WO2023230864A1 - Ultrasonic fingerprint recognition apparatus and electronic device - Google Patents

Ultrasonic fingerprint recognition apparatus and electronic device Download PDF

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Publication number
WO2023230864A1
WO2023230864A1 PCT/CN2022/096313 CN2022096313W WO2023230864A1 WO 2023230864 A1 WO2023230864 A1 WO 2023230864A1 CN 2022096313 W CN2022096313 W CN 2022096313W WO 2023230864 A1 WO2023230864 A1 WO 2023230864A1
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WO
WIPO (PCT)
Prior art keywords
ultrasonic
detection chip
ultrasonic detection
display screen
fingerprint identification
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PCT/CN2022/096313
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French (fr)
Chinese (zh)
Inventor
龙卫
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深圳市汇顶科技股份有限公司
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Priority to PCT/CN2022/096313 priority Critical patent/WO2023230864A1/en
Publication of WO2023230864A1 publication Critical patent/WO2023230864A1/en

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/043Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using propagating acoustic waves

Definitions

  • Embodiments of the present application relate to the field of fingerprint identification, and more specifically, to an ultrasonic fingerprint identification device and electronic equipment.
  • Ultrasonic fingerprint recognition can not only identify the surface morphology of fingerprints, but also identify signals from the dermal layer of the finger, thereby achieving natural 3D anti-counterfeiting. Compared with optical fingerprint recognition, ultrasonic fingerprint recognition has a higher impact on the cleanliness of the finger surface. Tolerance. Therefore, ultrasonic fingerprint recognition has gradually become a new generation of fingerprint recognition method. How to improve the packaging structure of the ultrasonic fingerprint recognition device to enhance its performance has become a problem that needs to be solved.
  • Embodiments of the present application provide an ultrasonic fingerprint identification device and electronic equipment, which have good performance.
  • an ultrasonic fingerprint identification device which is arranged under a display screen of an electronic device to realize under-screen ultrasonic fingerprint identification.
  • the ultrasonic fingerprint identification device includes: a substrate, and the substrate is bonded to the display screen. , the substrate is provided with a groove on one side away from the display screen; an ultrasonic detection chip is at least partially located in the groove, and one side of the ultrasonic detection chip is adhered to the bottom surface of the groove Then, the other side of the ultrasonic detection chip is provided with a piezoelectric material layer and a metal wiring layer.
  • the piezoelectric material layer is used to transmit ultrasonic signals to the finger above the display screen and receive the return signal from the finger.
  • an ultrasonic detection signal the ultrasonic detection signal is used by the ultrasonic detection chip to obtain the fingerprint information of the finger; and a flexible circuit board, the flexible circuit board is arranged on the side of the substrate away from the display screen, The pads of the flexible circuit board and the pads of the metal wiring layer are pressed together through an anisotropic conductive adhesive film to realize interconnection between the ultrasonic detection chip and the flexible circuit board.
  • the ultrasonic fingerprint identification device is attached to the lower surface of the display screen in a back-attached manner. Contrary to the front-attached method, the ultrasonic detection chip in the ultrasonic fingerprint identification device is placed close to the display screen and the piezoelectric material layer is further away. Display settings.
  • the ultrasonic fingerprint identification device includes a substrate and an ultrasonic detection chip, and a groove for accommodating the ultrasonic detection chip is provided on the substrate. Because it is bonded between the substrate and the display, it has a certain degree of strength and a large bonding area, thus reducing the warpage caused by the bonding of the ultrasonic fingerprint recognition device to the display and making it less likely to show appearance marks on the display. .
  • the ultrasonic detection signal returned by the finger passes through the piezoelectric material layer and reaches the air interface, it can be fully reflected back.
  • the encapsulated stacked structure is relatively simple, thus reducing signal loss and improving the fingerprint recognition of the ultrasonic fingerprint recognition device. performance.
  • the metal wiring layer is a rewiring layer, and the pads of the flexible circuit board and the pads of the rewiring layer are pressed together through the anisotropic conductive adhesive film. New pads are formed on the surface of the fingerprint recognition chip through rewiring to facilitate the electrical connection between the flexible circuit board and the ultrasonic detection chip.
  • the rewiring layer extends the groove from the surface of the ultrasonic detection chip to the surface of the substrate to form a fan-out package on the surface of the substrate for connecting all the components.
  • the pads of the flexible circuit board are not limited to.
  • the thickness of the piezoelectric material layer is less than or equal to 50um; or, the piezoelectric material layer is farther away from the surface of the ultrasonic detection chip than the flexible circuit board is farther away from the ultrasonic detection chip.
  • the surface of the chip closer to the display. While meeting the needs of ultrasonic transmission and reception, it reduces the overall thickness of the ultrasonic fingerprint recognition device and saves the internal space of the electronic device.
  • the substrate and the display screen are bonded through a first adhesive film, the thickness of the first adhesive film is less than or equal to 50um, and/or the acoustic resistance of the first adhesive film The coefficient is greater than or equal to 4.
  • the first adhesive film is a chip bonding film or epoxy resin, thereby ensuring good bonding ability without increasing the thickness of the module and reducing the impact on signal transmission.
  • the ultrasonic detection chip and the bottom surface of the groove are bonded through a second adhesive film, the second adhesive film between the ultrasonic detection chip and the bottom surface of the groove, and the The first adhesive film between the substrate and the display screen is the same.
  • the second adhesive film may be a chip bonding film or an epoxy resin.
  • the thickness of the second adhesive film is less than or equal to 50um, and/or the acoustic resistance coefficient of the second adhesive film is greater than or equal to, thereby ensuring good bonding ability without increasing the module thickness and reducing signal interference. transmission effects.
  • the filling material can further fix the ultrasonic detection chip and improve the structural stability of the ultrasonic fingerprint identification device.
  • the filling material is, for example, the same material as the second adhesive film between the ultrasonic detection chip and the bottom surface of the groove, thereby simplifying the packaging process.
  • the thermal expansion coefficient of the substrate matches the thermal expansion coefficient of the ultrasonic detection chip to prevent warpage due to temperature changes after the substrate and the display screen are bonded, and to prevent appearance marks on the display screen. .
  • the material of the substrate includes at least one of monocrystalline silicon, polycrystalline silicon, and glass, ensuring a certain carrying capacity and minimizing the impact on signal transmission.
  • the piezoelectric material layer is provided with a first electrode on its surface close to the ultrasonic detection chip, and a second electrode is provided on its surface far away from the ultrasonic detection chip.
  • the second electrode is made of a plurality of An electrode array composed of three electrodes, the first electrode and the second electrode are electrically connected to the ultrasonic detection chip.
  • the piezoelectric material layer is formed of at least one of the following materials: polyvinylidene fluoride, polyvinylidene fluoride-trifluoroethylene copolymer, barium titanate series, lead zirconate titanate Binary system and adding a third ABO3 type compound to the binary system, where A represents a divalent metal ion, B represents a tetravalent metal ion or the sum of several ions is positive tetravalent.
  • the entire ultrasonic detection chip is located in the groove, and the surface of the ultrasonic detection chip away from the display screen is flush with the surface of the substrate away from the display screen.
  • an electronic device including: a display screen; and an ultrasonic fingerprint recognition device according to the first aspect or any implementation of the first aspect.
  • Figure 1 is a schematic block diagram of an ultrasonic fingerprint identification device according to an embodiment of the present application.
  • FIG. 2 is a schematic diagram of a possible specific structure of the ultrasonic fingerprint identification device shown in FIG. 1 .
  • Figure 3 is a schematic diagram of an electronic device according to an embodiment of the present application.
  • the ultrasonic fingerprint recognition device includes an ultrasonic detection chip, a piezoelectric material layer, and an FPC connected to the ultrasonic detection chip.
  • the ultrasonic detection chip is an Application Specific Integrated Circuit (ASIC) used for ultrasonic fingerprint recognition, such as a CMOS chip.
  • ASIC Application Specific Integrated Circuit
  • the two surfaces of the piezoelectric material layer are respectively provided with first electrodes and second electrodes.
  • the ultrasonic detection chip can output an excitation signal and load it to the first electrode and the second electrode. Under the action of the excitation signal, based on the piezoelectric effect, The piezoelectric material layer vibrates, thereby emitting ultrasonic signals to the finger above the display screen.
  • the ultrasonic signals are transmitted to the surface of the finger, are emitted or scattered at the fingerprint valleys and fingerprint ridges, and return ultrasonic detection signals.
  • the ultrasonic detection signal is transmitted to the piezoelectric material layer. Based on the inverse piezoelectric effect, a potential difference is generated between the first electrode and the second electrode, and a corresponding electrical signal is obtained.
  • the ultrasonic detection chip processes the signal to obtain fingerprint information of the finger.
  • the ultrasonic fingerprint recognition device is pasted under the display screen to achieve under-screen ultrasonic fingerprint recognition.
  • the ultrasonic fingerprint recognition device is pasted under the display screen in a front-facing manner.
  • the ultrasonic detection chip and the FPC are pasted on the upper surface of the substrate.
  • the ultrasonic detection chip and the FPC are interconnected so that the signal of the ultrasonic detection chip can be output through the FPC.
  • the upper surface of the ultrasonic detection chip is a piezoelectric material layer, and the piezoelectric material layer is attached to the lower surface of the display screen.
  • the ultrasonic fingerprint recognition device is prone to warping after being attached to the display screen, and it is easy to show appearance marks on the display screen.
  • due to the complex laminate structure it may affect the transmission of ultrasonic signals and affect ultrasonic fingerprint recognition. Device performance.
  • embodiments of the present application provide an ultrasonic fingerprint identification device.
  • the ultrasonic fingerprint identification device is pasted under the display screen in a back-stick manner, which can reduce the warpage caused by the ultrasonic fingerprint identification device and the display screen being bonded, making it difficult to Appearance imprints are presented on the display screen, and the loss of ultrasonic signals is reduced through a well-designed stacked structure to improve the performance of the ultrasonic fingerprint recognition device.
  • FIG. 1 is a schematic block diagram of an ultrasonic fingerprint identification device 200 according to an embodiment of the present application.
  • the display screen 100 includes a light-emitting panel and a cover plate above it.
  • the ultrasonic fingerprint recognition device 200 can be disposed below the display screen 100 of the electronic device, for example, below a light-emitting panel of the display screen 100 such as an Active Matrix Organic Light Emitting Diode (AMOLED) panel, or below under the cover of the display screen 100 to implement under-screen ultrasonic fingerprint recognition.
  • AMOLED Active Matrix Organic Light Emitting Diode
  • the ultrasonic fingerprint recognition device 200 includes a substrate 210 , an ultrasonic detection chip 220 and a flexible printed circuit (FPC) 230 .
  • FPC flexible printed circuit
  • the substrate 210 is bonded to the display screen 100 through an adhesive film such as Die Attach Film (DAF) or epoxy resin (Epoxy).
  • a groove 211 is provided on the side of the substrate 210 away from the display screen 100 .
  • the ultrasonic detection chip 220 is partially or entirely located in the groove 211. One side of the ultrasonic detection chip 220 is bonded to the bottom surface of the groove 211. The other side of the ultrasonic detection chip 220 is provided with a piezoelectric material layer 221 and a metal wiring layer 222. .
  • the piezoelectric material layer 221 is used to transmit ultrasonic signals to the finger above the display screen 100 and receive the ultrasonic detection signal returned by the finger.
  • the ultrasonic detection signal is used by the ultrasonic detection chip 220 to obtain the fingerprint information of the finger.
  • the FPC 230 is disposed on the side of the substrate 210 away from the display screen 100, and the pads of the FPC 230 are electrically connected to the pads of the metal wiring layer 222.
  • ACF Anisotropic Conductive Film
  • the ultrasonic fingerprint identification device 200 is attached to the lower surface of the display screen 100 in a back-attached manner. Contrary to the front-attached method, the ultrasonic detection chip 220 in the ultrasonic fingerprint identification device 200 is placed close to the display screen 10 and The piezoelectric material layer 221 is disposed away from the display screen 100 .
  • the ultrasonic fingerprint identification device 200 includes a substrate 210 and an ultrasonic detection chip 220.
  • the substrate 210 is provided with a groove 211 for accommodating the ultrasonic detection chip 220. Since the substrate 210 and the display screen 100 are bonded together, they have a certain strength and a large bonding area.
  • the warpage generated after the ultrasonic fingerprint recognition device 200 and the display screen 100 are bonded is reduced, making it less likely to cause damage to the display screen. Appearance marks appear on 100. Since the ultrasonic detection signal returned by the finger passes through the piezoelectric material layer 221 and reaches the air interface, it can be fully reflected back. In addition, the encapsulated stacked structure is relatively simple, so the signal loss is reduced and the performance of the ultrasonic fingerprint identification device 200 is improved. Fingerprint recognition performance.
  • the ultrasonic fingerprint identification device 200 is disposed below the display screen 110, that is, above the screen in FIG. 2, to implement under-screen ultrasonic fingerprint recognition.
  • the ultrasonic fingerprint identification device 200 includes a substrate 210 , an ultrasonic detection chip 220 and an FPC 230 .
  • the substrate 210 is adhered to the lower surface of the display screen 110 .
  • the surface of the substrate 210 away from the display screen 100 is provided with a groove 211 recessed toward the display screen, and the ultrasonic detection chip 220 is at least partially located in the groove 211 .
  • the ultrasonic detection chip 220 is entirely located in the groove 211 , and the surface of the ultrasonic detection chip 330 away from the display screen 100 is flush with the surface of the substrate 210 away from the display screen 100 .
  • One side of the ultrasonic detection chip 220 is bonded to the bottom surface of the groove 211 , and the other side of the ultrasonic detection chip 220 is a piezoelectric material layer 221 and a metal wiring layer 222 .
  • the metal wiring layer 222 is used to electrically connect with the FPC 230 to achieve signal transmission.
  • the material of the substrate 210 includes, for example, at least one of monocrystalline silicon, polycrystalline silicon, glass, etc., which can be selected based on needs to ensure a certain carrying capacity and minimize the impact on signal transmission.
  • the thermal expansion coefficient of the substrate 210 matches the thermal expansion coefficient of the ultrasonic detection chip 220 to prevent warpage due to temperature changes after the substrate 210 is attached to the display screen 100 and to avoid appearance marks on the display screen 100 .
  • the substrate 210 and the ultrasonic detection chip 220 are made of similar materials with matching thermal expansion coefficients, such as silicon-based materials. Using the packaging solution of this application, the warpage is usually less than 30um.
  • the piezoelectric material layer 221 may be formed of, for example, polyvinylidene fluoride (PVDF) or polyvinylidene fluoride-trifluoroethylene copolymer (PVDF-TrFE); or, it may also be formed of lead zirconate titanate (PZT) or its relatives.
  • PVDF polyvinylidene fluoride
  • PVDF-TrFE polyvinylidene fluoride-trifluoroethylene copolymer
  • PZT lead zirconate titanate
  • Materials such as barium titanate series, lead zirconate titanate binary system are formed by adding a third ABO3 type compound to the binary system, where A represents a divalent metal ion, B represents a tetravalent metal ion or the sum of several ions is Positive price.
  • a first electrode 2211 is provided on the surface of the piezoelectric material layer 221 close to the ultrasonic detection chip 220
  • a second electrode 2212 is provided on the surface far away from the ultrasonic detection chip 220 .
  • the first electrode 2211 and the second electrode 2212 are electrically connected to the ultrasonic detection chip 220 .
  • the first electrode 2211 is, for example, a planar electrode formed on the surface of the piezoelectric material layer 221 by sputtering or other methods
  • the second electrode 2212 is, for example, an electrode array composed of a plurality of electrodes.
  • the material of the first electrode 2211 may be, for example, Al
  • the material of the second electrode 2212 may be, for example, Ag.
  • the ultrasonic detection signal returned by the finger will generate an electrical signal between the first electrode 2211 and each electrode in the electrode array.
  • the electrical signal corresponding to each electrode can be used as the pixel value of a pixel in the fingerprint pattern of the finger.
  • the ultrasonic detection chip 220 includes a sensor circuit module.
  • the surface of the sensor circuit module is a piezoelectric material layer 221 and a metal wiring layer 222.
  • the sensor circuit module is electrically connected to the first electrode 2211, the second electrode 2212 and the metal wiring layer 222.
  • the metal wiring layer The layer 222 leads out the electrical signal generated by the ultrasonic detection chip 220 through the FPC 230.
  • the metal wiring layer 222 is a (Redistribution Layer, RDL) layer 222, and the pads of the FPC 230 and the pads of the RDL layer 222 are pressed together through ACF to realize the interconnection between the ultrasonic detection chip 220 and the FPC 230 . That is, new pads are formed on the surface of the ultrasonic detection chip 220 through rewiring to facilitate electrical connection between the FPC 230 and the ultrasonic detection chip 220.
  • RDL Resource Layer
  • the position, number or width of the circuit contacts (I/O pads) of the ultrasonic detection chip 220 can be changed, so that the ultrasonic detection chip 220 can be adapted to different packaging methods.
  • rewiring can be used to route the wiring to the periphery of the ultrasonic detection chip 220.
  • the RDL layer 222 By rationally designing the RDL layer 222, a larger number of nodes and a thinner packaging structure can be achieved.
  • the pads of the FPC 230 and the pads of the RDL layer 222 are pressed together through ACF, the process operation difficulty is reduced, and the interconnection between the FPC 230 and the ultrasonic detection chip 220 is facilitated.
  • the ultrasonic detection chip 220 shown in FIG. 2 adopts a fan-out package.
  • the RDL layer 222 extends a groove 211 from the surface of the ultrasonic detection chip 220 to the surface of the substrate 210 to form a pad for connecting the FPC 230 on the surface of the substrate 210 through fan-out packaging.
  • the fan-out package is used to extend the RDL layer 222 from the surface of the ultrasonic detection chip 220 in the groove 221 of the substrate 210 to the surface of the substrate 210 outside the groove 221, which facilitates the connection of the FPC 230 through the ACF.
  • the pads are connected to the RDL layer 222 on the surface of the substrate 210 to realize the interconnection between the FPC 230 and the ultrasonic detection chip 220, so that the ultrasonic detection chip 220 can achieve a smaller area and reduce the cost of the ultrasonic fingerprint identification device 200.
  • the ACF between FPC 230 and RDL layer 222 is not shown in FIG. 2 .
  • the piezoelectric material layer 221 is not resistant to high temperatures, and the ACF method is used to press the pads of the FPC 230 and the pads of the RDL layer 222 to realize the interconnection between the FPC 230 and the ultrasonic detection chip 220.
  • the ACF method will not generate excessive high temperatures, will not cause damage to the piezoelectric material layer 221 during the packaging process, and will not cause conflicts in manufacturing operations.
  • the conductive particles in the ACF connect the pads on the pads of the RDL layer 222 and the pads on the FPC 230
  • the pad makes the two conductive while avoiding short circuit between two adjacent pads, thereby achieving the purpose of conduction only in the Z-axis direction perpendicular to the display screen 100 .
  • the thickness of the piezoelectric material layer 221 is, for example, less than or equal to 50um; or, the piezoelectric material layer 221 is far away from the surface of the ultrasonic detection chip 220 and is closer to the display screen 100 than the FPC 230 is far away from the surface of the ultrasonic detection chip 220.
  • the height of the piezoelectric material layer 221 should be less than the height of the FPC 230. While meeting the requirements for ultrasonic transmission and reception, the overall thickness of the ultrasonic fingerprint recognition device 200 is reduced, saving internal space of the electronic device.
  • the substrate 210 and the display screen 100 are bonded through a first adhesive film 301.
  • the first adhesive film 301 is DAF or epoxy resin.
  • the thickness of the first adhesive film 301 is less than or equal to 50um, and/or the acoustic resistance coefficient of the first adhesive film 301 is greater than or equal to 4, thereby ensuring good bonding ability without increasing the thickness of the ultrasonic fingerprint recognition device 200, and at the same time Reduce the impact on signal transmission.
  • the ultrasonic detection chip 220 and the bottom surface of the groove 211 are bonded through a second adhesive film 302.
  • a third gap between the ultrasonic detection chip 220 and the bottom surface of the groove 211 is
  • the second adhesive film 302 is the same as the first adhesive film 301 between the substrate 210 and the display screen 100 .
  • the second adhesive film 302 may be DAF or epoxy resin.
  • the thickness of the second adhesive film 302 is less than or equal to 50um, and/or the acoustic resistance coefficient of the second adhesive film 302 is greater than or equal to 4, thereby ensuring good bonding ability without increasing the size of the ultrasonic fingerprint identification device 200 thickness while reducing the impact on signal transmission.
  • the first adhesive film 301 and the second adhesive film 302 should also match the silicon-based material as much as possible, have good consistency and uniformity, and be free of impurities such as bubbles. This ensures the consistency of signal transmission, reduces the impact on signal transmission, and improves the fingerprint identification performance of the ultrasonic fingerprint identification device 200 .
  • the filling material 303 can further fix the ultrasonic detection chip 220 and improve the structural stability of the ultrasonic fingerprint recognition device 200 .
  • the filling material 303 is, for example, the same material as the second adhesive film 302 between the ultrasonic detection chip 220 and the bottom surface of the groove 211, such as DAF or epoxy resin, or it may be different.
  • the filling material 303 and the second adhesive film 302 are made of the same material, the packaging process can be simplified.
  • the ultrasonic fingerprint identification device 200 in the embodiment of the present application is attached to the lower surface of the display screen 100 in a back-to-back manner.
  • the ultrasonic fingerprint identification device 200 includes a substrate 210 and an ultrasonic detection chip 220.
  • the substrate 210 is provided with There is a groove 211 for accommodating the ultrasonic detection chip 220. Since the substrate 210 and the display screen 100 are bonded together, they have a certain strength and a large bonding area. Therefore, the warpage generated after the ultrasonic fingerprint recognition device 200 and the display screen 100 are bonded is reduced, making it less likely to cause damage to the display screen. Appearance marks appear on 100.
  • the ultrasonic detection signal returned by the finger passes through the piezoelectric material layer 221 and reaches the air interface, it can be fully reflected back.
  • the encapsulated stacked structure is relatively simple, so the signal loss is reduced and the performance of the ultrasonic fingerprint identification device 200 is improved. Fingerprint recognition performance.
  • the FPC 230 and the metal wiring layer 222 of the ultrasonic detection chip 220 are pressed together through ACF to realize the interconnection between the ultrasonic detection chip 220 and the FPC 230.
  • the packaging process will not generate high temperatures and cause damage to the piezoelectric material layer 221. Influence.
  • This packaging method not only reduces the complexity of the packaging structure, but also avoids the appearance marks left on the surface of the display screen 100 after the ultrasonic fingerprint recognition device 200 is attached to the display screen 100. It has less impact on the appearance of the electronic device and reduces the cost. Signal loss is eliminated, and the fingerprint recognition performance of the ultrasonic fingerprint recognition device 200 is improved.
  • the electronic device 300 includes a display screen 100; and the above-mentioned ultrasonic fingerprint recognition device 200.
  • the ultrasonic fingerprint recognition device 200 is located below the display screen 100.
  • the substrate 210 of the ultrasonic fingerprint recognition device 200 is bonded to the display screen 100 through an adhesive film such as DAF or epoxy resin, thereby realizing under-screen ultrasonic fingerprint recognition.
  • the electronic device in the embodiment of the present application may be a portable or mobile computing device such as a terminal device, a mobile phone, a tablet computer, a notebook computer, a desktop computer, a gaming device, a vehicle-mounted electronic device or a wearable smart device, and Electronic databases, cars, bank automated teller machines (Automated Teller Machine, ATM) and other electronic equipment.
  • the wearable smart devices include devices that are full-featured, large in size, and can realize complete or partial functions without relying on smartphones, such as smart watches or smart glasses, as well as devices that only focus on a certain type of application function and require integration with other devices such as smartphones.
  • Equipment used in conjunction with it such as various smart bracelets, smart jewelry and other equipment for physical sign monitoring.
  • the systems, devices and methods disclosed in the embodiments of this application can be implemented in other ways. For example, some features of the method embodiments described above may be omitted or not performed.
  • the device embodiments described above are only illustrative, and the division of units is only a logical function division. In actual implementation, there may be other divisions, and multiple units or components may be combined or integrated into another system.
  • the coupling between units or the coupling between components may be direct coupling or indirect coupling, and the above-mentioned coupling includes electrical, mechanical or other forms of connection.

Abstract

Provided in the present application are an ultrasonic fingerprint recognition apparatus and an electronic device, which have good performances. The ultrasonic fingerprint recognition apparatus is arranged under a display screen for the implementation of under-screen ultrasonic fingerprint recognition. The apparatus comprises: a substrate, which is bonded to a display screen, wherein the side of the substrate away from the display screen is provided with a recess; an ultrasonic detection chip, which is at least partially located in the recess, wherein one face of the ultrasonic detection chip is bonded to a bottom face of the recess, one side of the other face of the ultrasonic detection chip is provided with a piezoelectric material layer and a metal wiring layer, the piezoelectric material layer is used for transmitting an ultrasonic signal to a finger above the display screen and receiving an ultrasonic detection signal that is returned by the finger, and the ultrasonic detection signal is used by the ultrasonic detection chip to obtain fingerprint information of the finger; and an FPC, which is arranged on the side of the substrate away from the display screen, wherein a pad of the FPC and a pad of the metal wiring layer are laminated by means of an ACF, so as to achieve the mutual connection between the ultrasonic detection chip and the FPC.

Description

超声指纹识别装置和电子设备Ultrasonic fingerprint recognition devices and electronic equipment 技术领域Technical field
本申请实施例涉及指纹识别领域,并且更具体地,涉及一种超声指纹识别装置和电子设备。Embodiments of the present application relate to the field of fingerprint identification, and more specifically, to an ultrasonic fingerprint identification device and electronic equipment.
背景技术Background technique
随着社会进步,手机已成为现代生活必不可少的电子设备之一。目前市场上的手机都具有一种或多种身份认证方式,包括数字密码、手势图形、面部识别、指纹识别等。其中,指纹识别由于其应用方便、识别速度快和稳定可靠等特点,已经成为大多数手机的标配。指纹识别也发展出不同的技术路线,包括电容指纹识别、光学指纹识别和超声指纹识别等。With the progress of society, mobile phones have become one of the essential electronic devices in modern life. Currently, mobile phones on the market have one or more identity authentication methods, including digital passwords, gesture graphics, facial recognition, fingerprint recognition, etc. Among them, fingerprint recognition has become a standard feature of most mobile phones due to its convenient application, fast recognition speed, stability and reliability. Fingerprint recognition has also developed different technical routes, including capacitive fingerprint recognition, optical fingerprint recognition and ultrasonic fingerprint recognition.
超声指纹识别不仅可以识别指纹的表层形貌,还可以识别到手指真皮层的信号,从而实现天然的3D防伪,并且相比于光学指纹识别,超声指纹识别对手指表面的洁净状态具有更高的容忍度。因此,超声指纹识别逐渐成为新一代的指纹识别方式。如何改善超声指纹识别装置的封装结构,以提升其性能,成为需要解决的问题。Ultrasonic fingerprint recognition can not only identify the surface morphology of fingerprints, but also identify signals from the dermal layer of the finger, thereby achieving natural 3D anti-counterfeiting. Compared with optical fingerprint recognition, ultrasonic fingerprint recognition has a higher impact on the cleanliness of the finger surface. Tolerance. Therefore, ultrasonic fingerprint recognition has gradually become a new generation of fingerprint recognition method. How to improve the packaging structure of the ultrasonic fingerprint recognition device to enhance its performance has become a problem that needs to be solved.
发明内容Contents of the invention
本申请实施例提供一种超声指纹识别装置和电子设备,具有良好的性能。Embodiments of the present application provide an ultrasonic fingerprint identification device and electronic equipment, which have good performance.
第一方面,提供了一种超声指纹识别装置,设置在电子设备的显示屏下方,以实现屏下超声指纹识别,所述超声指纹识别装置包括:基板,所述基板与所述显示屏粘接,所述基板远离所述显示屏的一侧设置有凹槽;超声检测芯片,所述超声检测芯片至少部分位于所述凹槽内,所述超声检测芯片的一面与所述凹槽的底面粘接,所述超声检测芯片的另一面的一侧设置有压电材料层和金属布线层,所述压电材料层用于向所述显示屏上方的手指发射超声信号,并接收所述手指返回的超声检测信号,所述超声检测信号用于所述超声检测芯片获取所述手指的指纹信息;以及,柔性电路板,所述柔性电路板设置在所述基板远离所述显示屏的一侧,所述柔性电路板的焊盘与所述金属布线层的焊盘通过异方性导电胶膜压合,以实现所述超声检测芯片与所述柔性电路板之间的互联。In a first aspect, an ultrasonic fingerprint identification device is provided, which is arranged under a display screen of an electronic device to realize under-screen ultrasonic fingerprint identification. The ultrasonic fingerprint identification device includes: a substrate, and the substrate is bonded to the display screen. , the substrate is provided with a groove on one side away from the display screen; an ultrasonic detection chip is at least partially located in the groove, and one side of the ultrasonic detection chip is adhered to the bottom surface of the groove Then, the other side of the ultrasonic detection chip is provided with a piezoelectric material layer and a metal wiring layer. The piezoelectric material layer is used to transmit ultrasonic signals to the finger above the display screen and receive the return signal from the finger. an ultrasonic detection signal, the ultrasonic detection signal is used by the ultrasonic detection chip to obtain the fingerprint information of the finger; and a flexible circuit board, the flexible circuit board is arranged on the side of the substrate away from the display screen, The pads of the flexible circuit board and the pads of the metal wiring layer are pressed together through an anisotropic conductive adhesive film to realize interconnection between the ultrasonic detection chip and the flexible circuit board.
本申请实施例中,超声指纹识别装置采用背贴的方式贴合在显示屏的下表面,与正贴的方式相反,超声指纹识别装置中的超声检测芯片靠近显示屏设置而压电材料层远离显示屏设置。超声指纹识别装置包括基板和超声检测芯片,基板上设置有用于容纳超声检测芯片的凹槽。由于是基板与显示屏之间贴合,其具有一定的强度,且贴合面积较大,因此减轻了超声指纹识别装置与显示屏贴合后产生的翘曲,不易在显示屏上呈现外观印记。由于手指返回的超声检测信号穿过压电材料层后到达空气界面,能够被全反射回来,加上封装后的叠层结构较为简单,因此降低了信号损耗,提升了超声指纹识别装置的指纹识别性能。In the embodiment of the present application, the ultrasonic fingerprint identification device is attached to the lower surface of the display screen in a back-attached manner. Contrary to the front-attached method, the ultrasonic detection chip in the ultrasonic fingerprint identification device is placed close to the display screen and the piezoelectric material layer is further away. Display settings. The ultrasonic fingerprint identification device includes a substrate and an ultrasonic detection chip, and a groove for accommodating the ultrasonic detection chip is provided on the substrate. Because it is bonded between the substrate and the display, it has a certain degree of strength and a large bonding area, thus reducing the warpage caused by the bonding of the ultrasonic fingerprint recognition device to the display and making it less likely to show appearance marks on the display. . Since the ultrasonic detection signal returned by the finger passes through the piezoelectric material layer and reaches the air interface, it can be fully reflected back. In addition, the encapsulated stacked structure is relatively simple, thus reducing signal loss and improving the fingerprint recognition of the ultrasonic fingerprint recognition device. performance.
在一种实现方式中,所述金属布线层为重布线层,所述柔性电路板的焊盘与所述重布线层的焊盘通过所述异方性导电胶膜压合。通过重布线的方式在指纹识别芯片的表面形成新的焊盘,方便柔性电路板与超声检测芯片之间进行电连接。In one implementation, the metal wiring layer is a rewiring layer, and the pads of the flexible circuit board and the pads of the rewiring layer are pressed together through the anisotropic conductive adhesive film. New pads are formed on the surface of the fingerprint recognition chip through rewiring to facilitate the electrical connection between the flexible circuit board and the ultrasonic detection chip.
在一种实现方式中,所述重布线层从所述超声检测芯片的表面延伸出所述凹槽至所述基板的表面,以通过扇出型封装在所述基板的表面形成用于连接所述柔性电路板的焊盘。In one implementation, the rewiring layer extends the groove from the surface of the ultrasonic detection chip to the surface of the substrate to form a fan-out package on the surface of the substrate for connecting all the components. The pads of the flexible circuit board.
这样,就便于通过异方性导电胶膜对柔性电路板的焊盘与基板表面的重布线层的焊盘之间进行压合,以实现柔性电路板与超声检测芯片之间的互联,使得超声检测芯片可以实现更小的面积,降低成本。In this way, it is convenient to press the pads of the flexible circuit board and the pads of the rewiring layer on the surface of the substrate through the anisotropic conductive adhesive film to realize the interconnection between the flexible circuit board and the ultrasonic detection chip, making the ultrasonic The detection chip can achieve smaller area and reduce cost.
在一种实现方式中,所述压电材料层的厚度小于或等于50um;或者,所述压电材料层远离所述超声检测芯片的表面,相比于所述柔性电路板远离所述超声检测芯片的表面,更靠近所述显示屏。在满足超声发射和接收需求的同时,降低了超声指纹识别装置的整体厚度,节省了电子设备的内部空间。In one implementation, the thickness of the piezoelectric material layer is less than or equal to 50um; or, the piezoelectric material layer is farther away from the surface of the ultrasonic detection chip than the flexible circuit board is farther away from the ultrasonic detection chip. The surface of the chip, closer to the display. While meeting the needs of ultrasonic transmission and reception, it reduces the overall thickness of the ultrasonic fingerprint recognition device and saves the internal space of the electronic device.
在一种实现方式中,所述基板与所述显示屏之间通过第一胶膜粘接,所述第一胶膜的厚度小于或等于50um,和/或所述第一胶膜的声阻系数大于或等于4。例如,所述第一胶膜为芯片粘结膜或者环氧树脂,从而保证良好的粘接能力,且不会增加模组厚度,同时减少对信号传输的影响。In one implementation, the substrate and the display screen are bonded through a first adhesive film, the thickness of the first adhesive film is less than or equal to 50um, and/or the acoustic resistance of the first adhesive film The coefficient is greater than or equal to 4. For example, the first adhesive film is a chip bonding film or epoxy resin, thereby ensuring good bonding ability without increasing the thickness of the module and reducing the impact on signal transmission.
在一种实现方式中,所述超声检测芯片与所述凹槽的底面通过第二胶膜粘接,所述超声检测芯片与所述凹槽的底面之间的第二胶膜,和所述基板与所述显示屏之间的第一胶膜相同。例如,所述第二胶膜可以为芯片粘结膜或者环氧树脂。所述第二胶膜的厚度小于或等于50um,和/或所述第二胶膜的 声阻系数大于或等于,从而保证良好的粘接能力,且不会增加模组厚度,同时减少对信号传输的影响。In one implementation, the ultrasonic detection chip and the bottom surface of the groove are bonded through a second adhesive film, the second adhesive film between the ultrasonic detection chip and the bottom surface of the groove, and the The first adhesive film between the substrate and the display screen is the same. For example, the second adhesive film may be a chip bonding film or an epoxy resin. The thickness of the second adhesive film is less than or equal to 50um, and/or the acoustic resistance coefficient of the second adhesive film is greater than or equal to, thereby ensuring good bonding ability without increasing the module thickness and reducing signal interference. transmission effects.
在一种实现方式中,所述超声检测芯片的侧面与所述凹槽的侧面之间为空隙或者填充材料。所述填充材料可以对所述超声检测芯片进一步固定,提高超声指纹识别装置的结构稳定性。所述填充材料例如和所述超声检测芯片与所述凹槽的底面之间的第二胶膜的材料相同,从而简化封装工艺。In one implementation, there is a gap or filling material between the side surfaces of the ultrasonic detection chip and the side surfaces of the groove. The filling material can further fix the ultrasonic detection chip and improve the structural stability of the ultrasonic fingerprint identification device. The filling material is, for example, the same material as the second adhesive film between the ultrasonic detection chip and the bottom surface of the groove, thereby simplifying the packaging process.
在一种实现方式中,所述基板的热膨胀系数与所述超声检测芯片的热膨胀系数相匹配,以防止基板与显示屏贴合后因温度变化而产生翘曲,不易在显示屏上呈现外观印记。In one implementation, the thermal expansion coefficient of the substrate matches the thermal expansion coefficient of the ultrasonic detection chip to prevent warpage due to temperature changes after the substrate and the display screen are bonded, and to prevent appearance marks on the display screen. .
在一种实现方式中,所述基板的材料包括单晶硅、多晶硅、玻璃中的至少一种,保证一定的承载能力并尽量减少对信号传输的影响。In one implementation, the material of the substrate includes at least one of monocrystalline silicon, polycrystalline silicon, and glass, ensuring a certain carrying capacity and minimizing the impact on signal transmission.
在一种实现方式中,所述压电材料层靠近所述超声检测芯片的表面设置有第一电极,其远离所述超声检测芯片的表面设置有第二电极,所述第二电极是由多个电极组成的电极阵列,所述第一电极和所述第二电极与所述超声检测芯片电连接。In one implementation, the piezoelectric material layer is provided with a first electrode on its surface close to the ultrasonic detection chip, and a second electrode is provided on its surface far away from the ultrasonic detection chip. The second electrode is made of a plurality of An electrode array composed of three electrodes, the first electrode and the second electrode are electrically connected to the ultrasonic detection chip.
在一种实现方式中,所述压电材料层由以下材料中的至少一种形成:聚偏二氟乙烯、聚偏二氟乙烯-三氟乙烯共聚物、钛酸钡系、锆钛酸铅二元系及在所述二元系中添加第三种ABO3型化合物,其中,A表示二价金属离子,B表示四价金属离子或几种离子总和为正四价。In one implementation, the piezoelectric material layer is formed of at least one of the following materials: polyvinylidene fluoride, polyvinylidene fluoride-trifluoroethylene copolymer, barium titanate series, lead zirconate titanate Binary system and adding a third ABO3 type compound to the binary system, where A represents a divalent metal ion, B represents a tetravalent metal ion or the sum of several ions is positive tetravalent.
在一种实现方式中,所述超声检测芯片全部位于所述凹槽内,且所述超声检测芯片远离所述显示屏的表面与所述基板远离所述显示屏的表面齐平。In one implementation, the entire ultrasonic detection chip is located in the groove, and the surface of the ultrasonic detection chip away from the display screen is flush with the surface of the substrate away from the display screen.
第二方面,提供了一种电子设备,包括:显示屏;以及,根据第一方面或第一方面的任一实现方式中所述的超声指纹识别装置。In a second aspect, an electronic device is provided, including: a display screen; and an ultrasonic fingerprint recognition device according to the first aspect or any implementation of the first aspect.
附图说明Description of the drawings
图1是本申请实施例的超声指纹识别装置的示意性框图。Figure 1 is a schematic block diagram of an ultrasonic fingerprint identification device according to an embodiment of the present application.
图2是图1所示的超声指纹识别装置的一种可能的具体结构的示意图。FIG. 2 is a schematic diagram of a possible specific structure of the ultrasonic fingerprint identification device shown in FIG. 1 .
图3是本申请实施例的电子设备的示意图。Figure 3 is a schematic diagram of an electronic device according to an embodiment of the present application.
具体实施方式Detailed ways
下面将结合附图,对本申请中的技术方案进行描述。The technical solutions in this application will be described below with reference to the accompanying drawings.
超声指纹识别装置包括超声检测芯片、压电材料层以及与超声检测芯片连接的FPC。超声检测芯片为用于超声指纹识别的专用集成电路(Application Specific Integrated Circuit,ASIC),例如是CMOS芯片。压电材料层的两个表面分别设置有第一电极和第二电极,超声检测芯片可以输出激励信号并加载至第一电极和第二电极,在该激励信号的作用下,基于压电效应,压电材料层产生振动,从而向显示屏上方的手指发射超声信号,超声信号传输至手指的表面,在指纹谷和指纹脊处发生发射或散射而返回超声检测信号。超声检测信号传输至压电材料层,基于逆压电效应,第一电极和第二电极之间产生电势差,得到相应的电信号,超声检测芯片对该信号进行处理,得到手指的指纹信息。The ultrasonic fingerprint recognition device includes an ultrasonic detection chip, a piezoelectric material layer, and an FPC connected to the ultrasonic detection chip. The ultrasonic detection chip is an Application Specific Integrated Circuit (ASIC) used for ultrasonic fingerprint recognition, such as a CMOS chip. The two surfaces of the piezoelectric material layer are respectively provided with first electrodes and second electrodes. The ultrasonic detection chip can output an excitation signal and load it to the first electrode and the second electrode. Under the action of the excitation signal, based on the piezoelectric effect, The piezoelectric material layer vibrates, thereby emitting ultrasonic signals to the finger above the display screen. The ultrasonic signals are transmitted to the surface of the finger, are emitted or scattered at the fingerprint valleys and fingerprint ridges, and return ultrasonic detection signals. The ultrasonic detection signal is transmitted to the piezoelectric material layer. Based on the inverse piezoelectric effect, a potential difference is generated between the first electrode and the second electrode, and a corresponding electrical signal is obtained. The ultrasonic detection chip processes the signal to obtain fingerprint information of the finger.
超声指纹识别装置粘贴在显示屏的下方,以实现屏下超声指纹识别。通常,超声指纹识别装置采用正贴的方式粘贴在显示屏下方,基板的上表面粘贴有超声检测芯片和FPC,超声检测芯片与FPC之间互联,以使超声检测芯片的信号可以通过FPC输出。超声检测芯片的上表面为压电材料层,压电材料层与显示屏的下表面贴合。当采用正贴的方式时,超声指纹识别装置与显示屏贴合后容易发生翘曲,易在显示屏上呈现外观印记,且由于叠层结构复杂,可能影响超声信号的传输,影响超声指纹识别装置的性能。The ultrasonic fingerprint recognition device is pasted under the display screen to achieve under-screen ultrasonic fingerprint recognition. Usually, the ultrasonic fingerprint recognition device is pasted under the display screen in a front-facing manner. The ultrasonic detection chip and the FPC are pasted on the upper surface of the substrate. The ultrasonic detection chip and the FPC are interconnected so that the signal of the ultrasonic detection chip can be output through the FPC. The upper surface of the ultrasonic detection chip is a piezoelectric material layer, and the piezoelectric material layer is attached to the lower surface of the display screen. When using the front-to-side attachment method, the ultrasonic fingerprint recognition device is prone to warping after being attached to the display screen, and it is easy to show appearance marks on the display screen. Moreover, due to the complex laminate structure, it may affect the transmission of ultrasonic signals and affect ultrasonic fingerprint recognition. Device performance.
为此,本申请实施例提供一种超声指纹识别装置,该超声指纹识别装置采用背贴的方式粘贴在显示屏的下方,能够减轻超声指纹识别装置与显示屏贴合后产生的翘曲,不易在显示屏上呈现外观印记,并通过设计合理的叠层结构,减少超声信号的损耗,提高超声指纹识别装置的性能。To this end, embodiments of the present application provide an ultrasonic fingerprint identification device. The ultrasonic fingerprint identification device is pasted under the display screen in a back-stick manner, which can reduce the warpage caused by the ultrasonic fingerprint identification device and the display screen being bonded, making it difficult to Appearance imprints are presented on the display screen, and the loss of ultrasonic signals is reduced through a well-designed stacked structure to improve the performance of the ultrasonic fingerprint recognition device.
图1是本申请实施例的超声指纹识别装置200的示意性框图。显示屏100包括发光面板及其上方的盖板。超声指纹识别装置200可以设置在电子设备的显示屏100的下方,例如设置在显示屏100的发光面板比如主动矩阵有机发光二极体(Active MatrixOrganic Light Emitting Diode,AMOLED)面板的下方,或者设置在显示屏100的盖板下方,以实现屏下超声指纹识别。如图1所示,超声指纹识别装置200包括基板210、超声检测芯片220和柔性线路板(Flexible Printed Circuit,FPC)230。FIG. 1 is a schematic block diagram of an ultrasonic fingerprint identification device 200 according to an embodiment of the present application. The display screen 100 includes a light-emitting panel and a cover plate above it. The ultrasonic fingerprint recognition device 200 can be disposed below the display screen 100 of the electronic device, for example, below a light-emitting panel of the display screen 100 such as an Active Matrix Organic Light Emitting Diode (AMOLED) panel, or below under the cover of the display screen 100 to implement under-screen ultrasonic fingerprint recognition. As shown in FIG. 1 , the ultrasonic fingerprint recognition device 200 includes a substrate 210 , an ultrasonic detection chip 220 and a flexible printed circuit (FPC) 230 .
其中,基板210通过胶膜例如芯片粘结膜(Die Attach Film,DAF)或者环氧树脂(Epoxy)等,与显示屏100粘接,基板210远离显示屏100的一侧设置有凹槽211。The substrate 210 is bonded to the display screen 100 through an adhesive film such as Die Attach Film (DAF) or epoxy resin (Epoxy). A groove 211 is provided on the side of the substrate 210 away from the display screen 100 .
超声检测芯片220部分或者全部位于凹槽211内,超声检测芯片220的一面与凹槽211的底面粘接,超声检测芯片220的另一面的一侧设置有压电材料层221和金属布线层222。The ultrasonic detection chip 220 is partially or entirely located in the groove 211. One side of the ultrasonic detection chip 220 is bonded to the bottom surface of the groove 211. The other side of the ultrasonic detection chip 220 is provided with a piezoelectric material layer 221 and a metal wiring layer 222. .
压电材料层221用于向显示屏100上方的手指发射超声信号,并接收该手指返回的超声检测信号,该超声检测信号用于超声检测芯片220获取该手指的指纹信息。FPC 230设置在基板210远离显示屏100的一侧,FPC 230的焊盘与金属布线层222的焊盘之间电连接,例如,FPC 230的焊盘与金属布线层222的焊盘之间通过异方性导电胶膜(Anisotropic Conductive Film,ACF)压合,以实现FPC 230与超声检测芯片220之间的互联,因此封装过程不会产生高温而对压电材料层221造成影响。The piezoelectric material layer 221 is used to transmit ultrasonic signals to the finger above the display screen 100 and receive the ultrasonic detection signal returned by the finger. The ultrasonic detection signal is used by the ultrasonic detection chip 220 to obtain the fingerprint information of the finger. The FPC 230 is disposed on the side of the substrate 210 away from the display screen 100, and the pads of the FPC 230 are electrically connected to the pads of the metal wiring layer 222. For example, the pads of the FPC 230 and the pads of the metal wiring layer 222 are connected by Anisotropic Conductive Film (ACF) is pressed to realize the interconnection between the FPC 230 and the ultrasonic detection chip 220, so the packaging process will not generate high temperatures and affect the piezoelectric material layer 221.
本申请实施例中,超声指纹识别装置200采用背贴的方式贴合在显示屏100的下表面,与正贴的方式相反,超声指纹识别装置200中的超声检测芯片220靠近显示屏10设置而压电材料层221远离显示屏100设置。超声指纹识别装置200包括基板210和超声检测芯片220,基板210上设置有用于容纳超声检测芯片220的凹槽211。由于是基板210与显示屏100之间贴合,其具有一定的强度,且贴合面积较大,因此减轻了超声指纹识别装置200与显示屏100贴合后产生的翘曲,不易在显示屏100上呈现外观印记。由于手指返回的超声检测信号穿过压电材料层221后到达空气界面,能够被全反射回来,加上封装后的叠层结构较为简单,因此降低了信号损耗,提升了超声指纹识别装置200的指纹识别性能。In the embodiment of the present application, the ultrasonic fingerprint identification device 200 is attached to the lower surface of the display screen 100 in a back-attached manner. Contrary to the front-attached method, the ultrasonic detection chip 220 in the ultrasonic fingerprint identification device 200 is placed close to the display screen 10 and The piezoelectric material layer 221 is disposed away from the display screen 100 . The ultrasonic fingerprint identification device 200 includes a substrate 210 and an ultrasonic detection chip 220. The substrate 210 is provided with a groove 211 for accommodating the ultrasonic detection chip 220. Since the substrate 210 and the display screen 100 are bonded together, they have a certain strength and a large bonding area. Therefore, the warpage generated after the ultrasonic fingerprint recognition device 200 and the display screen 100 are bonded is reduced, making it less likely to cause damage to the display screen. Appearance marks appear on 100. Since the ultrasonic detection signal returned by the finger passes through the piezoelectric material layer 221 and reaches the air interface, it can be fully reflected back. In addition, the encapsulated stacked structure is relatively simple, so the signal loss is reduced and the performance of the ultrasonic fingerprint identification device 200 is improved. Fingerprint recognition performance.
以下,结合图2,详细描述本申请实施例的超声指纹识别装置。应理解,图2中的上方为显示屏110的下方。超声指纹识别装置200设置在显示屏110下方,即位于图2的上方,以实现屏下超声指纹识别。Below, the ultrasonic fingerprint identification device according to the embodiment of the present application will be described in detail with reference to FIG. 2 . It should be understood that the upper part in FIG. 2 is the lower part of the display screen 110 . The ultrasonic fingerprint recognition device 200 is disposed below the display screen 110, that is, above the screen in FIG. 2, to implement under-screen ultrasonic fingerprint recognition.
如图2所示,超声指纹识别装置200包括基板210、超声检测芯片220和FPC230。基板210粘贴在显示屏110的下表面。基板210远离显示屏100的表面设置有朝向所述显示屏凹陷的凹槽211,超声检测芯片220至少部分位于凹槽211内。例如,如图2所示,超声检测芯片220全部位于凹槽内211,且超声检测芯片330远离显示屏100的表面与基板210远离显示屏100的表面齐平。超声检测芯片220的一面与凹槽211的底面粘接,超声检测芯片220的另一面为压电材料层221和金属布线层222。金属布线层222用于与FPC230电连接,以实现信号传输。As shown in FIG. 2 , the ultrasonic fingerprint identification device 200 includes a substrate 210 , an ultrasonic detection chip 220 and an FPC 230 . The substrate 210 is adhered to the lower surface of the display screen 110 . The surface of the substrate 210 away from the display screen 100 is provided with a groove 211 recessed toward the display screen, and the ultrasonic detection chip 220 is at least partially located in the groove 211 . For example, as shown in FIG. 2 , the ultrasonic detection chip 220 is entirely located in the groove 211 , and the surface of the ultrasonic detection chip 330 away from the display screen 100 is flush with the surface of the substrate 210 away from the display screen 100 . One side of the ultrasonic detection chip 220 is bonded to the bottom surface of the groove 211 , and the other side of the ultrasonic detection chip 220 is a piezoelectric material layer 221 and a metal wiring layer 222 . The metal wiring layer 222 is used to electrically connect with the FPC 230 to achieve signal transmission.
基板210的材料例如包括单晶硅、多晶硅、玻璃等中的至少一种,可以基于需要进行选择,保证一定的承载能力并尽量减少对信号传输的影响。可选地,基板210的热膨胀系数与超声检测芯片220的热膨胀系数相匹配,以防止基板210与显示屏100贴合后因温度变化而产生翘曲,避免在显示屏100上呈现外观印记。通常,基板210和超声检测芯片220采用热膨胀系数匹配的相似材料,例如硅基材料。采用本申请的封装方案,该翘曲通常小于30um。The material of the substrate 210 includes, for example, at least one of monocrystalline silicon, polycrystalline silicon, glass, etc., which can be selected based on needs to ensure a certain carrying capacity and minimize the impact on signal transmission. Optionally, the thermal expansion coefficient of the substrate 210 matches the thermal expansion coefficient of the ultrasonic detection chip 220 to prevent warpage due to temperature changes after the substrate 210 is attached to the display screen 100 and to avoid appearance marks on the display screen 100 . Generally, the substrate 210 and the ultrasonic detection chip 220 are made of similar materials with matching thermal expansion coefficients, such as silicon-based materials. Using the packaging solution of this application, the warpage is usually less than 30um.
压电材料层221例如可以由聚偏二氟乙烯(PVDF)或者聚偏二氟乙烯-三氟乙烯共聚物(PVDF-TrFE)形成;或者,也可以由锆钛酸铅(PZT)或者其同族材料比如钛酸钡系、锆钛酸铅二元系和在该二元系中添加第三种ABO3型化合物形成,其中A表示二价金属离子,B表示四价金属离子或者几种离子总和为正四价。压电材料层221靠近超声检测芯片220的表面设置有第一电极2211,其远离超声检测芯片220的表面设置有第二电极2212。第一电极2211和第二电极2212与超声检测芯片220电连接。第一电极2211例如是通过溅射等方式形成在压电材料层221表面的平面电极,第二电极2212例如是由多个电极组成的电极阵列。第一电极2211的材料例如可以是Al,第二电极2212的材料例如可以是Ag。手指返回的超声检测信号会在第一电极2211与电极阵列中每个电极之间产生电信号,每个电极对应的电信号可以作为该手指的指纹图案中的一个像素的像素值。The piezoelectric material layer 221 may be formed of, for example, polyvinylidene fluoride (PVDF) or polyvinylidene fluoride-trifluoroethylene copolymer (PVDF-TrFE); or, it may also be formed of lead zirconate titanate (PZT) or its relatives. Materials such as barium titanate series, lead zirconate titanate binary system are formed by adding a third ABO3 type compound to the binary system, where A represents a divalent metal ion, B represents a tetravalent metal ion or the sum of several ions is Positive price. A first electrode 2211 is provided on the surface of the piezoelectric material layer 221 close to the ultrasonic detection chip 220 , and a second electrode 2212 is provided on the surface far away from the ultrasonic detection chip 220 . The first electrode 2211 and the second electrode 2212 are electrically connected to the ultrasonic detection chip 220 . The first electrode 2211 is, for example, a planar electrode formed on the surface of the piezoelectric material layer 221 by sputtering or other methods, and the second electrode 2212 is, for example, an electrode array composed of a plurality of electrodes. The material of the first electrode 2211 may be, for example, Al, and the material of the second electrode 2212 may be, for example, Ag. The ultrasonic detection signal returned by the finger will generate an electrical signal between the first electrode 2211 and each electrode in the electrode array. The electrical signal corresponding to each electrode can be used as the pixel value of a pixel in the fingerprint pattern of the finger.
超声检测芯片220包括传感器电路模块,传感器电路模块的表面为压电材料层221和金属布线层222,该传感器电路模块与第一电极2211、第二电极2212以及金属布线层222电连接,金属布线层222将超声检测芯片220产生的电信号通过FPC 230引出。The ultrasonic detection chip 220 includes a sensor circuit module. The surface of the sensor circuit module is a piezoelectric material layer 221 and a metal wiring layer 222. The sensor circuit module is electrically connected to the first electrode 2211, the second electrode 2212 and the metal wiring layer 222. The metal wiring layer The layer 222 leads out the electrical signal generated by the ultrasonic detection chip 220 through the FPC 230.
在一种实现方式中,金属布线层222为(Redistribution Layer,RDL)层222,FPC230的焊盘与RDL层222的焊盘通过ACF压合,以实现超声检测芯片220与FPC 230之间的互联。即,通过重布线的方式在超声检测芯片220的表面形成新的焊盘,方便FPC 230与超声检测芯片220之间进行电连接。In one implementation, the metal wiring layer 222 is a (Redistribution Layer, RDL) layer 222, and the pads of the FPC 230 and the pads of the RDL layer 222 are pressed together through ACF to realize the interconnection between the ultrasonic detection chip 220 and the FPC 230 . That is, new pads are formed on the surface of the ultrasonic detection chip 220 through rewiring to facilitate electrical connection between the FPC 230 and the ultrasonic detection chip 220.
采用重布线的方式,可以改变超声检测芯片220的线路接点(I/O pad)即焊点的位置、数量或者宽度等,使超声检测芯片220能够适用于不同的封装方式。特别在扇出型封装中,采用重布线的方式可以向超声检测芯片220的外围走线,通过合理地设计RDL层222,能够实现更多的节点数量以及更 薄的封装结构。另外,当通过ACF对FPC 230的焊盘与RDL层222的焊盘进行压合时,降低了其工艺操作难度,便于实现FPC 230与超声检测芯片220之间的互联。By rewiring, the position, number or width of the circuit contacts (I/O pads) of the ultrasonic detection chip 220, that is, the solder joints, can be changed, so that the ultrasonic detection chip 220 can be adapted to different packaging methods. Especially in fan-out packaging, rewiring can be used to route the wiring to the periphery of the ultrasonic detection chip 220. By rationally designing the RDL layer 222, a larger number of nodes and a thinner packaging structure can be achieved. In addition, when the pads of the FPC 230 and the pads of the RDL layer 222 are pressed together through ACF, the process operation difficulty is reduced, and the interconnection between the FPC 230 and the ultrasonic detection chip 220 is facilitated.
例如,图2所示的超声检测芯片220采用了扇出型封装。RDL层222从超声检测芯片220的表面延伸出凹槽211至基板210的表面,以通过扇出型封装在基板210的表面形成用于连接FPC230的焊盘。For example, the ultrasonic detection chip 220 shown in FIG. 2 adopts a fan-out package. The RDL layer 222 extends a groove 211 from the surface of the ultrasonic detection chip 220 to the surface of the substrate 210 to form a pad for connecting the FPC 230 on the surface of the substrate 210 through fan-out packaging.
可以看出,采用扇出型封装,将RDL层222从基板210的凹槽221内的超声检测芯片220的表面延伸至基板210位于凹槽221外的表面上,这样就便于通过ACF连接FPC230的焊盘与基板210表面的RDL层222的焊盘,以实现FPC 230与超声检测芯片220之间的互联,使得超声检测芯片220可以实现更小的面积,降低超声指纹识别装置200的成本。图2中未示出FPC230与RDL层222之间的ACF。It can be seen that the fan-out package is used to extend the RDL layer 222 from the surface of the ultrasonic detection chip 220 in the groove 221 of the substrate 210 to the surface of the substrate 210 outside the groove 221, which facilitates the connection of the FPC 230 through the ACF. The pads are connected to the RDL layer 222 on the surface of the substrate 210 to realize the interconnection between the FPC 230 and the ultrasonic detection chip 220, so that the ultrasonic detection chip 220 can achieve a smaller area and reduce the cost of the ultrasonic fingerprint identification device 200. The ACF between FPC 230 and RDL layer 222 is not shown in FIG. 2 .
另外,压电材料层221不耐高温,由于采用了ACF方式对FPC230的焊盘和RDL层222的焊盘进行压合,实现FPC 230与超声检测芯片220之间的互联。相比于SMT方式,采用ACF方式不会产生过高温,在封装过程中不会对压电材料层221造成损伤,不会带来制程作业的冲突。In addition, the piezoelectric material layer 221 is not resistant to high temperatures, and the ACF method is used to press the pads of the FPC 230 and the pads of the RDL layer 222 to realize the interconnection between the FPC 230 and the ultrasonic detection chip 220. Compared with the SMT method, the ACF method will not generate excessive high temperatures, will not cause damage to the piezoelectric material layer 221 during the packaging process, and will not cause conflicts in manufacturing operations.
但是,在对FPC230的焊盘和RDL层222的焊盘进行压合时,由于压头也具有一定的温度,因此RDL层222与压电材料层221之间应保持一定距离。However, when the pads of the FPC 230 and the pads of the RDL layer 222 are pressed together, since the pressure head also has a certain temperature, a certain distance should be maintained between the RDL layer 222 and the piezoelectric material layer 221 .
FPC230的焊盘与基板210表面的RDL层222的焊盘通过ACF压合后,基于ACF的导通原理,ACF中的导电粒子连接RDL层222的焊盘上的pad与FPC230的焊盘上的pad使二者成为导通,同时避免相邻两个pad之间导通短路,从而实现仅在垂直于显示屏100的Z轴方向导通的目的。After the pads of the FPC 230 and the pads of the RDL layer 222 on the surface of the substrate 210 are pressed together by ACF, based on the conduction principle of ACF, the conductive particles in the ACF connect the pads on the pads of the RDL layer 222 and the pads on the FPC 230 The pad makes the two conductive while avoiding short circuit between two adjacent pads, thereby achieving the purpose of conduction only in the Z-axis direction perpendicular to the display screen 100 .
压电材料层221的厚度例如小于或等于50um;或者,压电材料层221远离超声检测芯片220的表面,相比于FPC 230远离超声检测芯片220的表面,更靠近显示屏100。例如,如图2所示,压电材料层221的高度应小于FPC 230的高度。在满足超声发射和接收需求的同时,降低了超声指纹识别装置200的整体厚度,节省了电子设备的内部空间。The thickness of the piezoelectric material layer 221 is, for example, less than or equal to 50um; or, the piezoelectric material layer 221 is far away from the surface of the ultrasonic detection chip 220 and is closer to the display screen 100 than the FPC 230 is far away from the surface of the ultrasonic detection chip 220. For example, as shown in Figure 2, the height of the piezoelectric material layer 221 should be less than the height of the FPC 230. While meeting the requirements for ultrasonic transmission and reception, the overall thickness of the ultrasonic fingerprint recognition device 200 is reduced, saving internal space of the electronic device.
在一种实现方式中,如图2所示,基板210与显示屏100之间通过第一胶膜301粘接,例如,第一胶膜301为DAF或者环氧树脂。第一胶膜301的厚度小于或等于50um,和/或第一胶膜301的声阻系数大于或等于4,从 而保证良好的粘接能力,且不会增加超声指纹识别装置200的厚度,同时减少对信号传输的影响。In one implementation, as shown in FIG. 2 , the substrate 210 and the display screen 100 are bonded through a first adhesive film 301. For example, the first adhesive film 301 is DAF or epoxy resin. The thickness of the first adhesive film 301 is less than or equal to 50um, and/or the acoustic resistance coefficient of the first adhesive film 301 is greater than or equal to 4, thereby ensuring good bonding ability without increasing the thickness of the ultrasonic fingerprint recognition device 200, and at the same time Reduce the impact on signal transmission.
在一种实现方式中,如图2所示,超声检测芯片220与凹槽211的底面通过第二胶膜302粘接,可选地,超声检测芯片220与凹槽211的底面之间的第二胶膜302,和基板210与显示屏100之间的第一胶膜301相同。例如,第二胶膜302可以为DAF或者环氧树脂。可选地,第二胶膜302的厚度小于或等于50um,和/或第二胶膜302的声阻系数大于或等于4,从而保证良好的粘接能力,且不会增加超声指纹识别装置200的厚度,同时减少对信号传输的影响。In one implementation, as shown in Figure 2, the ultrasonic detection chip 220 and the bottom surface of the groove 211 are bonded through a second adhesive film 302. Optionally, a third gap between the ultrasonic detection chip 220 and the bottom surface of the groove 211 is The second adhesive film 302 is the same as the first adhesive film 301 between the substrate 210 and the display screen 100 . For example, the second adhesive film 302 may be DAF or epoxy resin. Optionally, the thickness of the second adhesive film 302 is less than or equal to 50um, and/or the acoustic resistance coefficient of the second adhesive film 302 is greater than or equal to 4, thereby ensuring good bonding ability without increasing the size of the ultrasonic fingerprint identification device 200 thickness while reducing the impact on signal transmission.
第一胶膜301和第二胶膜302还应尽量匹配硅基材料,且具有较好的一致性和均匀性,不具有气泡等杂质。从而保证信号传输的一致性,减小对信号传输的影响,提高超声指纹识别装置200的指纹识别性能。The first adhesive film 301 and the second adhesive film 302 should also match the silicon-based material as much as possible, have good consistency and uniformity, and be free of impurities such as bubbles. This ensures the consistency of signal transmission, reduces the impact on signal transmission, and improves the fingerprint identification performance of the ultrasonic fingerprint identification device 200 .
在一种实现方式中,超声检测芯片220的侧面与凹槽211的侧面之间为间隙或者填充材料303。例如,如图2所示,超声检测芯片220的侧面与凹槽211的侧面之间为填充材料303,填充材料303可以对超声检测芯片220进一步固定,提高超声指纹识别装置200的结构稳定性。In one implementation, there is a gap or filling material 303 between the side surfaces of the ultrasonic detection chip 220 and the side surfaces of the groove 211 . For example, as shown in FIG. 2 , there is a filling material 303 between the side of the ultrasonic detection chip 220 and the side of the groove 211 . The filling material 303 can further fix the ultrasonic detection chip 220 and improve the structural stability of the ultrasonic fingerprint recognition device 200 .
填充材料303例如和超声检测芯片220与凹槽211的底面之间的第二胶膜302的材料相同,比如可以是DAF或者环氧树脂,或者也可以不同。当填充材料303与第二胶膜302的材料相同时,可以简化封装工艺。The filling material 303 is, for example, the same material as the second adhesive film 302 between the ultrasonic detection chip 220 and the bottom surface of the groove 211, such as DAF or epoxy resin, or it may be different. When the filling material 303 and the second adhesive film 302 are made of the same material, the packaging process can be simplified.
综上,可以看出,本申请实施例的超声指纹识别装置200采用背贴的方式贴合在显示屏100的下表面,超声指纹识别装置200包括基板210和超声检测芯片220,基板210上设置有用于容纳超声检测芯片220的凹槽211。由于是基板210与显示屏100之间贴合,其具有一定的强度,且贴合面积较大,因此减轻了超声指纹识别装置200与显示屏100贴合后产生的翘曲,不易在显示屏100上呈现外观印记。由于手指返回的超声检测信号穿过压电材料层221后到达空气界面,能够被全反射回来,加上封装后的叠层结构较为简单,因此降低了信号损耗,提升了超声指纹识别装置200的指纹识别性能。同时FPC 230与超声检测芯片220的金属布线层222之间通过ACF压合,以实现所述超声检测芯片220与FPC 230之间的互联,封装过程不会产生高温而对压电材料层221造成影响。In summary, it can be seen that the ultrasonic fingerprint identification device 200 in the embodiment of the present application is attached to the lower surface of the display screen 100 in a back-to-back manner. The ultrasonic fingerprint identification device 200 includes a substrate 210 and an ultrasonic detection chip 220. The substrate 210 is provided with There is a groove 211 for accommodating the ultrasonic detection chip 220. Since the substrate 210 and the display screen 100 are bonded together, they have a certain strength and a large bonding area. Therefore, the warpage generated after the ultrasonic fingerprint recognition device 200 and the display screen 100 are bonded is reduced, making it less likely to cause damage to the display screen. Appearance marks appear on 100. Since the ultrasonic detection signal returned by the finger passes through the piezoelectric material layer 221 and reaches the air interface, it can be fully reflected back. In addition, the encapsulated stacked structure is relatively simple, so the signal loss is reduced and the performance of the ultrasonic fingerprint identification device 200 is improved. Fingerprint recognition performance. At the same time, the FPC 230 and the metal wiring layer 222 of the ultrasonic detection chip 220 are pressed together through ACF to realize the interconnection between the ultrasonic detection chip 220 and the FPC 230. The packaging process will not generate high temperatures and cause damage to the piezoelectric material layer 221. Influence.
这种封装方式不仅降低了封装结构的复杂性,同时避免了超声指纹识别 装置200与显示屏100贴合后在显示屏100表面留下的外观印记,对电子设备的外观影响较小,并降低了信号损耗,提升了超声指纹识别装置200的指纹识别性能。This packaging method not only reduces the complexity of the packaging structure, but also avoids the appearance marks left on the surface of the display screen 100 after the ultrasonic fingerprint recognition device 200 is attached to the display screen 100. It has less impact on the appearance of the electronic device and reduces the cost. Signal loss is eliminated, and the fingerprint recognition performance of the ultrasonic fingerprint recognition device 200 is improved.
本申请还提供了一种电子设备300,请一并参见图3所示,电子设备300包括显示屏100;以及上述的超声指纹识别装置200。超声指纹识别装置200位于显示屏100的下方,具体地,超声指纹识别装置200的基板210通过胶膜例如DAF或者环氧树脂等,与显示屏100粘接,从而实现屏下超声指纹识别。This application also provides an electronic device 300. Please refer to FIG. 3 as well. The electronic device 300 includes a display screen 100; and the above-mentioned ultrasonic fingerprint recognition device 200. The ultrasonic fingerprint recognition device 200 is located below the display screen 100. Specifically, the substrate 210 of the ultrasonic fingerprint recognition device 200 is bonded to the display screen 100 through an adhesive film such as DAF or epoxy resin, thereby realizing under-screen ultrasonic fingerprint recognition.
作为示例而非限定,本申请实施例中的电子设备可以为终端设备、手机、平板电脑、笔记本电脑、台式机电脑、游戏设备、车载电子设备或穿戴式智能设备等便携式或移动计算设备,以及电子数据库、汽车、银行自动柜员机(Automated Teller Machine,ATM)等其他电子设备。该穿戴式智能设备包括功能全、尺寸大、可不依赖智能手机实现完整或部分功能的设备,例如智能手表或智能眼镜等,以及包括只专注于某一类应用功能并且需要和其它设备如智能手机配合使用的设备,例如各类进行体征监测的智能手环、智能首饰等设备。As an example and not a limitation, the electronic device in the embodiment of the present application may be a portable or mobile computing device such as a terminal device, a mobile phone, a tablet computer, a notebook computer, a desktop computer, a gaming device, a vehicle-mounted electronic device or a wearable smart device, and Electronic databases, cars, bank automated teller machines (Automated Teller Machine, ATM) and other electronic equipment. The wearable smart devices include devices that are full-featured, large in size, and can realize complete or partial functions without relying on smartphones, such as smart watches or smart glasses, as well as devices that only focus on a certain type of application function and require integration with other devices such as smartphones. Equipment used in conjunction with it, such as various smart bracelets, smart jewelry and other equipment for physical sign monitoring.
需要说明的是,在不冲突的前提下,本申请描述的各个实施例和/或各个实施例中的技术特征可以任意的相互组合,组合之后得到的技术方案也应落入本申请的保护范围。It should be noted that, on the premise of no conflict, the various embodiments described in this application and/or the technical features in each embodiment can be combined with each other arbitrarily, and the technical solution obtained after the combination should also fall within the protection scope of this application. .
本申请实施例中所揭露的系统、装置和方法,可以通过其它的方式实现。例如,以上所描述的方法实施例的一些特征可以忽略或者不执行。以上所描述的装置实施例仅仅是示意性的,单元的划分仅仅为一种逻辑功能划分,实际实现时可以有另外的划分方式,多个单元或组件可以结合或者可以集成到另一个系统。另外,各单元之间的耦合或各个组件之间的耦合可以是直接耦合,也可以是间接耦合,上述耦合包括电的、机械的或其它形式的连接。The systems, devices and methods disclosed in the embodiments of this application can be implemented in other ways. For example, some features of the method embodiments described above may be omitted or not performed. The device embodiments described above are only illustrative, and the division of units is only a logical function division. In actual implementation, there may be other divisions, and multiple units or components may be combined or integrated into another system. In addition, the coupling between units or the coupling between components may be direct coupling or indirect coupling, and the above-mentioned coupling includes electrical, mechanical or other forms of connection.
本领域的技术人员可以清楚地了解到,为了描述的方便和简洁,上述描述的装置和设备的具体工作过程以及产生的技术效果,可以参考前述方法实施例中对应的过程和技术效果,在此不再赘述。Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working processes and technical effects produced by the above-described devices and equipment can be referred to the corresponding processes and technical effects in the foregoing method embodiments. Herein No longer.
应理解,本申请实施例中的具体的例子只是为了帮助本领域技术人员更好地理解本申请实施例,而非限制本申请实施例的范围,本领域技术人员可以在上述实施例的基础上进行各种改进和变形,而这些改进或者变形均落在 本申请的保护范围内。It should be understood that the specific examples in the embodiments of the present application are only to help those skilled in the art better understand the embodiments of the present application, but do not limit the scope of the embodiments of the present application. Those skilled in the art can use the above embodiments to Various improvements and deformations are made, and these improvements or deformations fall within the protection scope of the present application.
以上所述,仅为本申请的具体实施方式,但本申请的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本申请揭露的技术范围内,可轻易想到变化或替换,都应涵盖在本申请的保护范围之内。因此,本申请的保护范围应以所述权利要求的保护范围为准。The above are only specific embodiments of the present application, but the protection scope of the present application is not limited thereto. Any person familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application. should be covered by the protection scope of this application. Therefore, the protection scope of this application should be subject to the protection scope of the claims.

Claims (15)

  1. 一种超声指纹识别装置,其特征在于,设置在电子设备的显示屏下方,以实现屏下超声指纹识别,所述超声指纹识别装置包括:An ultrasonic fingerprint identification device is characterized in that it is arranged below the display screen of an electronic device to realize under-screen ultrasonic fingerprint identification. The ultrasonic fingerprint identification device includes:
    基板,所述基板与所述显示屏粘接,所述基板远离所述显示屏的一侧设置有凹槽;A substrate, the substrate is bonded to the display screen, and a groove is provided on the side of the substrate away from the display screen;
    超声检测芯片,所述超声检测芯片至少部分位于所述凹槽内,所述超声检测芯片的一面与所述凹槽的底面粘接,所述超声检测芯片的另一面的一侧设置有压电材料层和金属布线层,所述压电材料层用于向所述显示屏上方的手指发射超声信号,并接收所述手指返回的超声检测信号,所述超声检测信号用于所述超声检测芯片获取所述手指的指纹信息;以及,Ultrasonic detection chip, the ultrasonic detection chip is at least partially located in the groove, one side of the ultrasonic detection chip is bonded to the bottom surface of the groove, and one side of the other side of the ultrasonic detection chip is provided with a piezoelectric Material layer and metal wiring layer. The piezoelectric material layer is used to transmit ultrasonic signals to the finger above the display screen and receive the ultrasonic detection signal returned by the finger. The ultrasonic detection signal is used for the ultrasonic detection chip. Obtain the fingerprint information of the finger; and,
    柔性电路板,所述柔性电路板设置在所述基板远离所述显示屏的一侧,所述柔性电路板的焊盘与所述金属布线层的焊盘通过异方性导电胶膜压合,以实现所述超声检测芯片与所述柔性电路板之间的互联。Flexible circuit board, the flexible circuit board is arranged on the side of the substrate away from the display screen, and the pads of the flexible circuit board and the pads of the metal wiring layer are pressed together through an anisotropic conductive adhesive film, To realize the interconnection between the ultrasonic detection chip and the flexible circuit board.
  2. 根据权利要求1所述的超声指纹识别装置,其特征在于,所述金属布线层为重布线层,所述柔性电路板的焊盘与所述重布线层的焊盘通过所述异方性导电胶膜压合。The ultrasonic fingerprint identification device according to claim 1, wherein the metal wiring layer is a rewiring layer, and the pads of the flexible circuit board and the rewiring layer are electrically conductive through the anisotropy. Film lamination.
  3. 根据权利要求2所述的超声指纹识别装置,其特征在于,所述重布线层从所述超声检测芯片的表面延伸出所述凹槽至所述基板的表面,以通过扇出型封装在所述基板的表面形成用于连接所述柔性电路板的焊盘。The ultrasonic fingerprint identification device according to claim 2, wherein the rewiring layer extends from the groove from the surface of the ultrasonic detection chip to the surface of the substrate to be packaged in the ultrasonic fingerprint recognition device through a fan-out type package. The surface of the substrate forms a pad for connecting to the flexible circuit board.
  4. 根据权利要求1至3中任一项所述的超声指纹识别装置,其特征在于,The ultrasonic fingerprint identification device according to any one of claims 1 to 3, characterized in that:
    所述压电材料层的厚度小于或等于50um;或者,The thickness of the piezoelectric material layer is less than or equal to 50um; or,
    所述压电材料层远离所述超声检测芯片的表面,相比于所述柔性电路板远离所述超声检测芯片的表面,更靠近所述显示屏。The surface of the piezoelectric material layer away from the ultrasonic detection chip is closer to the display screen than the surface of the flexible circuit board away from the ultrasonic detection chip.
  5. 根据权利要求1至4中任一项所述的超声指纹识别装置,其特征在于,所述基板与所述显示屏之间通过第一胶膜粘接,所述第一胶膜的厚度小于或等于50um,和/或所述第一胶膜的声阻系数大于或等于4。The ultrasonic fingerprint identification device according to any one of claims 1 to 4, characterized in that the substrate and the display screen are bonded through a first adhesive film, and the thickness of the first adhesive film is less than or equal to 50um, and/or the acoustic resistance coefficient of the first adhesive film is greater than or equal to 4.
  6. 根据权利要求5所述的超声指纹识别装置,其特征在于,所述第一胶膜为芯片粘结膜或者环氧树脂。The ultrasonic fingerprint identification device according to claim 5, wherein the first adhesive film is a chip bonding film or an epoxy resin.
  7. 根据权利要求1至6中任一项所述的超声指纹识别装置,其特征在于,所述超声检测芯片与所述凹槽的底面通过第二胶膜粘接,所述超声检测 芯片与所述凹槽的底面之间的第二胶膜,和所述基板与所述显示屏之间的第一胶膜的材料相同。The ultrasonic fingerprint identification device according to any one of claims 1 to 6, characterized in that the ultrasonic detection chip and the bottom surface of the groove are bonded through a second adhesive film, and the ultrasonic detection chip and the bottom surface of the groove are bonded together. The second adhesive film between the bottom surfaces of the grooves is made of the same material as the first adhesive film between the substrate and the display screen.
  8. 根据权利要求1至7中任一项所述的超声指纹识别装置,其特征在于,所述超声检测芯片的侧面与所述凹槽的侧面之间为空隙或者填充材料。The ultrasonic fingerprint identification device according to any one of claims 1 to 7, characterized in that there is a gap or filling material between the side of the ultrasonic detection chip and the side of the groove.
  9. 根据权利要求8所述的超声指纹识别装置,其特征在于,所述填充材料与所述第二胶膜的材料相同。The ultrasonic fingerprint identification device according to claim 8, wherein the filling material and the second adhesive film are made of the same material.
  10. 根据权利要求1至9中任一项所述的超声指纹识别装置,其特征在于,所述基板的热膨胀系数与所述超声检测芯片的热膨胀系数相匹配。The ultrasonic fingerprint identification device according to any one of claims 1 to 9, wherein the thermal expansion coefficient of the substrate matches the thermal expansion coefficient of the ultrasonic detection chip.
  11. 根据权利要求1至10中任一项所述的超声指纹识别装置,其特征在于,所述基板的材料包括单晶硅、多晶硅、玻璃中的至少一种。The ultrasonic fingerprint identification device according to any one of claims 1 to 10, wherein the material of the substrate includes at least one of monocrystalline silicon, polycrystalline silicon, and glass.
  12. 根据权利要求1至11中任一项所述的超声指纹识别装置,其特征在于,所述压电材料层靠近所述超声检测芯片的表面设置有第一电极,其远离所述超声检测芯片的表面设置有第二电极,所述第二电极是由多个电极组成的电极阵列,所述第一电极和所述第二电极与所述超声检测芯片电连接。The ultrasonic fingerprint identification device according to any one of claims 1 to 11, wherein a first electrode is provided on the surface of the piezoelectric material layer close to the ultrasonic detection chip, and a first electrode is provided on the surface of the piezoelectric material layer away from the ultrasonic detection chip. A second electrode is provided on the surface. The second electrode is an electrode array composed of a plurality of electrodes. The first electrode and the second electrode are electrically connected to the ultrasonic detection chip.
  13. 根据权利要求1至12中任一项所述的超声指纹识别装置,其特征在于,所述压电材料层由以下材料中的至少一种形成:The ultrasonic fingerprint identification device according to any one of claims 1 to 12, wherein the piezoelectric material layer is formed of at least one of the following materials:
    聚偏二氟乙烯、聚偏二氟乙烯-三氟乙烯共聚物、钛酸钡系、锆钛酸铅二元系及在所述二元系中添加第三种ABO3型化合物,其中,A表示二价金属离子,B表示四价金属离子或几种离子总和为正四价。Polyvinylidene fluoride, polyvinylidene fluoride-trifluoroethylene copolymer, barium titanate series, lead zirconate titanate binary system and adding a third ABO3 type compound to the binary system, where A represents Divalent metal ions, B represents tetravalent metal ions or the sum of several ions is positive tetravalent.
  14. 根据权利要求1至13中任一项所述的超声指纹识别装置,其特征在于,所述超声检测芯片全部位于所述凹槽内,且所述超声检测芯片远离所述显示屏表面与所述基板远离所述显示屏的表面齐平。The ultrasonic fingerprint identification device according to any one of claims 1 to 13, wherein the ultrasonic detection chip is entirely located in the groove, and the ultrasonic detection chip is away from the surface of the display screen and the The substrate is flush with the surface away from the display screen.
  15. 一种电子设备,其特征在于,包括:An electronic device, characterized by including:
    显示屏;以及,display screen; and,
    根据权利要求1至14中任一项所述的超声指纹识别装置。The ultrasonic fingerprint identification device according to any one of claims 1 to 14.
PCT/CN2022/096313 2022-05-31 2022-05-31 Ultrasonic fingerprint recognition apparatus and electronic device WO2023230864A1 (en)

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Publication number Priority date Publication date Assignee Title
CN211698983U (en) * 2020-03-06 2020-10-16 南昌欧菲生物识别技术有限公司 Wearable device
CN113419645A (en) * 2021-07-15 2021-09-21 业泓科技(成都)有限公司 Ultrasonic fingerprint identification module, electronic equipment and ultrasonic fingerprint identification method
US20210397801A1 (en) * 2020-06-23 2021-12-23 Qualcomm Incorporated Techniques for beamforming pressure waves

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN211698983U (en) * 2020-03-06 2020-10-16 南昌欧菲生物识别技术有限公司 Wearable device
US20210397801A1 (en) * 2020-06-23 2021-12-23 Qualcomm Incorporated Techniques for beamforming pressure waves
CN113419645A (en) * 2021-07-15 2021-09-21 业泓科技(成都)有限公司 Ultrasonic fingerprint identification module, electronic equipment and ultrasonic fingerprint identification method

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