CN209487509U - Image sensor encapsulating structure - Google Patents
Image sensor encapsulating structure Download PDFInfo
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- CN209487509U CN209487509U CN201920710005.1U CN201920710005U CN209487509U CN 209487509 U CN209487509 U CN 209487509U CN 201920710005 U CN201920710005 U CN 201920710005U CN 209487509 U CN209487509 U CN 209487509U
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- image sensor
- platform part
- covering portion
- encapsulating structure
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Abstract
The utility model discloses a kind of encapsulating structures of image sensor, it is related to field of semiconductor package, the adhesive body including electric connection and enhancing encapsulating structure intensity between the fixed transparent plate body of substrate body and substrate body, image sensor, substrate body and image sensor.Image sensor encapsulating structure provided by the utility model is for conventional package, with relatively simple structure and packaged type, with preferable structural strength and frivolous volume, a kind of effective implementation means are provided for the encapsulation of image sensor, are conducive to ensure the state and its service life of image sensor at work.
Description
Technical field
The utility model relates to field of semiconductor package more particularly to a kind of encapsulating structures of image sensor.
Background technique
Image sensor be it is a kind of the optical signalling of image can be sensed, and by the optical signal conversion sensed at
The semiconductor devices that electronic signal is handled is intelligent terminal (such as computer, mobile phone, plate, camera) instantly
Core component.It needs to be packaged to improve the quality of its durability and its imaging as a kind of solid state image sensor
After reapply among terminal device.
When packaged, the transparent cover plate for often supporting glass or other transparent materials is directly viscous for traditional image sensor
It connects on image sensor, during bonding, the way generally used in the prior art is: along image sensor photosensitive area
The outside setting metal raised line or support bar in domain, and by the both ends of metal raised line or support bar respectively with image sensor, transparent
Cover board is mutually bonded, and to form certain insulating space, extends the service life of image sensor.Although these technologies are useful,
But the process of bonding needs to guarantee that bonding process meets a variety of preset requirements, for example, metal raised line or support bar after bonding
All in uniform height, and keep transparent cover plate horizontally disposed as far as possible.On the other hand, generally figure can be realized by wire bonding mode
It is electrically connected as being established between sensor and substrate, and lead connection type may require that filling adhesive material, to protect each
Lead, preventing lead from covering bad lead to disconnection and impacts to the service life of image sensor.Therefore, it will cause image
The encapsulating structure of sensor needs to fill a large amount of filling glue and protects to lead.For by above-mentioned steps encapsulated moulding
Image sensor, either encapsulating structure or be that encapsulation process is all complex, it is careless slightly, it will to encapsulate finished product
Yields decline.
Utility model content
In view of the above problems, the utility model provides a kind of image sensor encapsulating structure, does not need complexity
Sealed in unit and packaging technology, so that it may ensure that image sensor encapsulates yield to a certain extent, while encapsulating structure is with good
Good reliability and lightweight robust thin.
To achieve the above object, technical solution provided by the utility model are as follows:
Image sensor encapsulating structure provided by the utility model, comprising:
Substrate body, the substrate body include horizontally arranged platform part；First is provided in the platform part
Electrical junction, the one side for being provided with first electrical junction is platform part bottom surface, opposite with the platform part bottom surface
It is on one side platform part top surface；There are vertical cavity in the platform part top surface and the platform part bottom surface up and down；
Transparent plate body, the transparent plate body are fixed on the platform part top surface；The transparent plate body covers the platform
The opening of portion top surface；
Image sensor, described image sensor are provided with photosensitive area, and the one side for being provided with the photosensitive area is image sense
Survey plane on device；Plane is additionally provided with the second electrical junction on described image sensor；Second electrical junction is surround
It is set on the outside of the photosensitive area；
The electric connection that first electrical junction and second electrical junction are constituted, wherein the electrical property connects
It is connected in spherical conducting resinl；
Adhesive body, the adhesive body be filled in by the platform part subjacent, described image sensor above plane,
In the filled cavity that the electric connection outside and described image sensor lateral area are surrounded.
The utility model image sensor encapsulating structure above-mentioned, it is preferable that the adhesive body is epoxy resin or UV glue.
The utility model image sensor encapsulating structure above-mentioned, it is preferable that the viscosity of the adhesive body is 1x105Pa·
S~2x105Pa·s。
The utility model image sensor encapsulating structure above-mentioned, it is preferable that the substrate body further includes vertical direction
The covering portion of setting；The covering portion is the cube of upper and lower opening structure；The covering portion is sheathed on outside the platform part, and
The covering portion is fixedly connected with the platform part；The side fixed with the platform part is in covering portion in the covering portion
Side；The platform part bottom surface and the covering portion inner space are surrounded by the first accommodating cavity；Described image sensor is placed in
In the first accommodating cavity.
The utility model image sensor encapsulating structure above-mentioned, it is preferable that the platform part top surface and the covering portion
Inside is surrounded by the second accommodating cavity；The transparent plate body sealing is embedding to be invested in the first accommodating cavity and the transparent plate body
Top surface flushed with the covering portion top surface.
The utility model image sensor encapsulating structure above-mentioned, it is preferable that the covering portion and platform part one
Molding.
The utility model image sensor encapsulating structure above-mentioned, it is preferable that the substrate body is along the platform part top
The sectional elevation of face open area is in the H-type that middle part disconnects.
Image sensor encapsulating structure provided by the utility model is fixed transparent including substrate body, with substrate body
The sealing of electric connection and enhancing encapsulating structure intensity between plate body, image sensor, substrate body and image sensor
Body.Image sensor encapsulating structure provided by the utility model has relatively simple knot for conventional package
Structure and packaged type have preferable structural strength.Simultaneously as eliminating lead electric connection, guaranteeing that certain structure is strong
While spending, the volume of overall package structure is also more lightening, provides a kind of effective reality for the encapsulation of image sensor
Means are applied, are conducive to ensure the state and its service life of image sensor at work.
Detailed description of the invention
Upon reading the detailed description of non-limiting embodiments with reference to the following drawings, the utility model and its spy
Sign, shape and advantage will become more apparent.Identical label indicates identical part in all the attached drawings.Do not press deliberately
Attached drawing is drawn according to ratio, it is preferred that emphasis is the purport of the utility model is shown.
Figure 1A -1 is the section view signal of the substrate body for the image sensor encapsulating structure that the utility model embodiment 1 provides
Figure；
Figure 1A -2 is the covering portion schematic top plan view for the substrate body that the utility model embodiment 1 provides；
Figure 1A -3 is the platform part elevational schematic view for the substrate body that the utility model embodiment 1 provides；
Figure 1B is the section view signal of fixed transparent plate body in Figure 1A -1 structure basis that the utility model embodiment 1 provides
Figure；
Fig. 1 C-1 be the utility model embodiment 1 provide image sensor is fixed on substrate in Figure 1B structure basis
The schematic cross-sectional view of ontology；
Fig. 1 C-2 is the schematic side view for the image sensor that the utility model embodiment 1 provides；
Fig. 1 C-3 is the schematic top plan view for the image sensor that the utility model embodiment 1 provides；
Fig. 1 D is the encapsulation that adhesive body distribution is completed in the structure basis in Fig. 1 C-1 of the offer of the utility model embodiment 1
Schematic structural cross-sectional view；
Fig. 2 is the image sensor packaging method flow diagram that can be taken in the utility model embodiment 1.
Specific embodiment
Below with reference to the attached drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out clear
Chu, complete explanation, it is clear that described embodiment is only a part of the embodiment of the utility model, rather than whole realities
Apply example.Therefore, the detailed description in the utility model embodiment provided in attached drawing is not intended to limit below claimed
The scope of the utility model, but be merely representative of the selected embodiment of the utility model.Based on the embodiments of the present invention,
Those skilled in the art's every other embodiment obtained without creative labor belongs to practical
Novel protection scope.
Embodiment 1:
Below with reference to the attached drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out clear
Chu, complete explanation, it is clear that described embodiment is only a part of the embodiment of the utility model, rather than whole realities
Apply example.Therefore, the detailed description in the utility model embodiment provided in attached drawing is not intended to limit below claimed
The scope of the utility model, but be merely representative of the selected embodiment of the utility model.Based on the embodiments of the present invention,
Those skilled in the art's every other embodiment obtained without creative labor belongs to practical
Novel protection scope.
Embodiment 1:
Referring to Figure 1A -1, Figure 1A -2, Figure 1A -3, Figure 1B, Fig. 1 C-1, Fig. 1 C-2, Fig. 1 C-3 and Fig. 1 D, the utility model is real
The image sensor encapsulating structure of the offer of example 1 is provided, comprising:
Substrate body 1, the substrate body 1 include horizontally arranged platform part 12；It is arranged in the platform part 12
There is the first electrical junction 123, the one side for being provided with first electrical junction 123 is platform part bottom surface 122, is put down with described
The opposite one side in platform portion bottom surface 122 is platform part top surface 121；The platform part top surface 121 and about the 122 platform part bottom surface
It is through with vertical cavity 5；
Transparent plate body 4, wherein the transparent panel body 4 is fixed on the platform part top surface 121；The transparent plate body 4 covers
Cover the opening of the platform part top surface 121；
Image sensor 2, described image sensor 2 are provided with photosensitive area 23, and the one side for being provided with the photosensitive area 23 is
Plane 21 on image sensor；Plane 21 is additionally provided with the second electrical junction 24 on described image sensor；Second electricity
Property interconnecting piece 24 around being set to 23 outside of the photosensitive area；
The electric connection 3 that first electrical junction 123 is constituted with second electrical junction 24, wherein described
Being electrically connected is spherical conducting resinl.
Adhesive body 7, the adhesive body 7 are filled in by plane on 122 lower section of platform part bottom surface, described image sensor
In the filled cavity that 21 tops, 3 outside of the electric connection and 2 lateral area of described image sensor are surrounded.
By the way that transparent plate body is fixed on platform part top surface, meanwhile, image sensor is fixed by being electrically connected part
Adhesive body is filled in platform part bottom surface, and in the outside of platform part subjacent, image sensor, electric connection, can be reinforced
Overall package reliability of structure, so that image sensor is closely fixed together with substrate body, but also being electrically connected
Connection reliability reinforce.Meanwhile by filling out adhesive body, it can also be effectively prevented impurity and enter from the gap of electric connection
Sensing area impacts the sensing performance of image sensor and influences its service life.Due to eliminating lead, with spherical
Conducting resinl be electrically connected as being electrically connected part and established to substrate body and image sensor, substantially reduce occupied by lead
Space, be conducive to integrally-built thin design.
In order to reinforce the firm performance of substrate body, overall package reliability of structure intensity is preferably protected；The base
Plate ontology 1 further includes the covering portion 11 of vertical direction setting；The covering portion 11 is the cube of upper and lower opening structure；The packet
It covers portion 11 to be sheathed on outside the platform part 12, and the covering portion 11 is fixedly connected with the platform part 12；The covering portion 11
The upper side fixed with the platform part 12 is on the inside of covering portion；It can be enclosed on the inside of the platform part bottom surface 122 and the covering portion
At the first accommodating cavity；Described image sensor 2 is placed in the first accommodating cavity.The covering portion 11 and platform part of setting
12 are fixedly connected with and are sheathed on the outside of platform part 12, on the one hand can enhance the intensity of encapsulating structure, image sensor is consolidated
Due in the first accommodating cavity of substrate body 1, it is protected, while also foring effective envelope for the filling of adhesive body
Glue boundary is more advantageous to the flowing and dosage of control sealing, and for another angle, image sensor can with multi-panel and base
Plate ontology 1 carries out contact fixation, compared to only and for the fixed angle of platform part 12, by adhesive body simultaneously with platform part,
Covering portion carries out effectively sealing and fixes, and so that whole encapsulating structure is had better stability, is not easily disconnected from, and has good anti-
Vibratility.
It is highly preferred that as shown in Figure 1, in substrate body 1,11 inside of the platform part top surface 121 and the covering portion
The second accommodating cavity can be surrounded；The transparent plate body 4 seals embedding invest in the first accommodating cavity and the transparent plate body 4
Top surface is flushed with 11 top surface of covering portion.So, it is both fixed convenient for the sealing of transparent plate body, for example, directly will be transparent
In plate body insertion accommodating cavity, accomplishes preferably to protect transparent plate body 4, stop certain all lateral pressures.Meanwhile it is also possible that
Substrate body 1 forms an even curface by 11 top surface of covering portion and the top surface of transparent plate body 4, facilitates subsequent and other light
It learns element and establishes the datum level worked in coordination.
The each component for introducing image sensor encapsulating structure in the present embodiment 1 respectively is constructed below, and is illustrated in due course
Connection relationship between component.
Referring to 1A-1, Figure 1A -2 and Figure 1A -3, substrate body 1 provided by the present embodiment 1 can be plastics, ceramics, PCB
Circuit board is provided with can be electrically connected with image sensor 2 first in 12 bottom surface 122 of platform part of substrate body 1 and electrically connects
Socket part 123 (specifically, such as pad), platform part 12 is set within covering portion 11, and platform part 12 is sealedly attached to
On the medial surface of covering portion 11, and the first accommodating space and the second accommodating space are provided, is transparent plate body and image sensor
Insertion encapsulation provide space, this space make the photosensitive region of transparent plate body 4 and image sensor 2 obtained it is more stable and
More rigid protection zone is also conducive to integrally-built stabilization and brief.It, can be in the other of substrate body for substrate body 1
The pre-designed conductive connecting pin being electrically connected with external electronic circuits in position, such as can be in the lateral surface of covering portion 11
Conductive connecting pin is set；When there is no covering portion 11, conductive connecting pin, Lai Shixian overall package knot can be set in platform part lateral surface
Structure and external electronic circuits or other components are electrically connected, this be it is understood by one of ordinary skill in the art, it will not be described here.
For substrate body 1, as long as including the structure feature above-mentioned of the utility model embodiment 1, the mesh of the utility model can be realized
, however it is not limited to specific shape.Preferably, substrate body 1 can be subjected to integrated molding formula design in advance, on the one hand, can be with
Shorten the used time of overall package；Meanwhile the substrate body for being integrally formed processing can be produced in batches in advance, structure it is steady
It is qualitative to be expected, and then improve the intensity and service life of 1 image sensor encapsulating structure of the utility model embodiment.
It is highly preferred that it is vertical to be designed as substrate body 1 being open along 12 top surface of platform part for the ease of machine-shaping and design
The structure for the H-type that section is disconnected in middle part is designed as the H-type section that middle part disconnects, so that transparent plate body is embeddable in substrate sheet
In first accommodating space of body, image sensor can be fixed in the second accommodating space of substrate body, and in platform part
Upper and lower opening vertical cavity made of running through, so that being isolated naturally between transparent plate body and the photosensitive area of image sensor
Light region, so that the photosensitive element of image sensor has obtained seal protection.On the other hand, metal raised line is set relative to interval
Or for mode of other intermediaries to obtain transmission region, there is preferably compressive property and balance, can virtually make
Obtaining image sensor has the better service life.
It, can be in the second accommodating cavity of substrate body 1 by image sensor 2 referring to attached drawing 1C-1,1C-2,1C-3
Upper plane is fixed on platform part bottom surface 122 in a manner of being electrically connected, and passes through spherical 3 (ball described in the utility model of conductive rubber
Shape conductive rubber refers to the spherical electric connection part with stickiness) by image sensor 2 the second electrical junction 24 with
The first electrical junction 123 on platform part bottom surface 122 is electrically connected, and multiple first electrical junctions electrically connect with multiple second
Socket part can correspond, and shaped position is consistent, be easy to match, as long as so that be electrically connected mode alignment in place, can be disposable
It completes to be electrically connected step, is conducive to the control of packaging time cost.Meanwhile conventional wire is replaced to connect by spherical conductive rubber
The mode connect is more favorable for the lightening of overall package structural volume, saves encapsulating structure and is taken up space.
In view of image sensor working performance is influenced by particle, dust, vibration etc., need to guarantee the tight of its encapsulation
Close property.As shown in Fig. 1 C-1, after image sensor is electrically connected in substrate body, still there can be certain cavity 6.
Further, as shown in figure iD, in 11 inside of covering portion, 12 subjacent of the platform part, institute in the utility model embodiment 1
State 21 top of plane on image sensor, 2 outside of described image sensor, the chamber 6 for being electrically connected 3 lateral areas and being surrounded
Middle filling adhesive body, for example, epoxy resin or UV glue can be inserted as adhesive body, to mitigate external environment for image sensing
The influence of device working performance.More preferably, it is contemplated that exist between multiple second electrical junctions 24 of image sensor or greatly
Or small interval, poorly controlled when may distribute because of adhesive body cause adhesive body to flow into photosensitive area and to solidify, to image
The sensing performance of sensor causes to seriously affect, and can choose stickiness greatly and the adhesive body of low-flow, it is preferable that adhesive body
Viscosity is 1x105Pas~2x105Pas, so, on the one hand enables to overall package structure more solid firm,
On the other hand the effect of inertia because of adhesive body can largely be avoided to flow into photosensitive area to caused by the performance of image sensor
Irreversible influence.
The image sensor encapsulating structure provided for the utility model embodiment 1, it is preferable that cavity 5 is transversal vertically
Face shape is consistent with 23 shape of photosensitive area, and the cross section of the vertical cavity 5 is more than or equal to 24 area of photosensitive area,
It when packaged, can be from the direction that the vertical cavity 5 is overlapped with the plumb line of the photosensitive area 3, the i.e. position of centring
Image sensor is attached to the bottom surface of substrate body platform part.In this way, enable to photosensitive area fully to transparency cover
Signal outside plate is sensed.When the shape size of vertical cavity 5 is consistent with photosensitive area 23, and substrate body 1 is flat
12 bottom opening of platform portion can be such that vertical cavity 5 is overlapped with the plumb line of photosensitive area 3, be in image sensor 2 and stablized
Working condition in, additionally it is possible in the given volume of substrate body, so that 12 top surface of platform part and 12 bottom surface of platform part are supported
Area maximizes, and enhances the installation tightness of overall package structure to a certain extent.
For the utility model embodiment 1 provide above-mentioned image sensor encapsulating structure (A-1 to Fig. 1 D referring to Fig.1),
The utility model embodiment 1 additionally provides a kind of image sensor packaging method, specifically, referring to fig. 2, including the following steps:
It provides substrate body (S10)；Fixed transparent plate body is in (S20) in substrate body；Image sensor is electrically connected
In substrate body (S30)；It fills adhesive body (S40).
Specifically, for above-mentioned S10 step, referring to Figure 1A -1, Figure 1A -3, the substrate body 1 is set including horizontal direction
The platform part 12 set；The platform part 12 is provided with the first electrical junction 123 on one side, is provided with described first and is electrically connected
The one side in portion 123 is platform part bottom surface 122；The one side opposite with the platform part bottom surface 122 is platform part top surface 121；It is described
There are vertical cavity 5 in platform part top surface 121 and the platform part bottom surface 122 up and down；It is by institute for above-mentioned S20 step
It states transparent plate body 4 and is fixed on the platform part top surface 121, and transparent plate body 4 is made to cover the opening of the platform part top surface 121；
It is by first electrical junction 123 of described image sensor 2 and the platform part bottom surface for above-mentioned S30 step
122 second electrical junction 24 is electrically connected by spherical conducting resinl；It is by adhesive body 7 for above-mentioned S40 step
Be filled in by 21 top of plane on 122 lower section of the platform part bottom surface, described image sensor, it is described be electrically connected 3 outsides with
And in the filled cavity that is surrounded of 2 lateral area of described image sensor.
Further, in order to which integrally-built stability and encapsulating structure are convenient for further processing, the S10 step " is mentioned
" in step, referring to Figure 1A -1,1A-2, the substrate body further includes the covering portion 11 of vertical direction setting to substrate ontology；Institute
State the cube that covering portion 11 is upper and lower opening structure；The covering portion 11 is sheathed on outside the platform part 12, and the cladding
Portion 11 is sealedly and fixedly connected with the platform part 12；The side fixed with the platform part 12 is covering portion in the covering portion 11
Inside；The platform part bottom surface 122 and 11 inner space of the covering portion are surrounded by the first accommodating cavity；The platform part top surface
121 and the covering portion 11 on the inside of can surround the second accommodating cavity.So, for aforementioned encapsulation method, pass through
Covering portion is further set on the outside of the platform part of substrate body, and is formed with the first accommodating cavity, convenient for image sensor
Encapsulation process optimize control, covering portion can be formed with molding boundary for the filling of adhesive body, preferably control envelope
The dosage and flow control of colloid, i.e., relative to aforementioned encapsulation method, the S40 step can be incited somebody to action at " filling adhesive body "
Adhesive body is filled in the covering portion inside, on the platform part subjacent, described image sensor above plane, the electricity
Property connection outside and the filled cavity (cavity 6 in C-1 referring to Fig.1) that is surrounded of described image sensor lateral area in；And
The the second accommodating cavity formed, invests transparent plate body is embedding in substrate body in which can be convenient.Specifically, above-mentioned S20 is walked
Suddenly, can refer to Figure 1B understanding, fixed transparent plate body 4 in substrate body 1, can be by transparent plate body 4 by binder attaching
Embedding attached the substrate body is fixed on the platform part top surface 121 of the substrate body 1, being also possible to seal transparent plate body
In 1 the second accommodating cavity, transparent plate body is protected to a certain extent by substrate body.The utility model is not limited to
Specific binder form, does not limit the size of transparent panel body, as long as transparent plate body is enabled to be fixed on platform part top surface yet
On 121, and the opening of platform part top surface 121 is covered, image sensor is enabled to receive sensing signal by transparent plate body.
Preferably, transparent plate body can be shaped to and the first consistent shape of accommodating cavity cross section and just chimeric
Size invests in substrate body convenient for transparent plate body is closely embedding.So, it can reduce transparent plate body by external vibration
Influence degree；On the other hand, it can prevent external contaminants from involving in and the sense of pollution image sensor from platform part top surface opening
Light area.For transparent plate body alleged by the utility model, it can be the clear sheets such as glass, resin, acrylic board, not as this reality
With novel restriction content.
Above-mentioned S30 step is entered back into after transparent plate body is fixed, can prevent the top pollutant pair of encapsulation process
The photosensitive region of image sensor causes irreversible influence.For image sensor is electrically connected at platform part in S30 step
Bottom surface, it is preferable that spherical conductive rubber is selected to be electrically connected part without keeping away in such a way that traditional metal lead wire is bonded
Adverse effect of the conventional metals lead by external pressure Fault displacement is exempted from, as long as being adhered to substrate body by conductive rubber
On, stepization electric connection can be realized, simple and electric connection is convenient.It preferably, will be basic before being electrically connected step
Ontology turned upside down more conducively when packaged accurately controls the direction of electric connection.It is highly preferred that can be by image
After second electrical junction of the first electrical junction of sensor and platform part bottom surface is electrically connected and distribution adhesive body
Before step, by substrate body turned upside down, then adhesive body distribution is carried out, convenient for effectively pouring into for adhesive body, it is preferable that herein
In the process, adhesive body is chosen for stickiness greatly and the adhesive body of poor fluidity, can have both realized that gluing was firm, and had been influenced by external vibration
Degree is small, can also prevent from causing yields to decline because of the too fast infiltration photosensitive area of adhesive body flow velocity.After filling adhesive body (S40),
Both the close connection of image sensor and substrate body can have been guaranteed；It is also possible to prevent external contaminants from substrate body
The sensing range that image sensor is penetrated into lower part impacts sensing quality and sensitivity.
It should be appreciated by those skilled in the art that those skilled in the art combine the prior art and above-described embodiment can be real
The existing change case, it will not be described here.Such change case has no effect on the substantive content of the utility model, not superfluous herein
It states.
The preferred embodiment of the utility model is described above.It is to be appreciated that the utility model not office
It is limited to above-mentioned particular implementation, devices and structures not described in detail herein should be understood as with the common side in this field
Formula is practiced；Anyone skilled in the art, do not depart from technical solutions of the utility model make it is many possible
Changes and modifications or equivalent example modified to equivalent change, this has no effect on the substantive content of the utility model.Therefore,
All contents without departing from technical solutions of the utility model, it is made to the above embodiment according to the technical essence of the utility model
Any simple modifications, equivalents, and modifications, still fall within technical solutions of the utility model protection in the range of.
Claims (7)
1. a kind of image sensor encapsulating structure characterized by comprising
Substrate body, the substrate body include horizontally arranged platform part；First is provided in the platform part electrically
Interconnecting piece, the one side for being provided with first electrical junction is platform part bottom surface, the one side opposite with the platform part bottom surface
For platform part top surface；There are vertical cavity in the platform part top surface and the platform part bottom surface up and down；
Transparent plate body, the transparent plate body are fixed on the platform part top surface；The transparent plate body covers the platform part top
The opening in face；
Image sensor, described image sensor are provided with photosensitive area, and the one side for being provided with the photosensitive area is image sensor
Upper plane；Plane is additionally provided with the second electrical junction on described image sensor；Second electrical junction is around setting
On the outside of the photosensitive area；
The electric connection that first electrical junction and second electrical junction are constituted, wherein the electric connection is
Spherical conducting resinl；
Adhesive body, the adhesive body be filled in by the platform part subjacent, described image sensor above plane, it is described
In the filled cavity that electric connection outside and described image sensor lateral area are surrounded.
2. image sensor encapsulating structure as described in claim 1, which is characterized in that the adhesive body is epoxy resin or UV
Glue.
3. image sensor encapsulating structure as described in claim 1, which is characterized in that the viscosity of the adhesive body is
1x105Pas~2x105Pa·s。
4. image sensor encapsulating structure as described in claim 1, which is characterized in that the substrate body further includes vertical side
To the covering portion of setting；The covering portion is the cube of upper and lower opening structure；The covering portion is sheathed on outside the platform part,
And the covering portion is fixedly connected with the platform part；The side fixed with the platform part is in covering portion in the covering portion
Side；The platform part bottom surface and the covering portion inner space are surrounded by the first accommodating cavity；Described image sensor is placed in
In the first accommodating cavity.
5. image sensor encapsulating structure as claimed in claim 4, which is characterized in that the platform part top surface and the cladding
The second accommodating cavity is surrounded by the inside of portion；The transparent plate body sealing is embedding to be invested in the first accommodating cavity and the transparent panel
The top surface of body is flushed with the covering portion top surface.
6. image sensor encapsulating structure as claimed in claim 4, which is characterized in that the covering portion and the platform part one
It is body formed.
7. image sensor encapsulating structure as described in claim 1, which is characterized in that the substrate body is along the platform part
The sectional elevation of top surface open area is in the H-type that middle part disconnects.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920710005.1U CN209487509U (en) | 2019-05-17 | 2019-05-17 | Image sensor encapsulating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920710005.1U CN209487509U (en) | 2019-05-17 | 2019-05-17 | Image sensor encapsulating structure |
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| Publication Number | Publication Date |
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| CN209487509U true CN209487509U (en) | 2019-10-11 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110112164A (en) * | 2019-05-17 | 2019-08-09 | 积高电子(无锡)有限公司 | Image sensor encapsulating structure and packaging method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110112164A (en) * | 2019-05-17 | 2019-08-09 | 积高电子(无锡)有限公司 | Image sensor encapsulating structure and packaging method |
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