[ summary of the invention ]
In order to solve the problems, the invention provides an ultrasonic fingerprint identification module, a device and electronic equipment.
The technical scheme for solving the technical problem is to provide an ultrasonic fingerprint identification module, which is arranged on one side far away from the display surface of a display module, wherein the ultrasonic fingerprint identification module comprises a fingerprint touch identification module, the fingerprint touch identification module comprises a touch identification area and a fingerprint touch identification area, and the identification precision of the fingerprint touch identification area is higher than that of the touch identification area; the fingerprint touch identification module comprises an upper electrode layer, a piezoelectric layer and a lower electrode layer which are arranged in a laminated mode, the upper electrode layer and the lower electrode layer are arranged on two opposite surfaces of the piezoelectric layer respectively, the identification precision of the upper electrode layer corresponding to the fingerprint touch identification area is larger than that of the upper electrode layer corresponding to the touch identification area, and/or the identification precision of the lower electrode layer corresponding to the fingerprint touch identification area is larger than that of the lower electrode layer corresponding to the touch identification area.
Preferably, the upper electrode layer and/or the lower electrode layer includes a plurality of conductive blocks arranged in an array, and an area of the conductive block corresponding to the fingerprint touch identification area is smaller than an area of the conductive block corresponding to the touch identification area.
Preferably, the conducting block area that fingerprint touch-control discernment district corresponds is 30um ~ 50um, the conducting block area that fingerprint touch-control discernment district corresponds is 5um ~ 10um each other, the conducting block area that touch-control discernment district corresponds is 3mm ~ 5mm, the conducting block area that touch-control discernment district corresponds is 0.5mm ~ 2mm each other.
Preferably, the ultrasonic fingerprint identification module further comprises a non-conductive substrate, the fingerprint touch identification module is stacked on the surface of the non-conductive substrate close to the display module, when the lower electrode layer comprises a plurality of conductive blocks arranged in an array, the conductive blocks are arranged on the surface of the non-conductive substrate close to the display module, and the conductive blocks are formed on the non-conductive substrate through one-step processing.
Preferably, the display device further comprises a circuit board and a signal processing module, wherein the circuit board is electrically connected with the upper electrode layer and the lower electrode layer respectively, and the signal processing module is electrically connected with the circuit board.
Preferably, a plurality of pins are arranged in the edge area of the surface of the non-conductive substrate close to the fingerprint touch identification module, the lower electrode layer is electrically connected with the pins, and the circuit board is electrically connected with the pins.
Preferably, the piezoelectric layer is an in-situ polarized ferroelectric polymer film.
The invention further provides an ultrasonic fingerprint identification device, the ultrasonic fingerprint identification device comprises a display module and the ultrasonic fingerprint identification module, one surface of the display module is a touch surface for a user to operate, and the ultrasonic fingerprint identification module is arranged on the other surface opposite to the touch surface.
The invention also provides electronic equipment comprising the ultrasonic fingerprint identification module.
Compared with the prior art, the ultrasonic fingerprint identification module comprises the fingerprint touch identification module, the fingerprint touch identification module comprises the touch identification area and the fingerprint touch identification area, the identification precision of the fingerprint touch identification area is higher than that of the touch identification area, the ultrasonic fingerprint identification module is simple in structure, not only can realize fingerprint identification, but also can realize touch identification, the cost of the ultrasonic fingerprint identification module is reduced, the popularization and the application of the ultrasonic fingerprint identification module are improved, the ultrasonic fingerprint identification module is suitable for a touch screen, a special fingerprint identification device does not need to be arranged below the touch screen, and the size of a product using the ultrasonic fingerprint identification module is reduced.
The fingerprint touch identification module comprises an upper electrode layer, a piezoelectric layer and a lower electrode layer which are arranged in a laminated mode, wherein the upper electrode layer and the lower electrode layer are respectively arranged on two opposite surfaces of the piezoelectric layer, the identification precision of the upper electrode layer of the fingerprint touch identification area is larger than that of the upper electrode layer of the touch identification area, and/or the identification precision of the lower electrode layer of the fingerprint touch identification area is larger than that of the lower electrode layer of the touch identification area.
The area of the conductive blocks in the fingerprint touch identification area is 30-50 um multiplied by 30um, the distance between the conductive blocks in the fingerprint touch identification area is 5-10 um, the area of the conductive blocks in the touch identification area is 3-5 mm multiplied by 3mm, and the distance between the conductive blocks in the touch identification area is 0.5-2 mm, so that the fingerprint identification precision is ensured, the touch identification precision is ensured, and the cost is reduced.
The ultrasonic fingerprint identification module further comprises a non-conductive substrate, the fingerprint touch control identification module is stacked on the surface, close to the display module, of the non-conductive substrate, when the lower electrode layer comprises a plurality of conductive blocks which are arranged in an array mode, the conductive blocks are arranged on the surface, close to the display module, of the non-conductive substrate, and the conductive blocks are formed on the non-conductive substrate in a one-step processing mode, so that the processing times and the processing time are reduced, and the cost is reduced.
In addition, the piezoelectric layer is an in-situ polarized ferroelectric polymer film and has the advantages of good piezoelectric effect and high resolution.
Compared with the prior art, the ultrasonic fingerprint identification device comprises the display module and the ultrasonic fingerprint identification module, wherein one surface of the display module is a touch surface for a user to operate, and the other surface opposite to the touch surface is provided with the ultrasonic fingerprint identification module.
Compared with the prior art, the electronic equipment comprises the ultrasonic fingerprint identification module. The electronic equipment has the advantages of simple structure, high integration level, high reliability and light weight.
[ detailed description ] embodiments
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1, the present invention provides an ultrasonic fingerprint identification device 10, where the ultrasonic fingerprint identification device 10 includes an ultrasonic fingerprint identification module 10a, a display module 16 and an adhesive layer 14, one surface of the display module 16 is a touch surface 165 for a user to operate, the touch surface 165 is also a display surface, the other surface opposite to the touch surface 165 is provided with the adhesive layer 14, and the adhesive layer 14 is bonded to the ultrasonic fingerprint identification module 10a to enhance the connection strength between the ultrasonic fingerprint identification module 10a and the display module 16. The display module 16 may be some display modules existing in the market and including basic structures such as a display layer and a cover glass, but is preferably a display module including an OLED (organic light emitting diode) or a TFT (thin film transistor). It is understood that the adhesive layer 14 may be omitted, the surface of the display module 16 close to the ultrasonic fingerprint identification module 10a is sticky, and the display module 16 is directly connected to the ultrasonic fingerprint identification module 10 a. (the terms of orientation such as up, down, left, right, etc. as used herein are limited to relative positions on the designated view, rather than absolute positions, e.g., it is understood that the position term "down" may be replaced with the position term "up" after the designated view is rotated 180 degrees in the plane.)
Ultrasonic wave fingerprint identification module 10a includes fingerprint touch-control identification module 11, non-conductive base plate 15 and circuit board 17, fingerprint touch-control identification module 11 is stacked on non-conductive base plate 15 is close to display module 16 on the surface, and fingerprint touch-control identification module 11 passes through viscose layer 14 and is connected with display module 16, fingerprint touch-control identification module 11 and circuit board 17 electric connection, circuit board 17 still be used for with external circuit electric connection, circuit board 17 still partially fixes on non-conductive base plate 15. It is understood that the Circuit board 17 may be a Printed Circuit board, a Flexible Printed Circuit (FPC) or other Circuit board with a conductive structure, and in the present invention, the Circuit board 17 is preferably a Flexible Circuit board. It will also be appreciated that the non-conductive substrate 15 is preferably glass.
Referring to fig. 2, the fingerprint touch recognition module 11 includes a fingerprint touch recognition area 112 and a touch recognition area 114, and the fingerprint touch recognition area 112 and the touch recognition area 114 are structures that are distinguished according to functions. Touch recognition and fingerprint recognition can be performed in the fingerprint touch recognition area 112, and touch recognition can be performed in the touch recognition area 114. For example, a fingerprint touch recognition area 112 is defined in a partial area of the full-screen touch display module, and only in this area, fingerprint recognition and touch recognition can be performed simultaneously, and only in other areas, touch recognition can be performed. The recognition accuracy of the fingerprint touch recognition area 112 is greater than that of the touch recognition area.
Referring to fig. 3, the fingerprint touch recognition module 11 is divided into different structures, the fingerprint touch recognition module 11 includes an upper electrode layer 111, a piezoelectric layer 113, and a lower electrode layer 115, which are stacked, the upper electrode layer 111 and the lower electrode layer 115 are respectively disposed on two opposite surfaces of the piezoelectric layer 113, wherein the upper electrode layer 111 is disposed near the display module 16, and the circuit board 17 is respectively electrically connected to the upper electrode layer 111 and the lower electrode layer 115. The identification precision of the upper electrode layer 111 corresponding to the fingerprint touch identification area 112 is greater than that of the upper electrode layer 111 corresponding to the touch identification area 114, and/or the identification precision of the lower electrode layer 115 corresponding to the fingerprint touch identification area 112 is greater than that of the lower electrode layer 115 corresponding to the touch identification area 114.
Referring to fig. 4, the bottom electrode layer 115 includes a plurality of conductive blocks 1151 distributed in an array, and the conductive blocks 1151 are disposed on a surface of the non-conductive substrate 15 close to the display module 16. Preferably, the conductive block 1151 is formed on the non-conductive substrate 15 by a single process, so that the number of processes and the processing time are reduced, and the cost is reduced. The plurality of conductive pieces 1151 is used for induction of an ultrasonic signal. The identification precision of the conductive block 1151 corresponding to the fingerprint touch identification area 112 is greater than that of the conductive block corresponding to the touch identification area 114, that is, the area of the conductive block 1151 corresponding to the fingerprint touch identification area 112 is smaller than that of the conductive block 1151 corresponding to the touch identification area 114. The area of the conductive block 1151 corresponding to the fingerprint touch identification area 112 is 25um × 25um to 70um × 70um, preferably 30um × 30um to 50um × 50 um; gaps between the conductive blocks 1151 corresponding to the fingerprint touch identification area 112 are 4um to 12um, preferably 5um to 10 um; the area of the conductive block 1151 of the touch identification area 114 is 2mm × 2mm to 6mm × 6mm, preferably 3mm × 3mm to 5mm × 5 mm; the gap between the conductive blocks 1151 corresponding to the touch identification area 114 is 0.3mm to 2.3mm, and preferably 0.5mm to 2 mm. The smaller the area of the conductive blocks 1151, the higher the recognition accuracy of the fingerprint touch recognition module 11, and the smaller the gap between the conductive blocks 1151, the higher the recognition accuracy of the fingerprint touch recognition module 11. Since the width of one valley-ridge period of a finger is generally 300um, it is advantageous to ensure the definition of the recognized fingerprint by setting the size of the conductive block 1151, thereby ensuring the accuracy of fingerprint recognition.
The top electrode layer 111 is a bulk conductive layer. It is understood that the upper electrode layer 111 may also be electrically connected to the circuit board 17 by disposing a plurality of conductive blocks 1151 in an array. The conductive pieces 1151 of the upper electrode layer 111 have the same size and position as those of the conductive pieces 1151 of the lower electrode layer 115, and have one-to-one correspondence. When the upper electrode layer 111 includes a plurality of conductive blocks 1151 arranged in an array, the lower electrode layer 115 may be a whole layer electrode. At least one of the upper electrode layer 111 and the lower electrode layer 115 is a plurality of conductive blocks 1151 arranged in an array to realize touch recognition and/or touch recognition.
The piezoelectric layer 113 is a piezoelectric film, and preferably the piezoelectric layer 113 is a ferroelectric polymer film, which in one embodiment is obtained by purchasing an existing finished ferroelectric polymer film and then polarizing the ferroelectric polymer film by adhering the film to a substrate. Generally, the ferroelectric polymer film of the finished product needs to be pulled up to have certain stress and then is adhered on a substrate for polarization, the thickness of the ferroelectric polymer film formed by the method is more than 30 μm, which is not suitable for the development trend of lightness and thinness of the existing electronic devices, and the fingerprint touch identification module adopting the polarization film has lower resolution because the piezoelectric sensing film is too thick. The polarization method of the ferroelectric polymer thin film in the above embodiment is mostly performed by directly providing a high voltage electric field between the upper and lower surfaces of the ferroelectric polymer thin film, but the ferroelectric polymer thin film itself has a non-uniform thickness, so that it may be easily broken down by a high voltage electric field, the yield of the piezoelectric film 113 is very low, which is not suitable for mass production, and the piezoelectric effect of the obtained piezoelectric film 113 is poor and the service life is short.
In another specific embodiment, the piezoelectric layer 113 of the present invention is preferably a ferroelectric polymer thin film formed by in-situ polarization, and in particular, the piezoelectric layer 113 is formed in-situ on one surface of the lower electrode layer 115, the piezoelectric layer 113 includes a first surface and a second surface opposite to each other, the first surface is a surface close to the lower electrode layer 115, and the second surface is a surface close to the upper electrode layer 111. At the time of polarization, the first surface potential of the piezoelectric film 113 is made zero; providing a first electric field and a second electric field on the side of the second surface of the piezoelectric film 113, the first electric field having a higher potential than the second electric field; and ionizing the ambient gas on the side where the second surface of the piezoelectric film 113 is located under the action of the first electric field, wherein the ambient gas passes through the second electric field and is gathered on the second surface of the piezoelectric film 113, so that an in-film electric field along the thickness direction of the film is formed in the piezoelectric film 113, and the piezoelectric film 113 is polarized to form the piezoelectric layer 113. It can be understood that the ferroelectric polymer thin film is formed on the surface of the lower electrode layer 115 by wet chemical methods such as chemical vapor deposition, coating, dip coating, etc., so that a ferroelectric polymer thin film with a very thin and uniform thickness can be formed, the thickness can be less than 30um, preferably, the thickness can be maintained below 9um, thereby reducing the transmission loss of signals, the formation process is simple, and the resolution of the fingerprint touch identification module 11 using the in-situ formed polarization film is greatly improved. The thickness of the piezoelectric layer 113 can be further less than 9um, and still further, the thickness can be 1.5-7.4um, 1.9-7.2um, 2.2-8.6um, 2.8-8.4um or 3.6-6.6um, and further, can be specifically 1.8um, 2.4um, 2.6um, 3.7um, 3.9um, 4.2um, 4.6um, 5.6um, 5.8um, 6.7um, 8.6um, 8.7 um.
Furthermore, compared with the polarization method in which electrodes are directly disposed on the upper and lower surfaces of the piezoelectric layer 113, the above-mentioned virtual polarization method does not make the piezoelectric layer 113 directly bear the applied high voltage electric field, and can prevent the piezoelectric layer 113 from being broken down. Specifically, the polarization may be plasma polarization (see, for example, chinese patent application No. 201710108374.9) or X-ray polarization (see, for example, chinese patent application No. 201611222575.3) to form the piezoelectric layer, and the formed piezoelectric layer 113 may be very thin, and the piezoelectric layer 113 of the present invention has a good piezoelectric effect and a long service life, and can be well applied to the fingerprint touch recognition module 11, thereby facilitating the realization of a good recognition effect of the fingerprint touch recognition module 11. In this embodiment, the piezoelectric constant d33 of the piezoelectric layer 113 subjected to in-situ polarization is in the range of 20 to 35pC/N, and more preferably 25 to 29 pC/N.
It is understood that the material of the piezoelectric layer 113 is a ferroelectric polymer material, and may be selected from, but not limited to: polyvinylidene fluoride, polyvinyl chloride, poly-gamma-methyl-L-glutamate, polycarbonate, polyvinylidene fluoride PVDF, polyvinylidene fluoride trifluoroethylene PVDF-TrFE, polymethyl methacrylate PMMA, polytetrafluoroethylene TEFLON and other copolymers or a combination of a plurality of copolymers.
In some embodiments of the present invention, the polyvinylidene fluoride copolymer is polyvinylidene fluoride-trifluoroethylene copolymer, specifically polyvinylidene fluoride trifluoroethylene PVDF-TrFE, is selected as the material of the piezoelectric layer 113, and in order to obtain a piezoelectric layer with a better piezoelectric effect, the mass ratio of the polyvinylidene fluoride to the trifluoroethylene is (60-95): (5-30), preferably, the mass ratio thereof is in the range of (75-86): (15-25), further preferably, the mass ratio is 80: 20 or 75: 25 or 70: 30, compared with the polyvinylidene fluoride selected independently, the polyvinylidene fluoride and trifluoroethylene copolymer can reduce the cost and has better piezoelectric effect.
The piezoelectric film 113 obtained after the ferroelectric polymer film is polarized has alpha-phase crystal grains, beta-phase crystal grains and amorphous substances, the content of the beta-phase corresponds to the piezoelectric effect of the piezoelectric film 113, when the content of the beta-phase crystal grains in the total crystal grains is 60-70%, the polarized film has better piezoelectric effect, and the piezoelectric effect of the polarized film is better when the content of the beta-phase is higher. However, excessive polarization can create unwanted excess charges, etc., which can easily recombine with other charges on the polymer surface, thereby affecting the performance of the resulting piezoelectric film. In this embodiment, the mass ratio of the β -phase crystal grains to the total crystal grains of the ferroelectric polymer piezoelectric film 113 is 60 to 70%.
With reference to fig. 1, it can be understood that the size of the non-conductive substrate 15 is larger than that of the fingerprint touch recognition module 11, a plurality of pins 151 are disposed on an edge area of the non-conductive substrate 15 near the surface of the fingerprint touch recognition module 11, a plurality of conductive blocks 1151 are respectively electrically connected to the plurality of pins 151 in a one-to-one correspondence manner, and the circuit board 17 is electrically connected to the pins 151. The electric connection between the conductive blocks 1151 and the circuit board 17 is realized by arranging the pins 151, so that the processing difficulty can be reduced, the conductive blocks 1151 do not need to be separately and electrically connected with the circuit board one by one, the pins 151 can be made into blocks, the connection between the circuit board 17 and the pins 151 is more stable, the reliability is higher, and the process is simple.
The ultrasonic fingerprint recognition module 10a further includes a signal processing module 18, and the signal processing module 18 is electrically connected to the circuit board 17. It is understood that the signal processing module 18 includes a single signal processing chip or a plurality of signal processing chips spaced apart for collecting and analyzing electrical signals.
The ultrasonic fingerprint identification module 10a further includes a voltage boosting circuit layer 13, the voltage boosting circuit layer 13 is electrically connected to the circuit board 17, and the voltage boosting circuit layer 13 is used for boosting the voltage transmitted to the upper electrode layer 111 by the circuit board 17. It is understood that the booster circuit 13 may not be provided.
The ultrasonic fingerprint identification module 10a further includes a connector 19, the connector 19 is disposed on the circuit board 17 and electrically connected to the circuit board 17, and the connector 19 is used for electrically connecting to an external circuit. It will be appreciated that the connector 19 is preferably an FPC connector, making the electrical connection of the circuit board to the external circuit more robust.
One working cycle of the ultrasonic fingerprint identification module 10a of the embodiment of the present invention includes two parts, namely, a transmitting stage and a receiving stage. In the transmitting stage, the external circuit sequentially and respectively gives voltage signals to the first electrode layer 111 and the second electrode layer 115 through the circuit board 17, so that the voltage signal given to the first electrode layer 111 is higher than the voltage signal given to the second electrode layer 115, a potential difference is formed on two sides of the piezoelectric layer 113, and then mechanical vibration is generated and ultrasonic waves are emitted; in the receiving stage, the ultrasonic wave emitted from the piezoelectric layer 113 is reflected after contacting the finger, and because there is more air at the fingerprint valley than at the fingerprint ridge, the signal intensity reflected at the fingerprint valley and the fingerprint ridge of the finger is different, and usually the energy of the ultrasonic wave reflected by the fingerprint valley is greater than that of the ultrasonic wave reflected by the fingerprint ridge, that is, the signal intensity reflected by the fingerprint valley is stronger than that of the signal intensity reflected by the fingerprint ridge, and the piezoelectric layer 113 receives the different ultrasonic signals reflected by the fingerprint valley and the fingerprint ridge to generate different electric signals. By sizing the conductive pieces 1151, one valley-ridge period of the finger corresponds to a plurality of conductive pieces 1151. Therefore, the conductive blocks 1151 of the fingerprint touch identification area 112 respectively corresponding to the fingerprint valleys and the fingerprint ridges generate different amounts of induced charges due to the electrostatic coupling effect, the control module 12 detects the difference in the amounts of the induced charges to realize fingerprint identification, and finally transmits the detection result to the external circuit through the circuit board 13.
It can be understood that, in order to detect the ultrasonic signal reflected by the piezoelectric layer 113 and received by the display module 16, a certain time difference is required to be set to avoid mixing the ultrasonic signal transmitted to the display module 16 with the ultrasonic signal reflected by the display module 16, so as to ensure the detection accuracy. For example, the circuit board 17 supplies a potential difference to the piezoelectric layer 113 in accordance with a certain time law to emit an ultrasonic signal.
The fingerprint touch identification area 112 and the touch identification area 114 of the ultrasonic fingerprint identification module 10a can perform touch identification. The signal processing module 18 integrates the function of a touch chip, when the touch surface 165 of the display module 16 is not touched, the ultrasonic signal emitted by the piezoelectric layer 113 is reflected by the surface of the display module 16, the piezoelectric layer 113 can detect the reflected ultrasonic signal and generate an electric signal, and the conductive block of the second piezoelectric layer 115 generates a certain amount of induced charges due to the electrostatic coupling; when the surface of the display module 16 is touched, because the contact between the touch object (e.g. a user's finger) and the surface of the display module 16 can make part of the ultrasonic signal penetrate through the display module 16 and enter the touch object, the ultrasonic signal reflected by the display module 16 at the touched position received by the piezoelectric layer 113 changes, so that the electric signal generated by the piezoelectric layer 113 at the touched position changes, the amount of induced charges generated by the conductive blocks at the corresponding positions also changes, and the ultrasonic signal reflected by the display module 16 at the position not touched does not change, so that the amount of induced charges generated by the conductive blocks at the position not touched does not change, and therefore, the signal processing module 18 detects whether the amount of induced charges at the touched position and the position not touched changes to determine the touched position, namely, ultrasonic touch control is realized.
The invention also provides electronic equipment which adopts the ultrasonic fingerprint identification module. The electronic device includes, but is not limited to, a mobile phone, a computer, a tablet computer, an attendance machine, and other fingerprint swiping devices.
Compared with the prior art, the ultrasonic fingerprint identification module comprises the fingerprint touch identification module, the fingerprint touch identification module comprises the touch identification area and the fingerprint touch identification area, the identification precision of the fingerprint touch identification area is higher than that of the touch identification area, the ultrasonic fingerprint identification module is simple in structure, not only can realize fingerprint identification, but also can realize touch identification, the cost of the ultrasonic fingerprint identification module is reduced, the popularization and the application of the ultrasonic fingerprint identification module are improved, the ultrasonic fingerprint identification module is suitable for a touch screen, a special fingerprint identification device does not need to be arranged below the touch screen, and the size of a product using the ultrasonic fingerprint identification module is reduced.
The fingerprint touch identification module comprises an upper electrode layer, a piezoelectric layer and a lower electrode layer which are arranged in a laminated mode, wherein the upper electrode layer and the lower electrode layer are respectively arranged on two opposite surfaces of the piezoelectric layer, the identification precision of the upper electrode layer of the fingerprint touch identification area is larger than that of the upper electrode layer of the touch identification area, and/or the identification precision of the lower electrode layer of the fingerprint touch identification area is larger than that of the lower electrode layer of the touch identification area.
The area of the conductive blocks in the fingerprint touch identification area is 30-50 um multiplied by 30um, the distance between the conductive blocks in the fingerprint touch identification area is 5-10 um, the area of the conductive blocks in the touch identification area is 3-5 mm multiplied by 3mm, and the distance between the conductive blocks in the touch identification area is 0.5-2 mm, so that the fingerprint identification precision is ensured, the touch identification precision is ensured, and the cost is reduced.
The ultrasonic fingerprint identification module further comprises a non-conductive substrate, the fingerprint touch control identification module is stacked on the surface, close to the display module, of the non-conductive substrate, when the lower electrode layer comprises a plurality of conductive blocks which are arranged in an array mode, the conductive blocks are arranged on the surface, close to the display module, of the non-conductive substrate, and the conductive blocks are formed on the non-conductive substrate in a one-step processing mode, so that the processing times and the processing time are reduced, and the cost is reduced.
In addition, the piezoelectric layer is an in-situ polarized ferroelectric polymer film and has the advantages of good piezoelectric effect and high resolution.
Compared with the prior art, the ultrasonic fingerprint identification device comprises the display module and the ultrasonic fingerprint identification module, wherein one surface of the display module is a touch surface for a user to operate, and the other surface opposite to the touch surface is provided with the ultrasonic fingerprint identification module.
Compared with the prior art, the electronic equipment comprises the ultrasonic fingerprint identification module. The electronic equipment has the advantages of simple structure, high integration level, high reliability and light weight.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit of the present invention are intended to be included within the scope of the present invention.