CN107977602A - Ultrasonic fingerprint identification module, module, device and electronic equipment - Google Patents
Ultrasonic fingerprint identification module, module, device and electronic equipment Download PDFInfo
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- CN107977602A CN107977602A CN201710939810.7A CN201710939810A CN107977602A CN 107977602 A CN107977602 A CN 107977602A CN 201710939810 A CN201710939810 A CN 201710939810A CN 107977602 A CN107977602 A CN 107977602A
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- fingerprint identification
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/857—Macromolecular compositions
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Abstract
The present invention relates to fingerprint identification technology field, more particularly to a kind of ultrasonic fingerprint identification module, module, device and electronic equipment.The ultrasonic fingerprint identification module of the present invention, it includes upper electrode layer, piezoelectric layer and lower electrode layer, upper electrode layer and lower electrode layer are separately positioned on two opposite surfaces of piezoelectric layer, and the lower electrode layer includes signal processing layer and array arrangement the electrode block on surface of the signal processing layer close to piezoelectric layer.Ultrasonic fingerprint identification module, module, device and the electronic equipment of the present invention not only has simple in structure, the advantages of reliability is high, and it is that fingerprint identification module is directly formed in process chip, make the size of ultrasonic fingerprint identification module entirety smaller, be more in line with the trend that electronic equipment is lightening, integrated level is high.
Description
【Technical field】
The present invention relates to fingerprint identification technology field, more particularly to a kind of ultrasonic fingerprint identification module, module, device and
Electronic equipment.
【Background technology】
At present, fingerprint identification technology such as has been widely used in mobile terminal, smart home, has fought crime at the multiple fields.
Life to people brings many facility and safety.The fingerprint identification technology of present mainstream has light fingerprint recognition, condenser type
Fingerprint recognition and ultrasonic fingerprint identification, but they also have the shortcomings that respective, such as light fingerprint recognition and capacitance type fingerprint are known
There are not greasy dirt, dust in finger, water when material is easy for that fingerprint image can not be parsed；And ultrasonic fingerprint identification is for answering
It is less high with the requirement of environment, therefore ultrasonic fingerprint identification is used widely.
But the structure of existing ultrasonic fingerprint identification module is all sufficiently complex, integrated level is relatively low.
【The content of the invention】
In view of the above-mentioned problems, the present invention provides a kind of ultrasonic fingerprint identification module, module, device and electronic equipment.
The scheme that the present invention solves technical problem is to provide a kind of ultrasonic fingerprint identification module, and the ultrasonic fingerprint is known
Other module includes upper electrode layer, piezoelectric layer and lower electrode layer, and it is opposite that upper electrode layer and lower electrode layer are separately positioned on piezoelectric layer
On two surfaces, the lower electrode layer includes signal processing layer and array arrangement on surface of the signal processing layer close to piezoelectric layer
Electrode block.
Preferably, the piezoelectric layer is polarized ferroelectric polymer film in situ.
Preferably, the ferroelectric polymer film is Kynoar, polyvinyl chloride, poly- γ-methyl-L- paddy ammonia
Acid esters, makrolon, polyvinylidene fluoride copolymer, polyvinylidene fluoride, polyvinylidene fluoride trifluoro-ethylene, polymethylacrylic acid
One or several kinds of combinations in methyl esters, polytetrafluoroethylene (PTFE).
Preferably, the ferroelectric polymer film is formed in situ by wet chemical method.
Preferably, the ultrasonic fingerprint identification module further comprises protective layer, and the protective layer is arranged on top electrode
Partly or entirely covered on surface of the layer away from piezoelectric layer and by upper electrode layer.
The present invention also provides a kind of ultrasonic fingerprint to identify module, it is characterised in that：The ultrasonic fingerprint identifies module
Including ultrasonic fingerprint identification module, electrically-conductive backing plate and circuit board as described above, the electrically-conductive backing plate is located at circuit board and surpasses
Between sound wave fingerprint identification module, the ultrasonic fingerprint identification module is electrically connected with electrically-conductive backing plate, described circuit board one end
It is electrically connected with electrically-conductive backing plate, the other end is additionally operable to be electrically connected with external circuit, upper electrode layer and the lower electrode layer difference
It is electrically connected with electrically-conductive backing plate.
Preferably, the ultrasonic fingerprint identification module further comprises booster circuit layer, and the booster circuit layer is with leading
Electric substrate is electrically connected, and the booster circuit layer is used to raise the voltage that electrically-conductive backing plate is transferred to upper electrode layer.
The present invention also provides a kind of ultrasonic fingerprint recognition means, the ultrasonic fingerprint recognition means include display module
Module is identified with ultrasonic fingerprint as described above, and one of surface of the display module is to be touched for what user was operated
Face is touched, the ultrasonic fingerprint identification module is set on another face opposite with touch surface.
Preferably, the display module is OLED or TFT.
The present invention also provides a kind of electronic equipment, including ultrasonic fingerprint as described above identification module.
Compared with prior art, ultrasonic fingerprint identification module of the invention, it includes upper electrode layer, piezoelectric layer and lower electricity
Pole layer, upper electrode layer and lower electrode layer are separately positioned on two opposite surfaces of piezoelectric layer, and the lower electrode layer includes signal
The electrode block of process layer and array arrangement on surface of the signal processing layer close to piezoelectric layer.The ultrasonic fingerprint identification of the present invention
Module not only has the advantages of simple in structure, reliability is high, and it is that fingerprint identification module is directly formed in process chip,
Make the size of ultrasonic fingerprint identification module entirety smaller, be more in line with the trend that electronic equipment is lightening, integrated level is high.
In addition, the piezoelectric layer of the invention is polarized ferroelectric polymer film in situ, have piezoelectric effect it is good, point
The advantages of resolution is high.
Compared with prior art, ultrasonic fingerprint of the invention identification module, it includes ultrasonic fingerprint as described above
Identification module, electrically-conductive backing plate and circuit board, the electrically-conductive backing plate are described between circuit board and ultrasonic fingerprint identification module
Ultrasonic fingerprint identification module is electrically connected with electrically-conductive backing plate, and described circuit board one end is electrically connected with electrically-conductive backing plate, the other end
It is additionally operable to be electrically connected with external circuit, the upper electrode layer and lower electrode layer are electrically connected with electrically-conductive backing plate respectively.The present invention
Ultrasonic fingerprint identification module not only there is simple in structure, the advantages of reliability is high, and it is directly in process chip
Formed fingerprint identification module, make ultrasonic fingerprint identification module entirety size it is smaller, be more in line with electronic equipment it is lightening, collect
The trend high into degree.
Compared with prior art, ultrasonic fingerprint recognition means of the invention include display module and ultrasound as described above
Ripple fingerprint recognition module, one of surface of the display module is the touch surface operated for user, with touch surface phase
To another face on ultrasonic fingerprint identification module is set.The ultrasonic fingerprint recognition means of the present invention not only have knot
The advantages of structure is simple, and reliability is high, and it is that fingerprint identification module is directly formed in process chip, is more in line with electronics and sets
Standby trend lightening, integrated level is high.
Compared with prior art, electronic equipment of the invention, it includes ultrasonic fingerprint identification module as described above.This
The electronic equipment of invention has integrated level high, and reliability is high, it is more frivolous the advantages of.
【Brief description of the drawings】
Fig. 1 is the laminated construction schematic diagram of the ultrasonic fingerprint recognition means of first embodiment of the invention.
Fig. 2 is the laminated construction schematic diagram of the ultrasonic fingerprint identification module of first embodiment of the invention.
Fig. 3 is the laminated construction schematic diagram of the ultrasonic fingerprint recognition means of second embodiment of the invention.
Fig. 4 is the laminated construction schematic diagram of the ultrasonic fingerprint identification module of second embodiment of the invention.
【Embodiment】
In order to make the purpose of the present invention, technical solution and advantage are more clearly understood, below in conjunction with attached drawing and embodiment,
The present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only to explain the present invention, and
It is not used in the restriction present invention.
First embodiment
Please refer to Fig.1, the first embodiment of the present invention provides a kind of ultrasonic fingerprint recognition means 10, and the ultrasonic wave refers to
Line recognition means 10 include ultrasonic fingerprint identification module 10a, adhesive-layer 14 and display module 16, the display module 16 its
In surface be the touch surface 165 operated for user, be provided with adhesive-layer on another face opposite with touch surface 165
14, adhesive-layer 14 is bonded with ultrasonic fingerprint identification module 10a to strengthen ultrasonic fingerprint identification module 10a and display module 16
Bonding strength.The display module 16 can be that market is more existing including basic structures such as display layer, cover-plate glass
Display module, but preferably comprise the display module of OLED (Organic Light Emitting Diode) or TFT (thin film transistor (TFT)) etc..It is described
Display module 16 includes fingerprint identification area 161 and non-fingerprint identification area 163, the fingerprint identification area 161 and non-fingerprint identification area
163 can be the structure that can be substantially distinguished according to physical arrangement, such as：The display module bottom of iPhone is separately provided with
Fingerprint identification area；Can also be the structure distinguished according to function, such as the subregion of the display module in full frame touch-control
Fingerprint identification area is defined, fingerprint recognition can be just carried out only in the region.It is appreciated that the adhesive-layer 14 can be omitted,
The display module 16 is close to the surface of ultrasonic fingerprint identification module 10a per se with viscosity, the finger of the display module 16
Line cog region 161 is directly Nian Jie with ultrasonic fingerprint identification module 10a.(the grade side up and down mentioned in the present invention
Position word is only limitted to the relative position in given view, rather than absolute position, it will be understood that given view planar carries out 180 °
After rotation, position word " under " can replace with position word " on ".)
The ultrasonic fingerprint identification module 10a includes ultrasonic fingerprint identification module 11, booster circuit layer 13, conductive base
Plate 15 and circuit board 17.The ultrasonic fingerprint identification module 11, electrically-conductive backing plate 15 and circuit board 17 stack to form lamination successively
Structure, wherein electrically-conductive backing plate 15 is between ultrasonic fingerprint identification module 11 and circuit board 17.Circuit board 17 is with surpassing in other words
Projection of the sound wave fingerprint identification module 11 in display module 16 is least partially overlapped.11 He of ultrasonic fingerprint identification module
The position of electrically-conductive backing plate 15 is corresponding with the fingerprint identification area 161 of display module 16.The ultrasonic fingerprint identification module 11 with
Electrically-conductive backing plate 15 is electrically connected, and described 17 one end of circuit board is electrically connected with electrically-conductive backing plate 15, and the other end is used for and external circuit
Be electrically connected, the booster circuit layer 13 is electrically connected with electrically-conductive backing plate 15, its be used for the voltage of the output of electrically-conductive backing plate 15 into
Row rise.It is appreciated that, it is preferred that multiple pins 151 are provided with the surface of circuit board 17 in the electrically-conductive backing plate 15,
The circuit board 17 is electrically connected with the pin 151, and circuit board 17 realizes electric connection by welding with pin 151,
Stability is more preferable, and electrical reliability is preferable.It is appreciated that the circuit board 17 can be printed circuit board (PCB), flexible PCB or
Other circuit boards with conductive structure of person, preferably circuit board 17 is flexible PCB in the present invention, so as to reduce
Ultrasonic fingerprint identifies the thickness of module 11.It is further appreciated that the electrically-conductive backing plate 15 is preferably silicon-based wafer.
Please refer to Fig.2, the ultrasonic fingerprint identification module 11 includes upper electrode layer 111, protective layer 112, piezoelectric layer 113
With lower electrode layer 115, the upper electrode layer 111 and lower electrode layer 115 are separately positioned on two opposite surfaces of piezoelectric layer 113
On, wherein upper electrode layer 111 is set close to display module 16, the upper electrode layer 111 and lower electrode layer 115 respectively with conductive base
Plate 15 is electrically connected.The protective layer 112 is arranged on surface of the upper electrode layer 111 away from piezoelectric layer 113 and by upper electrode layer
111 partly or entirely coverings, the effect of the protective layer 112 is that upper electrode layer 111 is protected, and prevents it from aoxidizing or damaging
It is bad, so as to substantially increase the service life of ultrasonic fingerprint identification module 11.It is appreciated that the protective layer 112 can save
Slightly, so as to reduce the thickness of ultrasonic fingerprint identification module 11, it is more in line with the lightening trend of electronic equipment.The protection
The material of layer 112 is preferably silicon nitride.
The lower electrode layer 115 includes signal processing layer 1155, passivation layer 1151 and array arrangement in signal processing layer
1155 electrode block 1153 on the surface of piezoelectric layer 113, the passivation layer 1151 are arranged on electrode block 1153 close to piezoelectricity
Covered on the surface of layer 113 and by electrode block 1153.The multiple electrode block 1153 is used for the sensing for carrying out ultrasonic signal, by
In the width in a paddy ridge cycle of finger be usually 300um, by setting the size of electrode block 1153 to advantageously ensure that identification
Fingerprint clarity, so that it is guaranteed that the accuracy of fingerprint recognition.Preferably, the area of the electrode block 1153 is less than or waits
In 70 μm * 70 μm, further preferably less than or equal to 60 μm * 60 μm, still more preferably 40 μm * 40 μm, electrode block
1153 size within this range when, fingerprint recognition best results.The effect of the passivation layer 1151 be to electrode block 1153 into
Row protection, prevents it from aoxidizing or damaging, so as to substantially increase the service life of ultrasonic fingerprint identification module 11.It can manage
Solution, the passivation layer 1151 can be omitted, so as to reduce the thickness of ultrasonic fingerprint identification module 11, is more in line with electronics and sets
Standby lightening trend.The material of the passivation layer 1151 is preferably silicon nitride.Preferably, the passivation layer 1151 is by electrode block
Including 1153 integral coatings, protecting effect is optimal.It is appreciated that the signal processing layer 1155 includes a signal processing chip
Or multiple signal processing chips are arranged at intervals, the signal processing chip is used for collecting and analyzing into horizontal electrical signal.Can be with
Understanding, the upper electrode layer 111 can also be the electrode block 1153 for including multiple array arrangements, and the upper electrode layer 111
Size, the position consistency of the electrode block 1153 of the size of electrode block 1153, position and lower electrode layer 115.When upper electrode layer 111 wraps
When including the electrode block 1153 of multiple array arrangements, the lower electrode layer 115 can be a flood electrode.
Piezoelectric layer 113 is piezoelectric film, it is preferred that piezoelectric layer 113 is ferroelectric polymer film, in a specific embodiment
In, the ferroelectric polymer film is by purchasing existing ferroelectric polymer film finished product, then again by being adhered to substrate
On obtained to be polarized.In general, the ferroelectric polymer film of this finished product needs first to be drawn high with certain stress then
Polarized again by being bonded in substrate again, the ferroelectric polymer film thickness that such a method is formed is more than 30 μm, no
The frivolous development trend of existing electronic device is adapted to, and using the ultrasonic fingerprint identification module of this polarized film, due to pressure
Electrical sensing film is too thick, therefore resolution ratio is relatively low.Ferroelectric polymer film polarization method in the above embodiment is mostly direct
High voltage electric field is set to carry out between the upper and lower surface of ferroelectric polymer film, but because ferroelectric polymer film is thick in itself
The inequality of degree, it is possible that easily being punctured by high-voltage electricity place, the production qualification rate of piezoelectric film 113 is very low, is unfavorable for advising greatly
Mould produces, and the piezoelectric effect of obtained piezoelectric film 113 is poor, and service life is shorter.
In another specific embodiment, piezoelectric layer 113 of the invention is preferably the ferroelectric polymer that polarization in situ is formed
Thing film, is specially that the piezoelectric layer 113 is to be formed in situ piezoelectric film 113, the piezoelectric film in the one side of lower electrode layer 115
113 include opposite first surface and second surface, and the first surface is the one side close to lower electrode layer 115, and described the
Two surfaces are close to the surface of upper electrode layer 111.When polarization, the first surface potential for making the piezoelectric film 113 is zero；Described
Side where the second surface of piezoelectric film 113 provides the first electric field and the second electric field, and the potential of the first electric field is higher than the second electric field
Potential；The environmental gas of the side where 113 second surface of piezoelectric film, the environment gas are ionized under the action of the first electric field
Body is gathered in the second surface of piezoelectric film 113 through the second electric field, makes to be formed along film thickness direction in the piezoelectric film 113
Film internal electric field, polarization is carried out to the piezoelectric film 113 and forms the piezoelectric layer 113.It is appreciated that the ferroelectric polymers is thin
Film is formed in 115 surface of lower electrode layer by the wet chemical method such as chemical vapor deposition, coating, dip-coating, therefore can form thickness
Very thin and uniform ferroelectric polymer film is spent, thickness can be less than 30 μm, it is preferred that thickness can maintain less than 9 μm, from
And reducing the transmission loss of signal, formation process is simple, moreover, being known using the ultrasonic fingerprint of this polarized film being formed in situ
Other module 11, resolution ratio greatly improves.The thickness of the piezoelectric layer 113 may further be less than 9 μm, and yet further, it is thick
Degree can be 1.5-7.4 μm, 1.9-7.2 μm, 2.2-8.6 μm, 2.8-8.4 μm or 3.6-6.6 μm, further, can
Be specifically 1.8 μm, 2.4 μm, 2.6 μm, 3.7 μm, 3.9 μm, 4.2 μm, 4.6 μm, 5.6 μm, 5.8 μm, 6.7 μm, 8.6 μm, 8.7
μm。
Furthermore polarization of electrode method, above-mentioned virtual polarization side are set compared to the upper and lower surface directly in piezoelectric layer 113
Method will not make piezoelectric layer 113 directly bear applied high voltage electric field, be avoided that piezoelectric layer 113 is breakdown.Specifically, above-mentioned pole
Changing can use ion body polarization (Chinese patent application that for details, reference can be made to Application No. 201710108374.9) or X-ray to polarize
The mode of (Chinese patent application that for details, reference can be made to Application No. 201611222575.3) forms the piezoelectric layer, is formed
Piezoelectric layer 113 can accomplish it is very thin, moreover, the piezoelectric layer 113 of the present invention piezoelectric effect is preferable and service life length, can
It is useful in ultrasonic fingerprint identification module 11, is imitated beneficial to realizing that ultrasonic fingerprint identification module 11 preferably identifies well
Fruit.In this embodiment, the scope for having carried out the piezoelectric constant d33 of the polarized piezoelectric layer 113 in situ is 20-
35pC/N, more preferably 25 ￣ 29pC/N.
It is appreciated that the material of the piezoelectric layer 113 is ferroelectric polymer material, it is specific to can be selected but be not limited to：It is poly- inclined
Vinyl fluoride, polyvinyl chloride, poly-γ-methyl-L-glutamate, makrolon, Kynoar, polyvinylidene fluoride
PVDF, polyvinylidene fluoride trifluoro-ethylene PVDF-TrFE, polymetylmethacrylate, polytetrafluoroethylene (PTFE) TEFLON etc. are altogether
One or several kinds of combinations in polymers.
In some embodiments of the invention, the copolymer of the material selection Kynoar of the piezoelectric layer 113 is poly-
Vinylidene-trifluoro-ethylene copolymer, specific is polyvinylidene fluoride trifluoro-ethylene PVDF-TrFE, in order to obtain piezoelectricity
The preferable piezoelectric layer of effect, the scope of the mass ratio of the polyvinylidene fluoride and trifluoro-ethylene is (60-95)：(5-30),
Preferably, the scope of its mass ratio is (75-86)：(15-25), it is further preferred that its mass ratio is 80：20 or 75：25
Or 70：30, the polyvinylidene fluoride and trifluoro-ethylene copolymer more individually select polyvinylidene fluoride to reduce cost, and its
Also there is preferable piezoelectric effect.
Existing α phases crystal grain also has β phases crystal grain and non-in the piezoelectric film 113 of gained after ferroelectric polymer film polarization
Amorphous material, the content of β phases is corresponding with the piezoelectric effect of piezoelectric film 113, when the content that β phase crystal grain accounts for total crystal grain is 60-
When 70%, polarized film has preferable piezoelectric effect, and the piezoelectric effect of the content more high polarization film of β phases is better.But excessively
Polarization can produce unnecessary unnecessary electric charge etc., these excess charges are easily tied again with other electric charges on polymer surfaces
Close, so as to influence the performance of gained piezoelectric film.In the present embodiment, the β phases crystal grain of the ferroelectric polymers piezoelectric film 113 with it is total
Crystal grain mass ratio is 60 ￣ 70%.
Referring again to Fig. 1, the ultrasonic fingerprint identification module 10a further comprises discrete device 18 and connector 19,
For that can not integrate the electronic component made with signal processing layer 1155, the discrete device 18 be arranged on the discrete device 18
Circuit board 17 is electrically connected on the surface of ultrasonic fingerprint identification module 11 and with circuit board 17, and its position and display mould
The non-fingerprint identification area 163 of group 16 corresponds to.The connector 19 is arranged on circuit board 17 close to ultrasonic fingerprint identification module 11
Surface on, the connector 19 is used for and external circuit is electrically connected, the position of the connector 19 and display module 16
Non- fingerprint identification area 163 is corresponding.Projection of the above-mentioned discrete device 18 and connector 19 in display module 16 all falls
In non-fingerprint identification area 163.It is appreciated that the connector 19 is preferably FPC connector, make the electricity of circuit board and external circuit
Property connection it is more firm.
A work period of ultrasonic fingerprint identification module 10a includes launching phase and receives stage two parts.Transmitting
Stage, external circuit pass sequentially through circuit board 17, electrically-conductive backing plate 15 while give upper electrode layer 111 and lower electrode layer 115 respectively
Voltage signal, when the voltage signal for giving upper electrode layer 111 is higher than the voltage signal for giving lower electrode layer 115, without leading to again
13 pairs of voltage signal for giving upper electrode layer 111 of booster circuit layer are crossed to raise；When giving upper electrode layer 111 and lower electrode layer
During 115 identical voltage signal, the voltage signal that 13 pairs of electrically-conductive backing plate 15 of booster circuit layer are transferred to upper electrode layer 111 rises
It is high；When the potential of upper electrode layer 111 is higher than the potential of lower electrode layer 115, the both sides of piezoelectric layer 113 form an electrical potential difference, make
Piezoelectric layer 113 produces mechanical oscillation and sends ultrasonic wave, and external circuit stops giving upper electrode layer 111 and the electricity of lower electrode layer 115
Press signal.Reception stage, the ultrasonic wave that piezoelectric layer 113 is sent touch finger back reflection, due at fingerprint valley and at fingerprint ridge
Compared to there are more air, therefore the fingerprint valley of finger and the signal strength that is reflected at fingerprint ridge are different, usual fingerprint valley institute
The energy of the ultrasonic wave of reflection can be bigger than the ultrasonic energy that fingerprint ridge is reflected, i.e., the signal strength that fingerprint valley is reflected is eager to excel
In the signal strength that fingerprint ridge is reflected, piezoelectric layer 113 receives fingerprint valley and fingerprint ridge is reflected different ultrasonic waves
Signal, by setting the size of electrode block 1153, corresponds to a paddy ridge cycle of finger so as to produce different electric signals
Multiple electrodes block 1153, therefore, corresponds respectively to the electrode block 1153 of fingerprint valley and fingerprint ridge since the effect of electrostatic coupling is produced
The charge inducing of raw varying number, signal processing layer 1155 realize that fingerprint is known by detecting the difference of the quantity of charge inducing
Not, testing result is finally passed into external circuit by circuit board 17.
The first embodiment of the present invention also provides a kind of electronic equipment, it uses ultrasonic fingerprint identification mould as described above
Block.The equipment that the electronic equipment includes but not limited to the brush finger line such as mobile phone, computer, tablet computer, attendance recorder.
Second embodiment
Please refer to Fig.3, the second embodiment of the present invention also provides the ultrasonic fingerprint recognition means 20 of another structure, institute
Stating ultrasonic fingerprint recognition means 20 includes ultrasonic fingerprint identification module 20a, display module 26 and adhesive-layer 24, the display
One of surface of module 26 is the touch surface 265 operated for user, is set on another face opposite with touch surface 265
Be equipped with adhesive-layer 24, adhesive-layer 24 bonded with ultrasonic fingerprint identification module 20a with strengthen ultrasonic fingerprint identification module 20a with
The bonding strength of display module 26.The display module 26 can be that market is more existing including display layer, cover-plate glass etc.
The display module of basic structure, but preferably comprise the aobvious of OLED (Organic Light Emitting Diode) or TFT (thin film transistor (TFT)) etc.
Show module.The display module 26 includes fingerprint identification area 261 and non-fingerprint identification area 263, the fingerprint identification area 261 and non-
Fingerprint identification area 263 can be the structure that can be substantially distinguished according to physical arrangement, such as：The display module bottom of iPhone
It is separately provided with fingerprint identification area；Can also be the structure distinguished according to function, such as the display module in full frame touch-control
Subregion define fingerprint identification area, fingerprint recognition can be just carried out only in the region.It is appreciated that the adhesive-layer 24
It can be omitted, the display module 26 is close to the surface of ultrasonic fingerprint identification module 20a per se with viscosity, the display mould
The fingerprint identification area 261 of group 26 is directly connected with ultrasonic fingerprint identification module 20a.(mentioned in the present invention up and down
The relative position being only limitted to Deng the noun of locality in given view, rather than absolute position, for example, it is to be understood that given view is in plane
It is interior carry out 180 ° rotation after, position word " under " can replace with position word " on ".)
The ultrasonic fingerprint identification module 20a includes ultrasonic fingerprint identification module 21, non-conductive substrate 25 and circuit
Plate 27, the ultrasonic fingerprint identification module 21 are overlayed on non-conductive substrate 25, and ultrasonic fingerprint identification module 21 and not
The position of electrically-conductive backing plate 25 is corresponding with the fingerprint identification area 261 of display module 26, position and the display module 26 of circuit board 27
Non- fingerprint identification area 263 it is corresponding, circuit board 27 and ultrasonic fingerprint identification module 21 are in display module 26 in other words
Projection is not overlapping.The ultrasonic fingerprint identification module 21 is electrically connected with circuit board 27, and circuit board 27 is additionally operable to and external electrical
Road is electrically connected.It is appreciated that the circuit board 27 can be printed circuit board (PCB), flexible PCB (Flexible Printed
Circuit, abbreviation FPC) or other circuit boards with conductive structure, preferably circuit board 27 is flexible electrical in the present invention
Road plate.It is further appreciated that the non-conductive substrate 25 is preferably glass.
Please also refer to Fig. 3 and Fig. 4, upper electrode layer 211 of the ultrasonic fingerprint identification module 21 including lamination setting,
Piezoelectric layer 213 and lower electrode layer 215, upper electrode layer 211 and lower electrode layer 215 are separately positioned on opposite two of piezoelectric layer 213
On surface, wherein upper electrode layer 211 is set close to display module 26, the circuit board 27 respectively with upper electrode layer 211 and lower electricity
Pole layer 215 is electrically connected.The lower electrode layer 215 includes multiple electrode blocks 2153 in array distribution, the electrode block 2153
Non-conductive substrate 25 is provided on the surface of display module 26, the size requirement of the electrode block 2153 and first is in fact
Apply in example unanimously, therefore details are not described herein.It is appreciated that the upper electrode layer 211 can also be flood conduction or pass through
The conducting block of multiple array arrangements is set to realize electric connection with circuit board 27.It is appreciated that the upper electrode layer 211 also may be used
To be the electrode block 2153 for including multiple array arrangements, and the size of the electrode block 2153 of the upper electrode layer 211, position are with
The size of the electrode block 2153 of electrode layer 215 is consistent, position corresponds.When upper electrode layer 211 includes multiple array arrangements
During electrode block 2153, the lower electrode layer 215 can be a flood electrode.
It is appreciated that the piezoelectric layer 213 is piezoelectric film, it is preferred that piezoelectric layer 213 is polarized ferroelectric polymers in situ
Film, specifically, piezoelectric layer 213 is to carry out polarization in situ on the non-conductive substrate 25 with electrode block 2153 to obtain, is closed
In polarized content in situ with consistent in first embodiment, therefore details are not described herein.
Please refer to Fig.3, it will be understood that the size of the non-conductive substrate 25 is greater than ultrasonic fingerprint identification module 21
Size, multiple pins 251 are provided with fringe region of the non-conductive substrate 25 close to the surface of ultrasonic fingerprint identification module 21,
Multiple electrodes block 2153 corresponds with multiple pins 251 be electrically connected respectively, and the circuit board 27 electrically connects with pin 251
Connect.The electric connection of electrode block 2153 and circuit board 27 is realized by setting pin 251, can both reduce difficulty of processing, no
Individually it is electrically connected one by one with circuit board with by electrode block 2153, and pin 251 can make bulk, in circuit board
27 are connected more firm, reliability higher with pin 251, and technique is simple.
Referring again to Fig. 3, it will be understood that the ultrasonic wave identification module 20a further comprises signal processing layer 28, described
The position of signal processing layer 28 is corresponding with the non-fingerprint identification area 263 of display module 26, i.e., signal processing layer 28 is in display mould
Projection of the projection with ultrasonic fingerprint identification module 21 in display module 26 in group 26 be not overlapping, and signal processing layer 28 and
Circuit board 27 is electrically connected.Such structure setting can reduce the thickness of ultrasonic wave identification module 20a, be allowed to more meet electronics
The lightening trend of equipment.It is appreciated that the signal processing layer 28 includes an independent signal processing chip or multiple letters
Number process chip is arranged at intervals, and the signal processing chip is used to electric signal is collected and analyzed.
It is appreciated that the ultrasonic wave identification module 20a further comprises booster circuit layer 23, the booster circuit layer 23
Position it is corresponding with the position of the non-fingerprint identification area 263 of display module 26, i.e., described booster circuit layer 23 is in display module
Projection of the projection with ultrasonic fingerprint identification module 21 in display module 26 on 26 be not overlapping, and the booster circuit layer 23
It is electrically connected with circuit board 27, the booster circuit layer 23 is used for the voltage that boost circuit plate 27 is transferred to upper electrode layer 211.
It is appreciated that the ultrasonic fingerprint identification module 20a further comprises connector 29, the connector 29 is set
It is electrically connected on circuit board 27 and with circuit board 27, the connector 29 is used to be electrically connected with external circuit, the connection
The position of device 29 is corresponding with the non-fingerprint identification area 263 of display module 26.It is appreciated that the connector 29 is preferably FPC
Connector, makes the electric connection of circuit board and external circuit more firm.
The fingerprint identification process of the present embodiment is consistent with first embodiment principle, therefore details are not described herein.
The second embodiment of the present invention also provides a kind of electronic equipment, it uses ultrasonic fingerprint identification mould as described above
Group.The equipment that the electronic equipment includes but not limited to the brush finger line such as mobile phone, computer, tablet computer, attendance recorder.
Compared with prior art, ultrasonic fingerprint identification module of the invention, it includes upper electrode layer, piezoelectric layer and lower electricity
Pole layer, upper electrode layer and lower electrode layer are separately positioned on two opposite surfaces of piezoelectric layer, and the lower electrode layer includes signal
The electrode block of process layer and array arrangement on surface of the signal processing layer close to piezoelectric layer.The ultrasonic fingerprint identification of the present invention
Module not only has the advantages of simple in structure, reliability is high, and it is that fingerprint identification module is directly formed in process chip,
Make the size of ultrasonic fingerprint identification module entirety smaller, be more in line with the trend that electronic equipment is lightening, integrated level is high.
In addition, the piezoelectric layer of the invention is polarized ferroelectric polymer film in situ, have piezoelectric effect it is good, point
The advantages of resolution is high.
Compared with prior art, ultrasonic fingerprint of the invention identification module, it includes ultrasonic fingerprint as described above
Identification module, electrically-conductive backing plate and circuit board, the electrically-conductive backing plate are described between circuit board and ultrasonic fingerprint identification module
Ultrasonic fingerprint identification module is electrically connected with electrically-conductive backing plate, and described circuit board one end is electrically connected with electrically-conductive backing plate, the other end
It is additionally operable to be electrically connected with external circuit, the upper electrode layer and lower electrode layer are electrically connected with electrically-conductive backing plate respectively.The present invention
Ultrasonic fingerprint identification module not only there is simple in structure, the advantages of reliability is high, and it is directly in process chip
Formed fingerprint identification module, make ultrasonic fingerprint identification module entirety size it is smaller, be more in line with electronic equipment it is lightening, collect
The trend high into degree.
Compared with prior art, ultrasonic fingerprint recognition means of the invention include display module and ultrasound as described above
Ripple fingerprint recognition module, one of surface of the display module is the touch surface operated for user, with touch surface phase
To another face on ultrasonic fingerprint identification module is set.The ultrasonic fingerprint recognition means of the present invention not only have knot
The advantages of structure is simple, and reliability is high, and it is that fingerprint identification module is directly formed in process chip, is more in line with electronics and sets
Standby trend lightening, integrated level is high.
Compared with prior art, electronic equipment of the invention, it includes ultrasonic fingerprint identification module as described above.This
The electronic equipment of invention has integrated level high, and reliability is high, it is more frivolous the advantages of.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all originals in the present invention
Any modification made within then, equivalent substitution and improvement etc. should all be included within protection scope of the present invention.
Claims (10)
- A kind of 1. ultrasonic fingerprint identification module, it is characterised in that：The ultrasonic fingerprint identification module includes upper electrode layer, pressure Electric layer and lower electrode layer, upper electrode layer and lower electrode layer are separately positioned on two opposite surfaces of piezoelectric layer, the bottom electrode Layer includes signal processing layer and array arrangement the electrode block on surface of the signal processing layer close to piezoelectric layer.
- 2. ultrasonic fingerprint identification module as claimed in claim 1, it is characterised in that：The piezoelectric layer is polarized iron in situ Electric polymer film.
- 3. ultrasonic fingerprint identification module as claimed in claim 2, it is characterised in that：The ferroelectric polymer film is poly- inclined Vinyl fluoride, polyvinyl chloride, poly-γ-methyl-L-glutamate, makrolon, polyvinylidene fluoride copolymer, gather inclined difluoro One or several kinds of combinations in ethene, polyvinylidene fluoride trifluoro-ethylene, polymethyl methacrylate, polytetrafluoroethylene (PTFE).
- 4. ultrasonic fingerprint identification module as claimed in claim 2, it is characterised in that：The ferroelectric polymer film passes through wet Chemical method is formed in situ.
- 5. ultrasonic fingerprint identification module as claimed in claim 1, it is characterised in that：The ultrasonic fingerprint identification module into One step includes protective layer, and the protective layer is arranged on surface of the upper electrode layer away from piezoelectric layer and by upper electrode layer part or entirely Portion covers.
- 6. a kind of ultrasonic fingerprint identifies module, it is characterised in that：The ultrasonic fingerprint identification module includes such as claim 1-5 any one of them ultrasonic fingerprints identification module, electrically-conductive backing plate and circuit board, the electrically-conductive backing plate be located at circuit board and Between ultrasonic fingerprint identification module, the ultrasonic fingerprint identification module is electrically connected with electrically-conductive backing plate, the circuit board one End is electrically connected with electrically-conductive backing plate, and the other end is additionally operable to be electrically connected with external circuit, the upper electrode layer and lower electrode layer point It is not electrically connected with electrically-conductive backing plate.
- 7. ultrasonic fingerprint as claimed in claim 6 identifies module, it is characterised in that：The ultrasonic fingerprint identify module into One step includes booster circuit layer, and the booster circuit layer is electrically connected with electrically-conductive backing plate, and the booster circuit layer is led for rise Electric substrate is transferred to the voltage of upper electrode layer.
- A kind of 8. ultrasonic fingerprint recognition means, it is characterised in that：The ultrasonic fingerprint recognition means include display module and Ultrasonic fingerprint identification module as claimed in claim 6, one of surface of the display module are to be grasped for user The touch surface of work, the ultrasonic fingerprint identification module is set on another face opposite with touch surface.
- 9. ultrasonic fingerprint recognition means as claimed in claim 8, it is characterised in that：The display module for OLED or TFT。
- 10. a kind of electronic equipment, it is characterised in that：Module is identified including ultrasonic fingerprint as claimed in claim 6.
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