CN109858313A - Ultrasonic fingerprint identifies mould group, device and electronic equipment - Google Patents
Ultrasonic fingerprint identifies mould group, device and electronic equipment Download PDFInfo
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- CN109858313A CN109858313A CN201711245550.XA CN201711245550A CN109858313A CN 109858313 A CN109858313 A CN 109858313A CN 201711245550 A CN201711245550 A CN 201711245550A CN 109858313 A CN109858313 A CN 109858313A
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Abstract
The present invention relates to fingerprint identification technology field more particularly to a kind of ultrasonic fingerprint identification mould groups, device and electronic equipment.The ultrasonic fingerprint identification mould group includes fingerprint touch-control identification module, and the fingerprint touch-control identification module includes touch-control cog region and fingerprint touch-control cog region, and the accuracy of identification of the fingerprint touch-control cog region is greater than the accuracy of identification of touch-control cog region.Ultrasonic fingerprint identification mould group, device and electronic equipment of the invention has the advantages that structure is simple.
Description
[technical field]
The present invention relates to fingerprint identification technology field more particularly to a kind of ultrasonic fingerprint identification mould groups, device and electronics
Equipment.
[background technique]
Currently, fingerprint identification technology such as has been widely used in mobile terminal, smart home, has fought crime at the multiple fields.
Many convenience and safety are brought to people's lives.The fingerprint identification technology of present mainstream has light fingerprint recognition, condenser type
Fingerprint recognition and ultrasonic fingerprint identification, but they also have the shortcomings that respective, such as light fingerprint recognition and capacitance type fingerprint know
There is not a greasy dirt in finger, dust when the substances such as water, is easy for that fingerprint image can not be parsed；And ultrasonic fingerprint identification is for answering
It is less high with the requirement of environment, therefore ultrasonic fingerprint identification is used widely in certain fields.
But the structure of existing ultrasonic fingerprint identification mould group is all sufficiently complex.
[summary of the invention]
In view of the above-mentioned problems, the present invention provides a kind of ultrasonic fingerprint identification mould group, device and electronic equipment.
The scheme that the present invention solves technical problem is to provide a kind of ultrasonic fingerprint identification mould group, is used to be arranged far from
The side of display module display surface, the ultrasonic fingerprint identification mould group includes fingerprint touch-control identification module, the fingerprint touch-control
Identification module includes touch-control cog region and fingerprint touch-control cog region, and the accuracy of identification of the fingerprint touch-control cog region is known greater than touch-control
The accuracy of identification in other area.
Preferably, the fingerprint touch-control identification module includes upper electrode layer, piezoelectric layer and the lower electrode layer of lamination setting, on
Electrode layer and lower electrode layer are separately positioned on two opposite surfaces of piezoelectric layer, and the fingerprint touch-control cog region is corresponding to be powered on
The accuracy of identification of pole layer is greater than the accuracy of identification and/or the fingerprint touch-control cog region of the corresponding upper electrode layer of touch-control cog region
The accuracy of identification of corresponding lower electrode layer is greater than the accuracy of identification of the corresponding lower electrode layer of touch-control cog region.
Preferably, the upper electrode layer and/or lower electrode layer include the conducting block of multiple array arrangements, the fingerprint touch-control
The area of the corresponding conducting block of cog region is less than the area of the corresponding conducting block of touch-control cog region.
Preferably, the corresponding conducting block area of the fingerprint touch-control cog region is 30um × 30um ~ 50um × 50um, institute
The spacing stated between the corresponding conducting block of fingerprint touch-control cog region is 5um ~ 10um, and the touch-control cog region is corresponding to lead
Electric block area is 3mm × 3mm ~ 5mm × 5mm, and the spacing between the corresponding conducting block of the touch-control cog region is 0.5mm
~ 2mm.
Preferably, the ultrasonic fingerprint identification mould group further includes non-conductive substrate, and the fingerprint touch-control identification module is folded
Non-conductive substrate is placed on the surface of display module, when the lower electrode layer includes the conducting block of multiple array arrangements, institute
It states conducting block and non-conductive substrate is set on the surface of display module, the conducting block primary technique on non-conductive substrate
Machine-shaping.
It preferably, further comprise circuit board and signal processing module, the circuit board is electrical with upper and lower electrode layer respectively
Connection, the signal processing module and circuit board are electrically connected.
Preferably, fringe region of the non-conductive substrate close to the surface of fingerprint touch-control identification module is provided with multiple draw
Foot, the lower electrode layer and pin are electrically connected, and the circuit board and pin are electrically connected.
Preferably, the piezoelectric layer is polarized ferroelectric polymer film in situ.
The present invention also provides a kind of ultrasonic fingerprint recognition means, the ultrasonic fingerprint recognition means include display module
Mould group is identified with above-mentioned ultrasonic fingerprint, and one of surface of the display module is the touch operated for user
The ultrasonic fingerprint identification mould group is arranged on another face opposite with touch surface for face.
The present invention also provides a kind of electronic equipment, including ultrasonic fingerprint as described above to identify mould group.
Compared with prior art, ultrasonic fingerprint of the invention identification mould group includes fingerprint touch-control identification module, the finger
Line touch-control identification module includes touch-control cog region and fingerprint touch-control cog region, and the accuracy of identification of the fingerprint touch-control cog region is greater than
The accuracy of identification of touch-control cog region, ultrasonic fingerprint identify that modular structure is simple, are not only able to achieve fingerprint recognition, but also be able to achieve touch-control
Identification, and ultrasonic fingerprint identification mould group cost is reduced, and improves the popularization and application of ultrasonic fingerprint identification mould group, and suitable
For touch screen, does not have to one special fingerprint identification device of side's setting under a touch screen, reduce and know using ultrasonic fingerprint
The volume of the product of other mould group.
Fingerprint touch-control identification module of the invention includes upper electrode layer, piezoelectric layer and the lower electrode layer of lamination setting, is powered on
Pole layer is separately positioned on opposite two surfaces of piezoelectric layer with lower electrode layer, the upper electrode layer of the fingerprint touch-control cog region
Accuracy of identification is greater than the accuracy of identification of the upper electrode layer of touch-control cog region and/or the lower electrode layer of the fingerprint touch-control cog region
Accuracy of identification be greater than touch-control cog region lower electrode layer accuracy of identification, fingerprint touch-control identification module is simple and reasonable for structure, system
It makes at low cost.
The conducting block area of fingerprint touch-control cog region of the invention is 30um × 30um ~ 50um × 50um, the fingerprint touching
Controlling the spacing between the conducting block of cog region is 5um ~ 10um, the conducting block area of the touch-control cog region be 3mm ×
3mm ~ 5mm × 5mm, the spacing between the conducting block of the touch-control cog region are 0.5mm ~ 2mm, both ensure that fingerprint was known
Other precision, the precision of guaranteed touch-control identification, reduces costs.
Ultrasonic fingerprint identification mould group of the invention further includes non-conductive substrate, and the fingerprint touch-control identification module overlays
Non-conductive substrate is described to lead when the lower electrode layer includes the conducting block of multiple array arrangements on the surface of display module
Non-conductive substrate is arranged on the surface of display module in electric block, the conducting block primary technique processing on non-conductive substrate
Molding, reduces processing times and process time, reduces costs.
In addition, the piezoelectric layer of the invention is polarized ferroelectric polymer film in situ, have piezoelectric effect it is good, point
The high advantage of resolution.
Compared with prior art, ultrasonic fingerprint recognition means of the invention include that display module and above-mentioned ultrasonic wave refer to
Line identifies mould group, and one of surface of the display module is the touch surface operated for user, opposite with touch surface
The ultrasonic fingerprint identification mould group is set on another face, and ultrasonic fingerprint recognition means are simple with structure, thickness is frivolous
The advantages of.
Compared with prior art, electronic equipment of the invention comprising ultrasonic fingerprint as described above identifies mould group.This
The electronic equipment of invention is simple with structure, integrated level is high, high reliablity, more frivolous advantage.
[Detailed description of the invention]
Fig. 1 is the schematic diagram of laminated structure of ultrasonic fingerprint recognition means of the invention.
Fig. 2 is that the ultrasonic fingerprint identification mould group of ultrasonic fingerprint recognition means of the invention is shown by the structure of function division
It is intended to.
Fig. 3 is the structural schematic diagram of the ultrasonic fingerprint identification mould group of ultrasonic fingerprint recognition means of the invention.
Fig. 4 is the structural representation that the conducting block of ultrasonic fingerprint recognition means of the invention is arranged on non-conductive substrate
Figure.
[specific embodiment]
In order to make the purpose of the present invention, technical solution and advantage are more clearly understood, below in conjunction with attached drawing and embodiment,
The present invention will be described in further detail.It should be appreciated that described herein, specific examples are only used to explain the present invention, and
It is not used in the restriction present invention.
Referring to FIG. 1, the present invention provides a kind of ultrasonic fingerprint recognition means 10, the ultrasonic fingerprint recognition means 10
It is including ultrasonic fingerprint identification mould group 10a, display module 16 and adhesive-layer 14, one of surface of the display module 16
For the touch surface 165 that user is operated, touch surface 165 is also display surface, is arranged on another face opposite with touch surface 165
There is adhesive-layer 14, adhesive-layer 14 enhances ultrasonic fingerprint identification mould group 10a with ultrasonic fingerprint identification mould group 10a bonding and shows
Show the bonding strength of mould group 16.It includes the bases such as display layer, cover-plate glass that it is more existing, which to can be market, for the display module 16
The display module of this structure, but preferably comprise the display of OLED (Organic Light Emitting Diode) or TFT (thin film transistor (TFT)) etc.
Mould group.It is appreciated that the adhesive-layer 14 can be omitted, the display module 16 is close to ultrasonic fingerprint identification mould group 10a's
Surface is directly connect with ultrasonic fingerprint identification mould group 10a per se with viscosity, the display module 16.It (is mentioned in the present invention
And the nouns of locality equal up and down be only limitted to the relative position in given view, rather than absolute position, for example, it is to be understood that referring to
Determine view planar carry out 180 ° rotation after, position word "lower" can replace with position word "upper".)
The ultrasonic fingerprint identification mould group 10a includes fingerprint touch-control identification module 11, non-conductive substrate 15 and circuit board
17, the fingerprint touch-control identification module 11 overlays non-conductive substrate 15 on the surface of display module 16, and fingerprint touch-control is known
Other module 11 is connect by adhesive-layer 14 with display module 16, and fingerprint touch-control identification module 11 and circuit board 17 are electrically connected, electricity
Road plate 17 is also used to be electrically connected with external circuit, and circuit board 17 is also partially fixed on non-conductive substrate 15.It is appreciated that institute
State circuit board 17 can be printed circuit board, flexible circuit board (Flexible Printed Circuit, abbreviation FPC) or its
He has the circuit board of conductive structure, and preferably circuit board 17 is flexible circuit board in the present invention.Described in it is further appreciated that not
Electrically-conductive backing plate 15 is preferably glass.
Referring to Fig. 2, the fingerprint touch-control identification module 11 includes fingerprint touch-control cog region 112 and touch-control cog region 114,
The fingerprint touch-control cog region 112 and touch-control cog region 114 are the structures distinguished according to function.In fingerprint touch-control cog region
Touch-control identification and fingerprint recognition can be carried out in 112, can carry out touch-control identification in touch-control cog region 114.Such as in full frame touching
The partial region of the display module of control defines fingerprint touch-control cog region 112, only can just carry out fingerprint simultaneously in the area
Identification and touch-control identify, can only carry out touch-control identification in other regions.Wherein, the accuracy of identification of fingerprint touch-control cog region 112 is big
In the accuracy of identification of touch-control cog region.
It please refers to Fig. 3 fingerprint touch-control identification module 11 to divide by structure, fingerprint touch-control identification module 11 is arranged including lamination
Upper electrode layer 111, piezoelectric layer 113 and lower electrode layer 115, upper electrode layer 111 and lower electrode layer 115 are separately positioned on piezoelectric layer
On 113 two opposite surfaces, wherein upper electrode layer 111 close to display module 16 be arranged, the circuit board 17 respectively with power on
Pole layer 111 and lower electrode layer 115 are electrically connected.Wherein, the identification essence of the corresponding upper electrode layer 111 of fingerprint touch-control cog region 112
Under degree is corresponding greater than the accuracy of identification of the corresponding upper electrode layer 111 of touch-control cog region 114 and/or fingerprint touch-control cog region 112
The accuracy of identification of electrode layer 115 is greater than the accuracy of identification of the corresponding lower electrode layer 115 of touch-control cog region 114.
Referring to Fig. 4, lower electrode layer 115 includes multiple conducting blocks 1151 in array distribution, the conducting block 1151 is
Non-conductive substrate 15 is set on the surface of display module 16.Preferably, conducting block 1151 is on non-conductive substrate 15
It is one-time process machine-shaping, to reduce processing times and process time, reduces costs.The multiple conducting block 1151
For carrying out the induction of ultrasonic signal.The accuracy of identification of the corresponding conducting block 1151 of fingerprint touch-control cog region 112 is greater than touch-control
The area of the accuracy of identification of the corresponding conducting block of cog region 114, the i.e. corresponding conducting block 1151 of fingerprint touch-control cog region 112 is less than
The area of the corresponding conducting block 1151 of touch-control cog region 114.The area of the corresponding conducting block 1151 of fingerprint touch-control cog region 112 is
25um × 25um ~ 70um × 70um, preferably 30um × 30um ~ 50um × 50um；Fingerprint touch-control cog region 112 is corresponding to lead
Gap between electric block 1151 is 4um ~ 12um, preferably 5um ~ 10um；1151 area of conducting block of touch-control cog region 114 is
2mm × 2mm ~ 6mm × 6mm, preferably 3mm × 3mm ~ 5mm × 5mm；Between the corresponding conducting block 1151 of touch-control cog region 114
Gap be 0.3mm ~ 2.3mm, preferably 0.5mm ~ 2mm.The area of conducting block 1151 is smaller, fingerprint touch-control identification module 11
Accuracy of identification is higher, and the gap between conducting block 1151 is smaller, and fingerprint touch-control 11 accuracy of identification of identification module are higher.Due to finger
The width in a paddy ridge period be usually 300um, the size by the way that conducting block 1151 is arranged advantageously ensures that the fingerprint of identification
Clarity, so that it is guaranteed that the precision of fingerprint recognition.
Upper electrode layer 111 is a unitary conductive layer.It is appreciated that upper electrode layer 111 is also possible to by the way that multiple battle arrays are arranged
The conducting block 1151 for arranging arrangement is realized with circuit board 17 to be electrically connected.The size of the conducting block 1151 of upper electrode layer 111, position
, position consistent with the size of conducting block 1151 of lower electrode layer 115 corresponds.When upper electrode layer 111 is arranged including multiple arrays
When the conducting block 1151 of cloth, the lower electrode layer 115 can be a flood electrode.Both upper electrode layer 111 and lower electrode layer 115
At least one for multiple array arrangements conducting block 1151 with realize touch-control identification and/or touch-control identification.
Piezoelectric layer 113 is piezoelectric film, it is preferred that piezoelectric layer 113 is ferroelectric polymer film, in a specific embodiment
In, the ferroelectric polymer film is by purchasing existing ferroelectric polymer film finished product, then again by being adhered to substrate
On obtained to be polarized.In general, the ferroelectric polymer film of this finished product needs first to be drawn high with certain stress then
It is polarized again by being bonded in substrate again, the ferroelectric polymer film thickness that such method is formed is at 30 μm or more, no
The frivolous development trend of existing electronic device is adapted to, and using the fingerprint touch-control identification module of this polarized film, due to piezoelectricity
It is too thick to sense film, therefore resolution ratio is lower.Ferroelectric polymer film polarization method in above embodiment is mostly directly to exist
High voltage electric field is set between the upper and lower surface of ferroelectric polymer film to carry out, but because ferroelectric polymer film thickness itself
Unevenness, it is possible that being easy to be punctured by high-voltage electricity place, the production qualification rate of piezoelectric film 113 is very low, is unfavorable for extensive
Production, and the piezoelectric effect of piezoelectric film obtained 113 is poor, and service life is shorter.
In another specific embodiment, piezoelectric layer 113 of the invention is preferably the ferroelectric polymer that polarization in situ is formed
Object film, the specially described piezoelectric layer 113 are that piezoelectric film 113, the piezoelectric film are formed in situ on one side in lower electrode layer 115
113 include opposite first surface and second surface, and the first surface is the one side close to lower electrode layer 115, and described the
Two surfaces are close to the surface of upper electrode layer 111.When polarization, make the first surface potential zero of the piezoelectric film 113；Described
Side where the second surface of piezoelectric film 113 provides the first electric field and the second electric field, and the potential of the first electric field is higher than the second electric field
Potential；The environmental gas of the side where 113 second surface of piezoelectric film, the environment gas are ionized under the action of the first electric field
Body is gathered in the second surface of piezoelectric film 113 across the second electric field, makes to be formed in the piezoelectric film 113 along film thickness direction
Film internal electric field, to the piezoelectric film 113 carry out polarization form the piezoelectric layer 113.It is appreciated that the ferroelectric polymers is thin
For film by chemical vapor deposition, the wet chemical methods such as coating, dip-coating are formed in 115 surface of lower electrode layer, therefore can form thickness
Spend very thin and uniform ferroelectric polymer film, thickness can be less than 30um, it is preferred that thickness can maintain 9um hereinafter, from
And reducing the transmission loss of signal, formation process is simple, moreover, the fingerprint touch-control using this polarized film being formed in situ identifies
Module 11, resolution ratio greatly improves.The thickness of the piezoelectric layer 113 may further be less than 9um, still further, its thickness
It can be that 1.5-7.4um, 1.9-7.2um, 2.2-8.6um, 2.8-8.4um or 3.6-6.6um further can be with
Specifically 1.8um, 2.4um, 2.6um, 3.7um, 3.9um, 4.2um, 4.6um, 5.6um, 5.8um, 6.7um, 8.6um,
8.7um。
Furthermore compared to directly in the upper and lower surface setting polarization of electrode method of piezoelectric layer 113, above-mentioned virtual polarization side
Method will not make piezoelectric layer 113 directly bear applied high voltage electric field, be avoided that piezoelectric layer 113 is breakdown.Specifically, above-mentioned pole
Gas ions polarization (for details, reference can be made to application No. is 201710108374.9 Chinese patent applications) or X-ray polarization can be used in change
The mode of (for details, reference can be made to application No. is 201611222575.3 Chinese patent applications) forms the piezoelectric layer, is formed by
Piezoelectric layer 113 can accomplish it is very thin, moreover, piezoelectric layer 113 of the invention piezoelectric effect preferably and long service life, can
It is useful in fingerprint touch-control identification module 11 well, is conducive to realize the preferable recognition effect of fingerprint touch-control identification module 11.?
In this specific embodiment, the range for having carried out the piezoelectric constant d33 of the polarized piezoelectric layer 113 in situ is 20-35pC/
N, further preferably 25 ~ 29pC/N.
It is appreciated that the material of the piezoelectric layer 113 is ferroelectric polymer material, it is specific to can be selected but be not limited to: poly- inclined
Vinyl fluoride, polyvinyl chloride, poly-γ-methyl-L-glutamate, polycarbonate, Kynoar, polyvinylidene fluoride
PVDF, polyvinylidene fluoride trifluoro-ethylene PVDF-TrFE, polymetylmethacrylate, polytetrafluoroethylene (PTFE) TEFLON etc. are altogether
One of polymers or several combinations.
In some embodiments of the invention, the copolymer of the material selection Kynoar of the piezoelectric layer 113 is poly-
Vinylidene-trifluoro-ethylene copolymer is specifically polyvinylidene fluoride trifluoro-ethylene PVDF-TrFE, in order to obtain piezoelectricity
The range of the mass ratio of the preferable piezoelectric layer of effect, the polyvinylidene fluoride and trifluoro-ethylene is (60-95): (5-30),
Preferably, the range of mass ratio is (75-86): (15-25), it is further preferred that its mass ratio is 80:20 or 75:25
Or 70:30, the polyvinylidene fluoride and trifluoro-ethylene copolymer more individually select polyvinylidene fluoride that can reduce cost, and its
Also there is preferable piezoelectric effect.
Existing α phase crystal grain also has β phase crystal grain and non-in resulting piezoelectric film 113 after ferroelectric polymer film polarization
The content of amorphous material, β phase is corresponding with the piezoelectric effect of piezoelectric film 113, when the content of the total crystal grain of β phase crystal grain Zhan is 60-
When 70%, polarized film has preferable piezoelectric effect, and the piezoelectric effect of the content of β phase more high polarization film is better.However excessively
Polarization can generate extra unnecessary charge etc., these excess charges are easy to tie again with other charges on polymer surfaces
It closes, to influence the performance of gained piezoelectric film.In the present embodiment, the β phase crystal grain of the ferroelectric polymers piezoelectric film 113 and total
Crystal grain mass ratio is 60 ~ 70%.
Please continue to refer to Fig. 1, it will be understood that the size of the non-conductive substrate 15 is greater than fingerprint touch-control identification module 11
Size, fringe region of the non-conductive substrate 15 close to the surface of fingerprint touch-control identification module 11 is provided with multiple pins 151,
Multiple conducting blocks 1151 correspond with multiple pins 151 be electrically connected respectively, and the circuit board 17 electrically connects with pin 151
It connects.The electric connection that conducting block 1151 Yu circuit board 17 are realized by setting pin 151, can both reduce difficulty of processing, no
With by conducting block 1151 one by one individually with circuit board be electrically connected, and pin 151 can be made it is block-like, in circuit board
17 connect more firm with pin 151, and reliability is higher, and simple process.
Ultrasonic fingerprint identifies that mould group 10a further comprises signal processing module 18, signal processing module 18 and circuit board
17 are electrically connected.It is appreciated that the signal processing module 18 includes at an independent signal processing chip or multiple signals
Chip chamber is managed every setting, the signal processing chip is for being collected and analyzing to electric signal.
Ultrasonic fingerprint identifies that mould group 10a further comprises booster circuit layer 13, the booster circuit layer 13 and circuit board
17 are electrically connected, and booster circuit layer 13 is transferred to the voltage of upper electrode layer 111 for boost circuit plate 17.It is appreciated that boosting
Circuit 13 can be not provided with.
Ultrasonic fingerprint identifies that mould group 10a further comprises connector 19, and the connector 19 is arranged on circuit board 17
And be electrically connected with circuit board 17, the connector 19 is used to be electrically connected with external circuit.It is appreciated that the connector 19
Preferably FPC connector keeps the electric connection of circuit board and external circuit more firm.
A duty cycle of the ultrasonic fingerprint identification mould group 10a of the embodiment of the present invention includes launching phase and reception rank
Section two parts.Launching phase, external circuit pass sequentially through circuit board 17 while giving first electrode layer 111 and second electrode respectively
115 voltage signal of layer make the voltage signal for giving first electrode layer 111 be higher than the voltage signal for giving the second electrode lay 115, pressure
The two sides of electric layer 113 form a potential difference, and then generate mechanical oscillation and issue ultrasonic wave；Reception stage, piezoelectric layer 113 issue
Ultrasonic wave touch finger back reflection, due at fingerprint valley compared at fingerprint ridge there are more air, finger
Fingerprint valley is different with the signal strength reflected at fingerprint ridge, and the energy for the ultrasonic wave that usual fingerprint valley is reflected can be than fingerprint ridge institute
The ultrasonic energy of reflection is big, i.e., the signal strength that fingerprint valley is reflected is better than the signal strength that fingerprint ridge is reflected, piezoelectricity
Layer 113 receives the reflected different ultrasonic signals of fingerprint valley and fingerprint ridge institute to generate different electric signals.Pass through
The size of conducting block 1151 is set, a paddy ridge period of finger is made to correspond to multiple conducting blocks 1151.Therefore, it corresponds respectively to
The conducting block 1151 of fingerprint valley and the fingerprint touch-control cog region 112 of fingerprint ridge generates different number due to the effect of electrostatic coupling
Charge inducing, control module 12 realize fingerprint recognition by the difference of the quantity of detection charge inducing, finally will test result
External circuit is passed to by circuit board 13.
It is appreciated that detection piezoelectric layer 113 receives the reflected ultrasonic signal of display module 16 for convenience, need
Regular hour difference is set to avoid the ultrasonic signal propagated to display module 16 and the reflected ultrasound of display module 16
Wave signal mixing, so that it is guaranteed that the precision of detection.For example, circuit board 17 is mentioned according to regular hour rule to piezoelectric layer 113
For potential difference to issue ultrasonic signal.
The fingerprint touch-control cog region 112 and touch-control cog region 114 of ultrasonic fingerprint identification mould group 10a can be carried out touch-control
Identification.The signal processing module 18 is integrated with the function of touch chip, does not touch in the touch surface 165 of display module 16
In the case where, the ultrasonic signal that piezoelectric layer 113 is issued can be shown the surface reflection of mould group 16, and piezoelectric layer 113 can be examined
It measures reflected ultrasonic signal and generates electric signal, and the conducting block of the second piezoelectric layer 115 is due to the work of electrostatic coupling
With a certain number of charge inducings can be generated；When the surface of display module 16 is there is a situation where touching, due to touch objects (such as
The finger of user) contact between the surface of display module 16 can make portion of ultrasonic sound wave signal through display module 16 enter
In the touch objects, therefore the reflected ultrasonic signal of display module 16 of touch location that piezoelectric layer 113 receives can be sent out
Changing, so that the electric signal that piezoelectric layer 113 generates at touch location can change, thus the conducting block of corresponding position
The reflected ultrasonic wave of display module 16 at the position that the quantity of the charge inducing of generation can also change, and not touched
Signal does not change, thus do not changed by the quantity for the charge inducing that conducting block corresponding at touch location generates,
Therefore, whether sent out at touch location with not by the quantity of the charge inducing at touch location by the detection of signal processing module 18
Changing judges touch location, i.e. realization ultrasonic wave touch-control.
The present invention also provides a kind of electronic equipment, use ultrasonic fingerprint identification mould group as described above.The electronics
Equipment includes but is not limited to the equipment of the brush fingers line such as mobile phone, computer, tablet computer, attendance recorder.
Compared with prior art, ultrasonic fingerprint of the invention identification mould group includes fingerprint touch-control identification module, the finger
Line touch-control identification module includes touch-control cog region and fingerprint touch-control cog region, and the accuracy of identification of the fingerprint touch-control cog region is greater than
The accuracy of identification of touch-control cog region, ultrasonic fingerprint identify that modular structure is simple, are not only able to achieve fingerprint recognition, but also be able to achieve touch-control
Identification, and ultrasonic fingerprint identification mould group cost is reduced, and improves the popularization and application of ultrasonic fingerprint identification mould group, and suitable
For touch screen, does not have to one special fingerprint identification device of side's setting under a touch screen, reduce and know using ultrasonic fingerprint
The volume of the product of other mould group.
Fingerprint touch-control identification module of the invention includes upper electrode layer, piezoelectric layer and the lower electrode layer of lamination setting, is powered on
Pole layer is separately positioned on opposite two surfaces of piezoelectric layer with lower electrode layer, the upper electrode layer of the fingerprint touch-control cog region
Accuracy of identification is greater than the accuracy of identification of the upper electrode layer of touch-control cog region and/or the lower electrode layer of the fingerprint touch-control cog region
Accuracy of identification be greater than touch-control cog region lower electrode layer accuracy of identification, fingerprint touch-control identification module is simple and reasonable for structure, system
It makes at low cost.
The conducting block area of fingerprint touch-control cog region of the invention is 30um × 30um ~ 50um × 50um, the fingerprint touching
Controlling the spacing between the conducting block of cog region is 5um ~ 10um, the conducting block area of the touch-control cog region be 3mm ×
3mm ~ 5mm × 5mm, the spacing between the conducting block of the touch-control cog region are 0.5mm ~ 2mm, both ensure that fingerprint was known
Other precision, the precision of guaranteed touch-control identification, reduces costs.
Ultrasonic fingerprint identification mould group of the invention further includes non-conductive substrate, and the fingerprint touch-control identification module overlays
Non-conductive substrate is described to lead when the lower electrode layer includes the conducting block of multiple array arrangements on the surface of display module
Non-conductive substrate is arranged on the surface of display module in electric block, the conducting block primary technique processing on non-conductive substrate
Molding, reduces processing times and process time, reduces costs.
In addition, the piezoelectric layer of the invention is polarized ferroelectric polymer film in situ, have piezoelectric effect it is good, point
The high advantage of resolution.
Compared with prior art, ultrasonic fingerprint recognition means of the invention include that display module and above-mentioned ultrasonic wave refer to
Line identifies mould group, and one of surface of the display module is the touch surface operated for user, opposite with touch surface
The ultrasonic fingerprint identification mould group is set on another face, and ultrasonic fingerprint recognition means are simple with structure, thickness is frivolous
The advantages of.
Compared with prior art, electronic equipment of the invention comprising ultrasonic fingerprint as described above identifies mould group.This
The electronic equipment of invention is simple with structure, integrated level is high, high reliablity, more frivolous advantage.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in original of the invention
Made any modification within then, equivalent replacement and improvement etc. should all be comprising within protection scope of the present invention.
Claims (10)
1. a kind of ultrasonic fingerprint identifies mould group, it is used to be arranged far from the side of display module display surface, it is characterised in that:
The ultrasonic fingerprint identification mould group includes fingerprint touch-control identification module, and the fingerprint touch-control identification module includes touch-control cog region
With fingerprint touch-control cog region, the accuracy of identification of the fingerprint touch-control cog region is greater than the accuracy of identification of touch-control cog region.
2. ultrasonic fingerprint as described in claim 1 identifies mould group, it is characterised in that: the fingerprint touch-control identification module includes
It is opposite that upper electrode layer, piezoelectric layer and the lower electrode layer of lamination setting, upper electrode layer and lower electrode layer are separately positioned on piezoelectric layer
On two surfaces, the accuracy of identification of the corresponding upper electrode layer of the fingerprint touch-control cog region is greater than that touch-control cog region is corresponding to be powered on
The accuracy of identification of pole layer and/or the accuracy of identification of the corresponding lower electrode layer of the fingerprint touch-control cog region are greater than touch-control cog region
The accuracy of identification of corresponding lower electrode layer.
3. ultrasonic fingerprint as claimed in claim 2 identifies mould group, it is characterised in that: the upper electrode layer and/or lower electrode
Layer includes the conducting block of multiple array arrangements, and the area of the corresponding conducting block of the fingerprint touch-control cog region is less than touch-control cog region
The area of corresponding conducting block.
4. ultrasonic fingerprint as claimed in claim 3 identifies mould group, it is characterised in that: the fingerprint touch-control cog region is corresponding
Conducting block area is 30um × 30um~50um × 50um, between the corresponding conducting block of the fingerprint touch-control cog region between
Away from for 5um~10um, the corresponding conducting block area of the touch-control cog region is 3mm × 3mm~5mm × 5mm, the touch-control identification
Spacing between the corresponding conducting block in area is 0.5mm~2mm.
5. ultrasonic fingerprint as claimed in claim 3 identifies mould group, it is characterised in that: the ultrasonic fingerprint identification mould group is also
Including non-conductive substrate, the fingerprint touch-control identification module overlays non-conductive substrate on the surface of display module, described
When lower electrode layer includes the conducting block of multiple array arrangements, non-conductive substrate is arranged in close to the table of display module in the conducting block
On face, the conducting block primary technique machine-shaping on non-conductive substrate.
6. ultrasonic fingerprint as claimed in claim 5 identifies mould group, it is characterised in that: further comprise at circuit board and signal
Module is managed, the circuit board is electrically connected with upper and lower electrode layer respectively, and the signal processing module and circuit board are electrically connected.
7. ultrasonic fingerprint as claimed in claim 6 identifies mould group, it is characterised in that: the non-conductive substrate is touched close to fingerprint
The fringe region for controlling the surface of identification module is provided with multiple pins, and the lower electrode layer and pin are electrically connected, the circuit
Plate and pin are electrically connected.
8. ultrasonic fingerprint as claimed in claim 2 identifies mould group, it is characterised in that: the piezoelectric layer is polarized iron in situ
Electric polymer film.
9. a kind of ultrasonic fingerprint recognition means, it is characterised in that: the ultrasonic fingerprint recognition means include display module and
Ultrasonic fingerprint as described in any one of claims 1 to 8 identifies mould group, one of surface of the display module be for
The ultrasonic fingerprint identification mould group is arranged on another face opposite with touch surface for the touch surface that family is operated.
10. a kind of electronic equipment, it is characterised in that: identify mould including ultrasonic fingerprint as described in any one of claims 1 to 8
Group.
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| CN201711245550.XA CN109858313B (en) | 2017-11-30 | 2017-11-30 | Ultrasonic fingerprint identification module, device and electronic equipment |
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| CN201711245550.XA CN109858313B (en) | 2017-11-30 | 2017-11-30 | Ultrasonic fingerprint identification module, device and electronic equipment |
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| CN113343800A (en) * | 2021-05-25 | 2021-09-03 | 电子科技大学 | Fingerprint touch identification module, fingerprint touch identification method and electronic equipment |
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| CN109858313B (en) | 2021-05-07 |
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