing method for the electronic equipment that can realize supersonic sensing, this method include：
（1）Substrate is provided, which is glass substrate；
（2）Surface forms sinker area on the substrate, and there are Cutting Roads for the sinker area；
（3）Electrode is formed in the sinker area, the non-sinker area in surface forms ultrasonic sensor circuit on the substrate, will
The electrode is electrically connected with the ultrasonic sensor circuit；
（4）The substrate is cut along Cutting Road to form discrete substrate, includes the non-sinker area on the discrete substrate
Ultrasonic sensor circuit and the sinker area electrode, on the discrete substrate, the electrode and the ultrasound
Wave sensor circuit is electrically connected；
（5）Partial circumscription lead is arranged in the sinker area, the electrode is electrically connected with the external lead wire；
（6）Cover plate is arranged above the ultrasonic sensor circuit, the cover plate and ultrasonic sensor electricity
It include binder course between road.
8. manufacturing method according to claim 7, which is characterized in that the ultrasonic sensor circuit includes film crystal
Pipe.
9. manufacturing method according to claim 7, which is characterized in that the ultrasonic sensor circuit includes one or more
A supersonic sensing unit.
10. manufacturing method according to claim 7, which is characterized in that the ultrasound of the ultrasonic sensor circuit transmission
Wave signal passes through the binder course and the cover plate, the ultrasonic signal of detected target reflection to pass through the cover plate and institute
Binder course is stated to be received by the ultrasonic sensor circuit.
11. the method according to the description of claim 7 is characterized in that the level height of the external lead wire is no more than described surpass
The level height of sonic sensor circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810420677.9A CN108423632A (en) | 2018-05-04 | 2018-05-04 | A kind of electronic equipment and its manufacturing method that can realize supersonic sensing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810420677.9A CN108423632A (en) | 2018-05-04 | 2018-05-04 | A kind of electronic equipment and its manufacturing method that can realize supersonic sensing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108423632A true CN108423632A (en) | 2018-08-21 |
Family
ID=63162356
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810420677.9A Pending CN108423632A (en) | 2018-05-04 | 2018-05-04 | A kind of electronic equipment and its manufacturing method that can realize supersonic sensing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108423632A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109597081A (en) * | 2018-11-30 | 2019-04-09 | 李扬渊 | A kind of sensor device |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011025055A (en) * | 2010-08-23 | 2011-02-10 | Olympus Corp | Electrostatic capacity type ultrasonic transducer |
| CN102015127A (en) * | 2008-05-02 | 2011-04-13 | 佳能株式会社 | Methods of manufacturing capacitive electromechanical transducer and capacitive electromechanical transducers |
| CN107172812A (en) * | 2017-07-13 | 2017-09-15 | 杭州士兰微电子股份有限公司 | Supersonic sensing device assembly and manufacture method |
| CN107211222A (en) * | 2015-01-26 | 2017-09-26 | 思睿逻辑国际半导体有限公司 | MEMS device and method |
| WO2017218228A1 (en) * | 2016-06-16 | 2017-12-21 | Qualcomm Incorporated | Fingerprint sensor device and methods thereof |
| JP2018019339A (en) * | 2016-07-29 | 2018-02-01 | キヤノン株式会社 | Capacitance type transducer and manufacturing method of the same |
| CN107848790A (en) * | 2015-07-24 | 2018-03-27 | 罗伯特·博世有限公司 | Manufacture method and microelectronics medium sensor device for microelectronics medium sensor device |
| CN208234545U (en) * | 2018-05-04 | 2018-12-14 | 李扬渊 | A kind of electronic equipment can be realized supersonic sensing |
-
2018
- 2018-05-04 CN CN201810420677.9A patent/CN108423632A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102015127A (en) * | 2008-05-02 | 2011-04-13 | 佳能株式会社 | Methods of manufacturing capacitive electromechanical transducer and capacitive electromechanical transducers |
| JP2011025055A (en) * | 2010-08-23 | 2011-02-10 | Olympus Corp | Electrostatic capacity type ultrasonic transducer |
| CN107211222A (en) * | 2015-01-26 | 2017-09-26 | 思睿逻辑国际半导体有限公司 | MEMS device and method |
| CN107848790A (en) * | 2015-07-24 | 2018-03-27 | 罗伯特·博世有限公司 | Manufacture method and microelectronics medium sensor device for microelectronics medium sensor device |
| WO2017218228A1 (en) * | 2016-06-16 | 2017-12-21 | Qualcomm Incorporated | Fingerprint sensor device and methods thereof |
| JP2018019339A (en) * | 2016-07-29 | 2018-02-01 | キヤノン株式会社 | Capacitance type transducer and manufacturing method of the same |
| CN107172812A (en) * | 2017-07-13 | 2017-09-15 | 杭州士兰微电子股份有限公司 | Supersonic sensing device assembly and manufacture method |
| CN208234545U (en) * | 2018-05-04 | 2018-12-14 | 李扬渊 | A kind of electronic equipment can be realized supersonic sensing |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109597081A (en) * | 2018-11-30 | 2019-04-09 | 李扬渊 | A kind of sensor device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 215000 1003, room 33, Mei song garden, 99 Bada street, Suzhou Industrial Park, Jiangsu. Applicant after: Li Yangyuan Address before: 230071 Anhui Hefei Shushan District Changjiang West Road 669 CMC talent center collective households Applicant before: Li Yangyuan |
|
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20230412 Address after: 215000, 11th Floor, Building 22, No. 388 Xinping Street, Industrial Park, Suzhou City, Jiangsu Province Applicant after: MICROARRAY MICROELECTRONICS Corp.,Ltd. Address before: 215000 1003, room 33, Mei song garden, 99 Bada street, Suzhou Industrial Park, Jiangsu. Applicant before: Li Yangyuan |