CN217690134U - Ultrasonic fingerprint identification device and electronic equipment - Google Patents
Ultrasonic fingerprint identification device and electronic equipment Download PDFInfo
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- CN217690134U CN217690134U CN202221346217.4U CN202221346217U CN217690134U CN 217690134 U CN217690134 U CN 217690134U CN 202221346217 U CN202221346217 U CN 202221346217U CN 217690134 U CN217690134 U CN 217690134U
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Abstract
The application provides an ultrasonic fingerprint identification device and electronic equipment, has good performance. Supersound fingerprint identification device sets up in order to realize ultrasonic fingerprint identification under the screen below the display screen, include: the ultrasonic detection chip is bonded with the display screen, a piezoelectric material layer and a metal wiring layer are arranged on one side, away from the display screen, of the ultrasonic detection chip, the piezoelectric material layer is used for transmitting an ultrasonic signal to a finger above the display screen and receiving an ultrasonic detection signal returned by the finger, and the ultrasonic detection signal is used for the ultrasonic detection chip to acquire fingerprint information of the finger; and the FPC is arranged on one side, far away from the display screen, of the ultrasonic detection chip, and bonding pads of the FPC and bonding pads of the metal wiring layer are pressed through ACF to achieve interconnection between the ultrasonic detection chip and the FPC.
Description
Technical Field
The embodiment of the application relates to the field of fingerprint identification, and more particularly relates to an ultrasonic fingerprint identification device and an electronic device.
Background
With the social progress, the mobile phone has become one of the essential electronic devices in modern life. At present, mobile phones in the market all have one or more identity authentication modes, including digital passwords, gesture graphs, facial recognition, fingerprint recognition and the like. Among them, fingerprint identification has become the standard of most mobile phones due to its characteristics of convenient application, fast identification speed, stability and reliability. Different technical routes are developed for fingerprint identification, including capacitive fingerprint identification, optical fingerprint identification, ultrasonic fingerprint identification and the like.
Ultrasonic fingerprint identification can not only identify the surface morphology of the fingerprint, but also identify the signal of the dermis of the finger, thereby realizing natural 3D anti-counterfeiting, and compared with optical fingerprint identification, ultrasonic fingerprint identification has higher tolerance to the clean state of the surface of the finger. Therefore, ultrasonic fingerprint recognition is gradually becoming a new generation of fingerprint recognition. How to improve the packaging structure of the ultrasonic fingerprint identification device to improve the performance thereof becomes a problem to be solved.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides an ultrasonic fingerprint identification device and electronic equipment, and the ultrasonic fingerprint identification device and the electronic equipment have good performance.
In a first aspect, an ultrasonic fingerprint identification device is provided, which is disposed below a display screen of an electronic device to realize ultrasonic fingerprint identification under the screen, and the ultrasonic fingerprint identification device includes: the ultrasonic detection chip is bonded with the display screen, a piezoelectric material layer and a metal wiring layer are arranged on one side, away from the display screen, of the ultrasonic detection chip, the piezoelectric material layer is used for transmitting ultrasonic signals to a finger above the display screen and receiving ultrasonic detection signals returned by the finger, and the ultrasonic detection signals are used for the ultrasonic detection chip to acquire fingerprint information of the finger; and the flexible circuit board is arranged on one side, far away from the display screen, of the ultrasonic detection chip, and a bonding pad of the flexible circuit board is in press fit with a bonding pad of the metal wiring layer through an anisotropic conductive adhesive film, so that interconnection between the ultrasonic detection chip and the flexible circuit board is realized.
In this application embodiment, ultrasonic fingerprint identification device adopts the mode laminating of back of the body subsides at the lower surface of display screen, and is opposite with just pasting the mode, and ultrasonic testing chip among the ultrasonic fingerprint identification device is close to the display screen setting and piezoelectric material keeps away from the display screen setting. The ultrasonic fingerprint identification device comprises an ultrasonic detection chip, one surface of the ultrasonic detection chip is directly bonded on the lower surface of the display screen, and the other surface of the ultrasonic detection chip is a piezoelectric material layer and a metal wiring layer. Because the ultrasonic detection chip is attached to the display screen, the ultrasonic detection chip has certain strength and large attachment area, the warping generated after the ultrasonic fingerprint identification device is attached to the display screen is reduced, and the appearance mark is not easy to appear on the display screen. The ultrasonic detection signal returned by the finger passes through the piezoelectric material layer and then reaches the air interface, and can be totally reflected, and the encapsulated laminated structure is simple, so that the signal loss is reduced, and the fingerprint identification performance of the ultrasonic fingerprint identification device is improved.
In one implementation manner, the metal wiring layer is a redistribution layer, and the bonding pad of the flexible circuit board and the bonding pad of the redistribution layer are pressed together through the anisotropic conductive adhesive film, so as to realize interconnection between the ultrasonic detection chip and the flexible circuit board. A new bonding pad is formed on the surface of the fingerprint identification chip in a rewiring mode, so that the flexible circuit board and the ultrasonic detection chip are conveniently and electrically connected.
In one implementation manner, a step recessed towards the display screen is arranged at the edge of the ultrasonic detection chip, and the redistribution layer is arranged in the step so as to form a pad used for connecting the flexible circuit board in the step. The depth of the step may be, for example, less than or equal to 100um.
Through setting up the step to form the pad in the step through the mode of rewiring, make the pressfitting face between the pad of flexible circuit board and the pad of rewiring layer be located the step, reduced the height of flexible circuit board, and then reduced ultrasonic fingerprint identification device's whole thickness, saved electronic equipment's inner space.
In one implementation, the thickness of the layer of piezoelectric material is less than or equal to 50um; or the piezoelectric material layer is far away from the surface of the ultrasonic detection chip and is closer to the display screen than the surface of the flexible circuit board far away from the ultrasonic detection chip. The ultrasonic fingerprint identification device has the advantages that the requirements for ultrasonic emission and reception are met, meanwhile, the whole thickness of the ultrasonic fingerprint identification device is reduced, and the internal space of electronic equipment is saved.
In one implementation manner, the ultrasonic detection chip and the display screen are bonded through an adhesive film, the thickness of the adhesive film is less than or equal to 50um, and/or the acoustic resistance coefficient of the adhesive film is greater than or equal to 4. For example, the adhesive film is a chip adhesive film or epoxy resin, so that good adhesive capacity is guaranteed, the thickness of the module is not increased, and the influence on signal transmission is reduced.
In one implementation manner, a first electrode is disposed on a surface of the piezoelectric material layer close to the ultrasonic detection chip, and a second electrode is disposed on a surface of the piezoelectric material layer away from the ultrasonic detection chip, where the second electrode is an electrode array composed of a plurality of electrodes, and the first electrode and the second electrode are electrically connected to the ultrasonic detection chip.
In one implementation, the piezoelectric material layer is formed of at least one of the following materials: polyvinylidene fluoride, polyvinylidene fluoride-trifluoroethylene copolymer, barium titanate system and lead zirconate titanate binary system, and a third ABO3 type compound is added into the binary system, wherein A represents divalent metal ions, B represents tetravalent metal ions or the sum of several ions is positive quadrivalence.
In a second aspect, an electronic device is provided, including: a display screen; and the ultrasonic fingerprint identification device according to the first aspect or any implementation manner of the first aspect.
Drawings
Fig. 1 is a schematic block diagram of an ultrasonic fingerprint identification device according to an embodiment of the present application.
Fig. 2 is a schematic diagram of one possible specific structure of the ultrasonic fingerprint identification device shown in fig. 1.
Fig. 3 is a schematic diagram of another possible specific structure of the ultrasonic fingerprint identification device shown in fig. 1.
Fig. 4 is a schematic diagram of an electronic device according to an embodiment of the present application.
Detailed Description
The technical solution in the present application will be described below with reference to the accompanying drawings.
The ultrasonic fingerprint identification device comprises an ultrasonic detection chip, a piezoelectric material layer and an FPC (flexible printed circuit) connected with the ultrasonic detection chip. The ultrasonic detection chip is an Application Specific Integrated Circuit (ASIC) for ultrasonic fingerprint recognition, such as a CMOS chip. The two surfaces of the piezoelectric material layer are respectively provided with a first electrode and a second electrode, the ultrasonic detection chip can output an excitation signal and load the excitation signal to the first electrode and the second electrode, under the action of the excitation signal, the piezoelectric material layer generates vibration based on a piezoelectric effect, so that an ultrasonic signal is emitted to a finger above the display screen, the ultrasonic signal is transmitted to the surface of the finger, and the ultrasonic detection signal is returned by emission or scattering at a fingerprint valley and a fingerprint ridge. The ultrasonic detection signal is transmitted to the piezoelectric material layer, based on the inverse piezoelectric effect, a potential difference is generated between the first electrode and the second electrode, a corresponding electric signal is obtained, and the ultrasonic detection chip processes the signal, so that fingerprint information of the finger is obtained.
The ultrasonic fingerprint identification device is adhered below the display screen to realize the ultrasonic fingerprint identification under the screen. Generally, the ultrasonic fingerprint identification device is adhered below a display screen in a positive adhesion mode, an ultrasonic detection chip and a flexible circuit board are adhered to the upper surface of a substrate, and the ultrasonic detection chip and the flexible circuit board are interconnected, so that signals of the ultrasonic detection chip can be output through the flexible circuit board. The upper surface of the ultrasonic detection chip is a piezoelectric material layer, and the piezoelectric material layer is attached to the lower surface of the display screen. When the positive sticking mode is adopted, the ultrasonic fingerprint identification device is easy to warp after being stuck with the display screen, appearance marks are easy to appear on the display screen, and the transmission of ultrasonic signals and the performance of the ultrasonic fingerprint identification device are possibly influenced due to the complex laminated structure.
Therefore, the embodiment of the application provides an ultrasonic fingerprint identification device, and the ultrasonic fingerprint identification device is pasted below a display screen in a back pasting mode, so that warping generated after the ultrasonic fingerprint identification device is pasted with the display screen can be reduced, appearance marks are not easy to appear on the display screen, and through a reasonable-design laminated structure, loss of ultrasonic signals is reduced, and performance of the ultrasonic fingerprint identification device is improved.
Fig. 1 is a schematic block diagram of an ultrasonic fingerprint identification device 200 according to an embodiment of the present application. The display screen 100 includes a light emitting panel and a cover plate over the light emitting panel. The ultrasonic fingerprint recognition apparatus 200 may be disposed below the display screen 100 of the electronic device, for example, below a Light Emitting panel, such as an Active Matrix Organic Light Emitting Diode (AMOLED) panel, of the display screen 100, or below a cover plate of the display screen 100, so as to realize the under-screen ultrasonic fingerprint recognition. As shown in fig. 1, the ultrasonic fingerprint recognition apparatus 200 includes an ultrasonic detection chip 220 and a Flexible Printed Circuit (FPC) 230.
The ultrasonic detection chip 220 is bonded to the display screen 100, a piezoelectric material layer 221 and a metal wiring layer 222 are disposed on a side, away from the display screen 100, of the ultrasonic detection chip 220, the piezoelectric material layer 221 is used for emitting an ultrasonic signal to a finger above the display screen 100, and receiving an ultrasonic detection signal returned by the finger, where the ultrasonic detection signal is used for the ultrasonic detection chip 220 to obtain fingerprint information of the finger.
The FPC230 is disposed on a side of the ultrasonic detection chip 220 away from the display screen 100, and a pad of the FPC230 is electrically connected to a pad of the metal wiring layer 222, for example, the pad of the FPC230 and the pad of the metal wiring layer 222 are pressed together by an Anisotropic Conductive Film (ACF) to realize interconnection between the FPC230 and the ultrasonic detection chip 220, so that the piezoelectric material layer 221 is not affected by high temperature generated in the packaging process.
In the embodiment of the present application, the ultrasonic fingerprint identification device 200 is attached to the lower surface of the display screen 100 in a back-to-back manner, and the ultrasonic detection chip 220 in the ultrasonic fingerprint identification device 200 is disposed close to the display screen 10 and the piezoelectric material layer 221 is disposed away from the display screen 100, which is opposite to the front-to-back manner. The ultrasonic fingerprint recognition device 200 includes an ultrasonic detection chip 220, one surface of the ultrasonic detection chip 220 is directly bonded on the lower surface of the display screen 100, and the other surface is a piezoelectric material layer and a metal wiring layer. Because the ultrasonic detection chip 220 is attached to the display screen 100, the ultrasonic detection chip has certain strength and a large attachment area, the warpage generated after the ultrasonic fingerprint identification device 200 is attached to the display screen 100 is reduced, and the appearance mark is not easy to appear on the display screen 100. Because the ultrasonic detection signal returned by the finger reaches the air interface after passing through the piezoelectric material layer 221 and can be totally reflected, and the encapsulated laminated structure is simpler, the signal loss is reduced, and the fingerprint identification performance of the ultrasonic fingerprint identification device 200 is improved.
Hereinafter, the ultrasonic fingerprint recognition apparatus according to the embodiment of the present application will be described in detail with reference to fig. 2 and 3. It should be understood that the top in fig. 2 and 3 is the bottom of the display screen 110. The ultrasonic fingerprint recognition device 200 is disposed below the display screen 110, i.e., above fig. 2 and 3, to realize the off-screen ultrasonic fingerprint recognition.
As shown in fig. 2 and 3, the ultrasonic fingerprint recognition device 200 includes an ultrasonic detection chip 220 and an FPC230. The ultrasonic detection chip 220 is attached to the lower surface of the display screen 110. The side of the ultrasonic detection chip 220 away from the display screen 100 is provided with a piezoelectric material layer 221 and a metal wiring layer 222. The metal wiring layer 222 is used to electrically connect with the FPC230 to realize signal transmission.
The piezoelectric material layer 221 may be formed of, for example, polyvinylidene fluoride (PVDF) or polyvinylidene fluoride-trifluoroethylene copolymer (PVDF-TrFE); alternatively, it can be formed by lead zirconate titanate (PZT) or its equivalent material such as barium titanate system, lead zirconate titanate binary system, and adding a third ABO3 type compound in the binary system, wherein a represents divalent metal ion, B represents tetravalent metal ion or the total of several ions is positive tetravalent. The surface of the piezoelectric material layer 221 close to the ultrasonic detection chip 220 is provided with a first electrode 2211, and the surface thereof far from the ultrasonic detection chip 220 is provided with a second electrode 2212. The first and second electrodes 2211 and 2212 are electrically connected to the ultrasonic detection chip 220. The first electrode 2211 is a planar electrode formed on the surface of the piezoelectric material layer 221 by sputtering or the like, for example, and the second electrode 2212 is an electrode array including a plurality of electrodes, for example. The material of the first electrode 2211 may be, for example, al, and the material of the second electrode 2212 may be, for example, ag. The ultrasonic detection signal returned by the finger will generate an electrical signal between the first electrode 2211 and each electrode in the electrode array, and the electrical signal corresponding to each electrode can be used as the pixel value of one pixel in the fingerprint pattern of the finger.
The ultrasonic detection chip 220 includes a sensor circuit module, the surface of the sensor circuit module is a piezoelectric material layer 221 and a metal wiring layer 222, the sensor circuit module is electrically connected to the first electrode 2211, the second electrode 2212 and the metal wiring layer 222, and the metal wiring layer 222 leads out an electrical signal generated by the ultrasonic detection chip 220 through the FPC230.
For example, as shown in the ultrasonic fingerprint identification device 200 of fig. 2, the metal wiring layer 222 is located on the surface of the ultrasonic detection chip 220 away from the display screen 100, and the FPC230 and the metal wiring layer 222 on the surface of the ultrasonic detection chip 220 are directly bonded through the ACF, so as to achieve interconnection between the ultrasonic detection chip 220 and the FPC230.
In one implementation, the metal wiring Layer 222 is a (RDL) Layer 222, and the pads of the FPC230 and the pads of the RDL Layer 222 are bonded together by ACF to realize interconnection between the ultrasonic detection chip 220 and the FPC230. That is, a new pad is formed on the surface of the ultrasonic inspection chip 220 by re-wiring, which facilitates electrical connection between the FPC230 and the ultrasonic inspection chip 220.
By adopting the rewiring method, the position, number, width, or the like of the line contacts (I/O pads) of the ultrasonic detection chip 220 can be changed, so that the ultrasonic detection chip 220 can be applied to different packaging methods. In addition, by properly designing the RDL layer 222, a larger number of nodes and a thinner package structure can be realized. When the bonding pads of the FPC230 and the RDL layer 222 are laminated through the ACF, the difficulty of the process operation is reduced, and the interconnection between the FPC230 and the ultrasonic detection chip 220 is facilitated.
For example, as shown in the ultrasonic fingerprint recognition device 200 of fig. 3, the edge of the ultrasonic detection chip 220 is provided with a step 223 recessed toward the display screen 100, and the rdl layer 222 is disposed in the step 223 to form a pad for connecting the FPC230 within the step 223. The step 225 may be formed by, for example, grooving (Trench), laser (Laser), or etching.
It can be seen that by arranging the step 223 and forming the bonding pad in the step 223 in a rewiring manner, the bonding surface between the bonding pad of the FPC230 and the bonding pad of the RDL layer 222 is located in the step 223, so that the height of the FPC230 is reduced, the overall thickness of the ultrasonic fingerprint identification device 200 is reduced, and the internal space of the electronic device is saved. The depth of the step 223 may be less than or equal to 100um, for example.
In addition, since the piezoelectric material layer 221 is not resistant to high temperature, the bond pads of the FPC230 and the bond pads of the RDL layer 222 are pressed together in an ACF manner, so that interconnection between the FPC230 and the ultrasonic detection chip 220 is realized. Compared with the SMT method, the ACF method does not generate excessive high temperature, and does not damage the piezoelectric material layer 221 during the packaging process, thereby avoiding the conflict of the manufacturing process.
However, when the bonding pads of the FPC230 and the RDL layer 222 are pressed, since the pressing head also has a certain temperature, a certain distance should be kept between the RDL layer 222 and the piezoelectric material layer 221, that is, the size of the step 223 in the direction along the surface of the display screen 100 cannot be made too small.
After the bonding pad of the FPC230 and the bonding pad of the RDL layer 222 on the surface of the substrate 210 are pressed together by the ACF, based on the conduction principle of the ACF, the conductive particles in the ACF connect the pad on the bonding pad of the RDL layer 222 and the pad on the bonding pad of the FPC230 to make the two conductive, and simultaneously, conduction short circuit between two adjacent pads is avoided, so that the purpose of conduction only in the Z-axis direction perpendicular to the display screen is achieved.
The thickness of the piezoelectric material layer 221 is, for example, less than or equal to 50um; alternatively, the piezoelectric material layer 221 is farther from the surface of the ultrasonic detection chip 220, and closer to the display screen 100 than the FPC230 is farther from the surface of the ultrasonic detection chip 220. As shown in fig. 2 and 3, the height of the piezoelectric material layer 221 should be smaller than that of the FPC230. The whole thickness of the ultrasonic fingerprint identification device 200 is reduced and the internal space of the electronic equipment is saved while the requirements of ultrasonic transmission and reception are met.
In one implementation, as shown in fig. 2 and 3, the ultrasonic detection chip 220 is adhered to the display screen 100 by an adhesive film 301, for example, the adhesive film 301 is DAF or epoxy. The thickness of the adhesive film 301 is less than or equal to 50um, and/or the acoustic resistance coefficient of the adhesive film 301 is greater than or equal to 4, so that good adhesion capability is ensured, the thickness of the ultrasonic fingerprint identification device 200 is not increased, and the influence on signal transmission is reduced.
The adhesive film 301 should also match the material of the ultrasonic detection chip 220 as much as possible, and has good consistency and uniformity, and no impurities such as bubbles. Thereby ensuring the consistency of signal transmission, reducing the influence on the signal transmission and improving the fingerprint identification performance of the ultrasonic fingerprint identification device 200.
In summary, it can be seen that the ultrasonic fingerprint identification device 200 of the embodiment of the present application is attached to the lower surface of the display screen 100 in a back-to-back manner, the ultrasonic fingerprint identification device 200 includes the ultrasonic detection chip 220, one surface of the ultrasonic detection chip 220 is directly attached to the lower surface of the display screen 100, and the other surface is the piezoelectric material layer 221 and the metal wiring layer 222. Because the ultrasonic detection chip 220 is attached to the display screen 100, the ultrasonic detection chip has certain strength and a large attachment area, the warpage generated after the ultrasonic fingerprint identification device 200 is attached to the display screen 100 is reduced, and the appearance mark is not easy to appear on the display screen 100. With the packaging scheme of the present application, the warpage is typically less than 30um. The ultrasonic detection signal returned by the finger reaches the air interface after passing through the piezoelectric material layer 221 and can be totally reflected, and the encapsulated laminated structure is simple, so that the signal loss is reduced, and the fingerprint identification performance of the ultrasonic fingerprint identification device 200 is improved. Meanwhile, the FPC230 and the metal wiring layer 222 of the ultrasonic detection chip 220 are pressed together by the ACF, so that the ultrasonic detection chip 220 and the FPC230 are interconnected, and the piezoelectric material layer 221 is not affected by high temperature generated in the packaging process.
This kind of packaging method has not only reduced packaging structure's complexity, has avoided ultrasonic fingerprint identification device 200 to leave the outward appearance seal of a government organization in old china on display screen 100 surface behind the laminating with display screen 100 simultaneously, and is less to electronic equipment's outward appearance influence to reduce signal loss, promoted ultrasonic fingerprint identification device 200's fingerprint identification performance.
The present application further provides an electronic device 300, please refer to fig. 4, where the electronic device 300 includes a display screen 100; and the ultrasonic fingerprint recognition device 200 described above. The ultrasonic detection chip 220 and the display screen 100 are bonded through the adhesive film 301, so that the ultrasonic fingerprint identification device 200 is positioned below the display screen 100, and the ultrasonic fingerprint identification under the screen is realized.
By way of example and not limitation, the electronic device in the embodiments of the present application may be a portable or mobile computing device such as a terminal device, a mobile phone, a tablet computer, a notebook computer, a desktop computer, a game device, an in-vehicle electronic device, or a wearable smart device, and other electronic devices such as an electronic database, an automobile, and an Automated Teller Machine (ATM). This wearable smart machine includes that the function is complete, the size is big, can not rely on the smart mobile phone to realize complete or partial functional equipment, for example smart watch or smart glasses etc to and include only be concentrated on a certain kind of application function and need with other equipment like the equipment that the smart mobile phone cooperation was used, for example all kinds of intelligent bracelet, intelligent ornament etc. that carry out the physical sign monitoring.
It should be noted that, without conflict, the embodiments and/or technical features in the embodiments described in the present application may be arbitrarily combined with each other, and the technical solutions obtained after the combination also fall within the protection scope of the present application.
The system, apparatus and method disclosed in the embodiments of the present application may be implemented in other ways. For example, some features of the method embodiments described above may be omitted or not performed. The above-described device embodiments are merely illustrative, the division of the unit is only one logical functional division, and there may be other divisions when the actual implementation is performed, and a plurality of units or components may be combined or may be integrated into another system. In addition, the coupling between the units or the coupling between the components may be direct coupling or indirect coupling, and the coupling includes electrical, mechanical, or other forms of connection.
It can be clearly understood by those skilled in the art that, for convenience and brevity of description, the specific working processes and the generated technical effects of the above-described apparatuses and devices may refer to the corresponding processes and technical effects in the foregoing method embodiments, and are not described herein again.
It should be understood that the specific examples in the embodiments of the present application are for the purpose of promoting a better understanding of the embodiments of the present application, and are not intended to limit the scope of the embodiments of the present application, and that various modifications and variations can be made by those skilled in the art based on the above embodiments and fall within the scope of the present application.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (9)
1. The utility model provides an supersound fingerprint identification device which characterized in that sets up in electronic equipment's display screen below to realize ultrasonic fingerprint identification under the screen, supersound fingerprint identification device includes:
the ultrasonic detection chip is bonded with the display screen, a piezoelectric material layer and a metal wiring layer are arranged on one side, away from the display screen, of the ultrasonic detection chip, the piezoelectric material layer is used for transmitting an ultrasonic signal to a finger above the display screen and receiving an ultrasonic detection signal returned by the finger, and the ultrasonic detection signal is used for the ultrasonic detection chip to acquire fingerprint information of the finger; and the number of the first and second groups,
the flexible circuit board is arranged on one side, away from the display screen, of the ultrasonic detection chip, and a bonding pad of the flexible circuit board and a bonding pad of the metal wiring layer are in press fit through an anisotropic conductive adhesive film, so that interconnection between the ultrasonic detection chip and the flexible circuit board is achieved.
2. The ultrasonic fingerprint identification device according to claim 1, wherein the metal wiring layer is a redistribution layer, and the bonding pad of the flexible circuit board and the bonding pad of the redistribution layer are laminated through the anisotropic conductive adhesive film.
3. The ultrasonic fingerprint identification device according to claim 2, wherein the edge of the ultrasonic detection chip is provided with a step recessed towards the display screen, and the rewiring layer is provided in the step to form a pad for connecting the flexible circuit board in the step.
4. The ultrasonic fingerprint identification device of claim 3, wherein the depth of the step is less than or equal to 100um.
5. The ultrasonic fingerprint recognition device according to any one of claims 1 to 4,
the thickness of the piezoelectric material layer is less than or equal to 50um; or,
the piezoelectric material layer is far away from the surface of the ultrasonic detection chip and is closer to the display screen than the flexible circuit board is far away from the surface of the ultrasonic detection chip.
6. The ultrasonic fingerprint identification device according to any one of claims 1 to 4, wherein the ultrasonic detection chip is bonded with the display screen through an adhesive film, the thickness of the adhesive film is less than or equal to 50um, and/or the acoustic resistance coefficient of the adhesive film is greater than or equal to 4.
7. The ultrasonic fingerprint identification device according to claim 6, wherein the adhesive film is a die attach film or an epoxy resin.
8. The ultrasonic fingerprint identification device according to any one of claims 1 to 4, wherein the surface of the piezoelectric material layer close to the ultrasonic detection chip is provided with a first electrode, and the surface thereof far away from the ultrasonic detection chip is provided with a second electrode, the second electrode is an electrode array composed of a plurality of electrodes, and the first electrode and the second electrode are electrically connected with the ultrasonic detection chip.
9. An electronic device, comprising:
a display screen; and (c) a second step of,
the ultrasonic fingerprint recognition device according to any one of claims 1 to 8.
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| CN202221346217.4U CN217690134U (en) | 2022-05-31 | 2022-05-31 | Ultrasonic fingerprint identification device and electronic equipment |
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| CN202221346217.4U CN217690134U (en) | 2022-05-31 | 2022-05-31 | Ultrasonic fingerprint identification device and electronic equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023206916A1 (en) * | 2022-04-29 | 2023-11-02 | 深圳市汇顶科技股份有限公司 | Ultrasonic fingerprint recognition apparatus and electronic device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2023206916A1 (en) * | 2022-04-29 | 2023-11-02 | 深圳市汇顶科技股份有限公司 | Ultrasonic fingerprint recognition apparatus and electronic device |
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