CN106332448A - Ultrasonic wave sensor and electronic apparatus equipped with same - Google Patents
Ultrasonic wave sensor and electronic apparatus equipped with same Download PDFInfo
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- CN106332448A CN106332448A CN201610636877.9A CN201610636877A CN106332448A CN 106332448 A CN106332448 A CN 106332448A CN 201610636877 A CN201610636877 A CN 201610636877A CN 106332448 A CN106332448 A CN 106332448A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Transducers For Ultrasonic Waves (AREA)
Abstract
Disclosed is an ultrasonic wave sensor. The ultrasonic wave sensor comprises a substrate, a flexible printed circuit board, a signal receiving element and a signal sending element, wherein the signal receiving element comprises a first piezoelectric layer, a first electrode layer and a first protection layer; a connecting hole is formed in the end part of the first protection layer in a run-through manner; the connecting hole can expose one part of the first electrode layer; the flexible printed circuit board comprises a stage-structured first connecting part; the first connecting part comprises a first end part and a second end part which is formed by extending from one side at one end of the first end part; the first end part and the substrate are arranged at intervals in parallel, and the first end part is provided with a first conductive part, which is electrically connected with the substrate, in a protruding manner; the second end part and the first protection layer are arranged at intervals in parallel, and the second end part is provided with a second conductive part in a protruding manner corresponding to the connecting hole; and the second conductive part is electrically connected with the first electrode layer through the connecting hole.
Description
Technical field
The present invention relates to a kind of ultrasonic sensor and there is the electronic installation of this ultrasonic sensor.
Background technology
As it is shown in figure 1, the electronic installation 200 of prior art includes that TFT substrate 201, signal sending element 203, signal connect
Receive element 205 and flexible circuit board 206.Signal sending element 203 and signal receiving element 205 are pasted by tack coat 202 respectively
Together in TFT substrate 201 both sides.The bending extension of signal receiving element 205 one end is formed with connection end 207, connects end 207 and is positioned at this
TFT substrate 201 side.One end of flexible circuit board 206 is electrically connected with this signal sending element 203, and flexible circuit board 206
The connection end 207 of conductive part 208 with signal receiving element 205 by being arranged on the other end is electrically connected with.Flexible circuit board 206
One end and TFT substrate 201 and be connected between end 207 formation space 210.A length of fixing length due to flexible circuit board 206
Degree, when the connection end 207 of conductive part 208 and signal receiving element 205 is electrically connected with, flexible circuit board 206 end is in space 210
Bending upfold, so that the fold part of flexible circuit board 206 promotes forward flexible circuit board 206 conductive part 208, causes
The easy off normal in electricity portion 208, thus flexible circuit board 206 and signal receiving element 205 are susceptible to loose contact.Further, since it is soft
Property circuit board 206 end bend upfold in space 210, the space in space 210 is relatively big, causes the overall body of electronic installation 200
Long-pending change is big, is difficult to realize miniaturization.
Summary of the invention
In view of the foregoing, it is necessary to provide one to prevent flexible circuit board off normal, small volume, and easily realize miniaturization
Electronic installation.
A kind of ultrasonic sensor, it is used for producing ultrasonic wave energy, and this ultrasonic sensor includes substrate, flexible circuit board
And it being respectively arranged at signal receiving element and the signal sending element of these substrate both sides, this signal receiving element includes stacking gradually
The first piezoelectric layer, the first electrode layer and the first protective layer arranged, the first protective layer end is through offers connecting hole for this, and this is even
Connect hole can the part of this first electrode layer exposed, this flexible circuit board includes the first connecting portion of ledge structure, and this is first years old
Connecting portion includes that the side of one end of first end and this first end extends and forms the second end, this first end and this substrate
Spaced and parallel setting, and it is convexly equipped with the first conductive part being connected with this electrical property of substrate, this second end and this first protection interlayer
Every be arrangeding in parallel, this second end is to being convexly equipped with the second conductive part by connecting hole, and this second conductive part is through this connecting hole and is somebody's turn to do
First electrode layer is electrically connected with.
A kind of electronic installation, it includes pressing plate and fits in the ultrasonic sensor of this pressing plate side, this supersonic sensing
Device includes substrate, flexible circuit board and the signal receiving element being arranged at these substrate both sides and signal sending element, and this signal connects
Receiving the first piezoelectric layer, the first electrode layer and the first protective layer that element includes being cascading, this first protective layer end is passed through
Open up and be provided with connecting hole, this connecting hole can the part of this first electrode layer exposed, this flexible circuit board includes ledge structure
The first connecting portion, this first connecting portion include one end of first end and this first end side extend formed the second end
Portion, this first end and the spaced and parallel setting of this substrate, and it is convexly equipped with the first conductive part being connected with this electrical property of substrate, this is second years old
End and this spaced and parallel setting of the first protective layer, this second end is to being convexly equipped with the second conductive part by connecting hole, and this is second years old
Conductive part is electrically connected with this first electrode layer through this connecting hole.
The electronic installation of the present invention has ultrasonic sensor, due to this flexible circuit board the first connecting portion and substrate and
The spaced and parallel setting of signal receiving element, the first connecting portion of flexible circuit board will not be at space inner bending fold, so that soft
First connecting portion of circuit board will not promote the first conductive part and the second conductive part, thus is effectively prevented the first conductive part and
The problem of two conductive part off normals.Further, since the first connecting portion of flexible circuit board will not be at space inner bending fold, so that empty
Between space can less design, thus ultrasonic sensor compact conformation, and then easily realize the miniaturization of electronic installation.
Accompanying drawing explanation
Fig. 1 is the structural representation of electronic installation of the prior art.
Fig. 2 is the structural representation of electronic installation provided by the present invention.
Fig. 3 is the decomposing schematic representation of the pressing plate of the electronic installation shown in Fig. 2, signal receiving element and substrate.
Fig. 4 is substrate and the decomposing schematic representation of signal sending element of the electronic installation shown in Fig. 2.
Main element symbol description
| Electronic installation | 100、200 |
| TFT substrate | 201 |
| Signal sending element | 203、35 |
| Tack coat | 202 |
| Signal receiving element | 205、33 |
| Flexible circuit board | 206、37 |
| Connect end | 207 |
| Conductive part | 208 |
| Space | 210、39 |
| Pressing plate | 10 |
| Ultrasonic sensor | 30 |
| Substrate | 31 |
| First surface | 311 |
| First installed surface | 3112 |
| Second installed surface | 3113 |
| Second surface | 313 |
| Image element circuit | 315 |
| Pixel input electrode | 317 |
| First piezoelectric layer | 331 |
| First electrode layer | 332 |
| First protective layer | 335 |
| Connecting hole | 3351 |
| Second piezoelectric layer | 351 |
| The second electrode lay | 353 |
| 3rd electrode layer | 355 |
| Second protective layer | 357 |
| 3rd protective layer | 359 |
| First connecting portion | 371 |
| First end | 375 |
| First conductive part | 3751 |
| The second end | 377 |
| Second conductive part | 3771 |
| Second connecting portion | 373 |
Following detailed description of the invention will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Detailed description of the invention
Accompanying drawing is coordinated to be described in detail below by way of specific embodiment.
Please refer to Fig. 2, the electronic installation 100 that the present invention provides includes pressing plate 10 and fits in surpassing on this pressing plate 10
Sonic sensor 30.Electronic installation 100 has the electronic installation of ultrasonic sensor, such as, mobile phone, panel computer, wrist-watch etc.
Electronic installation.
In present embodiment, the substantially rectangular tabular of pressing plate 10, pressing plate 10 is for can be acoustically coupled to ultrasonic sensor
Any suitable material of the receptor of 30, in present embodiment, pressing plate 10 material is glass.In present embodiment, pressing plate 10 is
Cover plate, such as, be used for cover glass or the protection glass etc. of display.
Being appreciated that in other embodiments, pressing plate 10 can be plastics, pottery, sapphire, metal (such as, aluminum, no
Rust steel etc.), metal alloy (such as, almag etc.), composite, plastic film (such as, polymetylmethacrylate,
Polyethersulfone resin PES, polyethylene terephtalate, PEN PEN, polycarbonate, poly-ammonia
Carbamate PU etc.), metal filled formula polymer and, Merlon, use according to the actual requirements.When needed can be via
(such as) the relatively thick pressing plate 10 of 1mm or more than 1mm performs detection and imaging.In other embodiments, for electronics
The housing of device 100 or shell may act as pressing plate 10.In other embodiments, the back of mobile device case, side or above
May act as pressing plate 10, the ultrasonic sensor 30 of the present invention can be directly via case wall imaged fingerprint or collection biometric letter
Breath.In other embodiments, such as polyurethane thin layer, acrylic acid, the coating of Parylene or diamond-like coating (DLC) can
Serve as pressing plate 10.
Ultrasonic sensor 30 fits in the side of this pressing plate 10, and it includes that substrate 31, signal receiving element 33, signal are sent out
Send element 35 and flexible circuit board 37.
Please refer to Fig. 2 and Fig. 3, substrate 31 is thin substrate, such as glass or plastic.In present embodiment, base
Plate 31 is TFT substrate.In other embodiments, substrate 31 is silicon, monocrystal silicon or other semi-conducting material, such as silicon wafer or exhausted
Silicon wafer on edge body.Substrate 31 includes first surface 311 and the second surface 313 being oppositely arranged.This first surface 311 is towards this
Pressing plate 10 is arranged, and this second surface 313 deviates from this pressing plate 10 and arranges.This first surface 311 is formed with the battle array of image element circuit 315
Row.Each image element circuit 315 includes and the pixel input electrode 317 of this signal receiving element 33 electric coupling.This first surface 311
The first installed surface 3112 and the second installed surface 3113 can be divided into.First installed surface 3112 is used for signal receiving element 33 of fitting, the
Two installed surfaces 3113 are used for connecting flexible circuit board 37.
Signal receiving element 33 is arranged at the first installed surface 3112 of this substrate 31, and is coupled to the pixel electricity of this substrate 31
The pixel input electrode 317 on road 315.Signal receiving element 33 includes that first piezoelectric layer the 331, first electrode layer 332 and first is protected
Sheath 335.
First piezoelectric layer 331 covers the first installed surface 3112 fitting in this substrate 31 by binding agent (not shown), and
It is electrically coupled to the pixel input electrode 317 of image element circuit 315, so that the electric charge that the first piezoelectric layer 331 produces is converted into the signal of telecommunication.
The ultrasonic wave energy reflected from the exposed surface of pressing plate 10 can be converted into partial charge by the first piezoelectric layer 331.Pixel input electricity
This partial charge can be collected in pole 317, and by charge transfer to underlying pixel data circuit 315.Image element circuit 315 can amplify this electric charge and
Output signal from image element circuit 315 can be sent to the sensor controller for signal processing or other circuit.
First electrode layer 332 is formed at first piezoelectric layer 331 side away from this substrate 31.In present embodiment, this is years old
The material of one electrode layer 332 is silver.It is appreciated that the first electrode layer 332 can include that one layer or more aluminum, aluminium alloy, copper, copper close
Gold, copper and nickel, gold, platinum and gold, chromium and gold, chromium and aluminum, chromium and copper, chromium-copper and gold, silver, indium tin oxide (ITO) or other lead
Electroxidation thing, silver and polyether polyols with reduced unsaturation or other suitable conductive material.It is also to be understood that the material of the first electrode layer 332 is
Conductive ink, conductive epoxy resin, ink-jet metal and conductive adhesive etc..
First protective layer 335 is formed at this first electrode layer 332 and deviates from the side of this first piezoelectric layer 331, should with protection
First electrode layer 332.The first protective layer 335 one end is through offers connecting hole 3351 for this.One of this first electrode layer 332
Point by this, connecting hole 3351 is naked is exposed on the external.
Please refer to Fig. 2 and Fig. 4, signal sending element 35 fits in the second surface of this substrate 31 by binding agent
313.This signal sending element 35 includes the second piezoelectric layer 351, the second electrode lay the 353, the 3rd electrode layer 355, the second protective layer
357 and the 3rd protective layer 359.
Second piezoelectric layer 351 is positioned at below the second surface 313 of substrate 31, the second electrode lay 353 and the 3rd electrode layer 355
Fit in the relative both sides of this second piezoelectric layer 351 respectively.Specifically, this second piezoelectric layer 351 is located in this second electrode
Between layer 353 and the 3rd electrode layer 355, such as, this second electrode lay 353 is respectively coated in this with the 3rd electrode layer 355
Second piezoelectric layer 351 2 surface.This second electrode lay 353 is located at this second piezoelectric layer 351 side away from this substrate 31, and this is years old
Three electrode layers 355 are located between this second piezoelectric layer 351 and this substrate 31.In present embodiment, the second electrode lay 353 and the 3rd
Electrode layer 355 can be metallization or otherwise conductive electrode, such as, is coated with the metal level of the both sides of the second piezoelectric layer 351.
In present embodiment, the material of this second electrode lay 353 and the 3rd electrode layer 355 is silver.It is appreciated that this second electrode lay
353 can also include one layer or more aluminum, aluminium alloy, copper, copper alloy, copper and nickel, gold, platinum and gold, chromium with the 3rd electrode layer 355
And gold, chromium and aluminum, chromium and copper, chromium-copper and gold, silver, indium tin oxide (ITO) or other conductive oxide, silver and polyurethane polymerization
Thing or other suitable conductive material.The material being appreciated that the first electrode layer 332 is conductive ink, conductive epoxy resin, ink
Injecting type metal and conductive adhesive etc..
The outboard cover of this second electrode lay 353 is provided with the second protective layer 357, the second protective layer 357 be used for protecting this second
Electrode layer 353.The outboard cover of the 3rd electrode layer 355 is provided with the 3rd protective layer 359, the 3rd protective layer 359 be used for protecting this
Three electrode layers 355.3rd protective layer 359 is between this substrate 31 and the 3rd electrode layer 355, and is fitted in by binding agent
The second surface 313 of this substrate 31, so that whole signal sending element 35 fits in the second table of this substrate 31 by adhesive layer
Face 313.
Signal sending element 35 produces ultrasound wave and depends on applied signal, applies voltage to piezoelectric layer and with extension or receives
Contract described layer, produces plane wave whereby.The second pressure can be applied a voltage to via the second electrode lay 353 and the 3rd electrode layer 355
Electric layer 351.In this way, ultrasound wave can be produced by extension or contraction the second piezoelectric layer 351.This ultrasound wave can be towards finger
(or other object to be detected) advances, and through pressing plate 10.The part not absorbed by object to be detected or launching of this ultrasound wave
Can be reflected, in order to pass back through pressing plate 10 and received by signal receiving element 33.
This flexible circuit board 37 is electrically connected with this signal sending element 35, this substrate 31 and this signal receiving element 33.
This flexible circuit board 37 includes the first connecting portion 371 and is extended the second connecting portion formed by one end of the first connecting portion 371
373.First connecting portion 371 is positioned at the top of this signal receiving element 33, and with this spaced and parallel setting of the first protective layer 335.
First connecting portion 371 is substantially in ledge structure, and it includes first end 375 and is extended by the side of one end of first end 375
Form the second end 377.The width of the second end 377 is less than the width of first end 375, and the length of the second end 377 is big
Length in first end 375.First end 375 is positioned at above the second installed surface 3113 of this substrate 31, and with this second peace
The spaced and parallel setting in dress face 3113.This first end 375 is convexly equipped with the first conductive part 3751 towards this second installed surface 3113, should
First conductive part 3751 is electrical with the image element circuit 315 of the second installed surface 3113 of this substrate 31 by conductive adhesive film (not shown)
Connect.The second end 377 extends to above this first protective layer 335, and with the first spaced and parallel setting of protective layer 335.Second
End 377 is to the position of connecting hole 3351 being convexly equipped with the second conductive part 3771, and one end of the second conductive part 3771 houses
In this connecting hole 3351, and it is electrically connected with this first electrode layer 332 by conductive adhesive film.It is appreciated that the first conductive part
3751 and second conductive part 3771 shape can be circular, square, other shapes such as rectangle.In present embodiment, first leads
Electricity portion 3751 and the second conductive part 3771 are copper conductor.It is appreciated that the first conductive part 3751 and the second conductive part 3771 also may be used
To be anisotropic conductive film (ACF), electrically conductive ink, electroconductive binder etc..
It is collectively forming a space between first surface the 311, first connecting portion 371 and the signal receiving element 33 of substrate 31
39.Due to the first connecting portion 371 and substrate 31 and the spaced and parallel setting of signal receiving element 33 of this flexible circuit board 37, soft
First connecting portion 371 of circuit board 37 will not bend upfold in space 39, so that the first connecting portion of flexible circuit board 37
371 will not promote the first conductive part 3751 and the second conductive part 3771, thus are effectively prevented the first conductive part 3751 and second
The problem of conductive part 3771 off normal.Further, since the first connecting portion 371 of flexible circuit board 37 will not bend upwards in space 39
Fold so that the space in space 39 can less design, thus the compact conformation of ultrasonic sensor 30, and then easily realize electricity
The miniaturization of sub-device 100.Further, upwards pleat will not be bent in space 39 due to the first connecting portion 371 of flexible circuit board 37
Wrinkle, so that flexible circuit board 37 will not extrude the element below the first connecting portion 371 of substrate 31 flexible circuit board such as grade 37, thus
Guarantee that the normal of the element below the first connecting portion 371 of flexible circuit board 37 works.
It is appreciated that the size of the second conductive part 3771, and the connecting hole matched with this second conductive part 3771
The size of 3351 changes design according to the size of ultrasonic sensor 30 and the requirement of performance.It is appreciated that connecting hole 3351
Size and dimension change design according to the size and dimension of the second conductive part 3771 of flexible circuit board 37.It is appreciated that
The second end 377 of flexible circuit board 37 can extend to whole first protective layer 335, to cover whole first protective layer 335
Deviate from a surface of this first electrode layer 332.
Second connecting portion 373 of this flexible circuit board 37 by the first end 375 of this first connecting portion 371 away from this second
One end of end 377 extends and is formed.Second connecting portion 373 is by the second electricity of wire (not shown) with this signal sending element 35
Pole layer 353 and the 3rd electrode layer 355 are electrically connected with.
The further packet controller (not shown) of electronic installation 100, this controller passes through flexible circuit board 37 and the second electrode
Image element circuit 315 on layer the 353, the 3rd electrode layer the 355, first electrode layer 332 and substrate 31 is electrically connected with.
This ultrasonic sensor 30, when real work, applies electricity to this second electrode lay 353 and the 3rd electrode layer 355
Pressure, makes this second piezoelectric layer 351 vibrate and launch ultrasound wave.The ultrasound wave that signal sending element 35 produces receives unit through signal
It is outside that part 33 is exposed to pressing plate 10.In the surface exposing outside to the open air of pressing plate 10, it is right that ultrasonic wave energy may be contacted with pressing plate 10
As (such as, the skin of fingerprint ridge line) launches, absorbs or disperse, or it is reflected back toward.Outside is exposed to the open air at air contact pressing plate 10
Surface those positions (such as, the recess between fingerprint ridge line) in, major part ultrasound wave will be reflected back toward and connect towards signal
Receive element 33 for detecting.Controller can be coupled to signal sending element 35 and signal receiving element 33, and can supply
Signal sending element 35 is made to produce the timing signal of one or more ultrasound wave.Controller then can connect from signal receiving element 33
Receive instruction and be reflected the signal of ultrasonic wave energy.Controller can use the output signal received from signal receiving element 33 to carry out construction pair
The digitized video of elephant.
The electronic installation 100 of the present invention has ultrasonic sensor 30, due to the first connecting portion of this flexible circuit board 37
371 with substrate 31 and the spaced and parallel setting of signal receiving element 33, the first connecting portion 371 of flexible circuit board 37 will not be in space
39 bending upfolds, so that the first connecting portion 371 of flexible circuit board 37 will not promote the first conductive part 3751 and second to lead
Electricity portion 3771, thus it is effectively prevented the first conductive part 3751 and problem of the second conductive part 3771 off normal.Further, since it is soft
First connecting portion 371 of circuit board 37 will not bend upfold in space 39 so that the space in space 39 can less design,
Thus the compact conformation of ultrasonic sensor 30, and then easily realize the miniaturization of electronic installation 100.Further, due to soft electricity
First connecting portion 371 of road plate 37 will not bend upfold in space 39, so that the first connecting portion 371 of flexible circuit board 37
The element below the first connecting portion 371 of substrate 31 flexible circuit board such as grade 37 will not be extruded, so that it is guaranteed that flexible circuit board 37 times
The normal work of the element of side.
Certainly, the invention is not limited in embodiment disclosed above, the present invention can also is that and carries out above-described embodiment
Various changes.As long as those skilled in the art is appreciated that in the spirit of the present invention, to above example institute
That makees suitably changes and changes all to fall in the scope of protection of present invention.
Claims (10)
1. a ultrasonic sensor, it is used for producing ultrasonic wave energy, this ultrasonic sensor include substrate, flexible circuit board and
Being respectively arranged at signal receiving element and the signal sending element of these substrate both sides, this signal receiving element includes stacking gradually and sets
The first piezoelectric layer, the first electrode layer and the first protective layer put, it is characterised in that this through company of offering in the first protective layer end
Connect hole, this connecting hole can the part of this first electrode layer exposed, this flexible circuit board includes the first connection of ledge structure
Portion, this first connecting portion includes that the side of one end of first end and this first end extends and forms the second end, this first end
Portion and the spaced and parallel setting of this substrate, and be convexly equipped with the first conductive part being connected with this electrical property of substrate, this second end with this
The one spaced and parallel setting of protective layer, this second end is to being convexly equipped with the second conductive part by connecting hole, and this second conductive part is through being somebody's turn to do
Connecting hole is electrically connected with this first electrode layer.
2. ultrasonic sensor as claimed in claim 1, it is characterised in that this flexible circuit board also includes first being connected by this
The one end in portion extends the second connecting portion formed, and this second connecting portion is electrically connected with this signal sending element.
3. ultrasonic sensor as claimed in claim 1, it is characterised in that this signal sending element include the second piezoelectric layer,
The second electrode lay, the 3rd electrode layer, this second piezoelectric layer is located between this second electrode lay and the 3rd electrode layer, and the 3rd
Electrode layer is located between this second piezoelectric layer and this substrate, this second electrode lay and the 3rd electrode layer respectively with this soft electricity
Second connecting portion of road plate is electrically connected with.
4. ultrasonic sensor as claimed in claim 1, it is characterised in that this substrate include the first surface that is oppositely arranged and
Second surface, this first surface includes the first installed surface and the second installed surface, this signal receiving element cover fit in this first
Installed surface, the first conductive part of this flexible circuit board is electrically connected with this second installed surface, and this signal sending element fits in this
Second surface.
5. ultrasonic sensor as claimed in claim 4, it is characterised in that this first surface is formed with the battle array of image element circuit
Row, each image element circuit includes pixel input electrode, this pixel input electrode and this signal receiving element electric coupling.
6. ultrasonic sensor as claimed in claim 1, it is characterised in that this signal sending element also includes the second protective layer
And the 3rd protective layer, the outboard cover of this second electrode lay is provided with this second protective layer, and the outboard cover of the 3rd electrode layer is provided with this
3rd protective layer.
7. an electronic installation, it includes pressing plate and fits in the ultrasonic sensor of this pressing plate side, this ultrasonic sensor
Including substrate, flexible circuit board and the signal receiving element being arranged at these substrate both sides and signal sending element, this signal receives
Element includes the first piezoelectric layer, the first electrode layer and the first protective layer being cascading, it is characterised in that this first protection
End is through offers connecting hole for layer, this connecting hole can the part of this first electrode layer exposed, this flexible circuit board includes
First connecting portion of ledge structure, this first connecting portion includes that the side of one end of first end and this first end extends and is formed
The second end, this first end and the spaced and parallel setting of this substrate, and it is convexly equipped with the first conductive part being connected with this electrical property of substrate,
This second end and this spaced and parallel setting of the first protective layer, this second end to being convexly equipped with the second conductive part by connecting hole,
This second conductive part is electrically connected with this first electrode layer through this connecting hole.
8. electronic installation as claimed in claim 7, it is characterised in that this flexible circuit board also includes by this first connecting portion
One end extends the second connecting portion formed, and this second connecting portion is electrically connected with this signal sending element.
9. electronic installation as claimed in claim 7, it is characterised in that this signal sending element include the second piezoelectric layer, second
Electrode layer, the 3rd electrode layer, this second piezoelectric layer is located between this second electrode lay and the 3rd electrode layer, the 3rd electrode
Layer is located between this second piezoelectric layer and this substrate, this second electrode lay and the 3rd electrode layer respectively with this flexible circuit board
Second connecting portion be electrically connected with.
10. electronic installation as claimed in claim 7, it is characterised in that this substrate includes the first surface that is oppositely arranged and the
Two surfaces, this first surface includes the first installed surface and the second installed surface, and this signal receiving element covers and fits in this first peace
Dress face, the first conductive part of this flexible circuit board and this second installed surface be electrically connected with, this signal sending element fit in this
Two surfaces.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610636877.9A CN106332448B (en) | 2016-08-06 | 2016-08-06 | Ultrasonic sensor and electronic device with the ultrasonic sensor |
| TW105125587A TWI644083B (en) | 2016-08-06 | 2016-08-11 | Ultrasonic sensor and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610636877.9A CN106332448B (en) | 2016-08-06 | 2016-08-06 | Ultrasonic sensor and electronic device with the ultrasonic sensor |
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| Publication Number | Publication Date |
|---|---|
| CN106332448A true CN106332448A (en) | 2017-01-11 |
| CN106332448B CN106332448B (en) | 2019-04-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610636877.9A Active CN106332448B (en) | 2016-08-06 | 2016-08-06 | Ultrasonic sensor and electronic device with the ultrasonic sensor |
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| CN (1) | CN106332448B (en) |
| TW (1) | TWI644083B (en) |
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| CN106874853A (en) * | 2017-01-16 | 2017-06-20 | 麦克思商务咨询(深圳)有限公司 | Sound wave type fingerprint identification device and preparation method thereof and apply its electronic installation |
| CN106886333A (en) * | 2017-01-13 | 2017-06-23 | 麦克思商务咨询(深圳)有限公司 | Sensing device further |
| CN106886335A (en) * | 2017-01-16 | 2017-06-23 | 麦克思商务咨询(深圳)有限公司 | Ultrasonic sensor and electronic installation |
| CN106886753A (en) * | 2017-01-16 | 2017-06-23 | 麦克思商务咨询(深圳)有限公司 | Sound wave type fingerprint identification device application its electronic installation |
| CN109492481A (en) * | 2017-09-12 | 2019-03-19 | 南昌欧菲生物识别技术有限公司 | Ultrasonic sensor and electronic device |
| CN109948496A (en) * | 2019-03-12 | 2019-06-28 | 京东方科技集团股份有限公司 | A kind of fingerprint recognition device and display device |
| CN110245629A (en) * | 2019-06-19 | 2019-09-17 | 业成科技（成都）有限公司 | Electronic device and its manufacturing method |
| CN111460904A (en) * | 2020-03-05 | 2020-07-28 | 南昌欧菲生物识别技术有限公司 | Ultrasonic detection module, detection method and device thereof and electronic equipment |
| CN112869773A (en) * | 2019-11-29 | 2021-06-01 | 哈尔滨工业大学 | Flexible ultrasonic sensor and arterial blood pressure detection method thereof |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001111192A (en) * | 1999-10-13 | 2001-04-20 | Toshiba Corp | Electronic component, manufacturing method thereof, electronic apparatus and ultrasonic sensor component |
| US20130072796A1 (en) * | 2011-09-20 | 2013-03-21 | Seiko Epson Corporation | Ultrasonic probe and ultrasonic image diagnostic device |
| US20130223192A1 (en) * | 2012-02-24 | 2013-08-29 | Seiko Epson Corporation | Ultrasonic transducer device, probe, electronic instrument, and ultrasonic diagnostic device |
| WO2014197504A1 (en) * | 2013-06-03 | 2014-12-11 | Qualcomm Mems Technologies, Inc. | Ultrasonic sensor with bonded piezoelectric layer |
| US20150305713A1 (en) * | 2014-04-23 | 2015-10-29 | Samsung Electronics Co., Ltd. | Ultrasonic probe and manufacturing method thereof |
| CN105094227A (en) * | 2015-07-10 | 2015-11-25 | 麦克思商务咨询(深圳)有限公司 | Electronic apparatus |
| CN105447470A (en) * | 2015-12-02 | 2016-03-30 | 麦克思商务咨询(深圳)有限公司 | Electronic apparatus |
| CN105631402A (en) * | 2015-12-18 | 2016-06-01 | 麦克思商务咨询(深圳)有限公司 | Fingerprint recognition device and fingerprint recognition method |
| CN105634459A (en) * | 2015-12-25 | 2016-06-01 | 麦克思商务咨询(深圳)有限公司 | Touch-sensitive switch and electronic device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05152693A (en) * | 1991-11-30 | 1993-06-18 | Nitto Denko Corp | Flexible printed board with reinforcing part and manufacture thereof |
| WO2005020631A1 (en) * | 2003-08-22 | 2005-03-03 | Matsushita Electric Industrial Co., Ltd. | Sound matching body, process for producing the same, ultrasonic sensor and ultrasonic wave transmitting/receiving system |
| US9323393B2 (en) * | 2013-06-03 | 2016-04-26 | Qualcomm Incorporated | Display with peripherally configured ultrasonic biometric sensor |
| WO2015009766A1 (en) * | 2013-07-15 | 2015-01-22 | Qualcomm Incorporated | Method and integrated circuit for operating a sensor array |
| JP6327821B2 (en) * | 2013-09-20 | 2018-05-23 | 株式会社東芝 | Acoustic sensor and acoustic sensor system |
-
2016
- 2016-08-06 CN CN201610636877.9A patent/CN106332448B/en active Active
- 2016-08-11 TW TW105125587A patent/TWI644083B/en active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001111192A (en) * | 1999-10-13 | 2001-04-20 | Toshiba Corp | Electronic component, manufacturing method thereof, electronic apparatus and ultrasonic sensor component |
| US20130072796A1 (en) * | 2011-09-20 | 2013-03-21 | Seiko Epson Corporation | Ultrasonic probe and ultrasonic image diagnostic device |
| US20130223192A1 (en) * | 2012-02-24 | 2013-08-29 | Seiko Epson Corporation | Ultrasonic transducer device, probe, electronic instrument, and ultrasonic diagnostic device |
| WO2014197504A1 (en) * | 2013-06-03 | 2014-12-11 | Qualcomm Mems Technologies, Inc. | Ultrasonic sensor with bonded piezoelectric layer |
| CN105264543A (en) * | 2013-06-03 | 2016-01-20 | 高通Mems科技公司 | Ultrasonic sensor with bonded piezoelectric layer |
| US20150305713A1 (en) * | 2014-04-23 | 2015-10-29 | Samsung Electronics Co., Ltd. | Ultrasonic probe and manufacturing method thereof |
| CN105094227A (en) * | 2015-07-10 | 2015-11-25 | 麦克思商务咨询(深圳)有限公司 | Electronic apparatus |
| CN105447470A (en) * | 2015-12-02 | 2016-03-30 | 麦克思商务咨询(深圳)有限公司 | Electronic apparatus |
| CN105631402A (en) * | 2015-12-18 | 2016-06-01 | 麦克思商务咨询(深圳)有限公司 | Fingerprint recognition device and fingerprint recognition method |
| CN105634459A (en) * | 2015-12-25 | 2016-06-01 | 麦克思商务咨询(深圳)有限公司 | Touch-sensitive switch and electronic device |
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| CN106886333A (en) * | 2017-01-13 | 2017-06-23 | 麦克思商务咨询(深圳)有限公司 | Sensing device further |
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| CN106886753A (en) * | 2017-01-16 | 2017-06-23 | 麦克思商务咨询(深圳)有限公司 | Sound wave type fingerprint identification device application its electronic installation |
| CN106874853A (en) * | 2017-01-16 | 2017-06-20 | 麦克思商务咨询(深圳)有限公司 | Sound wave type fingerprint identification device and preparation method thereof and apply its electronic installation |
| CN106874853B (en) * | 2017-01-16 | 2020-04-10 | 业成科技（成都）有限公司 | Acoustic wave type fingerprint identification device, manufacturing method thereof and electronic device applying acoustic wave type fingerprint identification device |
| CN106886335A (en) * | 2017-01-16 | 2017-06-23 | 麦克思商务咨询(深圳)有限公司 | Ultrasonic sensor and electronic installation |
| CN106886753B (en) * | 2017-01-16 | 2020-12-15 | 业泓科技(成都)有限公司 | Electronic device using acoustic wave type fingerprint identification device |
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Also Published As
| Publication number | Publication date |
|---|---|
| TWI644083B (en) | 2018-12-11 |
| CN106332448B (en) | 2019-04-12 |
| TW201805602A (en) | 2018-02-16 |
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