KR20150013981A - Fingerprint Recognizing Apparatus And Manufacturing Method Thereof And Electronic Device - Google Patents

Abstract

The present invention relates to a fingerprint recognition device which employs an enhanced structure to improve the sensitivity of a fingerprint sensor, a manufacturing method for the fingerprint recognition device, and an electronic device thereof. The fingerprint recognition device includes: a case which has an internal space and multiple holes formed on the floor thereof; a printed circuit substrate which has a sensor on a first surface to detect sensing signals for fingerprint recognition and a driving chip on a second surface facing the case to be electrically connected to the sensor; and a bonding layer which fills at least one of the holes, forms a driving chip storing unit in the internal space to store the driving chip, and couples the printed circuit substrate to the case.

Description

Technical Field [0001] The present invention relates to a fingerprint recognition device,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a fingerprint recognition device, a manufacturing method thereof, and an electronic device, and more particularly, to a fingerprint recognition device having an improved structure for improving sensitivity of a fingerprint recognition sensor,

Generally, mobile terminals such as a mobile terminal, a PDA (Personal Digital Assistants) and a tablet PC employ a user interface such as a key pad or a touch pad.

2. Description of the Related Art In recent years, wireless Internet services and mobile communication services such as WIBRO (Wireless Broadband) have been commercialized to support communication services and Internet services using mobile terminals, and graphical user interface (GUI) support for mobile terminals such as mobile phones and PDAs (Windows Mobile), Android (Android), and the like are being adopted.

In addition to the development of communication technology, the above-mentioned martial terminal provides various additional services to the user, and the GUI-based operating system makes it convenient to provide the additional service by the portable electronic device.

In addition, a pointing device is used for more convenient use of the electronic device. In order to move a pointer such as a cursor or to receive information or a command desired by a user by detecting a signal that changes according to the movement of a finger, And is being applied to electronic devices.

A sensor is applied to the pointing device so that a cursor (a pointer on the screen) can be moved by sensing a change of a finger, and a dome switch or the like can be installed to select a menu or an icon where the cursor is located.

Generally, fingerprint recognition technology is a technique that is used to prevent security incidents by going through user registration and authentication procedures. It protects individuals and organizations from networking defenses, content and data protection, secure access to computers and mobile devices Access control and so on.

Recently, the development of mobile technology has been applied to devices such as a biotrack pad (BTP), a pointing device that detects image data of a fingerprint and performs manipulation of a pointer.

For such a fingerprint recognition technology, a fingerprint recognition sensor is applied as a sensor of a pointing device. The fingerprint recognition sensor is an apparatus for recognizing a fingerprint pattern of a human finger. The fingerprint recognition sensor may be an optical sensor, Capacity type and conductive type), an ultrasonic type sensor, and a hot sensation knowledge sensor. Each type of fingerprint recognition sensor acquires fingerprint image data from a finger according to each driving principle.

To increase the sensitivity of the fingerprint sensor, it is better that the surface of the sensor is flat and the thickness of the coating is thin.

Conventionally, a flat sensor surface is obtained by assembling a sensor on a mother substrate (substrate) whose flatness is not ensured, and the coating has to be thickened to cover the sensor surface which is not flat. As the thickness of the coating becomes thicker, the sensitivity of the sensor becomes lower. Therefore, it is necessary to take the inconvenience of post-treatment in order to reduce the thickness of the coating film.

Related prior art documents include Korean Patent Laid-Open Publication No. 10-2011-0055364 (pointing device and electronic device).

According to an aspect of the present invention, there is provided a fingerprint recognition device having a structure in which a fingerprint recognition sensor is flattened to improve sensitivity of the fingerprint recognition sensor, a manufacturing method thereof, and an electronic device.

According to another aspect of the present invention, there is provided a fingerprint recognition apparatus having a structure for protecting a fingerprint recognition sensor, a driving chip, and a printed circuit board from external impacts or foreign matter, a method of manufacturing the same, and an electronic apparatus.

A fingerprint recognition apparatus according to an embodiment of the present invention includes a case having a plurality of holes formed on its bottom surface and having an inner space, a sensor for detecting a sensing signal for fingerprint recognition is provided on a first surface, A printed circuit board having a driving chip electrically connected to the sensor on a second surface thereof and a driving chip accommodating portion accommodating the driving chip in the inner space by filling at least one of the plurality of holes, And a bonding layer for bonding the circuit board to the case.

The bonding layer may further include a supporting portion extending from the driving chip receiving portion and contacting the second surface.

One end of the printed circuit board may be bent through one of the plurality of holes formed in the bottom surface of the case.

The bonding layer may seal the space between the printed circuit board and the case to prevent foreign matter from entering the case.

The bonding layer may include at least one of an epoxy resin, a urethane resin, a UV curable resin, and an instant adhesive.

When the bonding layer is made of the UV curable resin, the case may be formed of a transparent plastic resin so that ultraviolet rays (UV) can be easily transmitted when the bonding layer is cured.

The fingerprint recognition apparatus according to an aspect of the present invention may further include a coating layer provided on the first surface to protect the sensor from an external impact.

The coating layer may be coupled to the first surface to have a flat surface.

The fingerprint recognition apparatus according to an embodiment of the present invention may further include a coating layer provided on the coating layer to protect the printed circuit board and the coating layer and to express a color or a pattern.

The coating layer may include at least one of a plastic resin, a UV curable resin, an epoxy resin, and a urethane resin.

The coating layer may be formed of a transparent UV curable resin so that ultraviolet rays can be easily transmitted when ultraviolet light (UV) is irradiated.

A dye of a color similar to that of the coating layer may be added to the transparent UV cured resin so that the thickness of the coating layer is kept thin and the shape of the coating layer is shielded.

The pattern may be displayed on the coating layer so that the function and existence of the sensor can be recognized from the outside.

The pattern may be displayed by at least one of printing, engraving and laser processing.

A method of manufacturing a fingerprint recognition device according to an embodiment of the present invention is as follows. A printed circuit board having a first surface provided with a fingerprint recognition sensor and a second surface provided with a driving chip electrically connected to the fingerprint recognition sensor passes through one of a plurality of holes formed in a bottom surface of the case, A pressure is applied to the printed circuit board such that the third flat surface of the pressure device contacts the fingerprint sensor and the bonding layer is injected through at least one of the plurality of holes, Wherein the driving chip is received in the driving chip receiving portion formed on the first surface, the supporting portion formed on the bonding layer supports the second surface, and the coating layer is provided on the first surface so as to protect the sensor from foreign substances, A pressure is applied to the third surface so that the surface of the coating layer is in contact with the pressing device so that the coating layer is flat, It is possible to provide a coating layer on the coating layer thereon.

In the electronic device according to the present invention, a plurality of holes are formed on a bottom surface of a case, a case having an internal space, a fingerprint recognition sensor is provided on a first surface, and a second surface, And a driving chip accommodating portion which is recessed toward the bottom surface of the case so as to accommodate the driving chip is formed in the inner space, And a coating layer provided on the first surface to protect the fingerprint recognition sensor from an external impact, and a printed circuit board and the coating layer, And a coating layer provided on the coating layer to express the coating layer.

The first surface and the coating layer may be flat.

Wherein the coating layer comprises a first layer provided on the coating layer, a second layer provided on the first layer and capable of being provided with a paint or dye, and a third layer provided on the second layer, Layer.

A pattern or a pattern may be displayed on the second layer or the third layer so that the function and existence of the fingerprint recognition sensor can be recognized from the outside.

The coating layer may include a transparent UV curable resin to facilitate ultraviolet (UV) irradiation, and a dye of a color similar to that of the second layer may be added to the transparent UV curable resin so that the shape of the coating layer is shielded.

And the bonding layer fills at least one of the plurality of holes.

The sensitivity of the fingerprint recognition sensor can be improved by flattening the printed circuit board provided with the fingerprint recognition sensor by using a pressing device having a flat surface.

The appearance of the coating layer disposed on the coating layer can be enhanced by making the coating layer disposed on the printed circuit board provided with the fingerprint recognition sensor thin and flat using a pressing device having a flat surface.

1 is a perspective view illustrating an appearance of a fingerprint recognition apparatus according to an embodiment of the present invention;
2 is a cross-sectional view of a fingerprint recognition apparatus according to an embodiment of the present invention.
3 is an exploded perspective view of a fingerprint recognition device according to an embodiment of the present invention.
4 is an exploded perspective view showing a cross section of a fingerprint recognition device according to an embodiment of the present invention.
5 is a view showing a state in which the first surface of the printed circuit board provided in the fingerprint recognition device according to the embodiment of the present invention is in close contact with the flat surface of the pressing device
6 is a perspective view showing an appearance of an electronic device according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view illustrating an appearance of a fingerprint recognition apparatus according to an embodiment of the present invention.

1, the fingerprint recognition device 1 may include a coating layer 10, a coating layer 20, a printed circuit board 30, and a case 40.

The case 40 may comprise a first plate 44 including a bottom surface 41 and a second plate 45 located on the top surface of the first plate 44. The coating layer 10 and the coating layer 20 may be sequentially stacked on the second plate 45.

A printed circuit board output terminal 31 may be provided at one end of the printed circuit board 30 to output an electrical signal generated in the printed circuit board 30. [ The printed circuit board output terminal 31 may be exposed to the outside and may be connected to an electronic component such as a main board (not shown).

FIG. 2 is an exploded perspective view of a fingerprint recognition apparatus according to an embodiment of the present invention. FIG. 4 is a schematic view illustrating a fingerprint recognition apparatus according to an embodiment of the present invention. 1 is an exploded perspective view showing a cross section of the device.

2 to 4, a plurality of holes 42 may be formed on the bottom surface 41 of the first plate 44 of the case 40 and a bonding layer (not shown) may be formed on the second plate 45. [ The inner space 43 can be formed so that the inner space 43 can be injected. For convenience of explanation, it is assumed that three holes 42a, 42b, and 42c are formed on the bottom surface 41. [ The number of the holes 42 is sufficient, and is not limited to three.

The plurality of holes 42a, 42b and 42c formed in the bottom surface 41 of the first plate 44 serve as a passage through which the bonding layer 70 for bonding the printed circuit board 30 and the case 40 is injected .

The plurality of holes 42a, 42b and 42c are formed on the bottom surface 41 of the first plate 44 so that gas which may be generated in the process of forming the bonding layer 70 can be discharged , It is possible to prevent an overflow phenomenon that may occur when the amount of the bonding layer 70 injected into the inner space 43 is excessively large. If one hole 42 is formed on the bottom surface 41 of the first plate 44 when the amount of the bonding layer 70 injected into the inner space 43 is excessively large, There may be a gap between the case 40 and the printed circuit board 30, which is referred to as an overflow phenomenon.

Therefore, the plurality of holes 42a, 42b, and 42c are formed on the bottom surface 41 of the first plate 44, so that the bonding force between the printed circuit board 30 and the case 40 can be enhanced.

The inner space 43 may have a depressed shape toward the bottom surface 41 of the first plate 44.

The inner space 43 may have a step, and the distance from the center of the inner space 43 is smaller. The central portion of the inner space 43 is largely recessed so that the driving chip receiving portion 72 capable of receiving the driving chip 60 can be formed by injecting the bonding layer 70 into the central portion of the inner space 43 . The shape of the inner space 43 formed in the second plate 45 may vary and is not limited to the above example.

The printed circuit board 30 may be provided with a fingerprint sensor 50 and a driving chip 60.

The printed circuit board 30 includes a flexible printed circuit board (FPCB).

The static electricity signal (static electricity) A sensed by the fingerprint sensor 50 is sensed by a circuit (not shown) in the printed circuit board 30, To the driving chip 60 via the driving circuit. The driving chip 60 converts the electrostatic signal A sensed by the fingerprint sensor 50 into an electrical signal B and the electrical signal B is transmitted to the main board Quot;) < / RTI >

The fingerprint sensor 50 may be provided on the first side 32 of the printed circuit board 30 and the driving chip 60 may be disposed on the second side of the printed circuit board 30 facing the case 40 33, respectively. The fingerprint sensor 50 provided on the first surface 32 and the driving chip 60 provided on the second surface 33 may be electrically connected.

The bonding layer 70 is formed in the inner space 43 formed in the second plate 45 through at least one of a plurality of holes 42a, 42b and 42c formed in the bottom surface 41 of the first plate 44 ≪ / RTI > The bonding layer 70 includes a driving chip accommodating portion capable of accommodating the driving chip 60 provided on the second surface 33 of the printed circuit board 30 in the inner space 43 of the second plate 45 72 can be formed. The driving chip receiving portion 72 may be formed in the inner space 43 having a large degree of depression. The bonding layer 70 may form a supporting portion 71 extending from the driving chip receiving portion 72 and contacting the second surface 33 of the printed circuit board 30. The support portion 71 can be formed in the inner space 43 having a relatively small depression degree.

One end of the printed circuit board 30 provided with the printed circuit board output terminal 31 penetrates through one of a plurality of holes 42a, 42b and 42c formed in the bottom surface 41 of the first plate 44 It can have a bent shape. Specifically, the printed circuit board output terminal 31 must be exposed to the outside so as to be connected to other electronic components, so that one end of the printed circuit board 30 provided with the printed circuit board output terminal 31 is connected to the first plate 44 And the third hole 42c passing through the second plate 45 and exposed to the outside along the guide 46 formed on the bottom surface 41 of the first plate 44. [ The printed circuit board 30 may have a bent shape because one end of the printed circuit board 30 is coupled to the guide 46 through the third hole 42c, But is not limited thereto.

The bonding layer 70 may seal the space between the printed circuit board 30 and the case 40 to prevent foreign matter from entering the inside of the case 40. [

Specifically, the bonding layer 70 shields the plurality of holes 42a, 42b, and 42c formed on the bottom surface 41 of the first plate 44, And foreign matter can be prevented from flowing into the case 40, a separate structure for waterproofing can be omitted in manufacturing the fingerprint recognition device 1. [

The bonding layer 70 is formed by sealing the gap between the inner circumferential surface of the third hole 42c and the printed circuit board 30 that can occur when one end of the printed circuit board 30 passes through the third hole 42c, can do.

The bonding layer 70 serves not only to bond the printed circuit board 30 and the case 40 but also to seal the interior of the case 40 to prevent the driving chip 60, The printed circuit board 30 and the like can be protected.

The bonding layer 70 may include at least one of an epoxy resin, a urethane resin, a UV curable resin, and an instant adhesive.

When the bonding layer 70 is made of a UV curable resin, the case 40 may be formed of a transparent plastic resin so as to easily transmit ultraviolet (UV) light to the bonding layer 70 located inside the case 40.

The coating layer 20 may be provided on the first side 32 of the printed circuit board 30 to protect the fingerprint sensor 50 and the driving chip 60 from external impacts and foreign matter.

The coating layer 20 may be bonded to the first side 32 to have a flat surface.

The coating layer 20 may include at least one of a plastic resin, a UV curable resin, an epoxy resin, and a urethane resin.

When the coating layer 20 is made of a UV curable resin which is cured by ultraviolet rays (UV), the coating layer 20 may have a transparent material so that ultraviolet rays are easily transmitted.

The thickness of the coating layer 20 may be 20 탆 or less, but is not limited thereto.

The coating layer 10 may be provided on the coating layer 20 to protect the fingerprint sensor 50, the printed circuit board 30, the driving chip 60 and the coating layer 20. The paint layer 10 may represent various colors or patterns.

The coating layer 10 may comprise a first layer (not shown), a second layer (not shown) and a third layer (not shown).

The first layer is provided on the coating layer 20 and serves as a primer. The thickness of the first layer may be 3 탆 or more and 5 탆 or less, but is not limited thereto.

The second layer is provided on the first layer, and a paint or dye may be added. The thickness of the second layer may be 3 탆 or more and 10 탆 or less, but is not limited thereto.

The third layer is provided on the second layer and may have a transparent material. The thickness of the third layer may be 25 탆 or more, but is not limited thereto.

A pattern or a pattern may be displayed on the second layer or the third layer of the coating layer 10 so that the fingerprint recognition device 1 can recognize that the fingerprint recognition sensor 50 is embedded in the fingerprint recognition device 1 from the outside. As an example of a pattern or pattern, a human fingerprint shape can be displayed. The pattern or pattern is not limited to the above example, and may be various.

A pattern or pattern indicating the presence of the fingerprint recognition sensor 50 can be displayed on the coating layer 10 by at least one of printing, engraving and laser processing. Or may be attached to the paint layer 10 in the form of a sticker. The pattern or pattern display method is not limited to the above example.

The thickness of the coating layer 10 may be 45 탆 or less, but is not limited thereto.

The structure including the fingerprint recognition sensor 50 and the printed circuit board 30 disposed below the coating layer 20 can be used as long as the coating layer 20 is made of a transparent UV curable resin, Is visible from the outside. In order to prevent this, the paint layer 10 must be formed thick. As the thickness of the paint layer 10 increases, the sensitivity of the fingerprint recognition sensor 50 decreases. Therefore, the transparent UV curable resin, which forms the coating layer 20, is coated with a color similar to that of the second layer of the coating layer 10 while keeping the thickness of the coating layer 10 thin, Of a dye can be added.

5 is a view showing a state in which a first surface of a printed circuit board provided in a fingerprint recognition device according to an embodiment of the present invention is in close contact with a flat surface of a pressing device.

The sensitivity of the fingerprint recognition sensor 50 is preferably such that the surface of the fingerprint recognition sensor 50 is flat and the thickness of the coating layer 10 is thin. A pressing device 80 may be used to flatten the surface of the fingerprint recognition sensor 50 and the surface of the coating layer 20 disposed on the fingerprint recognition sensor 50. [

As shown in FIG. 5, the pressurizing device 80 may have at least one flat third surface 81.

The fingerprint recognition device 1a in which the printed circuit board 30 passes through the third hole 42c and is coupled to the case 40 is configured such that the fingerprint recognition sensor 50 is mounted on the flat third surface 81). When the bonding layer 70 is injected into the case 40 through at least one of the plurality of holes 42a, 42b and 42c formed on the bottom surface 41 of the first plate 44, The driving chip accommodating portion 72 and the support portion 71 for supporting the second surface 33 are formed. Through this process, a flat fingerprint sensor 50 like the third surface 81 of the pressure device 80 can be formed.

A fingerprint recognition device (not shown) in which the coating layer 20 is formed such that the third surface 81 of the pressing device 80 and the surface of the coating layer 20 are in contact with each other can be pressed to obtain a flat coating layer 20 .

The positions of the pressurizing device 80 and the fingerprint recognizing device 1a may be changed.

6 is a perspective view showing an external appearance of an electronic device according to an embodiment of the present invention.

As shown in FIG. 6, the electronic device 100 has a bar-shaped body. However, the body of the electronic device 100 is not limited to a bar shape, and can be applied to various structures such as a slide type, a folder type, a swing type, and a swivel type in which bodies are relatively movably coupled.

The body includes a casing forming the appearance. The body may be composed of a front casing 101, a rear casing 102 and a battery cover (not shown). Various electronic components are embedded in the space formed between the front casing 101 and the rear casing 102. At least one intermediate casing may be additionally disposed between the front casing 101 and the rear casing 102. [

The casings may be formed by injection molding a synthetic resin or may be formed to have a metal material such as stainless steel (STS), aluminum (Al), titanium (Ti) or the like.

A display module 104, an acoustic output unit 105, a camera 106, a user input unit 107, a microphone (not shown), an interface (not shown), and the like are disposed in the front casing 101 .

The display module 104 occupies most of the main surface of the front casing 101. A sound output unit 105 and a camera 106 are disposed in an area adjacent to one end of both ends of the display module 104 and a user input unit 107 and a microphone (not shown) are disposed in an area adjacent to the other end. The user input unit 107 and an interface (not shown) may be disposed on the side surfaces of the front casing 101 and the rear casing 102.

The user input unit 107 is operated to receive a command for controlling the operation of the electronic device 100 and may include a plurality of operation units (not shown). The operating units may also be referred to as a manipulating portion and may be employed in any manner as long as the user is operating in a tactile manner with a tactile impression.

The user input unit 107 may include a home key 108 having a fingerprint recognition device (not shown). A fingerprint recognition sensor is provided in the fingerprint recognition device, and a fingerprint recognition sensor senses a difference in capacitance caused by a difference in electrical characteristics between the fingerprint bone and the acid. The electrostatic signal is converted into an electrical signal, amplified through an amplifier (not shown), and transmitted to a microcomputer of the electronic device 100 through a connector such as a printed circuit board (not shown).

The fingerprint recognition apparatus can be used to support a user authentication mode using an electric field, a capacitor, a thermistor, or the like.

The user authentication mode refers to a mode in which user authentication is performed by contacting a body part such as a finger with a fingerprint recognition sensor. For example, when a user places a finger on the fingerprint recognition device, the fingerprint recognition sensor provided in the fingerprint recognition device recognizes the fingerprint of the user and compares the fingerprint with the already stored fingerprint data to determine whether the user is a rightful user Verify.

A fingerprint identification device may be provided for all devices requiring authentication procedures. For example, electronic devices, medical devices, and ATMs including information terminals, smart phones, game machines, PMPs, tablet PCs, and cameras can be included.

The foregoing has shown and described specific embodiments. However, it should be understood that the present invention is not limited to the above-described embodiment, and various changes and modifications may be made without departing from the technical idea of the present invention described in the following claims .

1 (1a): fingerprint recognition device 10: paint layer
20: Coating layer 30: Printed circuit board
31: printed circuit board output terminal 32: first side
33: second surface 40: case
41: bottom surface 42: hole
43: inner space 44: first plate
45: second plate 46: guide
50: fingerprint recognition sensor 60: driving chip
70: bonding layer 71:
72: driving chip accommodating portion 80: pressing device
81: Third side 100: Electronic device
101: front casing 102: rear casing
104: Display module 105: Acoustic output section
106: camera 107: user input
108: Home key 42c: Third hole
42a: first hole 42b: second hole

Claims (20)

A case having a plurality of holes formed in its bottom surface and having an inner space;
A printed circuit board on which a sensor for detecting a sensing signal for fingerprint recognition is provided on a first surface and a driving chip electrically connected to the sensor on a second surface facing the case; And
And a bonding layer that fills at least one of the plurality of holes and forms a driving chip accommodating portion capable of accommodating the driving chip in the inner space, and bonding the printed circuit board to the case. Recognition device. The method according to claim 1,
Wherein the bonding layer further comprises a support portion extending from the drive chip receiving portion and contacting the second surface. The method according to claim 1,
Wherein one end of the printed circuit board is bent through one of the plurality of holes formed in a bottom surface of the case. The method of claim 3,
Wherein the bonding layer seals a space between the printed circuit board and the case so as to prevent foreign matter from entering the inside of the case. The method according to claim 1,
Wherein the bonding layer comprises at least one of an epoxy resin, a urethane resin, a UV curable resin, and an instant adhesive. 6. The method of claim 5,
When the bonding layer is made of the UV curable resin,
Wherein the case is formed of a transparent plastic resin so that ultraviolet rays (UV) can be easily transmitted when the bonding layer is cured. The method according to claim 1,
And a coating layer provided on the first surface to protect the sensor from an external impact. 8. The method of claim 7,
Wherein the coating layer is coupled to the first surface and has a flat surface. 8. The method of claim 7,
Further comprising a coating layer provided on the coating layer so as to protect the printed circuit board and the coating layer and to express a color or a pattern. 10. The method of claim 9,
Wherein the coating layer comprises at least one of a plastic resin, a UV curable resin, an epoxy resin, and a urethane resin. 11. The method of claim 10,
Wherein the coating layer is made of a transparent UV curable resin so that ultraviolet rays can be easily transmitted when ultraviolet light (UV) is irradiated. 12. The method of claim 11,
Wherein a dye of a color similar to that of the coating layer is added to the transparent UV curable resin so that the thickness of the coating layer is kept thin and the shape of the coating layer is shielded. 10. The method of claim 9,
Wherein a pattern is displayed on the coating layer so that the function and existence of the sensor can be recognized from the outside. 14. The method of claim 13,
Wherein the pattern is displayed on the coating layer by at least one of printing, engraving, and laser processing. A printed circuit board having a first surface provided with a fingerprint recognition sensor and a second surface provided with a driving chip electrically connected to the fingerprint recognition sensor passes through one of a plurality of holes formed in a bottom surface of the case, Respectively,
The pressure is applied to the printed circuit board in such a manner that the flat third surface of the pressure device and the fingerprint sensor come into contact with each other so that the fingerprint recognition sensor is flat,
Wherein when the bonding layer is injected through at least one of the plurality of holes, the driving chip is accommodated in the driving chip accommodating portion formed in the bonding layer, the supporting portion formed in the bonding layer supports the second surface,
Providing a coating layer on the first surface to protect the sensor from foreign matter,
Applying pressure such that the third surface and the surface of the coating layer are in contact with the pressing device so that the coating layer is flat,
Wherein a coating layer is provided on the coating layer so as to express a color or a pattern. A case having a plurality of holes formed in its bottom surface and having an inner space;
A printed circuit board having a first surface provided with a fingerprint recognition sensor and a second surface facing the case provided with a driving chip for converting an electrostatic signal generated from the fingerprint recognition sensor into an electrical signal;
A bonding layer forming a driving chip accommodation portion recessed toward the bottom surface of the case so as to receive the driving chip in the inner space and forming a support portion extending from the driving chip accommodation portion and contacting the second surface;
A coating layer provided on the first surface to protect the fingerprint recognition sensor from an external impact; And
And a coating layer provided on the coating layer so as to protect the printed circuit board and the coating layer and to express a color or a pattern. 17. The method of claim 16,
Wherein the first surface and the coating layer are flat. 17. The method of claim 16,
Wherein the coating layer comprises:
A first layer provided on the coating layer;
A second layer provided on the first layer and to which a paint or dye can be added; And
And a third layer provided on the second layer and having a transparent material,
Wherein a pattern or a pattern is displayed on the second layer or the third layer so that the function and existence of the fingerprint recognition sensor can be recognized from outside. 19. The method of claim 18,
The coating layer includes a transparent UV curable resin to facilitate ultraviolet (UV) irradiation,
Wherein a dye of a color similar to that of the second layer is added to the transparent UV cured resin so that the shape of the lower part of the coating layer is shielded. 17. The method of claim 16,
Wherein the bonding layer fills at least one of the plurality of holes.

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