WO2017204570A1

WO2017204570A1 - Touch sensing device and electronic device including same

Info

Publication number: WO2017204570A1
Application number: PCT/KR2017/005448
Authority: WO
Inventors: 진광용; 김병섭; 박제원
Original assignee: 엘지이노텍(주)
Priority date: 2016-05-27
Filing date: 2017-05-25
Publication date: 2017-11-30
Also published as: KR20170134097A; KR102500652B1; CN209044569U

Abstract

A touch sensing device according to an embodiment comprises: a substrate; a bezel arranged on the substrate so as to define a sensing area, and having a contact part having conductivity; a fingerprint sensing unit arranged in the sensing area on the substrate; a plurality of contact pads electrically spaced from each other, and arranged on the substrate so as to be electrically spaced from each other while facing the contact part; a connecting unit having elasticity and an insulation property, and arranged between the bezel and the plurality of contact pads so as to cover a part of the plurality of contact pads and to open other parts thereof, and allowing the contact part of the bezel to come in contact with the opened other parts of the plurality of contact pads when the bezel is pressed, such that the plurality of opened other parts are electrically connected to each other; and a touch control unit for switching the touch sensing device into an operating state from a sleep state, when the opened other parts of the plurality of contact pads are electrically connected to each other.

Description

Touch sensing device and electronic device including same

An embodiment relates to a touch sensing device and an electronic device including the same.

Fingerprint sensing technology is widely used in biometric or authentication processes. For example, a fingerprint sensor (or fingerprint recognition sensor) included in a fingerprint sensing device used in an electronic device such as a smartphone is used to detect a human fingerprint.

1 is a schematic cross-sectional view of a conventional fingerprint sensing device.

Referring to FIG. 1, a conventional fingerprint sensing device includes a substrate 10, a fingerprint sensor 20, a bezel 30, a pad 40, a switch 50, and a back cover 60. It includes.

The fingerprint sensor 20 is disposed in the sensing area defined by the bezel 30 on the upper surface of the substrate 10. The switch 50 is disposed on the lower surface of the substrate 10, and the back cover 60 is disposed below the switch 50. The switch 50 is connected to the substrate 10 through the pad 40. Such a switch 50 is called a tactile switch or dome switch.

When the user's finger 1 touches the fingerprint sensor 20, the protrusion 52 of the switch 50 presses the back cover 60 by the pressure pressed by the finger. When the back cover 60 is pressed, the fingerprint sensing device is switched from a sleep state to an operating state for driving the substrate 10 and the fingerprint sensor 20.

As described above, in order to switch the fingerprint sensing device from the sleep state to the operating state, the fingerprint sensing device requires the pad 40, the switch 50, and the back cover 60, and its structure is complicated.

In addition, a reflow process is generally performed after the bezel 30 is formed on the substrate 10 by surface mounting technology (SMT). Therefore, there is a problem that adhesion failure between the bezel 30 and the substrate 10 increases.

The embodiment provides a touch sensing device having a simple structure and improved reliability and an electronic device including the same.

Touch sensing device according to an embodiment, the substrate; A bezel disposed on the substrate to define a sensing area and having a conductive contact portion; A fingerprint sensing unit disposed in the sensing area on the substrate; A plurality of contact pads electrically spaced apart from each other and disposed to be electrically spaced apart from each other on the substrate while facing the contact portion; Disposed between the bezel and the plurality of contact pads to cover a portion of the plurality of contact pads and to open the other portion, wherein the contact portion of the bezel contacts the opened other portions of the plurality of contact pads when the bezel is pressed; Connecting parts having elasticity and insulation to allow the plurality of opened other parts to be electrically connected to each other; And a touch controller configured to switch the touch sensing device from a sleep state to an operation state when each of the opened other parts of the plurality of contact pads is electrically connected to each other.

For example, the contact portion may include a bottom surface of the bezel.

For example, the connection part may include an insulating double-sided adhesive member for adhering the bezel to the substrate.

For example, the thickness of the connection portion may be 0.5 mm to 3 mm.

For example, the plurality of contact pads may include: a first contact pad disposed on the substrate and having an annular planar shape; And a second contact pad disposed outside the first contact pad and having an annular planar shape. The first and second contact pads may be concentric. The plurality of other opened parts of the contact pads may be symmetrical with each other in a plane. Widths of the plurality of opened other parts may be as follows.

Here, W denotes the width of the connection region in which the connection portion is disposed, and WS may correspond to the width of the plurality of opened other portions.

For example, the touch sensing device may include a power supply unit supplying power; And a switch disposed between the power supply unit and the substrate and configured to switch in response to a control signal, wherein the touch controller may generate the control signal when switching from the sleep state to the operating state.

For example, the bezel, the fingerprint sensing unit, the plurality of contact pads and the connection unit are disposed on a first surface of the substrate, and the touch controller is disposed on a second surface opposite to the first surface of the substrate. Can be.

For example, the bezel, the fingerprint sensing unit, the plurality of contact pads, the connection unit, and the touch control unit may be modularized.

For example, the bezel may include a lower portion facing the fingerprint sensing unit; And a cross-sectional shape extending from the lower portion, facing a space on an upper surface of the fingerprint sensing unit, and protruding toward the sensing region. The portion protruding from the upper portion of the bezel and the upper surface of the fingerprint sensing unit are spaced apart by a first separation distance in a pressing direction, and the contact portion of the bezel and the plurality of contact pads are separated by a second separation distance in the pressing direction. Can be spaced apart. The first and second separation distances may be equal to each other.

Touch sensing device according to another embodiment, the substrate; A bezel disposed on the substrate to define a sensing area; A fingerprint sensing unit disposed in the sensing area on the substrate; A plurality of contact pads electrically spaced apart from each other and disposed on the substrate; And a double-sided adhesive member disposed between the bezel and the substrate on which the plurality of contact pads are disposed to adhere the bezel to the substrate. For example, the double-sided adhesive member may have insulation and elasticity.

For example, the touch sensing device may further include a touch controller for checking whether the plurality of contact pads are electrically connected to each other, and controlling an operation of the touch sensing device in response to the result of the inspection.

For example, the substrate may include a first surface; And a second surface opposite to the first surface, wherein the bezel, the fingerprint sensing unit, the plurality of contact pads and the double-sided adhesive member are disposed on the first surface of the substrate, and the touch controller is disposed on the substrate. It may be disposed on the second surface of the.

According to another embodiment, an electronic device may include: the touch sensing device when the bezel, the fingerprint sensing unit, the plurality of contact pads, the double-sided adhesive member, and the touch control unit are not modularized; And a master controller for controlling the touch sensing device, wherein the touch controller is included in the master touch controller.

The touch sensing device and the electronic device including the same according to the embodiment can eliminate the poor adhesion between the bezel and the substrate, and can switch from the sleep state to the operating state through a simpler structure.

2 is a plan view of an electronic device including a touch sensing device according to an embodiment.

3 is a cross-sectional view according to an exemplary embodiment in which the touch sensing device illustrated in FIG. 2 is cut along the line II ′.

4 is a plan view according to an embodiment of the contact pads illustrated in FIG. 3.

5 is an enlarged cross-sectional view of a portion 'A' shown in FIG. 3.

6A to 6C illustrate plan views according to embodiments showing various numbers and positions of openings.

FIG. 7 is an enlarged cross-sectional view illustrating a modified state of portion 'A' illustrated in FIG. 3 when the bezel is pressed by a user.

8 is an enlarged cross-sectional view of a portion 'B' illustrated in FIG. 3.

9 is a cross-sectional view of an embodiment of the fingerprint sensing unit illustrated in FIG. 3.

FIG. 10 is a cross-sectional view of another embodiment of the fingerprint sensing unit shown in FIG. 3.

11 is a block diagram illustrating an operation of a touch sensing device according to an exemplary embodiment.

12A to 12D are cross-sectional views illustrating a method of manufacturing a touch sensing device according to an embodiment.

Hereinafter, the present invention will be described in detail with reference to the following examples, and the present invention will be described in detail with reference to the accompanying drawings. However, embodiments according to the present invention may be modified in many different forms, and the scope of the present invention should not be construed as being limited to the embodiments described below. Embodiments of the present invention are provided to more fully describe the present invention to those skilled in the art.

In the description of the present embodiment, when described as being formed on "on or under" of each element, the above (up) or down (down) ( on or under includes both that two elements are in direct contact with one another or one or more other elements are formed indirectly between the two elements.

In addition, when expressed as "up" or "on (under)", it may include the meaning of the downward direction as well as the upward direction based on one element.

Further, the relational terms such as "first" and "second," "upper / upper / up" and "lower / lower / lower", etc., as used below, may be used to refer to any physical or logical relationship between such entities or elements, or It may be used to distinguish one entity or element from another entity or element without necessarily requiring or implying an order.

Hereinafter, a touch sensing apparatus 200 according to an embodiment and an electronic device 1000 including the apparatus 200 will be described with reference to the accompanying drawings. For convenience, the touch sensing apparatus 200 and the electronic device 1000 including the same will be described using the Cartesian coordinate system (x-axis, y-axis, z-axis), but it can be described by other coordinate systems. In the Cartesian coordinate system, the x-axis, y-axis, and z-axis are orthogonal to each other, but embodiments are not limited thereto. That is, the x-axis, y-axis, and z-axis may intersect without being orthogonal to each other.

The touch sensing device 200 described below may correspond to any device including the substrate 210, the bezel 220, and the fingerprint sensing unit 230. In addition, although the touch sensing device 200 is described as sensing a fingerprint of a user's finger, the touch sensing device 200 may sense a touch of a stylus pen instead of the user's fingerprint, but is not limited to the sensing target.

In addition, the touch sensing device 200 may be applied to various electronic devices. For example, the touch sensing device 200 may be used in a field requiring user authentication. If user authentication is required, for example, unlocking, acknowledging online transactions or non-repudiation, access to device systems and services, including websites and emails, passwords and PINs Replacement of the phone, physical access such as door locks, various credentials in time and attendance management systems, finger-based input devices / navigation for mobile phones and gaming, or the use of finger-based shortcuts There is this. As such, the touch sensing device 200 may be used in various fields such as user authentication, registration, payment, or security.

As described above, the electronic device including the touch sensing device 200 that can be applied to various fields is, for example, a mobile phone, a smart phone, a personal digital assistant (PDA), a portable multimedia player (PMP). ), But may be a portable terminal or a non-portable terminal such as a laptop or tablet personal computer (PC), but the embodiment is not limited to a specific electronic device.

In addition, although the touch sensing device 200 according to the embodiment may be packaged or modularized and included in the electronic device 1000, the embodiment is not limited to a specific form in which the touch sensing device 200 is included in the electronic device 1000. Do not.

In addition, the electronic device 1000 as illustrated in FIG. 1 is described as an example to help the understanding of the touch sensing device 200 according to an embodiment, but the embodiment is not limited thereto. That is, the touch sensing apparatus 200 according to the embodiment may be included in various types of electronic devices different from the electronic device 1000 shown in FIG. 1.

2 is a plan view of an electronic device 1000 including a touch sensing device 200 according to an embodiment.

2, the electronic device 1000 according to the embodiment may include a cover glass 100, a touch sensing device 200, and a display unit 300.

The cover glass 100 protects the display unit 300 and is disposed on a front surface of the electronic device 1000. The display unit 300 may serve as a touch screen.

The touch sensing device 200 may operate a pointer by sensing a fingerprint of a user, a movement of a finger of the user, or a touch of a stylus. In FIG. 2, the touch sensing device 200 is illustrated as being disposed below the display unit 300 in the electronic device 1000, but the embodiment is not limited thereto. According to another embodiment, unlike FIG. 2, the touch sensing device 200 may be disposed above or on the side of the display 300. That is, the embodiment is not limited to the position where the touch sensing device 200 is disposed in the electronic device 1000.

3 is a cross-sectional view according to an exemplary embodiment in which the touch sensing device 200 illustrated in FIG. 2 is cut along the line II ′.

The touch sensing device 200 illustrated in FIG. 3 includes a substrate 210, a bezel 220, a fingerprint sensing unit 230, a plurality of contact pads 240, a connection unit 250, and a touch. The controller 260 may include a contact unit (CNT) 272 and various elements 274.

The substrate 210 may be a printed circuit board (PCB), for example, a flexible PCB or a non-flexible PCB having a flexible characteristic as a whole, but embodiments are not limited thereto.

The substrate 210 may serve to connect or communicate the fingerprint sensing unit 230 with an external device. In addition, the substrate 210 may serve to drive the fingerprint sensing unit 230. Therefore, the substrate 210 may be electrically connected to the fingerprint sensing unit 230 to transmit an electrical signal or information related thereto to the fingerprint sensing unit 230.

In addition, although not shown, a lead frame (not shown) may be further disposed below the substrate 210. The lead frame may be attached to the lower portion of the substrate 210 based on surface mounting technology (SMT).

In addition, the substrate 210 may include a first surface 210-1 and a second surface 210-2. Here, the second surface 210-2 corresponds to the surface opposite to the first surface 210-1.

Meanwhile, the bezel 220 is disposed on the substrate 210 to define the sensing area SA. Here, the sensing area SA corresponds to an embodiment of the fingerprint sensing area SA illustrated in FIG. 2, and is an area in which the fingerprint sensing unit 230 for sensing a fingerprint is disposed and includes a user's finger or a stylus pen. It may mean an area where the same input device is touched.

The bezel 220 may also function as an antenna for transmitting a driving signal for fingerprint detection toward the finger. In this case, the bezel 220 may be implemented with a metal such as stainless steel. Alternatively, the function of the antenna for transmitting the driving signal for fingerprint detection may be performed by the fingerprint sensing unit 230 instead of the bezel 220.

In addition, the bezel 220 may include a contact portion having conductivity. Here, the contact portion may refer to a portion which is lowered when the bezel 220 is pressed to contact the plurality of contact pads 240 as described below. For example, as illustrated in FIG. 3, the contact portion of the bezel 220 may include the lower surface 220-1 of the bezel 220, but the embodiment is not limited thereto. That is, as long as the bezel 220 touched by the finger is pressed to electrically connect the plurality of contact pads 240, the contact portion may be disposed at any portion of the bezel 220.

Although the entire bezel 220 may be made of a material having conductivity or non-conductivity, the contact portion of the bezel 220 may have electrical conductivity.

In addition, the plurality of contact pads 240 may be disposed on the substrate 210 while being electrically spaced apart from each other and facing the contact portion.

4 is a plan view according to an embodiment of the plurality of contact pads 240 shown in FIG. 3. For the convenience of describing the planar shape of the plurality of contact pads 240, the bezel 220, the fingerprint sensing unit 230, and the connection unit 250 illustrated in FIG. 3 are omitted in FIG. 4.

According to an embodiment, the plurality of contact pads 240 may include first and

second contact pads

242 and 244. The first and

second contact pads

242 and 244 may be electrically spaced apart from each other, and may have annular (or annular) planar shapes, respectively.

In addition, the first and

second contact pads

242 and 244 may be disposed in the bezel area BA on the substrate 210. Here, the bezel area BA may mean a region in which the bezel 220 defining the sensing area is disposed on the substrate 210.

The second contact pads 244 may be disposed outside the first contact pads 242. In the case of FIG. 4, the first and

second contact pads

242 and 244 are both shown to have a planar shape having a rectangular ring shape, but the embodiment is not limited thereto. According to another embodiment, the first and

second contact pads

242 and 244 may each have a planar shape of various polygonal annular shapes other than circular, elliptical, or square.

In addition, the first and

second contact pads

242 and 244 may have concentric (O). In addition, the first and

second contact pads

242 and 244 may be made of a material having electrical conductivity.

5 is an enlarged cross-sectional view of a portion 'A' shown in FIG. 3.

Referring to FIG. 5, the connection part 250 is disposed between the bezel 220 and the plurality of contact pads 240. That is, the connection part 250 may be disposed between the contact portion, which is the lower surface 220-1 of the bezel 220, and the first surface 210-1 of the substrate 210 in the bezel area BA of the substrate 210. Can be.

In addition, the connection part 250 may be arranged to cover a part of the plurality of contact pads 240 and to open the other part.

In addition, the number of other parts (hereinafter, the openings OP) of the plurality of contact pads 240 which are not covered by the connection part 250 and opened may be singular or plural.

6A to 6C illustrate plan views according to embodiments showing various numbers and positions of the openings OP.

6A to 6C omit the illustration of the bezel 220 and the fingerprint sensing unit 230 for convenience of description in the planar shape in which the connection part 250 is disposed, and the contact pads 240 and the connection part 250 may be omitted. It shows a planar shape.

As illustrated in FIGS. 6A to 6C, a plurality of openings OP may be provided. If there are a plurality of openings OP, the number of the connecting portions 250 is also plural.

In addition, the plurality of openings OP may be symmetrical to one another and may be asymmetrical on a plane. For example, the plurality of openings OP may be positioned symmetrically with respect to each other on a plane, and may have the same area for exposing the plurality of contact pads 240.

For example, the connection part 250 may include first to fourth openings OP1 to OP4 which are symmetrical to each other on a plane as shown in FIG. 6A. In this case, the connection part 250 may include four connection parts 250A (250A1, 250A2, 250A3, 250A) spaced apart from each other. The first and third openings OP1 and OP3 may be symmetric to each other in the z-axis direction, and the second and fourth openings OP2 and OP4 may be symmetric to each other in the y-axis direction.

Alternatively, the connection part 250 may include fifth and sixth openings OP5 and OP6 which are symmetrical to each other in the y-axis direction on the plane as shown in FIG. 6B, and z on the plane as shown in FIG. 6C. The seventh and eighth openings OP7 and OP8 may be symmetrical to each other in the axial direction.

In the case of FIG. 6B, the connection part 250 includes two connection parts 250B: 250B1 and 250B2 spaced apart from each other, and the connection part 250 includes two connection parts 250C: 250C1 and 250C2 spaced apart from each other. can do.

In addition, the widths W1 to W8 of the plurality of openings OP1 to OP8 may be the same as or different from each other. If the plurality of openings OP1 to OP8 are symmetric to each other on a plane, the widths W1 to W8 of these openings OP1 to OP8 are equal to each other.

In FIG. 6A, the first width W1 of the first opening OP1 corresponds to a distance where two connecting parts 250A1 and 250A3 are spaced apart from each other, and the second width W2 of the second opening OP2 is 2. Four connection parts 250A1 and 250A2 correspond to a distance spaced from each other, and a third width W3 of the third opening OP3 corresponds to a distance that two connection parts 250A2 and 250A4 are spaced apart from each other, and a fourth opening part. The fourth width W4 of OP4 corresponds to a distance from which the two connection parts 250A3 and 250A4 are spaced apart from each other.

In FIG. 6B, the fifth width W5 of the fifth opening OP5 corresponds to a distance from which one side 250B1-1 and 250B2-1 of the two connecting portions 250B1 and 250B2 are spaced apart from each other, and a sixth opening. The sixth width W6 of OP6 corresponds to a distance from which the other sides 250B1-2 and 250B2-2 of the two connection parts 250B1 and 250B2 are spaced apart from each other.

In FIG. 6C, the seventh width W7 of the seventh opening OP7 corresponds to a distance from which one side 250C1-1 and 250C2-1 of the two connection portions 250C1 and 250C2 are spaced apart from each other, and the eighth opening. The eighth width W8 of OP8 corresponds to a distance from which the other sides 250C1-2 and 250C2-2 of the two connection parts 250C1 and 250C2 are spaced apart from each other.

In addition, the connector 250 may have insulation, and may include an insulation material for this purpose.

In addition, in order to bond the bezel 220 to the substrate 210 and the contact pad 240, the connection part 250 may be adhesive. To this end, the connection part 250 may be implemented with an insulating double-sided adhesive member (eg, double-sided adhesive tape) that adheres the bezel 220 to the substrate 210 and the contact pad 240.

FIG. 7 is an enlarged cross-sectional view illustrating a modified state of portion 'A' illustrated in FIG. 3 when the bezel 220 is pressed by a user.

The connection part 250 may have elasticity. For example, when the bezel 220 is pressed by the user, as shown in FIG. 7, the contact portion 220-1 of the bezel 220 is lowered in the −x-axis direction so that the plurality of contact pads 240 may be 242. Contact the plurality of contact pads 240 (242 and 244) opened at the other opened portion of the second and second openings 244, that is, the openings OP1 to OP8. In this case, since the contact portion 220-1 has conductivity, it can be seen that the plurality of

contact pads

242 and 244 electrically separated from each other are electrically connected to each other by the contact portion 220-1. As such, when the bezel 220 is pressed by the user, the connection part 250 may have elasticity enough to allow the contact part 220-1 to descend and contact the plurality of

contact pads

242 and 244. . Also, when the user stops pressing, i.e., does not touch the bezel 220, the elasticity of the connection portion 250 causes the bezel 220 to move from the position shown in FIG. 7 to the position shown in FIG. It can be rolled back in the axial direction.

That is, when the bezel 220 is not pressurized, as shown in FIG. 5, the contact portion 220-1 of the bezel 220 and the plurality of

contact pads

242 and 244 are connected by the insulating connection portion 250. Are electrically spaced from each other, the plurality of

contact pads

242 and 244 are not electrically connected to each other. However, when the bezel 220 is pressed, the contact portion 220-1 of the bezel 220 and the plurality of

contact pads

242 and 244 are contacted by the elastic connection portion 250 as shown in FIG. 7. As a result, the plurality of

contact pads

242 and 244 may be electrically connected to each other.

When the bezel 220 is continuously used, that is, as the operation of pressing the bezel 220 is repeated, the inherent elasticity of the connection part 250 may be weakened. In this case, if the elasticity of the connection portion 250 is weakened by continuous use even when the user does not press the bezel 220, the bezel 220 when the thickness T of the connection portion 250 is smaller than 0.5 mm, for example. The adhesive part 220-1 may contact the plurality of contact pads 240: 242 and 244. In addition, when the thickness T of the connection part 250 is larger than 3 mm, when the elasticity of the connection part 250 is small or the user's pressing force is small, the user may press the bezel 220 even if the user presses the bezel 220. The adhesive part 220-1 may be difficult to contact the plurality of pads 240: 242 and 244. Therefore, the thickness T of the connection part 250 may be 0.5 mm to 3 mm, for example, 1 mm, but the embodiment is not limited thereto.

In addition, when the widths of the plurality of opened other portions, that is, the widths W1 to W8 of the openings (eg, OP1 to OP8) are smaller than 0.1 W, the exposed surfaces of the plurality of contact pads 240 (242 and 244) When the bezel 220 is pressed down, the contact portion 220-1 may be difficult to contact the contact pad 240. Here, W represents the width of the connection area CA in which the connection part 250 is disposed. W may correspond to the width WH in the horizontal direction (for example, the y-axis direction) of the connection area CA shown by the dotted line in FIG. 4 and in the vertical direction (for example, the z-axis direction). It may also correspond to the width WV. In addition, when the width W of the plurality of opened other parts is greater than 0.7W, the contact part 220-1 may contact the contact pad 240 even though the user does not press the bezel 220. Accordingly, the widths of the plurality of opened other portions, that is, the widths of the openings may be expressed as in Equation 1 below, but the embodiment is not limited thereto.

Here, WS is the width of the opening, for example, may be W1 to W8.

6A to 6C, when the plurality of openings OP1 to OP8 are not symmetrically arranged and are arranged asymmetrically as shown in FIGS. 6A to 6C, the contact portion of the bezel 220 is disposed. Since the pressure 220-1 contacts the plurality of contact pads 240 (242, 244) exposed at the openings OP1 to OP8 is not uniform, the bezel 220 is repeatedly pressurized and thus the contact portion 220- is pressed. 1) or at least one of the plurality of contact pads 240 242 and 244 may be modified. Therefore, as described above, the plurality of openings OP1 to OP8 may be located symmetrically with each other on the plane. To this end, the first and

second contact pads

242 and 244 may have concentricity O as shown in FIGS. 4 and 6A to 6C.

8 is an enlarged cross-sectional view of a portion 'B' illustrated in FIG. 3.

Referring to FIG. 8, the bezel 220 may include a lower portion 220B and an upper portion 220T. The lower portion 220B of the bezel 220 may refer to a portion facing the fingerprint sensing unit 230 in the horizontal direction (eg, the y-axis direction). In addition, the upper portion 220T of the bezel 220 may extend from the lower portion 220B and may mean a portion facing the space on the upper surface 230-1 of the fingerprint sensing unit 230. In this case, the upper portion 220T of the bezel 220 may have a cross-sectional shape protruding toward the sensing area SA. At this time, the first separation distance d1 in the pressing direction (for example, the x-axis direction) between the protruding portion of the upper portion 220T of the bezel 220 and the upper surface 230-1 of the fingerprint sensing unit 230. ) May be equal to the second separation distance d2 in the pressing direction between the contact portion 220-1 of the bezel 220 and the plurality of contact pads 240: 242 and 244. As such, when the first and second separation distances d1 and d2 are equal to each other, the plurality of contact pads 240 may be damaged by the bezel 220 when the user excessively presses the bezel 220. It is possible to prevent the contact portion 220-1 of the bezel 220 from being damaged by the contact pad 240.

8 is a cross-sectional view when the user does not press the bezel 220, when the user presses the bezel 220, the bottom surface 220-2 of the protruding portion of the upper portion 220T of the bezel 220 ) May contact the upper surface 230-1 of the fingerprint sensing unit 230.

Meanwhile, the fingerprint sensing unit 230 is disposed on the substrate 210 in the form of a semiconductor chip to sense a fingerprint. For example, as illustrated in FIG. 3, the fingerprint sensing unit 230 may be disposed on the first surface 210-1 of the substrate 210 by surface mount technology (SMT).

In addition, the fingerprint sensing unit 230 may include a fingerprint sensor having a sensing area in which pixels are arranged in an array form. The fingerprint sensing unit 230 may find a difference in capacitance due to the height difference according to the shape of the ridge and valley of the finger fingerprint. For this purpose, the fingerprint sensing unit 230 scans an image of the fingerprint as the finger moves. You can create an image. For example, the fingerprint sensing unit 230 may read a fragmentary fingerprint image by sensing a fingerprint and then match the fragment fingerprint image into one image to implement an intact fingerprint image.

In addition, the fingerprint sensing unit 230 previously stores information on a feature point of the fingerprint (for example, a portion of the fingerprint such as the Y point), and compares the feature point obtained from the fingerprint image with previously stored information. It can also detect whether the fingerprint match.

In addition, the fingerprint sensing unit 230 may track not only the function of fingerprint detection but also the presence of a finger or the movement of a finger, thereby moving a pointer such as a cursor or receiving desired information or a command from a user.

For the above-described operation, the fingerprint sensing unit 230 may include a driving electrode (not shown) for transmitting a driving signal toward the fingerprint of the user and a receiving electrode (not shown) for receiving a signal passing through the fingerprint of the user. . The driving electrode is made of a conductive polymer to achieve a role of transmitting the driving signal and can be implemented in various shapes and colors.

The embodiment is not limited to the manner in which the fingerprint sensing unit 230 senses a fingerprint. That is, the fingerprint sensing unit 230 may be an ultrasonic method, an infrared method, or a capacitive fingerprint sensor classified according to an operating principle.

The embodiment is not limited to the specific structure of the fingerprint sensing unit 230. An exemplary configuration of the fingerprint sensing unit 230 is as follows.

FIG. 9 is a cross-sectional view of an embodiment 230A of the fingerprint sensing unit 230 shown in FIG. 3.

Referring to FIG. 9, the fingerprint sensing unit 230A according to an embodiment may include a molding unit 312, an adhesive unit 314, a fingerprint sensor 316, a wire 318, and a protective film 320. .

The adhesive part 314 may be disposed between the fingerprint sensor 316 and the substrate 210. Here, since the substrate 210 corresponds to the substrate 210 illustrated in FIG. 3, the same reference numerals are used, and overlapping descriptions are omitted.

The adhesive part 314 may be an epoxy adhesive that adheres and fixes the fingerprint sensor 316 to the substrate 210. However, the embodiment is not limited thereto. That is, according to another embodiment, the fingerprint sensing unit 230A may not include the adhesive unit 314. In this case, for example, the fingerprint sensor 316 and the substrate 210 may be fitted or coupled to each other. It may be.

The fingerprint sensor 316 receives a signal that is returned after the user's fingerprint is received, and may include pixels arranged in an array form. The fingerprint sensor 316 may find a difference in capacitance due to a difference in height depending on a valley of a fingerprint of the user's finger and a mountain shape, and receive a difference in an electrical signal of a fingerprint as the finger moves. It may include an electrode and a receiving electrode. In addition, the fingerprint sensor 316 serves to sense and process a fingerprint image, and may be an integrated IC.

The protective film 320 may be disposed between the upper surface of the fingerprint sensor 316 and the molding part 312 to serve to protect the fingerprint sensor 316 from the molding part 312. In some cases, the protective film 320 may be omitted from the fingerprint sensing unit 230A.

The wire 318 may serve to electrically connect the fingerprint sensor 316 to the substrate 210. For example, the wire 318 may comprise gold (Au).

The molding part 312 may be disposed on the substrate 210 while surrounding the fingerprint sensor 316 and the wire 318. The molding part 312 may be made by injection or mold. The molding part 312 may be implemented using a liquid polymer. For example, the molding part 312 may include at least one of an epoxy mold compound (EMC), an epoxy resin, a putty, or a polyphthalamide (PPA) resin. In order to reduce or eliminate plastic shrinkage during thermal curing when manufacturing the molding part 312, the molding part 312 may include silica gel. EMC, which is used as the molding part 312, is harder than the PC series formed by general injection, thereby preventing tolerances and improving flatness, as well as chips that appear in general injection even after a high temperature process. The chip mark can be reduced. In addition, the molding part 312 may contribute to enhancing the reliability of the fingerprint sensing part 230A by bringing the fingerprint sensing part 230A into close contact with the bottom surface of the substrate 210.

10 is a cross-sectional view of another embodiment 230B of the fingerprint sensing unit 230 shown in FIG. 3.

Referring to FIG. 10, the fingerprint sensing unit 230B according to another embodiment may include the sensor substrate 340, the pad 342, the fingerprint sensor 346, the solder unit 348, and the first and second lower layers (or, underfill layers) 344 and 350.

The sensor substrate 340 may include first and second surfaces 340A and 340B. The first surface 340A of the sensor substrate 340 corresponds to the surface facing the substrate 210, and the second surface 340B corresponds to the surface opposite to the first surface 340A. Here, since the substrate 210 corresponds to the substrate 210 illustrated in FIG. 3, the same reference numeral is used, and overlapping descriptions are omitted.

The sensor substrate 340 is a portion for receiving the difference between the electrical signal of the valley and the acid of the fingerprint of the user's finger, and may include a driving electrode and the receiving electrode, but embodiments are not limited thereto. That is, the driving electrode and the receiving electrode may not be included at the same time in the sensor substrate 340.

The fingerprint sensor 346 senses and processes a fingerprint image and may be an integrated IC.

The fingerprint sensor 316 of the fingerprint sensing unit 230A illustrated in FIG. 9 performs both the sensor substrate 340 and the fingerprint sensor 346 illustrated in FIG. 10. On the other hand, the sensor substrate 340 and the fingerprint sensor 346 illustrated in FIG. 10 may share the roles of the fingerprint sensor 316 illustrated in FIG. 9. Accordingly, the touch sensing device 200 including the fingerprint sensing unit 230A illustrated in FIG. 9 is referred to as an integrated touch sensing apparatus, and the touch sensing apparatus 200 including the fingerprint sensing unit 230B illustrated in FIG. 10. May be referred to as a separate touch sensing device.

The pad 342 electrically connects the fingerprint sensor 346 and the first surface 340A of the sensor substrate 340. To this end, the pad 342 is disposed between the fingerprint sensor 346 and the first surface 340A of the sensor substrate 340. The pad 342 may be implemented with a conductive material, and the embodiment is not limited to a specific material of the pad 342.

The solder portion 348 may be disposed between the first surface 340A of the sensor substrate 340 and the substrate 210 to electrically connect the sensor substrate 340 and the substrate 210 to each other. . Thus, the solder portion 348 may be implemented with a conductive material, and the embodiment is not limited to a specific material of the solder portion 348.

The first lower layer 344 may be disposed to surround the connection portion between the fingerprint sensor 346 and the sensor substrate 340. Thus, the pad 342 may be wrapped by the first lower layer 344 to be protected from the outside.

The second lower layer 350 is disposed between the first surface 340A of the sensor substrate 340 and the first surface 210-1 of the substrate 210 to form the first lower layer 344 and the fingerprint sensor 346. ) And the solder part 348 may be disposed to surround the solder part 348.

The materials of the first and second

lower layers

344 and 350 may be the same or different from each other. Each of the first and second

lower layers

344 and 350 may be manufactured by curing liquid EMC, but the embodiment is not limited to a specific material of each of the first and second

lower layers

344 and 350. In addition, at least one of the first or second

lower layers

344 and 350 may be omitted.

Meanwhile, the functional layer 330 illustrated in FIGS. 9 and 10 is disposed on the

fingerprint sensors

316 and 346. In FIG. 9, the functional layer 330 is disposed on the fingerprint sensor 316 with the molding part 312 interposed therebetween. In FIG. 10, the functional layer 330 is the second surface 340B of the sensor substrate 340. Is placed on top.

The functional layer 330 may include at least one of a primer layer 332, a color layer 334, or a protective layer 336.

For example, as illustrated in FIGS. 9 and 10, the functional layer 330 may include all of the primer layer 332, the color layer 334, and the protective layer 336.

9 and 10, the functional layer 330 may include the protective layer 336 and the primer layer 332, but may not include the color layer 334. Alternatively, the functional layer 330 may include the protective layer 336 and the color layer 334, but may not include the primer layer 332. Alternatively, the functional layer 330 may include the primer layer 332 and the color layer 334, but may not include the protective layer 336. Alternatively, the functional layer 330 may include only the primer layer 332, the color layer 334, or the protective layer 336, and the functional layer 330 may be omitted.

First, the primer layer 332 serves as a base layer, may be a coating of a reflective material, it may be implemented by a silver coating. For example, the base layer may be implemented to include paint and silver (Ag) particles pulverized into nano-molecules. The base layer may reflect light from the upper portions of the

fingerprint sensing units

230A and 230B so that the colors of the

fingerprint sensing units

230A and 230B may not be exposed to the outside.

For example, referring to FIG. 9, the base layer may prevent the color of the molding part 312 from being exposed to the outside. As such, the base layer may play a role of improving the hiding power of the molding part 312. In addition, the base layer may prevent the chip marks, which may be occasionally generated due to tolerances of the mold die, during the manufacturing of the molding part 312 so that they may not be displayed externally, thereby providing a concealment effect on chip mark defects. .

In addition, the primer layer 332 may serve as a kind of adhesive to help the stable application of the color layer 334.

The color layer 334 may be disposed between the protective layer 336 and the primer layer 332. If the functional layer 330 does not include the primer layer 332, the color layer 334 is disposed between the protective layer 336 and the molding part 312 in FIG. 9, and in the case of FIG. 10. It may be disposed between the layer 336 and the sensor substrate 340.

The color layer 334 serves to match or similar the color of the touch sensing device 200 to its surroundings. For example, referring to FIG. 9, since the color of the molding part 312 is usually black, the color layer 334 serves to reproduce a separate color to conceal it.

The color layer 334 may include a paint and color pigments that are pulverized into nanoparticles. The paint pulverized with the nanomolecules constituting the color layer 334 may be the same material as the silicon paint pulverized with the nanomolecules constituting the primer layer 332, and may be a silicon-based material, but embodiments are limited thereto. It doesn't work. The color layer 334 may have a color through mixing and coloring of the paint pulverized with the nano-molecule and the nano-sized color pigment. Here, the color pigment may include at least one of titanium oxide (TiO 2) or nickel oxide (NiO 2), but embodiments are not limited thereto. The color pigment may be appropriately selected according to the color to be implemented in the color layer 334.

The protective layer 336 is disposed on the color layer 334, and may be implemented in various forms depending on the texture to be implemented. For example, a hairline may be patterned on the protective layer 336. The hairline may be in the form of thin solid lines and may be patterned at regular intervals. In addition, the protective layer 336 may have various patterns.

In addition, when the protective layer 336 is coated, a separate material may be further added to exhibit a texture such as a pearl material.

The protective layer 336 may be formed using an ultraviolet (UV) curing paint. The UV curable paint is a paint cured by UV, not thermal curing, and has a resin or oligomer as a main skeleton resin, and is composed of a UV curable monomer (mainly acrylic), a photoinitiator, and other additives. Here, the photoinitiator serves to make the state capable of polymerization by receiving ultraviolet light. When pigment is added, it is difficult to pass UV, so it is often used as a transparent material. When a pigment is added, it is limited to a very thin coating. UV curing paints can be cured in a short time and are economical in all respects, enabling low temperature curing. In addition, since the UV cured paint is controlled at a temperature of about 10 ° C. higher than room temperature, it is also suitable for products with weak heat, and has high hardness and excellent friction resistance. UV-curable paints are available in both solvent-free and solvent-type, and are highly suited for flat coating.

In addition, although the functional layer 330 may have a coated form, the embodiment is not limited to a specific form of the functional layer.

On the other hand, although not shown, the portion where the fingerprint is touched in the above-described touch sensing device 200 may have a concave shape similar to the shape of the finger. As such, when the concave shape has a concave shape, the area of the touched portion of the fingerprint is enlarged, thereby obtaining more data on the fingerprint image. For example, when the functional layer 330 is omitted, the upper surface of the molding part 312 may have a concave shape so as to widen the contact area with the finger. Alternatively, when the functional layer 330 is not omitted, the functional layer 330 or the functional layer 330 and the molding part 312 may have a concave shape. However, the embodiment is not limited to the specific shape of the functional layer 330 and the molding portion 312.

In addition, according to an embodiment, the fingerprint sensor 316 may be electrically connected to the substrate 210 through the wire 318 as shown in FIG. 9, but the embodiment is not limited thereto. That is, the fingerprint sensor 316 may be electrically connected to the substrate 210 in various ways without using the wire 318. According to another embodiment, as illustrated in FIG. 10, the fingerprint sensor 346 may be electrically connected to the substrate 210 through the solder portion 348. The embodiment is not limited to a particular form in which the

fingerprint sensors

316 and 346 and the substrate 210 are electrically connected to each other.

Meanwhile, the touch controller 260 controls the operation of the touch sensing device 200. For example, the touch controller 260 may switch the touch sensing device 200 from a sleep state to an operation state or from the operation state to a sleep state.

Here, the sleep state is a state in which the power consumption of the touch sensing device 200 is minimized. For example, the sleep state may be a state in which power is not supplied to the substrate 210 and the fingerprint sensing unit 230. In the sleep state, only a predetermined power may be applied to the touch controller 260. This is because the touch controller 260 needs to receive a predetermined power to check whether the transition from the sleep state to the operating state is necessary.

In addition, the operation state is a state that consumes more power than the sleep state, and refers to a state in which power is supplied to the substrate 210 and the fingerprint sensing unit 230 and waiting until the fingerprint is touched by the fingerprint sensing unit 230. can do.

The touch controller 260 may contact the contact portion 220-1 with the

contact pads

242 and 244 exposed through the openings of the plurality of contact pads 240: 242 and 244, that is, the openings OP1 to OP8. Check that they are electrically connected to each other. When the first and

second contact pads

242 and 244 are electrically connected to each other by the contact unit 220-1, the touch controller 260 may cause the touch sensing device 200 to switch from a sleep state to an operating state. Can be.

FIG. 11 is a block diagram illustrating an operation of the touch sensing apparatus 200 according to an embodiment, and includes a power supply unit 280, a switch 282, a substrate 210, and a touch controller 260. For convenience of description, each

component

220, 230, 240, 250, which is disposed on the first surface 210-1 and the second surface 210-2 of the substrate 210 in addition to the touch controller 260 in FIG. 11. 272 and 274 are omitted.

The power supply unit 280 serves to supply power. In FIG. 11, the touch sensing device 200 is illustrated as including a power supply unit 280, but the embodiment is not limited thereto. That is, according to another exemplary embodiment, the touch sensing device 200 may not include the power supply unit 280. In this case, the power supply unit 280 may be included in the electronic device 1000 to supply power to the touch sensing device 200.

The switch 282 is disposed between the power supply unit 280 and the substrate 210 and switches in response to the control signal CS output from the touch controller 260. The touch controller 260 generates a control signal CS when switching from the sleep state to the operating state. For example, the switch 282 is switched on at the first logic level to provide power from the power supply 280 to the substrate 210 and to be switched off at the second logic level to turn off the power supply 280. The path from which power is supplied to the substrate 210 may be blocked. To this end, the touch controller 260 outputs a control signal CS of the first logic level when switching from the sleep state to the operating state, and control signal CS of the second logic level when switching from the operating state to the sleep state. ) Can be printed.

Meanwhile, the bezel 220, the fingerprint sensing unit 230, the plurality of contact pads 240 and the connection unit 250 are disposed on the first surface 210-1 of the substrate 210 and the touch controller 260. May be disposed on the second surface 210-2 of the substrate 210. In addition, various passive elements 274 such as resistors, inductors, or capacitors may be further disposed on the second surface 210-2 of the substrate 210. In addition, a contact portion 272 for connecting the substrate 210 with an external device may be further disposed on the second surface 210-2 of the substrate 210.

In addition, the bezel 220, the fingerprint sensing unit 230, the plurality of contact pads 240, the connection unit 250, and the touch controller 260 may be modular or not modular.

The non-modular touch sensing device 200 may be included in the mobile electronic device 1000 as shown in FIG. 2, and the modular touch sensing device 200 may be another non-mobile electronic device as shown in FIG. 2. It may also be included.

If the touch sensing device 200 is not modular, the touch controller 260 illustrated in FIG. 3 may correspond to or be included in a master controller (not shown) of the electronic device 1000. Here, the master controller can control the electronic device 1000 including the touch sensing device 200.

Hereinafter, a method of manufacturing the touch sensing device 200 according to an embodiment will be described with reference to the accompanying drawings.

12A to 12D are cross-sectional views illustrating a method of manufacturing the touch sensing device 200 according to an embodiment.

First, as shown in FIG. 12A, the touch controller 260, the connector 272, and the passive element 274 are mounted on the second surface 210-2 of the substrate 210 by surface mount technology (SMT). can do. Thereafter, a reflow process is performed. Here, the reflow process may mean a process of removing an organic material of the solder paste to solidify the solder.

Thereafter, as illustrated in FIG. 12B, the fingerprint sensing unit 230 is mounted on the first surface 210-1 of the substrate 210 by surface mounting technology. Thereafter, a reflow process is performed.

12C and 4, a plurality of contact pads 240: 242 and 244 are formed around the fingerprint sensing unit 230, and a connection part such as a double-sided tape as illustrated in FIGS. 6A to 6C. (250, 250A1 to 250A4, 250B, 250C) are formed in the bezel area BA.

Thereafter, as shown in FIG. 12D, the bezel 220 is fixed to the first surface 210-1 of the substrate 210 using the double-sided tape 250.

When manufacturing the conventional touch sensing device shown in FIG. 1, after placing the fingerprint sensor 20 on the substrate 10 and mounting the bezel 30 on the substrate 10 by surface mount technology (SMT) Perform the reflow process. Therefore, there is a problem that adhesion failure between the bezel 30 and the substrate 10 increases.

On the other hand, when manufacturing the touch sensing device of the embodiment, the fingerprint sensing unit 230 is formed on the first surface 210-1 of the substrate 210 and the bezel 220 is double-sided after performing the reflow process. The tape 250 is used to adhere to the substrate 210. Therefore, the defective rate can be reduced.

In addition, in the conventional touch sensing device illustrated in FIG. 1, a separate switch 50 and a back cover 60 are required to implement a wake-up function of switching from a sleep state to an operating state. .

On the other hand, in the touch sensing apparatus 200 according to the embodiment, since the bezel 220, the plurality of pads 240 and the connection unit 250 implements the wake up function, a separate switch 50 or the back cover 60 is unnecessary. Therefore, the configuration of the touch sensing apparatus according to the embodiment for implementing the wake up function is simpler than before.

Although the above description has been made based on the embodiments, these are merely examples and are not intended to limit the present invention. Those skilled in the art to which the present invention pertains may not have been exemplified above without departing from the essential characteristics of the present embodiments. It will be appreciated that many variations and applications are possible. For example, each component specifically shown in the embodiment can be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

Embodiments for carrying out the invention have been described fully in the foregoing "Best Modes for Carrying Out the Invention".

The touch sensing device according to the embodiment may be used in various fields requiring user authentication, registration, payment, or security, and the electronic device may be, for example, a mobile phone, a smartphone, a portable information terminal, a portable multimedia player, a laptop, or a tablet. It can be used in a portable terminal or a non-portable terminal such as a personal computer.

Claims

In the touch sensing device,

Board;

A bezel disposed on the substrate to define a sensing area and having a conductive contact portion;

A fingerprint sensing unit disposed in the sensing area on the substrate;

A plurality of contact pads electrically spaced apart from each other and disposed to be electrically spaced apart from each other on the substrate while facing the contact portion;

Disposed between the bezel and the plurality of contact pads to cover a portion of the plurality of contact pads and to open the other portion, wherein the contact portion of the bezel contacts the opened other portions of the plurality of contact pads when the bezel is pressed; Connecting parts having elasticity and insulation to allow the plurality of opened other parts to be electrically connected to each other; And

And a touch controller configured to switch the touch sensing device from a sleep state to an operating state when each of the opened other parts of the plurality of contact pads is electrically connected to each other.
The touch sensing device of claim 1, wherein the contact part comprises a bottom surface of the bezel.
The touch sensing device of claim 1, wherein the connection part comprises an insulating double-sided adhesive member that adheres the bezel to the substrate.
The touch sensing device of claim 1, wherein the connection part has a thickness of 0.5 mm to 3 mm.
The method of claim 1, wherein the plurality of contact pads

A first contact pad disposed on the substrate and having an annular planar shape; And

And a second contact pad disposed outside the first contact pad and having an annular planar shape.
The touch sensing device of claim 5, wherein the first and second contact pads are concentric.
The touch sensing device of claim 1, wherein a plurality of other opened parts are opened in the plurality of contact pads, and the plurality of opened other parts are symmetric to each other in a plane.
The touch sensing device of claim 7, wherein a width of the plurality of opened other parts is as follows.

(W represents the width of the connection region in which the connecting portion is disposed, and WS corresponds to the width of the plurality of opened other portions.)
The method of claim 5, wherein the touch sensing device

A power supply unit supplying power; And

A switch disposed between the power supply unit and the substrate and configured to switch in response to a control signal;

And the touch controller generates the control signal when switching from the sleep state to the operating state.
The display device of claim 1, wherein the bezel, the fingerprint sensing unit, the plurality of contact pads, and the connection unit are disposed on a first surface of the substrate, and the touch controller is disposed on a second surface opposite to the first surface of the substrate. Touch sensing device disposed in the.
The touch sensing device of claim 1, wherein the bezel, the fingerprint sensing unit, the plurality of contact pads, the connection unit, and the touch control unit are modularized.
The method of claim 1 wherein the bezel is

A lower portion facing the fingerprint sensing unit; And

And a cross-sectional shape extending from the lower portion and facing a space on an upper surface of the fingerprint sensing portion and protruding toward the sensing area.
The method of claim 12, wherein the portion protruding from the upper portion of the bezel and the upper surface of the fingerprint sensing portion are spaced apart by a first separation distance in a pressing direction.

And the contact portion of the bezel and the plurality of contact pads are spaced apart by a second separation distance in the pressing direction.
The touch sensing device of claim 13, wherein the first and second separation distances are the same.
In the touch sensing device,

Board;

A bezel disposed on the substrate to define a sensing area;

A fingerprint sensing unit disposed in the sensing area on the substrate;

A plurality of contact pads electrically spaced apart from each other and disposed on the substrate; And

And a double-sided adhesive member disposed between the bezel and the substrate on which the plurality of contact pads are disposed to adhere the bezel to the substrate.
The touch sensing device of claim 15, wherein the double-sided adhesive member has insulation and elasticity.
The touch sensing device of claim 15, further comprising: a touch controller configured to inspect whether the plurality of contact pads are electrically connected to each other, and to control an operation of the touch sensing device in response to the checked result.
The method of claim 17, wherein the substrate

First side; And

A second side opposite the first side;

The bezel, the fingerprint sensing unit, the plurality of contact pads and the double-sided adhesive member are disposed on the first surface of the substrate,

The touch controller is disposed on the second surface of the substrate.
The touch sensing device of claim 17, wherein the bezel, the fingerprint sensing unit, the plurality of contact pads, the double-sided adhesive member, and the touch control unit are not modular.
The touch sensing device of claim 19;

It includes a master control unit for controlling the touch sensing device,

The touch controller is included in the master touch controller.