CN106874853A - Sound wave type fingerprint identification device and preparation method thereof and apply its electronic installation - Google Patents
Sound wave type fingerprint identification device and preparation method thereof and apply its electronic installation Download PDFInfo
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- CN106874853A CN106874853A CN201710033511.7A CN201710033511A CN106874853A CN 106874853 A CN106874853 A CN 106874853A CN 201710033511 A CN201710033511 A CN 201710033511A CN 106874853 A CN106874853 A CN 106874853A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
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Abstract
A kind of sound wave type fingerprint identification device, the ultrasonic sensing unit and signal transmission unit on the circuit substrate surface are formed at including circuit substrate, one, contain circuit on the circuit substrate, the ultrasonic sensing unit includes being arranged at the surface of circuit substrate one and the first electrode, a piezoelectric polymer layer and the second electrode that are electrically connected with the circuit, the signal transmission unit electrically connects the circuit and the second electrode to realize signal transmission, the second electrode and piezoelectric polymer layer directly contact, the second electrode is the outer protective structure of the ultrasonic sensing unit.The present invention also provides the preparation method of the sound wave type fingerprint identification device, and using the electronic installation of the sound wave type fingerprint identification device.
Description
Technical field
The present invention relates to a kind of sound wave type fingerprint identification device and preparation method thereof and using the sound wave type fingerprint recognition
The electronic installation of device.
Background technology
As portable electron device is widely used, user proposes more functions to portable electron device and needs
Ask.Fingerprint identification device due to being arranged in portable electron device with privacy protection function, to increase Consumer's Experience.
Fingerprint identification device can be divided into optical profile type, condenser type, sound wave type etc..Sound wave type fingerprint identification device is difficult by environment because of its operation
The influence of temperature, humidity, and with long lifespan, resolution is high and is used widely.
Ultrasonic fingerprint recognition component is capable of identify that the fingerprint of the finger being placed on the fingerprint recognition element.When using
Be placed on its finger when on the surface of the fingerprint recognition element by person, and the fingerprint of the finger of user will be identified, and then test
Demonstrate,prove the identity information of the user.
In traditional architectures, also have at least one between the ultrasonic wave sensing unit and its overcoat in ultrasonic wave recognition component
Layer adhesive-layer.An electrode in ultrasonic wave sensing unit is silver paste, and silver paste and adhesive-layer are prepared by way of wire mark, the system
Standby process easily makes to produce bubble in structure.Bubble present in structure can cause bad shadow to the sensing of ultrasonic wave recognition component
Ring, how to eliminate or avoid the influence is those skilled in the art's urgent problem.
The content of the invention
In view of this, the present invention provides a kind of sound wave type fingerprint identification device, and the sound wave type fingerprint identification device is effectively solved
The problem certainly being had undesirable effect to the sensing of ultrasonic wave recognition component by bubble present in structure, makes discrimination results more
Accurately.
Separately, the preparation method and application sound wave type fingerprint recognition dress of a kind of sound wave type fingerprint identification device are also provided
The electronic installation put.
Sound wave type fingerprint identification device, including circuit substrate, a ultrasonic sensing unit for being formed at the circuit substrate surface
And signal transmission unit, containing circuit on the circuit substrate, the ultrasonic sensing unit includes being arranged at the table of circuit substrate one
Face and the first electrode, a piezoelectric polymer layer and the second electrode that are electrically connected with the circuit, signal transmission unit electricity
The circuit and the second electrode are connected to realize signal transmission, the second electrode and piezoelectric polymer layer directly contact, this second
Electrode is the outer protective structure of the ultrasonic sensing unit.
A kind of preparation method of above-mentioned sound wave type fingerprint identification device, comprises the following steps：
One battery lead plate is provided, a piezoelectric polymer layer is coated with a surface of the battery lead plate；
Dry piezoelectric polymer layer and crystallize polarization shaping；
One flexible circuit board is provided, the flexible circuit board and battery lead plate are formed without the surface electricity of the piezoelectric polymer layer
Property connection；
One circuit substrate is provided, is electrically connected with the circuit containing circuit and positioned at the surface of circuit substrate on the circuit substrate
The first electrode for connecing, and it is coated with an adhesive-layer in the surface region that the circuit substrate forms the first electrode；
The battery lead plate of the piezoelectric polymer layer that is formed with is placed on the first electrode, makes the adhesive-layer and the pressure
Electropolymerization nitride layer is bonded；
The flexible circuit board is electrically connected with the circuit of the circuit substrate.
The preparation method of another above-mentioned sound wave type fingerprint identification device, comprises the following steps：
One circuit substrate is provided, is electrically connected with the circuit containing circuit and positioned at the surface of circuit substrate on the circuit substrate
The first electrode for connecing, and it is coated with a piezoelectric polymer layer in the surface region that the circuit substrate forms the first electrode；
Piezoelectric polymer layer humidity reduction is made by drying process, but does not make its drying crystalline；
One battery lead plate is provided, the battery lead plate is fitted in into the piezoelectric polymer layer away from the side surface of circuit substrate one；
It is completely dried the piezoelectric polymer layer and crystallizes polarization shaping, the battery lead plate is thus viscous with the piezoelectric polymer layer
Knot is together；
The second electrode is set to be electrically connected with a flexible circuit board, while making the circuit of the circuit substrate and the flexible circuit
Plate is electrically connected with.
In traditional architectures, there are at least one of which adhesive-layer, second electrode and adhesive-layer between second electrode and overcoat
Prepared by way of wire mark, the preparation process easily makes to produce bubble in structure.And sound wave type fingerprint recognition dress of the invention
In putting, second electrode has the effect of overcoat concurrently, therefore, sound wave type fingerprint identification device subtracts compared to traditional structure on processing procedure
Lack multiple screen printing processing, it is to avoid influence of the produced bubble to ultrasonic wave sensing result during wire mark, it is not necessary to
Second electrode surface additionally sets overcoat again, makes sensing result more accurate.Simultaneously as second electrode also has overcoat concurrently
Effect so that product structure is more simple, and ultrasonic wave needs the number of layers for penetrating to greatly reduce in transmittance process, reduce
The generation of noise and save material and processing procedure.
Brief description of the drawings
Fig. 1 is the schematic perspective view of the sound wave type fingerprint identification device of first embodiment of the invention.
Fig. 2 is sectional views of the Fig. 1 along II-II.
Fig. 3 is the preparation method schematic flow sheet of the sound wave type fingerprint identification device of first embodiment of the invention.
Fig. 4 is the schematic perspective view of the sound wave type fingerprint identification device of second embodiment of the invention.
Fig. 5 is sectional views of the Fig. 4 along V-V.
Fig. 6 is the preparation method schematic flow sheet of the sound wave type fingerprint identification device of second embodiment of the invention.
Fig. 7 is the electronic installation schematic diagram of the preferred embodiment using sound wave type fingerprint identification device of the present invention.
Fig. 8 is schematic cross-sectional views of the Fig. 7 along VIII-VIII.
Main element symbol description
Following specific embodiment will further illustrate the present invention with reference to above-mentioned accompanying drawing.
Specific embodiment
In order that techniques disclosed in this application content it is more detailed with it is complete, be referred to accompanying drawing and it is of the invention under
Various specific embodiments are stated, identical mark represents same or similar component in accompanying drawing.However, the ordinary skill of this area
Personnel should be appreciated that embodiment provided hereinafter not for limiting the scope that the present invention is covered.Additionally, accompanying drawing is only
For being schematically illustrated, and drawn not according to its full size.
With reference to the accompanying drawings, specific embodiment of the invention is described in further detail.
First embodiment
As shown in Figures 1 and 2, the sound wave type fingerprint identification device 100 of first embodiment of the invention includes cover plate 140, electricity
Base board 130, signal transmission unit 120, ultrasonic sensing unit 110.
Circuit substrate 130 is fixedly arranged on the side of cover plate 140, and ultrasonic sensing unit 110 is arranged at circuit substrate 130 away from lid
The side of plate 140, one end of signal transmission unit 120 connects a control device (not shown), and the other end connects ultrasonic sensing simultaneously
Unit 110 and circuit substrate 130, to realize the signal between the control device and ultrasonic sensing unit 110 and circuit substrate 130
Transmission.
Cover plate 140 includes the adhesive-layer 141 of cover-plate glass 142 and first, cover-plate glass 142 by the first adhesive-layer 141 with
Circuit substrate 130 is combined.Cover-plate glass 142 reaches masking or fills towards can be coated with ink layer on the surface of the first adhesive-layer 141
The effect of decorations.In other embodiments, the cover-plate glass 142 can also be replaced by transparent plastic cover plate.
Ultrasonic sensing unit 110 includes piezoelectric polymer layer 113, the second adhesive-layer 114, first electrode 111 and second
Electrode 112.First electrode 111 is formed at surface of the circuit substrate 130 away from cover plate 140；Second adhesive-layer 114 is formed at first
The surface of electrode 111 is simultaneously completely covered first electrode 111；113 layers of piezoelectric polymer layer is arranged at the surface of the second adhesive-layer 114 simultaneously
Bonded by the second adhesive-layer 114 and first electrode 111；Second electrode 112 is formed at the surface of piezoelectric polymer layer 113 simultaneously completely
Cover the piezoelectric polymer layer 113.
Circuit substrate 130 includes first surface 131 and the second surface 132 opposite with first surface 131, first surface
131 contact with the first adhesive-layer 141.Circuit substrate 130 contains circuit (not shown), can be used to receiving, process and transmitting super
Sound sensing unit 110 receives the coupled electrical signal produced during ultrasonic wave.First electrode 111 is electrically connected with the circuit.The present embodiment
In, circuit substrate 130 is thin film transistor (TFT) (TFT) array base palte, and the tft array substrate includes the array of image element circuit, each
Image element circuit includes that one or more TFT, every TFT include at least one pixel electrode, multiple pixel electrode combination shapes
Into the first electrode 111.In other embodiments, circuit substrate 130 can also have for printed circuit board (PCB), flexible circuit board etc.
Can be used as the circuit board of the conductive structure of first electrode 111.
Signal transmission unit 120 includes flexible circuit board 123, the first metal connection pads 121, the second metal connection pads 122.
First metal connection pads 121 and the second metal connection pads 122 are formed on flexible circuit board 123.Flexible circuit board 123 is by the
The one end of one metal connection pads 121 with second electrode 112 away from the surface of piezoelectric polymer layer 113 is electrically connected with.Flexible circuit
Plate 123 is electrically connected with by the second metal connection pads 122 with circuit substrate 130.
First electrode 111 its material can be tin indium oxide (ITO).Second adhesive-layer 114 is viscous with conductive capability
Glue.Second electrode 112 has the effect of the overcoat of the sound wave type fingerprint identification device 100 concurrently while having conductive capability.The
The thickness of two electrodes 112 is more than 100 μm, and its surface resistivity is less than or equal to 50m Ω/.The material of second electrode 112 can be metal
Sheet material is made, such as copper, or is the multilayer composite metal layer formed by different metal layer combination, such as layers of copper and nickel dam, platinum layer
The multilayer composite metal layer formed with layer gold, layers of chrome and layers of copper and chromium-copper layer and layer gold.The material of second electrode 112 can also be
Organic matter sheet material is made, such as conductive polymer plastics, and wherein conductive polymer plastics include polyaniline and polystyrene.
100 1 work periods of sound wave type fingerprint identification device include launching phase and receive stage two parts.Transmitting rank
Section, flexible circuit board 123 gives first electrode 111 and the different voltage signal of second electrode 112, makes piezoelectric polymer layer simultaneously
113 both sides form an electrical potential difference, and then produce mechanical oscillation to send ultrasonic wave.Reception stage, flexible circuit board 123 is given only
One electrode 111 and the operating voltage of second electrode 112 1 are so that two electrodes maintain the normal work of piezoelectric polymer layer 113 jointly
Make.In this stage, first electrode 111 also has the effect being electrically coupled.That is, in the stage of reception, piezoelectric polymer layer 113 is received
Reflectance ultrasound ripple simultaneously produces charge inducing, and the charge inducing of piezoelectric polymer layer 113 is coupled to circuit substrate by first electrode 111
130,130 pairs of couple currents of circuit substrate are collected and analyze, then are transferred to the control dress by flexible circuit board 123
Put.
In traditional architectures, there are at least one of which adhesive-layer, second electrode and adhesive-layer between second electrode and overcoat
Prepared by way of wire mark, the preparation process easily makes to produce bubble in structure.In above-mentioned sound wave type fingerprint identification device 100
Second electrode 112 has the effect of overcoat concurrently, it is not necessary to extra to set overcoat then at the outside of second electrode 112, therefore, sound wave
Formula fingerprint identification device 100 reduces multiple screen printing processing compared to traditional structure on processing procedure, so as to avoid wire mark process
In the influence of produced bubble to ultrasonic wave sensing result, make sensing result more accurate.Simultaneously as second electrode 112
Also have the effect of overcoat concurrently so that product structure is more simple, ultrasonic wave needs the number of layers for penetrating in transmittance process
Greatly reduce, reduce the generation of noise and save material and processing procedure.The second electrode 112 of tabular is formed relative to wire mark
Film surface is more smooth, and piezoelectric polymer layer 113 is directly prepared on more smooth second electrode 112 so that piezoelectricity
The uniformity of polymeric layer 113 more preferably, effectively improves the accuracy of identification of the sound wave type fingerprint identification device 100.
It should be understood that the sound wave type fingerprint identification device 100 can also further include other conventional yuan of this area
Part (such as golden finger), is not repeated herein.
As shown in figure 3, the preparation method of above-mentioned sound wave type fingerprint identification device 100, it comprises the following steps:
Step S31 a, there is provided battery lead plate, polymeric piezoelectric material is coated with the surface of battery lead plate one.The thickness of the battery lead plate
Degree is more than 100 μm.The coating method can be spin coating, spraying, dipping or other feasible coating processes.
Step S32, dries polymeric piezoelectric material and crystallizes polarization shaping, forms piezoelectric polymer layer 113.It is described dry
Drying method can be baking, standing, ventilation or another drying process.
Step S33 a, there is provided flexible circuit board 123, is formed without the flexible circuit board 123 piezoelectricity and gathers with the battery lead plate
The surface electrical behavior connection of compound layer 113.Specifically, there are first metal connection pads 121 on the flexible circuit board 123, it is soft
Property circuit board 123 make its electric by way of welding, bondings first metal connection pads 121 and piezoelectric polymer layer 113
Pole plate is connected.
Step S34 a, there is provided circuit substrate 130, containing circuit and positioned at circuit substrate 130 on the circuit substrate 130
The first electrode 111 that is electrically connected with the circuit of surface, the surface region for forming the first electrode 111 in circuit substrate 130 applies
The second adhesive-layer of cloth 114.In the present embodiment, the circuit substrate 130 is a tft array substrate, and tft array substrate includes pixel electricity
Road and corresponding pixel electrode, multiple pixel electrodes combine to form the first electrode 111.The coating method can be rotation
Apply, spray, impregnating or another coating process.
Step S35, is rationally cut out the battery lead plate, the size needed for obtaining.When the size of the battery lead plate is accorded with originally
Needed for closing during size requirement, the step can also be omitted.
Step S36, the formation battery lead plate that have the piezoelectric polymer layer of size needed for having be placed in circuit substrate 130 it
On, the second adhesive-layer 114 is bonded with piezoelectric polymer layer 113.
Step S37, the circuit of the flexible circuit board 123 and the circuit substrate 130 is electrically connected with.Specifically, this passes through
One second metal connection pads 122 are electrically connected with it with circuit substrate 130 by way of welding, bonding.
Step S38, the surface by circuit substrate 130 away from first electrode 111 is covered by first adhesive-layer 141 and
Glass sheet 142 is bonded.
Second embodiment
As shown in Figure 4 and Figure 5, the sound wave type fingerprint identification device 200 of second embodiment of the invention includes cover plate 240, electricity
Base board 230, ultrasonic sensing unit 210, signal transmission unit 220.
Circuit substrate 230 is fixedly arranged on the side of cover plate 240, and ultrasonic sensing unit 210 is arranged at circuit substrate 230 away from lid
The side of plate 240, one end of signal transmission unit 220 connects a control device (not shown), and the other end connects ultrasonic sensing simultaneously
Unit 210 and circuit substrate 230, to realize the signal between the control device and ultrasonic sensing unit 210 and circuit substrate 230
Transmission.
Cover plate 240 includes the adhesive-layer 241 of cover-plate glass 242 and first, cover-plate glass 242 by the first adhesive-layer 241 with
Circuit substrate 230 is combined.Cover-plate glass 242 reaches masking or fills towards can be coated with ink layer on the surface of the first adhesive-layer 241
The effect of decorations.In other embodiments, the cover-plate glass 242 can also be replaced by transparent plastic cover plate.
Ultrasonic sensing unit 210 includes piezoelectric polymer layer 213, first electrode 211 and second electrode 212.First electricity
Pole 211 is formed at surface of the circuit substrate 230 away from cover plate 240；It is remote that piezoelectric polymer layer 213 is arranged at the first electrode 211
From the side of cover plate 240；Second electrode 212 is formed at piezoelectric polymer layer 213 away from the surface of first electrode 211 and is completely covered
The piezoelectric polymer layer 213.
Circuit substrate 230 includes first surface 231 and the second surface 232 opposite with first surface 231, first surface
231 contact with the first adhesive-layer 241.Circuit substrate 230 contains circuit (not shown), can be used to receiving, process and transmitting super
Sound sensing unit 210 receives the coupled electrical signal produced during ultrasonic wave.First electrode 211 is electrically connected with the circuit.The present embodiment
In, circuit substrate 230 is thin film transistor (TFT) (TFT) array base palte, and the tft array substrate includes the array of image element circuit, each
Image element circuit includes that one or more TFT, every TFT include at least one pixel electrode, multiple pixel electrode combination shapes
Into the first electrode 211.In other embodiments, circuit substrate 230 can also have for printed circuit board (PCB), flexible circuit board etc.
Can be used as the circuit board of the conductive structure of first electrode 211.
Signal transmission unit 220 includes flexible circuit board 223, the first metal connection pads 221, the second metal connection pads 222.
First metal connection pads 221 and the second metal connection pads 222 are formed on flexible circuit board 223.Flexible circuit board 223 is by the
The one end of one metal connection pads 221 with second electrode 212 away from the surface of piezoelectric polymer layer 213 is electrically connected with.Flexible circuit
Plate 223 is by the second metal connection pads 222 with the second surface 232 of circuit substrate 230 not by the overlay area of piezoelectric polymer layer 213
Part be electrically connected with.
First electrode 211 its material can be tin indium oxide (ITO).It is simultaneous while second electrode 212 is with conductive capability
Has the effect of the sound wave type fingerprint identification device overcoat.Second electrode thickness is more than 100 μm, and its surface resistivity is less than or equal to
50mΩ/□.The material of second electrode 212 can be copper, or be the multilayer composite metal layer formed by different metal layer combination,
Such as the multilayer composite metal layer that layers of copper and nickel dam, platinum layer and layer gold, layers of chrome and layers of copper and chromium-copper layer and layer gold are formed.Second electricity
The material of pole 212 can also be organic matter, such as conductive polymer plastics and electrically conductive ink, and wherein conductive polymer plastics include polyphenyl
Amine and polystyrene.
200 1 work periods of sound wave type fingerprint identification device include launching phase and receive stage two parts.Transmitting rank
Section, flexible circuit board 223 gives first electrode 211 and the different voltage signal of second electrode 212, makes piezoelectric polymer layer simultaneously
213 both sides form an electrical potential difference, and then produce mechanical oscillation to send ultrasonic wave.Reception stage, flexible circuit board 223 is given only
One electrode 211 and the operating voltage of second electrode 212 1 are so that two electrodes maintain the normal work of piezoelectric polymer layer 213 jointly
Make.In this stage, first electrode 211 also has the effect being electrically coupled.That is, in the stage of reception, piezoelectric polymer layer 213 is received
Reflectance ultrasound ripple simultaneously produces charge inducing, and the charge inducing of piezoelectric polymer layer 213 is coupled to circuit substrate by first electrode 211
230,230 pairs of couple currents of circuit substrate are collected and analyze, then are transferred to the control dress by flexible circuit board 223
Put.
In traditional architectures, there are at least one of which adhesive-layer, second electrode and adhesive-layer between second electrode and overcoat
Prepared by way of wire mark, the preparation process easily makes to produce bubble in structure.In above-mentioned sound wave type fingerprint identification device 200
Second electrode 212 has the effect of overcoat concurrently, it is not necessary to extra to set overcoat then at the outside of second electrode 212, therefore, sound wave
Formula fingerprint identification device 200 reduces multiple screen printing processing compared to traditional structure on processing procedure, so as to avoid wire mark process
In the influence of produced bubble to ultrasonic wave sensing result, make sensing result more accurate.Simultaneously as second electrode 212
Also have the effect of overcoat concurrently so that product structure is more simple, ultrasonic wave needs the number of layers for penetrating in transmittance process
Greatly reduce, reduce the generation of noise and save material and processing procedure.
It should be understood that the sound wave type fingerprint identification device can also further include the conventional other elements in this area
(such as golden finger), is not repeated herein.
As shown in fig. 6, the preparation method of above-mentioned sound wave type fingerprint identification device, it comprises the following steps：
Step S61 a, there is provided circuit substrate 230, containing circuit and positioned at the table of circuit substrate 230 on the circuit substrate 230
Face and the first electrode 211 electrically connected with the circuit, the surface region for including the first electrode 211 in circuit substrate 230 are applied
Cloth polymeric piezoelectric material.In the present embodiment, the circuit substrate 230 is a tft array substrate, and the tft array substrate includes picture
The array of plain circuit, each image element circuit includes that one or more TFT, every TFT include at least one pixel electrode, Duo Gesuo
State pixel electrode to combine to form the first electrode 211, polymeric piezoelectric material is coated with the surface of first electrode 211.Piezoelectricity gathers
Compound material can by spin coating, spray, impregnate, apply with or other feasible coating processes coat the surface of first electrode 211.
Step S62, makes the reduction of polymeric piezoelectric material humidity, but do not make its drying crystalline by drying process.It is described
The method for reducing humidity can be baking, standing, ventilation or another drying process.
Step S63 a, there is provided battery lead plate, and the battery lead plate is cut out.The battery lead plate is second electrode 212.It is right
Battery lead plate is rationally cut out, and makes battery lead plate more bigger than first electrode 211, and first electrode 211 can be dimensionally completely covered, when
When the size of the battery lead plate meets required size requirement originally, the Cut out step can also be omitted.
Step S64, the battery lead plate of size fits in the polymeric piezoelectric material away from circuit substrate 230 needed for this is had
One side surface.
Step S65, is completely dried polymeric piezoelectric material and crystallizes polarization shaping, forms piezoelectric polymer layer 213, should
Thus battery lead plate is bonded together with the piezoelectric polymer layer.The drying means can be baking, standing, ventilation or another
Drying process.
Step S66, makes the battery lead plate be electrically connected with the flexible circuit board 223, while making the circuit of the circuit substrate 230
It is electrically connected with the flexible circuit board 223.Battery lead plate passes through one first metal connection pads away from the surface of piezoelectric polymer layer 213
221 are electrically connected with flexible circuit board 223.Circuit substrate 230 can be by one second metal connection pads 222 and flexible circuit board
223 are electrically connected with.Specifically, first metal connection pads 221 can electrically be connected with battery lead plate by way of welding, bonding
Connect.Second metal connection pads 222 can be electrically connected with it with circuit substrate 230 by way of welding, bonding.
Step S67, the surface by circuit substrate 230 away from the first electrode 211 passes through first adhesive-layer 241 and
Cover-plate glass 242 is bonded.
Also referring to Fig. 7 and Fig. 8, the present invention also provides a kind of electronic installation 10, the electronic installation include main body 12 and
The sound wave type fingerprint identification device 900 in main body 12 is arranged at, the sound wave type fingerprint identification device 900 can be above-described embodiment
One and embodiment two described in any sound wave type fingerprint identification device.In Fig. 7 only so that electronic installation 10 is as mobile phone as an example, at other
In embodiment, the electronic installation 10 or personal computer, intelligent appliance, industrial control unit (ICU) etc..When the electronic installation 10 is
During mobile phone, the home keys that the sound wave type fingerprint identification device 900 can correspond to mobile phone are set, and the home keys is had tangible behaviour
Work energy.
Above, specific embodiment of the invention is described with reference to the accompanying drawings.But, those skilled in the art
It is understood that without departing from the spirit and scope of the present invention, can also make each to specific embodiment of the invention
Plant change and replace.These changes and replacement all fall in claims of the present invention limited range.
Claims (12)
1. the ultrasonic sensing list that a kind of sound wave type fingerprint identification device, including circuit substrate, are formed at the circuit substrate surface
Unit and signal transmission unit, circuit is contained on the circuit substrate, it is characterised in that：The ultrasonic sensing unit includes being arranged at this
The surface of circuit substrate one and the first electrode, a piezoelectric polymer layer and the second electrode that are electrically connected with the circuit, the letter
Number transmission unit electrically connects the circuit and the second electrode to realize signal transmission, and the second electrode is direct with piezoelectric polymer layer
Contact, the second electrode is the outer protective structure of the ultrasonic sensing unit.
2. sound wave type fingerprint identification device as claimed in claim 1, it is characterised in that：The second electrode thickness is more than 100 μm,
Its surface resistivity is less than or equal to 50m Ω/.
3. sound wave type fingerprint identification device as claimed in claim 1, it is characterised in that：The second electrode is layers of copper.
4. sound wave type fingerprint identification device as claimed in claim 1, it is characterised in that：The second electrode is by different metal layer
Combine the multilayer composite metal layer for being formed.
5. sound wave type fingerprint identification device as claimed in claim 1, it is characterised in that：The second electrode is moulded for conductive polymer
Material.
6. sound wave type fingerprint identification device as claimed in claim 1, it is characterised in that：The circuit substrate is a tft array
Substrate, the tft array substrate includes the array of image element circuit, and the circuit is the pixel circuit array；Each image element circuit
Including at least one TFT elements and with the pixel electrode for being electrically coupled to the image element circuit, the first electrode is wherein one
Individual or multiple pixel electrodes.
7. sound wave type fingerprint identification device as claimed in claim 1, it is characterised in that：The signal transmission unit includes soft
Circuit board, the flexible circuit board is electrically connected with the circuit substrate and the second electrode.
8. sound wave type fingerprint identification device as claimed in claim 1, it is characterised in that：The piezoelectric polymer layer is formed at
On two electrodes, first electrode is combined by side of the adhesive-layer with the piezoelectric polymer layer away from second electrode.
9. sound wave type fingerprint identification device as claimed in claim 1, it is characterised in that：The piezoelectric polymer layer is formed at this
In second electrode, piezoelectric polymer layer is directly contacted away from the side of second electrode with first electrode.
10. a kind of electronic installation, the electronic installation includes main body and the sound wave type fingerprint identification device being arranged in the main body, its
It is characterised by：The sound wave type fingerprint identification device is the sound wave type fingerprint identification device described in claim 1-9 any one.
A kind of 11. preparation methods of sound wave type fingerprint identification device, it comprises the following steps：
One battery lead plate is provided, a piezoelectric polymer layer is coated with a surface of the battery lead plate；
Dry piezoelectric polymer layer and crystallize polarization shaping；
One flexible circuit board is provided, the surface electrical behavior that the flexible circuit board and battery lead plate are formed without the piezoelectric polymer layer is connected
Connect；
One circuit substrate is provided, is electrically connected with the circuit containing circuit and positioned at the surface of circuit substrate on the circuit substrate
First electrode, and it is coated with an adhesive-layer in the surface region that the circuit substrate forms the first electrode；
The battery lead plate of the piezoelectric polymer layer that is formed with is placed on the first electrode, the adhesive-layer is gathered with the piezoelectricity
Compound layer is bonded；
The flexible circuit board is electrically connected with the circuit of the circuit substrate.
A kind of 12. preparation methods of sound wave type fingerprint identification device, it comprises the following steps：
One circuit substrate is provided, is electrically connected with the circuit containing circuit and positioned at the surface of circuit substrate on the circuit substrate
First electrode, and it is coated with a piezoelectric polymer layer in the surface region that the circuit substrate forms the first electrode；
Piezoelectric polymer layer humidity reduction is made by drying process, but does not make its drying crystalline；
One battery lead plate is provided, the battery lead plate is fitted in into the piezoelectric polymer layer away from the side surface of circuit substrate one；
It is completely dried the piezoelectric polymer layer and crystallizes polarization shaping, thus the battery lead plate is bonded in the piezoelectric polymer layer
Together；
The battery lead plate and the flexible circuit board are electrically connected with, while the circuit of the circuit substrate is electrical with the flexible circuit board
Connection.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710033511.7A CN106874853B (en) | 2017-01-16 | 2017-01-16 | Acoustic wave type fingerprint identification device, manufacturing method thereof and electronic device applying acoustic wave type fingerprint identification device |
| TW106106269A TWI650685B (en) | 2017-01-16 | 2017-02-24 | Acoustic fingerprint recognition device, manufacturing method thereof and electronic device using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710033511.7A CN106874853B (en) | 2017-01-16 | 2017-01-16 | Acoustic wave type fingerprint identification device, manufacturing method thereof and electronic device applying acoustic wave type fingerprint identification device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106874853A true CN106874853A (en) | 2017-06-20 |
| CN106874853B CN106874853B (en) | 2020-04-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710033511.7A Active CN106874853B (en) | 2017-01-16 | 2017-01-16 | Acoustic wave type fingerprint identification device, manufacturing method thereof and electronic device applying acoustic wave type fingerprint identification device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106874853B (en) |
| TW (1) | TWI650685B (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108846318A (en) * | 2018-05-24 | 2018-11-20 | 业成科技（成都）有限公司 | Ultrasonic fingerprint identification device and preparation method thereof and the electronic device for applying it |
| CN109460693A (en) * | 2017-09-06 | 2019-03-12 | 蓝思科技（长沙）有限公司 | Optical fingerprint sensor and terminal device |
| CN109492466A (en) * | 2017-09-12 | 2019-03-19 | 南昌欧菲生物识别技术有限公司 | Display module and electronic device |
| CN109492481A (en) * | 2017-09-12 | 2019-03-19 | 南昌欧菲生物识别技术有限公司 | Ultrasonic sensor and electronic device |
| CN111428702A (en) * | 2020-06-12 | 2020-07-17 | 深圳市汇顶科技股份有限公司 | Ultrasonic sensor, fingerprint identification module and electronic equipment |
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Also Published As
| Publication number | Publication date |
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| CN106874853B (en) | 2020-04-10 |
| TW201828002A (en) | 2018-08-01 |
| TWI650685B (en) | 2019-02-11 |
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