CN207718390U - Ultrasonic fingerprint identification module, module, device and electronic equipment - Google Patents
Ultrasonic fingerprint identification module, module, device and electronic equipment Download PDFInfo
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- CN207718390U CN207718390U CN201721303891.3U CN201721303891U CN207718390U CN 207718390 U CN207718390 U CN 207718390U CN 201721303891 U CN201721303891 U CN 201721303891U CN 207718390 U CN207718390 U CN 207718390U
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Abstract
The utility model is related to fingerprint identification technology field more particularly to a kind of ultrasonic fingerprint identification module, module, device and electronic equipments.The ultrasonic fingerprint identification module of the utility model includes upper electrode layer, piezoelectric layer and lower electrode layer, upper electrode layer and lower electrode layer are separately positioned on two opposite surfaces of piezoelectric layer, the lower electrode block that the lower electrode layer includes signal processing layer, passivation layer and array arrangement on surface of the signal processing layer close to piezoelectric layer, the passivation layer be arranged on the surface in lower electrode block close to piezoelectric layer and will under electrode block cover.The ultrasonic fingerprint identification module, module, device and electronic equipment of the utility model not only have simple in structure, the high advantage of reliability, and it is that fingerprint identification module is directly formed in processing chip, keep the size of ultrasonic fingerprint identification module entirety smaller, is more in line with the trend that electronic equipment is lightening, integrated level is high.
Description
【Technical field】
The utility model is related to fingerprint identification technology field more particularly to a kind of ultrasonic fingerprint identification module, module, devices
Part and electronic equipment.
【Background technology】
Currently, fingerprint identification technology such as has been widely used in mobile terminal, smart home, has fought crime at the multiple fields.
Many facility and safety are brought to people’s lives.The fingerprint identification technology of present mainstream has light fingerprint recognition, condenser type
Fingerprint recognition and ultrasonic fingerprint identification, but they also have the shortcomings that respective, such as light fingerprint recognition and capacitance type fingerprint know
There is not a greasy dirt in finger, dust when the substances such as water, is easy for that fingerprint image can not be parsed；And ultrasonic fingerprint identification is for answering
It is less high with the requirement of environment, therefore ultrasonic fingerprint identification is used widely.
But the structure of existing ultrasonic fingerprint identification module is all sufficiently complex, integrated level is relatively low.
【Utility model content】
In view of the above-mentioned problems, a kind of ultrasonic fingerprint identification module of the utility model offer, module, device and electronics are set
It is standby.
The scheme that the utility model solves technical problem is to provide a kind of ultrasonic fingerprint identification module, and the ultrasonic wave refers to
Line identification module includes upper electrode layer, piezoelectric layer and lower electrode layer, and upper electrode layer and lower electrode layer are separately positioned on piezoelectric layer phase
To two surfaces on, the lower electrode layer includes that signal processing layer, passivation layer and array arrangement are close in signal processing layer
Lower electrode block on the surface of piezoelectric layer, the passivation layer is arranged on the surface in lower electrode block close to piezoelectric layer and the electrode by under
Block covers.
Preferably, the piezoelectric layer is polarized ferroelectric polymer film in situ.
Preferably, the ultrasonic fingerprint identification module further comprises that protective layer, the protective layer are arranged in top electrode
It is partly or entirely covered on surface of the layer far from piezoelectric layer and by upper electrode layer.
The utility model also provides a kind of ultrasonic fingerprint identification module, and the ultrasonic fingerprint identification module includes as above
Ultrasonic fingerprint identification module, electrically-conductive backing plate and the circuit board, the electrically-conductive backing plate are located at circuit board and ultrasonic fingerprint
Between identification module, the ultrasonic fingerprint identification module is electrically connected with electrically-conductive backing plate, described circuit board one end and conductive base
Plate is electrically connected, and the other end is additionally operable to be electrically connected with external circuit, the upper electrode layer and lower electrode layer respectively with conductive base
Plate is electrically connected.
Preferably, the electrically-conductive backing plate is silicon-based wafer.
Preferably, the ultrasonic fingerprint identification module further comprises that discrete device, the discrete device are arranged in electricity
Road plate is electrically connected on the surface of ultrasonic fingerprint identification module and with circuit board.
Preferably, the ultrasonic fingerprint identification module further comprises that connector, the connector are arranged in circuit board
On, the connector is used to be electrically connected with external circuit.
The utility model also provides a kind of ultrasonic fingerprint recognition means, and the ultrasonic fingerprint recognition means include display
Module and ultrasonic fingerprint as described above identify that module, one of described display module surface are to be operated for user
Touch surface, the ultrasonic fingerprint identification module is set on another face opposite with touch surface.
Preferably, the ultrasonic fingerprint recognition means further comprise that adhesive-layer, the mucigel are arranged in ultrasonic wave
Between fingerprint recognition module and display module.
The utility model also provides a kind of electronic equipment, including ultrasonic fingerprint as described above identifies module.
Compared with prior art, the ultrasonic fingerprint identification module of the utility model comprising upper electrode layer, piezoelectric layer and
Lower electrode layer, upper electrode layer and lower electrode layer are separately positioned on two opposite surfaces of piezoelectric layer, and the lower electrode layer includes
The lower electrode block of signal processing layer, passivation layer and array arrangement on surface of the signal processing layer close to piezoelectric layer, it is described blunt
Change layer is arranged on the surface in lower electrode block close to piezoelectric layer and electrode block covers by under.The ultrasonic fingerprint of the utility model is known
Other module not only has simple in structure, the high advantage of reliability, and it is the formation fingerprint recognition mould directly in processing chip
Block keeps the size of ultrasonic fingerprint identification module entirety smaller, is more in line with the trend that electronic equipment is lightening, integrated level is high.
In addition, the piezoelectric layer of the utility model is polarized ferroelectric polymer film in situ, has piezoelectric effect
Well, the advantages of high resolution.
Compared with prior art, the ultrasonic fingerprint of the utility model identifies module comprising ultrasonic wave as described above
Fingerprint identification module, electrically-conductive backing plate and circuit board, the electrically-conductive backing plate between circuit board and ultrasonic fingerprint identification module,
The ultrasonic fingerprint identification module is electrically connected with electrically-conductive backing plate, and described circuit board one end is electrically connected with electrically-conductive backing plate, separately
One end is additionally operable to be electrically connected with external circuit, and the upper electrode layer and lower electrode layer are electrically connected with electrically-conductive backing plate respectively.This
The ultrasonic fingerprint identification module of utility model not only has simple in structure, the high advantage of reliability, and it is directly to locate
Fingerprint identification module is formed on reason chip, keeps the size of ultrasonic fingerprint identification module entirety smaller, is more in line with electronic equipment
Trend lightening, integrated level is high.
Compared with prior art, the ultrasonic fingerprint recognition means of the utility model include display module and as described above
Ultrasonic fingerprint identifies module, and one of described display module surface is the touch surface operated for user, with touch
The ultrasonic fingerprint identification module is set on another opposite face of face.The ultrasonic fingerprint recognition means of the utility model are not
Only there is simple in structure, the high advantage of reliability, and it is that fingerprint identification module is directly formed in processing chip, is more accorded with
Close the trend that electronic equipment is lightening, integrated level is high.
Compared with prior art, the electronic equipment of the utility model comprising ultrasonic fingerprint as described above identifies mould
Block.The electronic equipment of the utility model has integrated level high, and reliability is high, more frivolous advantage.
【Description of the drawings】
Fig. 1 is the laminated construction schematic diagram of the ultrasonic fingerprint recognition means of the utility model first embodiment.
Fig. 2 is the structural schematic diagram of the ultrasonic fingerprint identification module of the utility model first embodiment.
Fig. 3 is the laminated construction schematic diagram of the ultrasonic fingerprint recognition means of the utility model second embodiment.
Fig. 4 is the structural schematic diagram of the ultrasonic fingerprint identification module of the utility model second embodiment.
【Specific implementation mode】
In order to make the purpose of this utility model, technical solution and advantage be more clearly understood, below in conjunction with attached drawing and implementation
Example, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is only explaining
The utility model is not used to limit the utility model.
First embodiment
Referring to FIG. 1, the first embodiment of the utility model provides a kind of ultrasonic fingerprint recognition means 10, the ultrasound
Wave fingerprint recognition device 10 includes ultrasonic fingerprint identification module 10a, adhesive-layer 14 and display module 16, the display module 16
One of surface be the touch surface 165 operated for user, be provided on another face opposite with touch surface 165 viscous
Glue-line 14, adhesive-layer 14 are bonded with ultrasonic fingerprint identification module 10a to enhance ultrasonic fingerprint identification module 10a and display mould
The bonding strength of group 16.The display module 16 can be market it is more existing include display layer, cover-plate glass etc. substantially tie
The display module of structure, but preferably comprise the display module of OLED (Organic Light Emitting Diode) or TFT (thin film transistor (TFT)) etc..
The display module 16 includes fingerprint identification area 161 and non-fingerprint identification area 163, and the fingerprint identification area 161 and non-fingerprint are known
Other area 163 can be the structure that can be obviously distinguished according to physical arrangement, such as：The display module bottom of iPhone is individually set
It is equipped with fingerprint identification area；Can also be the structure distinguished according to function, for example, the display module in full frame touch-control part
Region defines fingerprint identification area, only can just carry out fingerprint recognition in the area.It is appreciated that the adhesive-layer 14 can save
Slightly, the display module 16 close to the surface of ultrasonic fingerprint identification module 10a per se with viscosity, the display module 16
Fingerprint identification area 161 is directly Nian Jie with ultrasonic fingerprint identification module 10a.(the upper bottom left mentioned in the utility model
Right equal nouns of locality are only limitted to the relative position in given view rather than absolute position, it will be understood that given view planar into
After 180 ° of rotations of row, position word "lower" can replace with position word "upper".)
The ultrasonic fingerprint identification module 10a includes ultrasonic fingerprint identification module 11, booster circuit layer 13, conductive base
Plate 15 and circuit board 17.The ultrasonic fingerprint identification module 11, electrically-conductive backing plate 15 and circuit board 17 stack to form lamination successively
Structure, wherein electrically-conductive backing plate 15 is between ultrasonic fingerprint identification module 11 and circuit board 17.In other words circuit board 17 with it is super
Projection of the sound wave fingerprint identification module 11 in display module 16 is least partially overlapped.11 He of ultrasonic fingerprint identification module
The position of electrically-conductive backing plate 15 is corresponding with the fingerprint identification area 161 of display module 16.The ultrasonic fingerprint identification module 11 with
Electrically-conductive backing plate 15 is electrically connected, and 17 one end of the circuit board is electrically connected with electrically-conductive backing plate 15, and the other end is used for and external circuit
Be electrically connected, the booster circuit layer 13 and electrically-conductive backing plate 15 are electrically connected, the voltage for being used to export electrically-conductive backing plate 15 into
Row increases.It is appreciated that, it is preferred that multiple pins 151 are provided on the surface of circuit board 17 in the electrically-conductive backing plate 15,
The circuit board 17 is electrically connected with the pin 151, and circuit board 17 realizes electric connection by welding with pin 151,
Stability is more preferable, and electrical reliability is preferable.It is appreciated that the circuit board 17 can be printed circuit board, flexible PCB or
Other circuit boards with conductive structure of person, preferably circuit board 17 is flexible PCB in the present invention, so as to
Reduce the thickness of ultrasonic fingerprint identification module 11.It is further appreciated that the electrically-conductive backing plate 15 is preferably silicon-based wafer.
Referring to FIG. 2, the ultrasonic fingerprint identification module 11 includes upper electrode layer 111, protective layer 112, piezoelectric layer 113
With lower electrode layer 115, the upper electrode layer 111 and lower electrode layer 115 are separately positioned on two opposite surfaces of piezoelectric layer 113
On, wherein upper electrode layer 111 is arranged close to display module 16, the upper electrode layer 111 and lower electrode layer 115 respectively with conductive base
Plate 15 is electrically connected.The protective layer 112 is arranged on surface of the upper electrode layer 111 far from piezoelectric layer 113 and by upper electrode layer
111 partly or entirely coverings, the effect of the protective layer 112 is protected to upper electrode layer 111, prevents it from aoxidizing or damaging
It is bad, to substantially increase the service life of ultrasonic fingerprint identification module 11.It is appreciated that the protective layer 112 can save
Slightly, to reduce the thickness of ultrasonic fingerprint identification module 11, it is more in line with the lightening trend of electronic equipment.The protection
The material of layer 112 is preferably silicon nitride.
The lower electrode layer 115 includes signal processing layer 1155, passivation layer 1151 and array arrangement in signal processing layer
1155 electrode block 1153 on the surface of piezoelectric layer 113, the passivation layer 1151 are arranged in electrode block 1153 close to piezoelectricity
It is covered on the surface of layer 113 and by electrode block 1153.The multiple electrode block 1153 is used to carry out the induction of ultrasonic signal, by
It is usually 300um in the width in a paddy ridge period of finger, the size by the way that electrode block 1153 is arranged advantageously ensures that identification
Fingerprint clarity, so that it is guaranteed that the accuracy of fingerprint recognition.Preferably, the area of the electrode block 1153 is less than or waits
In 70 μm * 70 μm, further preferably less than or equal to 60 μm * 60 μm, still more preferably 40 μm * 40 μm, electrode block
1153 size within this range when, fingerprint recognition best results.The effect of the passivation layer 1151 be to electrode block 1153 into
Row protection prevents it from aoxidizing or damaging, to substantially increase the service life of ultrasonic fingerprint identification module 11.It can manage
Solution, the passivation layer 1151 can be omitted, to reduce the thickness of ultrasonic fingerprint identification module 11, be more in line with electronics and set
Standby lightening trend.The material of the passivation layer 1151 is preferably silicon nitride.Preferably, the passivation layer 1151 is by electrode block
Including 1153 integral coatings, protecting effect is best.It is appreciated that the signal processing layer 1155 includes a signal processing chip
Or multiple signal processing chip interval settings, the signal processing chip are used for collecting and analyzing into horizontal electrical signal.It can be with
Understanding, the upper electrode layer 111 can also be the electrode block 1153 including multiple array arrangements, and the upper electrode layer 111
Size, the position consistency of the electrode block 1153 of the size of electrode block 1153, position and lower electrode layer 115.When upper electrode layer 111 wraps
When including the electrode block 1153 of multiple array arrangements, the lower electrode layer 115 can be a flood electrode.
Piezoelectric layer 113 is piezoelectric film, it is preferred that piezoelectric layer 113 is ferroelectric polymer film, in a specific embodiment
In, the ferroelectric polymer film is by purchasing existing ferroelectric polymer film finished product, then again by being adhered to substrate
On obtained to be polarized.In general, the ferroelectric polymer film of this finished product needs first to be drawn high with certain stress then
It is polarized again by being bonded in substrate again, the ferroelectric polymer film thickness that such method is formed is at 30 μm or more, no
The frivolous development trend of existing electronic device is adapted to, and using the ultrasonic fingerprint identification module of this polarized film, due to pressure
Electrical sensing film is too thick, therefore resolution ratio is relatively low.Ferroelectric polymer film polarization method in the above embodiment is mostly direct
High voltage electric field is set between the upper and lower surface of ferroelectric polymer film to carry out, but because ferroelectric polymer film itself is thick
The unevenness of degree, it is possible that being easy to be punctured by high-voltage electricity place, the production qualification rate of piezoelectric film 113 is very low, is unfavorable for advising greatly
Mould produces, and the piezoelectric effect of piezoelectric film obtained 113 is poor, and service life is shorter.
In another specific embodiment, the piezoelectric layer 113 of the utility model is preferably the ferroelectricity that polarization in situ is formed
Thin polymer film, specially the piezoelectric layer 113 is that piezoelectric film 113, the piezoelectricity are formed in situ on one side in lower electrode layer 115
Film 113 includes opposite first surface and second surface, and the first surface is the one side close to lower electrode layer 115, described
Second surface is close to the surface of upper electrode layer 111.When polarization, it is zero to make the first surface potential of the piezoelectric film 113；Institute
Side where stating the second surface of piezoelectric film 113 provides the first electric field and the second electric field, and the potential of the first electric field is higher than the second electric field
Potential；The environmental gas of the side where 113 second surface of the piezoelectric film, the environment are ionized under the action of the first electric field
Gas is gathered in the second surface of piezoelectric film 113 across the second electric field, makes to be formed along film thickness side in the piezoelectric film 113
To film internal electric field, to the piezoelectric film 113 carry out polarization form the piezoelectric layer 113.It is appreciated that the ferroelectric polymers
For film by chemical vapor deposition, the wet chemical methods such as coating, dip-coating are formed in 115 surface of lower electrode layer, therefore can be formed
Very thin thickness and uniform ferroelectric polymer film, thickness can be less than 30 μm, it is preferred that thickness can maintain 9 μm hereinafter,
To reduce the transmission loss of signal, formation process is simple, moreover, using the ultrasonic fingerprint of this polarized film being formed in situ
Identification module 11, resolution ratio greatly improves.The thickness of the piezoelectric layer 113 may further be less than 9 μm, still further, its
Thickness can be 1.5-7.4 μm, 1.9-7.2 μm, 2.2-8.6 μm, 2.8-8.4 μm or 3.6-6.6 μm, further,
Can be specifically 1.8 μm, 2.4 μm, 2.6 μm, 3.7 μm, 3.9 μm, 4.2 μm, 4.6 μm, 5.6 μm, 5.8 μm, 6.7 μm, 8.6 μm,
8.7μm。
Furthermore compared to directly in the upper and lower surface of piezoelectric layer 113 setting polarization of electrode method, above-mentioned virtual polarization side
Method will not make piezoelectric layer 113 directly bear applied high voltage electric field, be avoided that piezoelectric layer 113 is breakdown.Specifically, above-mentioned pole
Ion body polarization (for details, reference can be made to application No. is 201710108374.9 Chinese patent applications) or X-ray polarization can be used in change
The mode of (for details, reference can be made to application No. is 201611222575.3 Chinese patent applications) forms the piezoelectric layer, is formed by
Piezoelectric layer 113 can accomplish it is very thin, moreover, the piezoelectric effect of the piezoelectric layer 113 of the utility model is preferable and service life is long,
It can be good at being useful in ultrasonic fingerprint identification module 11, be conducive to realize the preferably identification of ultrasonic fingerprint identification module 11
Effect.In this embodiment, the piezoelectric constant d33 of the polarized piezoelectric layer 113 in situ has been carried out ranging from
20-35pC/N, further preferably 25 ￣ 29pC/N.
It is appreciated that the material of the piezoelectric layer 113 is ferroelectric polymer material, it is specific to can be selected but be not limited to：It is poly- inclined
Vinyl fluoride, polyvinyl chloride, poly-γ-methyl-L-glutamate, makrolon, Kynoar, polyvinylidene fluoride
PVDF, polyvinylidene fluoride trifluoro-ethylene PVDF-TrFE, polymetylmethacrylate, polytetrafluoroethylene (PTFE) TEFLON etc. are altogether
One or several kinds of combinations in polymers.
In some embodiments of the utility model, the copolymer of the material selection Kynoar of the piezoelectric layer 113
It is specifically polyvinylidene fluoride trifluoro-ethylene PVDF-TrFE, in order to obtain for Kynoar-trifluoro-ethylene copolymer
The range of the mass ratio of the preferable piezoelectric layer of piezoelectric effect, the polyvinylidene fluoride and trifluoro-ethylene is (60-95)：(5-
30), it is preferable that the range of its mass ratio is (75-86)：(15-25), it is further preferred that its mass ratio is 80：20 or
75：25 or 70：30, the polyvinylidene fluoride and trifluoro-ethylene copolymer more individually select polyvinylidene fluoride that can reduce into
This, and it also has preferable piezoelectric effect.
Existing α phases crystal grain also has β phases crystal grain and non-in the piezoelectric film 113 of gained after ferroelectric polymer film polarization
The content of amorphous material, β phases is corresponding with the piezoelectric effect of piezoelectric film 113, when the content that β phase crystal grain accounts for total crystal grain is 60-
When 70%, polarized film has preferable piezoelectric effect, the piezoelectric effect of the content more high polarization film of β phases better.However excessively
Polarization will produce extra unnecessary charge etc., these excess charges are easy to tie again with other charges on polymer surfaces
It closes, to influence the performance of gained piezoelectric film.In the present embodiment, the β phases crystal grain of the ferroelectric polymers piezoelectric film 113 with it is total
Crystal grain mass ratio is 60 ￣ 70%.
Referring again to Fig. 1, the ultrasonic fingerprint identification module 10a further comprises discrete device 18 and connector 19,
The discrete device 18 is that can not exist with the integrated electronic component made of signal processing layer 1155, the setting of the discrete device 18
Circuit board 17 is electrically connected on the surface of ultrasonic fingerprint identification module 11 and with circuit board 17, and its position and display mould
The non-fingerprint identification area 163 of group 16 corresponds to.The connector 19 is arranged in circuit board 17 close to ultrasonic fingerprint identification module 11
Surface on, the connector 19 is used for and external circuit is electrically connected, the position of the connector 19 and display module 16
Non- fingerprint identification area 163 is corresponding.Projection of the above-mentioned discrete device 18 and connector 19 in display module 16 is all fallen
In non-fingerprint identification area 163.It is appreciated that the connector 19 is preferably FPC connector, make the electricity of circuit board and external circuit
Property connection it is more firm.
A work period of ultrasonic fingerprint identification module 10a includes launching phase and reception stage two parts.Transmitting
Stage, external circuit pass sequentially through circuit board 17, electrically-conductive backing plate 15 while giving upper electrode layer 111 and lower electrode layer 115 respectively
Voltage signal no longer needs to lead to when the voltage signal for giving upper electrode layer 111 is higher than the voltage signal for giving lower electrode layer 115
13 pairs of voltage signal for giving upper electrode layer 111 of booster circuit layer are crossed to increase；When giving upper electrode layer 111 and lower electrode layer
When 115 identical voltage signal, the voltage signal that 13 pairs of electrically-conductive backing plate 15 of booster circuit layer are transferred to upper electrode layer 111 rises
It is high；When the potential of upper electrode layer 111 is higher than the potential of lower electrode layer 115, the both sides of piezoelectric layer 113 form a potential difference, make
Piezoelectric layer 113 generates mechanical oscillation and sends out ultrasonic wave, and external circuit stopping gives upper electrode layer 111 and lower electrode layer 115 electricity
Press signal.Reception stage, the ultrasonic wave that piezoelectric layer 113 is sent out touch finger back reflection, due at fingerprint valley and at fingerprint ridge
Compared to there are more air, therefore the fingerprint valley of finger and the signal strength that is reflected at fingerprint ridge are different, usual fingerprint valley institute
The ultrasonic energy that the energy of the ultrasonic wave of reflection can be reflected than fingerprint ridge is big, i.e., the signal strength that fingerprint valley is reflected is eager to excel
In the signal strength that fingerprint ridge is reflected, piezoelectric layer 113 receives the reflected different ultrasonic waves of fingerprint valley and fingerprint ridge institute
Signal, by the way that the size of electrode block 1153 is arranged, makes a paddy ridge period of finger correspond to generate different electric signals
Therefore multiple electrodes block 1153 corresponds respectively to the electrode block 1153 of fingerprint valley and fingerprint ridge since the effect of electrostatic coupling is produced
The charge inducing of raw different number, signal processing layer 1155 realize that fingerprint is known by the difference of the quantity of detection charge inducing
Not, testing result is finally passed into external circuit by circuit board 17.
The first embodiment of the utility model also provides a kind of electronic equipment, and ultrasonic fingerprint as described above is used to know
Other module.The electronic equipment includes but not limited to the equipment of the brush fingers line such as mobile phone, computer, tablet computer, attendance recorder.
Second embodiment
Referring to FIG. 3, the second embodiment of the utility model also provides the ultrasonic fingerprint recognition means of another structure
20, the ultrasonic fingerprint recognition means 20 include ultrasonic fingerprint identification module 20a, display module 26 and adhesive-layer 24, institute
It is the touch surface 265 operated for user to state one of display module 26 surface, another opposite with touch surface 265
Adhesive-layer 24 is provided on face, adhesive-layer 24 bonds with ultrasonic fingerprint identification module 20a and identifies mould to enhance ultrasonic fingerprint
The bonding strength of group 20a and display module 26.The display module 26 can be market it is more existing include display layer, cover board
The display module of the basic structures such as glass, but preferably comprise OLED (Organic Light Emitting Diode) or TFT (thin film transistor (TFT))
Deng display module.The display module 26 includes fingerprint identification area 261 and non-fingerprint identification area 263, the fingerprint identification area
261 and non-fingerprint identification area 263 can be the structure that can be obviously distinguished according to physical arrangement, such as：The display of iPhone
Module bottom is separately provided with fingerprint identification area；Can also be the structure distinguished according to function, such as in full frame touch-control
The subregion of display module defines fingerprint identification area, only can just carry out fingerprint recognition in the area.It is appreciated that described
Adhesive-layer 24 can be omitted, and the display module 26 is close to the surface of ultrasonic fingerprint identification module 20a per se with viscosity, institute
The fingerprint identification area 261 for stating display module 26 is directly connect with ultrasonic fingerprint identification module 20a.It (is carried in the utility model
And the nouns of locality equal up and down be only limitted to the relative position in given view rather than absolute position, for example, it is to be understood that referring to
Determine view planar carry out 180 ° rotation after, position word "lower" can replace with position word "upper".)
The ultrasonic fingerprint identification module 20a includes ultrasonic fingerprint identification module 21, non-conductive substrate 25 and circuit
Plate 27, the ultrasonic fingerprint identification module 21 overlay on non-conductive substrate 25, and ultrasonic fingerprint identification module 21 and not
The position of electrically-conductive backing plate 25 is corresponding with the fingerprint identification area 261 of display module 26, position and the display module 26 of circuit board 27
Non- fingerprint identification area 263 it is corresponding, circuit board 27 and ultrasonic fingerprint identification module 21 are in display module 26 in other words
Projection is not overlapped.The ultrasonic fingerprint identification module 21 is electrically connected with circuit board 27, and circuit board 27 is additionally operable to and external electrical
Road is electrically connected.It is appreciated that the circuit board 27 can be printed circuit board, flexible PCB (Flexible Printed
Circuit, abbreviation FPC) or other circuit boards with conductive structure, preferably circuit board 27 is soft in the present invention
Property circuit board.It is further appreciated that the non-conductive substrate 25 is preferably glass.
Please also refer to Fig. 3 and Fig. 4, the ultrasonic fingerprint identification module 21 include lamination setting upper electrode layer 211,
Piezoelectric layer 213 and lower electrode layer 215, upper electrode layer 211 and lower electrode layer 215 are separately positioned on opposite two of piezoelectric layer 213
On surface, wherein upper electrode layer 211 close to display module 26 be arranged, the circuit board 27 respectively with upper electrode layer 211 and lower electricity
Pole layer 215 is electrically connected.The lower electrode layer 215 includes multiple electrode blocks 2153 in array distribution, the electrode block 2153
Non-conductive substrate 25 is provided on the surface of display module 26, the size of the electrode block 2153 is required with first in fact
It applies in example unanimously, therefore details are not described herein.It is appreciated that the upper electrode layer 211 can also be flood conduction or pass through
The conducting block that multiple array arrangements are arranged to realize electric connection with circuit board 27.It is appreciated that the upper electrode layer 211 also may be used
To be the electrode block 2153 for including multiple array arrangements, and the size of the electrode block 2153 of the upper electrode layer 211, position are under
The size of the electrode block 2153 of electrode layer 215 is consistent, position corresponds.When upper electrode layer 211 includes multiple array arrangements
When electrode block 2153, the lower electrode layer 215 can be a flood electrode.
It is appreciated that the piezoelectric layer 213 is piezoelectric film, it is preferred that piezoelectric layer 213 is polarized ferroelectric polymers in situ
Film closes specifically, piezoelectric layer 213 is to carry out polarization in situ on the non-conductive substrate 25 with electrode block 2153 to obtain
It is consistent in polarized content in situ and first embodiment, therefore details are not described herein.
It please refers to Fig.3, it will be understood that the size of the non-conductive substrate 25 is greater than ultrasonic fingerprint identification module 21
Size is provided with multiple pins 251 in fringe region of the non-conductive substrate 25 close to the surface of ultrasonic fingerprint identification module 21,
Multiple electrodes block 2153 corresponds with multiple pins 251 be electrically connected respectively, and the circuit board 27 electrically connects with pin 251
It connects.The electric connection of electrode block 2153 and circuit board 27 is realized by the way that pin 251 is arranged, and can both reduce difficulty of processing, no
With by electrode block 2153 one by one individually with circuit board be electrically connected, and pin 251 can make it is block-like, in circuit board
27 connect more firm, reliability higher with pin 251, and simple for process.
Referring again to Fig. 3, it will be understood that the ultrasonic wave identification module 20a further comprises signal processing layer 28, described
The position of signal processing layer 28 is corresponding with the non-fingerprint identification area 263 of display module 26, i.e., signal processing layer 28 is in display mould
Projection and projection of the ultrasonic fingerprint identification module 21 in display module 26 in group 26 be not be overlapped, and signal processing layer 28 and
Circuit board 27 is electrically connected.Such structure setting can reduce the thickness of ultrasonic wave identification module 20a, be allowed to more meet electronics
The lightening trend of equipment.It is appreciated that the signal processing layer 28 includes an independent signal processing chip or multiple letters
The setting of number processing chip interval, the signal processing chip is for being collected and analyzing to electric signal.
It is appreciated that the ultrasonic wave identification module 20a further comprises booster circuit layer 23, the booster circuit layer 23
Position it is corresponding with the position of non-fingerprint identification area 263 of display module 26, i.e., the booster circuit layer 23 is in display module
Projection and projection of the ultrasonic fingerprint identification module 21 in display module 26 on 26 be not be overlapped, and the booster circuit layer 23
It is electrically connected with circuit board 27, the booster circuit layer 23 is transferred to the voltage of upper electrode layer 211 for boost circuit plate 27.
It is appreciated that the ultrasonic fingerprint identification module 20a further comprises that connector 29, the connector 29 are arranged
It is electrically connected on circuit board 27 and with circuit board 27, the connector 29 is used to be electrically connected with external circuit, the connection
The position of device 29 is corresponding with the non-fingerprint identification area 263 of display module 26.It is appreciated that the connector 29 is preferably FPC
Connector keeps the electric connection of circuit board and external circuit more firm.
The fingerprint identification process of the present embodiment is consistent with first embodiment principle, therefore details are not described herein.
The second embodiment of the utility model also provides a kind of electronic equipment, and ultrasonic fingerprint as described above is used to know
Other module.The electronic equipment includes but not limited to the equipment of the brush fingers line such as mobile phone, computer, tablet computer, attendance recorder.
Compared with prior art, the ultrasonic fingerprint identification module of the utility model comprising upper electrode layer, piezoelectric layer and
Lower electrode layer, upper electrode layer and lower electrode layer are separately positioned on two opposite surfaces of piezoelectric layer, and the lower electrode layer includes
The lower electrode block of signal processing layer, passivation layer and array arrangement on surface of the signal processing layer close to piezoelectric layer, it is described blunt
Change layer is arranged on the surface in lower electrode block close to piezoelectric layer and electrode block covers by under.The ultrasonic fingerprint of the utility model is known
Other module not only has simple in structure, the high advantage of reliability, and it is the formation fingerprint recognition mould directly in processing chip
Block keeps the size of ultrasonic fingerprint identification module entirety smaller, is more in line with the trend that electronic equipment is lightening, integrated level is high.
In addition, the piezoelectric layer of the utility model is polarized ferroelectric polymer film in situ, has piezoelectric effect
Well, the advantages of high resolution.
Compared with prior art, the ultrasonic fingerprint of the utility model identifies module comprising ultrasonic wave as described above
Fingerprint identification module, electrically-conductive backing plate and circuit board, the electrically-conductive backing plate between circuit board and ultrasonic fingerprint identification module,
The ultrasonic fingerprint identification module is electrically connected with electrically-conductive backing plate, and described circuit board one end is electrically connected with electrically-conductive backing plate, separately
One end is additionally operable to be electrically connected with external circuit, and the upper electrode layer and lower electrode layer are electrically connected with electrically-conductive backing plate respectively.This
The ultrasonic fingerprint identification module of utility model not only has simple in structure, the high advantage of reliability, and it is directly to locate
Fingerprint identification module is formed on reason chip, keeps the size of ultrasonic fingerprint identification module entirety smaller, is more in line with electronic equipment
Trend lightening, integrated level is high.
Compared with prior art, the ultrasonic fingerprint recognition means of the utility model include display module and as described above
Ultrasonic fingerprint identifies module, and one of described display module surface is the touch surface operated for user, with touch
The ultrasonic fingerprint identification module is set on another opposite face of face.The ultrasonic fingerprint recognition means of the utility model are not
Only there is simple in structure, the high advantage of reliability, and it is that fingerprint identification module is directly formed in processing chip, is more accorded with
Close the trend that electronic equipment is lightening, integrated level is high.
Compared with prior art, the electronic equipment of the utility model comprising ultrasonic fingerprint as described above identifies mould
Block.The electronic equipment of the utility model has integrated level high, and reliability is high, more frivolous advantage.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
Any modification made by within the principle of utility model, equivalent replacement and improvement etc. should all include the scope of protection of the utility model
Within.
Claims (10)
1. a kind of ultrasonic fingerprint identification module, it is characterised in that：The ultrasonic fingerprint identification module includes upper electrode layer, pressure
Electric layer and lower electrode layer, upper electrode layer and lower electrode layer are separately positioned on two opposite surfaces of piezoelectric layer, the lower electrode
Layer includes the lower electrode block of signal processing layer, passivation layer and array arrangement on surface of the signal processing layer close to piezoelectric layer,
The passivation layer is arranged on the surface in lower electrode block close to piezoelectric layer and electrode block covers by under.
2. ultrasonic fingerprint identification module as described in claim 1, it is characterised in that：The piezoelectric layer is polarized iron in situ
Electric polymer film.
3. ultrasonic fingerprint identification module as described in claim 1, it is characterised in that：The ultrasonic fingerprint identification module into
One step includes protective layer, and the protective layer is arranged on surface of the upper electrode layer far from piezoelectric layer and by upper electrode layer part or entirely
Portion covers.
4. a kind of ultrasonic fingerprint identifies module, it is characterised in that：The ultrasonic fingerprint identification module includes such as claim
1-3 any one of them ultrasonic fingerprints identification module, electrically-conductive backing plate and circuit board, the electrically-conductive backing plate be located at circuit board and
Between ultrasonic fingerprint identification module, the ultrasonic fingerprint identification module is electrically connected with electrically-conductive backing plate, the circuit board one
End is electrically connected with electrically-conductive backing plate, and the other end is additionally operable to be electrically connected with external circuit, the upper electrode layer and lower electrode layer point
It is not electrically connected with electrically-conductive backing plate.
5. ultrasonic fingerprint as claimed in claim 4 identifies module, it is characterised in that：The electrically-conductive backing plate is silicon-based wafer.
6. ultrasonic fingerprint as claimed in claim 4 identifies module, it is characterised in that：The ultrasonic fingerprint identify module into
One step includes discrete device, the discrete device be arranged in circuit board on the surface of ultrasonic fingerprint identification module and with electricity
Road plate is electrically connected.
7. ultrasonic fingerprint as claimed in claim 4 identifies module, it is characterised in that：The ultrasonic fingerprint identify module into
One step includes connector, and on circuit boards, the connector is used to be electrically connected with external circuit for the connector setting.
8. a kind of ultrasonic fingerprint recognition means, it is characterised in that：The ultrasonic fingerprint recognition means include display module and
Ultrasonic fingerprint as claimed in claim 4 identifies that module, one of described display module surface are to be grasped for user
The ultrasonic fingerprint identification module is arranged on another face opposite with touch surface for the touch surface of work.
9. ultrasonic fingerprint recognition means as claimed in claim 8, it is characterised in that：The ultrasonic fingerprint recognition means into
One step includes adhesive-layer, and the adhesive-layer setting is identified in ultrasonic fingerprint between module and display module.
10. a kind of electronic equipment, it is characterised in that：Module is identified including ultrasonic fingerprint as claimed in claim 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721303891.3U CN207718390U (en) | 2017-10-10 | 2017-10-10 | Ultrasonic fingerprint identification module, module, device and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721303891.3U CN207718390U (en) | 2017-10-10 | 2017-10-10 | Ultrasonic fingerprint identification module, module, device and electronic equipment |
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| Publication Number | Publication Date |
|---|---|
| CN207718390U true CN207718390U (en) | 2018-08-10 |
Family
ID=63064465
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721303891.3U Active CN207718390U (en) | 2017-10-10 | 2017-10-10 | Ultrasonic fingerprint identification module, module, device and electronic equipment |
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| CN (1) | CN207718390U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110213416A (en) * | 2019-06-24 | 2019-09-06 | Oppo广东移动通信有限公司 | Ultrasonic sensor mould group, display screen module and electronic equipment |
| WO2023051231A1 (en) * | 2021-09-30 | 2023-04-06 | 深圳市汇顶科技股份有限公司 | Ultrasonic fingerprint apparatus and electronic device |
-
2017
- 2017-10-10 CN CN201721303891.3U patent/CN207718390U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110213416A (en) * | 2019-06-24 | 2019-09-06 | Oppo广东移动通信有限公司 | Ultrasonic sensor mould group, display screen module and electronic equipment |
| WO2020259302A1 (en) * | 2019-06-24 | 2020-12-30 | Oppo广东移动通信有限公司 | Ultrasonic sensor module, display screen module and electronic device |
| WO2023051231A1 (en) * | 2021-09-30 | 2023-04-06 | 深圳市汇顶科技股份有限公司 | Ultrasonic fingerprint apparatus and electronic device |
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