WO2019031824A1 - Waterproof fingerprint sensor module having cover part - Google Patents

Waterproof fingerprint sensor module having cover part Download PDF

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Publication number
WO2019031824A1
WO2019031824A1 PCT/KR2018/008987 KR2018008987W WO2019031824A1 WO 2019031824 A1 WO2019031824 A1 WO 2019031824A1 KR 2018008987 W KR2018008987 W KR 2018008987W WO 2019031824 A1 WO2019031824 A1 WO 2019031824A1
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WO
WIPO (PCT)
Prior art keywords
waterproof
adhesive
main substrate
support
sensor
Prior art date
Application number
PCT/KR2018/008987
Other languages
French (fr)
Korean (ko)
Inventor
박용두
이석준
박동서
Original Assignee
크루셜텍 (주)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 크루셜텍 (주) filed Critical 크루셜텍 (주)
Publication of WO2019031824A1 publication Critical patent/WO2019031824A1/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection

Definitions

  • the present invention relates to a waterproof fingerprint sensor module having a cover portion, and more particularly, to a waterproof fingerprint sensor module having a cover portion that can be protected from moisture.
  • a portable electronic device incorporates a touch screen integrated with a display as a display device as one of input devices for receiving a specific command from a user.
  • the portable electronic device may include various function keys or soft keys as input devices other than the touch screen.
  • function keys or soft keys may act as home keys, for example, to exit a running application and return to the home screen, or to return the user interface to a previous layer, And can operate as a menu key for calling up a write menu.
  • Such a function key or a soft key may be realized by a method of sensing the capacitance of the conductor, a method of sensing the electromagnetic wave of the electromagnetic pen, or a hybrid method in which both methods are implemented, and may be implemented as a physical button.
  • Biometric information includes fingerprints, veins of the hand, voices, irises, and fingerprint sensors are widely used as biometric sensors.
  • the fingerprint sensor is a sensor for detecting the fingerprint of a human being. By performing a user registration or authentication procedure through a fingerprint sensor, data stored in the portable electronic device can be protected and a security accident can be prevented in advance.
  • the fingerprint sensor can be manufactured in the form of a module including peripheral parts or structures, and can be effectively integrated in various electronic devices since it can be integrated in a physical function key.
  • a navigation function for performing operations of a pointer such as a cursor
  • the fingerprint sensor of this type is called a biometric track pad (BTP) .
  • capacitive type There are capacitive type, optical type, ultrasonic type, thermal type, non-contact type, and so on.
  • capacitive type fingerprint sensor which is excellent in sensitivity, robust against external environmental change and excellent in compatibility with portable electronic devices, It is widely used.
  • the portable electronic device having the fingerprint sensor may be exposed to a variety of external environments. For example, moisture may be inevitably introduced in a place where it can be in contact with water or in an environment such as rainy weather.
  • a fingerprint sensor mounted on a portable electronic device is exposed to the outside of a portable electronic device to easily acquire fingerprint information of a user. Accordingly, a fingerprint sensor itself is required to have high waterproof performance.
  • FIG. 1 is a cross-sectional view illustrating a conventional fingerprint sensor module.
  • the sensor unit 200 may be mounted on the main board 100, and the cover unit 300 may be provided on the sensor unit 200. Referring to FIG. 1
  • the support part 400 may be mounted on the main board 100 and may cover the sensor part 200 and the cover part 300 from the side.
  • the supporting portion 400 may be coupled to the main substrate 100 through the adhesive member 500.
  • a terminal 110 for electrically connecting the sensor unit 200 and the main substrate 100 may be disposed between the sensor unit 200 and the main substrate 100.
  • the sensor unit 200 may include a terminal 110 for electrically connecting the sensor unit 200 and the main substrate 100, A space may be formed between the main substrate 100 and the main substrate 100.
  • an adhesive member 500 is provided at a crossing point C where a space between the support part 400 and the main substrate 100 meets the main substrate 100, the sensor part 200 and the support part 400 , Or a separate waterproof structure is provided to protect the sensor unit 200 from moisture or moisture introduced from the outside.
  • a plasma display panel comprising: a main substrate; A sensor unit mounted on the main board; A cover part provided on the upper part of the sensor part; A support unit provided on the main board and surrounding the sensor unit and the cover unit; And a cover member including a bonding member for bonding the main board, the sensor unit, and the supporting unit, and a waterproofing unit formed on a bonding surface of the supporting unit contacting the adhesive member.
  • the first waterproof portion may be formed on the lower joint surface of the support portion facing the upper surface of the main board when the main board and the support portion are coupled.
  • the first waterproof portion may be formed of a waterproof groove.
  • the first waterproof portion may be formed in a plurality of lengthwise directions along the lower joint surface.
  • the lower bonding surface has a first bonding surface and a second bonding surface, the first bonding surface and the second bonding surface being different from each other, the first bonding surface and the second bonding surface being connected to the first waterproof portion,
  • the first thickness T1 to the surface may be made thicker than the second thickness T2 from the reference surface B of the support to the second bonding surface.
  • a second waterproof portion may be formed on a side joint surface of the support portion facing the side surface of the sensor portion.
  • the second waterproof portion may be formed of a waterproof groove.
  • the second waterproof portion may be formed in a plurality of along the longitudinal direction of the side joint surface.
  • the lower joint surface may have a third joint surface and a fourth joint surface which are different in height from each other connected to the second waterproof portion.
  • the supporting portion may be formed with a chamfer so that a receiving space is formed at an intersection where the main substrate, the sensor portion, and the supporting portion meet.
  • the adhesive member includes: a first adhesive that is filled in a void space between the main substrate and the sensor unit; And a second adhesive interposed between the main substrate and the support, and bonding the main substrate, the sensor and the support, wherein the first adhesive may have a lower viscosity in a liquid state than the second adhesive.
  • the bonding member further includes a third adhesive for bonding the bonding surface of the conductive member provided on the main substrate and the supporting member facing the conductive member, May be made of a non-conductive material, and the third adhesive may be made of a conductive material.
  • the support portion may be electrically connected to the main board through the third adhesive.
  • the support unit may be configured to transmit a driving signal to the sensor unit.
  • the waterproof effect of the waterproof fingerprint sensor module can be improved by forming the waterproof portion on the inner side of the support portion abutting the adhesive member.
  • the adhesive member filled in the waterproof portion can prevent the support portion from deviating and shaking.
  • the waterproof fingerprint sensor module can not be attached to moisture or moisture
  • the waterproof effect can be excellent.
  • the waterproof effect of the waterproof fingerprint sensor module can be further improved.
  • the waterproof effect is improved by only the adhesive member without the separate waterproof structure, the manufacturing is simple and the manufacturing process can be simplified.
  • FIG. 1 is a cross-sectional view illustrating a conventional fingerprint sensor module.
  • FIG. 2 is a cross-sectional view illustrating a waterproof fingerprint sensor module according to a first embodiment of the present invention.
  • FIG. 3 is a cross-sectional view illustrating a waterproof fingerprint sensor module according to a second embodiment of the present invention.
  • FIG. 4 is a cross-sectional view illustrating a waterproof fingerprint sensor module according to a third embodiment of the present invention.
  • FIG. 5 is a cross-sectional view illustrating a waterproof fingerprint sensor module according to a fourth embodiment of the present invention.
  • FIG. 6 is a cross-sectional view illustrating a waterproof fingerprint sensor module according to a fifth embodiment of the present invention.
  • FIG. 7 is a cross-sectional view illustrating a waterproof fingerprint sensor module according to a sixth embodiment of the present invention.
  • FIG. 8 is a cross-sectional view illustrating a waterproof fingerprint sensor module according to a seventh embodiment of the present invention.
  • FIG. 9 is a cross-sectional view schematically showing the shape of the waterproof portion according to the present invention.
  • the upper part and the lower part mean that they are located above or below the object member, and does not necessarily mean that they are located at the upper or lower part with respect to the gravity direction.
  • FIG. 2 is a cross-sectional view illustrating a waterproof fingerprint sensor module according to a first embodiment of the present invention.
  • the waterproof fingerprint sensor module 1000 includes a main substrate 100, a sensor unit 200, a cover unit 300, a support unit 400, (500).
  • the main board 100 can mount the sensor unit 200.
  • the main board 100 may be a printed circuit board (PCB) or a flexible printed circuit board (FPCB) capable of transmitting electrical signal information.
  • PCB printed circuit board
  • FPCB flexible printed circuit board
  • the sensor unit 200 is a sensor capable of sensing an image of a fingerprint, and various sensing methods can be used.
  • the sensor unit 200 may sense an image of a fingerprint using a capacitive method, an optical method, an ultrasonic method, a heat sensing method, or a non-contact method.
  • the sensor unit 200 can detect a difference in capacitance due to the height difference between the peak and the peak of the fingerprint, and can transmit the sensed signal to a controller (not shown). Then, the control unit can acquire an image of the fingerprint based on the received signal.
  • the sensor unit 200 may include various types of sensing structures for sensing fingerprints.
  • the sensor unit 200 may include a plurality of sensing pixels arranged two-dimensionally.
  • the sensor unit 200 may include a plurality of line-type driving electrodes and receiving electrodes.
  • the sensor unit 200 may include a plurality of image receiving units of the AREA type.
  • the sensor unit 200 may be electrically connected to the main substrate 100 through the terminal 110.
  • the cover part 300 may be provided on the upper part of the sensor part 200.
  • the cover unit 300 is configured to protect the sensor unit 200 from external impacts or foreign matter.
  • the cover part 300 may be formed of various materials such as a coating material, a glass material, or a ceramic material.
  • cover portion 300 when the cover portion 300 is made of a glass material, various glass substrates such as a soda lime glass substrate, a non-alkali glass substrate, or a tempered glass substrate can be applied.
  • the cover 300 may be made of a material selected from the group consisting of sapphire, zirconium, and transparent resin.
  • the transparent resin may be acrylic or the like.
  • the cover portion 300 may have a color according to apparent requirements. At this time, the cover part 300 may have a color in various ways. For example, the cover portion 300 may have a color layer therein. Alternatively, the cover part 300 may have a separate color layer on the back surface of the cover part 300. [ Alternatively, the cover portion 300 may include a material capable of implementing colors.
  • the support part 400 may be provided on the main board 100 and may cover the sides of the sensor part 200 and the cover part 300.
  • the support portion 400 may be a bezel.
  • the supporting part 400 may be coupled to the main board 100 through a bonding material 500 made of a resin material.
  • the adhesive member 500 may be made of a non-conductive epoxy material.
  • the support portion 400 may have a lower bonding surface 410 and a side bonding surface 420.
  • the lower bonding surface 410 may be one surface of the supporting part 400 facing the upper surface of the main substrate 100 when the supporting part 400 and the main substrate 100 are coupled to each other.
  • the side joint surface 420 may be one surface of the support portion 400 facing the side surface of the sensor portion 200 when the support portion 400 and the main substrate 100 are coupled.
  • the lower bonding surface 410 may be horizontal, and the side bonding surface 420 may be vertical.
  • the first waterproof portion 401 may be formed on the support portion 400.
  • the first waterproofing part 401 may be formed in a semicircular shape on the horizontal lower bonding surface 410.
  • the shape of the first waterproofing part 401 is merely an example, and the first waterproofing part 401 may have various shapes.
  • the waterproof portion may have the form of a waterproof protrusion protruding from the joint surface of the support portion 400, not the structure of the waterproof groove recessed from the joint surface of the support portion 400.
  • the waterproof portion is a waterproof groove.
  • the first waterproof portion 401 may be filled with a bonding material 500 made of a resin material.
  • the first waterproof portion 401 may be formed at a position spaced apart from a corner where the lower bonding surface 410 and the side bonding surface 420 meet.
  • the first waterproofing part 401 is formed in a plurality of pieces along the longitudinal direction of the lower jointing surface 410.
  • the contact area between the support portion 400 and the adhesive member 500 can be widened.
  • the coupling force between the support portion 400 and the adhesive member 500 can be improved.
  • the infiltration path of water or moisture penetrated from the outside becomes longer, and the waterproof fingerprint sensor module 1000 The waterproof effect can be improved.
  • the improvement in the coupling force between the support part 400 and the adhesive member 500 effectively blocks water or moisture that may flow into the space between the support part 400 and the adhesive member 500. Therefore, the waterproof quality and durability of the waterproof fingerprint sensor module 1000 can be further improved.
  • the adhesive member 500 cured in the state of being filled in the first waterproofing portion 401 can prevent the support portion 400 from being separated and shaken even if a force exceeding a predetermined level is applied to the left and right directions of the support portion 400 can do. That is, the support member 400 can be prevented from moving in the left and right directions by the adhesive member 500 filled in the first waterproof portion 401.
  • the waterproof portion having the same function as the first waterproof portion 401 may be formed on the main board 100 as well.
  • FIG. 3 is a cross-sectional view illustrating a waterproof fingerprint sensor module according to a second embodiment of the present invention. Structures referred to by the same reference numerals as those shown in FIG. 2 have the same functions, A description thereof will be omitted.
  • the cover portion 300 of the waterproof fingerprint sensor module 1100 according to the second embodiment of the present invention may be formed of glass or ceramic which requires the shape processing in advance.
  • the waterproof fingerprint sensor module 1100 will be described by way of example in which the cover part 300 is a glass.
  • the cover part 300 of the glass can be attached to the upper surface of the sensor part 200 after the shape processing is performed in advance, unlike the cover part formed through the coating process.
  • FIG. 3 (a) is a cross-sectional view illustrating a state in which the cover unit 300 and the sensor unit 200 are coupled to each other at an accurate coupling position in attaching the cover unit 300 to the sensor unit 200
  • FIG. 3 (b) is a cross-sectional view showing a state in which the cover unit 300 is attached to the sensor unit 200 in a state where the cover unit 300 is slightly biased.
  • 3B shows a state in which the cover unit 300 is finely biased to one side due to a shape error of the cover unit 300 or a process error in the process of attaching the cover unit 300 and the sensor unit 200.
  • the distance between the support portion 400 and the cover portion 300 is set to be larger than the gap between the support portion 400 and the cover portion 300, Can be increased.
  • the waterproof fingerprint sensor module 1100 having the glass cover part 300 is particularly important for waterproof processing. Accordingly, the second embodiment of the present invention provides a waterproof fingerprint sensor module 1100 that is improved in waterproof function and is prevented from lifting the supporting part 400.
  • the waterproof fingerprint sensor module 1100 may include a main substrate 100, a sensor unit 200, a cover unit 300, a support unit 400, and an adhesive member 500 .
  • the supporting portion 400 may be chamfered at the corner portions of the lower bonding surface 410 and the side bonding surface 420. That is, the lower bonding surface 410 and the side bonding surface 420 may be connected with the chamfer surface 430 therebetween.
  • the edge portions where the lower bonding surface 410 and the side bonding surface 420 of the support portion 400 meet are chamfered so that the intersection points where the main substrate 100, the sensor unit 200, The space S can be formed.
  • the adhesive member 500 is applied over a predetermined amount in the process of manufacturing the waterproof fingerprint sensor module 1100 as the chamfered surface 430 is formed in the support part 400, And can be stably coupled to a predetermined position on the main substrate 100.
  • the fixed position of the support portion 400 coupled to the main board 100 refers to a preset connection position at which the support portion 400 is to be installed in the manufacturing process of the waterproof fingerprint sensor module 1100.
  • the excessively applied adhesive member 500 is introduced into the accommodation space S in the process of coupling the support portion 400 and the main substrate 100 .
  • the amount of the adhesive member 500 interposed between the supporting part 400 and the main substrate 100 is maintained, and the supporting part 400 can be coupled to the predetermined position on the main substrate 100 without lifting .
  • the first waterproof portion 401 is formed in the support portion 400 so that the first waterproof portion 401 is formed in the first region A1 as shown in Figure 3 (b) Moisture or moisture introduced through the second area A2 can be prevented from moving to the second area A2.
  • the waterproof fingerprint sensor module 1100 when the waterproof fingerprint sensor module 1100 is mounted on the portable terminal device, moisture or moisture may flow between the support part 400 and the cover part 300 through the first area A1
  • the first waterproofing portion 401 is formed on the supporting portion 400 of the waterproof fingerprint sensor module 1100 so that the element 2 provided in the second region A2, which is a lower region of the display portion 1, It is possible to prevent malfunction and breakage due to moisture or moisture introduced from the first region A1.
  • FIG. 4 is an exemplary sectional view showing a waterproof fingerprint sensor module according to a third embodiment of the present invention. Structures referred to by the same reference numerals as those shown in FIGS. 2 and 3 have the same functions, A detailed description thereof will be omitted.
  • the waterproof fingerprint sensor module 1200 according to the third embodiment of the present invention may be configured such that the height of the joint surfaces connected to both sides of the first waterproof portion 401 are different from each other.
  • the lower bonding surface 410 of the support part 400 may include a first bonding surface 411 and a second bonding surface 412.
  • the first joint surface 411 is connected to one end of the first waterproof portion 401 and the second joint surface 412 is connected to the other end of the first waterproof portion 401.
  • the first bonding surface 411 and the second bonding surface 412 may be formed to have different heights.
  • the first thickness T1 from the reference surface B to the first bonding surface 411 of the support portion 400 on which the lower bonding surface 410 is formed is smaller than the first thickness T1 between the reference surface B and the first bonding surface 411, May be made thicker than the second thickness (T2) from the reference plane (B) to the second bonding surface (412).
  • the distance between the first bonding surface 411 and the upper surface of the main substrate 100 is greater than the distance between the second bonding surface 412 and the main substrate 100
  • the distance between the upper surfaces of the first and second electrodes may be shorter than the distance between the upper surfaces. 4, when the support 400 is attached to the main substrate 100, the adhesive member 500 can be prevented from leaking into the second area A2.
  • the adhesive member 500 passes through the chamfer surface 430 Can be guided to the side joint surface 420 side.
  • the adhesion member 500 guided to the side joint surface 420 improves the bonding force between the support part 400 and the sensor part 200.
  • the improvement in the coupling force between the support part 400 and the sensor part 200 effectively blocks moisture or moisture that may flow through the first area A1. Therefore, the waterproof quality and durability of the waterproof fingerprint sensor module 1200 can be further improved.
  • FIG. 5 is a cross-sectional view illustrating a waterproof fingerprint sensor module according to a fourth embodiment of the present invention. Structures referred to by the same reference numerals as those shown in Figs. 2 to 4 have the same functions, A detailed description thereof will be omitted.
  • the waterproof fingerprint sensor module 1300 according to the fourth embodiment of the present invention may further include a second waterproof part 402. That is, the second waterproof portion 402 may be further formed on the side joint surface 420.
  • the second waterproof portion 402 may be formed in a semi-circular shape on the side joint surface 420 and may be recessed. It is needless to say that the second waterproof portion 402 may have various shapes other than the semicircular shape.
  • the second waterproof portion 402 may be filled with a bonding material 500 made of a resin material.
  • the second waterproof portion 402 may be formed at a position spaced apart from the end portion of the chamfer surface 430 by a predetermined distance.
  • the second waterproofing part 402 is formed in a plurality of pieces along the longitudinal direction of the side jointing surface 420.
  • the second waterproofing part 402 may include a plurality of second waterproofing parts 402, Of course it is possible.
  • the contact area between the support portion 400 and the adhesive member 500 can be widened.
  • the coupling force between the support portion 400 and the adhesive member 500 can be improved.
  • the joining area of the support part 400 and the adhesive member 500 is widened through the second waterproof part 402, the penetration path of moisture or moisture becomes long, and the waterproof effect of the waterproof fingerprint sensor module 1300 is Can be further improved.
  • the improvement in the bonding force between the support part 400 and the adhesive member 500 effectively blocks moisture or moisture that may flow through the first area A1.
  • the adhesive member 500 cured in the state of being filled in the second waterproofing portion 402 prevents the support portion 400 from being separated and shaken even if a force exceeding a predetermined level is applied to the support portion 400 in a downward direction. That is, the support member 400 can be prevented from moving upward and downward by the adhesive member 500 filled in the second waterproof portion 402.
  • FIG. 6 is a cross-sectional view illustrating a waterproof fingerprint sensor module according to a fifth embodiment of the present invention. Structures referred to by the same reference numerals as those shown in Figs. 2 to 5 have the same functions. A detailed description thereof will be omitted.
  • the waterproof fingerprint sensor module 1400 has the first waterproof portion 401 and the second waterproof portion 402 formed on the support portion 400 and the two sides of the first waterproof portion 401
  • the first joining surface 411 and the second joining surface 412 may be formed to have different heights.
  • the third joint surface 421 and the fourth joint surface 422, which are connected to both sides of the second waterproof portion 402 formed on the side joint surface 420, may have different heights. Thus, when the support portion 400 is attached, the adhesive member 500 can be prevented from leaking into the first region A1.
  • the support portion 400 having the first joint surface 411 and the second joint surface 412 can be adjusted in height and the third joint surface 421 and the fourth joint surface 422 can be adjusted in height,
  • the supporting part 400 and the main substrate 100 and the sensor part 200 are firmly fixed to each other by having the structure in which the adhesive member 500 is simultaneously guided to the chamfered surface 430 side in the process of attaching the main substrate 100 to the main substrate 100 Can be combined.
  • the waterproof function of the waterproof fingerprint sensor module 1400 can be improved.
  • FIG. 7 is a cross-sectional view illustrating a waterproof fingerprint sensor module according to a sixth embodiment of the present invention. Structures referred to by the same reference numerals as those shown in FIGS. 2 to 6 have the same functions, A detailed description thereof will be omitted.
  • the waterproof fingerprint sensor module 1500 may include an adhesive member 500 'having a different type of adhesive.
  • the adhesive member 500 ' may include a first adhesive 510 and a second adhesive 520.
  • the first adhesive 510 and the second adhesive 520 may be different kinds of adhesives having different physical properties.
  • the first adhesive 510 and the second adhesive 520 may be made of a non-conductive material.
  • the first adhesive 510 may have a lower viscosity in the liquid state than the second adhesive 520.
  • the first adhesive 510 is formed to fill a space between the sensor unit 200 and the main substrate 100 generated by the terminals 110 electrically connecting the main substrate 100 and the sensor unit 200 .
  • the first adhesive 510 may be cured while being supplied to the space between the sensor unit 200 and the main substrate 100.
  • the viscosity of the first adhesive 510 in the liquid phase state is low so as to fill the void space between the sensor unit 200 and the main substrate 100, It is possible to effectively block the moisture or moisture that flows into the apparatus.
  • the second adhesive 520 is applied to the supporting portion 400, the main substrate 100, and the sensor substrate 100 in a state where the first adhesive 510 is primarily filled in the void space between the sensor unit 200 and the main substrate 100. [ (200).
  • the second adhesive agent 520 bonds the support portion 400, the main substrate 100, and the sensor portion 200 while contacting the lower bonding surface 410 and the side bonding surface 420.
  • the second adhesive 520 is made to have a higher viscosity than the first adhesive 510, even if the bonding process of the first adhesive 510 and the second adhesive 520 is continuously or simultaneously performed, 520 can prevent the first adhesive 510 from flowing out to the second area A2.
  • the first adhesive 510 has a viscosity that is permeable to the space between the main substrate 100 and the sensor unit 200 in the liquid phase state, while the second adhesive 520 has the first adhesive 510 The second adhesive 520 can be prevented from leaking to the second area A2 when the support part 400 is attached to the main substrate 100.
  • the adhesive member 500 fills a fine space between the main substrate 100 and the sensor unit 200, 2 area A2 can be prevented from leaking out.
  • the waterproof fingerprint sensor module 1500 can effectively block moisture and moisture that may flow into the terminal 110 by using different kinds of first adhesive 510 and second adhesive 520 having different physical properties together have.
  • FIG. 8 is a cross-sectional view illustrating a waterproof fingerprint sensor module according to a seventh embodiment of the present invention. Structures referred to by the same reference numerals as those shown in Figs. 2 to 7 have the same functions, A detailed description thereof will be omitted.
  • the waterproof fingerprint sensor module 1600 according to the seventh embodiment may include an adhesive member 500 " having a different kind of adhesive as in the sixth embodiment. That is, the waterproof fingerprint sensor module 1600 according to the seventh embodiment 1600 may be bonded to the outer end of the lower bonding surface 410 and the main substrate 100 by the third adhesive 530.
  • Such an adhesive member 500 may include a second adhesive 520 and a third adhesive 530.
  • the second adhesive 520 may be made of a non-conductive material
  • the third adhesive 530 may be made of a conductive material
  • the second adhesive 520 is bonded to the support 400, the main substrate 100, and the sensor unit 200 except the outer end of the lower bonding surface 410.
  • the third adhesive 530 is formed to join the conductive member 120 provided on the upper surface of the main substrate 100 and the end of the lower bonding surface 410 facing the conductive member 120. At this time, since the third adhesive 530 is made of a conductive material, the lower bonding surface 410 and the conductive member 120 can be electrically connected. Accordingly, the main board 100 can be electrically connected to the support portion 400.
  • the conductive member 120 may be electrically connected to the conductive member 120 through the land portion 102 provided on the main substrate 100.
  • the conductive member 120 may be electrically connected to a land portion 102 exposed to the outside through an exposure operation of a PSR (Photo Solder Resist) which is an insulating coating layer 101 applied to the main substrate 100.
  • PSR Photo Solder Resist
  • the second adhesive agent 520 can be prevented from leaking into the second region A2 have.
  • the conductive member 120 Since the upper end of the conductive member 120 provided on the main substrate 100 is formed higher than the upper surface of the main substrate 100, the conductive member 120 is bonded to the second adhesive 520 in the process of attaching the support member 400, Can be prevented from leaking into the second area (A2).
  • the second adhesive 520 which is prevented from leaking to the second area A2, more firmly couples the supporting part 400, the main substrate 100 and the sensor part 200.
  • the supporter 400 electrically connected to the main board 100 through the third adhesive 530 is electrically connected to the sensor unit 200 due to static electricity instantaneously generated during the contact of the user's finger with the sensor unit 200.
  • [ (Electro Static Discharge) function that can prevent damage to the battery 200.
  • the supporting part 400 electrically connected to the main board 100 may transmit a driving signal for the user's fingerprint recognition to the sensor part 200.
  • the waterproof fingerprint sensor module 1600 may be provided with a different kind of adhesive having different physical properties of the first adhesive 510, the second adhesive 520 and the third adhesive 530.
  • FIG. 9 is a cross-sectional view schematically showing the shape of the waterproof portion according to the present invention. Structures referred to by the same reference numerals as those shown in Figs. 2 to 8 have the same functions, Is omitted.
  • the first waterproof portion 401 may have various shapes such as a semicircle, a triangle, a square, and a pentagon.
  • first waterproof portion 401 may be formed along the longitudinal direction of the lower joint surface 410.
  • the plurality of first waterproof portions 401 may have the same shape or different shapes.
  • the first waterproof part 401 formed in the support part 400 has a semicircular shape and the second waterproof part 402 has a first waterproof part 401 formed in a triangular support part 400,
  • the second waterproofing part 402 may have different shapes.
  • the second waterproofing part 402 may have various shapes as well as the first waterproofing part 401.
  • the first waterproofing part 401 and the second waterproofing part 402 have various shapes and can improve waterproof quality and durability of the waterproof fingerprint sensor modules 1000, 1100, 1200, 1300, 1400, 1500, have.
  • first waterproofing part 401 and the second waterproofing part 402 may be in the form of a waterproof protrusion protruding from the joint surface of the support part 400, not the structure of the waterproof groove recessed from the joint surface of the support part 400 Of course.

Abstract

An embodiment of the present invention provides a waterproof fingerprint sensor module having a cover part, the module comprising: a main substrate; a sensor part mounted on the main substrate; a cover part disposed on an upper portion of the sensor part; a support part disposed on the main substrate and covering side surfaces of the sensor part and the cover part; and an adhesive member bonding the main substrate, the sensor part, and the support part, wherein a waterproof part is formed on a bonding surface of the support part, which is in contact with the adhesive member.

Description

커버부를 가진 방수 지문 센서 모듈Waterproof fingerprint sensor module with cover
본 발명은 커버부를 가진 방수 지문 센서 모듈에 관한 것으로, 보다 상세하게는 습기로부터 보호될 수 있는 커버부를 가진 방수 지문 센서 모듈에 관한 것이다.The present invention relates to a waterproof fingerprint sensor module having a cover portion, and more particularly, to a waterproof fingerprint sensor module having a cover portion that can be protected from moisture.
최근 스마트폰(Smartphone)이나 태블릿 피씨(Tablet PC)를 비롯한 휴대용 전자기기에 대하여 대중의 관심이 집중되면서, 관련 기술분야에 대한 연구개발이 활발히 진행되고 있다.BACKGROUND ART [0002] Recently, with the public's attention focused on portable electronic devices including smartphones and tablet PCs, research and development on related technical fields are being actively conducted.
휴대용 전자기기는, 사용자로부터 특정한 명령을 입력받기 위한 입력장치의 하나로서 표시장치인 디스플레이와 일체화된 터치스크린(Touch Screen)을 내장하는 경우가 많다. 또한, 휴대용 전자기기는 터치스크린 이외의 입력장치로서 각종 기능 키(Function Key)나 소프트키(Soft Key)를 구비하기도 한다.In many cases, a portable electronic device incorporates a touch screen integrated with a display as a display device as one of input devices for receiving a specific command from a user. In addition, the portable electronic device may include various function keys or soft keys as input devices other than the touch screen.
이러한 기능키나 소프트키는 홈 키로서 동작할 수 있는데, 예를 들면, 실행중인 애플리케이션을 빠져 나와 초기 화면으로 돌아가는 기능을 수행하거나, 유저 인터페이스를 한 계층 전으로 돌아가게 하는 백(BACK)키 또는 자주 쓰는 메뉴를 호출하는 메뉴키로서 동작할 수 있다. 이러한 기능키나 소프트키는 도전체의 정전 용량을 감지하는 방식, 또는 전자기펜의 전자기파를 감지하는 방식 또는 이 두 가지 방식이 모두 구현된 복합 방식으로 구현될 수 있으며, 물리적 버튼으로 구현될 수 있다.These function keys or soft keys may act as home keys, for example, to exit a running application and return to the home screen, or to return the user interface to a previous layer, And can operate as a menu key for calling up a write menu. Such a function key or a soft key may be realized by a method of sensing the capacitance of the conductor, a method of sensing the electromagnetic wave of the electromagnetic pen, or a hybrid method in which both methods are implemented, and may be implemented as a physical button.
한편, 최근 휴대용 전자기기의 용도가 보안이 필요한 서비스로 급격히 확장됨에 따라, 높은 보안성의 이유로 생체정보를 측정하는 기능을 갖는 생체인식 센서(Biometric Sensor)를 휴대용 전자기기에 장착하려는 추세가 늘고 있다.In recent years, as the use of portable electronic devices has rapidly expanded to services requiring security, there has been an increasing tendency to install biometric sensors having functions of measuring biometric information on portable electronic devices for reasons of high security.
생체정보로는 지문, 손등의 혈관, 목소리, 홍채 등이 있으며, 생체인식 센서로는 지문센서가 많이 사용되고 있다.Biometric information includes fingerprints, veins of the hand, voices, irises, and fingerprint sensors are widely used as biometric sensors.
지문센서는 인간의 손가락 지문을 감지하는 센서로서, 지문센서를 통해 사용자 등록이나 인증 절차를 거치도록 함으로써, 휴대용 전자기기에 저장된 데이터를 보호하고, 보안사고를 미연에 방지할 수 있다.The fingerprint sensor is a sensor for detecting the fingerprint of a human being. By performing a user registration or authentication procedure through a fingerprint sensor, data stored in the portable electronic device can be protected and a security accident can be prevented in advance.
지문센서는 주변 부품이나 구조를 포함하는 모듈의 형태로 제조될 수 있고, 물리적인 기능키에 일체화되어 구현될 수 있기 때문에, 각종 전자기기에 효과적으로 장착될 수 있다.The fingerprint sensor can be manufactured in the form of a module including peripheral parts or structures, and can be effectively integrated in various electronic devices since it can be integrated in a physical function key.
최근에는, 커서와 같은 포인터의 조작을 수행하는 내비게이션 기능을 지문센서에 통합하기도 하는 등 그 활용 정도가 더욱 넓어지고 있는데, 이러한 형태의 지문센서를 바이오매트릭 트랙패드(BTP: Biometric Track Pad)라 한다.In recent years, a navigation function for performing operations of a pointer, such as a cursor, has been integrated into a fingerprint sensor. The fingerprint sensor of this type is called a biometric track pad (BTP) .
지문센서의 종류에는 정전용량식, 광학식, 초음파 방식, 열감지 방식, 비접촉 방식 등이 있으나, 감도가 우수하고 외부 환경변화에 강인하며 휴대용 전자기기와의 정합성이 우수한 정전용량 방식의 지문센서가 최근 많이 사용되고 있다.There are capacitive type, optical type, ultrasonic type, thermal type, non-contact type, and so on. However, capacitive type fingerprint sensor which is excellent in sensitivity, robust against external environmental change and excellent in compatibility with portable electronic devices, It is widely used.
한편, 지문센서가 실장된 휴대용 전자기기는 다양한 외부환경에 노출될 수 있는데, 예를 들어 물과 접촉할 수 있는 장소에 있거나 우천 시 등의 환경에서 불가피하게 수분의 유입이 이루어질 수 있다.Meanwhile, the portable electronic device having the fingerprint sensor may be exposed to a variety of external environments. For example, moisture may be inevitably introduced in a place where it can be in contact with water or in an environment such as rainy weather.
특히, 휴대용 전자기기에 실장되는 지문센서는 사용자의 지문정보를 용이하게 획득하기 위하여 대체로 휴대용 전자기기 외부에 노출되어 있는데, 이에 따라 지문센서 자체에도 높은 방수성능이 요구되고 있는 실정이다.Particularly, a fingerprint sensor mounted on a portable electronic device is exposed to the outside of a portable electronic device to easily acquire fingerprint information of a user. Accordingly, a fingerprint sensor itself is required to have high waterproof performance.
도 1은 종래의 지문 센서 모듈을 나타낸 단면 예시도이다.1 is a cross-sectional view illustrating a conventional fingerprint sensor module.
도 1에 도시된 바와 같이, 센서부(200)는 메인기판(100) 상에 실장될 수 있으며, 커버부(300)는 센서부(200)의 상부에 구비될 수 있다.1, the sensor unit 200 may be mounted on the main board 100, and the cover unit 300 may be provided on the sensor unit 200. Referring to FIG.
그리고 지지부(400)는 메인기판(100) 상에 실장될 수 있으며, 센서부(200)와 커버부(300)를 측면에서 감쌀 수 있다. 이러한 지지부(400)는 접착부재(500)를 통해 메인기판(100)에 결합될 수 있다.The support part 400 may be mounted on the main board 100 and may cover the sensor part 200 and the cover part 300 from the side. The supporting portion 400 may be coupled to the main substrate 100 through the adhesive member 500.
한편, 센서부(200)와 메인기판(100)의 사이에는 센서부(200)와 메인기판(100)을 전기적으로 연결하기 위한 단자(110)가 위치할 수 있는데, 이로 인해 센서부(200)와 메인기판(100) 사이에는 공간이 형성될 수 있다.A terminal 110 for electrically connecting the sensor unit 200 and the main substrate 100 may be disposed between the sensor unit 200 and the main substrate 100. The sensor unit 200 may include a terminal 110 for electrically connecting the sensor unit 200 and the main substrate 100, A space may be formed between the main substrate 100 and the main substrate 100.
이러한 공간에 외부의 수분 또는 습기가 유입될 경우, 센서부(200)가 오동작되거나 파손될 수 있다. 이에, 종래에는 지지부(400)와 메인기판(100) 사이의 공간과 메인기판(100), 센서부(200) 및 지지부(400)가 만나는 교차지점(C)에 접착부재(500)를 구비하거나, 또는 별도의 방수 구조물을 마련함으로써, 외부로부터 유입되는 수분 또는 습기로부터 센서부(200)를 보호하였다.When external moisture or moisture enters the space, the sensor unit 200 may malfunction or be damaged. Conventionally, an adhesive member 500 is provided at a crossing point C where a space between the support part 400 and the main substrate 100 meets the main substrate 100, the sensor part 200 and the support part 400 , Or a separate waterproof structure is provided to protect the sensor unit 200 from moisture or moisture introduced from the outside.
그러나 접착부재(500)와 맞닿는 지지부 접착면(410)의 평탄도가 낮을 경우, 지지부(400)와 접착부재(500) 사이에 틈이 발생하여, 이러한 틈을 통해 외부의 수분 또는 습기가 유입될 수 있는 문제점이 있었다.However, when the flatness of the supporting part adhesion surface 410 contacting the bonding member 500 is low, a gap is formed between the supporting part 400 and the bonding member 500, and moisture or moisture from the outside is introduced through the gap There was a problem.
이와 같이, 지지부(400)와 접착부재(500) 사이의 틈으로 외부의 수분 또는 습기가 유입되는 경우, 센서부(200)의 오작동이 발생될 수 있다.In this way, when moisture or moisture is introduced into the gap between the support part 400 and the adhesive member 500, malfunction of the sensor part 200 may occur.
상기와 같은 문제점을 해결하기 위한 본 발명의 기술적 과제는, 습기로부터 보호될 수 있는 커버부를 가진 방수 지문 센서 모듈을 제공하는 것이다.SUMMARY OF THE INVENTION It is an object of the present invention to provide a waterproof fingerprint sensor module having a cover portion that can be protected from moisture.
상기 기술적 과제를 달성하기 위하여, 본 발명의 일실시예는 메인기판; 상기 메인기판에 실장되는 센서부; 상기 센서부의 상부에 구비되는 커버부; 상기 메인기판 상에 구비되며, 상기 센서부와 커버부의 측면을 감싸는 지지부; 및 상기 메인기판, 센서부 및 지지부를 접착하는 접착부재를 포함하고, 상기 접착부재와 맞닿는 상기 지지부의 접합면에는 방수부가 형성된 것인 커버부를 가진 방수 지문 센서 모듈을 제공한다.According to an aspect of the present invention, there is provided a plasma display panel comprising: a main substrate; A sensor unit mounted on the main board; A cover part provided on the upper part of the sensor part; A support unit provided on the main board and surrounding the sensor unit and the cover unit; And a cover member including a bonding member for bonding the main board, the sensor unit, and the supporting unit, and a waterproofing unit formed on a bonding surface of the supporting unit contacting the adhesive member.
본 발명의 일실시예에 있어서, 상기 메인기판과 지지부의 결합시, 상기 메인기판의 상면과 마주보는 상기 지지부의 하부 접합면에는 제1 방수부가 형성될 수 있다.In one embodiment of the present invention, the first waterproof portion may be formed on the lower joint surface of the support portion facing the upper surface of the main board when the main board and the support portion are coupled.
본 발명의 일실시예에 있어서, 상기 제1 방수부는 방수홈으로 이루어질 수 있다.In one embodiment of the present invention, the first waterproof portion may be formed of a waterproof groove.
본 발명의 일실시예에 있어서, 상기 제1 방수부는 상기 하부 접합면의 길이 방향을 따라 복수개로 형성될 수 있다.In one embodiment of the present invention, the first waterproof portion may be formed in a plurality of lengthwise directions along the lower joint surface.
본 발명의 일실시예에 있어서, 상기 하부 접합면은 상기 제1 방수부에 각각 연결된 높낮이 서로 다른 제1 접합면과 제2 접합면을 가지되, 상기 지지부의 기준면(B)으로부터 상기 제1 접합면까지의 제1 두께(T1)는 상기 지지부의 기준면(B)으로부터 상기 제2 접합면까지의 제2 두께(T2)보다 두껍도록 이루어질 수 있다.In one embodiment of the present invention, the lower bonding surface has a first bonding surface and a second bonding surface, the first bonding surface and the second bonding surface being different from each other, the first bonding surface and the second bonding surface being connected to the first waterproof portion, The first thickness T1 to the surface may be made thicker than the second thickness T2 from the reference surface B of the support to the second bonding surface.
본 발명의 일실시예에 있어서, 상기 메인기판과 지지부의 결합시, 상기 센서부의 측면과 마주보는 상기 지지부의 측부 접합면에는 제2 방수부가 형성될 수 있다.In one embodiment of the present invention, when the main board and the support are coupled, a second waterproof portion may be formed on a side joint surface of the support portion facing the side surface of the sensor portion.
본 발명의 일실시예에 있어서, 상기 제2 방수부는 방수홈으로 이루어질 수 있다.In one embodiment of the present invention, the second waterproof portion may be formed of a waterproof groove.
본 발명의 일실시예에 있어서, 상기 제2 방수부는 상기 측부 접합면의 길이 방향을 따라 복수개로 형성될 수 있다.In one embodiment of the present invention, the second waterproof portion may be formed in a plurality of along the longitudinal direction of the side joint surface.
본 발명의 일실시예에 있어서, 상기 하부 접합면은 상기 제2 방수부에 각각 연결된 높낮이 서로 다른 제3 접합면과 제4 접합면을 가질 수 있다.In one embodiment of the present invention, the lower joint surface may have a third joint surface and a fourth joint surface which are different in height from each other connected to the second waterproof portion.
본 발명의 일실시예에 있어서, 상기 메인기판, 센서부 및 지지부가 만나는 교차지점에 수용공간이 형성되도록 상기 지지부에는 모따기면이 형성될 수 있다.In one embodiment of the present invention, the supporting portion may be formed with a chamfer so that a receiving space is formed at an intersection where the main substrate, the sensor portion, and the supporting portion meet.
본 발명의 일실시예에 있어서, 상기 접착부재는, 상기 메인기판과 센서부 사이의 빈 공간에 채워지는 제1 접착제; 및 상기 메인기판과 지지부 사이에 개재되며, 상기 메인기판, 센서부 및 지지부를 접착하는 제2 접착제를 포함하며, 상기 제1 접착제는 상기 제2 접착제에 비해 액상상태에서의 점도가 낮을 수 있다.In one embodiment of the present invention, the adhesive member includes: a first adhesive that is filled in a void space between the main substrate and the sensor unit; And a second adhesive interposed between the main substrate and the support, and bonding the main substrate, the sensor and the support, wherein the first adhesive may have a lower viscosity in a liquid state than the second adhesive.
본 발명의 일실시예에 있어서, 상기 접착부재는, 상기 메인기판 상에 구비된 도전성 부재와 상기 도전성 부재와 마주보는 상기 지지부의 접합면을 접착하는 제3 접착제를 더 포함하며, 상기 제2 접착제는 비도전성 소재로 이루어지고, 상기 제3 접착제는 도전성 소재로 이루어질 수 있다.In one embodiment of the present invention, the bonding member further includes a third adhesive for bonding the bonding surface of the conductive member provided on the main substrate and the supporting member facing the conductive member, May be made of a non-conductive material, and the third adhesive may be made of a conductive material.
본 발명의 일실시예에 있어서, 상기 지지부는 상기 제3 접착제를 통해 상기 메인기판과 전기적으로 연결될 수 있다.In an embodiment of the present invention, the support portion may be electrically connected to the main board through the third adhesive.
본 발명의 일실시예에 있어서, 상기 지지부는 상기 센서부로 구동신호를 송출하도록 이루어질 수 있다.In one embodiment of the present invention, the support unit may be configured to transmit a driving signal to the sensor unit.
상기에서 설명한 본 발명에 따른 커버부를 가진 방수 지문 센서 모듈의 효과를 설명하면 다음과 같다.The effect of the waterproof fingerprint sensor module having the cover portion according to the present invention will be described as follows.
본 발명에 따르면, 접착부재와 맞닿는 지지부 내측면에는 방수부가 형성됨에 따라 방수 지문 센서 모듈의 방수 효과는 향상될 수 있다. 그리고 이와 같은 방수부에 채워지는 접착부재는 지지부의 이탈 및 흔들림을 방지할 수 있다.According to the present invention, the waterproof effect of the waterproof fingerprint sensor module can be improved by forming the waterproof portion on the inner side of the support portion abutting the adhesive member. The adhesive member filled in the waterproof portion can prevent the support portion from deviating and shaking.
이에, 글라스로 이루어진 커버부의 형상 오차 또는 커버부와 센서부의 부착과정에서의 공정 오차로 인해 커버부가 한 쪽으로 치우친 상태로 센서부에 부착되더라도 방수 지문 센서 모듈은 외부로부터 유입될 수 있는 수분 또는 습기에 대한 방수 효과가 뛰어날 수 있다.Accordingly, even if the cover part is attached to the sensor part in a state of being biased toward one side due to a shape error of the cover part made of glass or a process error in the process of attaching the cover part and the sensor part, the waterproof fingerprint sensor module can not be attached to moisture or moisture The waterproof effect can be excellent.
본 발명에 따르면, 접착부재는 이종의 접착제를 사용하여 메인기판, 센서부 및 지지부를 접합하도록 이루어짐에 따라 방수 지문 센서 모듈의 방수 효과는 더욱 향상될 수 있다. 그리고 이러한 경우, 별도의 방수 구조물 없이 접착부재만으로도 방수 효과가 향상되므로 제조가 간편하고 제조공정이 간소화될 수 있다.According to the present invention, since the main board, the sensor unit, and the supporting unit are bonded to each other using different kinds of adhesive, the waterproof effect of the waterproof fingerprint sensor module can be further improved. In this case, since the waterproof effect is improved by only the adhesive member without the separate waterproof structure, the manufacturing is simple and the manufacturing process can be simplified.
본 발명의 효과는 상기한 효과로 한정되는 것은 아니며, 본 발명의 상세한 설명 또는 특허청구범위에 기재된 발명의 구성으로부터 추론 가능한 모든 효과를 포함하는 것으로 이해되어야 한다.It should be understood that the effects of the present invention are not limited to the above effects and include all effects that can be deduced from the detailed description of the present invention or the configuration of the invention described in the claims.
도 1은 종래의 지문 센서 모듈을 나타낸 단면 예시도이다.1 is a cross-sectional view illustrating a conventional fingerprint sensor module.
도 2는 본 발명의 제1 실시예에 따른 방수 지문 센서 모듈을 나타낸 단면 예시도이다.2 is a cross-sectional view illustrating a waterproof fingerprint sensor module according to a first embodiment of the present invention.
도 3은 본 발명의 제2 실시예에 따른 방수 지문 센서 모듈을 나타낸 단면 예시도이다.3 is a cross-sectional view illustrating a waterproof fingerprint sensor module according to a second embodiment of the present invention.
도 4는 본 발명의 제3 실시예에 따른 방수 지문 센서 모듈을 나타낸 단면 예시도이다.4 is a cross-sectional view illustrating a waterproof fingerprint sensor module according to a third embodiment of the present invention.
도 5는 본 발명의 제4 실시예에 따른 방수 지문 센서 모듈을 나타낸 단면 예시도이다.5 is a cross-sectional view illustrating a waterproof fingerprint sensor module according to a fourth embodiment of the present invention.
도 6은 본 발명의 제5 실시예에 따른 방수 지문 센서 모듈을 나타낸 단면 예시도이다.6 is a cross-sectional view illustrating a waterproof fingerprint sensor module according to a fifth embodiment of the present invention.
도 7은 본 발명의 제6 실시예에 따른 방수 지문 센서 모듈을 나타낸 단면 예시도이다.7 is a cross-sectional view illustrating a waterproof fingerprint sensor module according to a sixth embodiment of the present invention.
도 8은 본 발명의 제7 실시예에 따른 방수 지문 센서 모듈을 나타낸 단면 예시도이다.8 is a cross-sectional view illustrating a waterproof fingerprint sensor module according to a seventh embodiment of the present invention.
도 9는 본 발명에 따른 방수부의 형상을 개략적으로 나타낸 단면 예시도이다.9 is a cross-sectional view schematically showing the shape of the waterproof portion according to the present invention.
이하에서는 첨부한 도면을 참조하여 본 발명을 설명하기로 한다. 그러나 본 발명은 여러 가지 상이한 형태로 구현될 수 있으며, 따라서 여기에서 설명하는 실시예로 한정되는 것은 아니다. 그리고 도면에서 본 발명을 명확하게 설명하기 위해서 설명과 관계없는 부분은 생략하였으며, 명세서 전체를 통하여 유사한 부분에 대해서는 유사한 도면 부호를 붙였다.DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and similar parts are denoted by like reference characters throughout the specification.
명세서 전체에서, 어떤 부분이 다른 부분과 "연결"되어 있다고 할 때, 이는 "직접적으로 연결"되어 있는 경우뿐 아니라, 그 중간에 다른 부재를 사이에 두고 "간접적으로 연결"되어 있는 경우도 포함한다. 또한 어떤 부분이 어떤 구성요소를 "포함"한다고 할 때, 이는 특별히 반대되는 기재가 없는 한 다른 구성요소를 제외하는 것이 아니라 다른 구성요소를 더 구비할 수 있다는 것을 의미한다.Throughout the specification, when a part is referred to as being "connected" to another part, it includes not only "directly connected" but also "indirectly connected" . Also, when an element is referred to as " comprising ", it means that it can include other elements, not excluding other elements unless specifically stated otherwise.
본 발명에서 상부와 하부는 대상부재의 위 또는 아래에 위치함을 의미하는 것으로, 반드시 중력방향을 기준으로 상부 또는 하부에 위치하는 것을 의미하는 것은 아니다.In the present invention, the upper part and the lower part mean that they are located above or below the object member, and does not necessarily mean that they are located at the upper or lower part with respect to the gravity direction.
이하 첨부된 도면을 참고하여 본 발명의 실시예를 상세히 설명하기로 한다.Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도 2는 본 발명의 제1 실시예에 따른 방수 지문 센서 모듈을 나타낸 단면 예시도이다.2 is a cross-sectional view illustrating a waterproof fingerprint sensor module according to a first embodiment of the present invention.
도 2에 도시된 바와 같이, 본 발명의 제1 실시예에 따른 방수 지문 센서 모듈(1000)은 메인기판(100), 센서부(200), 커버부(300), 지지부(400) 및 접착부재(500)를 포함할 수 있다.2, the waterproof fingerprint sensor module 1000 according to the first embodiment of the present invention includes a main substrate 100, a sensor unit 200, a cover unit 300, a support unit 400, (500).
메인기판(100)은 센서부(200)를 실장할 수 있다. 이러한 메인기판(100)은 전기신호정보를 전달할 수 있는 인쇄회로기판(PCB : Printed Circuit Board) 또는 연성인쇄회로기판(FPCB : Flexible Printed Circuit Board)일 수 있다.The main board 100 can mount the sensor unit 200. The main board 100 may be a printed circuit board (PCB) or a flexible printed circuit board (FPCB) capable of transmitting electrical signal information.
센서부(200)는 지문의 이미지를 감지할 수 있는 센서로서, 다양한 감지 방식이 사용될 수 있다. 예를 들어, 센서부(200)는 정전용량 방식, 광학 방식, 초음파 방식, 열감지 방식, 비접촉 방식 등을 사용하여 지문의 이미지를 감지할 수 있는데, 이하에서는 설명의 편의상 센서부(200)가 정전용량 방식을 사용하는 경우를 예로 설명하기로 한다.The sensor unit 200 is a sensor capable of sensing an image of a fingerprint, and various sensing methods can be used. For example, the sensor unit 200 may sense an image of a fingerprint using a capacitive method, an optical method, an ultrasonic method, a heat sensing method, or a non-contact method. Hereinafter, The case where the electrostatic capacity method is used will be described as an example.
상세히, 센서부(200)는 지문의 산과 골의 높이차이에 따른 정전용량의 차이를 감지할 수 있으며, 감지한 신호를 제어부(미도시)로 전달할 수 있다. 그리고 제어부는 수신한 신호를 바탕으로 지문의 이미지를 획득할 수 있다.In detail, the sensor unit 200 can detect a difference in capacitance due to the height difference between the peak and the peak of the fingerprint, and can transmit the sensed signal to a controller (not shown). Then, the control unit can acquire an image of the fingerprint based on the received signal.
또한, 센서부(200)는 지문을 감지하기 위해 다양한 형태의 센싱구조를 포함할 수 있다. 예를 들어, 센서부(200)는 2차원적으로 배열된 복수개의 센싱 픽셀을 포함할 수도 있다. 또는, 센서부(200)는 라인 타입의 복수개의 구동 전극 및 수신 전극을 포함할 수도 있다. 또는, 센서부(200)는 AREA 타입인 복수개의 이미지 수신부를 포함할 수도 있다.In addition, the sensor unit 200 may include various types of sensing structures for sensing fingerprints. For example, the sensor unit 200 may include a plurality of sensing pixels arranged two-dimensionally. Alternatively, the sensor unit 200 may include a plurality of line-type driving electrodes and receiving electrodes. Alternatively, the sensor unit 200 may include a plurality of image receiving units of the AREA type.
이러한 센서부(200)는 단자(110)를 통해 메인기판(100)과 전기적으로 연결될 수 있다.The sensor unit 200 may be electrically connected to the main substrate 100 through the terminal 110.
한편, 커버부(300)는 센서부(200)의 상부에 구비될 수 있다. 이러한 커버부(300)는 외부의 충격 또는 이물질로부터 센서부(200)를 보호하도록 이루어진다.Meanwhile, the cover part 300 may be provided on the upper part of the sensor part 200. The cover unit 300 is configured to protect the sensor unit 200 from external impacts or foreign matter.
이와 같은 커버부(300)는 코팅산출물 또는 유리 소재 또는 세라믹 소재 등 다양하게 구성될 수 있다.The cover part 300 may be formed of various materials such as a coating material, a glass material, or a ceramic material.
예로, 커버부(300)가 유리 소재로 이루어지는 경우, 소다라임 유리기판, 무알칼리 유리기판 또는 강화유리기판 등 각종의 유리기판이 적용될 수 있다. 또한, 커버부(300)는 사파이어, 지르코늄 및 투명 수지 중에서 선택된 재질로 이루어질 수도 있으며, 상기 투명 수지로는 아크릴 등이 적용될 수 있다.For example, when the cover portion 300 is made of a glass material, various glass substrates such as a soda lime glass substrate, a non-alkali glass substrate, or a tempered glass substrate can be applied. The cover 300 may be made of a material selected from the group consisting of sapphire, zirconium, and transparent resin. The transparent resin may be acrylic or the like.
이러한 커버부(300)는 외관상의 요구조건에 따라 색상을 가질 수도 있다. 이때, 커버부(300)는 다양한 방식으로 색상을 가질 수 있다. 예를 들어, 커버부(300)는 내부에 색상층을 가질 수도 있다. 또는, 커버부(300)는 커버부(300)의 배면에 별도의 색상층을 가질 수도 있다. 또는, 커버부(300)는 색상을 구현할 수 있는 소재를 포함할 수도 있다.The cover portion 300 may have a color according to apparent requirements. At this time, the cover part 300 may have a color in various ways. For example, the cover portion 300 may have a color layer therein. Alternatively, the cover part 300 may have a separate color layer on the back surface of the cover part 300. [ Alternatively, the cover portion 300 may include a material capable of implementing colors.
한편, 지지부(400)는 메인기판(100) 상에 구비될 수 있으며, 센서부(200)와 커버부(300)의 측면을 감쌀 수 있다. 이러한 지지부(400)는 베젤(bezel)이 될 수도 있다.The support part 400 may be provided on the main board 100 and may cover the sides of the sensor part 200 and the cover part 300. The support portion 400 may be a bezel.
그리고 지지부(400)는 수지 소재의 접착부재(500)를 통해 메인기판(100)과 결합될 수 있다. 여기서 접착부재(500)는 비도전성 에폭시 소재로 이루어질 수도 있다.The supporting part 400 may be coupled to the main board 100 through a bonding material 500 made of a resin material. Here, the adhesive member 500 may be made of a non-conductive epoxy material.
이러한 지지부(400)는 하부 접합면(410)과 측부 접합면(420)을 가질 수 있다.The support portion 400 may have a lower bonding surface 410 and a side bonding surface 420.
여기서 하부 접합면(410)은 지지부(400)와 메인기판(100)이 결합됨에 있어, 메인기판(100)의 상면과 마주보는 지지부(400)의 일면일 수 있다. 그리고 측부 접합면(420)은 지지부(400)와 메인기판(100)이 결합됨에 있어, 센서부(200)의 측면과 마주보는 지지부(400)의 일면일 수 있다.The lower bonding surface 410 may be one surface of the supporting part 400 facing the upper surface of the main substrate 100 when the supporting part 400 and the main substrate 100 are coupled to each other. The side joint surface 420 may be one surface of the support portion 400 facing the side surface of the sensor portion 200 when the support portion 400 and the main substrate 100 are coupled.
도 2에서와 같이, 하부 접합면(410)은 수평을 이루고, 측부 접합면(420)은 수직을 이룰 수도 있다.2, the lower bonding surface 410 may be horizontal, and the side bonding surface 420 may be vertical.
이러한 지지부(400)에는 제1 방수부(401)가 형성될 수 있다. 여기서 제1 방수부(401)는 수평을 이루는 하부 접합면(410)에 반원 형상을 이루며 함몰 형성될 수 있다. 이와 같은 제1 방수부(401)의 형상은 일 예일 뿐, 제1 방수부(401)는 다양한 형상으로 이루어질 수도 있음은 물론이다.The first waterproof portion 401 may be formed on the support portion 400. Here, the first waterproofing part 401 may be formed in a semicircular shape on the horizontal lower bonding surface 410. The shape of the first waterproofing part 401 is merely an example, and the first waterproofing part 401 may have various shapes.
여기서 방수부는 지지부(400)의 접합면으로부터 함몰된 방수홈의 구조가 아닌 지지부(400)의 접합면으로부터 돌기된 방수돌기 형태를 이룰 수도 있음은 물론이다. 본 발명의 다양한 실시예에서는 방수부가 방수홈인 형태를 예로 설명하기로 한다.It is needless to say that the waterproof portion may have the form of a waterproof protrusion protruding from the joint surface of the support portion 400, not the structure of the waterproof groove recessed from the joint surface of the support portion 400. In the various embodiments of the present invention, a description will be made by way of an example in which the waterproof portion is a waterproof groove.
이러한 제1 방수부(401)에는 수지 소재의 접착부재(500)가 채워질 수 있다.The first waterproof portion 401 may be filled with a bonding material 500 made of a resin material.
여기서 제1 방수부(401)는 하부 접합면(410)과 측부 접합면(420)이 만나는 모서리로부터 소정 간격으로 이격된 지점에 형성될 수 있다. 본 발명에서는 하부 접합면(410)에 1개의 제1 방수부(401)가 형성된 것을 예로 설명하고 있으나, 제1 방수부(401)는 하부 접합면(410)의 길이 방향을 따라 복수개로 형성될 수도 있음은 물론이다.Here, the first waterproof portion 401 may be formed at a position spaced apart from a corner where the lower bonding surface 410 and the side bonding surface 420 meet. The first waterproofing part 401 is formed in a plurality of pieces along the longitudinal direction of the lower jointing surface 410. However, Of course it is possible.
이와 같이, 지지부(400)에는 제1 방수부(401)가 형성됨에 따라 지지부(400)와 접착부재(500)가 맞닿는 접합면적은 넓어질 수 있다. 이에, 지지부(400)와 접착부재(500)의 결합력은 향상될 수 있다.As the first waterproof portion 401 is formed in the support portion 400, the contact area between the support portion 400 and the adhesive member 500 can be widened. Thus, the coupling force between the support portion 400 and the adhesive member 500 can be improved.
그리고 제1 방수부(401)를 통해 지지부(400)와 접착부재(500)의 접합면적이 넓어질 경우, 외부로부터 침투되는 수분 또는 습기의 침투 경로가 길어지게 되어 방수 지문 센서 모듈(1000)의 방수 효과는 향상될 수 있다.When the joining area of the support part 400 and the adhesive member 500 is widened through the first waterproof part 401, the infiltration path of water or moisture penetrated from the outside becomes longer, and the waterproof fingerprint sensor module 1000 The waterproof effect can be improved.
이러한 지지부(400)와 접착부재(500)의 결합력 향상은 지지부(400)와 접착부재(500) 사이로 유입될 수 있는 수분 또는 습기를 효과적으로 차단하게 된다. 따라서, 방수 지문 센서 모듈(1000)의 방수 품질 및 내구성은 더욱 향상될 수 있다.The improvement in the coupling force between the support part 400 and the adhesive member 500 effectively blocks water or moisture that may flow into the space between the support part 400 and the adhesive member 500. Therefore, the waterproof quality and durability of the waterproof fingerprint sensor module 1000 can be further improved.
그리고 제1 방수부(401)에 채워진 상태로 경화된 접착부재(500)는 지지부(400)의 측 방향인 좌, 우 방향으로 일정 이상의 힘이 가해지더라도 지지부(400)의 이탈 및 흔들림 발생을 방지할 수 있다. 즉, 제1 방수부(401)에 채워진 접착부재(500)에 의해 지지부(400)는 좌, 우 방향으로의 이동이 방지될 수 있다.The adhesive member 500 cured in the state of being filled in the first waterproofing portion 401 can prevent the support portion 400 from being separated and shaken even if a force exceeding a predetermined level is applied to the left and right directions of the support portion 400 can do. That is, the support member 400 can be prevented from moving in the left and right directions by the adhesive member 500 filled in the first waterproof portion 401.
여기서 메인기판(100) 상에도 제1 방수부(401)와 동일한 기능을 갖는 방수부가 형성될 수 있음은 물론이다.It is needless to say that the waterproof portion having the same function as the first waterproof portion 401 may be formed on the main board 100 as well.
도 3은 본 발명의 제2 실시예에 따른 방수 지문 센서 모듈을 나타낸 단면 예시도로, 도 2에 도시된 도면부호와 동일한 도면부호에 의해 지칭되는 구성들은 동일한 기능을 가지는 것으로서, 그들 각각에 대한 상세한 설명은 생략하기로 한다.FIG. 3 is a cross-sectional view illustrating a waterproof fingerprint sensor module according to a second embodiment of the present invention. Structures referred to by the same reference numerals as those shown in FIG. 2 have the same functions, A description thereof will be omitted.
본 발명의 제2 실시예에 따른 방수 지문 센서 모듈(1100)의 커버부(300)는 미리 형상 가공이 필요한 글라스 및 세라믹 등으로 이루어질 수 있다. 여기서 방수 지문 센서 모듈(1100)은 커버부(300)가 글라스인 것을 예로 설명하기로 한다.The cover portion 300 of the waterproof fingerprint sensor module 1100 according to the second embodiment of the present invention may be formed of glass or ceramic which requires the shape processing in advance. Here, the waterproof fingerprint sensor module 1100 will be described by way of example in which the cover part 300 is a glass.
이러한 글라스의 커버부(300)는 코팅 처리를 통해 형성되는 커버부와는 달리 미리 형상 가공을 한 후, 센서부(200)의 상면에 부착될 수 있다.The cover part 300 of the glass can be attached to the upper surface of the sensor part 200 after the shape processing is performed in advance, unlike the cover part formed through the coating process.
여기서 커버부(300)를 센서부(200) 상에 부착함에 있어, 도 3의 (a)는 커버부(300)와 센서부(200)가 정확한 결합위치에 결합된 상태를 보여주는 단면 예시도이고, 도 3의 (b)는 커버부(300)가 미세하게 한쪽으로 치우친 상태로 센서부(200)에 부착된 상태를 보여주는 단면 예시도이다.3 (a) is a cross-sectional view illustrating a state in which the cover unit 300 and the sensor unit 200 are coupled to each other at an accurate coupling position in attaching the cover unit 300 to the sensor unit 200 And FIG. 3 (b) is a cross-sectional view showing a state in which the cover unit 300 is attached to the sensor unit 200 in a state where the cover unit 300 is slightly biased.
여기서 도 3의 (b)는 커버부(300)의 형상 오차 또는 커버부(300)와 센서부(200)의 부착 과정에서의 공정상 오차 등으로 인해 커버부(300)가 미세하게 한쪽으로 치우친 상태로 센서부(200)에 부착된 것으로 나타낸 것이다. 이와 같은 경우, 지지부(400)와 커버부(300) 간의 간격은 도 3의 (a)에서 보다 더 넓어지게 되어, 지지부(400)와 커버부(300) 간의 간격으로 외부의 수분 또는 습기의 유입이 많아질 수 있다.3B shows a state in which the cover unit 300 is finely biased to one side due to a shape error of the cover unit 300 or a process error in the process of attaching the cover unit 300 and the sensor unit 200. [ And is attached to the sensor unit 200 as shown in FIG. 3 (a), the distance between the support portion 400 and the cover portion 300 is set to be larger than the gap between the support portion 400 and the cover portion 300, Can be increased.
이에, 글라스의 커버부(300)를 갖는 방수 지문 센서 모듈(1100)은 방수 처리가 특히 중요하다. 따라서, 본 발명의 제2 실시예에서는 방수 기능이 개선되고, 지지부(400)의 들뜸 현상이 방지되도록 이루어진 방수 지문 센서 모듈(1100)을 제공한다.Therefore, the waterproof fingerprint sensor module 1100 having the glass cover part 300 is particularly important for waterproof processing. Accordingly, the second embodiment of the present invention provides a waterproof fingerprint sensor module 1100 that is improved in waterproof function and is prevented from lifting the supporting part 400.
본 발명의 제2 실시예에 따른 방수 지문 센서 모듈(1100)은 메인기판(100), 센서부(200), 커버부(300), 지지부(400) 및 접착부재(500)를 포함할 수 있다.The waterproof fingerprint sensor module 1100 according to the second embodiment of the present invention may include a main substrate 100, a sensor unit 200, a cover unit 300, a support unit 400, and an adhesive member 500 .
이러한 지지부(400)는 하부 접합면(410)과 측부 접합면(420)의 만나는 모서리 부분이 모따기(chamfer)된 형태로 이루어질 수 있다. 즉, 하부 접합면(410)과 측부 접합면(420)은 모따기면(430)을 사이에 두고 연결될 수 있다.The supporting portion 400 may be chamfered at the corner portions of the lower bonding surface 410 and the side bonding surface 420. That is, the lower bonding surface 410 and the side bonding surface 420 may be connected with the chamfer surface 430 therebetween.
이렇게 지지부(400)의 하부 접합면(410)과 측부 접합면(420)이 만나는 모서리 부분이 모따기됨에 따라, 메인기판(100), 센서부(200) 및 지지부(400)가 만나는 교차지점에는 수용공간(S)이 형성될 수 있다.The edge portions where the lower bonding surface 410 and the side bonding surface 420 of the support portion 400 meet are chamfered so that the intersection points where the main substrate 100, the sensor unit 200, The space S can be formed.
이와 같이, 지지부(400)에는 모따기면(430)이 형성됨에 따라 방수 지문 센서 모듈(1100)의 제조 과정에서 접착부재(500)가 미리 설정된 정량을 초과하여 도포되는 경우라도, 지지부(400)는 메인기판(100) 상의 정위치에 안정적으로 결합될 수 있다. 여기서 메인기판(100) 상에 결합되는 지지부(400)의 정위치는 방수 지문 센서 모듈(1100)의 제조 과정에서 지지부(400)가 설치되어야 하는 미리 설정된 결합위치를 말한다.Even if the adhesive member 500 is applied over a predetermined amount in the process of manufacturing the waterproof fingerprint sensor module 1100 as the chamfered surface 430 is formed in the support part 400, And can be stably coupled to a predetermined position on the main substrate 100. [ Here, the fixed position of the support portion 400 coupled to the main board 100 refers to a preset connection position at which the support portion 400 is to be installed in the manufacturing process of the waterproof fingerprint sensor module 1100.
구체적으로, 접착부재(500)가 미리 설정된 정량을 초과하여 도포되는 경우, 초과로 도포된 접착부재(500)는 지지부(400)와 메인기판(100)의 결합과정에서 수용공간(S)으로 유입될 수 있다.More specifically, when the adhesive member 500 is applied in a predetermined amount exceeding the predetermined amount, the excessively applied adhesive member 500 is introduced into the accommodation space S in the process of coupling the support portion 400 and the main substrate 100 .
따라서, 지지부(400)와 메인기판(100) 사이에 개재되는 접착부재(500)는 정량이 유지되어, 지지부(400)는 메인기판(100) 상의 미리 설정된 정위치에 들뜸 현상 없이 결합될 수 있다.Accordingly, the amount of the adhesive member 500 interposed between the supporting part 400 and the main substrate 100 is maintained, and the supporting part 400 can be coupled to the predetermined position on the main substrate 100 without lifting .
그리고 도 3의 (b)에서와 같이 지지부(400)와 커버부(300) 간의 간격이 넓게 형성되더라도, 지지부(400)에는 제1 방수부(401)가 형성됨에 따라 제1 영역(A1)을 통해 유입된 수분 또는 습기가 제2 영역(A2)으로 이동되는 것이 방지될 수 있다.The first waterproof portion 401 is formed in the support portion 400 so that the first waterproof portion 401 is formed in the first region A1 as shown in Figure 3 (b) Moisture or moisture introduced through the second area A2 can be prevented from moving to the second area A2.
즉, 도 3의 (b)에서와 같이, 방수 지문 센서 모듈(1100)이 휴대용 단말기기에 장착된 경우, 제1 영역(A1)을 통해 지지부(400)와 커버부(300) 사이로 수분 또는 습기가 유입되더라도 방수 지문 센서 모듈(1100)의 지지부(400)에는 제1 방수부(401)가 형성됨에 따라, 디스플레이부(1)의 하부 영역인 제2 영역(A2)에 구비된 소자(2)는 제1 영역(A1)으로부터 유입된 수분 또는 습기로 인한 오작동 및 파손 발생이 방지될 수 있다.3 (b), when the waterproof fingerprint sensor module 1100 is mounted on the portable terminal device, moisture or moisture may flow between the support part 400 and the cover part 300 through the first area A1 The first waterproofing portion 401 is formed on the supporting portion 400 of the waterproof fingerprint sensor module 1100 so that the element 2 provided in the second region A2, which is a lower region of the display portion 1, It is possible to prevent malfunction and breakage due to moisture or moisture introduced from the first region A1.
도 4는 본 발명의 제3 실시예에 따른 방수 지문 센서 모듈을 나타낸 단면 예시도로, 도 2 및 도 3에 도시된 도면부호와 동일한 도면부호에 의해 지칭되는 구성들은 동일한 기능을 가지는 것으로서, 그들 각각에 대한 상세한 설명은 생략하기로 한다.FIG. 4 is an exemplary sectional view showing a waterproof fingerprint sensor module according to a third embodiment of the present invention. Structures referred to by the same reference numerals as those shown in FIGS. 2 and 3 have the same functions, A detailed description thereof will be omitted.
본 발명의 제3 실시예에 따른 방수 지문 센서 모듈(1200)은 제1 방수부(401)의 양측으로 연결되는 접합면의 높낮이가 서로 다르도록 이루어질 수 있다.The waterproof fingerprint sensor module 1200 according to the third embodiment of the present invention may be configured such that the height of the joint surfaces connected to both sides of the first waterproof portion 401 are different from each other.
이와 같은 지지부(400)의 하부 접합면(410)은 제1 접합면(411)과 제2 접합면(412)을 포함할 수 있다.The lower bonding surface 410 of the support part 400 may include a first bonding surface 411 and a second bonding surface 412.
여기서 제1 접합면(411)은 제1 방수부(401)의 일단부와 연결형성되고, 제2 접합면(412)은 제1 방수부(401)의 타단부와 연결 형성된다.The first joint surface 411 is connected to one end of the first waterproof portion 401 and the second joint surface 412 is connected to the other end of the first waterproof portion 401.
이러한 제1 접합면(411)과 제2 접합면(412)은 높낮이가 다르도록 형성될 수 있다. 구체적으로, 하부 접합면(410)이 형성된 지지부(400)의 기준면(B)으로부터 제1 접합면(411)까지의 제1 두께(T1)는 하부 접합면(410)이 형성된 지지부(400)의 기준면(B)으로부터 제2 접합면(412)까지의 제2 두께(T2)보다 두껍도록 이루어질 수 있다.The first bonding surface 411 and the second bonding surface 412 may be formed to have different heights. The first thickness T1 from the reference surface B to the first bonding surface 411 of the support portion 400 on which the lower bonding surface 410 is formed is smaller than the first thickness T1 between the reference surface B and the first bonding surface 411, May be made thicker than the second thickness (T2) from the reference plane (B) to the second bonding surface (412).
이렇게 제1 두께(T1)는 제2 두께(T2)보다 두껍도록 이루어짐에 따라 제1 접합면(411)과 메인기판(100)의 상면 간의 이격거리는 제2 접합면(412)과 메인기판(100)의 상면 간의 이격거리보다 짧게 형성될 수 있다. 이에, 도 4에서와 같이 지지부(400)를 메인기판(100)에 부착시, 접착부재(500)가 제2 영역(A2)으로 새어나가는 것이 방지될 수 있다.The distance between the first bonding surface 411 and the upper surface of the main substrate 100 is greater than the distance between the second bonding surface 412 and the main substrate 100 The distance between the upper surfaces of the first and second electrodes may be shorter than the distance between the upper surfaces. 4, when the support 400 is attached to the main substrate 100, the adhesive member 500 can be prevented from leaking into the second area A2.
그리고 제1 접합면(411)과 제2 접합면(412)의 높낮이 조절이 이루어질 경우, 지지부(400)를 메인기판(100)에 부착시, 접착부재(500)는 모따기면(430)을 통해 측부 접합면(420) 측으로 유도될 수 있다. 이렇게 측부 접합면(420) 측으로 유도된 접착부재(500)는 지지부(400)와 센서부(200)의 결합력을 향상시키게 된다.When the height of the first joint surface 411 and the second joint surface 412 is adjusted, when the support member 400 is attached to the main board 100, the adhesive member 500 passes through the chamfer surface 430 Can be guided to the side joint surface 420 side. The adhesion member 500 guided to the side joint surface 420 improves the bonding force between the support part 400 and the sensor part 200.
이러한 지지부(400)와 센서부(200)의 결합력 향상은 제1 영역(A1)을 통해 유입될 수 있는 수분 또는 습기를 효과적으로 차단하게 된다. 따라서, 방수 지문 센서 모듈(1200)의 방수 품질 및 내구성은 더욱 향상될 수 있다.The improvement in the coupling force between the support part 400 and the sensor part 200 effectively blocks moisture or moisture that may flow through the first area A1. Therefore, the waterproof quality and durability of the waterproof fingerprint sensor module 1200 can be further improved.
도 5는 본 발명의 제4 실시예에 따른 방수 지문 센서 모듈을 나타낸 단면 예시도로, 도 2 내지 도 4에 도시된 도면부호와 동일한 도면부호에 의해 지칭되는 구성들은 동일한 기능을 가지는 것으로서, 그들 각각에 대한 상세한 설명은 생략하기로 한다.5 is a cross-sectional view illustrating a waterproof fingerprint sensor module according to a fourth embodiment of the present invention. Structures referred to by the same reference numerals as those shown in Figs. 2 to 4 have the same functions, A detailed description thereof will be omitted.
본 발명의 제4 실시예에 따른 방수 지문 센서 모듈(1300)에는 제2 방수부(402)가 더 형성될 수 있다. 즉, 측부 접합면(420)에는 제2 방수부(402)가 더 형성될 수 있다.The waterproof fingerprint sensor module 1300 according to the fourth embodiment of the present invention may further include a second waterproof part 402. That is, the second waterproof portion 402 may be further formed on the side joint surface 420.
이러한 제2 방수부(402)는 측부 접합면(420)에 반원 형상를 이루며 함몰 형성될 수 있다. 이와 같은 제2 방수부(402)는 반원 형상 이외에 다양한 형상으로 이루어질 수 있음은 물론이다.The second waterproof portion 402 may be formed in a semi-circular shape on the side joint surface 420 and may be recessed. It is needless to say that the second waterproof portion 402 may have various shapes other than the semicircular shape.
이러한 제2 방수부(402)에는 수지 소재의 접착부재(500)가 채워질 수 있다.The second waterproof portion 402 may be filled with a bonding material 500 made of a resin material.
여기서 제2 방수부(402)는 모따기면(430)의 단부로부터 소정 간격으로 이격된 지점에 형성될 수 있다. 본 발명에서는 측부 접합면(420)에 1개의 제2 방수부(402)가 형성된 것을 예로 설명하고 있으나, 제2 방수부(402)는 측부 접합면(420)의 길이 방향을 따라 복수개로 형성될 수도 있음은 물론이다.Here, the second waterproof portion 402 may be formed at a position spaced apart from the end portion of the chamfer surface 430 by a predetermined distance. The second waterproofing part 402 is formed in a plurality of pieces along the longitudinal direction of the side jointing surface 420. However, the second waterproofing part 402 may include a plurality of second waterproofing parts 402, Of course it is possible.
이와 같이, 지지부(400)에는 제2 방수부(402)가 형성됨에 따라 지지부(400)와 접착부재(500)가 맞닿는 접합면적은 넓어질 수 있다. 이에, 지지부(400)와 접착부재(500)의 결합력은 향상될 수 있다. 그리고 제2 방수부(402)를 통해 지지부(400)와 접착부재(500)의 접합면적이 넓어질 경우에는 수분 또는 습기의 침투 경로가 길어지게 되어, 방수 지문 센서 모듈(1300)의 방수 효과는 더욱 향상될 수 있다.As the second waterproof portion 402 is formed in the support portion 400, the contact area between the support portion 400 and the adhesive member 500 can be widened. Thus, the coupling force between the support portion 400 and the adhesive member 500 can be improved. When the joining area of the support part 400 and the adhesive member 500 is widened through the second waterproof part 402, the penetration path of moisture or moisture becomes long, and the waterproof effect of the waterproof fingerprint sensor module 1300 is Can be further improved.
이러한 지지부(400)와 접착부재(500)의 결합력 향상은 제1 영역(A1)을 통해 유입될 수 있는 수분 또는 습기를 효과적으로 차단하게 된다.The improvement in the bonding force between the support part 400 and the adhesive member 500 effectively blocks moisture or moisture that may flow through the first area A1.
그리고 제2 방수부(402)에 채워진 상태로 경화된 접착부재(500)는 지지부(400)의 상, 하 방향으로 일정 이상의 힘이 가해지더라도 지지부(400)의 이탈 및 흔들림 발생을 방지하게 된다. 즉, 제2 방수부(402)에 채워진 접착부재(500)에 의해 지지부(400)는 상, 하 방향으로의 이동이 방지될 수 있다.The adhesive member 500 cured in the state of being filled in the second waterproofing portion 402 prevents the support portion 400 from being separated and shaken even if a force exceeding a predetermined level is applied to the support portion 400 in a downward direction. That is, the support member 400 can be prevented from moving upward and downward by the adhesive member 500 filled in the second waterproof portion 402.
도 6은 본 발명의 제5 실시예에 따른 방수 지문 센서 모듈을 나타낸 단면 예시도로, 도 2 내지 도 5에 도시된 도면부호와 동일한 도면부호에 의해 지칭되는 구성들은 동일한 기능을 가지는 것으로서, 그들 각각에 대한 상세한 설명은 생략하기로 한다.6 is a cross-sectional view illustrating a waterproof fingerprint sensor module according to a fifth embodiment of the present invention. Structures referred to by the same reference numerals as those shown in Figs. 2 to 5 have the same functions. A detailed description thereof will be omitted.
본 발명의 제5 실시예에 따른 방수 지문 센서 모듈(1400)은 지지부(400)에 제1 방수부(401)와 제2 방수부(402)가 형성됨과 동시에 제1 방수부(401)의 양측으로 연결되는 제1 접합면(411)과 제2 접합면(412)은 높낮이가 서로 다르도록 이루어질 수 있다. 이에, 지지부(400)의 부착 시, 접착부재(500)가 제2 영역(A2)으로 새어나가는 것이 방지될 수 있다.The waterproof fingerprint sensor module 1400 according to the fifth embodiment of the present invention has the first waterproof portion 401 and the second waterproof portion 402 formed on the support portion 400 and the two sides of the first waterproof portion 401 The first joining surface 411 and the second joining surface 412 may be formed to have different heights. Thus, when the support portion 400 is attached, the adhesive member 500 can be prevented from leaking into the second region A2.
그리고 측부 접합면(420)에 형성된 제2 방수부(402)의 양측으로 연결되는 제3 접합면(421)과 제4 접합면(422)도 높낮이가 서로 다르도록 이루어질 수 있다. 이에, 지지부(400)의 부착 시, 접착부재(500)가 제1 영역(A1)으로 새어나가는 것이 방지될 수 있다.The third joint surface 421 and the fourth joint surface 422, which are connected to both sides of the second waterproof portion 402 formed on the side joint surface 420, may have different heights. Thus, when the support portion 400 is attached, the adhesive member 500 can be prevented from leaking into the first region A1.
이와 같이, 제1 접합면(411)과 제2 접합면(412)의 높낮이 조절이 이루어지고, 제3 접합면(421)과 제4 접합면(422)의 높낮이 조절이 함께 이루어진 지지부(400)는 메인기판(100)과의 부착 과정에서 접착부재(500)를 모따기면(430) 측으로 동시에 유도하는 구조를 가짐으로써, 지지부(400)와 메인기판(100) 및 센서부(200)는 견고하게 결합될 수 있다. 이에, 방수 지문 센서 모듈(1400)의 방수 기능은 향상될 수 있다.The support portion 400 having the first joint surface 411 and the second joint surface 412 can be adjusted in height and the third joint surface 421 and the fourth joint surface 422 can be adjusted in height, The supporting part 400 and the main substrate 100 and the sensor part 200 are firmly fixed to each other by having the structure in which the adhesive member 500 is simultaneously guided to the chamfered surface 430 side in the process of attaching the main substrate 100 to the main substrate 100 Can be combined. Thus, the waterproof function of the waterproof fingerprint sensor module 1400 can be improved.
도 7은 본 발명의 제6 실시예에 따른 방수 지문 센서 모듈을 나타낸 단면 예시도로, 도 2 내지 도 6에 도시된 도면부호와 동일한 도면부호에 의해 지칭되는 구성들은 동일한 기능을 가지는 것으로서, 그들 각각에 대한 상세한 설명은 생략하기로 한다.FIG. 7 is a cross-sectional view illustrating a waterproof fingerprint sensor module according to a sixth embodiment of the present invention. Structures referred to by the same reference numerals as those shown in FIGS. 2 to 6 have the same functions, A detailed description thereof will be omitted.
제6 실시예에 따른 방수 지문 센서 모듈(1500)은 이종의 접착제를 갖는 접착부재(500')를 포함할 수 있다.The waterproof fingerprint sensor module 1500 according to the sixth embodiment may include an adhesive member 500 'having a different type of adhesive.
이러한 접착부재(500')는 제1 접착제(510)와 제2 접착제(520)로 이루어질 수 있다. 이때, 제1 접착제(510)와 제2 접착제(520)는 물성이 서로 다른 이종의 접착제일 수 있다. 그리고 제1 접착제(510)와 제2 접착제(520)는 비도전성 소재로 이루어질 수 있다.The adhesive member 500 'may include a first adhesive 510 and a second adhesive 520. At this time, the first adhesive 510 and the second adhesive 520 may be different kinds of adhesives having different physical properties. The first adhesive 510 and the second adhesive 520 may be made of a non-conductive material.
여기서 제1 접착제(510)는 제2 접착제(520)에 비해 액상상태에서의 점도가 낮을 것일 수 있다.Here, the first adhesive 510 may have a lower viscosity in the liquid state than the second adhesive 520.
이러한 제1 접착제(510)는 메인기판(100)과 센서부(200)를 전기적으로 연결하는 단자(110)로 인해 발생된 센서부(200)와 메인기판(100) 사이의 공간을 채우도록 이루어진다.The first adhesive 510 is formed to fill a space between the sensor unit 200 and the main substrate 100 generated by the terminals 110 electrically connecting the main substrate 100 and the sensor unit 200 .
이와 같은 제1 접착제(510)는 센서부(200)와 메인기판(100) 사이의 공간으로 공급된 상태에서 경화 처리가 이루어질 수 있다.The first adhesive 510 may be cured while being supplied to the space between the sensor unit 200 and the main substrate 100.
이와 같이, 제1 접착제(510)는 센서부(200)와 메인기판(100) 사이의 빈 공간을 채울수 있도록 액상상태에서의 점도가 낮음으로써, 제1 접착제(510)는 외부로부터 단자(110)로 유입되는 수분 또는 습기를 효과적으로 차단할 수 있다.Since the viscosity of the first adhesive 510 in the liquid phase state is low so as to fill the void space between the sensor unit 200 and the main substrate 100, It is possible to effectively block the moisture or moisture that flows into the apparatus.
이렇게 제1 접착제(510)가 센서부(200)와 메인기판(100) 사이의 빈 공간을 1차적으로 채운 상태에서 제2 접착제(520)는 지지부(400), 메인기판(100) 및 센서부(200)를 2차적으로 접착하게 된다.The second adhesive 520 is applied to the supporting portion 400, the main substrate 100, and the sensor substrate 100 in a state where the first adhesive 510 is primarily filled in the void space between the sensor unit 200 and the main substrate 100. [ (200).
이와 같은 제2 접착제(520)는 하부 접합면(410) 및 측부 접합면(420)에 맞닿은 상태로 지지부(400), 메인기판(100) 및 센서부(200)를 접착하게 된다.The second adhesive agent 520 bonds the support portion 400, the main substrate 100, and the sensor portion 200 while contacting the lower bonding surface 410 and the side bonding surface 420.
이러한 제2 접착제(520)는 제1 접착제(510)보다 점도가 높도록 이루어짐에 따라, 제1 접착제(510)와 제2 접착제(520)의 접착 과정이 연속적 또는 동시에 이루어지더라도 제2 접착제(520)는 제1 접착제(510)가 제2 영역(A2)으로 흘러나오는 것을 방지할 수 있다.As the second adhesive 520 is made to have a higher viscosity than the first adhesive 510, even if the bonding process of the first adhesive 510 and the second adhesive 520 is continuously or simultaneously performed, 520 can prevent the first adhesive 510 from flowing out to the second area A2.
다시 말해서, 제1 접착제(510)는 액상상태에서 메인기판(100)과 센서부(200) 사이의 공간에 스며들 수 있는 점도를 갖는 반면에, 제2 접착제(520)는 제1 접착제(510)에 비해 높은 점도를 가지기 때문에, 지지부(400)를 메인기판(100)에 부착 시 제2 접착제(520)가 제2 영역(A2)으로 새어나오는 것이 방지될 수 있다.In other words, the first adhesive 510 has a viscosity that is permeable to the space between the main substrate 100 and the sensor unit 200 in the liquid phase state, while the second adhesive 520 has the first adhesive 510 The second adhesive 520 can be prevented from leaking to the second area A2 when the support part 400 is attached to the main substrate 100. [
즉, 방수 지문 센서 모듈(1500)은 액상상태에서 점도가 다른 이종의 접착제를 사용하기 때문에, 접착부재(500')는 메인기판(100)과 센서부(200) 사이의 미세한 공간을 채우면서도 제2 영역(A2)으로 새어나오는 것이 방지될 수 있다.That is, since the waterproof fingerprint sensor module 1500 uses different kinds of adhesives having different viscosities in the liquid state, the adhesive member 500 'fills a fine space between the main substrate 100 and the sensor unit 200, 2 area A2 can be prevented from leaking out.
이와 같이, 방수 지문 센서 모듈(1500)은 물성이 다른 이종의 제1 접착제(510)와 제2 접착제(520)를 함께 사용함으로써, 단자(110)로 유입될 수 있는 수분 및 습기를 효과적으로 차단할 수 있다.As described above, the waterproof fingerprint sensor module 1500 can effectively block moisture and moisture that may flow into the terminal 110 by using different kinds of first adhesive 510 and second adhesive 520 having different physical properties together have.
도 8은 본 발명의 제7 실시예에 따른 방수 지문 센서 모듈을 나타낸 단면 예시도로, 도 2 내지 도 7에 도시된 도면부호와 동일한 도면부호에 의해 지칭되는 구성들은 동일한 기능을 가지는 것으로서, 그들 각각에 대한 상세한 설명은 생략하기로 한다.8 is a cross-sectional view illustrating a waterproof fingerprint sensor module according to a seventh embodiment of the present invention. Structures referred to by the same reference numerals as those shown in Figs. 2 to 7 have the same functions, A detailed description thereof will be omitted.
제7 실시예에 따른 방수 지문 센서 모듈(1600)은 제6 실시예와 같이 이종의 접착제를 갖는 접착부재(500")를 포함할 수 있다. 즉, 제7 실시예에 따른 방수 지문 센서 모듈(1600)은 하부 접합면(410)의 외측 단부와 메인기판(100)이 제3 접착제(530)에 의해 접착될 수 있다.The waterproof fingerprint sensor module 1600 according to the seventh embodiment may include an adhesive member 500 " having a different kind of adhesive as in the sixth embodiment. That is, the waterproof fingerprint sensor module 1600 according to the seventh embodiment 1600 may be bonded to the outer end of the lower bonding surface 410 and the main substrate 100 by the third adhesive 530.
이러한 접착부재(500")는 제2 접착제(520)와 제3 접착제(530)를 포함할 수 있다.Such an adhesive member 500 " may include a second adhesive 520 and a third adhesive 530. [
여기서 제2 접착제(520)는 비도전성 소재로 이루어지고, 제3 접착제(530)는 도전성 소재로 이루어질 수 있다.Here, the second adhesive 520 may be made of a non-conductive material, and the third adhesive 530 may be made of a conductive material.
이러한 제2 접착제(520)는 하부 접합면(410)의 외측 단부를 제외한 지지부(400), 메인기판(100) 및 센서부(200)를 접착하도록 이루어진다.The second adhesive 520 is bonded to the support 400, the main substrate 100, and the sensor unit 200 except the outer end of the lower bonding surface 410.
그리고 제3 접착제(530)는 메인기판(100)의 상면에 구비된 도전성 부재(120)와 도전성 부재(120)와 마주보는 하부 접합면(410)의 단부를 결합하도록 이루어진다. 이때, 제3 접착제(530)는 도전성 소재로 이루어짐에 따라 하부 접합면(410)과 도전성 부재(120)는 전기적으로 연결될 수 있다. 이에, 지지부(400)는 메인기판(100)은 전기적으로 연결될 수 있다.The third adhesive 530 is formed to join the conductive member 120 provided on the upper surface of the main substrate 100 and the end of the lower bonding surface 410 facing the conductive member 120. At this time, since the third adhesive 530 is made of a conductive material, the lower bonding surface 410 and the conductive member 120 can be electrically connected. Accordingly, the main board 100 can be electrically connected to the support portion 400. [
이러한 도전성 부재(120)는 메인기판(100)에 구비된 랜드부(102)를 통해 메인기판(100)과 도전성 부재(120)는 전기적인 연결이 이루어질 수 있다. 예로, 도전성 부재(120)는 메인기판(100)에 도포된 절연 코팅층(101)인 PSR(Photo Solder Resist)의 노광 작업을 통해 외부로 노출된 랜드부(102)와 전기적으로 연결될 수 있다.The conductive member 120 may be electrically connected to the conductive member 120 through the land portion 102 provided on the main substrate 100. For example, the conductive member 120 may be electrically connected to a land portion 102 exposed to the outside through an exposure operation of a PSR (Photo Solder Resist) which is an insulating coating layer 101 applied to the main substrate 100.
이와 같이, 제3 접착제(530)에 의해 하부 접합면(410)의 단부와 도전성 부재(120)가 결합되는 경우, 제2 접착제(520)는 제2 영역(A2)으로 새어나가는 것이 방지될 수 있다.As such, when the end of the lower bonding surface 410 is joined to the conductive member 120 by the third adhesive agent 530, the second adhesive agent 520 can be prevented from leaking into the second region A2 have.
여기서 메인기판(100) 상에 구비되는 도전성 부재(120)의 상단 높이는 메인기판(100)의 상면보다 높게 형성됨에 따라 도전성 부재(120)는 지지부(400)의 부착 과정에서 제2 접착제(520)가 제2 영역(A2)으로 새어나가는 것을 방지할 수 있다.Since the upper end of the conductive member 120 provided on the main substrate 100 is formed higher than the upper surface of the main substrate 100, the conductive member 120 is bonded to the second adhesive 520 in the process of attaching the support member 400, Can be prevented from leaking into the second area (A2).
따라서, 제2 영역(A2)으로 새어나가는 것이 방지된 제2 접착제(520)는 지지부(400), 메인기판(100) 및 센서부(200)를 더욱 견고하게 결합하게 된다.Therefore, the second adhesive 520, which is prevented from leaking to the second area A2, more firmly couples the supporting part 400, the main substrate 100 and the sensor part 200. [
이러한 제3 접착제(530)를 통해 메인기판(100)과 전기적으로 연결된 지지부(400)는 센서부(200)에 사용자의 손가락이 접촉되는 과정에서 순간적으로 발생되는 정전기(static electricity)로 인한 센서부(200)의 손상을 방지할 수 있는 정전기 방전(ESD : Electro Static Discharge) 기능을 수행할 수도 있다.The supporter 400 electrically connected to the main board 100 through the third adhesive 530 is electrically connected to the sensor unit 200 due to static electricity instantaneously generated during the contact of the user's finger with the sensor unit 200. [ (Electro Static Discharge) function that can prevent damage to the battery 200.
그리고 메인기판(100)과 전기적으로 연결된 지지부(400)는 사용자의 지문인식을 위한 구동신호를 센서부(200)로 송출하도록 이루어질 수도 있다.The supporting part 400 electrically connected to the main board 100 may transmit a driving signal for the user's fingerprint recognition to the sensor part 200.
이와 같은 방수 지문 센서 모듈(1600)에는 제1 접착제(510), 제2 접착제(520) 및 제3 접착제(530)의 서로 다른 물성을 갖는 이종의 접착제가 함께 사용될 수도 있음은 물론이다.Needless to say, the waterproof fingerprint sensor module 1600 may be provided with a different kind of adhesive having different physical properties of the first adhesive 510, the second adhesive 520 and the third adhesive 530.
도 9는 본 발명에 따른 방수부의 형상을 개략적으로 나타낸 단면 예시도로, 도 2 내지 도 8에 도시된 도면부호와 동일한 도면부호에 의해 지칭되는 구성들은 동일한 기능을 가지는 것으로서, 그들 각각에 대한 상세한 설명은 생략하기로 한다.9 is a cross-sectional view schematically showing the shape of the waterproof portion according to the present invention. Structures referred to by the same reference numerals as those shown in Figs. 2 to 8 have the same functions, Is omitted.
도 9에서는 제1 방수부(401)가 형성된 하부 접합면(410)의 요부를 예로 설명하기로 한다.9, the recessed portion of the lower joint surface 410 on which the first waterproof portion 401 is formed will be described as an example.
도 9에서 보는 바와 같이, 제1 방수부(401)는 반원, 삼각형, 사각형, 오각형 등의 다양한 형상으로 이루어질 수 있다.9, the first waterproof portion 401 may have various shapes such as a semicircle, a triangle, a square, and a pentagon.
그리고 제1 방수부(401)는 하부 접합면(410)의 길이 방향을 따라 복수개로 형성될 수 있음은 물론이다. 여기서 복수개로 형성된 제1 방수부(401)는 동일한 형상으로 이루어질 수도 있고, 서로 다른 형상으로 이루어질 수도 있음은 물론이다.It is needless to say that the first waterproof portion 401 may be formed along the longitudinal direction of the lower joint surface 410. Here, the plurality of first waterproof portions 401 may have the same shape or different shapes.
그리고 지지부(400)에 형성되는 제1 방수부(401)는 반원 형상으로 이루어지고, 제2 방수부(402)는 삼각형 형상으로 이루어지는 등 지지부(400)에 형성되는 제1 방수부(401)와 제2 방수부(402)는 서로 다른 형상으로 이루어질 수도 있다.The first waterproof part 401 formed in the support part 400 has a semicircular shape and the second waterproof part 402 has a first waterproof part 401 formed in a triangular support part 400, The second waterproofing part 402 may have different shapes.
여기서 제2 방수부(402)도 제1 방수부(401)와 같이 다양한 형상으로 이루어질 수 있음은 물론이다.Here, the second waterproofing part 402 may have various shapes as well as the first waterproofing part 401.
이와 같은 제1 방수부(401)와 제2 방수부(402)는 다양한 형상을 이루며 방수 지문 센서 모듈(1000, 1100, 1200, 1300, 1400, 1500, 1600)의 방수 품질 및 내구성을 향상시킬 수 있다.The first waterproofing part 401 and the second waterproofing part 402 have various shapes and can improve waterproof quality and durability of the waterproof fingerprint sensor modules 1000, 1100, 1200, 1300, 1400, 1500, have.
여기서 제1 방수부(401)와 제2 방수부(402)는 지지부(400)의 접합면으로부터 함몰된 방수홈의 구조가 아닌 지지부(400)의 접합면으로부터 돌기된 방수돌기 형태를 이룰 수도 있음은 물론이다.Here, the first waterproofing part 401 and the second waterproofing part 402 may be in the form of a waterproof protrusion protruding from the joint surface of the support part 400, not the structure of the waterproof groove recessed from the joint surface of the support part 400 Of course.
다만, 이는 본 발명의 바람직한 일실시예에 불과할 뿐, 본 발명의 권리 범위가 이러한 실시예의 기재 범위에 의하여 제한되는 것은 아니다.It should be understood, however, that the scope of the present invention is not limited by the scope of the present invention.
전술한 본 발명의 설명은 예시를 위한 것이며, 본 발명이 속하는 기술분야의 통상의 지식을 가진 자는 본 발명의 기술적 사상이나 필수적인 특징을 변경하지 않고서 다른 구체적인 형태로 쉽게 변형이 가능하다는 것을 이해할 수 있을 것이다. 그러므로 이상에서 기술한 실시예들은 모든 면에서 예시적인 것이며 한정적이 아닌 것으로 이해해야만 한다. 예를 들어, 단일형으로 설명되어 있는 각 구성 요소는 분산되어 실시될 수도 있으며, 마찬가지로 분산된 것으로 설명되어 있는 구성 요소들도 결합된 형태로 실시될 수 있다.It will be understood by those skilled in the art that the foregoing description of the present invention is for illustrative purposes only and that those of ordinary skill in the art can readily understand that various changes and modifications may be made without departing from the spirit or essential characteristics of the present invention. will be. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single entity may be distributed and implemented, and components described as being distributed may also be implemented in a combined form.
본 발명의 범위는 후술하는 특허청구범위에 의하여 나타내어지며, 특허청구범위의 의미 및 범위 그리고 그 균등 개념으로부터 도출되는 모든 변경 또는 변형된 형태가 본 발명의 범위에 포함되는 것으로 해석되어야 한다.The scope of the present invention is defined by the appended claims, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included within the scope of the present invention.

Claims (14)

  1. 메인기판;A main board;
    상기 메인기판에 실장되는 센서부;A sensor unit mounted on the main board;
    상기 센서부의 상부에 구비되는 커버부;A cover part provided on the upper part of the sensor part;
    상기 메인기판 상에 구비되며, 상기 센서부와 커버부의 측면을 감싸는 지지부; 및A support unit provided on the main board and surrounding the sensor unit and the cover unit; And
    상기 메인기판, 센서부 및 지지부를 접착하는 접착부재를 포함하고,And a bonding member for bonding the main substrate, the sensor unit, and the supporting unit,
    상기 접착부재와 맞닿는 상기 지지부의 접합면에는 방수부가 형성된 것인 커버부를 가진 방수 지문 센서 모듈.And a cover portion having a waterproof portion formed on a joint surface of the support portion which contacts the adhesive member.
  2. 제1항에 있어서,The method according to claim 1,
    상기 메인기판과 지지부의 결합시, 상기 메인기판의 상면과 마주보는 상기 지지부의 하부 접합면에는 제1 방수부가 형성된 것인 커버부를 가진 방수 지문 센서 모듈.Wherein a first waterproofing portion is formed on a lower joint surface of the support portion facing the upper surface of the main board when the main board and the support portion are coupled to each other.
  3. 제2항에 있어서,3. The method of claim 2,
    상기 제1 방수부는 방수홈으로 이루어진 것인 커버부를 가진 방수 지문 센서 모듈.Wherein the first waterproofing portion comprises a waterproof groove.
  4. 제2항에 있어서,3. The method of claim 2,
    상기 제1 방수부는 상기 하부 접합면의 길이 방향을 따라 복수개로 형성된 것인 커버부를 가진 방수 지문 센서 모듈.Wherein the first waterproof portion has a cover portion formed in a plurality of along the longitudinal direction of the lower joint surface.
  5. 제2항에 있어서,3. The method of claim 2,
    상기 하부 접합면은 상기 제1 방수부에 각각 연결된 높낮이 서로 다른 제1 접합면과 제2 접합면을 가지되,Wherein the lower joint surface has a first joint surface and a second joint surface that are different in height from each other connected to the first waterproof portion,
    상기 지지부의 기준면(B)으로부터 상기 제1 접합면까지의 제1 두께(T1)는 상기 지지부의 기준면(B)으로부터 상기 제2 접합면까지의 제2 두께(T2)보다 두껍도록 이루어진 것인 커버부를 가진 방수 지문 센서 모듈.Wherein the first thickness (T1) from the reference surface (B) of the support portion to the first bonding surface is greater than the second thickness (T2) from the reference surface (B) of the supporting portion to the second bonding surface Waterproof fingerprint sensor module.
  6. 제1항에 있어서,The method according to claim 1,
    상기 메인기판과 지지부의 결합시, 상기 센서부의 측면과 마주보는 상기 지지부의 측부 접합면에는 제2 방수부가 형성된 것인 커버부를 가진 방수 지문 센서 모듈.And a second waterproof portion formed on a side joint surface of the support portion facing the side surface of the sensor portion when the main board and the support portion are coupled.
  7. 제6항에 있어서,The method according to claim 6,
    상기 제2 방수부는 방수홈으로 이루어진 것인 커버부를 가진 방수 지문 센서 모듈.And the second waterproofing portion comprises a waterproof groove.
  8. 제6항에 있어서,The method according to claim 6,
    상기 제2 방수부는 상기 측부 접합면의 길이 방향을 따라 복수개로 형성된 것인 커버부를 가진 방수 지문 센서 모듈.And the second waterproof portion has a cover portion formed in a plurality of along the longitudinal direction of the side joint surface.
  9. 제6항에 있어서,The method according to claim 6,
    상기 하부 접합면은 상기 제2 방수부에 각각 연결된 높낮이 서로 다른 제3 접합면과 제4 접합면을 가지는 것인 커버부를 가진 방수 지문 센서 모듈.And the lower bonding surface has a third bonding surface and a fourth bonding surface different in height from each other connected to the second waterproofing portion.
  10. 제1항에 있어서,The method according to claim 1,
    상기 메인기판, 센서부 및 지지부가 만나는 교차지점에 수용공간이 형성되도록 상기 지지부에는 모따기면이 형성된 것인 커버부를 가진 방수 지문 센서 모듈.And a cover portion having a chamfered surface formed on the supporting portion so that a receiving space is formed at an intersection point where the main board, the sensor portion, and the support portion meet.
  11. 제1항에 있어서,The method according to claim 1,
    상기 접착부재는,Wherein the adhesive member comprises:
    상기 메인기판과 센서부 사이의 빈 공간에 채워지는 제1 접착제; 및A first adhesive that fills a void space between the main substrate and the sensor unit; And
    상기 메인기판과 지지부 사이에 개재되며, 상기 메인기판, 센서부 및 지지부를 접착하는 제2 접착제를 포함하며,And a second adhesive which is interposed between the main substrate and the supporting part and adheres to the main substrate, the sensor part and the supporting part,
    상기 제1 접착제는 상기 제2 접착제에 비해 액상상태에서의 점도가 낮은 것인 커버부를 가진 방수 지문 센서 모듈.Wherein the first adhesive has a lower viscosity in a liquid state than the second adhesive.
  12. 제11항에 있어서,12. The method of claim 11,
    상기 접착부재는,Wherein the adhesive member comprises:
    상기 메인기판 상에 구비된 도전성 부재와 상기 도전성 부재와 마주보는 상기 지지부의 접합면을 접착하는 제3 접착제를 더 포함하며,Further comprising a third adhesive for bonding a conductive member provided on the main substrate to a bonding surface of the conductive member and the support member facing the conductive member,
    상기 제2 접착제는 비도전성 소재로 이루어지고, 상기 제3 접착제는 도전성 소재로 이루어진 것인 커버부를 가진 방수 지문 센서 모듈.Wherein the second adhesive is made of a non-conductive material, and the third adhesive is made of a conductive material.
  13. 제12항에 있어서,13. The method of claim 12,
    상기 지지부는 상기 제3 접착제를 통해 상기 메인기판과 전기적으로 연결되는 것인 커버부를 가진 방수 지문 센서 모듈.And the support portion is electrically connected to the main board through the third adhesive.
  14. 제13항에 있어서,14. The method of claim 13,
    상기 지지부는 상기 센서부로 구동신호를 송출하도록 이루어진 것인 커버부를 가진 방수 지문 센서 모듈.And the support portion is configured to transmit a drive signal to the sensor portion.
PCT/KR2018/008987 2017-08-07 2018-08-07 Waterproof fingerprint sensor module having cover part WO2019031824A1 (en)

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